JP2014227300A - Double sided printer - Google Patents

Abstract

A compact double-sided printer is provided easily and inexpensively, and the printing image quality is improved. A double-sided printer includes a thermal head that prints on a substrate, and a sheet substrate supply unit that supplies a sheet substrate that is printed on both sides of the thermal head. Between the thermal head 12 and the single-wafer base material supply unit 25, a guide conveyance path 24 for guiding the single-wafer base material 1 from the single-wafer base material supply unit 25 to the thermal head 12 is provided. A reversing mechanism 20 for reversing the sheet substrate 1 returned from the thermal head 12 is connected to the guide conveyance path 24. A first grip roller 31, a second grip roller 61, and a third grip roller 63 are provided in the vicinity of the thermal head 12 or in the guide conveyance path 24, and the first protrusion region 31 a of the first grip roller 31 and the second grip roller 61. The total area of the second protrusion area 61 a and the third protrusion area 63 a of the third grip roller 63 extends over the entire width direction of the sheet substrate 1. [Selection] Figure 14

Description

  The present invention relates to a printer that prints on a sheet substrate by heat generation of a thermal head, and more particularly to a duplex printer that can perform duplex printing on a sheet substrate.

  Conventionally, as a printer that performs double-sided printing, the base material is transported from roll paper obtained by winding a base material having a receiving layer on both sides, and the dye or pigment is transferred to the base material through heating of the thermal head. Printers are known.

  In such a printer, the roll paper obtained by winding the base material is held in the paper feed unit, and duplex printing is performed on the base material by switching the feed line of the roll fed out from the paper feed unit. The printed substrate is then cut to obtain a printed sheet substrate. Further, since the roll paper fed from the paper feeding unit is sandwiched between the grip roller and the pinch roller, a grip region is formed on the roll paper. In this case, since a grip trace appears on the printing surface due to the grip area of the roll paper, a technique for making the grip trace inconspicuous has been developed.

JP 2012-125987 A

  By the way, as described above, a technology for performing double-sided printing on a base material while supplying the base material from a roll paper obtained by winding the base material has been developed, but a single-wafer base material cut in advance into a single-wafer type is prepared. In addition, it is desired to use a printer that reverses the single-wafer substrate while being conveyed by a conveyance mechanism and performs double-sided printing on the substrate. In this case, if the grip marks formed on the substrate can be made as inconspicuous as possible, the printing quality can be improved, and a compact and inexpensive double-sided printer can be realized.

  The present invention has been made in consideration of such points, and can easily reverse the sheet substrate to print on both sides of the sheet substrate, improve the printing quality, and be compact. An object of the present invention is to provide a duplex printer.

  In the double-sided printer, the present invention provides a printing unit, a sheet-fed substrate supply unit that stores sheet substrates printed on both sides and supplies the sheet-fed substrate to the printing unit, and guide conveyance for guiding the sheet-fed substrate from the sheet-fed substrate supply unit to the printing unit. The sheet substrate that is connected to the path and the guide conveyance path through the reversing mechanism connection unit and returned from the printing unit to the guide conveyance path is directed to the sheet printing substrate with one side facing the printing unit, and the other side is directed to the printing unit. And a first grip roller and a second grip roller located on the same side of the sheet substrate in the vicinity of the printing unit or in the guide conveyance path, and a first grip roller and a second grip roller, A first pinch roller and a second pinch roller each having a flat surface for sandwiching the single-wafer substrate therebetween, the first grip roller has a first protrusion region having a plurality of protrusions formed in the circumferential direction, The two-grip roller has a second protrusion region having a plurality of protrusions formed in the circumferential direction, and the first protrusion region of the first grip roller and the second protrusion region of the second grip roller are positioned in the width direction of the single-wafer substrate. Are two-sided printers characterized by different from each other.

  The present invention is a double-sided printer characterized in that a region obtained by combining the first protrusion region of the first grip roller and the second protrusion region of the second grip roller extends over the entire width direction of the sheet substrate.

  In the present invention, the first protrusion region of the first grip roller and the second protrusion region of the second grip roller each have a central portion and a peripheral portion, and the protrusion height of each central portion is higher than the protrusion height of the peripheral portion. This is a double-sided printer characterized by being expensive.

  The present invention is a double-sided printer characterized in that the peripheral edge of the first protrusion area of the first grip roller and the peripheral edge of the second protrusion area of the second grip roller partially overlap in the width direction of the sheet substrate. is there.

  The present invention is the double-sided printer characterized in that the first grip roller is provided in the vicinity of the downstream side of the printing unit in the printing process of the sheet substrate, and the second grip roller is provided in the guide conveyance path.

  The present invention is the double-sided printer, wherein the second grip roller is provided on the printing unit side of the reversing mechanism connection unit in the guide conveyance path.

  The present invention is the double-sided printer, wherein the second grip roller is provided on the sheet substrate supply part side of the reversing mechanism connection part in the guide conveyance path.

  According to the present invention, a discharge port having a second protrusion region having a plurality of protrusions formed in a circumferential direction and located on a different surface side from the second grip roller at the discharge port of the guide conveyance path. An outlet second grip roller and an outlet second pinch roller for sandwiching the sheet substrate between the outlet second grip roller and the outlet second grip roller are provided, the outlet second protrusion region of the outlet second grip roller, and the second grip The second protrusion area of the roller is a double-sided printer characterized in that the position in the width direction of the sheet substrate matches.

  According to the present invention, the guide conveyance path has a third protrusion region having a plurality of protrusions that are located on the same surface side as the first grip roller and the second grip roller with respect to the sheet substrate and that have a plurality of protrusions formed in the circumferential direction. A grip roller and a third pinch roller for sandwiching the sheet substrate are provided between the third grip roller, a first protrusion region of the first grip roller, a second protrusion region of the second grip roller, and a third grip The third protrusion area of the roller is a double-sided printer characterized in that the position of the sheet substrate in the width direction is different from each other.

  According to the present invention, the region including the first protrusion region of the first grip roller, the second protrusion region of the second grip roller, and the third protrusion region of the third grip roller extends over the entire width direction of the single-wafer substrate. A double-sided printer.

  In the present invention, the first protrusion region of the first grip roller, the second protrusion region of the second grip roller, and the third protrusion region of the third grip roller each have a central portion and a peripheral portion, The double-sided printer is characterized in that the projection height of the portion is higher than the projection height of the peripheral portion.

  In the present invention, the peripheral portion of the third protrusion region of the third grip roller is the peripheral portion of the first protrusion region of the first grip roller or the peripheral portion of the second protrusion region of the second grip roller, and the width direction of the single-wafer substrate. In the double-sided printer.

  The present invention is the double-sided printer, wherein the third grip roller is provided on the printing unit side with respect to the reversing mechanism connection unit in the guide conveyance path.

  The present invention is the double-sided printer characterized in that the third grip roller is provided on the sheet substrate supply part side of the reversing mechanism connection part in the guide conveyance path.

  The present invention provides a discharge port having a third protrusion region at the discharge port of the guide conveyance path, which is located on a different side from the third grip roller with respect to the sheet substrate and has a plurality of protrusions formed in the circumferential direction. A discharge port third pinch roller for holding the sheet substrate between the outlet third grip roller and the discharge port third grip roller is provided, and the discharge port third protrusion region of the discharge port third grip roller and the third grip The third protrusion region of the roller is a double-sided printer characterized in that the position in the width direction of the sheet substrate is the same.

