JP2014204304A - Surface-mounted crystal vibrator and manufacturing method thereof - Google Patents

Abstract

A surface-mount crystal unit capable of fixing a cover mounting position and easily positioning the cover mounting glass even if it is pre-baked after printing the low-melting glass when sealing the glass of the cover, and its manufacture Provide a method. The shape of the crystal support part 3 that lifts and supports the crystal piece 5 is such that the side of the crystal support part 3 that is close to the side of the substrate 1 is located inside the ceramic cover when the ceramic cover is mounted on the substrate 1. This is a surface-mount crystal resonator that is formed so as to extend to a position that substantially contacts the side surface, and that the crystal holding terminals under the crystal support portion 3 are also formed in the same pattern, and a method for manufacturing the same. [Selection] Figure 5

Description

  The present invention relates to a surface-mount crystal resonator, and more particularly, to a surface-mount crystal resonator that can be miniaturized, can achieve high airtightness, and can improve productivity and reliability, and a manufacturing method thereof.

[Conventional technology]
Since the surface-mounted crystal resonator is small and lightweight, it is built into a portable electronic device as a frequency and time reference source.
Some conventional surface-mount crystal units have a crystal piece mounted on a ceramic substrate, and are covered with a concave cover upside down and hermetically sealed.

[Related technologies]
As related prior art, Japanese Patent Laid-Open No. 07-115145, “Semiconductor Package” (NEC Corporation) [Patent Document 1], Japanese Patent Laid-Open No. 09-130009, “Hybrid Integrated Circuit Device and Manufacturing Method Thereof” (Mitsubishi) Denki Co., Ltd.] [Patent Document 2], Japanese Patent Application Laid-Open Publication No. 2005-065056 “Electronic Component Package Body and Piezoelectric Device, Piezoelectric Device Manufacturing Method, Mobile Phone Device Using Piezoelectric Device, and Electronic Device Using Piezoelectric Device” (Seiko Epson Corporation) [Patent Document 3], Japanese Patent Application Laid-Open No. 2004-103629, “Structure of Glass Sealed Package” (Toyo Communication Equipment Co., Ltd.) [Patent Document 4].

Patent Document 1 discloses a semiconductor package in which convex guides are provided at the upper four corners of the package so that the shape of the cap can be fitted inside the convex guide.
Patent Document 2 shows that in a hybrid integrated circuit device, a convex portion is formed with solder on a thick film electrode, whereby the position of the frame is determined and the positional deviation of the frame is prevented.

Patent Document 3 shows that, in an electronic component package, protruding protective portions are formed on opposite sides located at the opening periphery of the package body, and a lid is housed between the pair of protective portions. Yes.
In Patent Document 4, in a glass sealing package in which a base and a lid are hermetically sealed by melting glass, a fitting step is provided on the lid, and the glass is sealed by contacting the inner peripheral edge of the base. It is shown.

JP 07-115145 A Japanese Patent Laid-Open No. 09-130009 Japanese Patent Laid-Open No. 2005-065056 JP 2004-103629 A

  However, in the conventional surface-mounted crystal resonator, glass sealing is desirable for improving airtightness and improving reliability as compared with the case where the cover is resin-sealed. If pre-baking is not performed after printing, there is a risk that the characteristics of the vibrator will deteriorate due to outgassing, and if pre-baking is performed, tack (stickiness) is eliminated, so when mounting a cover individually on the base of the ceramic sheet In addition, the cover mounting position cannot be fixed, and the position cannot be determined.

  The present invention has been made in view of the above circumstances, and when performing glass sealing of a cover, the position of the cover mounting can be fixed and positioning can be easily performed even if low-melting glass is pre-baked after printing. An object of the present invention is to provide a surface-mount crystal resonator and a method for manufacturing the same.

