JP2014208728A - Heat storable silicone material and method for producing the same - Google Patents

Abstract

A heat storage silicone material having high heat storage and thermal conductivity and a method for producing the same are provided. A heat storage silicone material (20) of the present invention includes an organopolysiloxane (21), heat conductive particles (23, 24), and a heat storage material, and the heat storage material contains a heat storage material having a melting point of 0 to 100 ° C. It is a microencapsulated heat storage material particle (22), containing 100 to 2000 parts by weight of heat conductive particles (23,24) per 100 parts by weight of organopolysiloxane, and having a thermal conductivity of 0.2 to 10 W / m · K. It is. This heat storage silicone material (20) comprises a silicone base polymer component (A), a crosslinking component (B), a catalyst, heat conductive particles, and microencapsulated heat storage material particles (22) with a total of 100 components (A + B). It is obtained by mixing 100 to 500 parts by weight with respect to parts by weight and crosslinking. [Selection] Figure 1

Description

  The present invention relates to a heat storage silicone material and a method for producing the same. More specifically, the present invention relates to a silicone material having heat storage and thermal conductivity and a method for producing the same.

  A semiconductor used in an electronic device or the like generates heat during use, and the performance of the electronic component may deteriorate. For this reason, a metal radiator is usually attached to an electronic component that generates heat through a heat conductive sheet in the form of a gel or a soft rubber. However, in recent years, a method of attaching a heat storage material sheet to a heat generating electronic component, storing heat in the heat storage material sheet, and delaying the speed of transferring heat has also been adopted.

  Patent Documents 1 and 2 propose heat storage rubber in which microcapsules containing a heat storage material are kneaded. Patent Document 3 proposes a heat countermeasure member in which the entire circumference of a silicone elastomer containing a paraffin wax polymer and a heat conductive filler is coated with a coating material.

JP 2010-184981 A JP 2010-235709 A JP 2012-102264 A

  However, the proposals in Patent Documents 1 and 2 have a problem that heat transfer from the heat generating member to the heat storage material is difficult because the gel or the soft rubber itself is a heat insulating material. There was a need for further improvements in sex.

  In order to solve the above-mentioned conventional problems, the present invention provides a heat storage silicone material having high heat storage and thermal conductivity and a method for producing the same.

  The heat storage silicone material of the present invention is a heat storage silicone material containing an organopolysiloxane, heat conductive particles, and a heat storage material, and the heat storage material is a heat storage material particle obtained by microencapsulating a heat storage material having a melting point of 0 to 100 ° C. And 100 to 2000 parts by weight of the thermally conductive particles with respect to 100 parts by weight of the organopolysiloxane, and the thermal conductivity is 0.2 to 10 W / m · K.

The method for producing a heat storage silicone material of the present invention is a method for producing the above heat storage silicone material,
A compound having the following composition is crosslinked.
(A) Base polymer component: a linear organopolysiloxane containing an alkenyl group bonded to silicon atoms at both ends of the molecular chain in an average of 2 or more in the molecule.
(B) Crosslinking component: 1 mole of the organohydrogenpolysiloxane containing hydrogen atoms bonded to an average of 2 or more silicon atoms in one molecule is 1 mole per mole of the silicon atom-bonded alkenyl group in the component A. Less than the amount.
(C) Platinum-based metal catalyst: 0.01 to 1000 ppm by weight with respect to component A.
(D) Thermally conductive particles: 100 to 2000 parts by weight with respect to 100 parts by weight of the total of component A and component B.
(E) Heat storage material particles obtained by microencapsulating a heat storage material having a melting point of 0 to 100 ° C .: 100 to 500 parts by weight with respect to 100 parts by weight of A component + B component in total.

 The present invention includes thermally conductive particles and microencapsulated heat storage material particles with respect to organopolysiloxane as a matrix polymer, and the thermally conductive particles include 100 to 2000 parts by weight with respect to 100 parts by weight of organopolysiloxane, By using a heat storage silicone material having a conductivity of 0.2 to 10 W / m · K, heat storage and heat conductivity are high, and the heat storage silicone material is interposed between the heat-generating component and the housing. In this case, a higher heat storage effect can be obtained.