  As described above, according to the present invention, it is possible to provide a compact duplex printer that can improve the printing image quality.

FIG. 1 is a schematic side view showing an embodiment of a duplex printer according to the present invention. FIG. 2 is an operation explanatory view showing the operation of the duplex printer according to the present invention. FIG. 3 is an operation explanatory view showing the operation of the duplex printer according to the present invention. FIG. 4 is an operation explanatory view showing the operation of the duplex printer according to the present invention. FIG. 5 is an operation explanatory view showing the operation of the duplex printer according to the present invention. FIG. 6 is an operation explanatory view showing the operation of the duplex printer according to the present invention. FIG. 7 is an operation explanatory view showing the operation of the duplex printer according to the present invention. FIG. 8 is an operation explanatory view showing the operation of the duplex printer according to the present invention. FIG. 9 is an operation explanatory view showing the operation of the duplex printer according to the present invention. FIG. 10 is an operation explanatory view showing the operation of the duplex printer according to the present invention. FIG. 11 is an operation explanatory view showing the operation of the duplex printer according to the present invention. FIG. 12 is an operation explanatory view showing the operation of the duplex printer according to the present invention. FIGS. 13A and 13B are views showing a sheet substrate on which double-sided printing has been performed. 14A to 14D show the positional relationship between the first grip roller, the second grip roller and the discharge port second grip roller, the third grip roller and the discharge port third grip roller, and the single-wafer substrate. FIG. FIGS. 15A to 15C are views showing a positional relationship among the first grip roller, the second grip roller and the discharge port second grip roller, and the third grip roller and the discharge port third grip roller. 16 (a) to 16 (c) show a first grip roller, a second grip roller and a discharge port second grip roller, and a center portion and a peripheral portion of each of the third grip roller and the discharge port third grip roller. FIG. FIG. 17 is a diagram showing grip marks formed on the other surface of the single-wafer base material. FIG. 18 is a diagram showing grip marks formed on one surface of a single wafer substrate.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 to 18 are views showing an embodiment of a duplex printer according to the present invention.

  Among these, FIG. 1 is a schematic side view showing a double-sided printer, FIGS. 2 to 12 are diagrams for explaining the operation of the double-sided printer, and FIGS. 13A and 13B are views showing a sheet substrate subjected to double-sided printing. .

  As shown in FIGS. 1 and 2, the double-sided printer 10 conveys a sheet substrate 1 having a receiving layer on both sides, and performs duplex printing on the sheet substrate 1 by a printing unit including a thermal head 12. It consists of a sublimation printer.

  Such a double-sided printer 10 includes a printing unit composed of a thermal head 12, a sheet base material supply unit 25 that is disposed below the thermal head 12, stores the sheet base material 1 printed on both sides, and supplies the sheet to the thermal head 12. It has.

  A guide conveyance path 24 for guiding the sheet substrate 1 from the sheet substrate supply section 25 to the thermal head 12 is installed between the thermal head 12 and the sheet substrate supply section 25, and a reversing mechanism 20 is provided in the guide conveyance path 24. It is connected. The reversing mechanism 20 inverts the single-wafer substrate 1 with one surface 1 a facing the thermal head 12 so that the other surface 1 b faces the thermal head 12 with respect to the single-wafer substrate 1 returned from the thermal head 12 to the guide conveyance path 24 side. Is.

  Such a guide conveyance path 24 and the reversing mechanism 20 are disposed below the thermal head 12, and a sheet-fed base material supply unit 25 is provided below the guide conveyance path 24 and the reversing mechanism 20, so that the duplex printer 10 is compact as a whole. It has a special structure.

  Among the above-described components, the thermal head 12 can be an existing one, and by disposing the guide conveyance path 24, the reversing mechanism 20 and the single-wafer base material supply unit 25 below the existing thermal head 12. The double-sided printer 10 can be constructed at low cost using the existing thermal head 12.

  Further, a one-side base material transport path 15a is provided on the inlet side of the thermal head 12, and another base material transport path 15b is provided on the outlet side of the thermal head 12, and these one-side base material transport path 15a and the other side are provided. The substrate conveyance path 15 is configured by the substrate conveyance path 15b.

  A platen roller 13 that holds the sheet substrate 1 is provided at a position facing the thermal head 12 with the sheet substrate 1 interposed therebetween.

  Further, the guide transport path 24 is connected to the one-side base material transport path 15a of the base material transport path 15 through an end 24a, and a switching flap (reversing mechanism connecting portion) 48 described later is provided on the guide transport path 24. A reversing mechanism 20 is connected via the via. The reversing mechanism 20 reverses the single-wafer substrate 1 with one surface 1 a of the single-wafer substrate 1 facing the thermal head 12 so that the other surface 1 b faces the thermal head 12. The reversing mechanism 20 will be described later.

  A pickup lever 25a that lifts the sheet substrate 1 placed on the lifting plate 25b in the sheet substrate supply unit 25 upward is provided below the sheet substrate supply unit 25 and is lifted by the pickup lever 25a. Of the single-wafer base material 1, the uppermost single-wafer base material 1 is sent to the guide conveyance path 24 side by the pickup roller 26.

  That is, a separation roller 27 and a paper feed roller 28 are provided on the entrance side of the guide conveyance path 24, and the uppermost sheet substrate 1 among the sheet substrates 1 lifted by the pickup lever 25 a is separated from the separation roller 27 by the pickup roller 26. It is sent to the paper feed roller 28 side. At this time, it is conceivable that the sheet substrate 1 below the uppermost sheet substrate 1 is also sent to the separation roller 27 and the feed roller 28 side together with the uppermost sheet substrate 1. Since the lower substrate 1 is in contact with the separation roller 27, it is not sent to the guide conveyance path 24 side.

  In addition, a conveyance roller 16 and a substrate conveyance mechanism 30 are provided on the one-side substrate conveyance path 15a of the substrate conveyance path 15 in order from the guide conveyance path 24 side. Further, an end detection sensor 35 that detects the end 1 </ b> B of the single-wafer substrate 1 is installed between the substrate transport mechanism 30 and the transport roller 16. In this case, the substrate transport mechanism 30 includes a first grip roller 31 and a first pinch roller 32 as described later.

  Furthermore, the guide conveyance path 24 is provided with a discharge port 55 for discharging the single-wafer substrate 1 in the guide conveyance path 24 outward. A switching flap 48 that functions as a reversing mechanism connecting portion is provided in the guide conveyance path 24 in the vicinity of the discharge port 55. Further, a cutter 19 for cutting the sheet substrate 1 is installed on the outlet side of the discharge port 55. The cutter 19 removes the margin at the front end portion and the margin at the rear end portion of the printed sheet substrate 1 and includes a fixed blade 19b and a movable blade 19a for cutting the sheet substrate 1 between the fixed blade 19b. It is made up of.

  Furthermore, a sublimation transfer ribbon 5 for performing sublimation transfer is supplied from a ribbon unwinding unit 6 to a thermal head 12 serving as a printing unit. The ribbon 5 supplied from the ribbon unwinding unit 6 is used when performing sublimation transfer printing in the thermal head 12, and then the used ribbon 5 is wound on the ribbon winding unit 7.

