JP2015060753A - LED module, manufacturing method thereof, and vehicular lamp - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED module which can improve radiation performance by eliminating heat conduction loss, which enables easy wire-bonding work, and which is less likely to be disconnected.SOLUTION: An LED module 10 is configured to include: a socket housing 11 detachably provided to a housing 2 (or reflector) of a vehicular lighting fixture 1; a heat sink (heat radiation member) 12 incorporated in the socket housing 11; and an LED substrate 13 on which LED chips 14 and 15, which are light source, are mounted. A through hole 13a is formed on the LED substrate 13, and the LED chips 14 and 15 are installed in the through hole 13a. In addition, a plurality of conductive patterns 16-1 to 16-6 are formed around the through hole 13a, and the LED chips 14 and 15 are directly in contact with, and mounted on the heat sink 12 exposed from the through hole 13a on the LED substrate 13.

Description

  The present invention relates to an LED module using an LED (light emitting diode) as a light source, a method for manufacturing the same, and a vehicular lamp including the LED module.

  In recent years, LEDs having high luminance, low power consumption, and high durability tend to be used as light sources for vehicle lamps such as headlamps and tail lamps. Regarding a vehicular lamp using an LED as a light source, Patent Document 1 proposes a replaceable automotive LED lamp assembly. This automotive LED lamp assembly is composed of a heat radiating member in contact with external air, a heat conducting structure connected to the heat radiating member, and an LED light source attached to the heat conducting structure, and generates heat generated in the LED. It is characterized by preventing the temperature of the LED from rising by promoting radiation to the outside of the housing or reflector.

  Patent Document 2 proposes a detachable automotive LED light source unit that includes an LED substrate on which an LED chip is mounted and a heat dissipation member that radiates heat to the outside. According to this LED light source unit, since the LED substrate and the heat dissipation member are in contact with each other, the heat of the control element such as the LED chip and the resistor mounted on the LED substrate is transmitted to the heat dissipation member, and the LED is released by the heat dissipation from the heat dissipation member. The temperature rise of the chip and the control element can be suppressed.

  Further, Patent Document 3 proposes an LED module that can efficiently irradiate light distribution patterns of a tail lamp and a stop lamp, respectively, and can make the capacity of the sealing member as small as possible.

Japanese Patent No. 4155858 JP 2011-171276 A JP 2013-137959 A

  However, in the automotive LED lamp assembly proposed in Patent Document 1, since a separate heat conduction structure is interposed between the heat radiation member in contact with external air and the LED light source, the heat conduction structure There is a problem in that heat conduction loss occurs at the joint surface between the heat dissipation member and the heat dissipation member, and high heat dissipation performance cannot be exhibited due to this heat conduction loss.

  Also, in the LED light source units proposed in Patent Documents 2 and 3, since a separate LED substrate is interposed between the heat dissipation member that contacts the outside and the LED chip, the LED substrate and the heat dissipation member are joined to each other. There is a problem in that heat conduction loss occurs on the surface, and heat dissipation performance is reduced by this heat conduction loss.

  Therefore, an object of the present invention is to provide an LED module that can eliminate heat conduction loss and improve heat dissipation performance, and a vehicular lamp including the LED module.

  Further, in the LED light source units proposed in Patent Documents 2 and 3, since the LED chip and the control element such as a resistor or a diode are arranged on the same LED substrate, the heat resistance temperature of the LED chip and the control element is different. Also, it is necessary to match the heat dissipation design with parts with low heat resistance (usually LED chips), and it is uneconomical for parts with high heat resistance (usually control elements) because heat dissipation is more than necessary. is there.

  Accordingly, an object of the present invention is to provide an LED module that can be optimally designed to dissipate heat according to each heat-resistant temperature of the LED chip and the control element, and a vehicular lamp provided with the LED module.

  Further, in the LED light source units proposed in Patent Documents 2 and 3, since a plurality of LED chips are directly connected to each other through wires, there is a problem that the wire bonding operation is not easy in addition to being easily disconnected.

  Therefore, an object of the present invention is to provide an LED module that is easily wire-bonded and hardly broken, and a vehicular lamp including the LED module.

In order to achieve the above object, a first aspect of the present invention includes a socket housing that can be attached to and detached from a housing or reflector of a vehicular lamp, a heat radiating member incorporated in the socket housing, and an LED chip that is a light source. In an LED module configured to include an LED substrate,
A hollow is formed in the LED substrate, and at least one LED chip is mounted in the hollow, and a plurality of the conductive patterns are formed around the hollow and exposed from the hollow of the LED substrate. The LED chip is mounted in direct contact with the heat dissipation member.

