JP2014190709A - Handler, and inspection device - Google Patents

Abstract

[PROBLEMS] To detect whether or not a transfer object remains in a socket after performing a transfer operation on the transfer object placed on a socket, and to quickly detect the transfer object with as little information as possible. To provide a handler and inspection device that can be performed in
A handler includes a transport unit that transports an IC device 100 in an individual socket for inspection 61 to a different position, and slit light 601 and 602 toward the individual socket for inspection 61 after the transport unit starts the transport operation. A light irradiating unit for irradiating the image, an imaging unit for imaging the individual socket for inspection 61 in the state irradiated with the slit light 601 and 602 from the light irradiating unit, and the individual socket for inspection 61 on which the IC device 100 is not placed. And a control unit that detects a difference between the position and the irradiation position irradiated with the slit lights 601 and 602 and determines whether or not the IC device 100 is present in the individual socket for inspection 61.
[Selection] Figure 16

Description

  The present invention relates to a handler and an inspection apparatus.

2. Description of the Related Art Conventionally, an electronic component test apparatus that inspects electrical characteristics of an electronic component such as an IC device is known (see, for example, Patent Document 1).
The electronic component test apparatus described in Patent Document 1 supplies an electronic component from a supply tray to a socket, inspects the electrical characteristics of the electronic component supplied to the socket, and responds to the inspection result after completion of the inspection. Thus, the electronic components are classified from the socket into the classification tray.

  By the way, in the electronic component testing apparatus described in Patent Document 1, in the process of classifying the electronic components from the socket to the classification tray after the inspection of the electrical characteristics, for example, the electronic components are not transported due to a cause such as failure of transporting the electronic components. It may remain in the socket. For this reason, in this electronic component testing apparatus, it is performed to inspect the remaining electronic components. This residual inspection method is performed as follows.

First, inspection image data of a socket to be subjected to a residual inspection is acquired.
Next, image processing for correcting pixel values (brightness: brightness) in accordance with the inspection image data is performed on all the pixels on the reference image data of the socket in a state where no electronic component is supplied.
Next, difference processing is performed between the entire inspection image data and the entire reference image data after image processing to generate a difference image.
When the difference image is equal to or smaller than the threshold value, it is determined that there is no residue, and when the difference image exceeds the threshold value, it is determined that there is a residue.

  However, in such a residual inspection method, for example, if the correction is insufficient or not appropriate, the determination of the presence or absence of the residue may differ from the actual presence or absence of the residue. In addition, since correction is performed for the entire reference image data, that is, data with a significantly large amount of information, a large amount of time is spent on the image processing time, making it difficult to quickly determine whether there is a residual image. Furthermore, a difference image must be generated when determining the presence or absence of a residue, which also makes it difficult to make a quick determination.

Japanese Patent No. 4820823

  The object of the present invention is to quickly detect the transfer object remaining in the socket after performing the transfer operation on the transfer object placed on the socket, with the smallest possible amount of information. It is an object of the present invention to provide a handler and an inspection device capable of reliably performing detection.

Such an object is achieved by the present invention described below.
The handler of the present invention is a socket installation portion in which a socket having a placement portion capable of placing an object to be transported is installed;
A transport unit for transporting the transported object subjected to the inspection from the socket to another position;
A light irradiation unit configured to irradiate light toward the placement unit after the transfer unit has started a transfer operation;
An imaging unit that images the socket in a state where the light from the light irradiation unit is irradiated;
Detecting the difference between the position of the placement unit in a state where the transport object is not placed on the socket and the irradiation position irradiated with the light, and the presence or absence of the transport object on the placement unit And a control unit that determines whether or not.
As a result, after performing a transport operation on the transport object placed on the socket, when detecting whether or not the transport object remains in the socket, the detection is ensured promptly with as little information as possible. Can be done.

In the handler of the present invention, the socket has a plate shape,
It is preferable that the light irradiation unit is configured to irradiate at least one slit light with respect to the socket.
Thus, depending on the state of the socket mounting portion, that is, in a state where the object to be transported remains on the socket mounting portion and a state in which the object to be transported does not remain on the socket mounting portion. The shape of the portion irradiated with the slit light changes. Based on the amount of the change, it can be determined whether or not there is a remaining object to be transported.

In the handler according to the aspect of the invention, when the difference exceeds a threshold, the control unit determines that the conveyance target is present, and when the difference is equal to or less than the threshold, there is no conveyance target. It is preferable to judge that.
As a result, the residual detection can be performed more quickly and reliably with as little information as possible.

In the handler of the present invention, the transport object is a small piece having a front side surface and a back side surface,
The position of the placement unit in a state where the transport object is not placed on the socket is the placement surface,
In the irradiation position, when the conveyance object remains, at least a part of the irradiation position becomes the surface on the front side, and when the conveyance object does not remain, Preferably it is.

  As a result, when the conveyance object remains, the irradiation position is shifted from the position of the mounting portion in a state where the conveyance object is not mounted on the socket. A difference is certain. On the other hand, in the case where the object to be transported does not remain, there is almost no difference between the position of the placing portion in the state where the object to be transported is not placed in the socket and the irradiation position, Or it does not occur at all. Then, according to the magnitude of the difference, it is possible to easily and reliably determine whether the conveyance target remains.

In the handler of the present invention, the position of the placement unit in a state where the transport object is not placed in the socket is given as coordinate data,
The irradiation position is preferably comparison data on the same coordinates as the coordinate data and compared with the coordinate data.
Thereby, compared with the case where the position of the mounting part in which the conveyance target object is not mounted in the socket is captured from, for example, an image, the position of the mounting part in the state where the transport target object is not mounted in the socket Can be quickly used to detect the difference from the irradiation position.

In the handler of the present invention, the light irradiation unit irradiates a plurality of slit lights toward the placement unit, and in the captured image by the imaging unit, the irradiation position corresponds to each slit light. Exists,
The control unit detects the difference between the position of the placement unit in a state where the transport object is not placed on the socket and each irradiation position, and even one of the differences is detected. When the threshold value is exceeded, it is preferable to determine that the conveyance object is present.
Thereby, accurate and fail-safe residual detection can be performed.

