JP2015064748A - Integrated touch sensor substrate, display device including the same, and method for manufacturing the integrated touch sensor substrate - Google Patents

Abstract

A logo mark displayed on a frame portion of a front panel of a touch panel sensor is made thin with a simple configuration and is displayed in a gold-based metal (metallic) color.
In an integrated touch sensor substrate used for a display device with a touch panel, a jumper wiring and a metal oxide film layer for displaying a logo mark are formed by the same metal oxide film layer in the same process. The metal wiring provided in the frame portion and the display film for displaying the logo mark are formed of the same metal by the same process. Also, by forming striped slits in the metal oxide film layer and the display film made of the metal film layer to form the metal wiring, the metal wiring is also arranged in the area where the logo mark is displayed, and the frame portion is limited. Wiring can be provided by effectively using the space provided.
[Selection] Figure 12

Description

  The present invention relates to an integrated touch sensor substrate used for a display device with a touch panel, and more particularly to an integrated touch sensor substrate on which a logo mark is displayed on a peripheral portion.

  In recent years, touch panels have been adopted for operation units of various electronic devices such as mobile phones, personal digital assistants, car navigation systems. The touch panel is configured by bonding a position input device capable of detecting a contact position such as a finger on a display screen of a display device such as a liquid crystal panel or an organic EL (Electro-Luminescence). The touch panel system is roughly classified into a resistance film type, a capacitance type, an optical type, and an ultrasonic type, and each has a merit / demerit, and is used properly according to the application. The electrostatic capacitance type further includes a surface type and a projection type. A projected capacitive touch panel includes a plurality of electrodes arranged on a grid in the X direction and the Y direction, is capable of multi-touch, and is currently spreading rapidly.

  The projected capacitive touch panel sensor substrate generally has a five-layer structure, that is, metal wiring, two transparent electrodes for X and Y directions, an interlayer insulating layer between two transparent electrodes, and a surface. It consists of a protective layer. A single-sided structure in which two transparent electrode layers are formed on one side of a glass substrate by forming an interlayer insulating layer with an organic film, and the glass substrate is also used as an interlayer insulating layer. It is roughly divided into two types of double-sided structures formed separately. (For example, see Patent Document 1)

  Here, it is common for a display with a touch panel such as a cellular phone to adopt a structure in which a front plate (cover glass) is provided on the outermost surface. The cover glass is formed with a frame portion made of a highly light-shielding material for concealing peripheral wiring and the like. Various colors and patterns can be applied to the frame portion according to the design of the device. When applying a color or a pattern to a frame part, it is common to form a frame part by screen printing. However, it is mainstream that the frame portion is black because various colors and patterns are applied to the frame portion to increase the cost.

Further, as the ink or resist used when forming the black frame portion, a material in which carbon or titanium, which is a pigment having a high light shielding property, is dispersed is generally used. A material in which carbon or titanium is dispersed has a low specific resistance and a high dielectric constant. In addition, a material whose resistivity is increased to 1 × 10 ¹¹ Ω / cm by coating carbon with a resin is also employed.

  Here, in such a display with a touch panel, a company name, a product name, a design or the like called a house mark, a family name, or a pet name is often displayed as a logo mark on the periphery of the screen. Such a logo mark is formed on the back surface of the cover glass by printing.

  The logo mark is displayed in a metallic color (metallic), white, or a predetermined color. A frame part having a mark extraction part in a predetermined shape of the logo mark provided at a predetermined position is formed on the back surface of the front plate in black, for example, and then a predetermined part is formed by screen printing or the like from the back side of the mark extraction part. This display is formed by overcoating with colors. (For example, see Patent Document 2)

  FIG. 21 shows an example of a cover glass of a display with a touch panel used for a conventional mobile phone or the like. As shown in FIGS. 21A and 21B, a rectangular frame-shaped frame portion 103 is formed on the cover glass 102, and the inside of the frame portion 103 is a display area 110. The frame portion 103 is made of a light-shielding material and includes a mark removal portion 113 and a selfie camera window 114. Then, a display film layer 112 made of a predetermined color ink or the like is applied to the mark removal portion 113 from the back side to form a logo mark display portion 111.

JP 2010-182277 A JP 2010-256682 A

  However, when the logo mark display unit 111 is formed as shown in FIG. 21, it is necessary to apply ink or the like in order to form the display film layer 112 on the frame unit 103, which increases the number of processes and the manufacturing cost. There was an inconvenience of doing so. Further, in a logo formed by metal wiring without the frame portion 103, the metal wiring is a silver metallic color and lacks color variation. Therefore, there is a demand for a gold logo instead of a silver logo. In the present invention, it is possible to form a logo of gold color which has been conventionally made by sputtering.

  The object of the present invention is to adopt the following configuration in order to enable the formation of the gold-based logo.

  The present invention relates to an integrated touch sensor substrate including a front plate and a touch panel sensor. And a transparent front plate, a frame layer that is formed on the peripheral portion of the back surface of the front plate and divides a display area of a predetermined shape, and a mark removal portion that is formed by extracting a predetermined position of the frame layer in a predetermined shape A metal wiring formed on the back side of the frame layer, a metal oxide film layer and a metal film layer formed on the back side of the mark removal part, and a sensor layer formed in the display area and connected to the metal wiring It is characterized by having.

  In addition, the display device has a pixel region in which a plurality of pixels are arranged in a matrix, a display panel that displays an image in the pixel region based on an input signal, and an integrated type that is attached so as to cover the pixel region And a touch sensor substrate.

  Also, a transparent front plate, a frame layer that is formed on the peripheral edge of the back surface of the front plate and divides a display area of a predetermined shape, and a mark removal formed by extracting a predetermined position of the frame layer in a predetermined shape , A metal wiring formed on the back side of the frame layer, a metal oxide film layer and a metal film layer formed on the back side of the mark removal part, and a sensor formed in the display area and connected to the metal wiring A method of manufacturing an integrated touch sensor substrate including a front plate having a layer and a touch panel sensor, the step of forming a frame layer having a mark-out portion on the back surface of the front plate, the step of forming jumper wiring, and a metal The method includes a step of forming a wiring, a step of forming a metal oxide film layer, a step of forming a metal film layer, and a step of forming a sensor layer using the metal oxide. Forming the layer and Forming a metal wiring, and forming a metal oxide layer and the metal film layer, and performing with the metal and the metal oxide materials.

