JP2015050313A - Wiring board and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board capable of achieving favorable electrical connection between penetrating conductors formed in a thickness direction of an insulating layer along a side of a through hole having a square shape in a planar view.SOLUTION: A wiring board 1 of the present invention includes: an insulating substrate 11 comprising a plurality of insulating layers laminated therein and having a through hole 12 having a square shape in a planar view; and a plurality of penetrating conductors 14 disposed along a square-shaped side that forms an external shape and penetrating through the insulating layers. Each of the penetrating conductors 14 includes a first penetrating conductor 141 and a second penetrating conductor 142. The first penetrating conductor 141 and the second penetrating conductor 142 are formed in the insulating layers located vertically, respectively, to be connected with each other. The second penetrating conductor 142 has a longer length in a direction orthogonal to the side than the first penetrating conductor 141.

Description

  The present invention relates to a wiring board for mounting an electronic component such as a semiconductor element or a light emitting element, and an electronic device.

  Conventionally, wiring boards for mounting electronic components such as semiconductor elements and light emitting elements are made of a metal powder metallization such as tungsten or molybdenum on the surface of an insulating substrate made of a ceramic material such as an aluminum oxide sintered body. It is formed by arranging a wiring conductor. An insulating substrate of such a wiring substrate is known, for example, formed by laminating a plurality of insulating layers in which rectangular through holes are formed, and the plurality of insulating layers are wired in the thickness direction. Each through conductor is buried. Such a wiring board is formed by a ceramic green sheet laminating method (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 2003-133454

  However, when the ceramic green sheets are stacked and pressed, the inner wall of the through hole tends to be deformed so as to protrude inward in a plan view around the central portion of one side of the insulating layer. In particular, in a wiring board having a long through-hole side or a wiring board having a thick board thickness, the deformation tends to increase when the layers are repeatedly laminated and pressed.

  In addition, when the through conductors arranged along the through holes are embedded in the thickness direction of the plurality of insulating layers, one of the upper and lower insulating layers is deformed so as to protrude toward the inner wall of the through hole. Is greatly displaced inward in the plane direction, and there is a concern that the through conductors embedded in the upper and lower insulating layers are disconnected.

  A wiring board according to one aspect of the present invention is formed by laminating a plurality of insulating layers, and has an insulating board having a rectangular through hole in a plan view, and is arranged along the rectangular side that is an outer shape. A plurality of through conductors penetrating the insulating layer, the through conductors including a first through conductor and a second through conductor, wherein the first through conductor and the second through conductor are included. The through conductors are formed on the insulating layers positioned above and below and connected to each other, and the second through conductor is longer in the direction perpendicular to the side than the first through conductor.

  An electronic device according to another aspect of the present invention includes a wiring board and an electronic component mounted on the wiring board.

According to the wiring board according to one aspect of the present invention, the through conductor includes the first through conductor and the second through conductor, and the first through conductor and the second through conductor are positioned vertically. The second through conductors are longer in the direction perpendicular to the sides than the first through conductors. Because of such a configuration, the inner wall of the through hole having a rectangular shape in plan view is deformed so as to protrude inward in plan view, and one of the upper and lower insulating layers is greatly displaced inward in the plane direction. However, it is possible to reduce the possibility that the first through conductor and the second through conductor are disconnected only by shifting the connection position between the first through conductor and the second through conductor.

  According to the electronic device according to another aspect of the present invention, since the wiring board and the electronic component mounted on the wiring board are included, an electronic device having excellent electrical connection reliability can be obtained.

It is a top view which shows the electronic device in the 1st Embodiment of this invention. (A) is a longitudinal cross-sectional view in the AA line of FIG. 1, (b) is a principal part expanded sectional view in the A section of (a). (A) is an internal top view in the insulating layer with which the 1st penetration conductor of the wiring board in FIG. 1 was embed | buried, (b) is a principal part expansion internal top view in the A section of (a). (A) is an internal top view in the insulating layer with which the 2nd penetration conductor of the wiring board in FIG. 1 was embed | buried, (b) is a principal part expansion internal top view in the A section of (a). (A) is a principal part expanded sectional view of the wiring board in the other example of the 1st Embodiment of this invention, (b) is the 2nd penetration conductor of the wiring board of (a) embedded. It is a principal part expansion internal top view in an insulating layer. It is an internal top view in the insulating layer with which the 2nd penetration conductor was embedded. (A) is a longitudinal cross-sectional view of the electronic device in the 2nd Embodiment of this invention, (b) is a principal part expansion in the insulating layer by which the 2nd penetration conductor of the wiring board of (a) was embed | buried. FIG. It is a longitudinal cross-sectional view which shows the electronic device in the 3rd Embodiment of this invention. (A) is an internal top view in one insulating layer in which the first through conductor and the second through conductor of the wiring board in FIG. 8 are embedded, and (b) is an essential part in section A of (a). FIG. (A) is an internal top view in the other insulating layer in which the first through conductor and the second through conductor of the wiring board in FIG. 8 are embedded, and (b) is an essential part in the A part of (a). FIG. It is a longitudinal cross-sectional view which shows the electronic device in the other example of the 1st Embodiment of this invention. It is a longitudinal cross-sectional view which shows the electronic device in the other example of the 1st Embodiment of this invention.

