JP2015060984A - Multi-piece body of lead frame, multi-piece body of lead frame with resin, multi-piece body of semiconductor device - Google Patents

Abstract

Provided are a multi-sided body of a lead frame, a multi-sided body of a lead frame with a resin, and a multi-sided body of a semiconductor device capable of preventing metal powder from being generated from the back and outer peripheral side surfaces of the frame. A multifaceted body MS of a leadframe 10 has a leadframe 10 on which the LED element is connected to the surface of the multifaceted body MS. The leadframe 10 is multifaceted to the frame F, and the frame F has at least one of the sides forming the outer shape thereof. A frame resin portion 14 that has a groove portion D1 that is recessed from the back surface thereof along one side, is formed in the groove portion D1 of the frame body F, and protrudes from the back surface of the frame body F is provided. [Selection] Figure 2

Description

  The present invention relates to a multifaceted body of a lead frame for a semiconductor device on which a semiconductor element is mounted, a multifaceted body of a lead frame with a resin, and a multifaceted body of a semiconductor device.

Conventionally, a semiconductor element such as an LED element is electrically insulated and fixed to a lead frame having two terminal portions covered with a resin layer, and the periphery thereof is covered with a transparent resin layer. It was mounted on a substrate (for example, Patent Document 1).
In such a semiconductor device, a resin layer is formed on a lead frame (multi-faced body of a lead frame) that is multi-faced to a frame body to produce a multi-faced body of a lead frame with resin, and semiconductor elements are electrically connected. Then, the transparent resin layer is formed, and a plurality of them are simultaneously manufactured by cutting into package units.
Here, the multifaceted body of the lead frame used is formed of a conductive metal material such as copper, and a plating layer is formed on the front and back surfaces thereof. The multi-sided body of the lead frame and the multi-sided body of the lead frame with resin are transported by a jig of a transport device or stored in a storage case in which a plurality of sheets are stacked at a predetermined interval in the semiconductor device manufacturing process. In some cases, the metal surface exposed on the back surface or outer peripheral side surface of the frame body and the jig or the rail of the storage case are in frictional contact, and metal powder may be generated. When such a multifaceted body of a lead frame is formed by etching, a convex portion protruding from the back surface or the outer peripheral side surface of the frame body may be formed. In such a case, in particular, since the convex portion is most easily in contact with the rail or the like, it is scraped off by frictional contact and more metal powder is generated.
If this metal powder adheres to the terminal part of the lead frame, the terminal part may be short-circuited, causing a semiconductor device having a defect such that the semiconductor element cannot be operated properly to be manufactured. It was.

JP 2011-151069 A

  An object of the present invention is to provide a multi-sided body of a lead frame, a multi-sided body of a lead frame with a resin, and a multi-sided body of a semiconductor device that can prevent metal powder from being generated from the back surface or outer peripheral side surface of the frame Is to provide.

  The present invention solves the above problems by the following means. In addition, in order to make an understanding easy, although the code | symbol corresponding to embodiment of this invention is attached | subjected and demonstrated, it is not limited to this. In addition, the configuration described with reference numerals may be improved as appropriate, or at least a part thereof may be replaced with another configuration.

In a first aspect of the present invention, there is provided a lead frame multi-faced body (MS) in which a lead frame (10) connected to a surface of a semiconductor element (2) is multi-faced to a frame body (F). It has a first groove (D1) that is recessed from the back surface along at least one side that forms the outer shape, is formed in the first groove of the frame, and protrudes from the back surface of the frame A lead frame multi-faced body comprising a frame body resin portion (14).
According to a second aspect of the present invention, in the multi-faced body (MS) of the lead frame of the first aspect, the frame body resin portion (14) is located on the outer peripheral side from the first groove portion (D1) of the frame body (F). It is a multi-faced body of a lead frame characterized by covering a part or all of the outer peripheral side surface of the frame.
According to a third aspect of the present invention, in the multifaceted body (MS) of the lead frame of the first aspect or the second aspect, the frame (F) is along the side where the first groove (D1) is formed. And having a second groove part (D2) recessed from the surface thereof, wherein the frame body resin part (14) is formed in the second groove part and protrudes from the surface of the frame body. This is a multi-faced body of a lead frame.
According to a fourth aspect of the present invention, in the multifaceted body (MS) of any one of the lead frames from the first aspect to the third aspect, the frame body resin portion (14) is formed of a curable resin. A multi-faceted body of a lead frame characterized by the above.
According to a fifth aspect of the present invention, in the lead frame multi-faced body (MS) in which the lead frame (10) to which the semiconductor element (2) is connected is multi-faced to the frame (F), the frame (F ) Has a groove (D3) that is recessed from the side surface along at least one of the sides that form the outer shape, and is formed in the groove portion of the frame body and protrudes from the side surface of the frame body A lead frame multi-faced body comprising a body resin portion (914).

A sixth aspect of the present invention is the multifaceted body (MS) of any one of the lead frames from the first aspect to the fifth aspect, and the frame resin portion (20a) formed on the outer peripheral side surface of the lead frame (10) And a resin-coated lead frame (R) having a resin layer (20).
According to a seventh aspect of the present invention, in the multifaceted body (R) of the lead frame with resin of the sixth aspect, the resin layer (20) is connected to the semiconductor element (2) of the lead frame (10). It has the reflector resin part (20b) which protrudes and is formed in the surface of this, It is a multi-faced body of the lead frame with a resin characterized by the above-mentioned.
According to an eighth aspect of the present invention, in the multifaceted body (R) of the lead frame with resin of the sixth aspect or the seventh aspect, the frame body resin portion (14) includes the lead frame (10) and the resin layer ( 20) A multi-sided body of a lead frame with resin, characterized in that it is formed in a color different from the color of 20).

  According to a ninth aspect of the present invention, there is provided the resin-coated lead frame multifaceted body (R) according to any of the sixth to eighth aspects, and the resin-made leadframe multifaceted body of the leadframe (10). And a transparent resin layer (30) formed on a surface of the multi-faced body of the lead frame with resin connected to the semiconductor element and covering the semiconductor element. This is a multifaceted body of a semiconductor device.

  The tenth invention is connected to the multifaceted body (MS) of any one of the leadframes from the first invention to the fifth invention, and each leadframe (10) of the multifaceted body of the leadframe. A resin layer (1020) formed on the outer peripheral side surface of the semiconductor element (1002) and the lead frame, and formed on the side of the multi-faced body of the lead frame to which the semiconductor element is connected, and covering the semiconductor element And a multifaceted body of a semiconductor device.

  According to the present invention, the multifaceted body of the lead frame, the multifaceted body of the lead frame with resin, and the multifaceted body of the semiconductor device can prevent metal powder from being generated from the back surface and the outer peripheral side surface of the frame body. it can.

1 is a diagram illustrating an overall configuration of an optical semiconductor device 1 according to a first embodiment. 1 is an overall view of a multifaceted body MS of a lead frame according to a first embodiment. It is a figure explaining the detail of the multi-faced body MS of the lead frame of 1st Embodiment. It is a figure explaining the detail of the multi-faced body R of the lead frame with resin of 1st Embodiment. It is the schematic which shows the storage case which stores the multi-faced body MS of the lead frame of 1st Embodiment. It is a figure explaining the manufacturing process of the lead frame 10 of 1st Embodiment. It is a figure explaining the manufacturing process of the optical semiconductor device 1 of 1st Embodiment. It is a figure which shows the multi-faced body of the optical semiconductor device 1 of 1st Embodiment. It is a figure explaining the outline of transfer molding. It is a figure explaining the outline of injection molding. It is a figure explaining the other form of the groove part and frame body resin part which were provided in the multi-faced body MS of the lead frame of 1st Embodiment. It is a figure explaining the other form of the groove part and frame body resin part which were provided in the multi-faced body MS of the lead frame of 1st Embodiment. It is a figure which shows the whole structure of the semiconductor device 1001 of 2nd Embodiment. It is a general view of the multi-faced body MS of the lead frame of the second embodiment. It is a figure explaining the groove part provided in the multi-faced body MS of the lead frame of a deformation | transformation form.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings and the like.
FIG. 1 is a diagram illustrating an overall configuration of an optical semiconductor device 1 according to the first embodiment. FIG. 1A, FIG. 1B, and FIG. 1C show a plan view, a side view, and a back view of the optical semiconductor device 1, respectively. FIG.1 (d) shows the dd sectional drawing of Fig.1 (a).
FIG. 2 is an overall view of the multi-faceted body MS of the lead frame of the first embodiment. 2 (a), 2 (b), and 2 (c) show a plan view, a right side view, and a back view of the multi-faced body MS of the lead frame, respectively.
FIG. 3 is a diagram for explaining the details of the multi-faced body MS of the lead frame according to the first embodiment. FIGS. 3A and 3B are a plan view and a back view, respectively, of the multifaceted body MS of the lead frame. FIG. 3C and FIG. 3D respectively show a cc cross-sectional view and a dd cross-sectional view of FIG. FIG.3 (e) shows the e section detail drawing of FIG.3 (d).