FIG. 1 is a schematic cross-sectional view of a thermally conductive silicone sheet in one embodiment. FIG. 2 is an explanatory view of a heat storage evaluation test of a thermally conductive silicone material in one embodiment of the present invention. 3A-B are explanatory views showing a method for measuring the thermal conductivity and thermal resistance value of the thermally conductive silicone material in one embodiment of the present invention. FIG. 4 is a graph of the heat storage evaluation test of one example of the present invention. FIG. 5 is an enlarged graph of part A in FIG.

The heat storage silicone material of the present invention is obtained by crosslinking a compound having the following composition.
(A) Base polymer component: a linear organopolysiloxane containing an alkenyl group bonded to silicon atoms at both ends of the molecular chain in an average of 2 or more in the molecule.
(B) Crosslinking component: 1 mole of the organohydrogenpolysiloxane containing hydrogen atoms bonded to an average of 2 or more silicon atoms in one molecule is 1 mole per mole of the silicon atom-bonded alkenyl group in the component A. Less than the amount.
(C) Platinum-based metal catalyst: 0.01 to 1000 ppm by weight with respect to component A.
(D) Thermally conductive particles: 100 to 2000 parts by weight with respect to 100 parts by weight of the total of component A and component B.
(E) Heat storage material particles obtained by microencapsulating a heat storage material having a melting point of 0 to 100 ° C .: 100 to 500 parts by weight with respect to 100 parts by weight of A component + B component in total.

(1) Thermal storage material The thermal storage material of the said (E) component uses the thermal storage material particle which encapsulated the substance of melting | fusing point 0-100 degreeC. More preferable heat storage materials are paraffin having a melting point of 35 ° C. or higher, higher alcohol having a melting point of 45 ° C. or higher, and R ¹ —COO—R ^{2 having a} melting point of 30 ° C. or higher (where R ¹ is a hydrocarbon group having 16 or more carbon atoms, R ² is at least one compound selected from ester compounds represented by (C1-C6 hydrocarbon group). The film resin of the microcapsule is preferably at least one resin selected from urea formalin resin and melamine formalin resin. The average particle size of the microcapsules is preferably from 0.1 to 100 μm. Such a heat storage material microcapsule includes, for example, a product name “Thermo Memory” manufactured by Mitsubishi Paper Industries. The heat storage material microcapsules are preferably mixed in an amount of 100 to 500 parts by weight with respect to 100 parts by weight of the organopolysiloxane. More preferably, it is 150-250 weight part.

(2) Base polymer component (component A)
The component A of the present invention is an organopolysiloxane containing two or more alkenyl groups bonded to silicon atoms in one molecule, and the organopolysiloxane containing two alkenyl groups is the main agent in the silicone rubber composition of the present invention. (Base polymer component). This organopolysiloxane has, as an alkenyl group, two alkenyl groups bonded to a silicon atom having 2 to 8 carbon atoms, particularly 2 to 6 carbon atoms, such as vinyl group and allyl group, in one molecule. The viscosity is preferably 10 to 100000 mPa · s, particularly 100 to 100000 mPa · s at 25 ° C. from the viewpoint of workability and curability.

  Specifically, an organopolysiloxane containing an alkenyl group bonded to a silicon atom at the molecular chain terminal in an average of 2 or more in one molecule represented by the following general formula (Formula 1) is used. The side chain is a linear organopolysiloxane blocked with a triorganosiloxy group. A viscosity at 25 ° C. of 10 to 100000 mPa · s is desirable from the viewpoint of workability and curability. The linear organopolysiloxane may contain a small amount of a branched structure (trifunctional siloxane unit) in the molecular chain.

In the formula, R ¹ is an unsubstituted or substituted monovalent hydrocarbon group not having the same or different aliphatic unsaturated bond, R ² is an alkenyl group, and k is 0 or a positive integer.