  Next, a reversing mechanism 20 for reversing the single-wafer substrate 1 and directing the single-wafer substrate 1 with one surface 1a facing the thermal head 12 to the other surface 1b toward the thermal head 12 will be described.

  The reversing mechanism 20 is connected to a switching flap 48 of the guide conveyance path 24 via an introduction path 47, and a feed roller 47 a is provided at the end of the introduction path 47 on the guide conveyance path 24 side.

  Such a reversing mechanism 20 includes a storage shell 21 that has a cylindrical inner peripheral surface 21 a and is rotatably disposed, and a drive mechanism 52 that rotates the storage shell 21. Among these, the storage shell 21 is rotatable about a rotation shaft 45 extending in the vertical direction, and the storage shell 21 is rotated by a drive mechanism 52. The drive mechanism 52 includes a drive motor 52 a and a transmission mechanism 52 b that transmits the rotation from the drive motor 52 a to the rotary shaft 45.

  As described above, the storage shell 21 has a cylindrical inner peripheral surface 21 a, and one side opening 22 a for introducing the single-wafer base material 1 into the storage shell 21 is provided on one side of the storage shell 21. The other side opening 22b which discharges the sheet | seat base material 1 in the storage shell 21 is provided in the other side.

  The single-wafer substrate 1 introduced into the storage shell 21 is moved along a cylindrical inner peripheral surface 21 a by a feed roller 50 provided in the storage shell 21. Further, a position detection sensor 46 for detecting the position of the single-wafer base material 1 that moves along the inner peripheral surface 21 a is provided in the storage shell 21.

  Further, in the guide conveyance path 24, the second grip roller 61 and the second pinch roller 62, the third grip roller 63 and the third pinch roller 64 are disposed on the sheet substrate supply unit 25 side from the switching flap (reversing mechanism connecting portion) 48. And are provided.

  In this case, the single-wafer base material 1 fed from the single-wafer base material supply unit 25 is sandwiched and conveyed by the second grip roller 61 and the second pinch roller 62, and the single-wafer base material 1 is conveyed by the third grip roller 63 and the third pinch roller 64. Is further pinched and conveyed.

  As shown in FIGS. 1 and 2, the second grip roller 61 and the third grip roller 63 are located on the same surface side as the first grip roller 31 with respect to the single-wafer substrate 1. That is, for example, when the other surface 1b of the single-wafer substrate 1 faces the first grip roller 31 side, the other surface 1b similarly faces the second grip roller 61 and the third grip roller 63 side.

  Next, the first grip roller 31, the second grip roller 61, and the third grip roller 63 will be described in more detail with reference to FIGS.

  As shown in FIGS. 14 to 16, the first grip roller 31 has a pair of first projection regions 31a having a plurality of projections 70 formed in the circumferential direction, and the first pinch roller 32 is arranged in the circumferential direction. It has a flat surface that extends. In this case, each 1st projection area | region 31a of the 1st grip roller 31 is located in the both ends of the 1st grip roller 31, and is provided corresponding to the width direction both ends of the sheet | seat base material 1 (FIG. 14). (See (a), (b) and FIG. 15 (a)).

  Each first projection region 31 a of the first grip roller 31 has a central portion 71 and a peripheral portion 72 located on both sides of the central portion 71, and the height of the protrusion 70 of the central portion 71 is the height of the peripheral portion 72. The height of the protrusion 70 is higher than the height of the protrusion 70, that is, the height of the protrusion 70 of the peripheral edge 72 is lower than the height of the protrusion 70 of the central portion 71 (see FIG. 16A).

  The second grip roller 61 has a pair of second protrusion regions 61a having a plurality of protrusions 70 formed in the circumferential direction, and the second pinch roller 62 has a flat surface extending in the circumferential direction. In this case, each 2nd protrusion area | region 61a of the 2nd grip roller 61 is located in the both sides of the 2nd grip roller 61, and is provided corresponding to the width direction both sides of the sheet | seat base material 1 (FIG. 14 (a)). (See (c) and FIG. 15 (b)).

  Each second protrusion region 61 a of the second grip roller 61 has a central portion 71 and a peripheral portion 72 located on both sides of the central portion 71, and the height of the protrusion 70 of the central portion 71 is the height of the peripheral portion 72. The height of the protrusion 70 is higher than the height of the protrusion 70, that is, the height of the protrusion 70 of the peripheral edge 72 is lower than the height of the protrusion 70 of the central portion 71 (see FIG. 16B).

  The third grip roller 63 has a third protrusion region 63a having a plurality of protrusions 70 formed in the circumferential direction, and the third pinch roller 64 has a flat surface extending in the circumferential direction. In this case, the 3rd projection area | region 63a of the 3rd grip roller 63 is located in the center part of the 3rd grip roller 63, and is provided corresponding to the center part of the sheet | seat base material 1 (FIG. 14 (a)). (See (d) and FIG. 15 (c)).

  The third protrusion region 63 a of the third grip roller 63 has a central portion 71 and a peripheral portion 72 located on both sides of the central portion 71, and the height of the protrusion 70 of the central portion 71 is the protrusion of the peripheral portion 72. The height of the protrusion 70 at the peripheral edge 72 is lower than the height of the protrusion 70 at the center 71 (see FIG. 16C).

  Furthermore, as shown in FIGS. 14A to 14D and FIGS. 15A to 15C, a pair of first protrusion regions 31a and 31a of the first grip roller 31 and a pair of second grip roller 61 are provided. The second protrusion areas 61a and 61a and the third protrusion area 63a of the third grip roller 63 are different from each other in the position in the width direction of the single-wafer substrate 1.

  In addition, the region where the pair of first protrusion regions 31 a and 31 a of the first grip roller 31, the pair of second protrusion regions 61 a and 61 a of the second grip roller 61 and the third protrusion region 63 a of the third grip roller 63 is combined. And across the entire width direction of the single-wafer substrate 1 (see FIGS. 14A, 14B, 14C, and 14D). For this reason, for example, when the other surface 1b of the single-wafer substrate 1 faces the first grip roller 31, the second grip roller 61, and the third grip roller 63, the first protrusion regions 31a, 31a, A grip mark G (see FIG. 17) is formed in the entire width direction of the other surface 1b of the single-wafer substrate 1 by the second protrusion areas 61a and 61a of the two grip rollers 61 and the third protrusion area 63a of the third grip roller 63. be able to. For this reason, the boundary between the portion where the grip mark G is formed and the portion where the grip mark G is not formed does not appear on the other surface 1b of the single-wafer substrate 1, and is uniform over the entire width direction of the other surface 1b. Printing can be performed, and the print quality can be improved.

  Specifically, first, a grip mark G is formed on the other surface 1 b of the sheet substrate 1 by the second protrusion regions 61 a and 61 a of the second grip roller 61, and the third protrusion region 63 a of the third grip roller 63. A grip mark G is formed. Then, the grip marks G are formed by the first protrusion areas 31 a and 31 a of the first grip roller 31. The second protrusion areas 61 a and 61 a of the second grip roller 61 and the third protrusion of the third grip roller 63 are formed. Due to the region 63a and the first protrusion regions 31a and 31a of the first grip roller 31, uniform printing can be performed on the other surface 1b of the single-wafer substrate 1 in the entire width direction.

