JP2015062036A - Electronic component transfer device, electronic component handling device, and electronic component testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component transfer device excellent in transfer capacity of DUTs between trays.SOLUTION: An electronic component transfer device for transferring DUTs 100 between trays 110 and 120 includes a device conveying apparatus 50 comprising: a plurality of shuttles 51 for holding the DUTs 100; a first endless guide rail 521 for guiding the shuttles 51; and first to third feeding devices 53-55 for moving the shuttles 51 on the first guide rail 521. On the first guide rail 521, the shuttles 51 can move over the entire circumference of the rail.

Description

The present invention relates to various electronic components such as semiconductor integrated circuit elements (hereinafter referred to as DUT (Device Under Test).
). In the electronic component testing apparatus for testing the electronic component, an electronic component transfer apparatus that transfers the DUT between trays, and an electronic component handling apparatus and an electronic component testing apparatus that include the electronic component transfer apparatus.

As an electronic component testing apparatus for testing an electronic component, a device that transfers a DUT between a customer tray and a test tray before and after the test is known (see, for example, Patent Document 1).

International Publication No. 2008/041334

In the electronic component testing apparatus described above, since the DUT is transferred between trays by a so-called pick and place apparatus, there is a limit to the transfer capability.

The problem to be solved by the present invention is to provide an electronic component transfer device having excellent DUT transfer capability between trays, as well as an electronic component handling device and an electronic component test device including the electronic component transfer device.

[1] An electronic component transfer device according to the present invention is an electronic component transfer device for transferring an electronic device under test between trays, a plurality of holding means for holding the electronic device under test, and the holding device. And a moving device that moves the holding means on the track. The holding means is movable on the track over the entire circumference of the track. It is characterized by being.

[2] In the above invention, the intervals between the plurality of holding means may be variable on the track.

  [3] In the above invention, the moving means may be independent of the holding means.

[4] In the above invention, the electronic component transfer device includes a first transfer means for transferring the electronic device under test from a first tray to the holding means, and a second tray from the holding means. And a second transfer means for transferring the electronic device under test.

  [5] In the above invention, the track may have a reversing portion that is folded back in the vertical direction.

[6] In the above invention, the electronic component transfer device transfers the electronic device under test from the first tray to the holding means with the terminal of the electronic device under test facing downward or upward. A first transfer means; and a second transfer means for transferring the electronic device under test from the holding means to a second tray with the terminal facing upward or downward. Good.

[7] In the above invention, the track includes a first horizontal portion in which the holding means moves in the horizontal direction with the terminal facing downward, and the holding means in the horizontal position with the terminal facing upward. A second horizontal portion that moves in a direction, and the inversion portion connects between one end of the first horizontal portion and one end of the second horizontal portion, A second reversing unit connecting between the other end of the second horizontal part and the other end of the first horizontal part, and the moving means includes the first
A first moving part that moves the holding means from the other end of the horizontal part toward the one end; and the second part
A second moving part for moving the holding means from one end to the other end of the horizontal part, and the second part
And a third moving part that moves the holding means from the other end of the second horizontal part toward the other end of the first horizontal part.

[8] In the above invention, the holding means may have a holding mechanism for holding the electronic device under test even when the holding means is inverted.

[9] In the above invention, the transport device may include a levitation unit that suspends the holding unit from the track by interposing a compressed fluid between the holding unit and the track.

[10] In the above invention, one of the trays may be a customer tray or a test tray, and the other tray may be a test tray or a customer tray.

[11] In the electronic component handling apparatus according to the present invention, in order to test an electronic device under test, the electronic device under test is mounted on a test tray and conveyed, and the electronic device under test is placed on a contact portion of a test head. An electronic component handling device for pressing, wherein the first electronic component transfer device is configured to transfer an electronic device under test before a test from a customer tray to a test tray,
Alternatively, the second electronic device described above in which the electronic component under test is transferred from the test tray to the customer tray.
The electronic component transfer apparatus according to claim 1 is provided.

[12] An electronic component testing apparatus according to the present invention is an electronic component testing apparatus for testing an electronic device under test, and presses the electronic device under test against a test head and a contact portion of the test head. An electronic component handling apparatus and a tester electrically connected to the test head are provided.

According to the present invention, when transferring the electronic devices under test between the trays, the electronic devices under test can be sequentially conveyed by circulating a plurality of holding means on an endless track. The transfer capability of the electronic component under test can be improved.

FIG. 1 is a plan view of an electronic component testing apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view of the electronic component testing apparatus according to the embodiment of the present invention. 3 is a cross-sectional view taken along line III-III in FIG. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. FIG. 5 is a side view of the device transfer device of the loader unit in the embodiment of the present invention. 6 is a side view showing a shuttle and a guide rail of the device transport apparatus shown in FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. FIG. 8 is a side view showing a modification of the device transport apparatus in the embodiment of the present invention. FIGS. 9A to 9E are diagrams showing a transfer operation from the customer tray to the shuttle in the embodiment of the present invention, and FIG. 9A is a diagram showing an outline of the transfer operation. FIGS. 9B to 9E are diagrams showing the steps of the transfer operation. FIG. 10 is an enlarged view of the pitch changing mechanism of the device transport apparatus shown in FIG. FIG. 11 is a graph showing the relationship between the feeding speed of the second feeding device and the receiving operation of the third feeding device. 12 (a) to 12 (e) are diagrams showing the transfer operation from the shuttle to the test tray in the embodiment of the present invention, and FIG. 12 (a) is a diagram showing the outline of the transfer operation. FIG. 12B to FIG. 12E are diagrams showing each step of the transfer operation. FIG. 13 is a cross-sectional view illustrating the configuration of the test unit and the upper part of the test head of the electronic component handling apparatus according to the embodiment of the present invention. 14 (a) to 14 (f) are diagrams showing a transfer operation from the test tray to the shuttle in the embodiment of the present invention, and FIG. 14 (a) is a diagram showing an outline of the transfer operation. 14 (b) to 14 (f) are diagrams showing each step of the transfer operation. FIGS. 15A to 15E are diagrams showing a transfer operation from the shuttle to the customer tray in the embodiment of the present invention, and FIG. 15A is a diagram showing an outline of the transfer operation. FIGS. 15B to 15E are diagrams showing an outline of the transfer operation.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 and 2 are a plan view and a perspective view of the electronic component testing apparatus according to the present embodiment.
Is a sectional view taken along line III-III in FIG. 1, and FIG. 4 is a sectional view taken along line IV-IV in FIG.