FIG. 4 is a diagram for explaining the details of the multifaceted body R of the lead frame with resin on which the light reflecting resin layer 20 of the first embodiment is formed. 4 (a) and 4 (b) are a plan view and a back view, respectively, of the multifaceted body R of the lead frame with resin, and FIG. 4 (c) and FIG. Cc cross-sectional view and dd cross-sectional view of FIG.
FIG. 5 is a schematic view showing a storage case 50 for storing the multi-faced body MS of the lead frame of the first embodiment. 5A is a view showing a state in which the lead frame MS is stored in the storage case 50, and FIG. 5B is a detailed view of a portion b in FIG. 5A.
In each figure, in the plan view of the optical semiconductor device 1, the lead frame multi-faced body MS, and the resin-attached lead frame multi-faced body R, the left-right direction is the X direction, the up-down direction is the Y direction, and the thickness direction is the Z direction.

The optical semiconductor device 1 is an illumination device in which the mounted LED element 2 emits light when attached to a substrate such as an external device. As shown in FIG. 1, the optical semiconductor device 1 includes an LED element 2 (semiconductor element), a lead frame 10, a light reflecting resin layer 20 (resin layer), and a transparent resin layer 30.
The optical semiconductor device 1 includes a multi-sided lead frame 10 (see FIG. 3A) of a multi-sided lead frame 10 formed with a light-reflecting resin layer 20 and a multi-sided surface R of a lead frame with resin (see FIG. 3A). 4), the LED element 2 is electrically connected, the transparent resin layer 30 is formed, and it is manufactured by cutting (dicing) into package units (details will be described later).
The LED element 2 is an LED (light emitting diode) element generally used as a light emitting layer. For example, a compound semiconductor single crystal such as GaP, GaAs, GaAlAs, GaAsP, and AlInGaP, or various GaN compound semiconductor single elements such as InGaN are used. By appropriately selecting a material made of crystals, an emission wavelength ranging from ultraviolet light to infrared light can be selected.

The multi-faced body MS of the lead frame refers to a structure in which the lead frame 10 is multi-faced in the frame F. In the present embodiment, as shown in FIG. 2, a plurality of sets (four sets in the present embodiment) of lead frames 10 connected by connecting portions in the vertical and horizontal directions are arranged in the left-right direction to form a frame. It is formed in the body F.
Further, the multi-faced body R of the lead frame with resin is formed by filling the multi-faced body MS of the lead frame with the resin that forms the light reflecting resin layer 20 (see FIG. 4).
The frame body F is a member for fixing the lead frame 10 for each assembly G of the lead frames 10, and the outer shape thereof is formed in a rectangular shape. As shown in FIG. 3, a convex portion T that protrudes from the back surface side of the outer peripheral side surface is formed on the outer peripheral edge of the frame body F on the back surface side.
This convex portion T is formed on the outer peripheral side surface of the frame F when the multifaceted body MS of the lead frame is formed from the metal substrate by the etching process described later. As shown to (e), the front-end | tip of the convex part T may be sharply sharp.

Here, the lead frame multi-faced body MS may be stored in a storage case in which a plurality of lead frame multi-sided bodies MS are stacked at a predetermined interval, or may be disposed in a predetermined jig, etc. In this case, the outer peripheral side surface and the back surface of the frame F may come into contact with the rails, jigs, and the like of the storage case. Here, since the metal part is exposed on the outer peripheral side surface and the back surface of the frame F, the multi-faced body MS of the lead frame can be attached to the frame F, the rail, There was a case where metal powder was generated from the frame F due to frictional contact with a jig or the like. In particular, the outer peripheral side surface of the frame F has a convex portion T, and the tip portion thereof is sharply pointed as described above, so that more metal powder is generated when contacting the rail or the like. There is a fear.
If the metal powder adheres to the lead frame, the terminal portions 11 and 12 may be short-circuited, and the optical semiconductor device 1 having a problem such that the LED element 2 cannot emit light is manufactured. It was.

Therefore, in the multi-faced body MS of the lead frame of the present embodiment, the frame body resin portion so as to cover the outer peripheral side surface including the convex portion T of the frame body F, the outer peripheral edge of the back surface of the frame body F, and the vicinity thereof. 14 is formed.
By forming the frame body resin portion 14 on the outer peripheral side surface of the frame body F and the back surface of the frame body F, it is possible to prevent the metal portion of the frame body F from coming into direct contact with the rail or the like. Preventing the occurrence of In the present embodiment, the storage direction of the lead frame multi-faced body MS in the storage case and the arrangement direction of the lead frame on the jig or the like are directions parallel to the long sides of the frame F. , Formed on the outer peripheral side surface and the back surface of the long side of the frame F. More specifically, the frame body resin portion 14 is formed on the entire outer peripheral side surface of the frame body F and the outer peripheral side surface of the back surface along the long side of the frame body F.

  As a result, even if the multi-faced body MS of the lead frame is housed in the housing case 50 as shown in FIG. 5, the frame body resin portion 14 formed on the outer peripheral side surface of the frame body F Friction contact between the outer peripheral side surface (convex portion T) and the side surface of the rail 51 can be prevented, and generation of metal powder can be prevented. The lead frame multi-faced body MS generates metal powder due to frictional contact between the surface of the rail 51 and the metal surface of the back surface of the frame body F by the frame body resin portion 14 formed on the back surface side of the frame body F. Can also prevent. Similarly, the multi-faced body MS of the lead frame can prevent the metal powder from being generated from the outer peripheral side surface or the back surface of the frame F even when it is disposed on a jig or the like.

Further, a multi-faced body R of a lead frame with a resin in which the light reflecting resin layer 20 is formed, and a multi-faced body of an optical semiconductor device in which the LED element 2 is connected and the transparent resin layer 30 is formed (see FIG. 8). Similarly, when being stored in the storage case 50 or disposed on a jig or the like, it is possible to avoid frictional contact with the outer peripheral side surface and the back surface of the frame F, and to prevent the generation of metal powder. .
From the above, the multi-faced body MS of the lead frame, the multi-faced body R of the lead frame with resin, and the multi-faced body of the optical semiconductor device are manufactured from the optical semiconductor device 1 having the above-described problems. It can be avoided.

  The frame body resin portion 14 is formed of a resin that is more easily worn than metal so that the rail side or the like is not scraped by frictional contact of the rail or the like of the storage case to generate metal powder. Moreover, in order to ensure sufficient adhesion with the frame body F, it is desirable that the frame body resin portion 14 uses a curable resin having a reactive functional group in the resin. Here, the curable resin refers to a resin that is cured by heating a liquid resin or irradiating light, for example, a thermosetting resin, a photocurable resin (UV curable resin), or the like. Say.

  Furthermore, it is desirable to use a heat-resistant resin for the frame body resin portion 14. For example, it is desirable that the deflection temperature under load (JIS K 7207-1983) is 180 degrees or more. This is because, in the manufacturing process of the optical semiconductor device 1, the LED element 2 is bonded to the multi-sided body MS of the lead frame by wire bonding, die bonding, or narrow joint by soldering, and the multi-sided body of the lead frame. The MS may be heated. In this case, if a heat-resistant resin is used for the frame body resin portion 14, the frame body resin portion 14 is softened by the heat applied to the frame body F, so that the multifaceted body MS of the lead frame becomes a rail or jig. It is possible to avoid slipping with respect to the like.

In this embodiment, the frame body resin portion 14 is formed of polyimide, which is a thermosetting resin having excellent heat resistance characteristics. In addition to polyimide, the frame body resin portion 14 may be made of epoxy, acrylic, polyamide, or the like as a thermosetting resin.
Further, when a photocurable resin is used for the frame body resin portion 14, for example, acrylic, rubber, protein such as gelatin or casein, PVA (polyvinyl alcohol), or the like can be used.

The frame resin portion 14 is colored in a color different from that of the lead frame 10 and the light reflecting resin layer 20. In this way, when the frame body F is frictionally contacted with the rail or the like and the frame body resin portion 14 is scraped, the scraped resin powder adheres to the lead frame 10 or the light reflecting resin layer 20. In addition, the resin powder can be easily found and removed.
Further, it is desirable that the frame body resin portion 14 is colored with a color having a large contrast difference from the colors of the lead frame 10 and the light reflecting resin layer 20. For example, when the color of the lead frame 10 is silver and the color of the light reflecting resin layer 20 is white, it is desirable that the color of the frame body resin portion 14 is black. Thereby, when the resin powder scraped from the frame resin portion 14 adheres to the lead frame 10 or the light reflecting resin layer 20, the resin powder is made to stand out from the lead frame 10 or the light reflecting resin layer 20. And the discovery of the resin powder can be further facilitated.
The frame body resin portion 14 is colored by mixing a predetermined color pigment into the curable resin.

The frame body resin portion 14 preferably has a resin hardness of 50 HSD or more in Shore hardness (D-type, JIS Z2246), and more preferably 70 HSD or more. In this way, by limiting the hardness of the resin to a specific hardness or more, it is possible to prevent the frame resin portion 14 from becoming difficult to slide against the rails, jigs, etc. of the storage case due to the softness of the resin. Can do.
The frame resin portion 14 has a surface exposed to the outside, that is, a surface in contact with a rail, a jig, or the like, not a mirror surface, and has a surface roughness (arithmetic average roughness Ra, JIS B0601-2001). It is desirable that it is 10 μm or more and 700 μm or less. By defining the surface roughness in this way, a gap corresponding to the surface roughness can be provided on the rail or the like of the storage case, so that the frictional force is reduced and the frame resin portion 14 is made slippery. Can do.