  The invention according to claim 2 is characterized in that in the invention according to claim 1, at least one of the LED chips is connected to each other through a plurality of conductive patterns and wires formed on the LED substrate. The LED module according to claim 1.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the heat dissipating member is provided with a heat dissipating fin in contact with the air outside the socket housing.

  The invention according to claim 4 is the invention according to any one of claims 1 to 3, wherein the shape of the hollow formed in the LED substrate is similar to a desired light distribution pattern. To do.

  According to a fifth aspect of the present invention, in the invention according to any one of the first to fourth aspects, the plurality of LED chips are configured by a plurality of types or LED chips having different roles, and the conductive pattern includes a plurality of types of LEDs. A common GND pattern is provided on the chip.

  The invention according to claim 6 is the invention according to any one of claims 1 to 5, wherein the central axis of the socket housing is aligned with the optical axis, and the plurality of LED chips are rotationally symmetrical with respect to the central axis. It is arranged.

  According to a seventh aspect of the invention, in the invention according to any one of the first to sixth aspects, the control element for controlling the drive current to the LED chip is arranged on a circuit board separate from the LED board. Features.

The invention according to claim 8 includes a socket housing that can be attached to and detached from the housing or reflector of the vehicular lamp, a heat dissipating member incorporated in the socket housing, and an LED substrate on which an LED chip as a light source is mounted. In the manufacturing method of the LED module to be performed,
Forming a hole in the LED substrate having a conductive pattern laminated on a resin substrate;
Adhering the LED substrate formed with the cut-out holes to a heat dissipation member;
Mounting at least one LED chip in direct contact with the heat dissipating member exposed from the cutout hole; and
Electrically connecting the LED chips via the plurality of conductive patterns formed around the cut-out holes;
The LED module is manufactured through the steps.

  The invention according to claim 9 is the invention according to claim 8, wherein the step of electrically connecting the LED chips includes a plurality of conductive patterns formed on the LED substrate by connecting at least one of the LED chips. And connected to each other through a wire.

  A vehicular lamp according to a tenth aspect is characterized in that the LED module according to any one of the first to seventh aspects is detachably attached to a housing or a reflector.

  According to the present invention, since the LED chip is brought into direct contact with the heat radiating member without interposing a substrate between the LED chip and the heat radiating member, the heat of the LED chip is conducted to the heat radiating member without loss from the heat radiating member. Heat is dissipated efficiently to the surroundings. For this reason, the heat dissipation performance of the LED module is enhanced, the temperature rise of the LED chip is suppressed, and the light emission efficiency and durability life of the LED chip are enhanced.

  In addition, since the plurality of LED chips are connected to each other through a plurality of conductive patterns and wires formed on the LED substrate without being directly connected to each other by wires as in the prior art, the wire bonding work is facilitated and the wires are connected. Since the length of can be shortened, it can be set as the structure which is hard to be disconnected.

  Furthermore, since the common GND pattern is provided for the plurality of types of LED chips, the configuration can be simplified by reducing the number of the conductive patterns.

  In addition, according to the present invention, since the plurality of LED chips are arranged rotationally symmetrically with respect to the central axis of the socket housing that coincides with the optical axis of the LED module, the LED is turned on and off in light quantity switching and emission color switching. The chip arrangement can be kept rotationally symmetric.

  Furthermore, since the heat conducted from the LED chip to the heat radiating member is efficiently radiated from the heat radiating fins in contact with the air outside the socket housing, the temperature rise of the LED chip is effectively suppressed.

  According to the vehicular lamp according to the present invention, when a failure occurs in the LED chip, it is economical to replace only the LED module with a new one without replacing the entire vehicular lamp. Therefore, the economic burden on the user is reduced. Moreover, since the heat dissipation performance of the LED module is enhanced and the luminous efficiency and durability of the LED chip are enhanced, the illuminance of the vehicular lamp is increased and the replacement frequency of the LED module is kept low.

