JP2015041777A - Fluorescent film pickup device for LED chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fluorescent film pickup device for an LED chip capable of easily separating a fluorescent film from a highly soft tape even in the case where the fluorescent tape is deposited to the tape or the fluorescent film deposited to the tape is small.SOLUTION: The fluorescent film pickup device comprises: a support body in which an adsorption hole is formed so as to adsorb a bottom face of a tape to which a fluorescent tape is deposited; a scraper including a contact pin in contact with the bottom face of the tape deposited to the support body, and installed in the support body in a horizontally slidable manner so as to separate the fluorescent film from the tape by scraping the bottom face of the tape to which the fluorescent film is bonded, by means of the contact pin; an operation member for moving the scraper in a horizontal direction relative to the support body; and a pickup head which is disposed at an upper side of the support body for releasing the fluorescent film by moving upwards while adsorbing the fluorescent film that is separated from the tape by the contact pin of the scraper.

Description

  The present invention relates to a fluorescent film pickup device for an LED chip, and more particularly to a fluorescent film pickup device for an LED chip that is supplied for separating a large number of fluorescent films attached to a tape and mounting them on a package or a substrate.

  In general, each fluorescent film is sawed in a state where the fluorescent film is attached to an adhesive tape, and is transferred to the next process together with the tape.

  As shown in FIG. 1, the multiple fluorescent films P attached to the tape T are sequentially separated from the tape T one by one and attached to the LED chip. Thus, the LED element which emits white light can be manufactured by attaching the fluorescent film F to the LED chip. Compared with the method of manufacturing an LED element by applying a liquid synthetic resin mixed with fluorescent substance powder to an LED chip, the method of attaching the fluorescent film F to the LED chip can adjust the thickness of the phosphor more accurately. There are advantages you can do.

  In recent years, as the size of the LED chip is reduced, the size of the fluorescent film F) attached to the LED chip has become very small, and the material of the fluorescent film is often highly flexible.

  Thus, in order to attach the small and highly flexible fluorescent film F to the LED chip, an apparatus capable of effectively separating the fluorescent film from the tape T is required.

  The present invention has been made to meet the above-described needs. Even when a fluorescent film is attached to a highly flexible tape or the fluorescent film attached to the tape is small, the fluorescent film is removed from the tape. It aims at providing the fluorescent film pick-up apparatus for LED chips which has the structure which can be isolate | separated easily.

  The fluorescent film pickup device for LED chip of the present invention for solving the above-mentioned object is a fluorescent film pickup device for LED chip that peels the fluorescent film attached to the tape from the tape, and the fluorescent film is attached to the fluorescent film pickup device. A support body in which suction holes are formed so as to adsorb the lower surface of the tape formed; a contact pin that contacts the lower surface of the tape adsorbed to the support body; and the lower surface of the tape to which the fluorescent film is bonded is in contact with the support body A scraper installed on the support body so as to be slidable in a horizontal direction so that the fluorescent film can be separated from the tape by scratching a pin; an operation for moving the scraper in a horizontal direction with respect to the support body A member; and an upper side of the support body, the contact pin of the scraper Characterized in that it comprises a; pick-up head of removing the fluorescent film by increasing by adsorbing the fluorescent film is separated from the-loop.

  The fluorescent film pickup device for LED chip of the present invention for achieving the above-described object has an effect that it can be separated from the tape and peeled off without damaging a small-sized fluorescent film.

  Moreover, the fluorescent film pick-up device for LED chips of the present invention has an effect that the fluorescent film attached to a thin tape with high flexibility can be effectively separated from the tape.

It is sectional drawing which shows the state in which the fluorescent film was adhered to the tape. It is sectional drawing explaining the fluorescent film pick-up apparatus for LED chips by one Example of this invention. It is sectional drawing explaining the fluorescent film pick-up apparatus for LED chips by one Example of this invention. It is sectional drawing explaining the fluorescent film pick-up apparatus for LED chips by one Example of this invention. It is sectional drawing explaining the fluorescent film pick-up apparatus for LED chips by one Example of this invention.

  Hereinafter, a fluorescent film pickup device for an LED chip according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  2 to 5 are sectional views illustrating a fluorescent film pickup device for LED chips according to an embodiment of the present invention.

  Referring to FIG. 2, the fluorescent film pickup device for an LED chip according to this embodiment includes a support body 10, a scraper 20, an operation member 30, and a pickup head 40.

  On the upper surface of the support body 10, a tape T with a fluorescent film P attached is disposed and supported. A suction hole 11 is formed on the upper surface of the support body 10, and a vacuum path 15 communicating with the suction hole 11 is formed at the center of the support body 10. The tape T is fixed to the upper surface of the support body 10 by the vacuum transmitted through the suction holes 11.