The frame body F has a groove portion D1 (first groove portion) that is recessed from the back surface along the side where the frame body resin portion 14 is formed, that is, the long side of the frame body F among the sides forming the outer shape. Is formed.
As shown in FIG. 3E, the groove D1 is a groove whose cross section is formed in a semicircular shape.
The frame body resin portion 14 is formed in the groove portion D1, protrudes from the back surface of the frame body F, is formed from the groove portion D1 to the outer peripheral edge side of the frame body F, and is formed to the outer peripheral side surface of the frame body F. ing.
Thus, by forming the groove part D1 in the frame body F, when the frame body resin part 14 is formed in the frame body F by applying a resin or the like, the applied resin exceeds the groove part D1, It is possible to prevent the frame F from adhering to the side of the lead frame that is multifaceted. Thereby, it can prevent that the part (lead frame 10) used as the product of the multi-faced body MS of a lead frame is soiled with resin which forms the frame body resin part 14. FIG. Moreover, by providing the groove part D1 of the frame body F, the contact area of the frame body resin part 14 and the frame body F can be increased, and it is suppressed that the frame body resin part 14 peels from the frame body F. be able to.

The lead frame 10 includes a pair of terminal portions, that is, a terminal portion 11 on which the LED element 2 is placed and connected, and a terminal portion 12 connected to the LED element 2 through a bonding wire 2a.
Each of the terminal portions 11 and 12 is formed of a conductive material, for example, copper, a copper alloy, 42 alloy (Ni 40.5% to 43% Fe alloy), etc. In this embodiment, heat conduction and It is formed from a copper alloy from the viewpoint of strength.
As shown in FIG. 3, the terminal portions 11 and 12 have a gap S formed between sides facing each other, and are electrically independent. Since the terminal portions 11 and 12 are formed by pressing or etching a single metal substrate (copper plate), the thicknesses of both are the same.

As shown in FIG. 1, the terminal portion 11 has an LED terminal surface 11a on which the LED element 2 is mounted and connected on the surface thereof, and an external terminal surface 11b mounted on an external device on the back surface. The so-called die pad is formed. Since the LED element 2 is placed on the terminal portion 11, the outer shape of the terminal portion 11 is larger than that of the terminal portion 12.
The terminal portion 12 has an LED terminal surface 12a connected to the bonding wire 2a of the LED element 2 formed on the surface thereof, and an external terminal surface 12b mounted on an external device formed on the back surface of the terminal portion 12 so-called lead side. Configure the terminal part.
The terminal portions 11 and 12 have plating layers C formed on the front and back surfaces thereof (see FIG. 6E), and the plating layer C on the front surface side serves as a reflective layer that reflects the light emitted from the LED element 2. The plating layer C on the back side has a function of improving the solderability when mounted on an external device.

As shown in FIG. 3, the terminal portions 11 and 12 are each provided with a concave portion M having a reduced thickness on the outer peripheral portion on the back surface side.
The recess M is a recess formed in the outer peripheral portion of each of the terminal portions 11 and 12 when viewed from the back side of the lead frame 10, and the thickness of the recess is 1/3 to 2 of the thickness of the terminal portions 11 and 12. / 3 or so.

  As shown in FIG. 4, when the lead frame 10 is filled with the resin that forms the light reflecting resin layer 20 around the terminal portions 11 and 12 or in the gap S between the terminal portions 11 and 12, as shown in FIG. The recess M is also filled with resin, and the contact area between the light reflecting resin layer 20 and the terminal portions 11 and 12 is increased. Further, the lead frames 10 and the light reflecting resin layers 20 can be alternately configured in the thickness (Z) direction. Thereby, the recessed part M can suppress that the light reflection resin layer 20 peels from the lead frame 10 in a plane direction (X direction, Y direction) and a thickness direction.

The connecting portion 13 connects the terminal portions 11 and 12 of each lead frame 10 multifaceted in the frame F to the terminal portions of other adjacent lead frames 10 and the frame F. The connecting portion 13 has an outer shape that forms the lead frame 10 when the LED element 2 or the like is mounted on each of the multiple lead frames 10 and a multi-faced body (see FIG. 11) of the optical semiconductor device 1 is formed. Dicing (cutting) is performed along a line (broken line in FIGS. 3A and 3B).
The connection part 13 is formed in the edge | side except the edge | side which the terminal parts 11 and 12 oppose among each edge | side which forms the terminal parts 11 and 12. FIG.

  Specifically, as shown in FIG. 3A, the connecting portion 13a is formed on the right (+ X) side of the terminal portion 12 and the left (−) of the terminal portion 11 of another lead frame 10 adjacent to the right side. X) is connected to the side, and the left side of the terminal portion 11 is connected to the right side of the terminal portion 12 of another lead frame 10 adjacent to the left side. For the terminal portions 11 and 12 adjacent to the frame body F, the connecting portion 13a connects the frame body F with the left side of the terminal portion 11 or the right side of the terminal portion 12.

The connecting portion 13 b connects the upper (+ Y) side of the terminal portion 11 and the lower (−Y) side of the terminal portion 11 of another lead frame 10 adjacent to the upper side, and the terminal portion 11. The lower side is connected to the upper side of the terminal portion 11 of another lead frame 10 adjacent to the lower side. For the terminal portion 11 adjacent to the frame F, the connecting portion 13b connects the frame F with the upper or lower side of the terminal portion 11.
The connecting portion 13c connects the upper side of the terminal portion 12 and the lower side of the terminal portion 12 of another lead frame 10 adjacent to the upper side, and the lower side and the lower side of the terminal portion 12 The upper side of the terminal portion 12 of another lead frame 10 adjacent to the side is connected. For the terminal portion 12 adjacent to the frame F, the connecting portion 13 c connects the frame F with the upper or lower side of the terminal portion 12.

The connecting portion 13 d (reinforcing portion) is formed so as to cross over the extension of the gap S between the terminal portion 11 and the terminal portion 12. Here, “on the extension of the gap S” means a region where the gap S is extended in the vertical (Y) direction. In the present embodiment, the connecting portion 13d is located on the opposite side of the terminal portion (12, 11) and the gap S between the terminal portions, and is adjacent to the upper or lower lead frame. In order to connect the parts (11, 12), it is formed in a shape that is inclined (for example, 45 degrees) with respect to the upper side of the terminal part 11 and the lower side of the terminal part 12.
Specifically, the connecting part 13d connects the upper side of the terminal part 12 and the lower side of the terminal part 11 of another lead frame 10 adjacent to the upper side, and the lower side of the terminal part 11 Are connected to the upper side of the terminal portion 12 of the other lead frame 10 adjacent to the lower side. For the terminal portions 11 and 12 adjacent to the frame F, the connecting portion 13d connects the frame F with the upper side of the terminal portion 12 or the lower side of the terminal portion 11. .

  By providing the connecting portion 13d, in the step of forming the light reflecting resin layer 20, the multifaceted body MS of the lead frame has a gap between the terminal portion 11 and the terminal portion 12 or the terminal portions 11 and 12 are connected to each other. It is possible to suppress twisting with respect to the frame F. Moreover, the connection part 13d can improve the intensity | strength of the space | gap part S of the optical semiconductor device 1, and can suppress damaging in the space | gap part S. FIG.

  The terminal portions 11 and 12 are electrically connected to the terminal portions 11 and 12 of the other adjacent lead frames 10 by the connecting portion 13. However, after the multifaceted body of the optical semiconductor device 1 is formed, Insulation is performed by cutting (dicing) each connecting portion 13 in accordance with the outer shape of the semiconductor device 1 (lead frame 10) (broken line in FIG. 3A). Moreover, when it divides into pieces, each piece can be made into the same shape.

As shown in FIGS. 3B and 3C, the connecting portion 13 is thinner than the terminal portions 11 and 12, and the surface thereof is formed in the same plane as the surfaces of the terminal portions 11 and 12. Has been. Specifically, the back surface of the connecting portion 13 is formed in substantially the same plane as the bottom surface (recessed portion) of the concave portion M of each terminal portion 11, 12. As a result, when the resin of the light reflecting resin layer 20 is filled, as shown in FIGS. 4B to 4D, the resin also flows into the back surface of the connecting portion 13, and the light reflecting resin layer 20 is The peeling from the lead frame 10 can be suppressed.
Further, as shown in FIG. 4B, rectangular external terminal surfaces 11 b and 12 b are exposed on the back surface of the lead frame 10 on which the light reflecting resin layer 20 is formed. In addition to being able to improve the appearance, when mounting on the board with solder, solder printing on the board side is easy, solder is evenly applied, and the generation of voids in the solder after reflow is suppressed. Can be. In addition, since it is axisymmetric with respect to the center line in the plane of the optical semiconductor device 1 (in the XY plane), the reliability against thermal stress and the like can be improved.