  First, the configuration of the electronic component testing apparatus 1 in this embodiment will be outlined.

The electronic component testing apparatus 1 in the present embodiment tests (inspects) whether or not the DUT 100 operates properly in a state where a high-temperature or low-temperature thermal stress is applied to the DUT 100 (or a normal temperature state), and the test result is obtained. A device for classifying the DUT 100 based on the test head 2,
A tester 3 and a handler 10 are provided. In this electronic component testing apparatus 1,
The DUT 100 is mounted on the test tray 120 and conveyed, and the test of the DUT 100 is executed. However, the DUT 100 is switched between the customer tray 110 and the test tray 120 before and after that. The handler 10 in this embodiment corresponds to an example of an electronic component handling apparatus in the present invention.

The handler 10 in this embodiment includes a storage unit 20, a loader unit 30, a heat application unit 60, a test unit 70, a heat removal unit 80, an unloader unit 90, as shown in FIGS. It has.

The storage unit 20 stores a large number of customer trays 110 that contain DUTs 100 that have been tested or have been tested. This customer tray 110 is transferred to the handler 10 from another process.
This is a tray for loading / unloading 0, and a large number of accommodating portions 111 that can accommodate the DUT 100.
(Refer to FIG. 9A and FIG. 15A). The housing part 111 is arranged in a matrix at a first pitch P _1.

The loader unit 30 receives the DU before the test from the customer tray 110 provided from the storage unit 20.
T100 is transferred to the test tray 120, and the test tray 120 is conveyed to the heat application unit 60. The test tray 120 is a tray that circulates in the handler 10 and is a DUT.
It has a large number (for example, 256) of inserts 122 formed with recesses 123 for holding 100 (see FIGS. 12A, 13 and 14A). This insert 122 is
Arranged in a matrix at a _second pitch P ₂ wider than the first pitch P ₁ (P ₁ <
P _2).

The heat application unit 60 receives the test tray 120 from the loader unit 30 and is high in temperature (for example, room temperature to + 160 ° C.) with respect to the DUT 100 before the test mounted on the test tray 120.
Alternatively, after applying a low temperature (for example, −60 ° C. to room temperature) thermal stress, the test tray 120 is transported to the test unit 70.

In this embodiment, as shown in FIG. 2 to FIG.
The socket 201 of the test head 2 faces the test portion 70 of the handler 10 through the opening 11 formed in the upper portion of the handler 1.

The test unit 70 is a DU mounted on the test tray 120 sent from the heat application unit 60.
By pressing T100 against the socket 201 of the test head 2, the terminal 1 of the DUT 100
10 and the contact pin 202 of the socket 201 are brought into electrical contact.

Although not particularly illustrated, a large number (for example, 512) of sockets 201 are arranged in a matrix on the test head 2, and the insert 122 in the test tray 120 is arranged.
Corresponds to the socket 201.

As shown in FIG. 3, the test head 2 is connected to the tester 3 via a cable 301. When the DUT 100 is pressed against the socket 201 by the handler 10, for example,
The tester 3 inputs / outputs a test signal to / from the DUT 100 via the socket 201, thereby executing the test of the DUT 100. Incidentally, the socket 201 on the test head 2 is
When the product type of the DUT 100 is changed, it is appropriately replaced with a socket corresponding to the DUT 100.

The heat removal unit 80 receives the test tray 120 from the test unit 70 and completes the test.
After removing the thermal stress from the UT 100, the test tray 120 is removed from the unloader unit 9
Transport to 0.

The unloader unit 90 classifies the DUT 100 while transferring the tested DUT 100 from the test tray 120 to the customer tray 110 associated with the test result.
The customer tray 110 containing the tested DUT 100 is stored in the storage unit 20. Also, the test tray 120 that has been emptied after all the DUTs 100 are transferred is returned to the loader unit 30 by the tray transfer device 58 (see FIG. 1).

  Hereinafter, each part of the handler 10 will be described in detail.

<Storage unit 20>
As shown in FIGS. 1 and 2, the storage unit 20 includes a pre-test tray stocker 21, a tested tray stocker 22, and an empty tray stocker 23.

The pre-test tray stocker 21 is a customer tray 110 that houses the pre-test DUT 100.
Many are stored. On the other hand, the tested tray stocker 22 stores a large number of customer trays 110 containing the DUTs 100 classified according to the test results. The empty tray stocker 23 stores an empty customer tray 110 that does not accommodate the DUT 100.
In this example, six tested tray stockers 22 are provided, and the DUT 100 can be classified into a maximum of six types of test results.

Although not particularly shown, these stockers 21 to 23 include a frame-like tray support frame and an elevator that can move up and down in the tray support frame. A large number of customer trays 110 are stacked in the tray support frame, and a stack of customer trays is moved up and down by an elevator.

Since all the stockers 21 to 23 have the same structure, the number of the pre-test tray stocker 21, the tested tray stocker 22, and the empty tray stocker 23 is not limited to the above.
It can be set arbitrarily. Further, the total number of tray stockers 21 to 23 is not particularly limited to the above.

The storage unit 20 has a tray transfer arm 24 that can transfer the customer tray 110.

For example, all DUTs from the uppermost customer tray 110 of the pre-test tray stocker 21
When 100 is supplied to the loader unit 30 and the customer tray 110 becomes empty, the tray transfer arm 24 moves the customer tray 110 from the pre-test tray stocker 21 to the empty tray stocker 23.

Further, for example, when the uppermost customer tray 110 of the tested tray stocker 22 is filled with the tested DUT 100, the tray transfer arm 24 is replaced with the empty tray stocker 23.
To move the new empty customer tray 110 to the tested tray stocker 22.

The configuration of the storage unit 20 is not particularly limited to the above. For example, the tray transfer arm 24
However, the uppermost customer tray 110 is taken out from the pre-test tray stocker 21 or the tested tray stocker 22 and transferred onto the set plate, and the set plate faces the window formed on the apparatus base of the handler 10. Ascending, the loader unit 30 and the unloader unit 90
A customer tray 110 may be provided.