According to the present invention, the following effects can be obtained from the above-described features.
That is, an integrated touch sensor substrate of a front plate and a touch panel sensor, a transparent front plate, a frame layer that is formed on a peripheral portion of the back surface of the front plate and defines a display area of a predetermined shape, and a frame layer Marked portions formed by extracting predetermined positions in a predetermined shape, metal wiring formed on the back side of the frame layer, metal oxide layers and metal film layers formed on the back side of the marked portions, And a sensor layer formed in the display area and connected to the metal wiring, and a mark-out part formed by extracting a predetermined position of the frame layer in a predetermined shape is a metal oxide and a metal film layer of the same metal Therefore, as compared with the case where screen printing is performed with another ink, the configuration is simplified and the ink can be formed with a small thickness. Moreover, the logo mark display which was excellent in the design property with the gold-type metal color can be performed.

  In addition, the display device has a pixel region in which a plurality of pixels are arranged in a matrix, a display panel that displays an image in the pixel region based on an input signal, and an integrated type that is attached so as to cover the pixel region Since the touch sensor substrate is provided, the configuration is simplified and the thickness can be reduced as compared with the case of screen printing with another ink. Moreover, the logo mark display which was excellent in the design property with the gold-type metal color can be performed.

  Also, a transparent front plate, a frame layer that is formed on the peripheral edge of the back surface of the front plate and divides a display area of a predetermined shape, and a mark removal formed by extracting a predetermined position of the frame layer in a predetermined shape , A metal wiring formed on the back side of the frame layer, a metal oxide film layer and a metal film layer formed on the back side of the mark removal part, and a sensor connected to the metal wiring formed in the display area A method of manufacturing an integrated touch sensor substrate including a front plate having a layer and a touch panel sensor, the step of forming a frame layer having a mark-out portion on the back surface of the front plate, the step of forming jumper wiring, and a metal A step of forming a wiring, a step of forming a metal oxide film layer, a step of forming a metal film layer, and a step of forming a sensor layer. The process of forming In addition, since the process of forming the metal wiring and the process of forming the metal film layer are performed in the same process using the same material, the configuration is simplified compared to the case of screen printing with another ink, It can be formed with a small thickness.

The perspective view which shows an example of a display apparatus provided with the integrated touch sensor board | substrate which concerns on the 1st Embodiment of this invention. The schematic plan view seen from the surface side which shows the integrated touch sensor board | substrate which concerns on 1st Embodiment The schematic plan view seen from the back surface side which shows the integrated touch sensor board | substrate which concerns on 1st Embodiment. 1 is a schematic plan view showing a main part structure of an integrated touch sensor substrate according to a first embodiment. Schematic sectional view showing the structure of the integrated touch sensor substrate according to the first embodiment Schematic sectional view showing the structure of the integrated touch sensor substrate according to the first embodiment 1 is a schematic cross-sectional view showing a structure of a main part of an integrated touch sensor substrate according to a first embodiment. The schematic plan view seen from the surface side which shows the integrated touch sensor board | substrate which concerns on 2nd Embodiment Schematic top view which shows the principal part structure of the integrated touch sensor board | substrate which concerns on 2nd Embodiment. Schematic sectional view showing the structure of the main part of the integrated touch sensor substrate according to the second embodiment The schematic plan view seen from the surface side which shows the integrated touch sensor board | substrate which concerns on 3rd Embodiment Schematic top view which shows the principal part structure of the integrated touch sensor board | substrate which concerns on 3rd Embodiment. Schematic sectional view showing the structure of the main part of an integrated touch sensor substrate according to a third embodiment Schematic sectional view showing the structure of the main part of the integrated touch sensor substrate according to the fourth embodiment Schematic showing an integrated touch sensor substrate according to an embodiment of the present invention. Schematic showing an integrated touch sensor substrate according to an embodiment of the present invention. Schematic showing an integrated touch sensor substrate according to an embodiment of the present invention. Schematic showing an integrated touch sensor substrate according to an embodiment of the present invention. Schematic showing an integrated touch sensor substrate according to an embodiment of the present invention. Schematic showing an integrated touch sensor substrate according to an embodiment of the present invention. Schematic showing the structure of the front plate of a conventional integrated touch sensor substrate

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(First embodiment)
An integrated touch sensor substrate according to a first embodiment of the present invention will be described with reference to FIGS. In the integrated touch sensor substrate according to this embodiment, the cover glass and the touch sensor are directly formed integrally. Moreover, it has the structure which provides a metal wiring in a frame part. Hereinafter, the surface with which a finger or the like is brought into contact will be referred to as the front surface, and the opposite surface as the back surface.

  FIG. 1 is a perspective view showing a mobile phone as an example of a display device including an integrated touch sensor substrate 1 according to the present embodiment. FIG. 2 is a plan view of the integrated touch sensor substrate 1 according to the present embodiment as viewed from the front side. FIG. 3 is a plan view of the integrated touch sensor substrate 1 as viewed from the back side. 4 is a plan view showing details of the laminated structure of the integrated touch sensor substrate 1 shown in FIG. 3, and shows a state before the insulating protective film 9 shown in FIG. 3 is formed. 5 is a cross-sectional view in the direction of arrows P-P shown in FIG. 3, FIG. 6 is a cross-sectional view in the direction of arrows Q-Q shown in FIG. 3, and FIG. It is sectional drawing of the shown RR line arrow direction, FIG.7 (b) is an expanded sectional view which shows the A section of Fig.7 (a).

  First, a display device 50 including the integrated touch sensor substrate 1 according to the present embodiment will be described with reference to FIG. The display device 50 is a mobile phone called a smartphone, and has a case 51 constituting an outer casing. The case 51 is flat and has a rectangular shape that is long in the vertical direction (Y direction). An integrated touch sensor substrate 1 is provided at the center of one main surface, and an operation button 52 is provided at the bottom.