  As shown in FIGS. 15A, 15B, and 16C and FIGS. 16A, 16B, and 16C, the peripheral edge 72 of the first protrusion region 31a of the first grip roller 31 and the second grip roller 61 between the peripheral edge 72 of the second protrusion area 61 a and between the peripheral edge 72 of the second protrusion area 61 a of the second grip roller 61 and the peripheral edge 72 of the third protrusion area 63 a of the third grip roller 63. Are partially overlapped in the width direction of the sheet substrate 1.

  For this reason, the grip marks G can be continuously formed in the entire width direction of the single-wafer substrate 1 without forming the steps of the grip marks G.

  Further, between the discharge port 55 and the cutter 19, there are provided a discharge port second grip roller 65 and a discharge port second pinch roller 66 for sandwiching the sheet substrate 1 between the discharge port second grip roller 65. Further, the discharge port third grip roller 67 is disposed upstream of the discharge port second grip roller 65 and the discharge port second pinch roller 66, and the sheet substrate 1 is sandwiched between the discharge port third grip roller 67 and the discharge port third grip roller 67. An outlet third pinch roller 68 is provided.

  In this case, the discharge port second grip roller 65 forms a grip mark G on the surface of the single-wafer substrate 1 that is different from the second grip roller 61. For example, when the second grip roller 61 forms the grip mark G on the other surface 1 b of the sheet substrate 1, the discharge mark second grip roller 65 forms the grip mark G on the one surface 1 a of the sheet substrate 1.

  Similarly, the discharge port third grip roller 67 is configured to form a grip mark G on the surface of the single-wafer substrate 1 that is different from the third grip roller 63. For example, when the grip mark G is formed on the other surface 1 b of the sheet substrate 1 by the third grip roller 63, the grip mark G is formed on the one surface 1 a of the sheet substrate 1 by the discharge third grip roller 67.

  Next, the discharge port second grip roller 65 and the discharge port second pinch roller 66, and the discharge port third grip roller 67 and the discharge port third pinch roller 68 will be further described below.

  As shown in FIGS. 14 to 16, the discharge port second grip roller 65 has a pair of discharge port second protrusion regions 65a having a plurality of protrusions 70 formed in the circumferential direction, and the discharge port second pinch roller. 66 has a flat surface extending in the circumferential direction. In this case, each of the discharge port second protrusion regions 65 a of the discharge port second grip roller 65 is located on both sides of the discharge port second grip roller 65 and is provided corresponding to both sides in the width direction of the single-wafer substrate 1. (See FIGS. 14A and 14C and FIG. 15B).

  Each discharge port second protrusion region 65a of the discharge port second grip roller 65 has a center portion 71 and a peripheral edge portion 72 located on both sides of the center portion 71. The height of the protrusion 70 of the center portion 71 is as follows. The height of the protrusion 70 of the peripheral portion 72 is higher, that is, the height of the protrusion 70 of the peripheral portion 72 is lower than the height of the protrusion 70 of the central portion 71 (see FIG. 16B).

  The discharge port third grip roller 67 has a discharge port third protrusion region 67a having a plurality of protrusions 70 formed in the circumferential direction, and the discharge port third pinch roller 68 has a flat surface extending in the circumferential direction. . In this case, the discharge port third protrusion region 67 a of the discharge port third grip roller 67 is located at the center of the discharge port third grip roller 67 and is provided corresponding to the center of the single-wafer substrate 1. (See FIGS. 14 (a) (d) and 15 (c)).

  The discharge port third protrusion region 67a of the discharge port third grip roller 67 has a central portion 71 and a peripheral edge portion 72 located on both sides of the central portion 71. The height of the protrusion 70 of the central portion 71 is the peripheral edge. The height of the protrusion 70 of the portion 72 is higher, that is, the height of the protrusion 70 of the peripheral portion 72 is lower than the height of the protrusion 70 of the central portion 71 (see FIG. 16C).

  Furthermore, as shown in FIGS. 14A to 14D and FIGS. 15A to 15C, the pair of first protrusions 31a and 31a of the first grip roller 31 and the discharge port second grip roller 65 are provided. The pair of discharge port second protrusion regions 65 a and 65 a and the discharge port third protrusion region 67 a of the discharge port third grip roller 67 are different from each other in the width direction position of the single-wafer substrate 1.

  In addition, the pair of first protrusion areas 31 a and 31 a of the first grip roller 31, the pair of discharge opening second protrusion areas 65 a and 65 a of the discharge opening second grip roller 65, and the discharge opening third of the discharge opening third grip roller 67. The combined region of the protruding regions 67a extends over the entire width direction of the single-wafer substrate 1 (see FIGS. 14A, 14B, 14C, and 14D). For this reason, for example, when one surface 1a of the sheet substrate 1 faces the first grip roller 31, the discharge port second grip roller 65, and the discharge port third grip roller 67, the first protrusion region 31a of the first grip roller 31 is provided. 31a, the discharge port second protrusion regions 65a and 65a of the discharge port second grip roller 65 and the discharge port third protrusion region 67a of the discharge port third grip roller 67, the entire width direction of one surface 1a of the single-wafer substrate 1 A grip mark G can be formed on the surface. For this reason, the boundary between the portion where the grip mark G is formed and the portion where the grip mark G is not formed does not appear on one surface 1a of the single-wafer substrate 1, and is uniform over the entire width direction of the one surface 1a. Printing can be performed, and the print quality can be improved.

  Specifically, first, grip marks G are formed on the one surface 1 a of the single-wafer substrate 1 by the first protrusion regions 31 a and 31 a of the first grip roller 31. Next, a grip mark G is formed on one surface 1 a of the single-wafer substrate 1 by the discharge port second protrusion region 65 a of the discharge port second grip roller 65 and the discharge port third protrusion region 67 a of the discharge port third grip roller 67. However, the first projection regions 31 a and 31 a of the first grip roller 31, the discharge port second projection regions 65 a and 65 a of the discharge second grip roller 65, and the discharge port third projection region of the discharge port third grip roller 67. With 67a, uniform printing can be performed on the entire surface in the width direction on one surface 1a of the sheet substrate 1.

  15A, 15B, 16C, and 16A, 16B, 16C, the peripheral edge 72 of the first projection region 31a of the first grip roller 31 and the second outlet port. Between the discharge port second protrusion region 65a of the grip roller 65 and the peripheral edge 72 of the discharge port second grip roller 65, and the discharge port of the discharge port second protrusion region 65a and the discharge port of the discharge port third grip roller 67. A part of the third protrusion region 67 a overlaps with the peripheral edge portion 72 in the width direction of the sheet substrate 1.

  For this reason, the grip marks G can be continuously formed in the entire width direction of the single-wafer substrate 1 without forming the steps of the grip marks G.

  By the way, the above-mentioned constituent members, for example, the drive motor 52 a of the drive mechanism 52, the feed roller 50, the substrate transport mechanism 30 including the first grip roller 31, the roll-shaped substrate supply unit 42, the thermal head 12, the ribbon unwinding unit 6 , Ribbon winding unit 7, transport roller 16, cutter 19, pickup lever 25 a, pickup roller 26, separation roller 27, paper feed roller 28, second grip roller 61, third grip roller 63, discharge port second grip roller 65 , And the discharge port second grip roller 67 are all driven and controlled by the control device 11, and all of these components and the control device 11 are housed in the housing 10A.