<Loader unit 30>
5 is a side view of the device transport apparatus of the loader unit in the present embodiment, FIG. 6 is a side view of the shuttle and guide rail of the device transport apparatus, and FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 8 is a side view showing a modification of the device transport apparatus in the present embodiment, and FIGS.
FIG. 10E is a diagram showing the transfer operation from the customer tray to the shuttle in this embodiment.
Is an enlarged view of the pitch changing mechanism of the device conveying apparatus shown in FIG. 5, FIG. 11 is a graph showing the relationship between the feeding speed of the second feeding apparatus and the receiving operation of the third feeding apparatus, and FIGS. (E
(A) is a figure which shows the transfer operation | movement from the shuttle to a test tray in this embodiment.

As shown in FIG. 1, the loader unit 30 includes a device transfer device 40 and a device transfer device 50.
A. In this example, after the device transfer apparatus 40 transfers the DUT 100 from the customer tray 110 to the device transfer apparatus 50A, the device transfer apparatus 50A
To transfer the DUT 100 to the test tray 120. The first movable head 43 and the device transport apparatus 50A of the device transfer apparatus 40 in the present embodiment correspond to an example of the first electronic component transfer apparatus in the present invention.

The device transfer apparatus 40 transfers the DUT from the customer tray 110 to the device transport apparatus 50A.
As shown in the figure, a pair of Xs provided along the X direction
Direction rail 41 and a first Y sliding on the X direction rail 41 along the X direction
A directional rail 42, a first movable head 43 supported by the first Y-directional rail 42,
Have.

The first movable head 43 includes a plurality of (for example, 36) suction heads 4 that can move up and down.
31 (see FIG. 5 and FIG. 9A), and a plurality of DUTs 100 can be sucked and held simultaneously. The suction heads 431 of the first movable head 43 are arranged in a line at the same first pitch P ₁ as the housing portion 111 of the customer tray 110 described above. The 1st movable head 43 of the device transfer apparatus 40 in this embodiment is equivalent to an example of the 1st transfer means of this invention.

The first movable head 43 has a latch opener 432 for opening a latch 513 of the shuttle 51 described later. The latch opener 432 has a protrusion 433 that protrudes downward, and can move up and down independently of the suction head 341.

As shown in FIG. 1, the device transfer apparatus 40 includes the first movable head 43 described above.
In addition, there are two movable heads 45, 47. These heads 45, 47 are used when transferring from the device transport apparatus 50 B to the customer tray 110 to the DUT 100 in the unloader unit 90 described later. Is done.

Incidentally, the second movable head 45 is supported by the second Y-direction rail 44 slidable on the X-direction rail 41, and similarly to the first movable head 43, a plurality of (for example 36) ) Suction heads 451 (see FIG. 15A) and a latch opener 452 that can move up and down independently of the suction heads 451.

On the other hand, the third movable head 47 is also supported by the third Y-direction rail 46 that can slide on the X-direction rail 41. However, the third movable head 47 supports a test result with a low occurrence frequency. Therefore, it is possible to move on the third Y-direction rail 46 along the Y direction. Although not specifically shown, the third movable head 47 has the same suction head and latch opener as the first and second movable heads 43 and 45, but the first and second movable heads. The number of suction heads is smaller than 43 and 45.

As shown in FIGS. 5 and 6, the device transport apparatus 50 </ b> A includes a plurality of shuttles 51 that hold the DUT 100, guide rails 52 that guide the shuttles 51, and first to first devices that move the shuttles 51 on the guide rails 52. 3 feeding devices 53 to 55, a latch opener 56A for transferring the DUT 100 from the shuttle 51 to the test tray 120, and a control device 57 for controlling the first to third feeding devices 53 to 55.

The shuttle 51, the guide rail 52, and the first to third feeding devices 53 in the present embodiment.
To 55 correspond to an example of the transport device in the present invention, the shuttle (transport carrier) 51 in the present embodiment corresponds to an example of the holding means in the present invention, and the first guide rail 521 in the present embodiment corresponds to the present invention. The latch opener 56 in the present embodiment corresponds to an example of the second transfer means in the present invention.

Further, the first feeding device 53 in the present embodiment corresponds to an example of the first moving unit in the present invention, and the second feeding device 54 in the present embodiment corresponds to an example of the second moving unit in the present invention. And the 3rd feeder 55 in this embodiment is equivalent to an example of the 3rd moving part in the present invention.

As shown in FIG. 7, the shuttle 51 includes a device holding unit 511 that holds the DUT 100 and a base unit 515 to which the device holding unit 511 is attached. The device holding unit 511 houses the DUT 100. Device receiving hole 512 and device receiving hole 5
12 and a pair of latches 513 for restraining the DUT 100. Note that the latch 513 in the present embodiment corresponds to an example of a holding mechanism in the present invention.

Each latch 513 has a first holding portion 51 located at the bottom of the device receiving hole 512.
3a, a second holding portion 513b located above the device receiving hole 512, a contact portion 513c extending outward from the second holding portion 513b, a first holding portion 513a and a second holding portion A rotating shaft 513d that connects the holding portion 513b, and a first holding portion 513a,
The second holding portion 513b and the contact portion 513c are integrally formed. This latch 51
3 is rotatably supported by a rotating shaft 513d, and an urging member (not shown) such as a torsion spring.
Is biased in the direction toward the device accommodation hole 512 (the arrow direction in the figure).

When the DUT 100 is received in the device receiving hole 513, as shown in FIG.
The terminal 101 side of 100 is held by the first holding unit 513a and the DUT 100
The second holding portion 513b comes into contact with the upper portion of the first portion. For this reason, the device holding unit 511 has the DUT 1
When 00 is received, the DUT 100 is fixed in the device receiving hole 513 by the latch 513 so that the DUT 100 does not fall even if the shuttle 51 is turned upside down.

On the other hand, a pair of rail receiving grooves 516 are formed on both sides of the base portion 515 along the front-rear direction of the shuttle 51. The first guide rail 521 of the guide rail 52 is inserted into the rail receiving groove 516 through a slight clear rice so that the shuttle 51 is guided along the first guide rail 521. It has become.

As shown in FIG. 6, the guide rail 52 includes a first guide rail 521 and a second guide rail 525.

The first guide rail 521 includes first and second horizontal portions 521a and 5 extending in the horizontal direction.
21b and the first and second reversing parts 521c connecting the horizontal parts 521a and 521b,
521d and an annular shape (endless shape). The shuttle 51 can move (circulate) over the entire circumference of the first guide rail 521.