  As shown in FIG. 1, the integrated touch sensor substrate 1 has a rectangular shape that is long in the vertical direction (Y direction), and includes a frame-shaped frame portion 3 having a predetermined width at the periphery. An inner area defined by the frame portion 3 is a display area 10. A logo mark display unit 11 for displaying a logo mark is provided at the lower part of the frame part 3, and a selfie camera window 14 is provided at the upper part. A self-portrait camera (not shown) is provided below the self-portrait camera window 14 (inside the case 51), and the self-portrait of a mobile phone caller or the like through the self-portrait camera window 14 is integrated with the touch sensor board. 1 and the operation button 52 are operated.

  FIG. 2 is a plan view of the integrated touch sensor substrate 1 of the display device 50 shown in FIG. The shape is shown in a simplified manner. Here, the display of each character of this logo mark display part 11 is comprised from the surface of a uniform metal color.

  The configuration of the integrated touch sensor substrate 1 will be described with reference to FIGS. In FIGS. 3 to 6, for simplification of illustration, two lines of electrode patterns are schematically shown in the X direction and the Y direction, respectively. An electrode is provided.

  The integrated touch sensor substrate 1 is a position input device used in combination with a display device such as a liquid crystal panel or an organic EL panel (not shown). The integrated touch sensor substrate 1 has a plurality of electrodes extending in the X direction and a plurality of electrodes extending in the Y direction, and detects the change in the capacitance of the electrode in contact with or close to the finger, thereby Specify coordinates.

  Specifically, the integrated touch sensor substrate 1 includes a cover glass 2, a frame portion 3, a plurality of jumper wirings 4, an insulating film 5, a metal wiring 6, a plurality of transparent electrodes 7 and 8, and insulation. And a protective film 9.

  The cover glass 2 is a transparent front plate that is the outermost surface of the integrated touch sensor substrate 1 and is a member that is touched by the user. In the present embodiment, an example in which the cover glass 2 is used as the front plate will be described. However, instead of glass, a heat-resistant transparent resin material may be used as the front plate. Moreover, the transparent plate which consists of resin materials may be stuck on the glass surface, and you may form from several layers.

  The frame portion 3 is formed on the back surface of the cover glass 2 using a light shielding material that absorbs and blocks light. The frame part 3 defines a display area 10 having a predetermined shape in a central window part, and plays a role of hiding wiring provided on the peripheral part of the integrated touch sensor substrate 1.

  The frame portion 3 is formed in a frame shape so as to partition the display region 10 at the peripheral edge of the cover glass 2. In addition, the planar shape of the frame part 3 is not limited to a rectangular ring shape as in the present embodiment, and is arbitrary such as a heart shape, an egg shape, and a round shape. Further, the outer peripheral edge shape (outer shape) and the inner peripheral edge shape (the shape of the display area 10) of the frame portion 3 may be similar or dissimilar.

  The frame portion 3 is made of a photo-cured product of a pigment-based resist that absorbs visible light. Here, the pigment-based resist is a resin in which a pigment is dispersed in a resin dissolved in a solvent. The photo-cured product of the pigment-based resist means that the pigment-based resist is subjected to an exposure process by a photolithography method. It is hardened by.

  In this embodiment, the pigment-based resist is a pseudo black resist containing a mixture of at least two kinds of pigments other than carbon black and titanium oxide. As an example, a pigment used in forming a colored transparent layer of a color filter, C.I. I. Pigment red 1, C.I. I. Pigment Red 2 and C.I. I. Pigment red 3, C.I. I. Pigment red 4, C.I. I. Pigment red 5, C.I. I. Pigment red 6 and C.I. I. Pigment red 7, C.I. I. Pigment red 8, C.I. I. Pigment red 9, C.I. I. Pigment red 10 and C.I. I. Pigment red 11, C.I. I. Pigment red 12, C.I. I. Red (RED) pigments such as CI Pigment Red 14; I. Pigment blue 15 and C.I. I. Pigment blue 15: 3, C.I. I. Pigment blue 15: 4, C.I. I. Pigment blue 15: 6, C.I. I. A pseudo black color is obtained by mixing at least a blue (BLUE) pigment represented by CI Pigment Blue 60 and the like.

  In this embodiment, in addition to the red pigment and the blue pigment, a yellow (YELLOW) pigment may be added. It is known that yellow pigments absorb light in the low wavelength region of visible light, that is, light having a wavelength of 500 nm or less (for example, “Shoji Shiji (1965)“ Printing Ink Class ”(Nihon Printing Shimbun) P170. 173). By adding a yellow pigment to a red pigment and a blue pigment, the yellow pigment absorbs low-wavelength visible light and can be made closer to black.

  Here, the dielectric constant of the photo-cured product of the pigment-based resist is preferably 10 or less, more preferably 4.0 or less. This is to ensure the responsiveness of the capacitively coupled touch panel. Further, when the dielectric constant is 4.0 or less, formation of the electrostatic capacity of the pigment-based resist can be suppressed.

Moreover, since the metal wiring 6 and the transparent electrodes 7 and 8 are formed on the frame part 3 of this embodiment, it is necessary to ensure electrical insulation. That is, even if the specific resistance value of the conventional pigment resist in which carbon is coated with resin is 1 × 10 ¹¹ Ω / cm, the specific resistance value of the photocured pigment resist is 1 × 10 ¹⁴ Ω. / Cm or more is preferable. When the specific resistance value of the photo-cured product of the pigment-based resist is less than 1 × 10 ¹⁴ Ω / cm, the metal wiring and the transparent electrode wiring formed on the frame that is the photo-cured product of the pigment-based resist are short-circuited (short). This is because the integrated touch sensor substrate does not operate normally.

  The jumper wiring 4 is formed using a conductive material, and is arranged intermittently and in a matrix on the cover in the display area 10 in the X direction parallel to one side of the display area 10 and the Y direction perpendicular thereto. Has been. The jumper wiring 4 is for connecting the transparent electrodes 7 aligned in the X direction. The jumper wiring 4 is formed of a metal oxide such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide).

  The plurality of insulating films 5 are provided corresponding to each of the jumper wirings 4. Each of the insulating films 5 is formed so as to cross the corresponding jumper wiring 4 and extend in the X direction, and partially overlaps the central portion of the jumper wiring 4 in the Y direction. The insulating film 5 functions as an interlayer insulating film between the jumper wiring 4 and the transparent electrode 8. The insulating film 5 does not overlap with both ends of the jumper wiring 4 so that the jumper wiring 4 and the transparent electrode 7 can be connected in the Y direction.