In the handler according to the present invention, the handler includes a storage unit that stores the position of the mounting unit in a state where the transport object is not mounted on the socket,
When the control unit detects the difference, the control unit preferably calls the position of the placement unit in a state where the transport object is not placed on the socket from the storage unit.
Thereby, when detecting the difference of the position of the mounting part in the state in which the conveyance target object is not mounted in the socket, and an irradiation position, the detection can be performed rapidly.

In the handler according to the aspect of the invention, the control unit can change the position of the placement unit in a state where the transport object is not placed on the socket, or the transport object is placed on the socket. A plurality of types of the positions of the placement unit in a state where the transport object is not placed are stored, and one socket is provided from the position of the placement unit in a state where the transport object is not placed in the sockets of the plurality of types. It is preferable that the position of the placement unit in a state where the transport object is not placed is selected.
Thereby, for example, according to the depth of the mounting portion, it is possible to appropriately set the position of the mounting portion in a state where the transporting target object is not mounted on the socket. Can be done accurately.

In the handler of the present invention, it is preferable that the handler includes a notifying unit that notifies the presence of the transport object when the control unit determines that the transport object exists.
Thereby, for example, the operator of the handler can move to an operation of removing the remaining transport object from the socket.
In the handler according to the aspect of the invention, when the control unit determines that there is no conveyance object, the conveyance unit supplies the conveyance object that has not been inspected yet to the placement unit, and places the conveyance object on the loading unit. It is preferable to perform a supply operation.
Thereby, the residual detection can be continuously performed.

In the handler according to the aspect of the invention, it is preferable that the imaging unit is a camera arranged to face the mounting unit side of the socket.
As a result, the socket can be reliably imaged from the mounting side, and thus the obtained image becomes an image in a plan view and is easy to perform image processing.
The inspection apparatus of the present invention includes the handler of the present invention,
A socket installed on the handler and having a placement portion on which the object to be transported can be placed.
As a result, after performing a transport operation on the transport object placed on the socket, when detecting whether or not the transport object remains in the socket, the detection is ensured promptly with as little information as possible. Can be done.

It is a schematic plan view which shows 1st Embodiment of the inspection apparatus (handler) of this invention. It is the figure (side view) seen from the arrow A direction in FIG. It is a schematic perspective view of the 1st hand unit which the inspection robot of the inspection apparatus shown in FIG. 1 has. It is a block diagram of the principal part of the inspection apparatus shown in FIG. It is a flowchart which shows the control program of the control apparatus incorporated in the test | inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the test | inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the test | inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the test | inspection apparatus shown in FIG. FIG. 2 is a plan view for explaining an electronic component inspection procedure by the inspection apparatus shown in FIG. 1. It is a top view explaining the test | inspection procedure of the electronic component by the test | inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the test | inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the test | inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the test | inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the test | inspection apparatus shown in FIG. FIG. 1A is a plan view of the socket of the inspection apparatus shown in FIG. 1 (a) shows a state where electronic components are not yet accommodated, (b) shows a state where electronic components are accommodated, and (c) shows removal of the electronic components It shows a state immediately after the operation is performed). The figure corresponding to FIG.15 (c) ((a) shows the BB sectional drawing in FIG.15 (c), (b) shows the captured image of (a), (c) is a residual presence or absence. Is shown). The figure corresponding to FIG.15 (c) ((a) shows CC sectional view taken on the line in FIG.15 (c), (b) shows the captured image of (a), (c) is the presence or absence of residual. Is shown). It is a figure which shows the reference position in the inspection apparatus (2nd Embodiment) of this invention.

Hereinafter, a handler and an inspection device of the present invention are explained in detail based on a suitable embodiment shown in an accompanying drawing.
<First Embodiment>
FIG. 1 is a schematic plan view showing a first embodiment of an inspection apparatus (handler) according to the present invention, FIG. 2 is a view (side view) seen from the direction of arrow A in FIG. 1, and FIG. 4 is a schematic perspective view of a first hand unit included in the inspection robot of the inspection apparatus shown in FIG. 4, FIG. 4 is a block diagram of the main part of the inspection apparatus shown in FIG. 1, and FIG. 5 is a control built in the inspection apparatus shown in FIG. FIG. 6 to FIG. 14 are plan views for explaining an electronic component inspection procedure by the inspection apparatus shown in FIG. 1, and FIG. 15 is a plan view of a socket of the inspection apparatus shown in FIG. ((A) shows a state where the electronic component is not yet stored, (b) shows a state where the electronic component is stored, and (c) shows a state immediately after the removal operation for the electronic component is performed), FIG. 16 is a diagram corresponding to FIG. 15C ((a) is FIG. 1). (C) shows a cross-sectional view taken along the line BB, (b) shows the captured image of (a), (c) shows the presence or absence of residual), FIG. 17 is shown in FIG. 15 (c) Corresponding figures ((a) shows a cross-sectional view taken along the line CC in FIG. 15 (c), (b) shows a captured image of (a), and (c) shows judgment of the presence or absence of residual). is there.

  In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis (first axis), a Y axis (second axis), and a Z axis (third axis). A direction parallel to the X axis is referred to as “X direction (first direction)”, a direction parallel to the Y axis is referred to as “Y direction (second direction)”, and a direction parallel to the Z axis is referred to as “Z direction”. (Third direction) ". In each of the X direction, the Y direction, and the Z direction, the direction in which the arrow points is referred to as “+”, and the opposite direction is referred to as “−”. The + Z direction is referred to as “up” or “upward”, and the −Z direction is referred to as “down” or “down”.

  The inspection apparatus 1 shown in FIGS. 1, 2, 4, and 6 to 14 includes, for example, an IC (Integrated Circuit) device, an LCD (Liquid Crystal Display), and a CIS (Contact) as inspection objects (conveyance objects). This is a device for inspecting (testing) the electrical characteristics of test parts (electronic parts) such as image sensors. In the following, for convenience of explanation, the case where the IC device 100 is used as a test part will be described as a representative. Further, the inspection of the electrical characteristics of the IC device 100 is referred to as “electrical inspection”.

  As shown in FIG. 15, the IC device 100 is an IC chip (small piece) having a square shape in plan view, and at least the upper surface (front surface) 100a has a black color. For example, a product number (not shown) is printed on the upper surface 100a. Further, external terminals (not shown) arranged in a matrix of a plurality of rows in the X direction and a plurality of columns in the Y direction are provided on the lower surface (back surface) 100b of the IC device 100 in a protruding manner.