As shown in FIG. 4, the light reflecting resin layer 20 includes a frame resin portion 20a and a reflector resin portion 20b.
The frame resin portion 20a is not only the outer peripheral side surface of the lead frame 10 (the outer peripheral side surfaces of the terminal portions 11 and 12 and the space S between the terminal portions), but also the concave portions M provided in each terminal portion and the back surface of the connecting portion 13. Also formed.
The reflector resin portion 20b is formed so as to protrude to the surface side of the lead frame 10 (the side to which the LED element 2 of the lead frame 10 is connected), and the direction of light emitted from the LED element 2 connected to the lead frame 10 The reflector which controls etc. is comprised. The reflector resin portion 20b protrudes to the front surface side of the lead frame 10 so as to surround the LED terminal surfaces 11a and 12a of the terminal portions 11 and 12, and emits light emitted from the LED element 2 connected to the LED terminal surface 11a. The light is efficiently reflected from the optical semiconductor device 1 by reflection.
The reflector resin portion 20b is formed so that its outer shape is along the inner peripheral edge of the frame F, and its thickness (height) dimension is greater than the thickness dimension of the LED element 2 connected to the LED terminal surface 11a. Are also formed with large dimensions.

The light reflecting resin layer 20 is made of a thermoplastic resin having a light reflecting property or a thermosetting resin in order to reflect light emitted from the LED element 2 placed on the lead frame 10.
The resin forming the light reflecting resin layer 20 has high fluidity when the resin is formed with respect to the resin filling in the recessed portion, and the adhesiveness at the recessed portion is easy to introduce a reactive group into the molecule. Since it is necessary to obtain chemical adhesion with the lead frame, a thermosetting resin is desirable.
For example, as the thermoplastic resin, polyamide, polyphthalamide, polyphenylene sulfide, liquid crystal polymer, polyether sulfone, polybutylene terephthalate, polyolefin, or the like can be used.

As the thermosetting resin, silicone, epoxy, polyetherimide, polyurethane, polybutylene acrylate, or the like can be used.
Furthermore, the reflectance of light can be increased by adding any of titanium dioxide, zirconium dioxide, potassium titanate, aluminum nitride, and boron nitride as a light reflecting material to these resins.
Moreover, after molding a thermoplastic resin such as polyolefin, a so-called electron beam curable resin using a method of crosslinking by irradiation with an electron beam may be used.

The transparent resin layer 30 is a transparent or substantially transparent resin layer provided to protect the LED element 2 placed on the lead frame 10 and transmit the emitted light of the LED element 2 to the outside. It is. As illustrated in FIG. 1, the transparent resin layer 30 is formed on the LED terminal surfaces 11 a and 12 a surrounded by the reflector resin portion 20 b of the light reflecting resin layer 20.
For the transparent resin layer 30, it is desirable to select a material having a high light transmittance and a high refractive index at the emission wavelength of the LED element 2 in order to improve the light extraction efficiency. For example, an epoxy resin or a silicone resin can be selected as a resin that satisfies the properties of high heat resistance, light resistance, and mechanical strength. In particular, when a high-brightness LED element is used for the LED element 2, the transparent resin layer 30 is preferably made of a silicone resin having high light resistance because it is exposed to strong light. Moreover, a phosphor for wavelength conversion may be used, or it may be dispersed in a transparent resin.

Next, a method for manufacturing the lead frame 10 will be described.
FIG. 6 is a diagram for explaining the manufacturing process of the lead frame 10 of the first embodiment.
FIG. 6A shows a plan view showing a metal substrate 100 on which a resist pattern is formed, and an aa cross-sectional view of the plan view. FIG. 6B shows the metal substrate 100 that has been etched. FIG. 6C shows the metal substrate 100 after the etching process. FIG. 6D shows the metal substrate 100 from which the resist pattern has been removed. FIG. 6E shows the metal substrate 100 that has been subjected to plating.
In FIG. 6, the manufacturing process of one lead frame 10 is illustrated, but actually, a multi-faced body MS of the lead frame is manufactured from one metal substrate 100.

  In the manufacture of the lead frame 10, the metal substrate 100 is processed to form the lead frame 10. The processing may be press processing, but an etching process that easily forms a thin portion is desirable. Below, the manufacturing method of the lead frame 10 by an etching process is demonstrated.

First, a flat metal substrate 100 is prepared, and as shown in FIG. 6A, resist patterns 40a and 40b are formed on portions of the front surface and back surface that are not etched. The material and the formation method of the resist patterns 40a and 40b use a conventionally known technique as an etching resist.
Next, as shown in FIG. 6B, the metal substrate 100 is etched with a corrosive solution using the resist patterns 40a and 40b as etching resistant films. The corrosive liquid can be appropriately selected according to the material of the metal substrate 100 to be used. In this embodiment, since a copper plate is used as the metal substrate 100, an aqueous ferric chloride solution can be used and spray etching can be performed from both surfaces of the metal substrate 100.

Here, the lead frame 10 includes an outer peripheral portion of the terminal portions 11 and 12, a space penetrating like a gap portion S between the terminal portions 11 and 12, a concave portion M, a back surface of the connecting portion 13, and a frame body. There is a recessed space where the thickness is reduced without penetrating like the groove portion D1 of F (see FIG. 3). In the present embodiment, a so-called half-etching process that etches up to about half the plate thickness of the metal substrate 100 is performed, and a resist pattern is not formed on both surfaces of the metal substrate 100 in the penetrating space. Etching is performed from both sides of the substrate 100 to form a penetrating space. For the recessed space, a resist pattern is formed only on the surface opposite to the side where the thickness is reduced, and only the surface without the resist pattern is etched to form a recessed space.
As shown in FIG. 6C, terminal portions 11 and 12 having recesses M are formed on the metal substrate 100 by the etching process, and the lead frame 10 that is multifaceted to the frame F on the metal substrate 100. Is formed. At this time, a convex portion T protruding from the outer peripheral side surface of the frame body F and a groove portion D1 recessed from the back surface along the long side of the frame body F are formed (see FIG. 3E). .

Next, as shown in FIG. 6D, the resist pattern 40 is removed from the metal substrate 100 (lead frame 10).
Then, as shown in FIG. 6 (e), the metal substrate 100 on which the lead frame 10 is formed is plated to form a plating layer C on the terminal portions 11 and 12. The plating process is performed, for example, by performing electroplating using a silver plating solution containing silver cyanide as a main component.
In addition, before forming the plating layer C, for example, an electrolytic degreasing process, a pickling process, and a copper strike process may be selected as appropriate, and then the plating layer C may be formed through an electrolytic plating process.
As described above, the lead frame 10 is manufactured in a state of being multifaceted to the frame body F as shown in FIGS. In FIGS. 2 and 3, the plating layer C is omitted.

Next, a method for forming the frame body resin portion 14 will be described.
In the present embodiment, first, the multi-faced body MS of the lead frame is arranged on the transport device and moved in the longitudinal direction (X direction). And the thermosetting resin which forms the frame body resin part 14 is ejected from the nozzle to the outer peripheral side surface and the back surface including the convex part T of the frame F of the multi-faced body MS of the lead frame moving in the longitudinal direction. Apply (coating).
Then, the multi-faced body MS (frame body F) of the lead frame is heated at a predetermined temperature to cure the thermosetting resin applied to the frame body F. As described above, the frame resin portion 14 is formed on the outer peripheral side surface and the back surface of the frame F as shown in FIG.
Here, as described above, since the groove part D1 that is recessed from the back surface along the long side is provided in the frame body F, the resin applied to the back surface of the frame body F is from the groove part D1. Can also be prevented from flowing out to the lead frame side. Thereby, it can suppress that resin which forms the frame body resin part 14 adheres to the part used as the product of the multi-faced body MS of a lead frame, ie, the part of a lead frame.

In addition, the formation method of the frame body resin part 14 is not restricted to the method by the said coating. For example, a frame is obtained by applying a dry film resist composed of a photosensitive photo-curable resin on the frame body F or applying a solder resist and irradiating light through a predetermined photomask. The body resin portion 14 may be formed by a so-called photofabrication technique. In the case of this forming method, the accuracy of the thickness dimension of the frame body resin portion 14 and the accuracy of the arrangement position of the frame body resin portion 14 with respect to the frame body F can be improved as compared with the case of the above-described coating.
Moreover, the part which forms the frame body resin part 14 of the frame body F, ie, from the outer periphery of the frame body F to the groove part D1, is immersed in the curable resin stored in the container, and then cured by heating or light irradiation. The frame body resin portion 14 may be formed by curing the resin. In this case, the frame resin portion 14 can be formed more easily.
Further, the frame body resin portion 14 may be formed by transfer molding or injection molding described later. In this case, the shape of the frame body resin portion 14 can be formed with high accuracy. Further, by using the same resin as the light reflecting resin layer 20 as the resin forming the frame body resin portion 14, the frame body resin portion 14 and the light reflecting resin layer 20 are simultaneously formed by transfer molding or injection molding. The manufacturing process can be shared.