  Several exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

(First embodiment)
The electronic device according to the first embodiment of the present invention includes a wiring board 1 and an electronic component 2 mounted on the lower surface of the wiring board 1 as in the example shown in FIGS. 1 and 2. Such an electronic device is mounted on, for example, an external circuit board.

As in the example shown in FIGS. 1 and 2, the wiring substrate 1 includes an insulating substrate 11 in which a plurality of insulating layers are stacked, and a plurality of wiring conductors 13 provided on and inside the insulating substrate 11. The insulating substrate 11 has a plurality of through conductors 14 penetrating the insulating layer. The insulating substrate 11 has a rectangular through-hole 12 in plan view, and has a base 111 formed from a plurality of insulating layers 11a and a rectangular through-hole 12 in plan view laminated on the upper surface of the base 111. And a first frame portion 112 formed of a plurality of insulating layers, and a rectangular through hole 12 that is laminated on the upper surface of the first frame portion 112 and is larger in plan view than the through hole 12 of the first frame portion 112. And a second frame 113 formed of a plurality of insulating layers. The through conductor 14 includes a first through conductor 141 and a second through conductor 142 arranged along the side of the rectangular through hole 12 in plan view. The first penetrating conductor 141 and the second penetrating conductor 142 are respectively formed on the upper and lower insulating layers and connected to each other, and the length in the direction perpendicular to the side of the second penetrating conductor 142 is the first. Longer than the through conductor 141. 1 and 2, the electronic device is provided in a virtual xyz space, and for the sake of convenience, the “upward direction” means the positive direction of the virtual z axis.

  The insulating substrate 11 has a rectangular plate shape in plan view. The insulating substrate 11 functions as a support for supporting the electronic component 2. For example, the electronic component 2 is bonded and fixed to the lower surface via a low melting point brazing material or a bonding material such as resin or glass.

  Examples of the material of the insulating substrate 11 include an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, and a glass ceramic sintered body. It is an electrically insulating ceramic.

When the insulating substrate 11 is made of, for example, an aluminum oxide sintered body, first, it is suitable for a raw material powder such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), and magnesia (MgO). An organic solvent and a solvent are added and mixed to produce a slurry. A ceramic green sheet is produced by forming this into a sheet by employing a conventionally known doctor blade method or calendar roll method. Next, by subjecting the ceramic green sheet to appropriate punching or laser processing, a ceramic green laminate is formed by laminating and pressing as necessary, and firing at a high temperature (about 1500 to 1800 ° C.). An insulating substrate 11 is manufactured.

  The insulating substrate 11 includes a base 111, a first frame 112, and a second frame 113, each of which includes a plurality of insulating layers. The base 111, the first frame 112, and the second frame Each part 113 is provided with a rectangular through-hole 12 in plan view. Here, the rectangular through-hole 12 includes a through-hole 12 whose corners are arcuate or chamfered and a through-hole 12 having a recess on the side.

Note that the base 111, the first frame 112, and the second frame 113 that form the insulating substrate 11 have a through hole 12 formed in each of the ceramic green sheets for the insulating substrate 11 during the above-described punching or laser processing. The holes to be the through holes 12 of the 111, the first frame part 112, and the second frame part 113 may be formed by a die, punching by punching, laser processing, or the like.

  The wiring conductor 13 is provided on the upper and lower surfaces of each insulating layer of the insulating substrate 11. The wiring conductor 13 is used to electrically connect the electronic component 2 mounted on the wiring board 1 and the external circuit board, and to join the electronic component 2 and the wiring board 1. Is used to join.