  Further, the control device 11 includes a drive control unit for a conveyance mechanism that performs high-precision drive control of the substrate conveyance mechanism 30 and performs multicolor printing by the thermal head 12 with high accuracy.

  Next, the base material transport mechanism 30 and the edge detection sensor 35 for transporting the single-wafer base material 1 will be further described.

  As shown in FIG. 1, a base material transport mechanism 15 that transports the single-wafer base material 1 between the thermal head 12 and the transport roller 16 in the one-side base material transport path 15 a of the base material transport path 15, An end detection sensor 35 is installed in order from the thermal head 12 side.

  Of these, the substrate transport mechanism 30 includes the first clip roller 31 and the first pinch roller 32 that presses the single-wafer substrate 1 toward the first grip roller 31 as described above.

  Further, an end detection sensor 35 is provided adjacent to the transport roller 16 side of the substrate transport mechanism 30, and the end 1 B of the single-wafer substrate 1 can be detected by the end detection sensor 35. A detection signal from the end detection sensor 35 is sent to the drive control unit of the transport mechanism in the control device 11. The drive control unit drives and controls the friction roller 30 based on a signal from the end detection sensor 35, adjusts the position of the end 1B of the sheet substrate 1, and performs multicolor printing by the thermal head 12 with high accuracy. can do.

  Next, the operation of the present embodiment having such a configuration will be described with reference to FIGS.

  That is, as shown in FIGS. 1 to 13, double-sided printing is performed by the thermal head 12 on the sheet substrate 1 housed in the sheet substrate supply unit 25.

  First, as shown in FIGS. 1 and 2, a large number of single-wafer base materials 1 are stacked in a single-wafer base material supply unit 25.

  From this state, the pickup lever 25a lifts the elevating plate 25b in the single-wafer base material supply unit 25. At this time, the single-wafer substrate 1 placed on the lifting plate 25b is also lifted in the same manner.

  Thereafter, the uppermost sheet substrate 1 of the sheet substrates 1 placed on the elevating plate 25 b is sent by the pickup roller 26 to the separation roller 27 and paper feed roller 28 side. At this time, one surface 1a of the sheet substrate 1 faces upward, and the other surface 1b faces downward.

  At this time, the conveyance roller 16 on the side of the one-side substrate conveyance path 15 a rotates in synchronization with the pickup roller 26, the separation roller 27, and the paper feed roller 28.

  Next, the single-wafer base material 1 sent to the separation roller 27 and the paper feed roller 28 side by the pickup roller 26 is then sent to the base material transport path 15 side through the guide transport path 24. By the way, when the uppermost sheet substrate 1 is conveyed among the sheet substrates 1 in the sheet substrate supply unit 25, the lower sheet substrates 1 other than the uppermost sheet substrate 1 are also sent to the separation roller 27 and the sheet feeding roller 28 side. However, since the lower sheet substrate 1 other than the uppermost sheet substrate 1 is in contact with the separation roller 27, only the uppermost sheet substrate 1 is fed from the guide conveyance path 24 side to the substrate conveyance path 15 side. It is done.

  In this case, the pickup lever 25a is lowered at the same time when the rear end 1B of the sheet substrate 1 is detected by a detection sensor (not shown) provided in the guide conveyance path 24, and accordingly, the sheet substrate supply unit. The lift plate 25b in 25 and the sheet substrate 1 on the lift plate 25b are also lowered (see FIG. 3).

  During this time, the single-wafer substrate 1 is sandwiched between the second grip roller 61 and the second pinch roller 62, and then sandwiched between the third grip roller 63 and the third pinch roller 64, and sequentially conveyed, and the single-wafer substrate 1 1 reaches the transport mechanism 30. Next, the sheet substrate 1 is pressed against the first grip roller 31 side by the first pinch roller 32 in the transport mechanism 30. Therefore, by driving the first grip roller 31 by the drive control unit of the control device 11, the single-wafer substrate 1 can be reliably conveyed by the first grip roller 31. In addition, since the other surface 1b is conveyed toward the 2nd grip roller 61, the 3rd grip roller 63, and the 1st grip roller 31 side, the sheet | seat base material 1 conveys the 2nd grip to the other surface 1b of the sheet | seat base material 1. A grip mark G is formed by the second protrusion areas 61 a and 61 a of the roller 61, the third protrusion area 63 a of the third grip roller 63, and the first protrusion areas 31 a and 31 a of the first grip roller 31.

  In the present embodiment, as described above, the grip marks G are formed on the other surface 1b of the single-wafer substrate 1 by the second protrusion regions 61a and 61a of the second grip roller 61, and the third grip roller 63 A grip mark G is formed by the three protrusion regions 63a. Next, the grip marks G are formed by the first protrusion areas 31 a and 31 a of the first grip roller 31. The second protrusion areas 61 a and 61 a of the second grip roller 61 and the third protrusion area of the third grip roller 63 are formed. 63a and the first protrusion regions 31a and 31a of the first grip roller 31 are combined over the entire width direction of the single-wafer base material 1, so that the uniform grip is provided over the entire width direction of the other surface 1b of the single-wafer base material 1. A mark G can be formed.

  Thereafter, the single-wafer base material 1 is sent to the other-side base material conveyance path 15b side.

  At this time, the pickup roller 26, the separation roller 27, and the paper feed roller 28 all stop.

  Next, as shown in FIG. 4, printing by sublimation transfer is performed on the one surface 1 a of the sheet substrate 1 by the thermal head 12.

  At this time, the single-wafer base material 1 is directed from the other side base material transport path 15b of the base material transport path 15 toward the one side base material transport path 15a by the transport roller 16 and the transport mechanism 30. Further, a ribbon 5 for sublimation transfer is supplied from the ribbon unwinding section 6 to the thermal head 12 side, and the dye or pigment on the ribbon 5 side is transferred to one surface 1 a of the sheet substrate 1 by heat from the thermal head 12. Can do.

  The sublimation transfer ribbon 5 has Y (yellow), M (magenta), C (cyan), and OP (overcoat) regions, and Y printing is first performed by the Y region of the ribbon 5.

  In this way, in the thermal head 12, Y printing is performed on one surface 1 a of the sheet substrate 1 by the sublimation transfer ribbon 5. The printed single-wafer base material 1 on which Y printing has been performed is sent to the one-side base material transport path 15a of the base material transport path 15, and then the single-wafer base material 1 is guided from the end 24a having functions of an inlet and an outlet. Enter 24.

  Next, the single-wafer base material 1 in the guide transport path 24 is sent again from the one-side base material transport path 15a to the other-side base material transport path 15b side. Thereafter, in the same manner as described above, in the thermal head 12, M printing and C printing are sequentially performed on one surface 1a of the sheet substrate 1 using the sublimation transfer ribbon 5 to complete the multicolor printing, and then the sheet substrate An overcoat layer is formed on one surface 1a.