Here, as the unsubstituted or substituted monovalent hydrocarbon group having no aliphatic unsaturated bond of R ¹ , for example, those having 1 to 10 carbon atoms, particularly 1 to 6 carbon atoms are preferable, specifically Alkyl group such as methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, cyclohexyl group, octyl group, nonyl group, decyl group, phenyl Group, tolyl group, xylyl group, aryl group such as naphthyl group, aralkyl group such as benzyl group, phenylethyl group, phenylpropyl group, and part or all of hydrogen atoms of these groups are fluorine, bromine, chlorine, etc. Substituted with a halogen atom, a cyano group, etc., such as a halogen atom such as chloromethyl group, chloropropyl group, bromoethyl group, trifluoropropyl group, etc. Alkyl, cyanoethyl group, and the like. As the alkenyl group for R ² , for example, an alkenyl group having 2 to 6 carbon atoms, particularly 2 to 3 carbon atoms is preferable, and specifically, a vinyl group, allyl group, propenyl group, isopropenyl group, butenyl group, isobutenyl group, hexenyl group. And a cyclohexenyl group, and a vinyl group is preferable.

  In general formula (1), k is generally 0 or a positive integer that satisfies 0 ≦ k ≦ 10000, preferably 5 ≦ k ≦ 2000, more preferably 10 ≦ k ≦ 1200. It is.

  As the organopolysiloxane of component A, for example, 3 or more, usually 3 to 30, alkenyl groups bonded to silicon atoms having 2 to 8 carbon atoms, particularly 2 to 6 carbon atoms, such as vinyl groups and allyl groups, in one molecule. Preferably, an organopolysiloxane having about 3 to 20 may be used in combination. The molecular structure may be any of linear, cyclic, branched, and three-dimensional network structures. Preferably, the main chain is composed of repeating diorganosiloxane units, both ends of the molecular chain are blocked with triorganosiloxy groups, and the viscosity at 25 ° C. is 10 to 100000 mPa · s, particularly 100 to 100,000 mPa · s. An organopolysiloxane.

  The alkenyl group is bonded to at least the silicon atom at the end of the molecular chain. Further, it may include those bonded to a silicon atom at the non-terminal end of the molecular chain (in the middle of the molecular chain). Among them, each having 1 to 3 alkenyl groups on the silicon atoms at both ends of the molecular chain represented by the following general formula (Chemical Formula 2) (provided that the alkenyl group bonded to the silicon atom at the molecular chain end is When the total number of both ends is less than 3, the alkenyl group bonded to the silicon atom at the non-end of the molecular chain (in the middle of the molecular chain) (for example, as a substituent in the diorganosiloxane unit) has at least one As described above, a linear organopolysiloxane having a viscosity of 10 to 1,000,000 mPa · s at 25 ° C. is desirable from the viewpoint of workability, curability, etc. Note that this linear organopolysiloxane has a small amount of branching. It may also contain a structure (trifunctional siloxane unit) in the molecular chain.

In the formula, R ³ is the same or different unsubstituted or substituted monovalent hydrocarbon group, and at least one is an alkenyl group. R ⁴ is an unsubstituted or substituted monovalent hydrocarbon group which does not have the same or different aliphatic unsaturated bond, R ⁵ is an alkenyl group, and l and m are 0 or a positive integer.

Here, as the monovalent hydrocarbon group of R ³ , those having 1 to 10 carbon atoms, particularly 1 to 6 carbon atoms are preferable, and specifically, methyl group, ethyl group, propyl group, isopropyl group, butyl group, Alkyl group such as isobutyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, cyclohexyl group, octyl group, nonyl group, decyl group, aryl group such as phenyl group, tolyl group, xylyl group, naphthyl group, benzyl Group, aralkyl group such as phenylethyl group, phenylpropyl group, etc., alkenyl group such as vinyl group, allyl group, propenyl group, isopropenyl group, butenyl group, hexenyl group, cyclohexenyl group, octenyl group, and hydrogen of these groups Some or all of the atoms are substituted with halogen atoms such as fluorine, bromine and chlorine, cyano groups, etc., for example, chloromethyl , Chloropropyl group, bromoethyl group, and a halogen-substituted alkyl group or cyanoethyl group such trifluoropropyl group.

Also, as the monovalent hydrocarbon group for R ⁴ , those having 1 to 10 carbon atoms, particularly 1 to 6 carbon atoms are preferable, and the same examples as the specific examples of R ¹ can be exemplified, but an alkenyl group is not included. .