1 is a front view of a vehicular lamp according to the present invention. It is the sectional view on the AA line of FIG. It is a perspective view of the LED module which concerns on this invention. It is a disassembled perspective view of the LED module which concerns on this invention. It is a top view of the LED module which concerns on this invention. It is a plane sectional view of the LED module concerning the present invention. It is a side view of the heat sink of the LED module which concerns on this invention. It is a front view of the heat sink of the LED module which concerns on this invention. It is the B section enlarged detail drawing of FIG. It is a top view which shows the copper foil pattern on the LED board of the LED module which concerns on this invention. It is a circuit diagram which shows the connection structure of the LED chip of the LED module which concerns on this invention. (A)-(k) is explanatory drawing which shows the manufacturing process of the LED module which concerns on this invention in the order of the process. It is a figure which shows another form of the LED chip of the LED module which concerns on this invention, and its connection structure. It is a figure which shows another form of the LED chip of the LED module which concerns on this invention, and its connection structure.

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 is a front view of a vehicular lamp according to the present invention, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, and the vehicular lamp 1 shown in the figure is a rear combination lamp provided on the left and right of the rear part of a four-wheel vehicle. Since the configuration is the same on the left and right, only the right vehicle lamp (rear combination lamp) 1 will be illustrated and described below.

  The vehicular lamp 1 according to the present embodiment includes a bulb 5 and 6 that are light sources and an LED module 10 according to the present invention in a lamp chamber 4 defined by a housing 2 and an outer lens 3 that covers an opening thereof. An inner lens 7 that has been cut to distribute light emitted from the LED module 10, a reflector 8 that reflects the light that has passed through the inner lens 7, and an extension 9 that covers the gap between the reflector 8 and the housing 2. Etc. are accommodated.

  Here, the bulbs 5 and 6 are detachably attached to the housing 2, and the LED module 10 is detachably attached to the reflector 8. In the vehicular lamp 1 according to the present embodiment, the LED module 10 is detachably attached to the reflector 8. However, in the present invention, the vehicular lamp in which the LED module is detachably attached to the housing. Are also included in the scope of application.

  Next, details of the configuration of the LED module 10 according to the present invention will be described with reference to FIGS.

  3 is a perspective view of the LED module according to the present invention, FIG. 4 is an exploded perspective view of the LED module, FIG. 5 is a plan view of the LED module, FIG. 6 is a plan sectional view of the LED module, and FIG. FIG. 8 is a front view of the heat sink, FIG. 9 is an enlarged detail view of part B of FIG. 8, FIG. 10 is a plan view showing a copper foil pattern on the LED board of the LED module, and FIG. It is a circuit diagram which shows the connection structure of the LED chip of the LED module.

  The LED module 10 according to the present invention incorporates an aluminum heat sink 12 as a heat radiating member in a socket housing 11 integrally formed of resin, and a rectangular flat LED substrate 13 is mounted on the rectangular top surface of the heat sink 12. It is composed by bonding.

  The heat sink 12 is an aluminum extrusion-molded product. As shown in FIG. 7, three thin heat radiating fins 12 </ b> B are integrally extended from a rectangular block-shaped main body 12 </ b> A of the heat sink 12. The rectangular plate-like LED substrate 13 on which a plurality of LED chips 14 and 15 (see FIG. 9) are mounted is bonded to the rectangular top surface of the main body 12A of the heat sink 12.

  Thus, in the present embodiment, the central axis of the socket housing 11 coincides with the optical axis of the LED module 10, and the LED chips 14 and 15 are placed on the LED substrate 13 as shown in FIG. The rotation axis is symmetrical with respect to the central axis. Specifically, as shown in FIG. 10, a cross-shaped hollow 13 a is formed on the LED substrate 13, and six copper foils having conductive patterns independent of each other are formed around the hollow 13 a. Patterns 16-1 to 16-6 are formed. A single red LED chip 14 is arranged at the center of the hollow 13a, and 16 red LED chips 15 (15-1 to 15-4) are arranged in a cross shape around the red LED chip 14. . In the present embodiment, the width of the cut-out hole 13a is set to 2 mm or less. In addition, one red LED chip 14 constitutes a tail lamp light source, and 16 red LED chips 15 constitute a stop lamp light source.

  It is preferable that the cross-shaped cutout hole has a shape close to the standard light distribution pattern of the vehicle stop lamp. In the case of the present embodiment, since the cross-cut holes 13a are formed in the LED substrate 13, the cut holes 13a can be processed into a substantially similar shape. However, the shape of the cut-out hole may be changed in accordance with the standard of the vehicle lamp and the light distribution pattern of the illumination, and thus is not limited to the shape of the present embodiment.