In this embodiment, the first and second reversing portions 521a and 521b are folded along the vertical direction, and the shuttle 51 moves with the terminal 101 of the DUT 100 facing downward on the first horizontal portion 521a. However, on the second horizontal portion 521b, the terminal 101 of the DUT 100 is used.
The shuttle 51 moves with the posture facing upward.

Note that the terminal 101 of the DUT 100 faces downward or upward over the entire circumference of the first guide rail 521 while rotating the first guide rail 521 90 degrees around the longitudinal direction from the state shown in FIG. The shuttle 51 may be moved in the posture. Moreover, if the whole shape of the 1st guide rail 521 is an endless shape, it will not specifically limit to the shape which has the above two inversion parts.

In the horizontal portions 521a and 521b of the first guide rail 521, as shown in FIG.
A flow path 522 and an outlet 523 are formed. The flow path 522 includes first and second horizontal portions 52.
A compressor 524 that extends along the longitudinal direction of 1 a and 521 b and supplies a compressed fluid such as pressurized air is connected to the flow path 522. The air outlet 523 opens from the flow path 522 to the upper surface and the side surface of the first guide rail 521.

When pressurized air is discharged from the air outlet 523, the pressurized air is interposed between the rail receiving groove 516 of the shuttle 51 and the first guide rail 511, and the shuttle 51 is connected to the first guide rail 521. Emerge from. For this reason, since the friction which arises when the shuttle 51 moves on the 1st guide rail 521 reduces remarkably, it can aim at cost reduction and a maintenance-free. The flow path 52 of the first guide rail 521 in the present embodiment.
2 and the air outlet 523 and the compressor 524 correspond to an example of the levitation means in the present invention.

On the other hand, the flow path 522 and the air outlet 523 are not formed in the reversing parts 521c and 521d of the first guide rail 521, but as shown in FIG. The guide rail 525 is arranged. Although not particularly illustrated, a flow path to which pressurized air is supplied also inside the second guide rail 525, and an outlet opening from the flow path toward the reversing portions 521c and 521d of the first guide rail 521. And are formed.

By blowing pressurized air from the outlet of the second guide rail 525 toward the upper portion of the shuttle 51, the shuttle 51 is prevented from rattling when the shuttle 51 passes through the reversing portions 521c and 521d. . In FIG. 5, the second guide rail 525 is omitted.

Instead of the above-described static pressure method, as shown in FIG. 8, a bearing 517 is attached to the shuttle 51 ′, and the bearing 517 rolls on the guide rail 52 ′, whereby the shuttle 51 ′ is moved to the guide rail 52 ′. You may move it up. Alternatively, although not particularly illustrated, the shuttle may be moved by a belt conveyor instead of the guide rail.

Returning to FIG. 5, a large number (for example, 100 or more) of shuttles 51 are mounted on the first guide rail 521, and the interval between these shuttles 51 is arbitrarily variable. Further, when the shuttles 51 are brought into contact with each other on the first guide rail 521, the shuttle 51
Pitch of each other, is set to be substantially the same as the pitch P ₁ between the accommodation part 111 of the customer tray 110 described above. Note that when the shuttles 51 are brought into contact with each other on the first guide rails 521, the pitch between the shuttles 51 is set to the accommodating portion 1 of the customer tray 110.
It may be an integral multiple of the pitch P ₁ between 11.

As shown in the figure, the first feeding device 53 is provided along the first horizontal portion 521a of the first guide rail 521. The first feeding device 53 includes pulleys 531 and 532, a belt 533, a motor 534, a guide rail 535, a slide block 536, an air cylinder 537, and a contact block 538.

A belt 533 is looped around the pair of pulleys 531 and 532, and the belt 533 is provided in parallel with the first horizontal portion 521 a of the first guide rail 521. Further, the motor 534 can drive one pulley 531 to rotate.

Similar to the belt 533, the guide rail 535 is also provided in parallel with the first horizontal portion 521a. The slide block 536 can slide on the guide rail 535 and is fixed to the belt 533.

An air cylinder 537 that can be vertically expanded and contracted is attached to the tip of the slide block 536, and a contact block 538 that contacts the shuttle 51 is attached to the tip of the air cylinder 537.

The first feeding device 53 rotates the pulley 531 clockwise by the motor 534 with the air cylinder 537 extended to move the slide block 536 to the left in the drawing, thereby The shuttle 51 is moved on the horizontal portion 521a. At this time, by pushing the last shuttle 51 by the contact block 538, the shuttles 51 are brought into contact with each other to move the plurality of shuttles 51 together. Incidentally, when the contact block 538 is returned to the origin, the pulley 531 is rotated counterclockwise in the drawing with the air cylinder 547 shortened, and the contact block 538 is moved in the right direction in the drawing. . Shuttle 5
A groove or a hole may be formed in 1 and the contact block 538 may be inserted into the groove or hole.

Further, as shown in the figure, a stopper 539 is provided in the vicinity of the end portion of the first horizontal portion 521a of the first guide rail 521. The stopper 539 has an air cylinder 539a that can be expanded and contracted in the vertical direction, and a stopper block 539b attached to the tip of the air cylinder 539a. By extending the air cylinder 539a, the first guide The shuttle 51 can be stopped at the end of the first horizontal portion 521a of the rail 521.

A customer tray 110 from which the DUT 100 is taken out by the first movable head 43 of the device transfer device 40 is located on the side of the end portion of the first horizontal portion 521a. In the present embodiment, as shown in the figure, when the first feeding device 53 loads the shuttle 51 on the first guide rail 521 up to the stopper 539, the shuttle 51 between the stopper 539 and the abutment block 538 is loaded. The number is set to be the same as the number of storage units 511 in the customer tray 110 along the Y direction.

When the shuttle 51 is loaded between the stopper 539 and the contact block 538,
As shown in FIG. 9A, the first movable head 43 of the device transfer device 40 transfers a plurality of DUTs 100 from the customer tray 110 to the shuttle 51 at the same time.

Specifically, first, the first movable head 43 approaches the customer tray 110, and the DUT
100 is held (FIG. 9B). Next, after the first movable head 43 moves above the shuttle 51, only the latch opener 432 is lowered and the contact 513 c of the latch 513 of the shuttle 51 is pressed by the protrusion 433 to open the latch 513 ( FIG. 9 (c)). Next, the first movable head 43 lowers the suction head 431 and places the DUT 100 on the first holding portion 513a of the latch 513 (FIG. 9D), and then the suction head 431 and the latch opener 432 are moved. It raises (FIG.9 (e)).

