JP2014138074A - Substrate with through electrode and method of manufacturing the same - Google Patents

Abstract

To obtain a substrate with a through electrode having a precise and high density through electrode while ensuring high reliability.
A glass substrate with a through electrode 1 is formed of a laminated structure in which a plurality of linear glass substrates 11 having a plurality of conductor portions and insulating portions on the side surfaces are joined. Each of the linear glass substrates 11 has a rectangular parallelepiped glass formed by a redraw method. A cross section perpendicular to the longitudinal direction of the linear glass substrate 11 is rectangular. The conductor portions are provided in a plane parallel to the longitudinal direction and substantially parallel to each other along a direction substantially orthogonal to the longitudinal direction. A through-hole is formed by separating by an insulator formed on a side surface of one linear glass substrate 11 at a joint portion between two adjacent linear glass substrates 11. Inside the through hole 1a, a conductive through electrode 12 is sandwiched, and electrical conduction is ensured between the two main surfaces of the glass substrate 1 with a through electrode for each through hole 1a.
[Selection] Figure 1A

Description

  The present invention relates to a substrate with a through electrode used mainly as an interposer and a method for manufacturing the same.

  In recent years, various fine connection techniques called 3D integration and 2.5D integration using a glass substrate with a through electrode have been proposed. Further, in order to ensure insulation between the through electrodes, an interposer made of a glass substrate has attracted attention instead of a silicon substrate. Various proposals have been made on manufacturing methods for accurately forming through electrodes in an interposer made of a glass substrate (Patent Documents 1 and 2).

  In Patent Document 1, after a photomask is formed on the surface of a thin glass substrate, a laser beam is irradiated from the excimer laser to the glass substrate along a direction substantially perpendicular to the surface, whereby a through-hole is formed in the glass substrate. A method of forming is disclosed. Patent Document 2 discloses a process of inserting a conductive post through a through hole of a substrate and placing the substrate on a support plate, and an insulating layer on the substrate and in the gap between the inner surface of the through hole and the conductive post. A method is described in which a plurality of substrates each provided with a through electrode are manufactured by repeating horizontal forming from the side surface of the insulating layer between the support plate and the substrate and between the substrates after repeating the forming step.

  In these patent documents 1, 2, the method of forming a through-hole in a glass substrate by performing the process along a substantially perpendicular direction with respect to the surface of a glass substrate is disclosed.

JP 2011-228495 A JP 2009-105326 A

  10A and 10B are a perspective view showing a method of forming a through hole for a glass substrate disclosed in Patent Documents 1 and 2, respectively, and a cross-sectional view showing a portion of the formed through hole. As shown in FIG. 10A, according to the conventional technique, the through-hole 200a is formed by processing along a substantially vertical direction with respect to the surface of the glass substrate 200. In the formation of the through hole 200a, the glass melts from the processing side of the glass substrate 200. Therefore, as shown in FIG. 10B, the through hole 200a has an inner surface from one end to the other end where the through hole 200a is formed. Is formed in a tapered shape. Thereby, even if it tried to form through-hole 200a with desired opening diameter (phi), there existed a problem that the opening diameters of the one end and the other end will differ. When a difference occurs in the opening diameters at both ends of the through hole 200a, the interval between the adjacent through holes 200a is sufficiently large in order to ensure the insulation state of the through electrode provided in the through hole 200a and ensure high reliability. It is necessary to secure. For this reason, it has been difficult to increase the density of the through electrodes. Also, as the glass melts, the temperature history changes and distortion occurs around the processed hole, which requires long-time annealing to ensure cracking and reliability during handling. .

  The present invention has been made in view of the above, and an object of the present invention is to provide a substrate with a penetrating electrode capable of forming a penetrating electrode precisely and at a high density while ensuring high reliability, and a method for manufacturing the same. It is in.

  In order to solve the above-described problems and achieve the above object, a substrate with a through electrode according to the present invention includes a substrate, and a plurality of conductors arranged so as to penetrate from one main surface to the other main surface of the substrate. And the substrate is composed of a base assembly formed by joining a plurality of bases, and the plurality of bases are joined to each other with the outer peripheral surfaces different from the main surface as joint surfaces so as to sandwich the conductor. It is characterized by.

  In the substrate with a through electrode according to the present invention, in the above invention, the base has a groove provided on at least one surface from one side to the other side, and the plurality of bases are provided with the groove. The conductors are joined to each other with the joined surfaces as joint surfaces, and the conductor is provided in a through-hole formed of a groove.

  In the substrate with a through electrode according to the present invention, in the above invention, the base body has a substantially rectangular parallelepiped shape, and a plurality of side surfaces on opposite sides of the side surfaces parallel to the longitudinal direction in the rectangular parallelepiped shape of the base body are provided. The side surfaces provided with the grooves of the pair of substrates to be joined are aligned and joined so that the positions of the grooves coincide with each other. In this configuration, the substrate with a through electrode according to the present invention is characterized in that a plurality of grooves provided on the side surface are provided in a direction perpendicular to the longitudinal direction and parallel to each other.

  The substrate with a through electrode according to the present invention is characterized in that, in the above invention, the bonding surface is a surface of a resin layer, and a groove is formed in the resin layer.

  The substrate with a through electrode according to the present invention is characterized in that, in the above invention, the substrate is made of glass or glass having a resin provided at least on the bonding surface side.

  In the substrate with a through electrode according to the present invention, in the above invention, the base body has a substantially rectangular parallelepiped shape, and the base body has a conductor portion provided on at least one surface from one side to the other side. The plurality of bases are joined to each other so that the surfaces on which the conductor portions are provided are parallel to each other, and the side surfaces on which the conductor portions of the pair of bases to be joined are provided so that the positions of the conductor portions coincide with each other. It is characterized by being formed by being aligned with and bonded to each other.

  The substrate with a through electrode according to the present invention is characterized in that, in the above invention, a plurality of conductor portions are provided on side surfaces which are opposite to each other among side surfaces parallel to the longitudinal direction of the rectangular parallelepiped shape of the base. And Furthermore, the substrate with a through electrode according to the present invention is characterized in that, in this configuration, the plurality of conductor portions provided on the side surface are provided in a direction perpendicular to the longitudinal direction and parallel to each other.

  The substrate with a through electrode according to the present invention is the hollow substrate having a hollow portion communicating with the outside in which the substrate bonded body is bonded to one end portion of the plurality of substrates bonded to each other or to each other. Is further provided.

  The method of manufacturing a substrate with a through electrode according to the present invention includes a substrate forming step for forming a plurality of substrates, and at least one of the plurality of substrates from one side to the other side of at least one surface of each substrate. A groove forming step for forming two grooves, a substrate bonding step for manufacturing a substrate bonded body by bonding a plurality of substrates to each other using the surface on which the groove is formed as a bonding surface of at least one of the substrates, and a substrate A conductor installation step of providing a conductor in a through-hole constituted by a groove in the joined body.

  In the above invention, the method for manufacturing a substrate with a through electrode according to the present invention further includes a resin layer forming step of forming a resin layer on the bonding surface side of the plurality of substrates at the same time as the substrate forming step or after the substrate forming step. It is characterized by that. In this configuration, the method for manufacturing a substrate with a through electrode according to the present invention is such that, after the resin layer forming step, the conductor is pressed to the resin layer by bonding a plurality of substrates while keeping the conductor at a temperature higher than the glass transition temperature of the resin layer. Then, the groove forming step, the substrate bonding step, and the conductor installation step are performed in parallel.

  The method for producing a substrate with a through electrode according to the present invention is characterized in that, in the above invention, the resin layer is made of a thermoplastic resin, a high-temperature adhesive, or a photoresist.