Next, a method for manufacturing the optical semiconductor device 1 will be described.
FIG. 7 is a diagram illustrating a manufacturing process of the optical semiconductor device 1 according to the first embodiment.
7A is a cross-sectional view of the lead frame 10 on which the light reflecting resin layer 20 is formed, and FIG. 7B is a cross-sectional view of the lead frame 10 to which the LED elements 2 are electrically connected. . FIG. 7C shows a cross-sectional view of the lead frame 10 on which the transparent resin layer 30 is formed. FIG. 7D shows a cross-sectional view of the optical semiconductor device 1 singulated by dicing.
In FIG. 7, the manufacturing process of one optical semiconductor device 1 is illustrated, but actually, a plurality of optical semiconductor devices 1 are manufactured from one metal substrate 100. 7A to 7D are based on the cross-sectional view of FIG.
FIG. 8 is a view showing a multi-faced body of the optical semiconductor device of the first embodiment.

  First, as shown in FIG. 7A, the above-mentioned light reflection characteristics are applied to the outer peripheral side surfaces (the outer peripheral side surfaces of the terminal portions 11 and 12 and the gap portion S between the terminal portions) of the lead frame 10 of the multifaceted body of the lead frame. The light reflecting resin layer 20 is formed by filling the resin having the same. The light reflecting resin layer 20 is formed by inserting a lead frame 10 (lead frame multi-faced body MS) into a resin molding die and injecting resin, such as transfer molding or injection molding (injection molding). The resin is formed on the lead frame 10 by a method such as screen printing of resin. At this time, the resin flows from the outer peripheral side surfaces of the terminal portions 11 and 12 to the concave portion M and the back surface of the connecting portion 13, and the frame resin portion 20 a is formed and joined to the lead frame 10.

At the same time, the reflector resin portion 20 b is formed so as to protrude to the front surface side of the lead frame 10 and surround the LED terminal surfaces 11 a and 12 a of the terminal portions 11 and 12.
As a result, the multi-sided body MS of the lead frame on which the light reflecting resin layer 20 is formed has the LED terminal surfaces 11a and 12a of the terminal portions 11 and 12 and the external terminal surfaces 11b and 12b on the front and back surfaces, respectively. Appears (see FIGS. 4A and 4B).
Thus, the multifaceted body R of the lead frame with resin shown in FIG. 4 is formed.

  Next, as shown in FIG. 7B, the LED element 2 is placed on the LED terminal surface 11 a of the terminal portion 11 via a heat-dissipating adhesive such as die attach paste or solder, and the terminal portion 12. The LED element 2 is electrically connected to the LED terminal surface 12a via the bonding wire 2a. Here, there may be a plurality of LED elements 2 and bonding wires 2a, a plurality of bonding wires 2a may be connected to one LED element 2, or the bonding wires 2a may be connected to a die pad. Moreover, you may electrically connect the LED element 2 by a mounting surface. Here, the bonding wire 2a is made of a material having good conductivity such as gold (Au), copper (Cu), silver (Ag), and the like.

And as shown in FIG.7 (c), the transparent resin layer 30 is formed so that the LED element 2 enclosed by the reflector resin part 20b may be covered.
The transparent resin layer 30 may have an optical function such as a lens shape and a refractive index gradient in addition to a flat shape. As described above, as shown in FIG. 8, a multifaceted optical semiconductor device 1 is formed.
Finally, as shown in FIG. 7D, the connecting portion 13 of the lead frame 10 together with the light reflecting resin layer 20 and the transparent resin layer 30 is formed in accordance with the outer shape of the optical semiconductor device 1 (broken line in FIG. 8). By cutting (dicing, punching, cutting, etc.), the optical semiconductor device 1 (see FIG. 1) separated (divided into one package) is obtained.

Next, transfer molding and injection molding for forming the light reflecting resin layer 20 on the lead frame 10 in FIG. 7A will be described.
FIG. 9 is a diagram for explaining the outline of transfer molding. FIG. 9A is a diagram for explaining the configuration of the mold, and FIGS. 9B to 9I are diagrams for explaining the steps until the multi-faced body R of the lead frame with resin is completed. It is.
FIG. 10 is a diagram for explaining the outline of injection molding. FIG. 10A to FIG. 10C are diagrams for explaining the process until the multifaceted body R of the lead frame with resin is completed.
9 and 10, for the sake of clarity, a diagram in which the light reflecting resin layer 20 is formed on a single lead frame 10 is shown. Actually, however, the lead frame multi-faced body MS is shown. On the other hand, the light reflecting resin layer 20 is formed.

(Transfer molding)
In the transfer molding, as shown in FIG. 9A, a mold 110 including an upper mold 111 and a lower mold 112 is used.
First, the operator heats the upper mold 111 and the lower mold 112, and then places the multi-faced body MS of the lead frame between the upper mold 111 and the lower mold 112 as shown in FIG. 9B. The pot portion 112a provided with the lower mold 112 is filled with a resin that forms the light reflecting resin layer 20.
Then, as shown in FIG. 9C, the upper mold 111 and the lower mold 112 are closed (clamping), and the resin is heated. When the resin is sufficiently heated, as shown in FIGS. 9 (d) and 9 (e), pressure is applied to the resin by the plunger 113 to fill (transfer) the resin into the mold 110, and the predetermined The pressure is kept constant for a period of time.

  After elapse of a predetermined time, as shown in FIGS. 9 (f) and 9 (g), the upper mold 111 and the lower mold 112 are opened, and light is emitted from the upper mold 111 by the ejector pins 111 a provided on the upper mold 111. The lead frame multi-faced body MS in which the reflective resin layer 20 is molded is removed. Thereafter, as shown in FIG. 9 (h), the excess resin portion such as the flow path (runner) portion of the upper mold 111 is removed from the product portion, and the light reflection is performed as shown in FIG. 9 (i). A multi-faced body R of a lead frame with a resin on which the resin layer 20 is formed is completed.

(Injection molding)
As shown in FIG. 10A, the injection molding uses a mold 120 including a nozzle plate 121, a sprue plate 122, a runner plate 123 (upper mold), a lower mold 124, and the like in order from the top.
First, the operator arranges the multi-faced body MS of the lead frame between the runner plate 123 and the lower mold 124, and closes the mold 120 (clamping).
Then, as shown in FIG. 10B, the nozzle 125 is disposed in the nozzle hole of the nozzle plate 121, and the resin that forms the light reflecting resin layer 20 is injected into the mold 120. The resin injected from the nozzle 125 passes through the sprue 122a of the sprue plate 122, passes through the runner 123a and the gate sprue 123b of the runner plate 123, and then in the mold 120 in which the multifaceted body MS of the lead frame is arranged. Filled with resin.

  After holding for a predetermined time after the resin is filled, the operator opens the runner plate 123 from the lower mold 124 and reflects light by the ejector pins 124a provided on the lower mold 124 as shown in FIG. The lead frame multi-faced body MS on which the resin layer 20 is formed is removed from the lower mold 124. Then, excess burrs and the like are removed from the multi-sided body MS of the lead frame on which the light reflecting resin layer 20 is formed, thereby completing the multi-sided body R of the lead frame with resin.

  In the injection molding die 120 of the present embodiment, the resin flow path is branched from a single sprue to a plurality of gates via a runner, so that the multi-faced body MS of the lead frame is Resin is injected evenly from multiple locations. As a result, the resin can be appropriately filled in each lead frame 10 of the multi-sided body MS of the lead frame, and a multi-sided body R of the lead frame with resin without resin unevenness can be obtained.

The invention of this embodiment has the following effects.
(1) Since the multifaceted body MS of the lead frame includes the frame body resin portion 14 that is formed in the groove portion D1 of the frame body F and protrudes from the back surface of the frame body F, the metal portion on the back surface of the frame body F and the storage Friction contact with the case rails, jigs and the like can be avoided, and generation of metal powder can be prevented. As a result, the multi-faced body MS of the lead frame is manufactured such that the optical powder is short-circuited between the terminal portions 11 and 12 and the optical semiconductor device 1 having a defect such that the LED element 2 cannot emit light is produced. It can be avoided.
Further, since the groove portion D1 is formed in the frame body F, when the frame body resin portion 14 is formed in the multifaceted body MS of the lead frame, the resin flows out to the lead frame side from the groove portion D1. Can be suppressed. Thereby, it can suppress that resin which forms the frame body resin part 14 adheres to the part (lead frame 10) used as the product of the multi-faced body MS of a lead frame, and is damaged.
(2) The multifaceted body MS of the lead frame has the frame body resin portion 14 formed from the groove portion D1 of the frame body F to the outer peripheral edge side, and the back surface of the frame body F and the outer peripheral side surface including the convex portion T. Since it covers, the frictional contact with the metal part of the outer peripheral side surface of the frame F, the rail of a storage case, a jig | tool, etc. can be avoided, and generation | occurrence | production of metal powder can be prevented.

(3) Since the frame body resin portion 14 is formed of a thermosetting resin as a curable resin, the adhesion between the frame body F and the frame body resin portion 14 is improved, and the frame body resin portion 14 Formation can be facilitated.
(4) Since the frame body resin portion 14 is formed in a color different from the colors of the lead frame 10 and the light reflecting resin layer 20, the frame body resin portion 14 comes into contact with the rail of the storage case and is scraped off. Even if the resin powder is generated, the resin powder can be easily found from the multi-faced body MS of the lead frame. Further, since the color of the frame body resin portion 14 has a large difference in contrast with the colors of the lead frame 10 and the light reflecting resin layer 20, the resin powder can be found more easily.