  An outer diameter portion 12 is formed on the outer periphery of the upper surface of the support body 10. An upper surface portion of the support body 10 surrounded by the outer diameter portion 12 is a flange portion 13. The collar portion 13 is formed lower than the outer diameter portion 12. The outer diameter portion 12 supports the peripheral portion of the fluorescent film P of the tape T to which the fluorescent film P is attached, and the flange portion 13 adsorbs and supports the portion of the tape T to which the fluorescent film P is attached.

  The scraper 20 includes a contact pin 21 and is slidably installed on the support body 10 in the horizontal direction. The contact pin 21 is installed so as to protrude from the upper surface flange 13 of the support body 10, and contacts the lower surface of the tape T. If the scraper 20 moves horizontally with respect to the support body 10, the contact pin 21 scratches the lower surface of the tape T to separate the fluorescent film P from the tape T.

  The operating member 30 is installed on the support body 10 and moves the scraper 20 in the horizontal direction with respect to the support body 10. In this embodiment, the operating member 30 includes a push member 31 and an elastic member 32. The push member 31 moves the scraper 20 by pressing it against the support body 10 in the horizontal direction. The elastic member 32 urges the scraper 20 moved in one direction by the push member 31 in the opposite direction to return to the original position.

  The push member 31 has a first inclined surface 311 formed to be inclined with respect to the vertical direction, and the scraper 20 has a first inclined surface inclined to the same angle as the first inclined surface 311 on the opposite side of the first inclined surface 311. Two inclined surfaces 22 are formed. When the push member 31 moves up and down, the scraper 20 moves in the horizontal direction with respect to the support body 10 by sliding the second inclined surface 22 of the scraper 20 with respect to the first inclined surface 311.

  The elastic member 32 is installed between the scraper 20 and the support body 10. If the push member 31 moves up, the elastic member 32 is elastically compressed by the movement of the scraper 20. When the push member 31 is lowered, the elastic member 32 moves the scraper 20 to the original position in the horizontal direction while restoring elastically.

  The pickup head 40 is installed on the upper side of the support body 10 so as to be movable up and down. The pickup head 40 descends and sucks the fluorescent film P separated from the tape T by the contact pins 21 of the scraper 20. The pick-up head 40 peels off the fluorescent film P from the tape T by moving up while adsorbing the fluorescent film P. The pickup head 40 returns after attaching the peeled fluorescent film P to the LED chip mounted on the substrate, package, lead frame, etc., and peels off the next fluorescent film P from the tape T.

  The pickup head 40 includes a collet 43 and a suction plug 41. The collet 43 is formed in a cylindrical shape, and a vacuum is transmitted through the suction path 42 inside. A suction plug 41 is attached to the end of the collet 43. The suction plug 41 made of a porous material absorbs the fluorescent film P by receiving a vacuum through the suction path 42.

  Hereinafter, the operation of the LED chip fluorescent film pickup device configured as described above will be described.

  As shown in FIG. 2, the tape T to which the fluorescent film P is attached is adsorbed on the upper surface of the support body 10. At this time, in consideration of the position of the fluorescent film P to be peeled off, a vacuum is transmitted through the suction holes 11 in a state where the fluorescent film P is arranged at the center of the flange 13 to suck the tape T.

  With the tape T adsorbed in this way, as shown in FIG. 3, the pickup head 40 is lowered and arranged on the upper side close to the fluorescent film P or arranged so as to contact one end of the fluorescent film P.

  As shown in FIG. 3, the contact pin 21 of the scraper 20 is formed so as to protrude from the flange 13, so that it comes into contact with the tape T so as to push up one side of the fluorescent film P.

  In this state, as shown in FIG. 4, when the push member 31 is raised, the scraper 20 moves to the right due to the interaction between the first inclined surface 311 and the second inclined surface 22. At this time, the elastic member 32 is elastically compressed.

  As the scraper 20 moves to the right side, the contact pin moves while scratching the tape T under the fluorescent film P. The fluorescent film P is separated from the adhesive surface of the tape T by the action of the contact pins 21, and the fluorescent film P is attracted to the pickup head 40 by the vacuum acting on the suction plug 41 of the pickup head 40. On the other hand, the tape T separated from the fluorescent film P is adsorbed on the upper surface of the flange 13 by the vacuum transmitted through the adsorption holes 11 of the support body 10.

  As shown in FIG. 5, the pickup head 40 moves up while adsorbing the fluorescent film P, and transmits the fluorescent film P to a subsequent process for joining the fluorescent film P. If the push member 31 descends, the elastic member 32 moves to a position for separating the next fluorescent film P by pressing the scraper 20 to the left while elastically restoring.