  The inspection apparatus 1 includes a supply tray 2, a collection tray 3, a first shuttle 4, a second shuttle 5, an inspection socket (socket) 6 that is an inspection unit, a supply robot 7, a collection robot 8, Inspection robot (conveyance unit) 9, laser light source (light irradiation unit) 600, CCD (charge-coupled device) camera (imaging unit) 700, display device (display unit) 800, alarm device (notification unit) 900 and a control device (control unit) 10 that controls these units.

  In such an inspection apparatus 1, the configuration excluding the inspection socket 6 among these parts, that is, the supply tray 2, the recovery tray 3, the first shuttle 4, the second shuttle 5, the supply robot 7, A handler for carrying the IC device 100 by the collection robot 8, the inspection robot 9, the laser light source 600, the CCD camera 700, the display device 800, the alarm device 900, and the control device 10 (of the present invention). Handler) is configured. Note that the configuration of the handler of the present invention is not limited to this, and at least one of these components may be omitted as necessary, or another configuration (for example, a hot plate or a chamber) may be added. May be.

  Further, the inspection apparatus 1 includes a pedestal 11 on which the above-described parts are mounted, and a safety cover (not shown) that covers the pedestal 11 so as to accommodate the respective parts. The inside of the safety cover (hereinafter referred to as “region S”). The first shuttle 4, the second shuttle 5, the inspection socket 6, the supply robot 7, the recovery robot 8, the inspection robot 9, the laser light source 600, and the CCD camera 700 are arranged, and the region S A supply tray 2 and a collection tray 3 are arranged so as to be movable inward and outward.

Hereinafter, each of these units will be sequentially described in detail.
The supply tray 2 is a tray for transporting the IC device 100 to be inspected from outside the region S into the region S. As shown in FIG. 1, the supply tray 2 has a plate shape, and a plurality of pockets 21 for holding the IC device 100 are formed in a matrix form in the X direction and the Y direction on the upper surface thereof. .

  Such a supply tray 2 is placed on a stage (not shown) that moves on a rail 23 extending in the Y direction so as to straddle the inside and outside of the region S. The supply tray 2 can reciprocate in the ± Y direction along the rail 23 by moving the stage by a drive means (not shown) using, for example, a linear motor as a drive source. Therefore, the supply tray 2 in which the IC device 100 is accommodated is placed on a stage outside the area S, the supply tray 2 is moved into the area S together with the stage, and all the IC devices 100 are removed from the supply tray 2. The operation of moving the supply tray 2 out of the area S together with the stage can be repeated.

The collection tray 3 is a tray for storing the IC device 100 that has been subjected to the electrical inspection and transporting it from the area S to the outside of the area S. As shown in FIG. 1, the collection tray 3 has a plate shape, and a plurality of pockets 31 for holding the IC device 100 are formed in a matrix form in the X direction and the Y direction on the upper surface thereof. .
Such a collection tray 3 is placed on a stage (not shown) that moves on a rail 33 extending in the Y direction so as to straddle the inside and outside of the region S. The collection tray 3 can be reciprocated in the ± Y direction along the rail 33 by moving the stage by a drive means (not shown) using, for example, a linear motor as a drive source. Therefore, when the inspected IC device 100 is accommodated in the collection tray 3 in the area S, the collection tray 3 is moved out of the area S, and the collection tray 3 on the stage is replaced with an empty tray, the collection is performed again. The operation of moving the tray 3 into the area S can be repeated.

Such a collection tray 3 is provided apart from the supply tray 2 in the + X direction, and between the supply tray 2 and the collection tray 3, the first shuttle 4, the second shuttle 5, and the inspection tray are provided. A socket 6 is arranged.
The first shuttle 4 further transports the IC device 100 that has been transported into the region S by the supply tray 2 to the vicinity of the inspection socket 6. Further, the first shuttle 4 has been inspected after being electrically inspected by the inspection socket 6. The IC device 100 is transported to the vicinity of the collection tray 3.

  As shown in FIG. 1, the first shuttle 4 includes a base member 41 and two trays 42 and 43 fixed to the base member 41. These two trays 42 and 43 are provided side by side in the X direction. In addition, four pockets 421 and 431 for holding the IC device 100 are formed on the upper surfaces of the trays 42 and 43, respectively, in a matrix of two columns in the X direction and two rows in the Y direction.

  Of the trays 42 and 43, the tray 42 positioned on the supply tray 2 side is a tray for transferring and storing the IC device 100 stored in the supply tray 2, and the tray 43 positioned on the collection tray 3 side is This is a tray for accommodating the IC device 100 that has been inspected for electrical characteristics in the inspection socket 6. That is, the tray 42 is a tray for storing the untested IC device 100, and the tray 43 is a tray for storing the tested IC device 100.

  In such a first shuttle 4, the base member 41 is supported by a rail 44 extending in the X direction. For example, the first shuttle 4 reciprocates along the rail 44 in the ± X direction by a driving means (not shown) using a linear motor as a driving source. It is possible. Then, the first shuttle 4 moves to the −X direction side, the tray 42 is aligned on the + Y direction side with respect to the supply tray 2, and the tray 43 is aligned on the + Y direction side with respect to the inspection socket 6 (see FIG. 1, 6, 7, 10, 11, 13, and 14) and the first shuttle 4 moves to the + X direction side, and the tray 43 is aligned to the + Y direction side with respect to the collection tray 3. In this state, the tray 42 can be in the + Y direction side with respect to the inspection socket 6 (see FIGS. 8, 9, and 12).

  The second shuttle 5 has the same function and configuration as the first shuttle 4 described above. That is, the second shuttle 5 further transports the IC device 100 that has been transported into the region S by the supply tray 2 to the vicinity of the inspection socket 6, and further has been inspected by the inspection socket 6. This is for transporting the IC device 100 to the vicinity of the collection tray 3.

  As shown in FIG. 1, the second shuttle 5 includes a base member 51 and two trays 52 and 53 fixed to the base member 51. These two trays 52 and 53 are provided side by side in the X direction. Further, on the upper surfaces of the trays 52 and 53, four pockets 521 and 531 for holding the IC device 100 are formed in a matrix of two columns in the X direction and two rows in the Y direction, respectively.