  The method for producing a substrate with a through electrode according to the present invention is characterized in that, in the above-described invention, in the substrate forming step, the substrate is formed by a redraw method.

  The method for manufacturing a substrate with a through electrode according to the present invention is characterized in that, in the groove forming step, the groove is formed by liquid phase etching or mechanical grinding.

  The method for manufacturing a substrate with a through electrode according to the present invention includes a substrate forming step for forming a plurality of substrates, and a plurality of substrates, wherein at least one surface of each substrate is from one side to the other side. A conductor part forming step for forming at least one conductor part, and using the surface on which the conductor part is formed as a joining surface in at least one of the bases, a plurality of bases are joined together to form a base joined body. And a substrate bonding step to be manufactured.

  The method for manufacturing a substrate with a through electrode according to the present invention is characterized in that, in the above invention, the conductor portion forming step includes a step of forming an insulator portion at a place other than the conductor portion of the surface on which the conductor portion is formed. To do.

  The method for manufacturing a substrate with a through electrode according to the present invention is characterized in that, in the above invention, the conductor portion forming step forms the conductor portion by photolithography.

  The method for producing a substrate with a through electrode according to the present invention is characterized in that, in the above-described invention, in the substrate forming step, the substrate is formed by a redraw method.

  In the method of manufacturing a substrate with a through electrode according to the present invention, in the above invention, the substrate forming step further includes a hollow substrate forming step of forming a hollow substrate having a hollow portion communicating with the outside. The method further comprises the step of bonding the base body to manufacture the base body bonded body.

  According to the substrate with a through electrode and the manufacturing method thereof according to the present invention, it is possible to obtain a substrate with a through electrode having a precise and high density through electrode while ensuring high reliability.

FIG. 1A is a perspective view showing a glass substrate with a through electrode according to the first embodiment of the present invention. FIG. 1B is a perspective view showing a linear glass substrate constituting the glass substrate with through electrodes according to the first embodiment of the present invention. FIG. 2 is a flowchart showing a method for manufacturing a glass substrate with a through electrode according to the first embodiment of the present invention. FIG. 3 is a schematic perspective view showing a heat stretching apparatus for manufacturing the linear glass substrate according to the first embodiment of the present invention. FIG. 4A is a perspective view for explaining the method for manufacturing the glass substrate with through electrodes according to the second embodiment of the present invention. FIG. 4B is a perspective view for explaining the method for manufacturing the glass substrate with through electrodes according to the second embodiment of the present invention. FIG. 4C is a perspective view for explaining another example of the method for manufacturing the glass substrate with through electrodes according to the second embodiment of the present invention. FIG. 5A is a perspective view for explaining the method for manufacturing the glass substrate with through electrodes according to the third embodiment of the present invention. FIG. 5B is a cross-sectional view showing details of the groove in FIG. 5A. FIG. 5C is a perspective view for explaining the method for manufacturing the glass substrate with through electrodes according to the third embodiment of the present invention. FIG. 5D is a perspective view for explaining the method for manufacturing the glass substrate with through electrodes according to the third embodiment of the present invention. FIG. 5E is a perspective view for explaining another example of the method for manufacturing the glass substrate with through electrodes according to the third embodiment of the present invention. FIG. 6A is a perspective view for explaining the method for manufacturing the glass substrate with through electrodes according to the fourth embodiment of the present invention. 6B is a cross-sectional view showing details of the groove in FIG. 6A. FIG. 6C is a perspective view for explaining the method for manufacturing the glass substrate with through electrodes according to the fourth embodiment of the present invention. FIG. 6D is a perspective view for explaining the method for manufacturing the glass substrate with through electrodes according to the fourth embodiment of the present invention. FIG. 7A is a perspective view showing a glass substrate with a through electrode according to the fifth embodiment of the present invention. FIG. 7B is a perspective view for explaining the method for manufacturing the glass substrate with through electrodes according to the fifth embodiment of the present invention. FIG. 7C is a perspective view for explaining the method for manufacturing the glass substrate with through electrodes according to the fifth embodiment of the present invention. FIG. 7D is a perspective view for explaining the method for manufacturing the glass substrate with through electrodes according to the fifth embodiment of the present invention. FIG. 7E is a perspective view showing a linear glass substrate having another wiring example constituting the glass substrate with a through electrode according to the fifth embodiment of the present invention. FIG. 8A is a perspective view for explaining the method for manufacturing the glass substrate with through electrodes according to the sixth embodiment of the present invention. FIG. 8B is a perspective view for explaining the method for manufacturing the glass substrate with through electrodes according to the sixth embodiment of the present invention. FIG. 8C is a perspective view for explaining the method for manufacturing the glass substrate with through electrodes according to the sixth embodiment of the present invention. FIG. 8D is a perspective view for explaining the method for manufacturing the glass substrate with through electrodes according to the sixth embodiment of the present invention. FIG. 9A is a perspective view showing a portion of a glass substrate with a through electrode having a heat dissipation structure according to the first example of the seventh embodiment of the present invention. FIG. 9B is a perspective view showing a portion of a glass substrate with a through electrode having a heat dissipation structure according to a second example of the seventh embodiment of the present invention. FIG. 9C is a perspective view showing a portion of the glass substrate with a through electrode having a heat dissipation structure according to the third example of the seventh embodiment of the present invention. FIG. 9D is a perspective view showing a portion of a glass substrate with a through electrode having a heat dissipation structure according to a fourth example of the seventh embodiment of the present invention. FIG. 10A is a perspective view for explaining a method of forming a through hole in a glass substrate according to a conventional technique. FIG. 10B is a cross-sectional view of the through-hole portion of the glass substrate for explaining a problem when the through-hole is formed in the glass substrate by the conventional technique.

  Embodiments of the present invention will be described below with reference to the drawings. In all the drawings of the following embodiments, the same or corresponding parts are denoted by the same reference numerals. Further, the present invention is not limited to the embodiments described below.

(First embodiment)
(Glass substrate with through electrode)
First, the substrate with through electrodes according to the first embodiment of the present invention will be described. FIG. 1A shows a glass substrate with a through electrode provided with a through electrode according to the first embodiment, and FIG. 1B shows a linear glass substrate as a substrate that is a unit element constituting the glass substrate with a through electrode. .

  As shown in FIG. 1A, the glass substrate 1 with a through electrode according to the first embodiment has a substantially rectangular parallelepiped shape, and the linear glass substrate 11 as a base body having a plurality of grooves 11a shown in FIG. It is comprised from the base | substrate conjugate | zygote which has multiple structure joined by using as a joining surface the surface substantially parallel to outer peripheral surfaces other than the main surface of the glass substrate 1 with an electrode.

  Each of the linear glass substrates 11 constituting the glass substrate 1 with through electrodes is made of substantially rectangular parallelepiped glass formed by, for example, a redraw method. The cross-sectional shape orthogonal to the longitudinal direction of the rectangular parallelepiped shape of the linear glass substrate 11 is a substantially rectangular shape in which the four corners are curved with a relatively small curvature.

  In addition, a plurality of grooves 11a in the linear glass substrate 11 are provided side by side on a surface parallel to the longitudinal direction (hereinafter referred to as a side surface). In the first embodiment, the plurality of grooves 11a are provided in parallel to each other along a direction substantially orthogonal to the longitudinal direction of the linear glass substrate 11 (the thickness d direction of the glass substrate 1 with a through electrode). It has been.