  The metal wiring 6 is directly formed on the frame part 3 and is electrically connected to the transparent electrodes 7 and 8 located at the peripheral part of the display area 10. In the present embodiment, the metal wiring 6 is made of a Mo / Al / Mo (molybdenum / aluminum / molybdenum) laminate, but may be formed of Au (gold), Ag (silver), an Ag alloy, or the like. Good.

  The transparent electrode 7 is for detecting the X coordinate. The transparent electrode 7 is formed on the cover glass 2 in the display region 10 using a material having electrical conductivity and transparency. The transparent electrode 7 is intermittently arranged in a matrix in the X direction and the Y direction, and is electrically connected to the jumper wiring 4 adjacent in the Y direction. The transparent electrode 7 is made of, for example, ITO.

  The transparent electrode 8 is for detecting the Y coordinate. In the present embodiment, the transparent electrode 8 is formed in the same process as the transparent electrode 7 using the same material as the transparent electrode 7. The transparent electrode 8 extends in the Y direction between the columns of the transparent electrodes 7 aligned in the X direction, and three-dimensionally intersects with the jumper wiring 4 on the insulating film 5 as shown in FIGS.

  The insulating protective film 9 is formed on almost the entire surface of the cover glass 2 except for the portion corresponding to the lead wiring of the metal wiring 6 so as to cover the jumper wiring 4, the metal wiring 6, the transparent electrodes 7 and 8, and the frame portion 3. Has been. The insulating protective film 9 functions as a protective film that protects each component formed on the cover glass 2.

  In the integrated touch sensor substrate 1 according to the present embodiment, the jumper wiring 4, the insulating film 5, the transparent electrodes 7 and 8, and the insulating protective film 9 correspond to the sensor layer.

  The photo-cured product of the pigment-based resist used in this embodiment has a lower dielectric constant and a higher specific resistance value than the photo-cured product of the black resist material for conventional color filters. Is unnecessary, and the sensor layer and the metal wiring 6 can be formed directly on the frame portion 3. In addition, since the number of processes is reduced because the insulating film that covers the frame portion 3 is not necessary, it is possible to reduce costs and improve yield.

  In the present embodiment, the material of the frame portion 3 is subjected to an exposure process by a photolithography method. When the frame part 3 is formed by screen printing, the unevenness of the surface of the frame part 3 becomes rough, but when the frame part 3 is formed by photolithography, the surface of the frame part 3 becomes smooth. Therefore, the metal wiring 6 can be directly and stably formed on the frame portion 3.

Here, formation of the logo mark display part 11 in the integrated touch sensor substrate 1 according to the present embodiment will be described with reference to FIGS. 4 and 7A and 7B.
As shown in FIG. 7B, the frame part 3 positioned in the logo mark display part 11 on which the logo mark is displayed is formed with a mark removal part 13 that is cut out in the shape of the logo mark. That is, the mark-extracted portion 13 is a concave portion formed in a letter shape on the frame portion 3, and includes an inner wall obtained by hollowing the frame portion 3 in the shape of a logo mark, and the back surface of the cover glass 2 in the shape of the logo mark. And a bottom.

  As described above, in the present embodiment, the metal wiring 6 is formed directly on the frame portion 3. Further, in each of the same steps of forming the jumper wiring 4 and the metal wiring 6 using the same material as the jumper wiring 4 and the metal wiring 6, as shown in FIG. The display film layer 12 including the metal oxide film layer 12a and the metal film layer 12b is formed. As shown in FIG. 7B, the display film layer 12 is formed on the inner surface of the mark removal portion 13 without a gap. When viewed from the front side, each character of the logo mark on the logo mark display portion 11 of the frame portion 103 is displayed by a uniform surface of a gold-based metal color.

Thus, by covering the inner surface of the logo mark display portion 11 with the same film as the metal oxide film and the metal film forming the jumper wiring 4 and the metal wiring 6, the step of screen printing with another ink becomes unnecessary. The number of processes and the manufacturing cost can be reduced.
In addition, the configuration is simplified as compared with the case of screen printing with another ink, and the metal oxide film and the metal film can be formed with a thin thickness equivalent to that of the metal ink film. In addition, a logo with a metallic color (gold-based metallic) and an excellent design can be displayed.

  In the expression of the gold-based metal color of the logo mark part, the color tone can be adjusted by the film thickness of ITO which is the metal oxide film layer 12a. In addition, when the film thickness of the ITO etc. of the jumper wiring 4 and the color of the logo mark part to express are different, although a process increases, the jumper wiring 4 and the pressing metal oxide film layer 12a of the mark extraction part 13 are separately provided. It can also be made.

  As shown in FIG. 4, a metal wiring 6 is formed continuously with the display film layer 12 and is connected to an electric circuit of a display device (not shown). In this way, the display film layer 12 may be grounded. This is to prevent the touch panel, the electric circuit of the display device and the like from being troubled by static electricity accumulated in the display film layer 12 made of a metal film, and to take measures against unnecessary radiation of the display device.

(Second Embodiment)
An integrated touch sensor substrate according to a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, description thereof is omitted, and only different parts are described.

  FIG. 8A is a plan view of the integrated touch sensor substrate 1 according to the present embodiment as viewed from the front side, and FIG. 8B is an enlarged cross-sectional view showing a portion B of FIG. 8A. is there. FIG. 9 is a plan view showing the details of the laminated structure of the integrated touch sensor substrate 1 when viewed from the back side, and shows a state before the formation of the insulating protective film 9 (FIG. 4 of the first embodiment). It is a drawing corresponding to 10A is a cross-sectional view of the integrated touch sensor substrate 1 in the direction of the arrow S-S shown in FIG. 9, and FIG. 10B is an enlarged view showing a portion C in FIG. It is sectional drawing.

  In the integrated touch sensor substrate 1 according to this embodiment, the metal oxide film layer 12a and the metal film layer 12b of the display film layer 12 are formed in the same process using the same material as the jumper wiring 4 and the metal wiring 6. This is the same as the first embodiment except that the metal wiring 6 is included in at least a part of the display film layer 12. That is, in the present embodiment, the metal wiring 6 is disposed on a part of the display film layer 12 that displays each character of the logo mark display unit 11. A metal oxide film layer 12a similar to the display film layer 12 is provided in the lower layer of the metal wiring 6 in order to align the hues of the logo marks.