As the alkenyl group for R ⁵ , for example, those having 2 to 6 carbon atoms, particularly those having 2 to 3 carbon atoms are preferable, and specifically the same as R ^{2 in the} above formula (Chemical Formula 1) are exemplified, preferably vinyl group It is.

  l and m are generally 0 or a positive integer satisfying 0 <l + m ≦ 10000, preferably 5 ≦ l + m ≦ 2000, more preferably 10 ≦ l + m ≦ 1200, and 0 <l / (l + m). ≦ 0.2, preferably an integer satisfying 0.0011 ≦ l / (l + m) 0.1.

(3) Crosslinking component (component B)
The B component organohydrogenpolysiloxane of the present invention acts as a crosslinking agent, and a cured product is formed by the addition reaction (hydrosilylation) of the SiH group in this component and the alkenyl group in the A component. Is. The organohydrogenpolysiloxane may be any organohydrogenpolysiloxane as long as it has two or more hydrogen atoms (that is, SiH groups) bonded to silicon atoms in one molecule. Any of linear, cyclic, branched, and three-dimensional network structures may be used, but the number of silicon atoms in one molecule (that is, the degree of polymerization) is about 2 to 1000, particularly about 2 to 300. Can be used.

The position of the silicon atom to which the hydrogen atom is bonded is not particularly limited, and may be at the end of the molecular chain or at the non-terminal (midway). The organic groups bonded to silicon atoms other than hydrogen atom, a substituted or unsubstituted monovalent hydrocarbon group that does not have the same aliphatic unsaturation and R ¹ in the general formula (Formula 1) .

  Examples of the B component organohydrogenpolysiloxane include the following structures.

  In the above formula, Ph is an organic group containing at least one of a phenyl group, an epoxy group, an acryloyl group, a methacryloyl group, and an alkoxy group. L is an integer of 0 to 1,000, particularly an integer of 0 to 300, and M is an integer of 1 to 200. )

Such an organohydrogenpolysiloxane can be obtained by a known method, for example, R ⁵ SiHCl ₂ , (R ⁵ ) ₃ SiCl, (R ⁵ ) ₂ SiCl ₂ , (R ⁵ ) ₂ SiHCl (wherein R ⁵ is A chlorosilane such as a methyl group, an alkyl group such as an ethyl group, or an aryl group such as a phenyl group, or by equilibrating a siloxane obtained by hydrolysis.

(4) Catalyst component The catalyst component of component C is a component that promotes curing of the composition. As C component, a well-known catalyst can be used as a catalyst used for hydrosilylation reaction. For example, platinum black, secondary platinum chloride, chloroplatinic acid, a reaction product of chloroplatinic acid and a monohydric alcohol, a complex of chloroplatinic acid and olefins or vinyl siloxane, platinum-based catalysts such as platinum bisacetoacetate, palladium-based Examples thereof include platinum group metal catalysts such as catalysts and rhodium catalysts. The compounding amount of the component C may be an amount necessary for curing, and can be appropriately adjusted according to a desired curing rate. Add 0.01 to 1000 ppm by weight with respect to component A.

(5) Thermally conductive particles The thermally conductive particles of component D are added in an amount of 100 to 2000 parts by weight based on 100 parts by weight of the total of component A and component B. Thereby, the heat conductivity of a heat conductive sheet or a putty material can be made into the range of 0.2-10 W / m * K. The thermally conductive particles are preferably at least one selected from alumina, zinc oxide, magnesium oxide, aluminum nitride, boron nitride, aluminum hydroxide and silica. Various shapes such as a spherical shape, a scale shape, and a polyhedral shape can be used. When alumina is used, α-alumina having a purity of 99.5% by weight or more is preferable. The specific surface area of the heat conductive particles is preferably in the range of 0.06 to 10 m ² / g. The specific surface area is a BET specific surface area, and the measuring method is in accordance with JIS R1626. When using an average particle diameter, the range of 0.1-100 micrometers is preferable. The particle diameter is measured by 50% particle diameter by a laser diffraction light scattering method. An example of this measuring instrument is a laser diffraction / scattering particle distribution measuring apparatus LA-950S2 manufactured by Horiba.