  1B, the plurality of grooves 11a are formed on both side surfaces of the side surface of the linear glass substrate 11 and the opposite side surface substantially parallel to the surface. In addition, the groove | channel 11a may be formed only in one side surface of the linear glass substrate 11, and it is desirable to use such a linear glass substrate 11 especially for the edge part of the glass substrate 1 with a penetration electrode. And one groove | channel 11a formed in the side surface in one linear glass substrate 11, and one linear glass substrate 11 in the other linear glass substrate 11 joined to this one linear glass substrate 11 Each of the plurality of grooves 11a formed on the side surface facing the side surface is formed so as to correspond to each other.

  Further, as shown in FIG. 1A, in the two adjacent linear glass substrates 11, the plurality of grooves 11a formed in the respective linear glass substrates 11 are aligned with each other so that the through holes 1a are aligned. Composed. That is, the side surface of the two adjacent linear glass substrates 11 where the groove 11a is formed is used as a bonding surface, and the through hole 1a is provided at a bonding portion where these bonding surfaces are bonded to each other. And the groove | channel 11a of one linear glass substrate 11 and the groove | channel 11a of the other linear glass substrate 11 which opposes the some groove | channel 11a of this one linear glass substrate 11 were joined in the joint surface The through hole 1a is configured by the space formed by Thereby, in the glass substrate 1 with a penetration electrode, the through-hole 1a which can hold | maintain the penetration electrode 12 which has electroconductivity as a conductor is formed. Moreover, the joining part which comprises the joining surface in the side surface of the adjacent linear glass substrate 11 is a glass surface which the linear glass substrate 11 fuse | melted and solidified, for example, a thermoplastic resin, a high temperature adhesive agent, or insulation An insulating bonding film (not shown) made of a conductive resin is used.

  In addition, a conductive through electrode 12 is sandwiched inside a through hole 1a formed by two opposing grooves 11a in two adjacent linear glass substrates 11. The through electrode 12 ensures a desired electrical connection between the two main surfaces (between the front and back surfaces) of the upper surface that is one main surface and the lower surface that is the other main surface in the glass substrate 1 with a through electrode. As shown in FIG. 1B, the width defined by both side surfaces of the linear glass substrate 11 where the grooves 11a are formed is the electrode pitch t of the through electrodes 12 in the glass substrate 1 with through electrodes. In addition, as shown to FIG. 1A, the center space | interval of the two groove | channels 11a adjacent within the side surface in the linear glass substrate 11 becomes the electrode pitch in the glass substrate 1 with a penetration electrode similarly.

  As described above, a plurality of linear glass substrates 11 penetrate through the joint surfaces formed with a plurality of grooves 11a while forming one through hole 1a between a pair of opposed grooves 11a. The electrodes 12 are sequentially joined so as to sandwich the electrodes 12. Thereby, the glass substrate 1 with a penetration electrode by which the penetration electrode 12 was hold | maintained at each of the some through-hole 1a is comprised.

(Method for producing glass substrate with through electrode)
Next, the manufacturing method of the glass substrate 1 with a penetration electrode comprised as mentioned above is demonstrated. FIG. 2 is a flowchart showing a method for manufacturing the glass substrate 1 with through electrodes according to the first embodiment. FIG. 3 is a schematic perspective view of a heating and stretching apparatus for performing the redraw method.

  As shown in FIG. 2, in the manufacturing method of the glass substrate with a through electrode according to the first embodiment, first, a base glass plate 2 serving as a base material of the linear glass substrate 11 is prepared or, for example, a float method or the like (Step ST1). The dimension of the base glass plate 2 is determined based on the dimension of the cross section orthogonal to the longitudinal direction of the linear glass substrate 11. This is because when the linear glass substrate 11 is manufactured from the base glass plate 2 by the redraw method described later, the aspect ratio of the cross section orthogonal to the longitudinal direction of the linear glass substrate 11 is in the drawing direction of the base glass plate 2. This is because the film is stretched so as to be approximately equal to the aspect ratio of the cross section perpendicular to the cross section. Here, the dimensions of the cross section orthogonal to the longitudinal direction of the linear glass substrate 11 are the plate thickness d and the electrode pitch t shown in FIG. 1B. Therefore, based on the desired plate thickness d and electrode pitch t in the linear glass substrate 11, the base glass substrate 2 is prepared or manufactured so that the aspect ratio of the cross section is d / t. In the linear glass substrate 11, the portion generally referred to as the thickness is the electrode pitch t in the glass substrate 1 with through electrodes, and the portion generally referred to as the width is the plate thickness d in the glass substrate 1 with through electrodes.

  Next, for example, the linear glass substrate 11 is formed by a redraw method using the heating and stretching apparatus 100 shown in FIG. 3 (step ST2). A heating and stretching apparatus 100 shown in FIG. 3 includes a heating furnace 101, a base material feeding mechanism 102, take-up mechanisms 103 a and 103 b, and a cutter 104. The heating furnace 101 includes heaters 101a, 101b, and 101c, and heats the base glass plate 2. The base material feeding mechanism 102 feeds the base material glass plate 2 into the heating furnace 101. The take-out mechanisms 103 a and 103 b draw the base glass plate 2 from the heating furnace 101 while drawing it into the glass strip 3. The cutter 104 cuts and cuts a concave portion on the surface of the glass strip 3.

  Then, using the heating and stretching apparatus 100, the base glass plate 2 is stretched while being heated, and then the glass strip 3 formed to have a predetermined thickness is cut into a predetermined length, whereby a linear glass substrate 11 is obtained. Is molded. This predetermined length is the length of one of the vertical and horizontal sides of the glass substrate 1 with through electrodes shown in FIG. 1A, and this predetermined thickness is the electrode pitch t in the linear glass substrate 11 shown in FIG. 1B. Further, only the both end surfaces along the longitudinal direction of the linear glass substrate 11 become cut surfaces, and the four side surfaces other than the both end surfaces become glass melting surfaces, so that surface flatness and surface smoothness can be increased, A high-strength linear glass substrate 11 can be manufactured.

  Next, a groove 11a for embedding the through electrode 12 is formed on the side surface of the linear glass substrate 11 (step ST3). That is, for example, convex portions on the substrate surface using various groove forming techniques such as wet etching (liquid phase etching), reactive ion etching (RIE), machining, sand blasting, and imprinting, and photosensitive resin. By forming a plurality of grooves 11a on the side surface of the linear glass substrate 11, preferably at a predetermined electrode pitch.

  Then, during or after the formation of the groove 11a in step ST3, a conductor (conductor) such as copper (Cu) or tungsten (W), which will later become the through electrode 12, is embedded in the groove 11a (step ST4). ). Here, at the time of embedding the conducting wire in the groove 11a, a layer made of a thermoplastic resin formed on the side surface of the linear glass substrate 11 using a high temperature conducting wire is melted or softened, or a high temperature adhesive or insulating resin is used. It is possible to fix the conductive wire in the groove 11a using the layer to be fitted. Note that a conductive portion can be formed of a photosensitive conductive material using a photomask or the like, or a conductor can be formed by a plating method after performing a necessary surface treatment or base treatment. In this case, the conductive portion may be formed first.

  Further, at the time of or after the fitting of the conductive wire into the groove 11a in step ST4, the plurality of linear glass substrates 11 are joined to each other using the side surfaces on which the grooves 11a are formed as joining surfaces (step ST5). Thereby, the through-hole 1a of the glass substrate 1 with a penetration electrode is formed by a pair of groove | channel 11a which the side surface of the some linear glass substrate 11 joined and opposed. At the same time, the through electrode 12 made of a conducting wire is held in the through hole 1a so as to be sandwiched between the pair of grooves 11a.

  In addition, when performing step ST4, ST5 sequentially, first, the conducting wire used as the penetration electrode 12 is inserted in the groove | channel 11a of one linear glass substrate 11 first. Thereafter, the penetration electrode 12 fitted in the groove 11a of the one linear glass substrate 11 is fitted into the groove 11a of the other linear glass substrate 11 facing the groove 11a. The other linear glass substrate 11 is joined.