  Of the trays 52 and 53, the tray 52 located on the supply tray 2 side is a tray for transferring and accommodating the IC device 100 accommodated in the supply tray 2, and the tray 43 located on the collection tray 3 side is inspected. This is a tray for accommodating the IC device 100 that has been inspected for electrical characteristics in the socket 6 for use. That is, the tray 52 is a tray for accommodating the untested IC device 100, and the tray 53 is a tray for accommodating the tested IC device 100.

In such a second shuttle 5, the base member 51 is supported by a rail 54 extending in the X direction. For example, the second shuttle 5 reciprocates in the ± X direction along the rail 54 by driving means (not shown) using a linear motor as a driving source. It is possible. As a result, the second shuttle 5 moves to the −X direction side, the tray 52 is aligned to the + Y direction side with respect to the supply tray 2, and the tray 53 is aligned to the −Y direction side with respect to the inspection socket 6. (See FIGS. 6, 7, and 11 to 13), the second shuttle 5 moves to the + X direction side, the tray 53 is aligned to the + Y direction side with respect to the collection tray 3, and the tray 52 is the inspection socket. 6 (see FIGS. 1, 8 to 10, and 14).
The second shuttle 5 is provided in the −Y direction away from the first shuttle 4 described above, and the inspection socket 6 is disposed between the first shuttle 4 and the second shuttle 5. Yes.

As shown in FIG. 1, the inspection socket 6 is detachably installed in a socket installation portion located almost at the center of the handler area S, and inspects the electrical characteristics of the IC device 100 in the installation state. It is a socket. The inspection socket 6 is a plate-like member having a square shape in plan view.
This inspection socket 6 has four individual inspection sockets (mounting portions) 61 each formed of a recess capable of storing (mounting) four IC devices 100 one by one. In the present embodiment, the four individual inspection sockets 61 are formed in a matrix of two columns in the X direction and two rows in the Y direction. As shown in FIG. 15, among these four individual sockets 61 for inspection, the individual socket 61 for inspection at the lower left (closest to the origin) is the “individual socket 61a for inspection”, and the + X direction side from that. The individual socket 61 for inspection located at the “individual socket 61b for inspection”, the individual socket 61 for inspection located at the + Y direction side from the individual socket 61a for inspection is the “individual socket 61c for inspection”, and the + X direction side from it. The inspection individual socket 61 located in the position may be referred to as “inspection individual socket 61d”.

Note that the arrangement pitch of the four individual inspection sockets 61 is substantially equal to the arrangement pitch of the four pockets formed in each tray 42, 43, 52, 53. Thus, the IC device 100 can be smoothly transported between the trays 42, 43, 52, 53 and the individual inspection socket 61.
As shown in FIG. 15, each inspection individual socket 61 includes a bottom surface 611 having a substantially square shape and four side surfaces (banks) 612 inclined with respect to the bottom surface 611.

A plurality of probe pins (not shown) are provided on the bottom surface 611. Each probe pin comes into contact with the above-described external terminal of the IC device 100 when the IC device 100 is housed and arranged in the individual socket 61 for inspection. As a result, the state in which the IC device 100 and the control device 10 (inspection control unit 101 to be described later) are electrically connected via the probe pin, that is, the inspection (test) of the electrical characteristics of the IC device 100 is performed. It becomes a state that can be.
As described above, the inspection socket 6 is detachably installed on the base 11. Therefore, the inspection socket 6 can be easily replaced according to the target inspection (test), or the inspection socket 6 suitable for the size and shape of the IC device 100 can be replaced.

The supply robot 7 is a robot that conveys the IC device 100 accommodated in the supply tray 2 to the trays 42 and 52.
The supply robot 7 is supported by the support frame 72 supported by the pedestal 11, the moving frame 73 supported by the support frame 72 and reciprocally movable in the ± Y direction with respect to the support frame 72, and supported by the moving frame 73. It has a hand unit support part 74 that can reciprocate in the ± X-axis direction with respect to the frame 73 and four hand units 75 supported by the hand unit support part 74.

  A rail 721 extending in the Y direction is formed on the support frame 72, and the moving frame 73 reciprocates in the Y direction along the rail 721. The moving frame 73 is formed with a rail (not shown) extending in the X direction, and the hand unit support portion 74 reciprocates in the X direction along this rail. Note that the movement of the moving frame 73 with respect to the support frame 72 and the movement of the hand unit support portion 74 with respect to the moving frame 73 are performed by, for example, driving means (not shown) using a linear motor as a driving source.

  The four hand units 75 are arranged in a matrix so that two each are arranged in the X direction and the Y direction. Each hand unit 75 includes a holding unit that holds the IC device 100 and a lifting device that lifts and lowers the holding unit in the Z direction. The holding unit is configured by, for example, a suction nozzle and can hold the IC device 100 by suction. Further, the lifting device can be, for example, a device that uses a driving means that uses a linear motor as a driving source.

  Such a supply robot 7 conveys the IC device 100 from the supply tray 2 to the tray 42 as follows. First, the hand unit 75 is positioned on the supply tray 2. Next, the holding unit of each hand unit 75 is lowered, and the IC device 100 accommodated in the supply tray 2 is held by the holding unit. Next, after raising each holding part, each hand unit 75 is moved onto the tray 42. Next, the holding unit of each hand unit 75 is lowered to place the IC device 100 in the pocket 421 of the tray 42. Next, the IC device 100 is released by releasing the suction state of each holding unit and raising each holding unit. Thereby, the conveyance of the IC device 100 from the supply tray 2 to the tray 42 is completed. The IC device 100 can be similarly transported from the supply tray 2 to the tray 52.

The inspection robot 9 is a robot that performs a supply operation and a removal operation with respect to the inspection socket 6.
The supply operation is an operation for transporting and supplying the IC device 100 accommodated in the trays 42 and 52, which has not yet been subjected to the electrical inspection, to the empty individual socket 61 for inspection (see FIG. 15). (See the state shown in FIG. 15B from the state shown in FIG. 15A).