When the DUT 100 is transferred to all the shuttles 51 loaded between the stopper 539 and the contact block 538 in the manner described above, the first feeding device 53 causes the subsequent empty shuttle 51 to move.
Then, the last shuttle 51 is pushed to move all the shuttles 51 together.
The shuttle 51 pushed out by the first feeding device 53 to the first reversing portion 521c of the first guide rail 521 is caused by its own weight from the first reversing portion 521c to the second horizontal portion 521b.
Move to.

As shown in FIGS. 5 and 10, the second feeding device 54 is provided along the second horizontal portion 521 b of the first guide rail 521. Similarly to the first feeding device 53 described above, the second feeding device 54 also includes a pair of pulleys 541 and 542, a belt 543, and a motor 544.
A guide rail 545, a slide block 546, an air cylinder 547, and a contact block 548.

Similarly to the first feeding device 53 described above, the second feeding device 54 is also an air cylinder 547.
The second horizontal portion 521b is moved by moving the slide block 548 in a state where the second horizontal portion 521b is extended.
It is possible to move the shuttle 51 upward in the right direction in the figure. By pushing the last shuttle 51 by the contact block 538, the shuttles 51 are brought into contact with each other to be in a predetermined number (for example, test The same number of shuttles 51 as the number of inserts 122 along the Y direction in the tray 120 are moved together toward the third feeding device 55. A stopper 549 for stopping the shuttle 51 on the second horizontal portion 521b is also provided in the vicinity of the tip of the second feeding device 54.

As shown in FIGS. 5 and 10, the third feeding device 55 is disposed so as to overlap the horizontal portions 521 a and 521 b and the second reversing portion 521 d of the first guide rail 521.
A belt 551 provided along the guide rail 521, a pair of pulleys 552, 553 in which the belt 551 is stretched in a loop shape, and a motor 554 that rotates and drives one pulley 552.

On the outer peripheral surface of the belt 551, a large number of pins 555 that can be engaged with engagement grooves 514 (see FIG. 10) formed on the bottom surface of the shuttle 51 are provided. The pins 555 are arranged on the belt 551 at a _second pitch P ₂ similar to the pitch of the insert 122 of the test tray 120 described above.

When the shuttle 51 is supplied to the third feeding device 55 by the second feeding device 54, the pin 555 of the belt 551 is engaged with the engaging groove 514 of the shuttle 51, and the third feeding device 55 is The shuttle 51 is moved along the first guide rail 521 in the order of the second horizontal portion 521b, the second reversing portion 521d, and the first horizontal portion 521a.

Note that the left pulley 552 in FIG. 10 has a radius smaller than the radius of the right pulley 553 in FIG. 10, and the belt 551 has the second horizontal portion 52 of the first guide rail 521.
Although 1b and the 2nd inversion part 521d overlap, it is comprised so that it may leave | separate gradually from the 1st horizontal part 521a. For this reason, the first horizontal portion 52 is moved by the third feeding device 55.
When the shuttle 51 is carried to 1a, the engagement between the shuttle 51 and the pin 55 is released in the first horizontal portion 521a.

In the present embodiment, as shown in FIG. 5, the first to third feeding devices 53 to 55 are control devices 57.
Although the control device 57 controls the second feed device 54 so that the feed speed of the shuttle 51 and the receiving speed of the shuttle 51 of the third feed device 55 are different from each other,
And the third feeding devices 54 and 55 are controlled.

Specifically, as shown in FIG. 11, the control device 57 includes the pin 5 by the third feeding device 55.
The moving speed of 55 (receiving speed, indicated by a solid line in the figure) is faster than the moving speed of the contact block 548 by the second feeding device 54 (feed speed, indicated by a broken line in the figure). Thus, the second and third feeding devices 54 and 55 are controlled. Therefore, the third feeder 55 in receiving the shuttle 51 from the second feed device 54, the pitch in the Y direction between the shuttle 51 on the second horizontal portion 521b is converted from P ₁ to P ₂ .

Incidentally, in this embodiment, every time the DUT 100 is mounted by the device transport apparatus 50A on all the rows of inserts 122 along the Y direction in the test tray 120, the tray transport apparatus 58 is set to the test tray by one pitch of the insert 122. 120 is moved in the X direction. As a result, the pitch in the X direction between the DUTs 100 is changed from the pitch of the accommodating portion 111 of the customer tray 110 to the pitch of the insert 120 of the test tray 120.

As described above, a large number (for example, 512) of sockets 201 are mounted on the test head 2, but some of them may not be used due to a failure or the like. In such a case, when the DUT 100 is transferred from the customer tray 110 to the test tray 120, the insert 12 corresponding to the failed socket 201 in the test tray 120 is transferred.
No. 2 has conventionally been performed without mounting the DUT 100 (so-called DUToff function).

In the present embodiment, as indicated by a one-dot chain line and a two-dot chain line in FIG. 11, the receiving speed of the third feeding device 54 (indicated by the one-dot chain line in FIG. 11) is maintained at a predetermined value or more while maintaining the second value. The above-mentioned DUToff function is realized by intermittently setting the feed speed of the feed device 55 (shown by a two-dot chain line in the figure) to zero (that is, intermittently stopping the second feed device 54). doing.

Specifically, the third feeding device 55 keeps the motor 554 driven, and the DUT 1
When the pin 555 corresponding to the insert 122 on which 00 is not mounted approaches the receiving position RP (see FIG. 10) from the second feeding device 54, the motor 544 of the second feeding device 54 is temporarily stopped. (That is, the shuttle 51 is temporarily set to zero by the second feeder 54), so that the shuttle 51 is not supplied to the pin 555. When the pin 555 passes the receiving position RP, the second feeding device 54 resumes driving of the motor 544 and supplies the shuttle 51 to the next pin 555. If there is a large speed difference between the feeding speed of the third feeding device 55 and the receiving speed of the second feeding device 54, the feeding speed of the second feeding device 54 may not be completely zero. .

As shown in FIG. 5, a test tray 120 that receives the DUT 100 from the shuttle 51 is disposed below the third feeding device 55. When the third feeding device 55 moves a predetermined number of shuttles 51 (for example, the same number as the number of inserts 122 along the Y direction in the test tray 120) onto the inserts 122 of the test tray 120, the third feeding device 55 temporarily turns the motor 554 on. Stop.