Next, the other form of the convex part T provided in the frame F of this embodiment and the frame resin part 14 is demonstrated.
11 and 12 are diagrams for explaining other forms of the groove and the frame resin portion provided in the multi-faced body MS of the lead frame of the first embodiment. 11 (a) to 11 (e) and FIGS. 12 (a) to 12 (c) are cross-sectional views of the groove portion and the frame body resin portion provided in the frame body F, respectively, and correspond to FIG. 3 (e). FIG. In each of FIGS. 11 and 12, the frame body resin portion is formed on the long side of the frame F in the same manner as described above.
Note that in the following description and drawings, the same reference numerals or parts (lower two digits) are assigned the same reference numerals to the portions that perform the same functions as those described above, and overlapping descriptions are omitted as appropriate.
Further, the outer peripheral side surface of the frame F is not limited to the case where the convex portion T shown in the above-described embodiment (see FIG. 3E) is formed. As shown in FIG. 11 and FIG. 12, it is formed flat or formed in a different convex shape. In that case, the form of the frame body resin portion can be changed as appropriate in accordance with the form.

(Other form 1)
As shown in FIG. 11 (a), the frame F is formed with a convex portion T so as to protrude from the outer peripheral side surface.
Further, the frame body F is formed with a groove portion D1 that is recessed from the back surface along the long side that forms the outer shape thereof, as in the first embodiment.
The cross section of the groove D1 is formed in a semicircular shape.
The frame body resin portion 214 is formed in the groove portion D1, protrudes from the back surface of the frame body F, is formed from the groove portion D1 to the outer peripheral edge side of the frame body F, and is formed to the outer peripheral side surface of the frame body F. ing. Thus, the frame body resin portion 214 covers the back surface from the groove portion D1 to the outer peripheral edge of the frame body F and the outer peripheral side surface of the frame body F. Further, the frame body resin portion 214 on the outer peripheral edge on the surface side of the frame body F is formed so as to be positioned outside the tip of the convex portion T of the frame body F.
With the above configuration, the multi-faced body MS of the lead frame of the present embodiment can achieve the same effects as those of the first embodiment described above. Further, the protruding amount of the frame body resin portion 214 that covers the outer peripheral side surface of the frame body F can be minimized.

(Other form 2)
As shown in FIG. 11 (b), the frame F is not formed with convex portions on the outer peripheral side as in the above-described form, and the outer peripheral side is formed flat. Further, the frame body F is formed such that the outer peripheral side surface thereof is substantially orthogonal to the front surface and the back surface of the frame body F.
Further, the frame body F is formed with a groove portion D1 that is recessed from the back surface along the long side that forms the outer shape thereof, as in the first embodiment.
The cross section of the groove D1 is formed in a semicircular shape.
The frame body resin portion 314 is formed in the groove portion D1, protrudes from the back surface of the frame body F, is formed from the groove portion D1 to the outer peripheral edge side of the frame body F, and is formed to the outer peripheral side surface of the frame body F. ing. Thereby, the frame body resin part 314 covers the back surface from the groove part D1 of the frame body F to the outer periphery and the outer peripheral side surface of the frame body F.
With the above configuration, the multi-faced body MS of the lead frame can achieve the same effects as those of the first embodiment described above.

(Other form 3)
As shown in FIG. 11 (c), the frame body F has a convex portion T formed so as to protrude from the outer peripheral side surface at the outer peripheral edge on the surface side.
Further, the frame body F has a groove D1 formed along the long side forming the outer shape thereof. Here, the groove portion D1 is a groove formed so as to be recessed from the back surface and outer peripheral side surface of the frame F, that is, a groove formed so as to scrape corners of the back surface and outer peripheral side surface of the frame F.
The frame body resin portion 414 is formed in the groove portion D1, protrudes from the back surface of the frame body F, is formed from the groove portion D1 to the outer peripheral edge side of the frame body F, and is formed to the outer peripheral side surface of the frame body F. ing. Thereby, the frame body resin part 414 covers the back surface from the groove part D1 to the outer periphery of the frame body F and the outer peripheral side surface of the frame body F. Further, the frame body resin portion 414 on the outer peripheral edge on the surface side of the frame body F is formed so as to be positioned outside the tip of the convex portion T of the frame body F.
With the above configuration, the multi-faced body MS of the lead frame of the present embodiment can achieve the same effects as those of the first embodiment described above. Further, the protruding amount of the frame body resin portion 414 that covers the bottom surface of the frame body F can be reduced.

(Other form 4)
As shown in FIG. 11 (d), the frame F is not formed with a convex portion on the outer peripheral side surface and is formed flat on the outer peripheral side surface, as in the above-described second embodiment. Further, the frame body F is formed such that the outer peripheral side surface thereof is substantially orthogonal to the front surface and the back surface of the frame body F.
Further, the frame body F is formed with a groove portion D1 that is recessed from the back surface and a groove portion D2 that is recessed from the front surface along the long side forming the outer shape.
The grooves D1 and D2 each have a semicircular cross section. Moreover, the groove part D1 and the groove part D2 are formed in the same straight line shape in the thickness direction (Z direction) of the frame F.
The frame body resin portion 514 is formed in the groove portion D1, protrudes from the back surface of the frame body F, is formed from the groove portion D1 to the outer peripheral edge side on the back surface side of the frame body F, and is formed in the groove portion D2. In addition to projecting from the surface of the frame F, it is formed from the groove D2 to the outer peripheral edge of the surface of the frame F, and is formed to the outer peripheral side surface of the frame F. Thereby, the frame body resin part 514 will cover the back surface from the groove part D1 to the outer periphery of the frame body F, the outer peripheral side surface of the frame body F, and the surface from the groove part D2 to the outer periphery.

With the above configuration, the multi-faced body MS of the lead frame can achieve the same effects as those of the other form 2 described above.
In addition, since the frame body resin portion 514 is formed on the surface of the frame body F, even when the surface side of the frame body F and the storage case etc. are in contact with each other, it is possible to prevent metal powder from being generated. Can do. Furthermore, since the frame body resin portions 514 are formed on the front surface and the back surface of the frame body F, a plurality of sheets can be obtained without damaging the parts (the front and back surfaces of the lead frame) that are products of the multi-faced body MS of the lead frame. The lead frame multi-sided body MS can be directly laminated.

Moreover, the groove part D1 and the groove part D2 are formed in the position on the same straight line in the thickness direction (Z direction), ie, the position which overlaps with the front and back of the frame F as above-mentioned. Therefore, in the creation of the frame body resin portion 514, when a method of immersing in a curable resin stored in a container and curing the curable resin after being pulled up is applied, the surface of the frame F is immersed in the curable resin. On the back surface, the liquid level of the curable resin coincides with the positions of the grooves D1 and D2. Thereby, the multi-faced body MS of the lead frame can form the frame body resin portions 514 on the front surface and the back surface of the frame body F at the same time, thereby improving the manufacturing efficiency.
Moreover, since the groove part D2 is formed on the surface of the frame F in the multi-faced body MS of the lead frame, when the frame body resin part 514 is formed on the surface of the frame F, the resin exceeds the groove part D2. It can suppress flowing out to the lead frame side. Thereby, at the time of formation of the frame body resin part 514, it can suppress that the part (the surface of a lead frame) used as the product of the multi-faced body MS of a lead frame is soiled by adhesion of resin.
Furthermore, since the multifaceted body MS of the lead frame is filled with the resin of the frame body resin portion 514 to the inside of each groove portion of the groove portion D2 on the front surface side and the groove portion D1 on the back surface side, the frame body resin It is possible to prevent the portion 514 from being peeled off from the frame body F.

(Other form 5)
As shown in FIG. 11 (e), the frame F is not formed with a convex portion on the outer peripheral side surface and is formed flat on the outer peripheral side surface, as in the above-described second embodiment. Further, the frame body F is formed such that the outer peripheral side surface thereof is substantially orthogonal to the front surface and the back surface of the frame body F.
Further, the frame body F is formed with a groove portion D1 that is recessed from the back surface and a groove portion D2 that is recessed from the front surface along the long side forming the outer shape.
The grooves D1 and D2 each have a semicircular cross section. Moreover, the groove part D2 is formed in the outer peripheral edge side of the frame F compared with the groove part D1.
The frame body resin portion 614 is formed in the groove portion D1 and protrudes from the back surface of the frame body F, and is formed from the groove portion D1 to the outer peripheral edge side on the back surface side of the frame body F. It is formed. Further, the frame body resin part 614 is formed from the outer peripheral side surface of the frame body F to the groove D2 on the surface side of the frame body F. Thereby, the frame body resin part 614 covers the back surface from the groove part D1 to the outer peripheral edge of the frame body F, the outer peripheral side surface of the frame body F, and the surface from the outer peripheral edge of the frame body F to the groove part D2. .