  The present invention for solving the above-described problems of the conventional example is a surface-mounted crystal resonator in which a crystal piece is mounted on a rectangular ceramic substrate, and includes first and second crystal support portions that hold the crystal piece. A through terminal formed in a wall surface of a through hole formed in a corner portion of the substrate, and first and second crystal holders formed on a lower surface of the first and second crystal support portions on the surface of the substrate A first connecting portion that connects the terminal, the end of the first crystal holding terminal and the through terminal at the shortest corner from the end, and the shortest from the end of the second crystal holding terminal and the end And a ceramic cover that covers the crystal piece and is provided with a glass layer on the contact surface with the substrate, wherein the first and second crystal support portions include: The side on the side close to the side of the substrate is formed to a position where it almost contacts the inner surface of the cover. To.

  According to the present invention, in the surface-mounted crystal resonator, the corner on the first connection portion side of the first crystal support portion is curved in accordance with the curved shape of the inner surface of the cover corner portion, and the second crystal support portion The corner portion on the second connection portion side of the cover is curved in accordance with the curved shape of the inner surface of the cover corner portion.

  The present invention is characterized in that, in the surface mount crystal resonator, the first and second crystal holding terminal patterns have the same shape as the patterns of the first and second crystal support portions.

  The present invention is characterized in that, in the above surface-mounted crystal resonator, the glass layer is a low-melting glass and is pre-fired.

  The present invention is characterized in that, in the surface-mounted crystal resonator, the first and second crystal holding portions are formed of a silver metal film with a film thickness of about 50 to 70 μm.

  The present invention relates to a method of manufacturing a surface-mounted crystal resonator in which a crystal piece is mounted on a rectangular ceramic substrate, wherein through terminals are formed on the wall surface of a through-hole formed in a corner portion of the substrate, and On the surface are first and second crystal holding terminals below the first and second crystal supporting parts that hold the crystal pieces, and ends of the first crystal holding terminals and the shortest corners from the ends. Forming a first connecting portion connecting the through terminal, an end portion of the second crystal holding terminal, and a second connecting portion connecting the through terminal at the shortest corner from the end portion; When the cover is mounted on the substrate and the first and second crystal support terminals are mounted on the second crystal holding terminals, the side that is close to the side of the substrate substantially contacts the inner surface of the cover. And a cover formed with a glass layer obtained by pre-firing low-melting-point glass on the portion in contact with the substrate. And characterized by providing as close to the sides of the second crystal supporting portion.

  The present invention is characterized in that, in the method for manufacturing a surface-mounted crystal resonator, the first and second crystal holding portions are formed of a silver metal film with a film thickness of about 50 to 70 μm.

  According to the present invention, the first and second crystal supporting portions for holding the crystal pieces, the through terminals formed on the wall surfaces of the through holes formed in the corners of the substrate, and the first and The first and second crystal holding terminals formed in the lower layer of the second crystal supporting part, and the first crystal terminal connecting the end of the first crystal holding terminal and the through terminal at the shortest corner from the end. A glass layer on the contact surface with the substrate, covering the crystal piece, the second connection portion connecting the end portion of the second crystal holding terminal and the through terminal at the shortest corner from the end portion, and the crystal piece A surface mount crystal resonator in which the first and second crystal support portions are formed to a position where the side close to the side of the substrate substantially contacts the inner side surface of the cover. So, when performing glass sealing of the cover, even if pre-baking after printing the low melting glass, Position of the bar mounting can be fixed, there is an effect that it is possible to easily perform positioning.

1 is a schematic cross-sectional explanatory diagram of a surface-mounted crystal resonator according to an embodiment of the present invention. (A) is a plane explanatory view of a glass layer (seal glass), and (b) is a cross-sectional explanatory view of a ceramic cover or the like. It is a plane explanatory view of the extraction terminal on a substrate. It is plane explanatory drawing in which the crystal support part on the extraction terminal was formed. It is plane explanatory drawing which showed the position where a ceramic cover is mounted.