The thermally conductive particles are preferably used in combination with at least two inorganic particles having different average particle sizes. This is because the heat conductive inorganic particles having a small particle diameter are buried between the large particle diameters and can be filled in a state close to the closest packing, and the heat conductivity is increased. Inorganic particles having a relatively small average particle size are R (CH ₃ ) _a Si (OR ′) _{3 -a} (R is an unsubstituted or substituted organic group having 6 to 20 carbon atoms, R ′ is 1 to 4 carbon atoms) It is preferable to surface-treat with an alkyl group in which a is 0 or 1), or a partial hydrolyzate thereof. R (CH ₃ ) _a Si (OR ′) _3-a (wherein R is an unsubstituted or substituted organic group having 6 to 20 carbon atoms, R ′ is an alkyl group having 1 to 4 carbon atoms, a is 0 or 1) Examples of silane compounds (hereinafter simply referred to as “silane”) include hexyltrimethoxysilane, hexyltriethoxysilane, octyltrimethoxysilane, octyltriethoxysilane, decyltrimethoxysilane, decyltriethoxysilane, and dodecyltrimethoxysilane. , Dodecyltriethoxysilane, hexadodecyltrimethoxysilane, hexadodecyltriethoxysilane, octadecyltrimethoxysilane, octadecyltriethoxysilane. The said silane compound can be used 1 type or in mixture of 2 or more types. Surface treatment here includes adsorption in addition to covalent bonds. The inorganic particles having a relatively large average particle diameter are, for example, those having an average particle diameter of 2 μm or more, and it is preferable to add 50% by weight or more when the entire particle is 100% by weight.

(6) Other components Components other than those described above can be blended in the composition of the present invention as necessary. For example, an inorganic trial pigment such as Bengala, an alkyltrialkoxysilane or the like may be added for the purpose of surface treatment of the filler.

  The thermal conductivity of the thermally conductive silicone material of the present invention is in the range of 0.2 to 10 W / m · K. Preferably it is 0.5-5W / m * K, More preferably, it is 1-3W / m * K. If it is the said range, the heat from a heat generating body can be efficiently thermally conducted to a thermal storage material. The heat storage measurement method will be described in Examples.

  FIG. 1 is a schematic cross-sectional view of a heat storage silicone sheet 20 in one embodiment. The sheet 20 includes heat storage material particles 22, heat conductive large particles 23, and heat conductive small particles 24 in a crosslinked organopolysiloxane 21. When the heat storage silicone material is interposed between the heat-generating component and the housing, a higher heat storage effect is obtained.

This will be described below with reference to examples. The present invention is not limited to the examples.
<Heat storage evaluation test>
The heat storage evaluation test apparatus 10 is shown in FIG. The following members were stacked on the heat insulating base 11. It is shown below together with the position of the thermocouple and other conditions.
(1) Ceramic heater 12 (10mm in length and width, 1.75mm in thickness)
(2) Thermally conductive sheet 13 (10 mm in length and width, 2 mm in thickness)
(3) Aluminum plate 14 (vertical and horizontal 22.5mm each, thickness 4mm)
(4) Sheet sample 15 (20 mm in length and width and 1 mm in thickness were stacked in two)
(5) Bake plate 16 (vertical and horizontal 22.5mm each, thickness 4mm)
(6) Thermocouple 17: Inserted between the thermally insulating base 11 and the ceramic heater 12.
(7) Thermocouple 18: Inserted into the central hole in the thickness direction of the aluminum plate 14.
(8) Thermocouple 19: Inserted into the central hole in the thickness direction of the bake plate 16.
(9) Applied power to the ceramic heater 12: 5W

<Method of measuring thermal resistance and thermal conductivity>
It measured using TIM-Tester (made by Analysis Tech) based on ASTM D5470. 3A and 3B are schematic views of the thermal resistance measuring device 1. FIG. As shown in FIG. 3A, a sheet sample 4 having a diameter of 33 mm is placed on the cooling plate 3. A heater 5, a load cell 6 and a cylinder 8 are incorporated in this order in the upper part, and a cylindrical heat insulating material 7 is set on the outside of the cylinder so that it can move downward. 2 is a top plate. At the time of measurement, the state shown in FIG. 3B is set, the cylinder 8 is driven and pressurized to 100 kPa, and the thermal resistance value Rt is calculated from the temperature difference between the temperature T1 of the heater 5 and the temperature T2 of the cooling plate 3 and the applied power by the following formula. The thermal conductivity was calculated from the thermal resistance value Rt and the thickness of the sample.
Rt = [(T1-T2) / Q] × S
Rt: Thermal resistance value T1: Heater temperature (° C)
T2: Cooling plate temperature (° C)
Q: Applied power (W)
S: Sample contact area (cm ² )