A latch opener 56A is arranged below the test tray 120. As shown in FIG. 12A, the latch opener 56A is inserted into the insert 1 of the test tray 120.
22 and a support plate 562 that supports the projection 561, and the support plate 562 can be moved up and down by an air cylinder or the like. . The latch opener 56A transfers the DUT 100 from the shuttle 51 to the test tray 120.

Specifically, the latch opener 56A approaches the test tray 120 from below (
12 (b)), the protrusion 561 is inserted into the through hole 124 of the insert 122 (FIG. 12 (c)).
)). Next, the latch opener 56A further raises the protrusion 561, and the protrusion 561
By pressing the contact portion 513c of the latch 513 of the shuttle 51, the latch 513 is opened (FIG. 12D). As a result, the DUT 100 held by the second holding portion 513b of the latch 513 is moved from the device receiving hole 512 of the shuttle 51 to the concave portion 1 of the insert 122.
23, the latch opener 56A moves away from the test tray 120 (FIG. 12).
(E)).

The shuttle 51 in which the DUT 100 is empty is conveyed to the first horizontal portion 521a of the first guide rail 521 by the third feeder 55. On the other hand, the test tray 120 on which the DUT 100 is transferred by the device transport apparatus 50 </ b> A is transported to the heat application unit 60.

<Heat application unit 60>
As shown in FIGS. 2 and 4, the heat application unit 60 raises the test tray 120 supplied from the loader unit 30 by a vertical conveyance device (not shown), while moving the test tray 120 on the DUT 100 mounted on the test tray 120. Apply predetermined heat stress.

As described above, in this embodiment, since the test tray 120 is transported upward in the heat application unit 60, the height of the heat application unit 60 can be made equal to that of the test unit 70. Thereby, since the heat application part 60 becomes difficult to interfere with the test head 2 arrange | positioned on the handler 10, the freedom degree of the size of the test head 2 can be raised.

In general, in the heat application unit, sensors for detecting an abnormality of the test tray are installed immediately before the test unit. In contrast, in the present embodiment, the test tray 120 is transported upward in the heat application unit 60, so that the test tray 120 immediately before being supplied to the test unit 70 can be approached from above. , Test tray 120
This can easily eliminate jamming and the like, and is excellent in maintainability.

In this heat application unit 60, the DUT 100 is heated or cooled by bringing a temperature control block into contact with the individual DUTs 100 mounted on the test tray 120, so that the DUTs 100
Control the temperature of 100.

Inside the block, a flow path for supplying a heating medium and a refrigerant is formed, and the temperature of the block is controlled by adjusting the flow rates of the heating medium and the refrigerant. Specifically, for example, a temperature control device described in International Publication No. 2009/017495, International Publication No. 2010/137137, or the like can be used.

Instead of the temperature control device using the fluid as described above, a conventional chamber system may be adopted. In this case, the DUT 100 is heated by housing the entire heat application unit 60 in a thermostat and setting the atmosphere in the thermostat to a high temperature using a heater or the like. On the other hand, DUT1
When cooling 00, the atmosphere in the thermostatic chamber is cooled to low temperature using liquid nitrogen or the like.

When a predetermined thermal stress is applied to the DUT 100 by the heat application unit 60, the test tray 120 on which the DUT 100 is mounted is transported to the test unit 70. In the present embodiment, as shown in FIGS. 1 and 2, two test trays 120 are arranged and conveyed from the heat application unit 60 to the test unit 70.

<Test unit 70>
FIG. 13 is a cross-sectional view showing the configuration of the test part and the upper part of the test head of the handler in this embodiment.

As described above, in this embodiment, as shown in FIGS. 3 and 4, the socket 201 of the test head 2 faces the test portion 70 of the handler 10 from above through the opening 11. A Z driving device 71 is disposed in the test unit 70 so as to face the socket 201 of the test head 2.

As shown in FIG. 13, a large number of pushers 73 are attached to the top plate 72 of the Z drive device 71, and the pushers 73 are matrixed on the top plate 72 so as to correspond to the sockets 201 of the test head 2. Are arranged in a shape. When the Z driving device 71 raises the top plate 72, the pusher 73 presses the DUT 100 against the socket 201 and electrically contacts the terminal 101 of the DUT 100 with the contact pin 202 of the socket 201. The pusher 73 is also provided with a temperature control device using the above-described fluid, and can control the temperature of the DUT 100 under test.

In the present embodiment, as shown in the figure, an alignment plate 203 is provided in the socket 201 of the test head 2. The alignment plate 203 has a socket 20
A large number of through holes 204 are formed so as to correspond to one contact pin 202. When the DUT 100 approaches the socket 201 by the Z driving device 71, the terminal 1 of the DUT 100
01 is inserted into the through hole 204 of the alignment plate 203, and the terminal 101 is inserted into the through hole 20.
4, the DUT 100 is positioned with respect to the socket 201.

Incidentally, the insert 122 is held in the frame 121 of the test tray 120 in a floating state in the XY plane direction, and the guide pins 205 erected around the socket 201 are inserted into the guide holes 124 of the insert 122. And insert 12
2 is positioned relative to the socket 201.

In the conventional handler, the DUT is positioned with respect to the socket via the insert, so that a loader unit is provided with a precursor. When the DUT is transferred from the customer tray to the test tray, the DUT is temporarily mounted on the precursor. D against the insert
The UT is positioned accurately.

On the other hand, in the present embodiment, as described above, the DUT 100 is directly positioned with respect to the socket 201 by the alignment plate 203 attached to the socket 201. Therefore, the loader unit 30 does not need a precursor, and the handler 10 Space can be used effectively.

Further, when the DUT is positioned with respect to the socket via the insert as in the prior art, it is necessary to provide a positioning mechanism (for example, a guide core) on all the inserts of all the test trays circulating in the handler. In this embodiment, the socket 2 of the test head 2
Since it is only necessary to provide the alignment plate 203 only on 01, a significant cost reduction can be achieved.

In the present embodiment, the test unit 70 simultaneously tests a large number (for example, 512) of the DUTs 100 mounted on the two test trays 120, and when the test is completed, the DUT1
Two test trays 120 loaded with 00 are transferred to the heat removal unit 80.

<Heat removal unit 80>
As shown in FIGS. 2 and 4, the heat removal unit 80 raises the test tray 120 carried out from the test unit 70 by a vertical transfer device (not shown), and from the DUT 100 mounted on the test tray 120, The thermal stress applied by the heat application unit 60 is removed.