Embodiments of the present invention will be described with reference to the drawings.
[Outline of the embodiment]
In the surface-mounted crystal resonator according to the embodiment of the present invention, the side of the crystal support unit that is close to the side of the substrate is mounted on the substrate with respect to the shape of the crystal support unit that lifts and supports the crystal piece. Since the cover can be positioned by the corresponding side of the crystal support portion, a glass layer is formed on the contact surface to the substrate of the glass. Even when sealing, the cover mounting position can be fixed, positioning can be performed easily, and highly airtight glass sealing can be realized.

[This oscillator: Fig. 1]
A surface-mounted crystal resonator (main resonator) according to an embodiment of the present invention will be described with reference to FIG. FIG. 1 is a schematic cross-sectional explanatory diagram of a surface-mounted crystal resonator according to an embodiment of the present invention.
As shown in FIG. 1, in this vibrator, a rectangular ceramic substrate (ceramic base) 1 is formed with through terminals 6 that connect the front and back of the substrate 1 to the wall surfaces of through holes formed at the corners thereof. The lead terminal 2 connected to the electrode of the crystal piece 5 is connected to the through terminal 6 on the surface of the substrate 1, and the mounting terminal 7 is connected to the through terminal 6 on the back surface of the substrate 1.

  This vibrator includes a lead terminal 2 connected to the through terminal 6 on the substrate 1, a crystal support part 3 formed on the lead terminal 2, a crystal piece 5, a crystal support part 3, and a crystal piece 5. It basically has a conductive adhesive 4 to be bonded, a ceramic cover 9, and a low melting point glass layer (glass layer or seal glass) 8 formed on the contact surface of the ceramic cover 9 to the substrate 1.

  Here, as a feature of the present embodiment, the crystal support portion 3 is formed so close that the side close to the side of the substrate 1 contacts the inner side surface of the ceramic cover 9. Although the specific shape of the crystal support portion 3 will be described later, the ceramic cover 9 is positioned by the shape of the crystal support portion 3.

[Ceramic cover and glass layer: Fig. 2]
The ceramic cover 9 and the glass layer 8 will be described with reference to FIG. 2A is a plan explanatory view of a glass layer (seal glass), and FIG. 2B is a cross-sectional explanatory view of a ceramic cover and the like.
As shown in FIG. 2B, the ceramic cover 9 has a concave shape, and a glass layer 8 is formed on a portion (edge portion) that contacts the substrate 1. The ceramic cover 9 is mounted on the substrate 1 with the concave shape turned upside down.

The glass layer 8 is formed by printing on the edge portion and pre-baking.
Further, as shown in FIG. 2A, the ceramic cover 9 has four corners that are curved on both the outer surface and the inner surface.

[Drawer terminal: Fig. 3]
Next, the lead terminal will be described with reference to FIG. FIG. 3 is an explanatory plan view of the lead terminal on the substrate.
As shown in FIG. 3, this vibrator has a lead terminal 2 formed of a metal film on a substrate 1.
The lead terminal 2 includes a crystal holding terminal 2b formed in the lower layer of the crystal support portion 3, and a connection portion 2a drawn from the end portion of the crystal holding terminal 2b toward the shortest corner of the substrate 1.

The connection part 2a is connected to the through terminal 6 at the corner.
As shown in FIG. 3, the two lead terminals 2 are connected to through terminals 6 at opposite corners (diagonal directions). Here, one of the crystal holding terminals 2b in the two lead terminals 2 is a first crystal holding terminal, and the other is a second crystal holding terminal.

  Further, the shape of the crystal holding terminal 2b is formed to be further outward from the mounting position of the crystal piece 5, that is, drawn to the short side close to the substrate 1, and also to the long side close to the substrate 1. It is drawn out and formed. This pulled out position is a position where the ceramic cover 9 is almost in contact with the substrate 1 when the ceramic cover 9 is mounted on the substrate 1.

The crystal holding terminal 2b is a portion to which the connecting portion 2a is connected, and has a curved shape corresponding to the curvature of the inner surface of the ceramic cover 9.
The crystal holding terminal 2b is configured to be connected to the electrode of the crystal piece 5, and is formed of an Ag (silver) Pd (palladium) alloy.