  As shown in FIG. 8A, when the present embodiment is viewed from the front side, the configuration is substantially the same as that of the first embodiment, but as shown in the enlarged view of the B part in FIG. 8B. In addition, each character of the logo mark on the logo mark display unit 11 is not a uniform surface, but is formed by a vertical stripe-shaped display surface in which the vertical slits 15 are arranged at substantially equal intervals.

  As shown in FIGS. 9 and 10, the mark removal part 13 and the area in the vicinity thereof on the back side of the logo mark display part 11 are the same as the metal oxide film layer 12 a and the metal wiring 6 made of the same material as the jumper wiring 4. The display film layer 12 is covered with a metal film layer 12b made of a material. A wide display film layer 12 is formed in the center of this region, a metal wiring 6 is formed on both sides thereof, and a narrow display film layer 12 is formed on both sides thereof. It is configured not to short-circuit). Comb-shaped slits 15 are provided in the upper part of the center and right display film layers 12. Under the metal wiring 6, a metal oxide film layer 12 a similar to the jumper wiring 4 is provided. The slits 15 provided between the display film layer 12 and the metal wiring 6 and the comb-shaped slits 15 form vertical stripes arranged at substantially equal intervals as shown in FIG.

  As described above, each character of the logo mark display unit 11 is configured by a display surface having vertical stripes at substantially equal intervals. By doing so, the metal oxide constituting the display film layer 12 is formed. There is an effect that the slit 15 formed between the film layer 12a and the metal film layer 12b and the metal wiring 6 becomes inconspicuous. The display film layer 12 may not be provided with the comb-shaped slit 15. This is because the width of the slit 15 formed between the metal oxide film layer 12a and the metal film layer 12b constituting the display film layer 12 and the metal wiring 6 can be made inconspicuous.

Although it depends on the size of characters, for example, in a mobile phone, the slit 15 is formed to be 25 μm or less, so that it is difficult to recognize by human vision.
For example, if the slit 15 is 15 μm or less and the width of the line-shaped metal oxide film layer 12a and the metal film layer 12b between the adjacent slits 15 is 30 μm or more, a substantially uniform surface with fine stripes is obtained.

  Thus, since the display surface of the logo mark display unit 11 is covered with the same metal oxide and metal in the same process, the number of processes and manufacturing costs are reduced, the thickness is simple with a simple structure, and the gold-based It is possible to display a logo mark with a metallic color (metallic) and an excellent design. Further, the metal wiring 6 and the metal oxide film layer 12a can be arranged in the region of the logo mark display portion 11 and the wiring can be provided by effectively using the limited space of the frame portion.

(Third embodiment)
An integrated touch sensor substrate according to a third embodiment of the present invention will be described with reference to FIGS. In the third embodiment, the same parts as those of the above-described embodiment are denoted by the same reference numerals, description thereof will be omitted, and only different parts will be described.

  FIG. 11A is a plan view of the integrated touch sensor substrate 1 according to the present embodiment as viewed from the front surface side, and FIG. 11B is an enlarged cross-sectional view showing a portion D of FIG. is there. FIG. 12 is a plan view showing details of the laminated structure of the integrated touch sensor substrate 1 when viewed from the back side, and shows a state before the formation of the insulating protective film 9 (FIG. 4 of the first embodiment). It is a drawing corresponding to 13A is a cross-sectional view of the integrated touch sensor substrate 1 in the direction of arrows T-T shown in FIG. 12, and FIG. 13B is an enlarged view showing an E portion of FIG. 13A. It is sectional drawing.

  The integrated touch sensor substrate 1 according to the present embodiment uses the same metal oxide and metal as the jumper wiring 4 and the metal wiring 6 for the metal oxide film layer 12a and the metal film layer 12b which are the display film layers 12. The second embodiment is the same as the second embodiment in that the metal wiring 6 is disposed on a part of the display film layer 12 that displays each character of the logo mark display unit 11 in the same process. . However, as shown in FIG. 11 (b), each character of the logo mark on the logo mark display unit 11 is not a vertical stripe display surface, but a horizontal stripe shape in which horizontal slits 15 are inserted at substantially equal intervals. It is different in that it is constituted by the display surface.

  As shown in FIG. 12 and FIG. 13, a metal oxide film constituting a display film layer 12 having a horizontally long and narrow shape on the inner surface of the mark removal part 13 and the vicinity thereof on the back side of the logo mark display part 11. Layer 12a and metal wiring 6 are formed. A slit 15 is provided between the metal oxide film layer 12a which is the display film layer 12 and the metal wiring 6 so as not to short-circuit each other. These slits 15 form horizontal stripes arranged at approximately equal intervals as shown in FIG.

Thus, by making the slit 15 into a plurality of stripes, there is an effect of making the slit 15 inconspicuous.
In FIG. 12, the metal oxide film layers 12 a and the metal wirings 6 constituting the display film layer 12 having a horizontally long and narrow shape are arranged alternately, but the display film layers 12 are combined into one comb. A tooth-shaped slit 15 may be inserted.

  Thus, since the display surface of the logo mark display unit 11 is covered with the same metal oxide and metal in the same process, the number of processes and manufacturing costs are reduced, the thickness is simple with a simple structure, and the gold-based It is possible to display a logo mark with a metallic color (metallic) and an excellent design. Moreover, the metal wiring 6 can also be arrange | positioned also in the area | region of the logo mark display part 11, and wiring can be provided using the space where the frame part was limited effectively.

(Fourth embodiment)
With reference to FIG. 14, an integrated touch sensor substrate according to a fourth embodiment of the present invention will be described. In the fourth embodiment, the same parts as those of the above-described embodiment are denoted by the same reference numerals, description thereof is omitted, and only different parts are described.

  The integrated touch sensor substrate 1 according to the present embodiment is obtained by changing a part of the configuration described in the third embodiment, and the plan view viewed from the front side is shown in FIGS. Is the same. A plan view showing the details of the laminated structure of the integrated touch sensor substrate 1 when viewed from the back side is the same as FIG. FIG. 14A is a cross-sectional view of the integrated touch sensor substrate 1 in the direction of the line TT shown in FIG. 12, and FIG. 14B is an enlarged view showing an F portion of FIG. It is sectional drawing.