The through conductors 14 are provided so as to penetrate through the insulating layers of the base portion 111, the first frame portion 112, and the second frame portion 113 that constitute the insulating substrate 11 in the thickness direction. Is used for electrical connection.

  The material of the wiring conductor 13 and the through conductor 14 is metallization mainly composed of tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu), or the like.

  The wiring conductor 13 is formed by, for example, applying a metallized paste for the wiring conductor 13 to a ceramic green sheet for the insulating substrate 11 by printing means such as a screen printing method, and firing together with the ceramic green sheet for the insulating substrate 11. The

The through conductor 14 is formed, for example, by forming a hole for the through conductor 14 in a ceramic green sheet for the insulating substrate 11 by a die or punching method by punching or laser processing, and a metallized paste for the through conductor 14 in this hole. Is filled with the above printing means and fired together with the ceramic green sheet for the insulating substrate 11.

The through conductor 14 is a first through conductor 141 disposed along the side of the rectangular through hole 12 in plan view.
And a second through conductor 142. In the example shown in FIGS. 1 to 4, the first through conductor 141 and the second through conductor 142 are disposed along the side of the through hole 12 of the first frame portion 112.
The length of the second through conductor 142 in the direction orthogonal to the side is longer than that of the first through conductor 141. Here, the length in the direction orthogonal to the side is longer than that of the first through conductor 141 means that the length of the through conductor 14 in the direction parallel to the side is φ1, and the through conductor 14 in the direction orthogonal to the side. When φ2 is φ2, φ2> φ1, that is, the first through conductor 141 or the second through conductor 142 has an elliptical shape or an elliptical shape having two parallel sides in a plan view. . In the example shown in FIGS. 1 to 4, the first through conductor 141 and the second through conductor 142 are disposed so as to overlap each other in a plan view, and the first through conductor 141 and the second through conductor are disposed. A land pattern for improving the connection between the first through conductor 141 and the second through conductor 142 may be disposed between the first through conductor 141 and the second through conductor 142. For example, when the first through conductor 141 has a circular shape and the second through conductor 142 has an oval shape, the length φ1 of the second through conductor 142 in the direction parallel to the side is 100 μm, and the direction is perpendicular to the side. The length φ2 of the second through conductor 142 is 200 μm, and the length φ3 of the first through conductor 141 in the direction parallel to and perpendicular to the side is 100 μm. Even if only the land pattern in the direction perpendicular to the side is lengthened, the land pattern is not thick enough, and the land pattern breaks when one of the upper and lower insulating layers is greatly displaced inward in the plane direction. Therefore, it is important that the length of the second through conductor 142 in the direction orthogonal to the side is longer than that of the first through conductor 141.

  Here, the distance from the inner wall of the through hole 12 of the first through conductor 141 is L1, the distance from the inner wall of the through hole 12 of the second through conductor 142 is L2, and the first through conductor 141 is embedded. When the length of the inner wall surface of the through hole 12 in the insulating layer protruding from the inner wall surface of the through hole 12 in the insulating layer in which the second through conductor 142 is embedded is L3 ≧ L1−L2 ≧ 0, and φ2 ≧ φ3 + L3. That is, when one insulating layer is deformed so as to protrude inward in plan view, one through conductor 14 is elongated in a direction perpendicular to the side.

In the example shown in FIGS. 3 and 4, L1 ≧ L2, and the first through conductor 141 is circular, the second through conductor 142 is oval, and the second through conductor 142 is One through conductor 141
It is formed longer toward the inner wall side of the through hole 12 than. As in the example shown in FIG. 5, in the case of L1≈L2, the second through conductor 142 is formed longer than the first through conductor 141 toward the opposite side of the inner wall side of the through hole 12. In this case, the first through conductor 141 and the second through conductor 142 are arranged far from the through hole 12 and the space between the inner wall surface of the through hole 12 and the through conductor 141 is increased, so that Since it is possible to suppress the occurrence of cracks and the like, it is suitably used for a small wiring board 1 of low resistance wiring in which the length of the through conductor 14 is large and the distance between the through conductor 14 and the through hole 12 is small. it can.