[Crystal support: FIGS. 4 and 5]
Next, the crystal support portion will be described with reference to FIGS. FIG. 4 is an explanatory plan view in which a crystal support portion on the lead terminal is formed, and FIG. 5 is an explanatory plan view showing a position where a ceramic cover is mounted.
As shown in FIG. 4, the crystal support 3 is laminated on the crystal holding terminal 2b and formed in a convex shape, and is configured to lift and hold the crystal piece 5 and is made of Ag.
Since the crystal support portion 3 uses Ag, the viscosity is high, and a thick metal film can be formed by a single application using a metal mask. The thickness of the crystal support portion 3 formed by one application corresponds to three layers of a metal film (low viscosity) using conventional AgPd.

In other words, in order to form the crystal support portion 3 having the same thickness, the Ag film only needs to be applied once in the present embodiment, but the conventional AgPd film needs to be applied three times, and a lot of Pd is used. The cost is high and the work process is complicated.
Moreover, since the crystal support part 3 uses Ag with high viscosity, it does not leak out of the crystal holding terminal 2b.

  Further, as shown in FIGS. 4 and 5, the crystal support portion 3 is formed on the crystal holding terminal 2b in the same pattern as the crystal holding terminal 2b. Here, the first crystal support portion is formed on the first crystal holding terminal, and the second crystal support portion is formed on the second crystal holding terminal. .

  Therefore, the crystal support portion 3 is formed by being drawn out to the short side near the substrate 1 and is also formed by being drawn out to the long side near the substrate 1. As shown in FIG. 5, the extracted position is a position where the ceramic cover 9 is almost in contact with the substrate 1 when the ceramic cover 9 is mounted on the substrate 1.

The crystal support portion 3 has a curved shape corresponding to the curvature of the inner surface of the ceramic cover 9 even at the portion where the connection portion 2a is connected to the crystal holding terminal 2b.
In FIG. 5, the dotted line portion represents a portion 8 ′ where the glass layer 8 formed on the contact surface of the substrate 1 in the ceramic cover 9 comes into contact.

When the ceramic cover 9 is mounted on the substrate 1 due to the special shape of the crystal support portion 3, it has a positioning effect.
The crystal support portion 3 is formed of a conductive material that is connected to the electrode of the crystal piece 5. However, since the cover is made of ceramic, there is no problem such as a short circuit even if contact is made.

[Crystal piece: Fig. 1]
The crystal piece 5 and the crystal support part 3 are connected by the conductive adhesive 4 on the end side of the crystal holding terminal 2b from which the extraction terminal 2 is extracted.
Since the crystal holding terminal 2 b and the crystal support portion 3 hold the crystal piece 5 at both ends of the crystal piece 5, it is referred to as a “both-end” type.

The crystal piece 5 is AT-cut, and opposing excitation electrodes 5a are formed on both main surfaces.
Further, the crystal piece 5 is formed with an extraction electrode 5b extending from the excitation electrode 5a to opposite ends in the opposite direction and folded back over the entire width in the width direction.
Then, a pair of diagonal portions (end portions) extended from the extraction electrode 5b are fixed to the crystal support portion 3 by the conductive adhesive 4 as a conductive material, and the extraction electrode 5b, the crystal support portion 3 and the crystal holding portion are held. The terminal 2b is electrically and mechanically connected.

[Through terminal: Fig. 1]
The through terminals 6 are formed on the side walls of through holes (through holes) formed at the four corners of the substrate 1, and are formed of the same AgPd alloy as that of the lead terminals 2.
The lead terminal 2 is connected to the through terminal 6 at the four corners (corner portions) of the substrate 1.
However, since the lead terminal 2 is formed on the diagonal line of the substrate 1, the lead terminal 2 is connected to the through terminal 6 at the corner part on the diagonal line, but the through terminal 6 is connected to the lead terminal 2 at the corner part on the other diagonal line. Not connected to.