  When steps ST4 and ST5 are performed simultaneously, first, a conducting wire serving as the through electrode 12 is disposed between the two linear glass substrates 11 having side surfaces each having the groove 11a facing each other. Thereafter, the side surfaces are joined together as a joining surface so that the conductive wire is sandwiched by the grooves 11a on the side surfaces of the two linear glass substrates 11 facing each other. And while forming the through-hole 1a by this pair of groove | channels 11a, the penetration electrode 12 is hold | maintained in the inside.

  Further, when steps ST3, ST4, and ST5 are performed simultaneously, first, a conducting wire serving as the through electrode 12 is disposed between two linear glass substrates 11 whose side surfaces face each other. Then, these side surfaces are joined so that this conducting wire may be pinched | interposed by the side surfaces of the two linear glass substrates 11 which oppose. Thereby, the groove | channel 11a is formed in each side surface of the two linear glass substrates 11 with a conducting wire. At the same time, the through electrode 12 is held inside the through hole 1a of the glass substrate 1 with a through electrode formed of a groove 11a formed by a conducting wire at the time of bonding.

  As described above, a plurality of linear glass substrates 11 are sequentially joined with their respective side surfaces as joining surfaces to produce a glass substrate joined body as a base joined body, and provided on the glass base joined body. The through electrode 12 is held inside the through hole 1a.

  Thereafter, by polishing the surface of the glass substrate assembly having the through electrodes 12 to remove burrs and the like produced by the production, the glass substrate 1 with the through electrodes as the final product shown in FIG. 1A is manufactured. (Step ST6).

  According to the first embodiment described above, the through hole 1a of the glass substrate 1 with a through electrode is processed to penetrate the surface of the glass substrate along the plate thickness direction as in the prior art. And a plurality of grooves 11a formed on the side surface of the linear glass substrate 11, more specifically, a pair of grooves 11a formed on opposing bonding surfaces in the two linear glass substrates 11 to be bonded. doing. Therefore, when the through-hole 1a having a high aspect ratio (plate thickness d / opening diameter φ) is formed in the glass substrate 1 with a through-electrode, the groove width of the groove 11a facing the side surface of the linear glass substrate 11 and What is necessary is just to enlarge ratio of groove depth and plate | board thickness d of the glass substrate 1 with a penetration electrode which is groove length. When the plate thickness d of the glass substrate 1 with a through electrode is determined in advance by design or the like, the aspect ratio of the through hole 1a can be increased as the groove width and depth of the groove 11a are reduced. In this case, it is easier to form the through-hole 1a having a high aspect ratio than to form the through-hole 1a having a relatively low aspect ratio. Therefore, the aspect ratio is easier than that of the through-hole formed by the conventional technique. Can be improved.

  Furthermore, in order to form a through-hole with a high aspect ratio in a glass substrate, it is necessary to use a method such as laser irradiation with an excimer laser or a focused machining discharge method, and although high cost is inevitable, This through hole was formed in a tapered shape. On the other hand, according to the first embodiment, the through-hole 1a can be formed while reducing the cost required for processing without using a method such as laser irradiation with an excimer laser or a focused processing discharge method, and the through-hole can be formed. The opening diameters φ of the through holes 1a in the two main surfaces of the glass substrate 1 with through electrodes are substantially equal to each other without the cross-sectional shape along the plate thickness d direction of the glass substrate 1 with through electrodes in the hole 1a being tapered. Can be formed. Therefore, the electrode pitch t of the through-electrodes 12 held in the through-hole 1a can be reduced while maintaining mutual insulation, and it is possible to realize further reduction in the diameter and density of the through-electrodes 12 at low cost. . Further, since a non-heat processing method can be selected, there is almost no distortion due to processing, and an annealing step after through-hole processing is not necessary.

  Further, when the glass substrate 1 with a through electrode is formed from a glass substrate, it is difficult to form the through hole 1a by etching unless the glass composition is a special composition as compared with a case where the glass substrate is formed from a silicon substrate, for example. It was. This is because the glass substrate does not have the same etching anisotropy as the silicon substrate. On the other hand, according to the first embodiment, in forming a through hole by etching, it is not necessary to perform a process for penetrating the glass substrate, so that any glass composition depends on the anisotropy of etching and the like. The through-hole can be easily formed without doing so. Therefore, even if the material does not have etching anisotropy such as a glass substrate, the high-aspect-ratio through holes 1a can be formed with a small diameter and a high density, and the through electrodes 12 can be formed in the small diameter and high density through holes 1a. Since it can also hold | maintain, the glass substrate 1 with a penetration electrode which has the small diameter high-density penetration electrode 12 can be manufactured.

  Further, according to the first embodiment, the linear glass substrate 11 is formed by the redraw method. Thereby, since the thickness measurement can be performed continuously for all of the linear glass substrates, the side surfaces, which are the bonding surfaces of the plurality of linear glass substrates 11, can be maintained with high accuracy. The roughness is also very good because it is formed on the glass melt surface. Further, since the entire surface other than the cut end surface is formed of a glass melt surface, the surface strength is increased. And the glass substrate joined body is comprised by joining the glass melting surface of the some linear glass substrate 11 by heat melting, anodic bonding through a thin film, and using resin, an adhesive agent etc. as needed. For this reason, conventional through holes have been formed by mechanically processing, chemically processing, processing using laser, or electrical processing, etc. so as to penetrate in the direction perpendicular to the surface of the glass substrate. Compared with a glass substrate with electrodes, the strength can be dramatically improved, so that the handling property can be further improved.

(Second Embodiment)
Next, the manufacturing method of the glass substrate with a penetration electrode using the imprint by the 2nd Embodiment of this invention is demonstrated. In addition, in the following description, it demonstrates, referring suitably the flowchart of the manufacturing method of the glass substrate with a penetration electrode shown in FIG. 4A and 4B are perspective views for explaining a method for manufacturing the glass substrate with through electrodes according to the second embodiment.

  As shown in FIG. 4A, in the second embodiment, when the linear glass substrate 21 is formed by the redraw method (FIG. 2, step ST2), protective films are formed on both side surfaces of the linear glass substrate 21, respectively. 22 is formed. The protective film 22 is made of, for example, an insulating thermoplastic resin such as polyimide or polytetrafluoroethylene (PTFE) that reversibly softens at a lower temperature than the glass transition point of the glass by heating or the like, or an adhesive glass having a low melting point. Become.

  Thereafter, as shown in FIG. 4A, for example, a plurality of conductive wires 23 made of Cu, W, or the like, which will later become through electrodes 12, and a plurality of linear glass substrates 21 provided with protective films 22 on both side surfaces as a base, Are arranged side by side alternately so that their side surfaces face each other with the conductive wire 23 therebetween. Subsequently, the conductive wire 23 is heated to a predetermined temperature equal to or higher than the glass transition point of the protective film 22 and pressed so as to be sandwiched between the plurality of linear glass substrates 21 provided with the protective film 22.

  As a result, as shown in FIG. 4B, the protective film 22 is softened by the heat of the conductive wire 23 to form a through hole 1 a that follows the shape of the conductive wire 23, and the plurality of linear glass substrates 21 cover the protective film 22. The conductive wire 23 becomes a through electrode (FIG. 2, steps ST3, ST4, ST5). At this time, the linear glass substrate 21 functions as a formation stop layer of the groove 22 a formed in the protective film 22 by the heat of the conductive wire 23.