Further, as in the example shown in FIG. 5, the lengths of the lengths of the through conductors 14 in the direction parallel to the sides may be different between the first through conductors 141 and the second through conductors 142. For example, the length in the direction perpendicular to the side of one oval through conductor 14 may be smaller than the diameter of the other circular through conductor 14, that is, the direction parallel to the side and the direction perpendicular to the side. I do not care. In this case, in the manufacturing process of the wiring board 1, for example, by increasing the width of the insulating layer between the adjacent oval through conductors 14, there is a possibility that the oval through conductor 14 may fall off the insulating layer. The electrical connection between the first through-conductor 141 and the second through-conductor 142 can be improved, and the possibility of cracks occurring between the adjacent elliptical through-conductors 14 is reduced. Can be reduced. Moreover, if the length of the through conductor 14 is long and the cross-sectional area is large, the filling property of the metallized paste 141 is lowered or the filled metallized paste 141 is easily dropped off in the manufacturing process of the wiring board 1. It is better to reduce the length parallel to the side.

In addition, as in the example shown in FIG. 6, the deformation is such that the vicinity of the central portion of the side of the rectangular through hole 12 in the plan view is most convex inward in the plan view. Since the deformation that protrudes inward is small near the corner of the side, the length in the direction perpendicular to the side of the second through conductor 142 is increased near the center of the side of the rectangular through hole 12. The through conductors 14 may be circular in the vicinity of the corners of the sides of the rectangular through holes 12. For example, the length of the through conductor 14 may be gradually reduced from the vicinity of the center of the side of the rectangular through hole 12 to the corner, or a plurality of through conductors adjacent to each other along the side of the rectangular through hole 12 You may make it small for every 14 area | regions.

A surface of the wiring conductor 13 exposed from the insulating substrate 11 is coated with a metal plating layer having excellent corrosion resistance such as nickel and gold. Corrosion of the wiring conductor 13 can be reduced, and bonding between the electrode or bonding wire of the electronic component 2 and the wiring conductor 13 or bonding between the external circuit board and the external terminal 13 can be strengthened. For example, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the surface of the wiring conductor 13 exposed from the insulating substrate 11.

  Then, by mounting the electronic component 2 on the lower surface of the wiring board 1, an electronic device as shown in the example of FIGS. 1 and 2 is manufactured.

  The electronic component 2 to be mounted is a semiconductor element such as an IC chip or an LSI chip, a piezoelectric element such as a crystal vibrator or a piezoelectric vibrator, a light emitting element, or various sensors. For example, when the electronic component 2 is a wire bonding type semiconductor element, the electronic component 2 is fixed to the insulating substrate 11 with a bonding material, and then the electrodes and wiring of the semiconductor element are connected via the bonding wire. This is done by electrically connecting the conductor 13. Alternatively, when the electronic component 2 is a flip-chip type semiconductor element, the electrode of the semiconductor element and the wiring conductor are connected via a bonding material such as a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin, etc.). 13 is electrically and mechanically connected. Further, after the electronic component 2 is bonded to the wiring board with a bonding material, an underfill may be injected between the electronic component 2 and the wiring board 1. For example, when the electronic component 2 is a piezoelectric element such as a crystal resonator, the piezoelectric element is fixed and the electrode of the piezoelectric element and the wiring conductor 13 are electrically connected by a bonding material such as a conductive resin. . Moreover, you may mount 2nd electronic components, such as a resistive element and a capacitive element, around the electronic component 2 as needed.

  In addition, the electronic component 2 is sealed with a lid or resin as necessary. The lid has a cap shape made of metal, ceramics, glass, resin, or the like. The lid body preferably has a thermal expansion coefficient close to the thermal expansion coefficient of the insulating substrate 11 of the wiring board 1. For example, the insulating substrate 11 is made of an aluminum oxide sintered body and a lid made of metal is used. For example, an Fe-Ni (iron-nickel) alloy or an Fe-Ni-Co (iron-nickel-cobalt) alloy may be used. When the electronic component 2 is a solid-state image sensor or a light emitting element, the lid is not only made of a light transmissive plate made of glass or resin, but also a light transmissive lens made of glass or resin, Or you may use the cover body to which the lens was attached. Moreover, when sealing with resin, you may coat | cover the electronic component 2 with resin, such as an epoxy resin and a silicone resin. Further, when the electronic component 2 is a light emitting element, it is coated with a resin containing a phosphor, and wavelength conversion is performed by the phosphor in the resin coated with the light emitted from the light emitting element. Good.