  The removal operation is an operation in which the IC device 100 that has undergone the electrical inspection is removed from the individual inspection socket of the inspection socket 6 and conveyed to the trays 43 and 53 (different positions) (see FIG. 15B). (See the state shown in FIG. 15C from the state shown). Here, for example, even if the removal operation is performed due to some external factor (for example, vibration or power failure due to an earthquake) with respect to the inspection apparatus 1, the IC device 100 is placed in the inspection socket 6 as shown in FIG. It may remain. The IC device 100 in the individual inspection socket 61c in FIG. 15C remains because the inspection robot 9 has not been able to absorb the IC device 100. Further, the IC device 100 on the individual inspection socket 61d in 15 (c) remains because the IC device 100 is dropped from the inspection robot 9 during the transportation of the IC device 100. Therefore, in the inspection apparatus 1 (handler), a residual inspection for inspecting whether the IC device 100 still remains in the inspection socket 6 even when the removal operation is performed on the IC device 100 after the electrical inspection is performed. it can. This residual inspection will be described later.

  The inspection robot 9 can position the IC device 100 with respect to the inspection socket 6 (individual inspection socket 61) when the IC device 100 is transported from the trays 42 and 52 to the inspection socket 6. Further, when the IC device 100 is disposed in the inspection socket 6 and the electrical characteristics are inspected, the IC device 100 is pressed against the probe pin of the inspection socket 6 and a predetermined inspection pressure is applied to the IC device 100. Can do.

  As shown in FIG. 1, the inspection robot 9 is supported by the first frame 911 fixed to the pedestal 11 and the first frame 911, and reciprocates in the Y direction with respect to the first frame 911. A second frame 912 that is possible, a first hand unit support 913 and a second hand unit support 914 that are supported by the second frame 912 and can be moved up and down in the Z direction with respect to the second frame 912, and a first hand unit There are four first hand units 92 supported by the support part 913 and four second hand units 93 supported by the second hand unit support part 914.

  A rail 911a extending in the Y direction is formed on the first frame 911, and the second frame 912 reciprocates in the ± Y direction along the rail 911a. In addition, rails 912a and 912b extending in the Z direction are formed on the second frame 912, and the first hand unit support portion 913 reciprocates in the ± Z directions along the rail 912a, along the rail 912b. Thus, the second hand unit support portion 914 reciprocates in the ± Z direction.

  Since both the first hand unit support portion 913 and the second hand unit support portion 914 are supported by the second frame 912, they move integrally in the X direction and the Y direction, but are independent in the Z direction. Can move. The movement of the second frame 912 with respect to the first frame 911 and the movement of the hand unit support portions 913 and 914 with respect to the second frame 912 are performed by driving means (not shown) using, for example, a linear motor as a driving source.

The four first hand units 92 are arranged in a matrix so that two each are arranged in the X direction and the Y direction below the first hand unit support portion 913. Further, the arrangement pitch of the four first hand units 92 is the same as the arrangement pitch of the four pockets 421 and 431 formed on the trays 42 and 43 and the four individual sockets 61 for inspection provided on the inspection socket 6. Almost equal.
Thus, by arranging the first hand unit 92 so as to correspond to the arrangement of the pockets 421 and the individual test sockets 61, the IC device 100 can be transported between the trays 42 and 43 and the test socket 6. It can be performed more smoothly.

Similarly, the four second hand units 93 are apparatuses that transport the IC device 100 between the trays 52 and 53 of the second shuttle 5 and the inspection socket 6. The IC device 100 is also a device that positions the IC device 100 with respect to the inspection socket 6 when the uninspected IC device 100 is transported from the tray 52 to the inspection socket 6.
The four second hand units 93 are arranged in a matrix so as to be arranged two by two in the X direction and the Y direction below the second hand unit support portion 914. The arrangement and arrangement pitch of these four second hand units 93 are the same as those of the four first hand units 92 described above. In this way, by arranging the second hand unit 93 so as to correspond to the arrangement of the pockets 521 and the individual test sockets 61, the IC device 100 can be transported between the trays 52 and 53 and the test socket 6. It can be performed more smoothly.

Hereinafter, although the structure of the 1st hand unit 92 and the 2nd hand unit 93 is demonstrated, since each hand unit 92 and 93 is the mutually same structure, it represents below about the one 1st hand unit 92 below. A description of the other first hand unit 92 and each second hand unit 93 will be omitted.
As shown in FIG. 3, the first hand unit 92 is supported by and fixed to the first hand unit support 913, and is supported by the support 94, and reciprocates in the ± X direction with respect to the support 94. A movable first moving unit 95, supported by the first moving unit 95, supported by the second moving unit 96, and a second moving unit 96 that can reciprocate in the ± Y direction with respect to the first moving unit 95. The rotating unit 97 is rotatable about the Z axis with respect to the second moving unit 96, and the holding unit 98 is supported by the rotating unit 97. The support part 94 is provided with a device mark 941 for positioning the held IC device 100 with respect to the individual socket 61 for inspection. In addition, the holding unit 98 is constituted by, for example, a suction nozzle, and can hold the IC device 100 by sucking it.

  The first hand unit 92 includes a first drive mechanism (not shown) that reciprocates the first moving unit 95 in the ± X direction with respect to the support unit 94, and a second moving unit 96 with respect to the first moving unit 95. A second drive mechanism (not shown) that reciprocates in the ± Y direction and a third drive mechanism that rotates the rotating portion 97 around the Z axis with respect to the second moving portion 96 are provided. These first, second, and third drive mechanisms use, for example, a linear motor as a drive source, and, if necessary, add a configuration such as a rack gear and a pinion gear for converting the rotational motion of the motor into a linear motion. Can be configured.

The CCD camera 700 images the inspection socket 6 after the removal operation (after the start of the conveyance operation). As shown in FIG. 2, the CCD camera 700 is arranged and fixed immediately above the inspection socket 6, that is, facing the individual inspection socket 61 side. The CCD camera 700 can reliably image the inspection socket 6 from above with the second frame 912 and the structure supported by the second frame 912 retracted from the inspection socket 6.
The laser light source 600 emits light toward the individual test sockets 61 of the test socket 6 when the CCD camera 700 images the test socket 6. Thereby, it is possible to reliably image the inspection socket 6 in a state where the light from the laser light source 600 is irradiated.