[Mounting terminals and through terminals: Fig. 1]
Mounting terminals 7 are formed at the four corners of the back surface of the substrate 1, and are connected to the through terminals 6 at the corners of the substrate 1.
As described above, the through terminal 6 includes one that is connected to the lead terminal 2 and one that is not connected, and is mounted on the back surface of the substrate 1 that is connected to the through terminal 6 connected to the lead terminal 2. A test is performed in which the terminals 7 are brought into contact with each other with a measuring device and excited, and a vibration frequency to be described later is adjusted.

  The through holes (through holes) are formed at the same time as the break lines in the state of the ceramic sheet before the substrate 1 is divided. The front and back surfaces are formed at the four corner portions (corner portions) of the substrate 1 to be divided. It is formed to penetrate.

[Pattern of crystal holding terminal]
As shown in FIG. 3, the pattern of the crystal holding terminal 2b is formed so as to face the center of the substrate 1, and the end portion not connected to the connection portion 2a has a specific length compared to the conventional crystal holding terminal. Only shortened.

  That is, in this vibrator, the end portion of the one crystal holding terminal 2b on the side where the conductive adhesive 4 is not formed is formed shorter inside than the end portion to which the connection portion 2a of the other crystal holding terminal 2b is connected. The end of the other crystal holding terminal 2b on the side where the conductive adhesive 4 is not formed is shorter inward than the end of the one crystal holding terminal 2b to which the connecting portion 2a is connected.

Similarly, the crystal support portion 3 formed on the crystal holding terminal 2b has an end portion on the side where the conductive adhesive 4 is not formed short and formed inward.
As a result, the crystal holding terminal 2b and the crystal support portion 3 are shortened by a specific length as compared with the conventional case, and the ends of the crystal holding terminal 2b and the crystal support portion 3 are longer than the ends in the longitudinal direction of the extraction electrode of the crystal piece 5. The part is shortened inward.

[Manufacturing method of the vibrator: FIGS. 3 to 5]
Next, a method for manufacturing the present vibrator will be described with reference to FIGS.
In the method for manufacturing the vibrator, the first step (sheet-shaped ceramic fabric firing), the second step (circuit pattern formation), the third step (crystal support portion formation), the fourth step (crystal piece mounting), the first step There are 5 steps (frequency adjustment), 6th step (ceramic cover joining), and 7th step (division).

[First step / Sintered ceramic fabric]
First, a sheet-shaped ceramic cloth that is the basis of the sheet-shaped ceramic base is formed.
In the sheet-like ceramic fabric, break lines that divide adjacent regions corresponding to the individual ceramic bases 1 are formed, and through holes are formed at the four corners (corners).
And the sheet-like ceramic material | fabric in which the through-hole was formed is baked, and a sheet-like ceramic base (ceramic base sheet) is obtained.

[Second Step / Circuit Pattern Formation: FIG. 3]
Next, an AgPd alloy metal paste having a thickness of about 10 μm is formed in a region corresponding to the circuit pattern of the sheet-like ceramic base by printing using a screen mask.
As shown in FIG. 3, the circuit pattern has a metal pattern of the lead terminal 2 including the connection portion 2a and the crystal holding terminal 2b on one main surface (front surface), and the mounting terminal 7 on the other main surface (back surface). The through terminal 6 is formed on the wall surface of the through hole.

  And the metal paste made into AgPd alloy is baked at about 850 degreeC, the binder in a metal paste is evaporated, and AgPd alloy is fuse | melted and solidified, and the sheet-like ceramic base in which the metal pattern was formed is obtained.

Since the firing temperature of the ceramic is about 1500 to 1600 ° C. and the AgPd alloy is 850 ° C. below this, the AgPd alloy paste is applied after firing the ceramic, and the AgPd alloy paste is fired together with the ceramic.
This is due to the fact that when an AgPd alloy paste is applied to a ceramic fabric and fired at the firing temperature of the ceramic, the AgPd alloy paste becomes too hot and cannot form a circuit pattern.