  In this way, the single-wafer base material 1 is transported and returned from the other-side base material transport path 15b to the one-side base material transport path 15a by the transport mechanism 30, and Y printing is performed on one surface 1a of the single-wafer base material 1 by the thermal head 12. M printing and C printing are performed to form an overcoat layer.

  Next, referring to FIG. 17, a process of performing multicolor printing on one surface 1 a of the sheet substrate 1 by the thermal head 12 will be described. A first grip roller 31 and a first pinch roller 32 are disposed in the vicinity of the downstream side of the thermal head 12 in the printing process.

  As shown in FIG. 17, multicolor printing is performed on one surface 1 a of the sheet substrate 1 by the thermal head 12. In this case, the second grip roller 61, Grip marks G are formed in the entire width direction of the sheet substrate 1 by the three grip rollers 63 and the first grip rollers 31. At this time, the grip marks G are not formed on the one surface 1a of the single-wafer substrate 1.

  When the single-wafer base material 1 is transported and returned from the other base material transport path 15b to the one-side base material transport path 15a side by the transport mechanism 30, the end portion 1B of the single-wafer base material 1 is detected by the end detection sensor 35, and the end section A detection signal from the detection sensor 35 is sent to the drive control unit of the transport mechanism of the control device 11.

Then, the drive control unit controls the drive of the first grip roller 31 based on the signal from the end detection sensor 35, thereby adjusting the position of the front end 1 </ b> B of the single-wafer substrate 1.

  That is, a slight slip occurs between the first grip roller 31 and the sheet substrate 1 during the conveyance of the sheet substrate 1 by the conveyance mechanism 30, and the position shift slightly between the first grip roller 31 and the sheet substrate 1. It can also occur.

  In this case, the drive control unit of the control device 11 can control the driving of the first grip roller 31 based on the signal from the end detection sensor 35 and adjust the position of the front end 1B of the single-wafer substrate 1. . Such positional adjustment of the sheet substrate 1 by the drive control unit of the control device 11 is performed each time printing of each color (Y printing, M printing, C printing) and when an overcoat layer is formed. . For this reason, the position adjustment of the sheet | seat base material 1 can be performed reliably, and the highly accurate multicolor printing by the thermal head 12 is realizable.

  In this way, the thermal head 12 performs printing by sublimation transfer on the one surface 1a of the sheet substrate 1, and the multicolor printing on the one surface 1a of the sheet substrate 1 is completed.

  Thereafter, as shown in FIG. 5, the reversing operation of the single-wafer substrate 1 in the reversing mechanism 20 is performed.

  That is, the sheet substrate 1 printed on one surface 1a is returned into the guide conveyance path 24, and then the sheet substrate 1 enters the introduction path 47 from the guide conveyance path 24 by the feed roller 47a. Next, the single-wafer base material 1 is led into the storage shell 21 through the introduction path 47 from the one side opening 22a with the end 1B at the head (see FIG. 5).

  At this time, the switching flap 48 in the guide conveyance path 24 is switched in advance, and the single-wafer substrate 1 returned into the guide conveyance path 24 by the switching flap 48 is guided to the introduction path 47 side by the feed roller 47a. ing.

  The single-wafer substrate 1 guided into the storage shell 21 is then moved along the cylindrical inner peripheral surface 21a of the storage shell 21 by the feed roller 50 (see FIG. 5).

  Thereafter, as shown in FIG. 6, the end portion 1 </ b> A of the single-wafer substrate 1 is detected by the position detection sensor 46, and the control device 11 stops driving the feed roller 50 based on a signal from the position detection sensor 46.

  In this case, as shown in FIG. 6, the single-wafer base material 1 is disposed along the inner peripheral surface 21 a of the storage shell 21, and both end portions 1 </ b> A and 1 </ b> B of the single-wafer base material 1 are located in the vicinity of the other opening 22 b of the storage shell 21.

  Next, the drive motor 52a is rotated by the control device 11, and the storage shell 21 is rotated by 180 ° about the rotation shaft 45 (see FIG. 7).

  Thus, when the storage shell 21 rotates 180 ° about the rotation shaft 45, the other side opening 22b of the storage shell 21 faces the introduction path 47 side.

  Next, as shown in FIG. 8, the feed roller 50 in the storage shell 21 is driven again, and the sheet substrate 1 arranged along the inner peripheral surface 21a of the storage shell 21 is introduced from the end 1A by the feed roller 50. It is sent to the road 47 side.

  In this way, the reversing mechanism 20 ends the reversing action of the single-wafer substrate 1.

  By such a reversing action by the reversing mechanism 20, the single-wafer substrate 1 with one surface 1 a facing the thermal head 12 can be reversed so that the other surface 1 b faces the thermal head 12. Further, the single-wafer base material 1 is introduced into the storage shell 21 from the end 1B, and the single-wafer base material 1 is sent out from the storage shell 21 so that the end 1B becomes the rear end.

  For this reason, as for the sheet | seat base material 1, the edge part 1B faces the storage shell 21 side in the case of both before inversion and after inversion.

  Thereafter, the single-wafer substrate 1 is sent from the guide conveyance path 24 to the other-side substrate conveyance path 15b (see FIG. 9).

  Thereafter, as shown in FIG. 10, Y printing is first performed on the other surface 1 b of the sheet substrate 1 using the sublimation transfer ribbon 5 by the thermal head 12 in the same manner as described above.

  Thereafter, M printing and C printing are sequentially performed on the other surface 1b of the sheet substrate 1 using the sublimation transfer ribbon 5, and then an overcoat layer is formed on the other surface 1b of the sheet substrate 1. In this way, multicolor printing on the other surface 1b of the sheet substrate 1 is completed.

  Next, with reference to FIG. 18, a process of performing multicolor printing on the other surface 1b of the sheet substrate 1 by the thermal head 12 will be described.

  As shown in FIG. 18, multicolor printing is performed on the other surface 1 b of the sheet substrate 1 by the thermal head 12. In this case, the second grip roller 61 and the second surface 1 b are formed on the other surface 1 b of the sheet substrate 1. A grip mark G is formed in advance in the entire width direction of the sheet substrate 1 by the three grip roller 63 and the first grip roller 31. For this reason, printing is performed on the other surface 1b on which the grip marks G are formed over the entire width direction.

  During this time, the grip marks G are formed on the printed one surface 1 a of the sheet substrate 1 by the first protrusion regions 31 a and 31 a of the first grip roller 31. In this case, the grip marks G on the one surface 1a are formed so as to step on the printed portion.

  Further, as shown in FIG. 11, the storage shell 21 is rotated 180 ° again around the rotation shaft 45 by the drive mechanism 52, and the storage shell 21 assumes the original posture. In this case, the one side opening 22a of the storage shell 21 faces the introduction path 47 side.

  Next, the sheet substrate 1 on which both sides are printed on both sides 1a and 1b is guided from the guide conveyance path 24 through the introduction path 47 into the storage shell 21 through the one side opening 22a.

  Thereafter, after all the single-wafer base materials 1 in the guide conveyance path 24 enter the introduction path 47 side, the feed roller 47a of the introduction path 47 and the feed roller 50 of the storage shell 21 are reversed to be guided into the introduction path 47 and the storage shell 21. The single-wafer substrate 1 that has been placed is sent from the introduction path 47 to the discharge port 55 (see FIG. 12). In this case, the switching flap 48 is switched in advance, and the single-wafer substrate 1 in the introduction path 47 can be smoothly sent out to the discharge port 55 side.