  As shown in FIG. 2, the laser light source 600 is disposed so as to be inclined with respect to the inspection socket 6 at a position away from between the CCD camera 700 and the inspection socket 6. From the laser light source 600, a plurality of slit light beams are irradiated at an inclination toward the individual inspection sockets 61 of the inspection socket 6.

  As shown in FIGS. 16A and 17A, in this embodiment, each inspection individual socket 61 is irradiated with two slit lights (slit lights 601 and 602). . Thereby, according to the state of each individual socket 61 for inspection, that is, the state where the IC device 100 remains in the individual socket 61 for inspection, and the state where the IC device 100 does not remain in the individual socket 61 for inspection. Thus, the shape of the portion irradiated with each slit light changes (see FIGS. 16B and 17B). Based on the magnitude of this change, it is determined whether or not the IC device 100 remains (see FIGS. 16C and 17C). Thus, in the inspection apparatus 1, the residual inspection is performed using the light cutting method.

The inclination angle θ of the CCD camera 700 with respect to the inspection socket 6 is not particularly limited, but is preferably 45 to 70 degrees, for example, and more preferably 50 to 65 degrees.
Further, the laser irradiated from the laser light source 600 is not particularly limited, and examples thereof include an infrared laser, a visible light laser, and an ultraviolet laser.
The collection robot 8 is a robot for transporting the IC device 100 housed in the trays 43 and 53 and having been subjected to electrical inspection to the collection tray 3.

  The collection robot 8 has the same configuration as the supply robot 7. That is, the collection robot 8 is supported by the pedestal 11 and has a support frame 82 formed with rails 821, a support frame 82 supported by the support frame 82, and a movable frame 83 that can reciprocate in the Y direction with respect to the support frame 82. It has a hand unit support portion 84 supported by the frame 83 and capable of reciprocating in the X direction with respect to the moving frame 83, and a plurality of hand units 85 supported by the hand unit support portion 84. Since the configuration of each of these units is the same as the configuration of each corresponding unit of the supply robot 7, the description thereof is omitted.

  Such a collection robot 8 conveys the IC device 100 from the tray 43 to the collection tray 3 as follows. First, the hand unit 85 is positioned on the tray 43. Next, the holding unit of each hand unit 85 is lowered, and the IC device 100 accommodated in the tray 43 is held by the holding unit. Next, after raising each holding part, each hand unit 85 is moved onto the collection tray 3. Next, the holding part of each hand unit 85 is lowered, and the IC device 100 is placed in the pocket 31 of the collection tray 3. Next, the IC device 100 is released by releasing the suction state of each holding unit and raising each holding unit. Thereby, the conveyance of the IC device 100 from the tray 43 to the collection tray 3 is completed. Note that the IC device 100 can be similarly transported from the tray 53 to the collection tray 3.

  Here, in the inspected IC device 100 accommodated in the tray 43 (or the tray 53), there may be a defective product that could not exhibit predetermined electrical characteristics. Therefore, for example, two recovery trays 3 may be prepared, and one may be used as a tray for storing non-defective products that satisfy predetermined electrical characteristics, and the other may be used as a tray for recovering the defective products. Good. When one collection tray 3 is used, a predetermined pocket 31 may be used as a pocket for storing the defective product. Thereby, a good product and a defective product can be clearly separated.

The display device 800 is arranged on the −Y direction side that is the front side of the inspection device 1 (handler). The display device 800 includes, for example, a liquid crystal monitor, and can display, for example, an electrical inspection result or a residual inspection result. This liquid crystal monitor has a touch panel function and is also used as an operation unit for setting operations for the inspection apparatus 1.
The alarm device 900 includes, for example, a signal lamp and a speaker mounted on the upper side of the inspection device 1. The alarm device 900 notifies the operator of the inspection apparatus 1 when the result of the residual inspection is “remaining”.

As illustrated in FIG. 4, the control device 10 includes a drive control unit 102, an inspection control unit 101, and a storage unit 103.
The drive control unit 102 controls, for example, the movement of the supply tray 2, the recovery tray 3, the first shuttle 4 and the second shuttle 5, and the mechanical drive of the supply robot 7, the recovery robot 8, the inspection robot 9, and the like. .

One inspection control unit 101 inspects the electrical characteristics of the IC device 100 arranged in the inspection socket 6 based on a program stored in the storage unit 103.
In the inspection apparatus 1, a CPU (Central Processing Unit) built in the inspection apparatus 1 functions as the inspection control unit 101 and the drive control unit 102.
The storage unit 103 has a storage medium (recording medium) readable by the CPU for storing (recording) programs, data, and the like. This storage medium is composed of a magnetic or optical recording medium such as an HD (Hard Disk), a CD-ROM (Compact Disc Read-Only Memory), or a semiconductor memory.

Next, the operating state of the inspection apparatus 1 will be described with reference to FIGS. The operating state here is a case where the residual inspection was performed during the operation, but the residual of the IC device 100 was not detected. Details of the residual inspection will be described after this description.
First, as shown in FIG. 6, the supply tray 2 in which the IC device 100 is accommodated in each pocket 21 is transported into the region S, and the first shuttle 4 and the second shuttle 5 are moved to the −X direction side, The trays 42 and 52 are arranged in the + Y direction side with respect to the supply tray 2.

Next, as shown in FIG. 7, the IC device 100 accommodated in the supply tray 2 is transferred to the trays 42 and 52 by the supply robot 7, and the IC devices 100 are accommodated in the pockets 421 and 521 of the trays 42 and 52. To do.
Next, as shown in FIG. 8, both the first shuttle 4 and the second shuttle 5 are moved to the + X direction side, the tray 42 is on the + Y direction side with respect to the inspection socket 6, and the tray 52 is the inspection socket 6. Are arranged in the −Y direction side.

Next, as shown in FIG. 9, the first hand unit support portion 913 and the second hand unit support portion 914 are integrally moved to the + Y direction side, and the first hand unit support portion 913 is positioned immediately above the tray 42. At the same time, the second hand unit support portion 914 is positioned directly above the inspection socket 6. Thereafter, the IC device 100 accommodated in the tray 42 is held by each first hand unit 92.
Next, as shown in FIG. 10, the first hand unit support portion 913 and the second hand unit support portion 914 are integrally moved to the −Y direction side, and the first hand unit support portion 913 is connected to the inspection socket 6. It is assumed that the second hand unit support portion 914 is positioned directly above the tray 52 while being positioned immediately above (inspection origin position).