Example 1
1. Material component (1) Silicone component Two-component room temperature curing silicone rubber (two-component RTV) was used as the silicone component. Note that a base polymer component (A component), a crosslinking component (B component), and a platinum-based metal catalyst (C component) are added in advance to the two-component RTV.
(2) Thermally encapsulated heat storage material particles (E component)
The microencapsulated heat storage material particles are manufactured by Mitsubishi Paper Industries Co., Ltd., trade name “Thermo Memory”, product number “FP-58” (average particle size 50 μm, melting point 58 ° C., heat of dissolution 54.9 J / g, bulk density 0.3 to 0.4 g / cm ³ ) was added in an amount of 200 parts by weight based on 100 parts by weight of the silicone component (A + B) component. The microencapsulated heat storage material particles are filled with paraffin having a melting point of 58 ° C. with melamine resin.
(3) Thermally conductive particles (component D)
(A) Small-diameter heat conductive particles The small-diameter heat conductive particles were used after surface-treating alumina having an average particle diameter of 0.3 μm with a silane coupling agent.
(B) Medium-diameter thermally conductive particles Medium-diameter thermally conductive particles were used after surface-treating alumina having an average particle diameter of 3 μm with a silane coupling agent.
(C) Large-diameter thermally conductive particles The large-diameter thermally conductive particles used were alumina having an average particle diameter of 75 μm.
(D) Addition amount of thermally conductive particles (component D) 100 parts by weight of small particle size thermally conductive particles and 200 parts by weight of medium particle size thermally conductive particles with respect to 100 parts by weight of silicone component (A + B) 200 parts by weight of thermally conductive particles having a particle size were added.
2. Sheet Molding Method A 2 mm thick metal frame was placed on the release-treated polyester film, the compound was poured, and another release-treated polyester film was placed. This was cured at 120 ° C. for 10 minutes at a pressure of 5 MPa.

  The physical properties of the obtained silicone material are summarized in Table 1.

(Example 2)
(1) Silicone component The same component as in Example 1 was used.
(2) Thermally encapsulated heat storage material particles (E component)
The microencapsulated heat storage material particles were manufactured by Mitsubishi Paper Industries Co., Ltd., and trade name “Thermo Memory”, product number “FP-58” was added by 250 parts by weight to 100 parts by weight of the silicone component (A + B) component.
(3) Thermally conductive particles (component D)
(A) Small-diameter heat conductive particles The small-diameter heat conductive particles were used after surface-treating alumina having an average particle diameter of 0.3 μm with a silane coupling agent.
(B) Medium-diameter thermally conductive particles Medium-diameter thermally conductive particles were used after surface-treating alumina having an average particle diameter of 3 μm with a silane coupling agent.
(C) Addition amount of thermally conductive particles (component D) 150 parts by weight of small particle size thermally conductive particles and 200 parts by weight of large particle size thermally conductive particles were added to 100 parts by weight of the silicone component (A + B).
2. Sheet Forming Method A sheet was formed in the same manner as in Example 1.

  The physical properties of the obtained silicone material are summarized in Table 1.

(Comparative Example 1)
1. Material component (1) Silicone component Two-component room temperature curing silicone rubber (two-component RTV) was used as the silicone component. Note that the base polymer component (A), the crosslinking component (B), and the platinum-based metal catalyst (C) are added in advance to the two-component RTV.
(2) Thermally encapsulated heat storage material particles (E component)
The microencapsulated heat storage material particles were manufactured by Mitsubishi Paper Industries Co., Ltd., and trade name “Thermo Memory”, product number “FP-58” was added in an amount of 150 parts by weight to 100 parts by weight of the silicone component (A + B) component.
2. Sheet Forming Method A sheet was formed in the same manner as in Example 1. In Comparative Example 1, no thermally conductive particles were added.

  The physical properties of the obtained silicone material are summarized in Table 1.