With the above configuration, the multi-faced body MS of the lead frame can achieve the same effects as those of the other form 2 described above.
In addition, since the frame body resin portion 614 is also formed on the surface of the frame body F, it is possible to prevent the metal powder from being generated even when the surface side of the frame body F comes into contact with the storage case or the like. Can do. Furthermore, since the frame body resin portions 614 are formed on the front surface and the back surface of the frame body F, a plurality of sheets can be obtained without damaging the parts (the front and back surfaces of the lead frame) that are products of the multi-faced body MS of the lead frame. The lead frame multi-sided body MS can be directly laminated.
Further, the lead frame multi-faced body MS is filled with the resin of the frame body resin part 614 to the inside of each groove part of the groove part D2 on the front surface side and the groove part D1 on the back surface side of the frame body F. It is possible to prevent the portion 614 from being peeled off from the frame body F.
In addition, the lead frame multi-faceted body MS can reliably cover the corners from the front surface to the side surface with the resin in addition to the back surface and the side surface with the most contact, and reduce the surface covered with the frame body resin portion 614. Therefore, the degree of freedom of arrangement of the alignment marks and the like on the multi-faced body MS (frame body F) of the lead frame can be increased.

(Other form 6)
As shown in FIG. 12 (a), the frame F is not formed with a convex portion on the outer peripheral side surface as in the other embodiment 2 described above, and the outer peripheral side surface thereof is formed flat. Further, the frame body F is formed such that the outer peripheral side surface thereof is substantially orthogonal to the front surface and the back surface of the frame body F.
Further, the frame body F is formed with two parallel groove portions D1a and D1b that are recessed from the back surface along the long side that forms the outer shape thereof. The groove part D1a is formed closer to the outer peripheral edge side of the frame body F than the groove part D1b.
Each of the groove D1a and the groove D1b has a semicircular cross section.
The frame body resin portion 714 is formed in the groove portion D1a and the groove portion D1b, protrudes from the back surface of the frame body F, and is also formed between the groove portion D1a and the groove portion D1b. Thereby, the frame body resin part 714 will cover between the groove part D1a and the groove part D1b on the back surface of the frame body F.
Further, the frame resin portion 714 formed between the groove portion D1a and the groove portion D1b is formed so that the surface of the exposed resin is substantially parallel to the back surface of the frame body F.

With the above configuration, the multifaceted body MS of the lead frame avoids frictional contact between the metal portion on the back surface of the frame F and the rails, jigs, etc. of the storage case, as in the first embodiment. And generation of metal powder can be prevented.
In addition, since the multifaceted body MS of the lead frame has the groove D1b formed in the frame F, when the frame resin portion 714 is formed, the resin flows out to the lead frame side from the groove D1b. Can be suppressed. Thereby, it can suppress that the part (lead frame 10) used as the product of the multi-faced body MS of a lead frame is soiled with resin which forms the frame body resin part 14. FIG.
Further, since the multifaceted body MS of the lead frame has the groove D1a formed in the frame F, when the frame resin portion 714 is formed, the resin flows out to the outer peripheral edge side of the frame F from the groove D1a. It can also be suppressed.
In addition, since the frame body resin portion 714 is formed between the groove portion D1a and the groove portion D1b and the surface of the exposed resin is formed substantially parallel to the back surface of the frame body F, the multifaceted body MS of the lead frame is accommodated. It can be more stably arranged with respect to a case, a jig or the like.

(Other form 7)
As shown in FIG. 12 (b), the frame F is not formed with a convex portion on the outer peripheral side as in the above-described second embodiment, and the outer peripheral side is formed flat. Further, the frame body F is formed such that the outer peripheral side surface thereof is substantially orthogonal to the front surface and the back surface of the frame body F.
Further, the frame body F is formed with a groove portion D1 that is recessed from the back surface thereof along the long side that forms the outer shape thereof.
The cross section of the groove part D1 is formed in a semi-oval shape.
The frame body resin portion 814 is formed in the groove portion D1 so as to protrude from the back surface of the frame body F.
Further, the frame resin portion 814 is formed so that the surface of the exposed resin is substantially parallel to the back surface of the frame F.

With the above configuration, the multifaceted body MS of the lead frame avoids frictional contact between the metal portion on the back surface of the frame F and the rails, jigs, etc. of the storage case, as in the first embodiment. And generation of metal powder can be prevented.
Further, when the frame body resin portion 814 is formed, it is possible to suppress the resin from flowing out to the lead frame side from the groove portion D1, and a portion (lead frame 10) that becomes a product of the multi-sided body MS of the lead frame. ) Can be prevented from adhering to and fouling the resin forming the frame body resin portion 14.
Further, since the resin surface exposed by the frame body resin portion 814 is formed substantially parallel to the rear surface of the frame body F, the lead frame multi-faced body MS is more stable with respect to the storage case, jig, and the like. Can be arranged.

(Other form 8)
As shown in FIG. 12 (c), the frame F is not formed with a convex portion on the outer peripheral side surface as in the above-described second embodiment, and has a groove D3 formed on the outer peripheral side surface thereof.
The groove D3 is formed along the long side of the frame F. Further, the groove D3 has a semi-oval shape in cross section.
The frame body resin portion 914 is formed in the groove portion D3 so as to protrude from the outer peripheral side surface of the frame body F.
With the above configuration, the multi-faced body MS of the lead frame can avoid the frictional contact between the metal portion on the outer peripheral side surface of the frame F and the rails, jigs, etc. of the storage case, thereby preventing the generation of metal powder. be able to.

(Second Embodiment)
Next, a second embodiment of the present invention will be described.
FIG. 13 is a diagram illustrating an overall configuration of a semiconductor device 1001 according to the second embodiment. FIGS. 13A, 13B, and 13C are a plan view, a side view, and a back view of the semiconductor device 1001, respectively. FIG.13 (d) shows the dd sectional drawing of Fig.13 (a).
FIG. 14 is an overall view of a multi-sided body MS of a lead frame according to the second embodiment. FIG. 14A, FIG. 14B, and FIG. 14C are a plan view, a side view, and a back view of the multi-faced body MS of the lead frame, respectively. FIG.14 (d) is a figure which shows the d section detail of FIG.14 (b).
Note that, in the following description and drawings, the same reference numerals or the same reference numerals are given to the portions that perform the same functions as those in the first embodiment described above, and overlapping descriptions will be omitted as appropriate.

The lead frame multi-faced body MS of the second embodiment is different from that of the first embodiment in that it is used in the semiconductor device 1001 and the shape of the frame body resin portion 1014 formed in the frame body F is different. The main difference.
As shown in FIG. 13, the semiconductor device 1001 includes a lead frame 10, a diode 1002, and a resin layer 1020. The semiconductor device 1001 is manufactured by electrically connecting a diode 1002 to the multi-sided lead frame 10, forming a resin layer 1020, and cutting (dicing) into package units.
The diode 1002 is a semiconductor element having a function of rectification (flowing current only in a certain direction), and is configured by joining an n-type semiconductor and a p-type semiconductor.

  Unlike the optical semiconductor device 1 according to the first embodiment described above, the semiconductor device 1001 does not have a function of emitting light, and thus it is not necessary to make the resin layer 1020 covering the diode 1002 transparent. Further, it is not necessary to separate the resin layer 1020 like the light reflecting resin layer 20 and the transparent resin layer 30 as in the first embodiment. Therefore, the resin layer 1020 of the semiconductor device 1001 covers the periphery of the diode 1002 as well as the outer peripheral portion and the gap of each terminal portion after the diode 1002 is connected to the surface of the multi-faced body MS of the lead frame. And formed by filling.

As shown in FIG. 14, the frame body resin portion 1014 is formed on the outer peripheral side surface and the back surface of the long side of the frame body F. Here, unlike the frame resin portion 14 of the first embodiment, the frame resin portion 1014 is formed only on the long side of the frame F and at a position corresponding to the aggregate G. That is, the frame body resin portion 1014 is formed so as to be divided into four per side at a predetermined interval along each long side of the frame F.
The frame F is formed with a groove D1 that is recessed from the back surface along the side where the frame resin portion 1014 is formed, that is, the long side of the frame F among the sides forming the outer shape. . Here, the groove portion D1 is formed only at a position corresponding to the long-side assembly G of the frame F.
As shown in FIG. 14D, the groove portion D1 is a groove having a semicircular cross section.
The frame body resin portion 1014 is formed in the groove portion D1, protrudes from the back surface of the frame body F, is formed from the groove portion D1 to the outer peripheral edge side of the frame body F, and is formed to the outer peripheral side surface of the frame body F. ing.
The resin layer 1020 is a resin layer that insulates the terminal portions 11 and 12 of the lead frame 10 and insulates the diode 1002 from the outside, and is formed of, for example, an epoxy resin.