  In the present embodiment, the top surface of the aluminum heat sink 12 is exposed from the cut-out hole 13a. Since this exposed surface is a reflective surface having a high reflectance, one of the red light emitted from the LED chips 14 and 15 is used. The light extraction efficiency can be increased by reflecting the portion. Further, since the reflection surface is a metal surface, the light is regularly reflected, and the directivity of the light emitted from the LED chips 14 and 15 is improved. Thereby, if the shape of the cut-out hole 13a is a cruciform shape that is desired to satisfy the vehicle specification of the stop lamp, the light emission pattern can be easily changed to a desired pattern. In this case, since the top surface of the heat sink 12 exposed by the hollow hole 13a of the LED board 13 is connected without being divided by the LED board 12, the light emission of each LED chip 14, 15 is also aided by reflected light. Overlapping and seamless light distribution patterns can be formed.

  In the present embodiment, one LED chip 14 and 16 LED chips 15 arranged in the hollow 13a of the LED substrate 13 are mounted on an adhesive layer (not shown). The chips 14 and 15 are in direct contact with the top surface of the heat sink 12 through the adhesive layer. One LED chip 14 and 16 LED chips 15 are electrically connected as shown in FIGS. 9 and 11 by the copper foil patterns 16-1 to 16-6 and a plurality of wires 17. Yes. As shown in FIG. 9, a rectangular ring-shaped dam is formed around the LED chips 14 and 15 of the LED substrate 13, and a transparent sealing resin is potted in a region surrounded by the dam 18. Is filled by.

  Here, details of the electrical connection structure of the LED chips 14 and 15 will be described with reference to FIGS. 9 and 11.

  One LED chip 14 constituting the light source of the tail lamp is connected to a copper foil pattern 16-1 on the power supply side and a copper foil pattern 16-6 on the GND side through a wire 17. Of the 16 LED chips 15 constituting the light source of the stop lamp, four LED chips 15-1 are connected to the copper foil patterns 16-2 and 16-3 via the wires 17, and The LED chip 15-2 is connected to the copper foil patterns 16-3 and 16-4 via the wires 17, and the four LED chips 15-3 are connected to the copper foil patterns 16-4 and 16- via the wires 17. The four LED chips 15-4 are connected to the copper foil patterns 16-5 and 16-6 through the wires 17.

  Here, since the 16 LED chips 15 (15-1 to 15-4) are electrically connected to each other as shown in FIG. 11, for example, even when one LED chip 15 is disconnected. Since the other 15 LED chips 15 are lit, the decrease in the light amount of the stop lamp is so small that it can be ignored, and there is no practical problem. In the present embodiment, one copper foil pattern 16-6 is used as a GND pattern (ground electrode) of one LED chip 14 as a tail lamp light source and 16 LED chips 15 as a stop lamp light source. Since they are shared, the number of conductive patterns 16-1 to 16-6 can be reduced and the configuration can be simplified.

  By the way, the socket housing 11 is detachably attached to the reflector 8 of the vehicular lamp 1 as shown in FIG. 2, and as shown in FIGS. A rectangular cylindrical socket portion 11B extending integrally from a position offset from the center portion of the main body portion 11A is provided. As shown in FIGS. 3 to 5, four engaging claws 11 a are integrally formed on the outer periphery of the main body 11 </ b> A of the socket housing 11. A seal ring 19 such as an O-ring is fitted on the outer periphery of the base end portion of the main body 11 </ b> A of the socket housing 11.

  Further, as shown in FIG. 6, the socket housing 11 is formed with a board storage space 11b extending to the socket portion 11B, and a rectangular plate-like circuit board 20 is stored in the board storage space 11b. Yes. As shown in FIG. 4, a plurality of control elements 21 such as resistors and diodes for controlling the drive current to the LED chips 14 and 15 are arranged on the circuit board 20, and one end thereof (the front side of FIG. 4). Three terminals 22 that are bent in an L shape are provided on the side), and three terminals 23 are provided on the other end (the back side in FIG. 4). When the circuit board 20 is housed in the board housing space 11b of the socket housing 11 as shown in FIG. 6, the three terminals 22 provided at one end of the circuit board 20 are as shown in FIG. And electrically connected to the copper foil pattern for stop 24-1, the copper foil pattern for tail 24-2, and the copper foil pattern for GND 24-3 provided on the LED board 13, and provided on the other end of the circuit board 20. The three terminals 23 faced in the socket portion 11B of the socket housing 11 as shown in FIG. Note that the copper foil pattern for stop 24-1, the copper foil pattern for tail 24-2, and the copper foil pattern for GND 24-3 are the copper foil patterns 16-2, 16-1, 16- shown in FIGS. 6 are connected to each other.