  In the above-described embodiment, the metal wiring 6 is formed directly on the frame portion 3, but the specific resistance value of the material constituting the frame portion 3 is lower than a predetermined value, or the frame portion 3 is formed by screen printing. In cases such as when the surface irregularities are rough, it is difficult to form the metal oxide film layer 12a and the metal wiring 6 directly on the frame portion 3. In the present embodiment, it will be described below that the technical idea of the present invention can be implemented even when the metal oxide film layer 12a and the metal wiring 6 cannot be directly formed on the frame portion 3. It is.

  As shown in FIG. 14A, in the integrated touch sensor substrate 1 according to the present embodiment, an insulating layer 16 that covers the entire back surface of the cover glass 2 is formed on the frame portion 3. With this configuration, for example, even when the frame portion 3 contains a large amount of carbon black and has a low specific resistance value, the metal oxide film layer 12a and the metal wiring 6 cannot be directly formed on the frame portion 3. The oxide film layer 12 a and the metal wiring 6 can be formed on the insulating layer 16.

  When this embodiment is viewed from the front side, each character of the logo mark of the logo mark display section 11 is formed on a horizontal stripe-shaped display surface, as in the third embodiment. Here, as shown in FIG. 14B, this horizontal stripe-shaped display surface is not formed on the inner surface of the mark removal portion 13 as in the third embodiment, but is formed on the insulating layer 16. The display surface is visually recognized through the insulating layer 16.

  Thus, since the display surface of the logo mark display unit 11 is covered with the same metal oxide and metal in the same process, the number of processes and manufacturing costs are reduced, the thickness is simple with a simple structure, and the gold-based It is possible to display a logo mark with a metallic color (metallic) and an excellent design. Moreover, the metal wiring 6 can be arrange | positioned in the area | region of the logo mark display part 11, and wiring can be provided using the limited space of the frame part 3 effectively.

  The details of the integrated touch sensor substrate of the present invention are not limited to the above-described embodiments, and various modifications can be made. In the above-described embodiment, the mobile phone is used as the display device, but the present invention is not limited to this. For example, the present invention can also be applied to a display device in which a logo mark is displayed on the periphery, such as a portable information terminal, a car navigation system, a computer display, or a liquid crystal television.

  In the above-described embodiment, the projected capacitive touch panel has been described as an integrated touch sensor substrate. However, the capacitive touch panel is not limited to the capacitive touch panel, and various types of touch panels having a frame portion may be used. Can be applied.

  In order to describe the present invention in more detail, the following two examples will be given, but the present invention is not limited to these examples. In these examples, a manufacturing method of the integrated touch sensor substrate 1 having the same configuration as that described in the second embodiment will be described in detail.

  15-20 is a figure which shows the manufacturing process of the integrated touch sensor board | substrate 1 which concerns on a present Example. 15-20, (a) is sectional drawing, (b) is a top view. Moreover, the dashed-two dotted lines XX and YY shown to (b) of FIGS. 15-20 represent each cutting position of sectional drawing of (a).

[Example 1]
<1. Formation of frame part 3>
First, a pigment-based resist, which will be described later, was applied on the back surface of the cover glass 2 by spin coating.
Next, after removing the solvent with a vacuum drier, exposure was performed at 200 mJ using a proximity exposure system (ultra-high pressure mercury lamp). Here, as the photomask for exposure, a soda glass patterned with Cr (chromium) was used.
Then, _Na 2 CO ₃ (sodium carbonate), and developed with NaHCO ₃ aqueous alkaline solution of a mixture of (sodium hydrogen carbonate).
Then, heat treatment was performed at 235 ° C. for 20 minutes to form the frame portion 3 including the mark removal portion 13 having a predetermined logo mark shape shown in FIG.

<2. Formation of Jumper Wiring 4 and Metal Oxide Film Layer 12a>
First, an ITO film having a film thickness of 200 mm was formed on the formed material shown in FIG. 15 by DC sputtering using a DC magnetron sputtering method while sputtering at 170 ° C.
Next, a general novolac positive resist is spin-coated, pre-baked at 105 ° C., and then exposed at 100 mJ. Then, an alkaline aqueous solution in which NaOH (sodium hydroxide) and Na ₂ CO ₃ are mixed is added. Then, positive development was performed. Here, a proximity exposure system (ultra-high pressure mercury lamp) was used for exposure, and a soda glass patterned with Cr was used as a photomask for exposure.
Then, etching is performed using oxalic acid ((COOH) ₂ ), and the entire surface of the positive resist is exposed. Then, the positive resist is peeled off with an alkaline aqueous solution in which NaOH and Na ₂ CO ₃ are mixed, as shown in FIG. The jumper wiring 4 and the metal oxide film layer 12a were formed from the ITO film.

<3. Formation of insulating film 5>
First, an insulating material (manufactured by JSR, product number: NN901) was applied on the formed product shown in FIG. 16 by spin coating.
Next, it prebaked at 80 degreeC, the solvent part was removed, and it exposed at 250 mJ using the proximity exposure system (super-high pressure mercury lamp). Here, as a photomask for exposure, a quartz glass having a pattern made of Cr was used.
_{It was} then developed with an alkaline aqueous solution obtained by mixing Na ₂ CO _3, NaHCO 3.
Then, heat treatment was performed at 235 ° C. for 20 minutes.
In this way, the insulating film 5 on the jumper wiring 4 was formed as shown in FIG.

<4. Formation of metal wiring 6 and metal film layer 12b>
First, a Mo layer, an Al layer, and a Mo layer are sequentially formed in a vacuum by a DC magnetron sputtering method on the formation shown in FIG. Formed.
Next, a general novolac positive resist is spin-coated, pre-baked at 105 ° C., exposed at 100 mJ, and then positively developed with an alkaline aqueous solution in which NaOH and Na ₂ CO ₃ are mixed. It was. Here, a proximity exposure system (ultra-high pressure mercury lamp) was used for exposure, and a soda glass patterned with Cr was used as a photomask for exposure.
Then, etching was performed with a phosphoric acid / nitric acid / water ternary etchant (etching solution), and the positive resist was exposed on the entire surface, and then the positive resist was stripped with a water-soluble alkaline stripping solution containing silicate.
Thus, as shown in FIG. 18, the metal film layer 12 b for forming the metal wiring 6 and the display film layer 12 was formed on the frame portion 3. Here, the inner surface of the mark removal part 13 is covered with the film of the Mo / Al / Mo laminated body by the metal film layer 12b and the metal wiring 6 on both sides thereof.