[Third Step / Crystal Support 3 Formation: FIG. 4]
Next, formation of the crystal support portion 3 will be described.
As shown in FIG. 4, specifically, the quartz support portion 3 is formed as a quartz support portion 3 by printing using a nickel (Ni) metal mask to form an Ag metal film of about 50 to 70 μm. .
The crystal support part 3 is formed on the crystal holding terminal 2b of AgPd.
Since the crystal support portion 3 is an Ag metal film, the viscosity is high, and a thick film can be formed by a single film formation. Therefore, the crystal support part 3 does not protrude from the crystal holding terminal 2b.

[Fourth process / Crystal piece mounting]
Next, the crystal piece 5 is fixedly mounted by the conductive adhesive 4 on each crystal support portion 3 of the sheet-like ceramic base on which the metal pattern or the like is formed, and is electrically and mechanically connected.
Specifically, the extraction electrode is extended from the excitation electrode of the crystal piece 5, and the extraction electrode is connected to the crystal support portion 3 via the conductive adhesive 7.

[Fifth step / frequency adjustment]
Next, the vibration frequency of each crystal piece 5 as a crystal resonator mounted (fixed) on the sheet-like ceramic base is adjusted by the mass load effect.
Specifically, the measurement terminal (probe) from the measuring instrument is brought into contact with the mounting terminal 7 electrically connected to each crystal piece 5 on the back surface of the sheet-like ceramic base. Then, the excitation electrode on the surface side of the crystal piece 5 with the exposed plate surface is irradiated with gas ions to scrape the surface, and the mass of the excitation electrode is reduced to adjust the vibration frequency from the lower to the higher.
However, it is also possible to adjust the vibration frequency from higher to lower by adding a metal film on the excitation electrode by vapor deposition or sputtering, for example.

[Sixth step / Ceramic cover bonding (sealing enclosed): FIG. 5]
Next, the opening end face of the concave ceramic cover 9 is joined in a rectangular region corresponding to each substrate 1 of the sheet-like ceramic base on which the crystal piece 5 is mounted.
Here, the glass layer 8 is formed in advance by printing on the opening end face of the ceramic cover 9 and temporarily fired, and the glass layer 8 is used as a sealing material, and is melted by heating and bonded.
In FIG. 5, a contact portion 8 ′ of the glass layer 8 formed on the opening end face of the ceramic cover 9 is indicated by a belt-like broken line. Here, the state where the crystal piece 5 having the excitation electrode 5 a and the extraction electrode 5 b is mounted on the crystal support portion 3 with the conductive adhesive 4 is shown for the contact portion 8 ′.
As a result, individual crystal pieces 5 are hermetically sealed to form an aggregated sheet-like crystal resonator.

[Seventh step / division]
Finally, the sheet-like ceramic base on which the crystal resonators are assembled is divided vertically and horizontally according to the break line to obtain individual surface mount crystal resonators.

  Here, in the state of the sheet-like ceramic base on which the metal pattern or the like is formed, the crystal piece 5 is mounted (fourth process), the frequency adjustment (fifth process), and the ceramic cover 9 is joined (sixth process). Since the process can be performed continuously, the productivity can be improved.

Furthermore, in this embodiment, the mounting terminals 7 on the back surface of the ceramic base 1 are four terminals that are electrically independent from each other. On the other hand, in the state of the sheet-like ceramic base, the respective mounting terminals 7 (four pieces) at the four corners of the adjacent rectangular regions are electrically connected in common through the through terminals 6.
Therefore, even when the mounting terminals 7 at the four corners are connected in common, the measurement terminals are brought into contact with the pair of diagonal mounting terminals 7 connected to the crystal support portions 3 of the ceramic bases 1, and the crystal There is an effect that the vibration frequency can be adjusted for each piece 5.

  The metal pattern is an AgPd alloy, but may be, for example, an AgPt (silver / platinum) alloy mainly composed of Ag having relatively good adhesion to the ceramic, and any Ag-based thick film material can be applied.