  As shown in FIG. 2, the LED module 10 configured as described above is inserted into the mounting hole 8a formed at the center of the reflector 8 of the vehicular lamp 1 from the back side, and then turned to a socket. Four engaging claws 11a (see FIGS. 3 to 5) formed on the outer periphery of the main body portion 11A of the housing 11 are engaged with two engaging protrusions 8b formed on the inner periphery of the mounting hole 8a of the reflector 8. Accordingly, the reflector 8 is detachably attached. When the LED module 10 is attached to the reflector 8 in this way, the seal ring 19 fitted around the outer periphery of the main body 11A of the socket housing 11 protrudes around the attachment hole 8a on the back surface of the reflector 8. By being in close contact with the tube portion 8c, high sealing performance is ensured between the LED module 10 and the reflector 8, and entry of water or the like from the mounting portion of the LED module 10 into the lamp chamber 4 is reliably prevented.

  Although not shown, a power plug is attached to an end of a power cord extending from a battery mounted on the vehicle, and has a rectangular cylindrical shape formed on the socket housing 11 of the LED module 10 attached to the reflector 8. By inserting the power plug into the socket portion 11B, the LED chips 14 and 15 (see FIG. 9) as the light source of the LED module 10 are connected to the battery via the LED board 13, the terminal 22, the circuit board 20, the terminal 23 and the power cord. Electrically connected.

  Therefore, when the driver supplies power to the LED module 10 from the battery by a switch operation, the current from the battery is supplied to the LED chips 14 and 15 via the power cord and the terminal 23, the circuit board 20, the terminal 22, and the LED board 13. Therefore, each LED chip 14, 15 is activated to emit light. Then, the light emitted from each LED chip 14, 15 is reflected by the reflector 8 after the light distribution is controlled by passing through the inner lens 7, passes through the outer lens 3, and is rearward of the vehicle (downward in FIG. 2). Exit toward.

  When the LED chips 14 and 15 emit light as described above, the LED chips 14 and 15 generate heat, but the heat is directly conducted to the heat sink 12 and is radiated to the outside from the radiation fins 12B exposed to the air of the heat sink 12. The In the present embodiment, since the LED chips 14 and 15 are brought into direct contact with the heat sink 12, the heat generated in the LED chips 14 and 15 is directly conducted to the heat sink 12 without passing through the substrate as in the prior art. The conduction loss is suppressed to a small level and heat is efficiently transferred to the heat sink 12. As a result, heat is efficiently radiated to the outside from the radiation fins 12 </ b> B formed on the heat sink 12, the temperature rise of the LED chips 14, 15 is suppressed, and high luminous efficiency and durable life are ensured for the LED chips 14, 15. Further, in the present embodiment, since the control element 21 is arranged on the circuit board 20 separately from the LED chips 14 and 15, it is possible to perform an optimal heat radiation design according to each heat resistance temperature of the LED chips 14 and 15 and the control element 21. Become.

  In the present embodiment, the plurality of LED chips 14 and 15 are not directly connected to each other by wires as in the prior art, but the plurality of copper foil patterns 16-1 to 16-6 formed on the LED substrate 13 and Since the connection is made via the wire 17, the bonding strength of the wire 17 can be increased compared to the case where the wire 17 is directly connected from the LED chip 14, 15 to the LED chip 14, 15. Since the length of the wire 17 can be shortened, a structure that is difficult to break can be obtained. In the present embodiment, the length of the wire 17 can be 2 mm or less.

  Further, in the present embodiment, since the plurality of LED chips 14 and 15 are arranged rotationally symmetrically with respect to the central axis of the socket housing 11 that coincides with the optical axis of the LED module 10, lighting and non-lighting are performed in light quantity switching and emission color switching. In each lighting, the arrangement of the LED chips 14 and 15 can be maintained in rotational symmetry.