  Next, the results of the thermal storage evaluation test shown in FIG. 2 are shown in the graphs of FIGS. FIG. 5 is an enlarged view of a portion A in FIG. From part B in FIG. 5, it can be seen that the temperature at which heat storage is started is the fastest in Example 2 product with high thermal conductivity. From part C in FIG. 5, it can be seen that the effect of storing heat (heat storage amount) is higher when the thermal conductivity is higher. From this, it can be seen that the effect of storing heat (heat storage amount) is low unless the heat storage material particles are added. That is, it was confirmed that the thermal conductivity of each example product of the present invention was high (Table 1) and the heat storage amount was also high.

  The heat storage silicone material of the present invention can be applied to various forms of products such as sheets and putty materials.

DESCRIPTION OF SYMBOLS 1 Thermal resistance measuring apparatus 2 Top plate 3 Cooling plate 4 Sheet sample 5 Heater 6 Load cell 7 Thermal insulation material 8 Cylinder 10 Thermal storage evaluation test apparatus 11 Thermal insulation base 12 Ceramic heater 13 Thermal conductive sheet 14 Aluminum plate 15 Sheet sample 16 Bake plates 17, 18, 19 Thermocouple 20 Thermal storage silicone sheet 21 Organopolysiloxane 22 Thermal storage material particle 23 Thermal conductive large particle 24 Thermal conductive small particle

Claims (8)

A heat storage silicone material comprising an organopolysiloxane, thermally conductive particles and a heat storage material,
The heat storage material is a heat storage material particle in which a heat storage material having a melting point of 0 to 100 ° C. is microencapsulated,
100 to 2000 parts by weight of the thermally conductive particles with respect to 100 parts by weight of the organopolysiloxane,
A heat storage silicone material having a thermal conductivity of 0.2 to 10 W / m · K.   The heat storage silicone material according to claim 1, wherein the heat storage material particles include 100 to 500 parts by weight with respect to 100 parts by weight of the organopolysiloxane.   The heat storage silicone material according to claim 1, wherein the heat storage material particles have an average particle diameter of 0.1 to 100 μm. The thermally conductive particles include at least two inorganic particles having different average particle sizes,
Inorganic particles having a relatively small average particle size are R (CH ₃ ) _a Si (OR ′) _{3 -a} (R is an unsubstituted or substituted organic group having 6 to 20 carbon atoms, R ′ is 1 to 4 carbon atoms) The heat storage silicone material of any one of Claims 1-3 currently surface-treated with the silane compound or its partial hydrolyzate shown by the alkyl group of a, a is 0 or 1). The thermally conductive particles include inorganic particles having an average particle diameter of 2 μm or more and inorganic particles having an average particle diameter of less than 2 μm,
The heat storage silicone material according to any one of claims 1 to 4, wherein the inorganic particles having an average particle diameter of 2 µm or more is 50 wt% or more when the entire particle is 100 wt%.   The sex heat storage according to any one of claims 1 to 6, wherein the thermally conductive particles are at least one particle selected from alumina, zinc oxide, magnesium oxide, aluminum nitride, boron nitride, aluminum hydroxide, and silica. Silicone material.   The heat storage silicone material according to any one of claims 1 to 6, wherein an inorganic particle pigment is further added to the heat conductive silicone material. It is a manufacturing method of the heat storage silicone material of any one of Claims 1-7,
The method for producing a heat storage silicone material, wherein the silicone material is obtained by crosslinking a compound having the following composition.
(A) Base polymer component: a linear organopolysiloxane containing an alkenyl group bonded to silicon atoms at both ends of the molecular chain in an average of 2 or more in the molecule.
(B) Crosslinking component: 1 mole of the organohydrogenpolysiloxane containing hydrogen atoms bonded to an average of 2 or more silicon atoms in one molecule is 1 mole per mole of the silicon atom-bonded alkenyl group in the component A. Less than the amount.
(C) Platinum-based metal catalyst: 0.01 to 1000 ppm by weight with respect to component A.
(D) Thermally conductive particles: 100 to 2000 parts by weight with respect to 100 parts by weight of the total of component A and component B.
(E) Heat storage material particles obtained by microencapsulating a heat storage material having a melting point of 0 to 100 ° C .: 100 to 500 parts by weight with respect to 100 parts by weight of A component + B component in total.

Images