In the heat removal unit 80, the test tray 120 carried out from the test unit 70 is lowered by the vertical conveyance device, so that the height of the heat removal unit 80 is the same as that of the test unit 70 in the same manner as the heat application unit 60 described above. Although the height may be the same, the test tray 120 can be transported from the test section 70 to the heat removal section 80 by the belt transport device by moving the test tray 120 upward in the heat removal section 80. 10 costs can be reduced.

When high-temperature heat stress is applied to the DUT 100 in the heat application unit 60, the heat removal unit 80 returns to room temperature by blowing air to the DUT 100 using a fan or the like and cooling it. On the other hand, when a low-temperature thermal stress is applied to the DUT 100 in the heat application unit 60, the temperature at which dew condensation does not occur in the heat removal unit 80 by blowing warm air to the DUT 100 or heating the DUT 100 with a heater. Return to

When the heat stress is removed from the DUT 100 by the heat removal unit 80, the test tray 120 on which the DUT 100 is mounted is conveyed to the unloader unit 90 one by one.

<Unloader unit 90>
14 (a) to 14 (f) are diagrams showing the transfer operation from the test tray to the shuttle in this embodiment, and FIGS. 15 (a) to 15 (e) are from the shuttle to the customer tray in this embodiment. FIG.

As shown in FIG. 1, the unloader unit 90 includes two device transfer apparatuses 50B and 50B, and the DUT 100 is transferred from one or two test trays 120 to the customer tray 110.
It is possible to transfer to.

The device transport apparatus 50B of the unloader unit 90 is the same as the device transport apparatus 50A of the loader unit 30 described above, except for the configuration of the latch opener 56B.

As shown in FIG. 14A, the latch opener 56B of the unloader section 90 is connected to the DUT 10
A push-up unit 564 that pushes up 0 is provided, and a through hole 563 through which the push-up unit 564 can pass is formed in the support plate 562. The push-up unit 564 can be moved up and down independently of the support plate 562 by an air cylinder or the like.

In the unloader section 90, the DUT 100 is transferred from the test tray 120 to the shuttle 51 of the device transport apparatus 50B using the latch opener 56B. The latch opener 56B in the present embodiment corresponds to an example of the first transfer means in the present invention.

Specifically, the latch opener 56B approaches the test tray 120 from below (
14 (b)), the support plate 562 and the push-up unit 564 are raised, and the projection 561 is inserted into the through hole 124 of the insert 122 (FIG. 14 (c)), and the contact portion 513c of the shuttle 51 is moved by the projection 561. By pressing, the latch 513 is opened (FIG. 14D). Next, only the push-up unit 564 is raised to position the DUT 100 between the open latches 513 (FIG. 14 (e)). Next, only the support plate 562 is lowered to close the latch 513, and the DUT 100 is held by the second holding portion 513b of the latch 513, and then the push-up unit 564 is lowered and separated from the DUT 100 (FIG. 14 (f)). ).

When the DUT 100 is moved to the shuttle 51 from all the rows of inserts 122 along the Y direction in the test tray 120, the tray transport device 58 moves the test tray 120 in the X direction by one pitch of the insert 122. When the DUT 100 is carried out from all the inserts 122 on the test tray 120, the empty test tray 12
0 is returned to the loader unit 30 by the tray conveying device 58. The tray transfer device 5
As a specific example of 8, for example, a belt conveyor, a rotating roller, and the like can be exemplified.

When the DUT 100 is moved to the shuttle 51 by the latch opener 56 </ b> B, the device transport device 50 </ b> B moves the shuttle 51 to the vicinity of the customer tray 110 by the third feeding device 55 and the first feeding device 53. At this time, as shown in FIGS. 5 and 10, the shuttle 51 is moved to the first horizontal portion 521 a of the first guide rail 521 by the third feeding device 55.
When the shuttle 51 is disengaged from the pin 555 of the third feeding device 55, the pitch between the shuttles 51 becomes free.

Since the DUTs 100 having the same test result are irregularly arranged on the test tray 120, the conventional pick-and-place apparatus picks up the DUTs 100 having the same test result from the test tray 120 individually.

On the other hand, in the present embodiment, the device transport device 50B of the unloader unit 90 maintains the receiving speed of the third feeding device 55 at a predetermined level or higher in the same manner as the above-described DUToff function. The shuttle speed of the device 54 is intermittently stopped so that the shuttle 51 is supplied from the second feed device 54 to the third feed device 55 so that only the DUT 100 having the same test result on the test tray 120 is supplied. Deliver 51. Thereby, the third feeder 5
5, the DUT 100 is accommodated in all the shuttles 51 transported to the first horizontal portion 521a, so that the efficiency of the classification work in the unloader portion 90 can be improved.

When the first feeding device 53 loads the shuttle 51 up to the stopper 539 on the first horizontal portion 521a, the second and third movable portions of the device transporting device 40 described above are shown in FIG. 15A. The heads 45 and 47 transfer the DUT 100 from the shuttle 51 of the device transport apparatus 50B to the customer tray 110. The second and third movable heads 45 and 47 in the present embodiment correspond to an example of the second transfer means in the present invention, and the second and third movable heads of the device transfer apparatus 40 in the present embodiment. 45, 47 and device transfer device 50B
This corresponds to an example of the second electronic component transfer apparatus according to the present invention.

Specifically, the second movable head 45 will be described as an example. First, the second movable head 45 lowers only the latch opener 452 and the projection 453 latches the shuttle 51.
3 is pressed to open the latch 513 (FIG. 15B). At this time, the first holding portion 513 a of the latch 513 pushes up the DUT 100. Next, the second movable head 45 lowers only the suction head 451 and holds the DUT 100 by suction (FIG. 15 (c)).
Then, after raising the suction head 451, the latch opener 452 is raised (FIG. 15D
)). Next, after the second movable head 45 moves above the customer tray 110,
The suction head 451 is lowered, and the DUT 100 is placed in the accommodating portion 111 of the customer tray 110.
Is placed (FIG. 15E).

In the transfer of the DUT 100 in the unloader unit 90, different test results are assigned to the six tested tray stockers 22 of the storage unit 20, and the second and third movable heads 45 and 47 are connected to the DUT 100. Customer tray 110 associated with the test result of
By transferring the DUT 100, the DUT 100 is classified based on the test result.