  In parallel with the movement of the first hand unit support portion 913 and the second hand unit support portion 914, the following operation is also performed. First, the first shuttle 4 is moved to the −X direction side so that the tray 43 is aligned with the inspection socket 6 in the + Y direction, and the tray 42 is aligned with the supply tray 2 in the + Y direction. And Next, the IC device 100 accommodated in the supply tray 2 is transferred to the tray 42 by the supply robot 7, and the IC device 100 is accommodated in each pocket 421 of the tray 42.

  Next, the first hand unit support portion 913 is lowered, and the IC device 100 held by each first hand unit 92 is placed in each inspection individual socket 61 of the inspection socket 6. That is, a supply operation is performed. At this time, each first hand unit 92 presses the IC device 100 against the individual inspection socket 61 with a predetermined inspection pressure (pressure). As a result, the external terminals of the IC device 100 and the probe pins provided in the individual inspection socket 61 are electrically connected. In this state, the individual inspection sockets are inspected by the inspection control unit 101 of the control device 10. The electrical characteristics of the IC device 100 in 61 are inspected. In addition, after the electrical inspection is completed, the residual inspection is performed. As described above, in the description of the operation state, the residual of the IC device 100 is not detected. Is omitted.

When the electrical inspection is completed, the first hand unit support portion 913 is raised, and the IC device 100 held by each first hand unit 92 is taken out from the individual socket 61 for inspection. That is, a removal operation is performed.
In parallel with such work (electrical inspection for the IC device 100), each second hand unit 93 supported by the second hand unit support portion 914 holds the IC device 100 accommodated in the tray 52, and the IC The device 100 is removed from the tray 52.

Next, as shown in FIG. 11, the first hand unit support portion 913 and the second hand unit support portion 914 are moved to the + Y direction side so that the first hand unit support portion 913 is directly above the tray 43 of the first shuttle 4. And the second hand unit support portion 914 is positioned directly above the inspection socket 6 (inspection origin position).
In parallel with the movement of the first hand unit support portion 913 and the second hand unit support portion 914, the following operation is also performed. First, the second shuttle 5 is moved to the −X direction side so that the tray 53 is aligned with the inspection socket 6 in the −Y direction, and the tray 52 is aligned with the supply tray 2 in the + Y direction. State. Next, the IC device 100 accommodated in the supply tray 2 is transferred to the tray 52 by the supply robot 7, and the IC device 100 is accommodated in each pocket 521 of the tray 52.

  Next, as shown in FIG. 12, the second hand unit support portion 914 is lowered, and the IC device 100 held by each second hand unit 93 is placed in each inspection individual socket 61 of the inspection socket 6. That is, a supply operation is performed. Then, the inspection control unit 101 performs an inspection of electrical characteristics on the IC device 100 in each inspection individual socket 61. Thereafter, a residual inspection is performed in the same manner as described above. However, since the residual of the IC device 100 is not detected, description of the residual inspection is omitted.

When the electrical inspection is completed, the second hand unit support portion 914 is raised, and the IC device 100 held by the second hand unit 93 is taken out from the individual socket 61 for inspection. That is, the removal operation is performed.
In parallel with such work, the following work is performed. First, the inspected IC device 100 held by each first hand unit 92 is accommodated in each pocket 431 of the tray 43. Next, the first shuttle 4 is moved to the + X direction side so that the tray 42 is aligned in the + Y direction with respect to the inspection socket 6 and is located immediately below each first hand unit 92, and the tray 43 is recovered. The tray 3 is arranged in the + Y direction. Next, each first hand unit 92 holds the IC device 100 accommodated in the tray 42, and the inspected IC device 100 accommodated in the tray 43 is transferred to the recovery tray 3 by the recovery robot 8.

Next, as shown in FIG. 13, the first hand unit support portion 913 and the second hand unit support portion 914 are moved to the −Y direction side, and the first hand unit support portion 913 is directly above the inspection socket 6 (inspection). The second hand unit support portion 914 is positioned immediately above the tray 52.
In parallel with the movement of the first hand unit support portion 913 and the second hand unit support portion 914, the following operation is also performed. First, the first shuttle 4 is moved to the −X direction side, the tray 43 is aligned in the + Y direction with respect to the inspection socket 6, and the tray 42 is aligned in the + Y direction with respect to the supply tray 2. And Next, the IC device 100 accommodated in the supply tray 2 is transferred to the tray 42 by the supply robot 7, and the IC device 100 is accommodated in each pocket 421 of the tray 42.

  Next, as shown in FIG. 14, the first hand unit support portion 913 is lowered, and the IC device 100 held by each first hand unit 92 is placed in each inspection individual socket 61 of the inspection socket 6. Then, the inspection control unit 101 performs an inspection of electrical characteristics on the IC device 100 in each inspection individual socket 61. When the inspection ends, the first hand unit support 913 is raised, and the IC device 100 held by each first hand unit 92 is taken out from the individual socket 61 for inspection.

  In parallel with such work, the following work is performed. First, the inspected IC device 100 held by each second hand unit 93 is accommodated in each pocket 531 of the tray 53. Next, the second shuttle 5 is moved to the + X direction side so that the tray 52 is aligned in the −Y direction with respect to the inspection socket 6 and is located immediately below the second hand unit 93, and the tray 53 is recovered. The tray 3 is arranged in the + Y direction. Next, each second hand unit 93 holds the IC device 100 accommodated in the tray 52, and the inspected IC device 100 accommodated in the tray 53 is transferred to the recovery tray 3 by the recovery robot 8.

  Thereafter, the operations shown in FIGS. 11 to 14 are repeated. In the middle of this repetition, when all of the IC devices 100 accommodated in the supply tray 2 have been moved to the first shuttle 4, the supply tray 2 moves out of the region S. Then, after supplying a new IC device 100 to the supply tray 2 or exchanging it with another supply tray 2 in which the IC device 100 is already accommodated, the supply tray 2 moves again into the region S. Similarly, when the IC device 100 is accommodated in all the pockets 31 of the collection tray 3 during the repetition, the collection tray 3 moves out of the area S. Then, after the IC device 100 accommodated in the recovery tray 3 is removed or the recovery tray 3 is replaced with another empty recovery tray 3, the recovery tray 3 moves into the region S again.