  In some cases, prior to lowering the push member 31, after releasing the vacuum of the support body 10, the tape T is moved to a position for peeling the next fluorescent film P, and the tape T is pushed in the adsorbed state. The member 31 can also be lowered. In this case, the scraper 20 is moved to the left side by the action of the elastic member 32, and the tape T at the position where the fluorescent film P is attached is scratched. The fluorescent film P is naturally separated from the tape T, and the pickup head 40 receives the fluorescent film P.

  As mentioned above, although the suitable Example of this invention was described as an example, the scope of the present invention is not limited to the form of illustration shown above.

  For example, in the above-described embodiment, the case where the operation member 30 includes the push member 31 and the elastic member 32 has been described as an example. However, an operation member having a different structure can be used. That is, any configuration that can reciprocate the scraper in the horizontal direction with respect to the support body can be used as the operating member. For example, a pneumatic actuator connected to a scraper can be used as the actuating member.

  In the above embodiment, the upper surface of the support body 10 has been described as being composed of the outer diameter portion 12 and the flange portion 13, but the support body having a flat structure without any difference in height is thus constructed. It is also possible to do.

  In the above-described embodiment, the pickup head 40 is described as including the suction plug 41 made of a porous material. However, it is possible to use a pickup head that does not include such a suction plug. That is, the pickup head can be configured such that the suction path is exposed on the lower surface, and the fluorescent film can be configured to be sucked on the lower surface of the pickup head.

  The present invention provides a fluorescent film pick-up device for LED chips that can easily separate a fluorescent film from a tape even when the fluorescent film is attached to a highly flexible tape or the fluorescent film attached to the tape is small. Applicable.

DESCRIPTION OF SYMBOLS 10 Supporting body 11 Suction hole 12 Outer diameter part 13 Gutter part 15 Vacuum path 20 Scraper 21 Contact pin 22 2nd inclined surface 30 Actuating member 31 Push member 311 1st inclined surface 32 Elastic member 40 Pickup head 43 Collet 41 Adsorption plug 42 Adsorption route T Tape P Fluorescent film.

Claims (9)

In the fluorescent film pick-up device for LED chip that peels off the fluorescent film attached to the tape from the tape,
A support body having suction holes formed so as to suck the lower surface of the tape to which the fluorescent film is attached;
A contact pin that contacts the lower surface of the tape adsorbed to the support body is provided, and the fluorescent film can be separated from the tape by scratching the lower surface of the tape to which the fluorescent film is adhered. A scraper installed on the support body to be slidable in a horizontal direction;
An actuating member for moving the scraper in a horizontal direction with respect to the support body; and by adsorbing and raising the fluorescent film disposed on the upper side of the support body and separated from the tape by a contact pin of the scraper A pickup head for peeling off the fluorescent film;
The fluorescent film pick-up apparatus for LED chips characterized by including these.   The actuating member includes: a push member that moves the scraper by pressing in one horizontal direction with respect to the support body; and an elastic member that returns the scraper moved in one direction by the push member in the opposite direction. The fluorescent film pickup device for an LED chip according to claim 1, comprising: The push member of the actuating member includes a first inclined surface formed so as to be inclined in the vertical direction, and moves up and down.
The scraper according to claim 2, wherein the scraper is installed on the support body so as to be in contact with the first inclined surface of the push member, and moves horizontally while sliding with respect to the first inclined surface. Fluorescent film pickup device for LED chip.   4. The LED chip according to claim 3, wherein the scraper includes a second inclined surface formed to contact the first inclined surface of the push member and to slide relative to the first inclined surface. Fluorescent film pickup device.   The elastic member is installed between the scraper and the support body, and is elastically compressed when the push member is raised, and is moved horizontally while being elastically restored when the push member is lowered. The fluorescent film pick-up apparatus for LED chips as described in any one of Claims 2-4 characterized by these.   The fluorescent film pickup device for an LED chip according to any one of claims 1 to 4, wherein an upper end of a contact pin of the scraper protrudes higher than an upper surface of the surrounding support body. The upper surface of the support body is formed with an outer diameter portion that supports a peripheral portion of the fluorescent film of the tape to which the fluorescent film is attached, and a portion of the tape to which the fluorescent film is attached. Including the buttocks that adsorb,
The fluorescent film pickup device for an LED chip according to claim 6, wherein the contact pin of the scraper is formed so as to protrude from a collar portion of the support body.   While the pickup head is lowered near the fluorescent film attached to the tape, the scraper contact pins move horizontally with respect to the lower surface of the tape at the position where the fluorescent film is attached. 5. The fluorescent film pickup device for LED chip according to claim 1, wherein the fluorescent film pickup device is separated from the tape and transmitted to the pickup head.   The pick-up head is made of a porous material so as to adsorb the fluorescent film by receiving a vacuum from the adsorbing path, which is installed at the end of the collet with an adsorbing path through which vacuum is transmitted. The fluorescent film pickup device for LED chip according to claim 1, further comprising an adsorption plug.

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