  Next, the sheet substrate 1 is sent to the discharge port second grip roller 65 and the discharge port third grip roller 67 side, and the discharge port second protrusion regions 65a and 65a of the discharge port second grip roller 65 and the discharge port third grip roller. A grip mark G is formed on one surface 1a of the single-wafer substrate 1 by the 67 discharge port third protrusion regions 67a.

  As described above, the grip marks G are formed on the one surface 1 a of the sheet substrate 1 by the first protrusion regions 31 a and 31 a of the first grip roller 31. Next, a grip mark G is formed by the discharge port second protrusion regions 65a and 65a of the discharge port second grip roller 65 and the discharge port third protrusion region 67a of the discharge port third grip roller 67. These first grip rollers The first projection regions 31a and 31a of the discharge port 31, the discharge port second projection regions 65a and 65a of the discharge port second grip roller 65, and the discharge port third projection region 67a of the discharge port third grip roller 67 are combined, Since it extends over the entire width direction of the single-wafer substrate 1, a uniform grip mark G can be formed on one surface 1a of the single-wafer substrate 1 over the entire width direction.

  Next, the blank space at the front end portion (end portion 1 </ b> A) that is not printed in the sheet substrate 1 is removed by the cutter 19.

  Further, the single-wafer substrate 1 is discharged outward from the discharge port 55, and then the margin of the rear end portion (end portion 1 </ b> B) of the single-wafer substrate 1 is removed by the cutter 19.

  In this way, the single-sided substrate 1 that has been printed on both the one surface 1a and the other surface 1b, the front end margin and the rear end margin are removed, and the entire surface printed is removed from the discharge port 55. It is discharged to the direction and taken out as a product.

  By the way, as for the sheet | seat base material 1, the edge part 1B faces the storage shell 21 side in both the cases before inversion and after inversion. For this reason, the single-wafer base material 1 sent from the other-side base material conveyance path 15b side to the thermal head 12 side is always introduced into the thermal head 12 from the end 1B and printed by the thermal head 12. This makes it possible to shorten the length of the margin when removing the margin at the front end portion (end portion 1A) and the margin at the rear end portion (end portion 1B) that are not printed by the cutter 19.

  That is, as shown in FIG. 13A, the single-wafer substrate 1 is always sent from the end 1B to the thermal head 12 side in both cases before and after inversion. Printing is performed on the other surface 1b.

  When printing is performed on the sheet substrate 1 by the thermal head 12, the area between the first grip roller 31 and the pinch roller 32 and the thermal head 12 in the sheet substrate 1 must be removed as a blank.

  According to the present embodiment, the sheet substrate 1 is always introduced from the end portion 1B to the thermal head 12 for printing in both cases before and after inversion. For this reason, the area to be removed as a margin between the first grip roller 31 and the pinch roller 32 and the thermal head 12 is either the front side (one side 1a) or the back side (the other side 1b) of the single-wafer substrate 1. Can also be brought to the end 1B side.

  For this reason, by removing the margin on the end 1B side of the single-wafer substrate 1 by the cutter 19, the predetermined margin of the single-wafer substrate 1 can be surely removed. Although it is necessary to remove the margin on the end portion 1A side of the single-wafer substrate 1, the margin on the end portion 1A side is arbitrary and can be formed shorter than the margin on the end portion 1B side.

  On the other hand, before the sheet substrate 1 is reversed, the sheet substrate 1 is introduced into the thermal head 12 from the end 1B and printing is performed. After the sheet substrate 1 is reversed, the sheet substrate 1 is introduced into the thermal head 12 from the end 1A. When printing is performed (see FIG. 13B), an area to be removed as a margin between the first grip roller 31 and the pinch roller 32 and the thermal head 12 is the end 1A side (front side) of the sheet substrate 1. It comes to the end 1B side (back side). For this reason, the length of the margin to be removed by the cutter 19 is increased.

  On the other hand, according to the present embodiment, a region to be removed as a margin between the first grip roller 31 and the pinch roller 32 and the thermal head 12 is always brought to the end 1B side of the single-wafer substrate 1. And the length of the margin to be removed can be shortened.

  As described above, according to the present embodiment, the orientation of the single-wafer base material 1 can be easily and reliably achieved simply by introducing the single-wafer base material 1 into the storage shell 21 of the reversing mechanism 20 and rotating the storage shell 21 by 180 °. Sublimation transfer printing can be easily performed by the thermal head 12 on both sides 1a and 1b of the sheet substrate 1 thus reversed.

  The other surface 1 b of the single-wafer substrate 1 is formed by the first protrusion regions 31 a and 31 a of the first grip roller 31, the second protrusion regions 61 a and 61 a of the second grip roller 61 and the third protrusion region 63 a of the third grip roller 63. The grip marks G can be formed over the entire width direction, and the first protrusion areas 31a and 31a of the first grip roller 31, the discharge opening second protrusion areas 65a and 65a of the discharge opening second grip roller 65, and A grip mark G can be formed on one surface 1a of the single-wafer substrate 1 over the entire width direction by the discharge port third protrusion region 67a of the discharge port third grip roller 67. For this reason, the boundary between the part where the grip marks are formed and the part where the grip marks are not formed or the step difference of the grip marks does not appear on the one surface 1a and the other surface 1b of the sheet substrate 1, thereby improving the printing quality. Can be made.

  A single grip roller is used without using all of the first grip roller 31, the second grip roller 61, the third grip roller 63, the discharge port second grip roller 65, and the discharge port third grip roller 67. Although it is conceivable to form a grip mark in the entire width direction of the single-wafer base material 1, it is difficult to apply a predetermined pressing force over the entire width direction of the single-wafer base material 1 when using a single grip roller, In order to give a predetermined pressing force, the grip roller becomes large.

  On the other hand, according to the present embodiment, the first grip roller 31, the second grip roller 61, and the third grip roller 63 are used to form the grip marks G on the other surface 1b of the single-wafer substrate 1, and the first Since the grip marks G are formed on the one surface 1a of the single-wafer substrate 1 by using the grip roller 31, the discharge port second grip roller 65, and the discharge port third grip roller 67, respectively, the entire width direction of the single-wafer substrate 1 is measured. The grip rollers 31, 61, 63, 65 and 67 can apply a uniform and stable pressing force.

  In addition, since the guide conveyance path 24, the reversing mechanism 20, and the sheet-fed base material supply unit 25 are disposed below the thermal head 12, the shape of the entire duplex printer 10 can be made compact. Thus, since the double-sided printer 10 has a compact configuration as a whole, for example, even if the sheet substrate 1 is clogged, the location of the sheet substrate 1 can be easily set inside the case 10A by opening the case 10A. You can check it out.

  Furthermore, by using the existing thermal head 12, the double-sided printer 10 can be easily and inexpensively manufactured simply by installing the guide conveyance path 24, the single-wafer base material supply unit 25, and the reversing mechanism 20 below the thermal head 12. Can do.

  Further, the end portion 1B of the single-wafer substrate 1 is detected by the end detection sensor 35, and the drive control unit of the control device 11 drives and controls the first grip roller 31 based on the detection signal from the end detection sensor 35. By adjusting the position of the sheet substrate 1 with the roller 31, the thermal head 12 can realize highly accurate multicolor printing.