  In the present embodiment, since the LED module 10 is detachably attached to the reflector 8 of the vehicular lamp 1, the entire vehicular lamp 1 is removed when a failure occurs in the LED chips 14 and 15. It is economical because only the LED module 10 needs to be replaced with a new one without replacement, and the economic burden on the user is reduced. And since the thermal radiation performance of LED module 10 is improved and the luminous efficiency and durable life of LED chip 14 and 15 are improved, while the illumination intensity of the vehicle lamp 1 is raised, the replacement frequency of LED module 10 is restrained low.

  Next, the manufacturing method of the LED module 10 which concerns on this invention is demonstrated below based on Fig.12 (a)-(k).

  12 (a) to 12 (k) are explanatory views showing the manufacturing steps of the LED module 10 in the order of the steps. In manufacturing the LED module 10 according to the present invention, first, as shown in FIG. 12 (a), aluminum is used. One long heat sink material W is manufactured by extrusion molding. Next, the heat sink material W is cut into an appropriate length to obtain the heat sink 12 shown in FIG.

  Next, the LED substrate 13 shown in FIG. 12C on which the plurality of LED chips 14 and 15 are mounted in advance is bonded to the top surface of the heat sink 12 as shown in FIG. Then, after the LED chips 14 and 15 and the copper foil patterns 16-1 to 16-6 are electrically connected by the wire 17 by the wire bonding operation shown in FIGS. 12E and 12F, FIG. As shown, a rectangular ring-shaped dam 18 is formed around the LED chips 14 and 15 of the LED substrate 13.

  In the present embodiment, a laminated type substrate is used as the LED substrate 13, and specifically, the substrate is laminated in the order of resin substrate / adhesive layer / copper foil pattern / resin layer. Here, FR-4 (glass cloth base epoxy resin) was used for the resin substrate. In addition, CEM-3 (glass cloth / glass nonwoven fabric composite base material epoxy resin) may be used. Moreover, the epoxy resin soaked in the glass cloth or glass fiber of the resin substrate may be replaced with a silicone resin or a fluorine resin having high heat resistance and light resistance. The adhesive layer is a so-called general adhesive, and there are an epoxy type and a silicone type. The copper foil pattern is plated thereon, and in this embodiment, the copper foil pattern is laminated in the order of copper foil / nickel plating / gold plating. When the emitted light is red or amber, gold plating is mainly used. However, when the white light requiring high reflectivity in the entire wavelength region is emitted light, silver plating may be used. However, since silver plating may be discolored due to sulfuration, gold plating may be used even when white. A white solder resist was used as the outermost resin layer. An epoxy resin was used for the resin material of the resin layer, and a general white pigment such as titanium oxide, zinc oxide or barium sulfate was used for the white pigment. This resin material is not limited to an epoxy type, and may be changed to a silicone type or a fluorine type when heat resistance or light resistance improvement is required. In this embodiment, the white resin layer is used for the purpose of improving the reflectivity, but the color of the resin layer, particularly black, red, amber, green, yellow, etc., is adjusted depending on the application, function and design. Good. In the present embodiment, the simplest laminated substrate is used as the LED substrate 13, but a multilayer substrate having a wiring structure of two or more layers using vias for wiring of the copper foil patterns 16-1 to 16-6 is used. May be used.

  When the dam 18 is formed on the LED substrate 13 as described above, a transparent sealing resin is injected into the region surrounded by the dam 18 and surrounded by the dam 18 as shown in FIG. The LED chips 14, 15 arranged in the region, the copper foil patterns 16-1 to 16-6, and the wires 17 are sealed with a sealing resin.

  Thereafter, as shown in FIG. 12 (i), the socket housing 11 is insert-molded together with the heat sink 12 by resin, and the heat sink 12 is integrated with the socket housing 11. Finally, the circuit board 20 is assembled in the board housing space 11b (see FIG. 6) of the socket housing 11, whereby the LED module 10 as a finished product as shown in FIG. 12 (k) is obtained.

  By the way, in the above embodiment, the LED board 13 is formed with the cross-shaped hollow 13a, and the LED chips 14 and 15 are arranged in the hollow 13a. For example, as shown in FIG. The LED board 13 is formed with a bowl-shaped cut-out hole 13a, one LED chip 14 serving as a tail lamp light source is disposed at the center of the cut-out hole 13a, and around the sixteen stop lamp light sources. The LED chip 15 may be disposed, and the LED chips 14 and 15 may be electrically connected by a connection structure similar to that of the above embodiment (see FIGS. 9 and 11). In addition, you may produce an LED module by mounting one LED chip directly on the heat radiating member exposed to the hole, via an adhesive agent.