The wiring board 1 of the present embodiment is formed by laminating a plurality of insulating layers, and is disposed along an insulating substrate 11 having a rectangular through hole 12 in plan view and a rectangular side that is an outer shape. And a plurality of through conductors 14 penetrating the insulating layer, the through conductors 14 comprising a first through conductor 141 and a second through conductor 1.
42, and the first through conductor 141 and the second through conductor 142 are formed on the upper and lower insulating layers and connected to each other, and the second through conductor 142 is orthogonal to the side. The length in the direction to be longer than the first through conductor 141. Due to such a configuration, the inner wall of the rectangular through hole 12 in a plan view is deformed so as to be convex inward in a plan view, and one of the upper and lower insulating layers is greatly displaced inward in the plane direction. Even if the length of the first through conductor 141 and the second through conductor 142 in the direction perpendicular to the side is long, the connection position between the first through conductor 141 and the second through conductor 142 is The possibility of disconnection of the first through conductor 141 and the second through conductor can be reduced only by shifting.

  According to the electronic device according to another aspect of the present invention, since the wiring board and the electronic component mounted on the wiring board are included, an electronic device having excellent electrical connection reliability can be obtained.

  Next, a method for manufacturing the wiring board 1 as described above will be described.

  In the example of the method for manufacturing the wiring substrate 1 of the first embodiment, first, a plurality of ceramic green sheets for the base 111, the first frame 112, and the second frame 113 are prepared.

  Next, holes for the through holes 12 and the through conductors 14 having a square shape in plan view are formed in each ceramic green sheet. These holes can be formed by punching by a die or punching or laser processing.

  In addition, the metalized paste 131 for the wiring conductor 13 is printed on the surface of each ceramic green sheet by screen printing, and the holes for the through conductors 14 of each ceramic green sheet are used for the through conductors 14 by screen printing. The metallized paste 141 is filled.

  Then, these ceramic green sheets are sequentially laminated and pressed in the ascending order of the holes to be the through holes 12, thereby producing a ceramic green laminate having the through holes 12. When pressing after laminating, it may be performed while heating as necessary.

  And the wiring board 1 which has the through-hole 12 is manufactured by baking the ceramic raw laminated body in which the through-hole 12 was formed at high temperature.

(Second Embodiment)
Next, an electronic device according to a second embodiment of the present invention will be described with reference to FIG.

The electronic device in this embodiment differs from the electronic device in the above-described embodiment in that
The second through conductors 142 having a long length in the direction orthogonal to the side are arranged in the vertical direction and connected.

According to the wiring board of the second embodiment, since the second through conductors 142 having a long length in the direction orthogonal to the side are arranged so as to be connected to each other, they are orthogonal to the side of the through conductor 14. Since the length in the direction is shortened and the insulating base 11 around the through conductor 14 is thickened, there is a possibility that the first through conductor 141 or the second through conductor 142 may fall off the insulating layer in the manufacturing stage of the wiring board 1. , The connection between the first through conductor 141 and the second through conductor 142 can be improved, and between the adjacent first through conductors 141 or the second through conductor. The possibility of cracks occurring between the conductors 142 can be reduced.

In the wiring board of the second embodiment, the first through conductor 141 has a circular shape, and each of the second through conductors 142 has an elliptical shape or an oval shape having two parallel sides. Second through conductor 142
Includes those that are longer than the first through conductor 141 on the opposite side of the inner wall side of the through hole 12 and those that are longer than the first through conductor 141 on the inner wall side of the through hole 12. The first through conductor 141 is connected to each of the second through conductors 142.

Here, the length in the direction parallel to the side of one of the second through conductors 142 is φ11, the length in the direction orthogonal to the side is φ12, and is parallel to the side of the through conductor 142 of the other second through conductor 142 The length in one direction is φ13, the length in the direction perpendicular to the side is φ14, the distance from the inner wall of the through hole 12 of one second through conductor 142 is L1, and the length of the other second through conductor 142 is When the distance from the inner wall of the through hole 12 is L2 and φ11 = φ31, the inner wall surface of the through hole 12 of the insulating layer in which the first through conductor 141 is embedded is insulated with the second through conductor 142 embedded. When the length of the layer protruding from the inner wall surface of the through hole 12 is L3, L3 ≧ L1−L2 ≧ 0 and φ21 + φ41 ≧ φ11 + φ31 + L3. The first through conductor 141 is connected to each of the second through conductors 142 as in the example shown in FIG. 7, and the diameter thereof is φ11 or φ31, respectively.

In the example shown in FIG. 7, φ21 = φ41, but the length in the direction perpendicular to either one of the first through conductor 141 and the second through conductor 142 is perpendicular to the other side. It may be longer than the length in the direction.