  Moreover, as another example in the manufacturing method of the glass substrate with a penetration electrode by a 2nd embodiment, it is also possible to manufacture as shown in Drawing 4C. That is, as shown in FIG. 4C, a protective film 22 is provided only on one side surface of the linear glass substrate 21, and a pair of linear glass is sandwiched between the conductive wires so as to be embedded in the protective film 22 while forming grooves. The substrate 21 is bonded. Thereby, the through-hole 1a is formed in the protective film 22 and the through-electrode 12 is formed. Other processes in the method for manufacturing the glass substrate with a through electrode are the same as those in the first embodiment, and thus the description thereof is omitted.

  According to the second embodiment, the same effect as that of the first embodiment can be obtained, and the protective film 22 is formed on the surface of the linear glass substrate 21, and the protective film 22 is formed by the heated conducting wire 23. Since the groove 22 a is formed while being softened, the groove 22 a that follows the shape of the conductive wire 23 can be formed. That is, it is possible to form the through hole 1a that matches the shape of the conducting wire 23. Furthermore, since the mutually independent conducting wires 23 are employed as the through electrodes 12, the insulation between the through electrodes 12 in the glass substrate 1 with the through electrodes can be secured by the linear glass substrate 21 and the protective film 22. .

(Third embodiment)
Next, the manufacturing method of the glass substrate with a penetration electrode using the liquid phase etching by the 3rd Embodiment of this invention is demonstrated. In addition, in the following description, it demonstrates, referring suitably the flowchart of the manufacturing method of the glass substrate with a penetration electrode shown in FIG. 5A, FIG. 5C, and FIG. 5D are perspective views for explaining a method of manufacturing a glass substrate with a through electrode according to the third embodiment, and FIG. 5B is a longitudinal view of the linear glass substrate 31 shown in FIG. 5A. It is sectional drawing along a direction and orthogonal to the side surface.

  As shown in FIGS. 5A and 5B, in the third embodiment, first, when the linear glass substrate 31 is formed by the redraw method (FIG. 2, step ST2), both side surfaces of the linear glass substrate 31 are formed. Each photoresist is baked and applied. Then, a resist pattern 33 having a predetermined groove pattern shape is formed on both side surfaces of the linear glass substrate 31 by patterning the photoresist by a photolithography process. Here, the opening width l of the resist pattern 33 is determined based on the desired groove width and groove depth of the groove 31a. In addition, after forming the linear glass substrate 31, it is also possible to perform the process of apply | coating a photoresist on the both sides | surfaces of the linear glass substrate 31, and a photolithography process.

  Next, as shown in FIG. 5B, liquid phase etching (wet etching) is performed on the linear glass substrate 31 using the resist pattern 33 as a mask. Thereafter, the resist pattern 33 is removed. Thereby, the groove | channel 31a is formed in the both sides | surfaces of the linear glass substrate 31 (FIG. 2, step ST3).

  Thereafter, as shown in FIG. 5C, a plurality of conductive wires 32 made of, for example, Cu or W, which will later become through electrodes 12, and a plurality of linear glasses having grooves 31a formed on at least one side, preferably both sides. The substrates 31 are arranged alternately one after another while aligning the pair of grooves 31 a on the opposite side surfaces with the conductive wires 32.

  Subsequently, as shown in FIG. 5D, the side surfaces of the plurality of linear glass substrates 31 are joined together as the joining surfaces while sandwiching the conducting wires 32 so as to be fitted into the grooves 31 a. At this time, the side surfaces of the linear glass substrate 31 and the conductive wire 32 in the groove 31a are fixed using a bonding agent 34 such as a high temperature adhesive. As a result, the plurality of linear glass substrates 31 are bonded via the bonding agent 34, and the through hole 1a is configured by the pair of grooves 31a, and the through electrode 12 including the conductive wire 32 is held in the through hole 1a. (FIG. 2, steps ST4 and ST5).

  Moreover, as another example in the manufacturing method of the glass substrate with a penetration electrode by 3rd Embodiment, it is also possible to manufacture as shown in FIG. 5E. That is, as shown in FIG. 5E, the groove 31a is formed only on one side surface of the linear glass substrate 31, and the side surface on which the groove 31a is formed is used as a bonding surface, so that the flat side surface of the other linear glass substrate 31 is formed. And join. At this time, the conductive wire 32 is fitted and held in the groove 31a by the groove 31a and the flat surface, and the pair of linear glass substrates 31 are joined, whereby the through-hole 1a is formed by the groove 31a of the one linear glass substrate 31. And the through electrode 12 is formed by the conductive wire 32. In addition, the cross-sectional shape along the longitudinal direction of the conducting wire 32 is not limited to the semicircular shape shown in FIG. 5E. Other processes in the method for manufacturing the glass substrate with a through electrode are the same as those in the first embodiment, and thus the description thereof is omitted.

  According to the third embodiment, the same effects as those of the first embodiment can be obtained.

(Fourth embodiment)
Next, the manufacturing method of the glass substrate with a penetration electrode using the electroformed grindstone by the 4th embodiment of the present invention is explained. In addition, in the following description, it demonstrates, referring suitably the flowchart of the manufacturing method of the glass substrate with a penetration electrode by 1st Embodiment. 6A, 6C, and 6D are perspective views for explaining a method of manufacturing the glass substrate with through electrodes according to the fourth embodiment, and FIG. 6B is a longitudinal view of the linear glass substrate 41 shown in FIG. 6A. It is sectional drawing along a direction and orthogonal to the side surface.

  As shown in FIGS. 6A and 6B, in the fourth embodiment, a linear glass substrate 41 is formed by a redraw method. Thereafter, the linear glass substrates 41 are arranged so that the side surfaces thereof are on the same plane, and a plurality of grooves 41a are formed on both side surfaces of the linear glass substrate 41 using, for example, an electroforming grindstone (FIG. 2, Step ST3). The dimensions of the electroforming grindstone used here are determined based on the desired groove width L and groove depth D of the groove 41a. Thereafter, if necessary, the opposite side surface of the linear glass substrate 41 is similarly ground using an electroformed grindstone to form the groove 41a.

  Thereafter, as shown in FIG. 6C, a plurality of conductive wires 42 made of, for example, Cu or W, which will later become through electrodes 12, and a plurality of linear glasses in which grooves 41a are formed on at least one side surface, preferably both side surfaces. The substrate 41 and the pair of opposed grooves 41a and the conducting wires 42 are aligned and arranged alternately and sequentially.

  Subsequently, as illustrated in FIG. 6D, the side surfaces of the plurality of linear glass substrates 41 are joined together as the joining surfaces while sandwiching the conductive wires 42 so as to be fitted into the grooves 41 a. At this time, the side surfaces of the linear glass substrate 41 and the conductive wire 42 in the groove 41a are fixed using a bonding agent 43 such as a high temperature adhesive. At this time, there may be a gap between the conductive wire 42 and the pair of grooves 41a due to the difference in shape. In this case, for example, a resin material 44 made of a molten and insulating resin is embedded in a gap between the lead wire 42 and the pair of grooves 41a, so that the lead wire 42 is formed in the through hole 1a made of the pair of grooves 41a. Hold.

  As a result, the plurality of linear glass substrates 41 are bonded via the bonding agent 43, the through hole 1 a is formed by the pair of grooves 41 a, and the conductive wire 42 fixed by the resin material 44 in the through hole 1 a. A through electrode 12 is provided (FIG. 2, steps ST4 and ST5). Other processes in the method for manufacturing the glass substrate with a through electrode are the same as those in the first embodiment, and thus the description thereof is omitted.

  According to the fourth embodiment, the same effect as in the first embodiment can be obtained.