  Alternatively, as shown in FIG. 14, the LED board 13 is formed with four straight elongated holes 13a in parallel with each other at an appropriate interval, and copper foil patterns 16-1 to 16-16 on both sides of these holes 13a. -5 may be arranged, and a configuration in which the LED chip 15 for the stop lamp is arranged in each cut-out hole 13a may be adopted.

  Although the present invention has been described with respect to a form in which the present invention is applied to a rear combination lamp and an LED module provided therein, the present invention is not limited to a headlamp, a DRL (Daytime Running Lamp), a fog lamp, a back lamp, and a side turn. Of course, the present invention can be similarly applied to other vehicular lamps such as lamps, turn signal lamps, rear fog lamps, ash mount stop lamps, license plate lamps, and LED modules provided therein.

  By the way, there are cases where two-color or three-color LED chips are mounted in one LED module. For example, when a turn signal lamp enters a vehicle lamp of one rear combination lamp in addition to a stop lamp and a tail lamp. The red LED chip and the amber LED chip are mounted together. Furthermore, if a back lamp is added to the rear combination lamp, a white LED chip is also mounted. In the case of a DRL with a turn signal function, an amber LED chip for a turn signal lamp is mounted together with a white LED chip for DRL.

  In the case of turn signal lamps and side turn lamps, use LED chips that emit amber color, or mount blue LED chips directly on the heat dissipation member, and then encapsulate the phosphor that emits amber light in the area surrounded by the dam Fill the resin by potting.

1 Vehicle lamp (rear combination lamp)
2 Housing 3 Outer lens 4 Light chamber 5, 6 Bulb 7 Inner lens 8 Reflector 9 Extension 10 LED module 11 Socket housing 12 Heat sink (heat dissipation member)
12A Heat sink main body 12B Heat sink heat dissipation fin 13 LED substrate 13a LED substrate punch hole 14, 15 LED chip 16-1 to 16-6 Copper foil pattern (conductive pattern)
17 Wire 18 Dam 19 Seal ring 20 Circuit board 21 Control element 22, 23 Terminal

Claims (10)

In an LED module configured to include a socket housing that can be attached to and detached from a vehicle lamp housing or a reflector, a heat dissipation member incorporated in the socket housing, and an LED substrate on which an LED chip that is a light source is mounted.
A hollow is formed in the LED substrate, and at least one LED chip is mounted in the hollow, and a plurality of the conductive patterns are formed around the hollow and exposed from the hollow of the LED substrate. An LED module, wherein the LED chip is mounted in direct contact with the heat dissipation member.   The LED module according to claim 1, wherein at least one of the LED chips is connected to each other through a plurality of conductive patterns and wires formed on the LED substrate.   The LED module according to claim 1, wherein the heat dissipating member is provided with a heat dissipating fin that contacts air outside the socket housing.   4. The LED module according to claim 1, wherein a shape of the hollow formed in the LED substrate is a shape similar to a desired light distribution pattern.   The plurality of LED chips are configured by a plurality of types or LED chips having different roles, and a GND pattern common to the plurality of types of LED chips is provided in the conductive pattern. LED module according to 1.   6. The LED module according to claim 1, wherein a central axis of the socket housing coincides with an optical axis, and the plurality of LED chips are arranged rotationally symmetrically with respect to the central axis.   The LED module according to claim 1, wherein a control element that controls a drive current to the LED chip is arranged on a circuit board separate from the LED board. In a method for manufacturing an LED module comprising a socket housing that can be attached to and detached from a vehicle lamp housing or reflector, a heat dissipation member incorporated in the socket housing, and an LED substrate on which an LED chip as a light source is mounted. ,
Forming a hole in the LED substrate having a conductive pattern laminated on a resin substrate;
Adhering the LED substrate formed with the cut-out holes to a heat dissipation member;
Mounting at least one LED chip in direct contact with the heat dissipating member exposed from the cutout hole; and
Electrically connecting the LED chips via the plurality of conductive patterns formed around the cut-out holes;
The LED module is manufactured through the steps.   9. The step of electrically connecting the LED chips includes connecting at least one of the LED chips to each other through a plurality of conductive patterns and wires formed on the LED substrate. The manufacturing method of the LED module of description. A vehicle lamp comprising the LED module according to claim 1 detachably attached to a housing or a reflector.

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