[Effect of the embodiment]
According to the present vibrator, when the crystal support portion 3 that lifts and supports the crystal piece 5 is supported by the side of the crystal support portion 3 that is close to the side of the substrate 1 when the ceramic cover 9 is mounted on the substrate 1. Since the ceramic cover 9 is formed so as to be extended to a position almost in contact with the inner side surface of the ceramic cover 9, the ceramic cover 9 can be positioned by the expanded side of the crystal support portion 3. Even when the glass layer 8 is formed on the contact surface and glass sealing is performed, the mounting position of the ceramic cover 9 can be fixed, positioning can be performed easily, and an airtight glass sealing can be realized. .

  The present invention provides a surface-mount crystal resonator that can fix the position of the cover mounting and can easily perform positioning even when the cover is sealed with glass even if the low-melting glass is pre-baked after printing. Suitable for manufacturing method.

  DESCRIPTION OF SYMBOLS 1 ... Board | substrate (ceramic base), 2 ... Lead terminal, 2a ... Connection part, 2b ... Crystal holding terminal, 3 ... Crystal support part, 4 ... Conductive adhesive agent, 5 ... crystal piece, 5a ... excitation electrode, 5b ... extraction electrode, 6 ... through terminal, 7 ... mounting terminal, 8 ... glass layer, 9 ... ceramic cover

Claims (7)

A surface-mount crystal resonator in which a crystal piece is mounted on a rectangular ceramic substrate,
First and second crystal support parts for holding the crystal pieces;
A through terminal formed on a wall surface of a through hole formed in a corner of the substrate;
First and second crystal holding terminals formed on a lower layer of the first and second crystal support portions on the surface of the substrate;
A first connecting portion for connecting an end portion of the first crystal holding terminal and a through terminal at a shortest corner portion from the end portion;
A second connecting portion for connecting the end of the second crystal holding terminal and the through terminal at the shortest corner from the end;
A ceramic cover that covers the crystal piece and is provided with a glass layer on the contact surface with the substrate;
The surface-mounted crystal resonator, wherein the first and second crystal support portions are formed to a position where a side close to the side of the substrate is substantially in contact with an inner surface of the cover. The corner portion on the first connecting portion side in the first crystal support portion is curved in accordance with the curved shape of the inner surface of the cover corner portion,
The surface-mounted crystal resonator according to claim 1, wherein a corner portion on the second connection portion side of the second crystal support portion is curved in accordance with a curved shape of an inner surface of the cover corner portion.   3. The surface mount crystal resonator according to claim 1, wherein the pattern of the first and second crystal holding terminals has the same shape as the pattern of the first and second crystal support portions.   The surface-mount crystal resonator according to claim 1, wherein the glass layer is low-melting glass and is pre-fired.   5. The surface-mount crystal resonator according to claim 1, wherein the first and second crystal holding portions are formed of a silver metal film with a film thickness of about 50 to 70 μm. A method of manufacturing a surface-mounted crystal resonator in which a crystal piece is mounted on a rectangular ceramic substrate,
While forming a through terminal on the wall surface of the through hole formed in the corner of the substrate,
First and second crystal holding terminals below the first and second crystal supporting parts for holding a crystal piece on the surface of the substrate, the end of the first crystal holding terminal, and the shortest from the end A first connecting portion that connects the through terminal at the corner of the second crystal, and an end portion of the second crystal holding terminal and a second connecting portion that connects the through terminal at the shortest corner from the end portion. Forming,
When the cover is mounted on the substrate on the first and second crystal holding terminals, the side close to the side of the substrate is placed on the side of the cover. Form up to a position almost touching the inner surface,
A surface-mounted crystal vibration characterized in that a cover in which a glass layer obtained by pre-baking a low-melting glass is formed in a portion in contact with the substrate so as to be close to the side of the first and second crystal support portions Child manufacturing method.   7. The method for manufacturing a surface-mounted crystal resonator according to claim 6, wherein the first and second crystal holding portions are formed of a silver metal film with a film thickness of about 50 to 70 [mu] m.

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