(Fifth embodiment)
Next, a glass substrate with through electrodes according to a fifth embodiment of the present invention will be described. FIG. 7A shows a glass substrate with a through electrode manufactured according to the fifth embodiment. As shown to FIG. 7A, the glass substrate 10 with a penetration electrode by this 5th Embodiment has a substantially rectangular parallelepiped shape. Further, in the glass substrate 10 with a through electrode, the linear glass substrates 13 as a plurality of bases are bonded to each other through an insulator 13a with a surface substantially parallel to the outer peripheral surface of the glass substrate 10 with the through electrode as a bonding surface. A substrate bonded body is formed. Furthermore, the glass substrate 10 with a through electrode sandwiches a plurality of through electrodes 12 in which a pair of linear glass substrates 13 penetrates from an upper surface as one main surface to a lower surface as the other main surface. The plurality of through electrodes 12 are insulated from each other by the linear glass substrate 13 and the insulator 13a.

  Next, the manufacturing method of the glass substrate with a penetration electrode manufactured by formation of an insulator and a conductor without using an etching method according to a fifth embodiment of the present invention will be described. In addition, in the following description, it demonstrates, corresponding suitably with the flowchart of the manufacturing method of the glass substrate with a penetration electrode shown in FIG. FIG. 7B, FIG. 7C, and FIG. 7D are perspective views for explaining the method of manufacturing the glass substrate with through electrodes according to the fifth embodiment.

  As shown in FIG. 7B, in the fifth embodiment, first, the linear glass substrate 13 is formed by the redraw method (FIG. 2, steps ST1 and ST2). Thereafter, the linear glass substrates 13 are placed in close contact with each other on a predetermined holding jig (not shown). Thereafter, an insulator such as photosensitive polyimide is applied onto the plurality of linear glass substrates 13 in close contact with each other by various application methods such as a spin coating method.

  Subsequently, by patterning this insulator using a photomask, as shown in FIG. 7B, an insulating portion 13a having a predetermined pattern is formed on one side surface (one side surface) of the linear glass substrate 13 ( FIG. 2, step ST3). The predetermined pattern here is, for example, a linear pattern orthogonal to the linear glass substrate 13, and an interval (opening width l) between two adjacent patterns is determined based on a desired dimension of the through electrode 12.

  Next, as shown in FIG. 7C, the conductor portion 12a is formed by embedding a conductor between adjacent patterns in the insulating portion 13a (FIG. 2, step ST4). That is, first, after forming a conductor portion 12a by applying a metal-containing paste or the like between patterns of at least a plurality of insulating portions 13a, or performing metal plating after performing a surface treatment, The surface is planarized by a chemical mechanical polishing (CMP) method. Thereby, the insulation between the conductor parts 12a and the plate thickness accuracy are ensured.

  Thereafter, as shown in FIG. 7D, the plurality of linear glass substrates 13 are individually separated, so that at least one side surface of the linear glass substrate 13 is embedded in the gap of the insulating portion 13 a and then the through electrode 12. A conductor portion 12a is formed.

  Next, a plurality of linear glass substrates 13 are laminated toward the side surface on which the insulator 13a and the conductor portions 12a are formed while aligning the conductor portions 12a and the linear glass substrates 13 with each other. They are joined to each other (FIG. 2, step ST5). At this time, the side surfaces of the linear glass substrate 13 may be fixed using, for example, a high-temperature adhesive.

  As described above, as shown in FIG. 7A, the glass substrate 10 with through electrodes according to the fifth embodiment is manufactured.

  In addition, regarding the shape of the conductor portion, not only a shape that simply penetrates from one main surface to the other main surface, but also the conductor portion 12b and the conductor portion 12c are branched as shown in FIG. 7E. It is also possible. Moreover, the cross-sectional shape along the longitudinal direction of the conductor part 12a is not limited to the rectangular parallelepiped shape shown to FIG. 7C and FIG. 7D. Other processes in the method for manufacturing the glass substrate with a through electrode are the same as those in the first embodiment, and thus the description thereof is omitted.

  According to the fifth embodiment, the same effect as that of the first embodiment can be obtained, and the patterning shape of the insulator 13a can be appropriately specified by design, so that a glass substrate with a through electrode can be provided as necessary. It is possible to configure a desired circuit between the ten surfaces.

(Sixth embodiment)
Next, the manufacturing method of the glass substrate with a penetration electrode using the electroformed grindstone and the wire saw by the 6th Embodiment of this invention is demonstrated. In addition, in the following description, it demonstrates, referring suitably the flowchart of the manufacturing method of the glass substrate with a penetration electrode by 1st Embodiment. FIG. 8A, FIG. 8B, FIG. 8C, and FIG. 8D are perspective views for explaining a method for manufacturing a glass substrate with a through electrode according to the sixth embodiment.

  As shown in FIG. 8A, in the sixth embodiment, unlike the first to fourth embodiments, a flat thin glass substrate having a plate thickness d larger than that of the linear glass substrate 11 by the redraw method. 51 is formed. Thereafter, similarly to the fourth embodiment, a plurality of grooves 51a are formed on both surfaces of the thin glass substrate 51 using, for example, an electroformed grindstone (corresponding to FIG. 2, step ST3). The dimensions of the electroforming grindstone used here are determined based on the desired groove width L and groove depth D of the groove 51a. It is also possible to form the groove 51a in the linear glass substrate 51 by forming a desired groove in the substrate before being stretched by the redraw method. In this case, the groove is formed in the substrate before being stretched by the redraw method. In the case of forming, since the shape of the groove before stretching can be reduced by the amount of the drawing rate by the redraw method, it is desirable to reversely calculate the drawing rate and form a desired groove on the substrate before redrawing. As a method for forming the groove, an etching method, a sand blast method, or the like can be employed.

  After that, as shown in FIG. 8B, for example, a plurality of conductive wires 52 made of Cu, W, etc., which will later become through electrodes 12, and a plurality of thin glass substrates 51 having grooves 51a formed on at least one surface, preferably both surfaces. Are aligned and arranged alternately one after another while aligning the pair of opposing grooves 51a and the conducting wire 52.

  Subsequently, as shown in FIG. 8C, the conductive wires 52 are sandwiched so as to be fitted inside the grooves 51a, and the arrangement surfaces of the conductive wires 52 in which the grooves 51a are formed in the plurality of thin glass substrates 51 are joined together as joint surfaces. Let At this time, the surfaces of the thin glass substrates 51 and the conductive wires 52 in the grooves 51a are fixed by a bonding agent 53 such as a high temperature adhesive. Further, there may be a gap between the conductive wire 52 and the pair of grooves 51a. In this case, the conductive wire 52 is held inside the pair of grooves 51a by embedding, for example, a resin material 54 made of a molten and insulating resin in the gap between the conductive wire 52 and the pair of grooves 51a. Thereby, the some thin glass substrate 51 is joined via the bonding agent 53, and the conducting wire 52 is hold | maintained by a pair of groove | channel 51a and the resin material 54 (FIG. 2, step ST4, ST5).

  Thereafter, as shown in FIG. 8D, a glass substrate assembly composed of a plurality of thin glass substrates 51 joined so as to sandwich the conducting wire 52 is orthogonal to the surface of the thin glass substrate 51 using, for example, a wire saw, And it cut | disconnects along the direction orthogonal to the longitudinal direction of the conducting wire 52. FIG. As a result, a glass substrate assembly having a desired plate thickness on which the conducting wire 52 as the through electrode 12 is held is cut out. Then, the glass substrate 1 with a through electrode having a desired plate thickness is manufactured by polishing the surface of the glass substrate assembly (FIG. 2, step ST6). Since other processes in the method for manufacturing the glass substrate with a through electrode are the same as those in the first and fourth embodiments, the description thereof is omitted.