<5. Formation of transparent electrodes 7 and 8>
First, an ITO film was formed on the formed material shown in FIG. 18 by DC sputtering using a DC magnetron sputtering method and sputtering while heating at 170 ° C.
Next, a general novolac positive resist is spin-coated, pre-baked at 105 ° C., exposed at 100 mJ, and then positively developed with an alkaline aqueous solution in which NaOH and Na ₂ CO ₃ are mixed. It was. Here, a proximity exposure system (ultra-high pressure mercury lamp) was used for exposure, and a soda glass patterned with Cr was used as a photomask for exposure.
Then, etching was performed using oxalic acid, and the entire surface of the positive resist was exposed. Then, the positive resist was peeled off with an alkaline aqueous solution in which NaOH and Na ₂ CO ₃ were mixed.
Thus, as shown in FIG. 19, the transparent electrodes 7 and 8 were formed with the ITO film.
In addition, when the alkali resistance of the metal film layer 12b is poor in the alkaline aqueous solution when the positive resist is peeled off, an ITO film layer is coated on the metal film layer 12b simultaneously with the formation of the transparent electrodes 7 and 8 as necessary. May be.

<6. Formation of insulating protective film 9>
First, an overcoat material (manufactured by JSR, product number: NN901) was applied on the formed product shown in FIG. 19 by spin coating.
Next, it prebaked at 80 degreeC, the solvent part was removed, and it exposed at 150 mJ using the proximity exposure system (super-high pressure mercury lamp). Here, as a photomask for exposure, a quartz glass having a pattern made of Cr was used.
_{It was} then developed with an alkaline aqueous solution obtained by mixing Na ₂ CO _3, NaHCO 3.
Then, heat treatment was performed at 235 ° C. for 20 minutes.
In this way, as shown in FIG. 20, the insulating protective film 9 was formed, and the integrated touch sensor substrate 1 was manufactured and completed.

<7. About pigment-based resists>
The pigment-based resist used in the above examples is obtained by dispersing a black pigment in a resin dissolved in a solvent. As the black pigment, pigment red (PR254) and pigment blue (PB15: 3) mixed at a ratio of 1: 1 were used. The pigment ratio in the solid is 40 percent. The frame portion 3 was formed to a thickness of 3 μm using this material. The specific resistance value of the frame part 3 formed in this way was less than 1 × 10 ¹⁴ Ω / cm, and the dielectric constant was 4.0 or less.

<About the color of the logo mark>
In Example 1, the thickness of the metal oxide film layer 12a (ITO) that is the presser of the logo mark portion is 200 mm, and the metal film layer 12b with Mo / Al / Mo = 500 mm / 2000 mm / 500 mm is formed on the upper layer. When it is provided, when the logo mark part is observed from the surface side, a gold-based metal color of L *: 62.53, a *: 0.36, b *: 9.25 (SCI D65 light source) is obtained. It was.

[Example 2]
<1. Formation of frame part 3>
First, a pigment-based resist, which will be described later, was applied on the back surface of the cover glass 2 by spin coating.
Next, after removing the solvent with a vacuum drier, exposure was performed at 200 mJ using a proximity exposure system (ultra-high pressure mercury lamp). Here, as the photomask for exposure, a soda glass patterned with Cr (chromium) was used.
Then, _Na 2 CO ₃ (sodium carbonate), and developed with NaHCO ₃ aqueous alkaline solution of a mixture of (sodium hydrogen carbonate).
Then, heat treatment was performed at 235 ° C. for 20 minutes to form the frame portion 3 including the mark removal portion 13 having a predetermined logo mark shape shown in FIG.

<2. Formation of Jumper Wiring 4 and Metal Oxide Film Layer 12a>
First, an ITO film having a film thickness of 1400 mm was formed on the formed material shown in FIG. 15 by DC sputtering using a DC magnetron sputtering method while sputtering at 170 ° C.
Next, a general novolac positive resist is spin-coated, pre-baked at 105 ° C., and then exposed at 100 mJ. Then, an alkaline aqueous solution in which NaOH (sodium hydroxide) and Na ₂ CO ₃ are mixed is added. Then, positive development was performed. Here, a proximity exposure system (ultra-high pressure mercury lamp) was used for exposure, and a soda glass patterned with Cr was used as a photomask for exposure.
Then, etching is performed using oxalic acid ((COOH) ₂ ), and the entire surface of the positive resist is exposed. Then, the positive resist is peeled off with an alkaline aqueous solution in which NaOH and Na ₂ CO ₃ are mixed, as shown in FIG. The jumper wiring 4 and the metal oxide film layer 12a were formed from the ITO film.

<3. Formation of insulating film 5>
First, an insulating material (manufactured by JSR, product number: NN901) was applied on the formed product shown in FIG. 16 by spin coating.
Next, it prebaked at 80 degreeC, the solvent part was removed, and it exposed at 250 mJ using the proximity exposure system (super-high pressure mercury lamp). Here, as a photomask for exposure, a quartz glass having a pattern made of Cr was used.
_{It was} then developed with an alkaline aqueous solution obtained by mixing Na ₂ CO _3, NaHCO 3.
Then, heat treatment was performed at 235 ° C. for 20 minutes.
In this way, the insulating film 5 on the jumper wiring 4 was formed as shown in FIG.

<4. Formation of metal wiring 6 and metal film layer 12b>
First, a Mo layer, an Al layer, and a Mo layer are sequentially formed in a vacuum by a DC magnetron sputtering method on the formation shown in FIG. Formed.
Next, a general novolac positive resist is spin-coated, pre-baked at 105 ° C., exposed at 100 mJ, and then positively developed with an alkaline aqueous solution in which NaOH and Na ₂ CO ₃ are mixed. It was. Here, a proximity exposure system (ultra-high pressure mercury lamp) was used for exposure, and a soda glass patterned with Cr was used as a photomask for exposure.
Then, etching was performed with a phosphoric acid / nitric acid / water ternary etchant (etching solution), and the positive resist was exposed on the entire surface, and then the positive resist was stripped with a water-soluble alkaline stripping solution containing silicate.
Thus, as shown in FIG. 18, the metal film layer 12 b for forming the metal wiring 6 and the display film layer 12 was formed on the frame portion 3. Here, the inner surface of the mark removal part 13 is covered with the film of the Mo / Al / Mo laminated body by the metal film layer 12b and the metal wiring 6 on both sides thereof.