  If φ11 ≠ φ31, the length of φ11 and φ31 may be adjusted. For example, if φ11> φ31, φ21 + φ41 ≧ 2φ11 + L3.

(Third embodiment)
Next, an electronic device according to a third embodiment of the present invention will be described with reference to FIGS.

  The electronic device according to this embodiment differs from the electronic device according to the above-described embodiment in that the first through conductor 141 and the second through conductor 142 are arranged in the same insulating layer in a direction parallel to the side (y direction). It is a point arranged alternately.

According to the wiring board of the third embodiment, by increasing the distance between the second through conductors 142 that are long in the direction orthogonal to the side, the second through conductor in the manufacturing stage of the wiring board 1 is increased. 142 can be reduced from falling off the insulating layer, the connection between the first through conductor 141 and the second through conductor 142 can be improved, and the first through conductor 141 The possibility of cracks occurring between the second through conductors 142 or between the second through conductors 142 can be reduced.

  In addition, this invention is not limited to the example of the above-mentioned embodiment, A various change is possible. For example, although the wiring conductor 13 is led out to the upper surface or the lower surface of the insulating substrate 11, a cutout may be formed on the side surface of the insulating substrate 11, and the so-called castoration conductor may be led out to the inner surface of the notch. .

  In addition, as in the example shown in FIG. 11, a flat plate heat radiator 15 may be bonded to the lower surface of the insulating substrate 11 so as to cover the through hole 12. In such a case, the heat generated in the electronic component 2 mounted on the mounting surface of the heat radiating body 15 can be radiated well through the heat radiating body 15, whereby an electronic device with excellent heat dissipation can be obtained.

  The radiator 15 is made of a material having a higher thermal conductivity than the insulating substrate 11, for example, when the insulating substrate 11 is made of an aluminum oxide sintered body, copper (Cu), copper-tungsten (Cu-W) or aluminum (Al ) Or a ceramic material such as an aluminum nitride sintered body can be used.

  Further, the heat dissipation of the electronic device can be enhanced by bonding the heat dissipating body 15 to the external circuit board.

  In the case where the radiator 15 is made of a metal material, the insulating substrate 11 and the radiator 15 can be joined by, for example, providing a connection layer at a portion of the insulating substrate 11 that is in contact with the radiator 15 so that the Ag—Cu brazing is performed. It can be performed using a bonding material such as a material.

  In the example shown in FIG. 11, the flat radiator 15 is bonded to the lower surface of the insulating substrate 11, but the radiator 15 provided with a convex portion that fits into the through hole 12 is bonded. The wiring board 1 may be used.

  Further, as in the example shown in FIG. 12, the electronic component 2 may be bonded to the inner surface of the through hole 12 of the insulating substrate 11.

1 to 12, the first frame portion 112 and the second frame portion 113 are formed only on the upper surface of the base portion 111, but are formed on both the upper surface and the lower surface of the base portion 111. The wiring board 1 may be used.

In the example shown in FIGS. 1 to 12, the first through conductor 141 and the second through conductor 142 are each formed in the first frame 112, but the base 111 and the first The first through conductor 141 and the second through conductor 142 may be formed between the first frame portion 112 and the first frame portion 112 and the second frame portion 113.

Moreover, in the example shown in FIGS. 1-12, although the example of the 1st penetration conductor 141 and the 2nd penetration conductor 142 between two insulation layers is shown, the 1st across a plurality of insulation layers is shown. The through conductor 141 and the second through conductor 142 may be formed.

Further, the electronic component 2 may be bonded to the upper surface of the base 111 of the insulating base 11.

1 ... Wiring board
11 ... Insulating substrate
111 ・ ・ Base
112 ・ ・ First frame
113 ・ ・ Second frame
114 .. Third frame
12 ... Through hole
12a ... recess
12b ・ ・ Second recess
13 ... Wiring conductor
14 ... Penetration conductor
15 ... Heat radiator 2 ... Electronic component 3 ... Connecting member

Claims (2)

An insulating substrate having a plurality of insulating layers stacked and having a rectangular through hole in plan view;
A plurality of penetrating conductors arranged along the rectangular side that is an outer shape and penetrating the insulating layer;
The through conductor includes a first through conductor and a second through conductor,
The first penetrating conductor and the second penetrating conductor are formed on the insulating layers positioned above and below and connected to each other,
The wiring board, wherein the second through conductor has a length in a direction perpendicular to the side longer than that of the first through conductor. The wiring board according to claim 1;
An electronic device comprising: an electronic component mounted on the wiring board.

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