  According to the sixth embodiment, the same effects as those of the first and fourth embodiments can be obtained, and after laminating a plurality of thin glass substrates 51, the glass substrate assembly is connected to the length of the conductor 52. By cutting along the direction orthogonal to the direction, a plurality of glass substrates 1 with through electrodes can be manufactured with a desired plate thickness.

(Seventh embodiment)
Next, a glass substrate with a through electrode having a heat dissipation structure according to a seventh embodiment of the present invention will be described. 9A, 9B, 9C, and 9D are perspective views showing glass substrates with through electrodes according to the first, second, third, and fourth examples of the seventh embodiment, respectively. And as shown to FIG. 9A-FIG. 9D, the glass substrate 1 with a penetration electrode by this 7th Embodiment is at least 1 linear glass substrate of the linear glass substrates which comprise the glass substrate 1 with a penetration electrode. However, it has the heat dissipation structure which consists of a hollow part formed so that it may communicate with the exterior along the longitudinal direction. Below, the 1st-4th Example which is a specific example which has this thermal radiation structure is demonstrated.

(First embodiment)
As shown in FIG. 9A, a glass substrate 1 with a through electrode according to the first embodiment is formed in a linear glass substrate 11 whose side surfaces are bonded to each other like the glass substrate 1 with a through electrode shown in FIG. 1A. At least one linear glass substrate 61 having 61a is joined. The hollow portion 61a is formed through a plurality of holes along the longitudinal direction of the linear glass substrate 61 so as to communicate with the outside so that a cross section perpendicular to the longitudinal direction is substantially rectangular. Release. Then, by supplying a coolant such as water from one end of the hollow portion 61a and discharging it from the other end, it is possible to cool the glass substrate 1 with penetrating electrodes and the integrated circuit provided adjacent thereto. In addition, about the installation position of the linear glass substrate 61 in the glass substrate 1 with a penetration electrode, even if it is the one end part or both ends along the sequence of the linear glass substrate 11 in the glass substrate 1 with a penetration electrode, this is orthogonal to this. Further, it may be at both ends of the plurality of linear glass substrates 11 on the cut surface side or between the two linear glass substrates 11.

  A method for manufacturing the linear glass substrate 61 having the hollow portion 61a configured as described above will be described. In the production of the linear glass substrate 61 according to the first embodiment, first, a cross section of the base glass plate 2 shown in FIG. 3 along the horizontal direction orthogonal to the direction of redraw is shown in FIG. 9A. It is manufactured in a hollow shape so as to be similar to the cross section orthogonal to the longitudinal direction of the linear glass substrate 61. Thereafter, the base glass plate 2 is drawn by a redraw method using the heating and stretching apparatus 100. Here, if necessary, drawing by the redraw method may be performed while supplying a gas such as air having a pressure higher than atmospheric pressure into the hollow portion of the base glass plate 2. Thus, the linear glass substrate 61 according to the first embodiment is manufactured.

  And this linear glass substrate 61 is made into the linear glass substrate 11 in the glass substrate 1 with a penetration electrode shown in FIG. 1A, one end part or both ends along the line, or a plurality of the linear glass substrates 11 that are orthogonal to each other. It joins to the both ends of the cut surface side. As a result, the glass substrate 1 with through electrodes according to the first example of the seventh embodiment is manufactured. Since other manufacturing methods are the same as those in the first to fourth and sixth embodiments, the description thereof will be omitted.

(Second embodiment)
Moreover, the glass substrate 1 with a through electrode according to the second embodiment is an end portion of the glass substrate 1 with a through electrode shown in FIG. 1A or between two linear glass substrates 11 among a plurality of linear glass substrates 11. A linear glass substrate 71 having a hollow portion 71a shown in FIG. Unlike the first embodiment, the hollow portion 71a has a substantially circular shape and communicates with the outside along the longitudinal direction of the linear glass substrate 71, and releases heat through the inside. Other configurations are the same as those in the first embodiment, and thus the description thereof is omitted.

  Moreover, about the manufacturing method of the glass substrate 1 with a penetration electrode by 2nd Example, first, the cross section along the horizontal direction orthogonal to the direction of redrawing of the base material glass plate 2 shown in FIG. It is manufactured in a substantially circular hollow shape so as to be similar to the cross section orthogonal to the longitudinal direction of the linear glass substrate 71 shown in 9B. Thereafter, the glass substrate 71 shown in FIG. 9B is manufactured by drawing the base glass plate 2 by a redraw method using the heating and stretching apparatus 100. Since other manufacturing methods are the same as those in the first embodiment, the description thereof will be omitted.

(Third embodiment)
Moreover, the glass substrate 1 with a through electrode according to the third embodiment has a plurality of pieces shown in FIG. 9C between the ends of the glass substrate 1 with a through electrode shown in FIG. The linear glass substrate 81 having the hollow portion 81a is joined. Unlike the first and second embodiments, the hollow portion 81a has a substantially circular cross section perpendicular to the longitudinal direction and communicates with the outside independently of each other along the longitudinal direction of the linear glass substrate 81. A plurality are formed, and heat is released through the inside. Other configurations are the same as those in the first and second embodiments.

  Moreover, about the manufacturing method of the glass substrate 1 with a penetration electrode by 3rd Example, the cross section along the horizontal direction of the base material glass plate 2 shown in FIG. It is manufactured so as to have a plurality of hollow structures whose cross sections are substantially circular and communicate with each other independently of each other so as to be similar to the cross section orthogonal to the direction. And the linear glass substrate 81 shown to FIG. 9C is manufactured by drawing this base material glass plate 2 by the redraw method using the heating extending | stretching apparatus 100. FIG. Other manufacturing methods are the same as those in the first and second embodiments.

(Fourth embodiment)
Moreover, the glass substrate 1 with a through-electrode according to the fourth embodiment is a hollow shown in FIG. 9D between the end of the glass substrate 1 with the through-electrode shown in FIG. 1A or between the joints in the plurality of linear glass substrates 11. A linear glass substrate 91 having a portion 91a is bonded. Unlike the first to third embodiments, the hollow portion 91a communicates with the outside in a cloud shape in which, for example, a cross section perpendicular to the longitudinal direction overlaps a plurality of circles along the longitudinal direction of the linear glass substrate 91. And release heat through the inside. About another structure, it is the same as that of the 1st-3rd Example.

  Moreover, about the manufacturing method of the glass substrate 1 with a penetration electrode by a 4th Example, first, it is the linear glass substrate 91 which the cross section along the horizontal direction shows the base material glass plate 2 shown in FIG. 9D. It is manufactured in a hollow shape so as to be similar to a cross section perpendicular to the longitudinal direction of the. Thereafter, the glass substrate 91 according to the fourth embodiment is manufactured by drawing the base glass plate 2 by the redraw method using the heating and stretching apparatus 100. About another manufacturing method, it is the same as that of the 1st-3rd Example.

  According to each example of the seventh embodiment described above, when the glass substrate 1 with a through electrode is used in contact with an integrated circuit that generates heat when driving, for example, a semiconductor device, the glass substrate 1 with the through electrode is used. Since the heat generated by the through electrode 12 and the heat generated by the integrated circuit can be released to the outside through the hollow portions 61a, 71a, 81a, 91a of the linear glass substrates 61, 71, 81, 91, the Peltier element The glass substrate 1 with through electrodes can be cooled without providing a special cooling device such as the above, and the heat transmitted from the integrated circuit can be dissipated, and the integrated circuit can be cooled together.