<5. Formation of transparent electrodes 7 and 8>
First, an ITO film was formed on the formed material shown in FIG. 18 by DC sputtering using a DC magnetron sputtering method and sputtering while heating at 170 ° C.
Next, a general novolac positive resist is spin-coated, pre-baked at 105 ° C., exposed at 100 mJ, and then positively developed with an alkaline aqueous solution in which NaOH and Na ₂ CO ₃ are mixed. It was. Here, a proximity exposure system (ultra-high pressure mercury lamp) was used for exposure, and a soda glass patterned with Cr was used as a photomask for exposure.
Then, etching was performed using oxalic acid, and the entire surface of the positive resist was exposed. Then, the positive resist was peeled off with an alkaline aqueous solution in which NaOH and Na ₂ CO ₃ were mixed.
Thus, as shown in FIG. 19, the transparent electrodes 7 and 8 were formed with the ITO film.
In addition, when the alkali resistance of the metal film layer 12b is poor in the alkaline aqueous solution when the positive resist is peeled off, an ITO film layer is coated on the metal film layer 12b simultaneously with the formation of the transparent electrodes 7 and 8 as necessary. May be.

<6. Formation of insulating protective film 9>
First, an overcoat material (manufactured by JSR, product number: NN901) was applied on the formed product shown in FIG. 19 by spin coating.
Next, it prebaked at 80 degreeC, the solvent part was removed, and it exposed at 150 mJ using the proximity exposure system (super-high pressure mercury lamp). Here, as a photomask for exposure, a quartz glass having a pattern made of Cr was used.
_{It was} then developed with an alkaline aqueous solution obtained by mixing Na ₂ CO _3, NaHCO 3.
Then, heat treatment was performed at 235 ° C. for 20 minutes.
In this way, as shown in FIG. 20, the insulating protective film 9 was formed, and the integrated touch sensor substrate 1 was manufactured and completed.

<7. About pigment-based resists>
The pigment-based resist used in the above examples is obtained by dispersing a black pigment in a resin dissolved in a solvent. As the black pigment, pigment red (PR254) and pigment blue (PB15: 3) mixed at a ratio of 1: 1 were used. The pigment ratio in the solid is 40 percent. The frame portion 3 was formed to a thickness of 3 μm using this material. The specific resistance value of the frame part 3 formed in this way was less than 1 × 10 ¹⁴ Ω / cm, and the dielectric constant was 4.0 or less.

<About the color of the logo mark>
In Example 2, the thickness of the metal oxide film layer 12a (ITO) that is a presser of the logo mark portion is 1400 mm, and the metal film layer 12b that is Mo / Al / Mo = 500 mm / 2000 mm / 500 mm is formed thereon. When provided, when the logo mark part is observed from the surface side, a gold-based metal color of L *: 63.86, a *: -3.29, b *: 30.38 (SCI D65 light source) is obtained. It was.

  The present invention can be used as a position input device for an electronic device such as a mobile phone or a portable information terminal.

DESCRIPTION OF SYMBOLS 1 Integrated touch sensor substrate 2, 102 Cover glass 3, 103 Frame part 4 Jumper wiring 5 Insulating film 6 Metal wiring 7, 8 Transparent electrode 9 Insulating protective film 10, 110 Display area 11, 111 Logo mark display part 12, 112 Display Film layer 12a Metal oxide film layer 12b Metal film layers 13, 113 Mark removal parts 14, 114 Selfie camera window 15 Slit 16 Insulating layer 50 Display device 51 Case 52 Operation button

Claims (6)

An integrated touch sensor substrate with a front panel and a touch panel sensor,
A transparent front plate,
A frame layer that is formed at the peripheral edge of the back surface of the front plate and divides a display area of a predetermined shape;
A mark removing portion formed by extracting a predetermined position of the frame layer in a predetermined shape;
Metal wiring formed on the back side of the frame layer;
A metal oxide film layer and a metal film layer formed on the back side of the mark removal part,
A sensor layer formed in the display area and connected to the metal wiring;
The integrated touch sensor substrate, wherein the metal wiring and the metal film layer are formed of the same metal.   The integrated touch sensor substrate according to claim 1, wherein the metal oxide film layer and the metal film layer are formed as a part of the metal wiring by being separated by a slit. A display device,
A display panel having a pixel region in which a plurality of pixels are arranged in a matrix, and displaying an image in the pixel region based on an input signal;
A display device comprising: the integrated touch sensor substrate according to claim 1 or 2 attached so as to cover the pixel region. A transparent front plate,
A frame layer that is formed at the peripheral edge of the back surface of the front plate and divides a display area of a predetermined shape;
A mark removing portion formed by extracting a predetermined position of the frame layer in a predetermined shape;
Metal wiring formed on the back side of the frame layer;
A metal oxide film layer and a metal film layer formed on the back side of the mark removal part,
A method for manufacturing an integrated touch sensor substrate of a front panel and a touch panel sensor, which is formed in the display area and includes a sensor layer connected to the metal wiring,
Forming the frame layer comprising the mark removal part on the back surface of the front plate;
Forming a jumper wiring;
Forming the metal wiring;
Forming the metal oxide film layer;
Forming the metal film layer;
Forming the sensor layer,
The step of forming the jumper wiring and the step of forming the metal oxide film layer, and the step of forming the metal wiring and the step of forming the metal film layer using the same material A method for manufacturing an integrated touch sensor substrate, characterized in that:   5. The method according to claim 4, further comprising forming a metal film layer as a part of the metal wiring by providing a slit in the metal oxide film layer and the metal film layer to separate the metal oxide film layer and the metal film layer. Manufacturing method of an integrated touch sensor substrate.   5. The method of manufacturing an integrated touch sensor substrate according to claim 4, wherein the metal oxide film layer is made of indium tin oxide and has a thickness of 100 to 2000 mm.

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