With the above configuration, the multifaceted body MS of the lead frame of the present embodiment includes the frame body resin portion 1014 that is formed in the groove portion D1 of the frame body F and protrudes from the back surface of the frame body F. The frictional contact between the metal portion of the housing and the rail or jig of the storage case can be avoided, and the generation of metal powder can be prevented. As a result, in the multi-faced body MS of the lead frame, the metal powder short-circuits between the terminal portions 11 and 12, and the semiconductor device 1001 having a defect such that the diode 1002 cannot be operated properly is manufactured. It can be avoided.
Further, since the groove portion D1 is formed in the frame body F, when the frame body resin portion 1014 is formed in the multifaceted body MS of the lead frame, the resin flows out to the lead frame side from the groove portion D1. Can be suppressed. Thereby, it can suppress that resin which forms the frame body resin part 1014 adheres to the part (lead frame 10) used as the product of the multi-faced body MS of a lead frame, and is damaged.
Further, in the multifaceted body MS of the lead frame, the frame body resin portion 1014 is formed from the groove portion D1 of the frame body F to the outer peripheral edge side, and covers the back surface of the frame body F and the outer peripheral side surface including the convex portion T. Therefore, frictional contact between the metal portion on the outer peripheral side surface of the frame F and the rails, jigs, etc. of the storage case can be avoided, and generation of metal powder can be prevented.

Further, since the multi-faced body MS of the lead frame is formed by dividing the frame resin portion 1014 along the long side of the frame F, the frame resin portion 1014 is compared to the case of the first embodiment. It is possible to reduce the contact area that contacts the rail. Thereby, generation | occurrence | production of the resin powder resulting from frictional contact, such as a frame body resin part 1014 and a rail, can also be reduced. In addition, the amount of resin forming the frame body resin portion 1014 can be reduced, and the manufacturing cost of the multifaceted body MS of the lead frame can be reduced.
In the present embodiment, the multifaceted body MS of the lead frame can replace the forms of the frame body F and the frame body resin portion with other forms 1 to 8 (see FIG. 11) described in the first embodiment. Is possible. The effect obtained by replacing the form of the frame body resin part 1014 can be exhibited in this embodiment as well as the effects described in the other forms 1 to 8 of the first embodiment.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications and changes can be made as in the modifications described later, and these are also included in the present invention. Within the technical scope. In addition, the effects described in the embodiments are merely a list of the most preferable effects resulting from the present invention, and the effects of the present invention are not limited to those described in the embodiments. It should be noted that the above-described embodiment and modifications described later can be used in appropriate combination, but detailed description thereof is omitted.

(Deformation)
FIG. 15 is a diagram illustrating a groove provided in the multi-faced body MS of the modified lead frame. FIGS. 15A and 15B are cross-sectional views of the groove portion and the frame resin portion provided in the frame body F, respectively, corresponding to FIG.
(1) In each embodiment, although the groove part D1 showed the example in which the cross section is formed in substantially semicircle shape or semi-oval shape, it is not limited to this. For example, as shown in FIG. 15 (a), the groove D1 may be formed to have a triangular cross section, and as shown in FIG. 15 (b), the cross section is formed to be rectangular. You may do it.

(2) In 2nd Embodiment, although the groove part D1 showed only the example formed only in the position corresponding to the aggregate | assembly G of the long side of the frame F, it is not limited to this, For example, You may make it form in the whole on the edge | side of the long side of the frame F like 1st Embodiment.
(3) In the first embodiment, the example in which the multi-faced body MS of the lead frame is applied to the optical semiconductor device 1 on which the LED element 2 is mounted as a semiconductor device has been described, but the present invention is not limited to this. For example, as in the second embodiment, the present invention can be applied to a semiconductor device on which a diode or a transistor is mounted. In this case, since this semiconductor device does not need to make the resin layer covering the semiconductor element transparent, it is not necessary to provide the light reflecting resin layer 20 and the transparent resin layer 30, and both resin layers are formed as one resin layer. can do.

(4) In the second embodiment, an example in which the multifaceted body MS of the lead frame is applied to the semiconductor device 1001 on which the diode 1002 is mounted is shown, but the present invention is not limited to this. For example, it is also possible to apply to an optical semiconductor device in which an optical semiconductor element such as an LED element is mounted as in the first embodiment. In this case, this optical semiconductor device needs to be formed to be transparent or substantially transparent at least in the resin layer covering the LED element.

(5) In each embodiment, an example in which the storage direction of the lead frame multi-faced body MS in the storage case and the arrangement direction of the lead frame on the jig or the like is a direction parallel to the long side of the frame F will be described as an example. However, it is not limited to this. For example, the storage direction of the lead frame multi-faced body MS in the storage case and the arrangement direction in the jig or the like are both the direction parallel to the short side of the frame F and the direction parallel to the short side and the long side. It may be.
When the storage direction or the like is a direction parallel to the short side of the frame body F, the multifaceted body of the lead frame forms the groove and the frame body resin portion on the short side of the frame body F, so that the frame body Generation of metal powder due to F can be prevented.
Further, when the storage direction or the like is both a direction parallel to the short side of the frame body F and a direction parallel to the long side, the groove portion and the frame body resin are formed on both the short side and the long side of the frame F. By forming the portion, generation of metal powder due to the frame body F can be prevented.

(6) In the first embodiment, the lead frame multi-faced body MS shows an example applied to a so-called cup-type optical semiconductor device in which the reflector resin portion 20b is formed on the surface of the lead frame 10. It is not limited to this. For example, the multi-faced body of the lead frame can be applied to a so-called flat type optical semiconductor device in which a reflector resin portion is not formed on the surface of the lead frame.

(7) In each embodiment, although the lead frame 10 showed the example provided with the terminal part 11 and the terminal part 12, the lead frame may be provided with the 3 or more terminal part. For example, three terminal portions may be provided, one of which is mounted with an LED element, and the other two may be connected to the LED element via bonding wires. Further, a transistor may be mounted on the lead frame, and the base, collector, and emitter of the transistor may be connected to each of the terminal portions.

(8) In each embodiment, the lead frame 10 is a terminal portion 11 that becomes a die pad on which the LED element 2 is placed and connected, and a terminal that becomes a lead side terminal portion connected to the LED element 2 via the bonding wire 2a. Although the example comprised from the part 12 was demonstrated, it is not limited to this. For example, the LED element may be placed and connected so as to straddle two terminal portions. In this case, the outer shapes of the two terminal portions may be formed equally.

DESCRIPTION OF SYMBOLS 1 Optical semiconductor device 2 LED element 10 Lead frame 11 Terminal part 12 Terminal part 13 Connection part 14 Frame body resin part 20 Light reflection resin layer 20a Frame resin part 20b Reflector resin part 30 Transparent resin layer 50 Storage case 51 Rail 1001 Semiconductor device 1002 Diode 1020 Resin layer D1 Groove D2 Groove D3 Groove F Frame G Assembly M Recess MS Multi-sided body of lead frame R Multi-sided body of lead frame with resin S Gap part T Convex part

Claims (10)

In the multi-faced body of the lead frame in which the lead frame connected to the surface of the semiconductor element is multi-faced to the frame body,
The frame has a first groove that is recessed from the back surface along at least one side of the side forming the outer shape,
A frame resin portion that is formed in the first groove of the frame and protrudes from the back surface of the frame;
Multi-faceted body of lead frame characterized by The lead frame multi-faced body according to claim 1,
The frame body resin portion covers a part or all of the outer peripheral side surface of the frame body from the first groove portion of the frame body to the outer peripheral edge side,
Multi-faceted body of lead frame characterized by In the multifaceted body of the lead frame according to claim 1 or 2,
The frame body has a second groove portion recessed from the surface thereof along the side where the first groove portion is formed,
The frame resin part is formed in the second groove part and protrudes from the surface of the frame;
Multi-faceted body of lead frame characterized by In the multi-faced body of the lead frame according to any one of claims 1 to 3,
The frame resin portion is formed of a curable resin;
Multi-faceted body of lead frame characterized by In the multi-faced body of the lead frame in which the lead frame connected to the surface of the semiconductor element is multi-faced to the frame body,
The frame has a groove that is recessed from the side surface along at least one side of the side forming the outer shape,
A frame resin portion formed in the groove of the frame and protruding from a side surface of the frame;
Multi-faceted body of lead frame characterized by A multi-faced body of a lead frame according to any one of claims 1 to 5,
A resin layer having a frame resin portion formed on the outer peripheral side surface of the lead frame;
A multi-faceted body of a lead frame with resin comprising: The multi-faced body of the lead frame with resin according to claim 6,
The resin layer has a reflector resin portion formed to protrude from a surface of the lead frame to which the semiconductor element is connected;
Multi-faceted body of resin-attached lead frame characterized by In the multi-faced body of the resin-attached lead frame according to claim 6 or 7,
The frame resin portion is formed in a color different from the colors of the lead frame and the resin layer;
Multi-faceted body of resin-attached lead frame characterized by A multifaceted body of a resin-attached lead frame according to any one of claims 6 to 8,
A semiconductor element connected to each lead frame of the multi-faced body of the lead frame with resin;
A transparent resin layer that is formed on a surface of the multifaceted body of the lead frame with resin to which the semiconductor element is connected, and covers the semiconductor element;
A multifaceted body of a semiconductor device comprising: A multi-faced body of a lead frame according to any one of claims 1 to 5,
A semiconductor element connected to each lead frame of the multifaceted body of the lead frame;
A resin layer formed on an outer peripheral side surface of the lead frame, and formed on a surface of the multi-faced body of the lead frame to which the semiconductor element is connected; and covering the semiconductor element;
A multifaceted body of a semiconductor device comprising:

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