When the DUT 100 is carried out from all the shuttles 51 loaded between the stopper 539 and the contact block 538 in the device transport device 50B, the first feeding device 53 is
Push the last shuttle 51 through the subsequent empty shuttles 51 and all shuttles 51
Move them together. The shuttle 51 pushed out to the first reversing unit 521c by the first feeding device 53 moves from the first reversing unit 521c to the second horizontal unit 521b by its own weight.

As described above, in the present embodiment, when the DUT 100 is transferred between the customer tray 110 and the test tray 120, the multiple shuttles 51 are connected to the endless first guide rails 521.
Since the DUT 100 can be sequentially transported by circulating on the trays 110, 1
The transfer capability of the DUT 100 between 20 can be improved.

In contrast, when a DUT is transferred between trays by a conventional pick and place device, when the head of the pick and place device returns to one tray to take the DUT, the other tray is in a standby state. Therefore, there is a limit to improving the transfer capability of the DUT.

In the present embodiment, the first guide rail 521 is folded back in the vertical direction.
c and 521d, the DUT 100 can be reversed simultaneously with the transfer operation of the DUT 100 between the trays 110 and 120. For this reason, the test head 2 is attached to the handler 1
The configuration of the electronic component testing apparatus 1 of the type disposed above 0 can be simplified. Incidentally, by disposing the test head 2 above the handler 10, the degree of freedom of the size of the test head 2 can be increased.

In the present embodiment, in the loader unit 30 and the unloader unit 90, the second feeder 5
From 4 when the third feed device 55 receives the shuttle 51, the pitch between the DUT100 is changed from _{P 1} to _{P 2,} employs a shuttle circulation method to transfer the DUT100 between trays 110 and 120 However, the pitch between the DUTs 100 can be changed simultaneously with the transfer.

The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Electronic component test apparatus 2 ... Test head 201 ... Socket 203 ... Alignment plate 3 ... Tester 10 ... Handler 20 ... Storage part 30 ... Loader part 40 ... Device transfer apparatus 43 ... 1st movable head 45 ... 2nd movable Head 47 ... Third movable head 50A ... Device transport device 51 ... Shuttle
511 ... Device holding unit
513 ... Latch
515 ... Base 52 ... Guide rail
521 ... First guide rail
521a ... first horizontal portion
521b ... second horizontal portion
521c ... 1st inversion part
521d. Second inversion part
522 ... Flow path
523 ... Air outlet
524 ... Compressor 53 ... First feeding device 54 ... Second feeding device 55 ... Third feeding device
555 ... Pin 56A ... Latch opener 57 ... Control device 60 ... Heat application unit 70 ... Test unit 80 ... Heat removal unit 90 ... Unloader unit 50B ... Device transport device 56B ... Latch opener 100 ... DUT
110 ... Customer tray 120 ... Test tray 122 ... Insert

In the first aspect of the present invention, there is provided at least one transport carrier provided on a guide rail of a device transport apparatus for transporting a device, the device holding section for holding the device, the device holding section being mounted, and the guide rail And a base portion guided along the carrier.

  According to a second aspect of the present invention, there is provided a device transport apparatus including a plurality of the transport carriers and a guide rail for guiding the plurality of transport carriers.

Claims (12)

An electronic component transfer device for transferring an electronic device under test between trays,
A plurality of holding means for holding the electronic device under test;
An endless track for guiding the holding means;
Moving means for moving the holding means on the track,
The electronic component transfer apparatus according to claim 1, wherein the holding means is movable on the track over the entire circumference of the track. The electronic component transfer apparatus according to claim 1,
The electronic component transfer apparatus according to claim 1, wherein the interval between the plurality of holding means is variable on the track. The electronic component transfer device according to claim 1 or 2,
The electronic component transfer apparatus, wherein the moving means is independent of the holding means. The electronic component transfer device according to any one of claims 1 to 3,
A first transfer means for transferring the electronic device under test from the first tray to the holding means;
An electronic component transfer apparatus comprising: a second transfer means for transferring the electronic device under test from the holding means to a second tray. The electronic component transfer device according to any one of claims 1 to 3,
2. The electronic component transfer apparatus according to claim 1, wherein the track includes a reversing portion that is folded back in a vertical direction. The electronic component transfer device according to claim 5,
With the terminal of the electronic device under test facing downward or upward, the electronic device under test is
First transfer means for transferring from the tray to the holding means;
With the terminal facing upward or downward, the electronic device under test is secondly moved from the holding means.
An electronic component transfer apparatus comprising: a second transfer means for transferring to the tray. The electronic component transfer device according to claim 6,
The trajectory is
A first horizontal portion in which the holding means moves in a horizontal direction with the terminal facing downward;
A second horizontal portion in which the holding means moves in a horizontal direction with the terminal facing upward, and
The inversion part is
A first reversing unit connecting between one end of the first horizontal part and one end of the second horizontal part;
A second reversing unit connecting between the other end of the second horizontal part and the other end of the first horizontal part;
Including
The moving means is
A first moving part for moving the holding means from the other end of the first horizontal part toward one end;
A second moving part for moving the holding means from one end of the second horizontal part toward the other end;
And a third moving part for moving the holding means from the other end of the second horizontal part toward the other end of the first horizontal part along the second reversing part. Electronic component transfer device. A device transfer apparatus according to any one of claims 5 to 7,
2. The electronic component transfer apparatus according to claim 1, wherein the holding means has a holding mechanism for holding the electronic device under test even when the holding means is inverted. An electronic component transfer device according to any one of claims 1 to 8,
The electronic device transfer apparatus according to claim 1, wherein the transfer device includes a levitation unit that floats the holding unit from the track by interposing a compressed fluid between the holding unit and the track. An electronic component transfer device according to any one of claims 1 to 9,
One of the trays is a customer tray or a test tray,
The other tray is a test tray or a customer tray. In order to test an electronic device under test, the electronic device handling apparatus is configured to transport the electronic device under test mounted on a test tray and press the electronic device under test against a contact portion of a test head,
The electronic device under test before the test is transferred from the customer tray to the test tray.
The first electronic component transfer device according to any of the above, or
The electronic device under test after the test is transferred from the test tray to the customer tray.
An electronic component handling apparatus comprising at least one of the second electronic component transfer apparatuses according to any one of the above. An electronic component testing apparatus for testing an electronic device under test,
A test head;
The electronic component handling apparatus according to claim 11, wherein the electronic device under test is pressed against a contact portion of the test head.
An electronic component testing apparatus comprising: a tester electrically connected to the test head.

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