  As mentioned above, although embodiment of this invention was described concretely, this invention is not limited to the above-mentioned embodiment, Various deformation | transformation based on the technical idea of this invention is possible. For example, the numerical values, the heating stretching apparatus, the manufacturing conditions of the linear glass substrate, the etching method, and the groove forming technique mentioned in the above embodiment are merely examples, and different numerical values, heating stretching apparatuses, and wires as necessary. The manufacturing conditions, the etching method, and the groove forming technique of the glass substrate may be used.

  In the third embodiment described above, the groove 31a is formed by the liquid phase etching method, but is not necessarily limited to the liquid phase etching (wet etching) method, and the reactive ion etching (RIE) method is used. It is also possible to use a dry etching method such as.

  In the first embodiment described above, the groove 11a formed on the side surface of the linear glass substrate 11 is linear. However, the groove is not necessarily limited to a linear shape, and has a through electrode as a final product. As long as the through-hole 1a can be formed in the glass substrate 1 and the through-electrode 12 can be sandwiched, it can be curved.

  Moreover, in the above-mentioned embodiment, although the glass substrate 1 with a penetration electrode is comprised from glass, it is not necessarily limited to glass, If insulation can ensure and a linear body can be formed, Various materials can be used.

  Moreover, in the above-mentioned embodiment, although the conducting wire which consists of Cu, W, etc. was used as the penetration electrode 12 which comprises a penetration electrode, it is not necessarily limited to a conducting wire, Cu fuse | melted only inside the groove | channel 11a Or a metal such as W may be embedded.

  In the first embodiment described above, the through electrode is provided inside the through hole formed by a pair of grooves formed by joining two substrates. However, the present invention is not necessarily limited thereto. The groove 11a is formed on the side surface of one linear glass substrate 11, and the side surface on which the groove 11a is formed as a flat surface without forming the groove on the side surface of the other linear glass substrate 11, and the flat surface The through-hole 1a may be configured with only one groove 11a.

DESCRIPTION OF SYMBOLS 1,10 Glass substrate with a through-electrode 1a Through-hole 2 Base material glass plate 3 Glass strip 11, 13, 21, 31, 41, 61, 71, 81, 91 Linear glass substrate 11a, 22a, 31a, 41a, 51a Groove DESCRIPTION OF SYMBOLS 12 Through electrode 12a Conductor part 13a Insulator 22 Protective film 23, 32, 42, 52 Conductive wire 33 Resist pattern 34, 43, 53 Bonding agent 44, 54 Resin material 51 Thin glass substrate 61a, 71a, 81a, 91a Hollow part 100 Heating Stretching apparatus 101 Heating furnace 101a, 101b, 101c Heater 102 Base material feed mechanism 103a, 103b Take-up mechanism 104 Cutter

Claims (20)

A substrate,
A plurality of conductors arranged penetrating from one main surface of the substrate to the other main surface,
The substrate comprises a substrate bonded body formed by bonding a plurality of substrates,
The substrate with a through electrode, wherein the plurality of bases are bonded to each other with the outer peripheral surfaces different from the main surface as bonding surfaces so as to sandwich the conductor.   The base has a groove provided on at least one surface from one side to the other side, and the plurality of bases are joined to each other using the surface provided with the groove as a joint surface. The substrate with a through electrode according to claim 1, wherein the substrate is provided in a through hole constituted by the groove.   The base body has a substantially rectangular parallelepiped shape, and a plurality of the grooves are provided on both side surfaces which are opposite to each other among the side surfaces parallel to the longitudinal direction of the rectangular parallelepiped shape of the base body, and the pair of the base members are joined. 3. The substrate with through electrodes according to claim 1, wherein the side surfaces of the substrate provided with the grooves are aligned and joined so that the positions of the grooves coincide with each other.   The board | substrate with a penetration electrode of Claim 3 with which the some groove | channel provided in the said side surface is provided in the orthogonal | vertical direction with respect to the said longitudinal direction, and mutually parallel.   The board | substrate with a penetration electrode of any one of Claims 1-4 in which the said joining surface consists of the surface of a resin layer, and the said groove | channel is formed in the said resin layer.   The substrate with penetrating electrodes according to any one of claims 1 to 5, wherein the base is made of glass or glass having a resin provided at least on the bonding surface side.   The base has a substantially rectangular parallelepiped shape, the base has a conductor portion provided on at least one surface from one side to the other side, and the plurality of bases are provided with the conductor portion. The side surfaces provided with the conductor parts of the pair of base bodies to be joined are aligned and joined so that the positions of the conductor parts coincide with each other. The board | substrate with a penetration electrode of Claim 1 characterized by the above-mentioned.   The board | substrate with a penetration electrode of Claim 7 provided with the said some conductor part in the side surface used as the surface on the opposite side among the side surfaces parallel to the longitudinal direction in the rectangular parallelepiped shape of the said base | substrate.   The board | substrate with a penetration electrode of Claim 8 with which the some conductor part provided in the said side surface is provided in the orthogonal | vertical direction with respect to the said longitudinal direction, and mutually parallel.   The said base | substrate conjugate | zygote is further equipped with the hollow base | substrate which has the hollow part connected to the exterior between the said several base | substrates, or the one end part of these several base | substrates joined mutually. The substrate with a through electrode according to any one of 9. A substrate forming step of forming a plurality of substrates;
A groove forming step of forming at least one groove from one side to the other side of at least one surface of each of the plurality of bases;
A substrate bonding step for manufacturing a substrate bonded body by bonding the plurality of substrates to each other using the surface in which the groove is formed as a bonding surface in at least one of the substrates;
A conductor installation step of providing a conductor in a through-hole constituted by the groove in the base body assembly;
The manufacturing method of the board | substrate with a penetration electrode characterized by including these.   The through electrode according to claim 11, further comprising a resin layer forming step of forming a resin layer on the bonding surface side of the plurality of substrates simultaneously with the substrate forming step or after the substrate forming step. A method for manufacturing a substrate.   After the resin layer forming step, the conductor is pressed to the resin layer by bonding the plurality of bases while keeping the conductor at a temperature higher than the glass transition temperature of the resin layer, and the groove forming step and the base body bonding step The method for manufacturing a substrate with a through electrode according to claim 12, wherein the conductor installation step is performed in parallel.   The method for manufacturing a substrate with a through electrode according to claim 12 or 13, wherein the resin layer is made of a thermoplastic resin, a high-temperature adhesive, or a photoresist.   The method for manufacturing a substrate with a through electrode according to claim 11, wherein, in the groove forming step, the groove is formed by liquid phase etching or mechanical grinding. A substrate forming step of forming a plurality of substrates;
A conductor portion forming step of forming at least one conductor portion from one side to the other side on at least one surface of each of the plurality of substrates;
A substrate bonding step for manufacturing a substrate bonded body by bonding the plurality of substrates to each other with the surface on which the conductor portion is formed as a bonding surface in at least one of the substrates;
The manufacturing method of the board | substrate with a penetration electrode characterized by including these.   The method of manufacturing a substrate with a through electrode according to claim 16, wherein the conductor portion forming step includes a step of forming an insulator portion at a place other than the conductor portion on a surface on which the conductor portion is formed.   The method of manufacturing a substrate with a through electrode according to claim 16 or 17, wherein the conductor part forming step forms the conductor part by photolithography.   The method for manufacturing a substrate with a through electrode according to any one of claims 16 to 18, wherein, in the base body forming step, the base body is formed by a redraw method.   The base body forming step further includes a hollow base body forming step of forming a hollow base body having a hollow portion communicating with the outside, and the base body joining step further includes a step of joining the hollow base body to manufacture the base body joined body. The manufacturing method of the board | substrate with a penetration electrode of any one of Claims 11-19 characterized by the above-mentioned.

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