  In addition, the area to be removed as a margin can be brought to the end 1B side in both cases of the one surface 1a and the other surface 1b of the single-wafer substrate 1, and the length of the margin to be removed can be shortened. .

  In the above-described embodiment, the second grip roller 61 and the third grip roller 63 are provided on the side of the sheet feeding base material supply unit 25 of the switching flap 48 in the guide conveyance path 24, and the discharge port is disposed downstream of the discharge port 55. Although the example in which the 2 grip roller 65 and the discharge port third grip roller 67 are provided is shown, the present invention is not limited to this, and the second grip roller 61 and the third grip roller are provided on the thermal head 12 side of the switching flap 48 in the guide conveyance path 24. 63 may be provided. In this case, the discharge port second grip roller 65 and the discharge port third grip roller 67 are not necessarily provided.

  Further, the number of grip rollers 31, 61, 63 is not limited to three, and four or more grip rollers may be provided, and the number of discharge port grip rollers 65, 66 is not limited to two, but three. The above discharge port grip roller may be provided.

1 sheet substrate 1a one side 1b other side 5 sublimation transfer ribbon 6 ribbon unwinding unit 7 ribbon winding unit 10 double-sided printer 10A casing 11 control device 12 thermal head 13 platen roller 15 substrate conveying path 15a one side Substrate conveying path 15b Other side substrate conveying path 16 Conveying roller 19 Cutter 20 Reversing mechanism 21 Storage shell 21a Inner peripheral surface 22a, 22b Opening 24 Guide conveying path 24a End 25 Sheet-fed substrate supplying part 25a Pickup lever 26 Pickup roller 27 Separation Roller 28 Paper feed roller 30 Transport mechanism 31 First grip roller 31a First protrusion area 32 First pinch roller 46 Position detection sensor 47 Introduction path 47a Feed roller 48 Switching flap 50 Feed roller 52 Drive mechanism 52a Drive motor 52b Transmission mechanism 55 Exhaust Outlet 61 Second grip roller 61a Second protrusion Region 62 Second pinch roller 63 Third grip roller 63a Third protrusion region 64 Third pinch roller 65 Discharge port second grip roller 65a Discharge port second protrusion region 66 Discharge port second pinch roller 67 Discharge port third grip roller 67a Discharge port third protrusion region 68 Discharge port third pinch roller 70 Protrusion 71 Center part 72 Peripheral part G Grip trace

Claims (15)

In double-sided printers,
A printing section;
A sheet-fed substrate supply unit that stores sheet substrates printed on both sides and supplies them to the printing unit;
A guide conveyance path for guiding the sheet substrate from the sheet substrate supply unit to the printing unit;
The sheet substrate that is connected to the guide conveyance path via the reversing mechanism connection unit and returned from the printing unit to the guide conveyance path is reversed so that the sheet substrate with one side facing the printing unit is directed to the printing unit. With a reversing mechanism,
A first grip roller and a second grip roller located on the same surface side of the sheet substrate are provided in the vicinity of the printing unit or in the guide conveyance path, and the sheet substrate is sandwiched between the first grip roller and the second grip roller. Providing a first pinch roller and a second pinch roller having a flat surface;
The first grip roller has a first protrusion region having a plurality of protrusions formed in the circumferential direction, and the second grip roller has a second protrusion region having a plurality of protrusions formed in the circumferential direction,
A double-sided printer, wherein the first protrusion area of the first grip roller and the second protrusion area of the second grip roller are different from each other in the width direction position of the sheet substrate.   2. The double-sided printer according to claim 1, wherein a region obtained by combining the first protrusion region of the first grip roller and the second protrusion region of the second grip roller extends over the entire width direction of the sheet substrate.   The first protrusion region of the first grip roller and the second protrusion region of the second grip roller each have a central portion and a peripheral portion, and the protrusion height of each central portion is higher than the protrusion height of the peripheral portion. The double-sided printer according to claim 1 or 2.   4. The peripheral portion of the first protrusion region of the first grip roller and the peripheral portion of the second protrusion region of the second grip roller partially overlap in the width direction of the single-wafer base material. Double-sided printer as described. The first grip roller is provided in the vicinity of the printing unit downstream side in the printing process of the sheet substrate,
The double-sided printer according to any one of claims 1 to 4, wherein the second grip roller is provided in the guide conveyance path.   The double-sided printer according to claim 5, wherein the second grip roller is provided on the printing unit side of the reversing mechanism connection unit in the guide conveyance path.   6. The double-sided printer according to claim 5, wherein the second grip roller is provided on the sheet substrate supply part side of the reversing mechanism connection part in the guide conveyance path. A discharge port second grip having a discharge port second protrusion region having a plurality of protrusions formed on the discharge port of the guide conveyance path on the surface side different from the second grip roller with respect to the single-wafer substrate and formed in the circumferential direction. A discharge port second pinch roller for sandwiching the sheet substrate between the roller and the discharge port second grip roller;
8. The double-sided printer according to claim 7, wherein the discharge port second protrusion region of the discharge port second grip roller and the second protrusion region of the second grip roller have the same position in the width direction of the sheet substrate.   A third grip roller having a third protrusion region having a plurality of protrusions formed in a circumferential direction on the guide conveyance path, located on the same surface side as the first grip roller and the second grip roller with respect to the sheet substrate; A third pinch roller is provided to sandwich the sheet substrate with the third grip roller, and the first protrusion region of the first grip roller, the second protrusion region of the second grip roller, and the third of the third grip roller. The double-sided printer according to claim 5, wherein the protruding regions are different from each other in the width direction position of the sheet substrate.   The region including the first protrusion region of the first grip roller, the second protrusion region of the second grip roller, and the third protrusion region of the third grip roller extends over the entire width direction of the single-wafer substrate. The double-sided printer according to claim 9.   The first protrusion region of the first grip roller, the second protrusion region of the second grip roller, and the third protrusion region of the third grip roller each have a central portion and a peripheral portion, and a protrusion height at each central portion. The double-sided printer according to claim 9 or 10, wherein the height is higher than the height of the protrusion at the peripheral edge.   The peripheral portion of the third protrusion region of the third grip roller partially overlaps with the peripheral portion of the first protrusion region of the first grip roller or the peripheral portion of the second protrusion region of the second grip roller in the width direction of the single-wafer substrate. The double-sided printer according to claim 11.   The double-sided printer according to claim 9, wherein the third grip roller is provided on the printing unit side of the reversing mechanism connection unit in the guide conveyance path.   The double-sided printer according to claim 9, wherein the third grip roller is provided on the sheet substrate supply part side of the reversing mechanism connection part in the guide conveyance path. A discharge port third grip having a discharge port third protrusion region at the discharge port of the guide conveyance path, which is located on a surface side different from the third grip roller with respect to the single-wafer substrate and has a plurality of protrusions formed in the circumferential direction. A discharge port third pinch roller that sandwiches the sheet substrate between the roller and the discharge port third grip roller;
14. The double-sided printer according to claim 13, wherein the discharge port third projection region of the discharge port third grip roller and the third projection region of the third grip roller have the same position in the width direction of the sheet substrate.