  According to the above method, the electrical inspection for the IC device 100 can be efficiently performed. Specifically, the inspection robot 9 includes a first hand unit 92 and a second hand unit 93. For example, an IC device held by the first hand unit 92 (the same applies to the second hand unit 93). In the state in which 100 is electrically inspected by the inspection socket 6, the IC device 100 in which the second hand unit 93 finishes the electrical inspection is accommodated in the tray 53 in parallel with this, and then inspected. The target IC device 100 is held and is on standby. As described above, by performing different operations using the two hand units, useless time can be reduced and the electrical inspection of the IC device 100 can be performed efficiently.

As described above, the inspection apparatus 1 performs a residual inspection for inspecting whether the IC device 100 still remains in the inspection socket 6 even if the removal operation is performed on the IC device 100 that has been subjected to the electrical inspection. be able to. This residual inspection will be described.
As illustrated in FIG. 4, the control device 10 further includes a detection unit 104, a determination unit 105, and an image processing unit 106 in addition to the inspection control unit 101, the drive control unit 102, and the storage unit 103. .

The detection unit 104 is a part that detects the difference in height between the two positions.
One detects the difference in height eye position is a first reference position P ₁ and the second reference position P ₂ of each individual test socket 61. The first reference position P ₁ is a position where the slit light 601 is irradiated on the bottom surface 611 of the individual inspection socket 61 in a state where the IC device 100 is not placed on the individual inspection socket 61. The second reference position P ₂ is in a state where the IC device 100 to the individual test socket 61 is not placed, it is at the position where the slit light 602 is irradiated onto the bottom surface 611 of the individual test socket 61 .

The first reference position P ₁ and the second reference position P ₂ are each given as coordinate data, and are stored in advance in the storage unit 103 by manual input from the display device 800 that also serves as an operation unit, for example. Alternatively, it may be stored in advance in the storage unit 103 by input from the CAD data. Further, since the first reference position P ₁ and the second reference position P ₂ is a coordinate data respectively, as compared with the case of capturing the reference position from the image, it is possible to shorten the time required for the subsequent image processing Therefore, rapid residual detection can be performed.

The second position for detecting the difference in height is in the individual socket 61 for inspection in the captured image 20 (see FIGS. 16B and 17B) captured by the CCD camera 700 in plan view. The first irradiation position P ₁ ′ where the slit light 601 is irradiated and the second irradiation position P ₂ ′ where the slit light 602 is irradiated.
The detection unit 104 detects a difference between the first position and the second position. That is, the difference between the first reference position P ₁ and the first irradiation position P ₁ ′ is detected. Alternatively, a difference between the second reference position P ₂ and the second irradiation position P ₂ ′ is detected. In a preferred embodiment, both the difference between the first reference position P ₁ and the first irradiation position P ₁ ′ and the difference between the second reference position P ₂ and the second irradiation position P ₂ ′ are detected. .

Note that the captured image 20 illustrated in FIGS. 16B and 17B is an image of the inspection socket 6 in the state illustrated in FIG. 15C. When the IC device 100 remains, one or both of the first irradiation position P ₁ ′ and the second irradiation position P ₂ ′ become the upper surface 100a of the IC device 100 (individual for inspection). (Refer to the drawings on the side of the sockets 61b and 61d). As a result, the irradiation position deviates from the reference position, so that a difference is surely generated between them. On the other hand, when the IC device 100 does not remain, both the first irradiation position P ₁ ′ and the second irradiation position P ₂ ′ become the bottom surface 611 of the inspection individual socket 61 (individual inspection individual). (Refer to the drawings on the side of the sockets 61a and 61c). In this case, there is little or no difference between the reference position and the irradiation position.

The first irradiation position P ₁ ′ and the second irradiation position P ₂ ′ are image data as comparison data on the same coordinates as the first reference position P ₁ and the second reference position P _{2 given} as coordinate data. The signal is given from the processing unit 106 to the detection unit 104. In this case, the data of each irradiation position may be corrected so as to match the scale at the reference position.
Then, the detection unit 104 detects the difference Δd between the first reference position P ₁ and the first irradiation position P ₁ ′, and the difference between the second reference position P ₂ and the second irradiation position P ₂ ′. Δd is detected. By taking a plurality of differences in this way, it is possible to accurately determine whether or not there is a residue. When detecting the difference, the first reference position P ₁ and the second reference position P ₂ are called from the storage unit 103. Thereby, the difference can be detected quickly.

Based on the comparison result of the detection unit 104, the determination unit 105 determines whether or not the IC device 100 remains in each inspection individual socket 61 of the inspection socket 6 after the removal operation, that is, for inspection after the removal operation. This is a part for determining the presence or absence of the IC device 100 in each individual socket 61 for inspection of the socket 6.
The image processing unit 106 is a part that performs image processing on the captured image 20. In this image processing, the captured image 20 is binarized, a portion irradiated with the slit light 601 and 602 is extracted as a light color region, and the light color region is extracted as the first irradiation position P ₁ ′ and the second irradiation. This is a process for setting the position P ₂ ′.
As described above, the inspection apparatus 1 has a built-in CPU and functions as the inspection control unit 101 and the drive control unit 102. The CPU can also function as the detection unit 104, the determination unit 105, and the image processing unit 106.

Hereinafter, a control program when the inspection apparatus 1 performs the residual inspection will be described based on the flowchart of FIG. This control program is stored in the storage unit 103 in advance.
When it is determined that the electrical inspection and removal operation for each IC device 100 accommodated in the individual inspection sockets 61a to 61d of the inspection socket 6 has been completed (step S200), and then it is determined to start the residual inspection ( Step S201), the operation (supply operation, removal operation, etc.) of the inspection robot 9 is stopped (Step S202).

Then, from the storage unit 103 and the first reference position _{P 1} in the individual test socket 61a~61d second reference position _{P 2} and with call (steps S203), actuates the laser light source 600 (step S204) The slit lights 601 and 602 are irradiated toward the individual sockets 61a to 61d for inspection.
Next, the CCD camera 700 is operated to image the current inspection socket 6 (step S205). Thereby, the captured image 20 is obtained.

Next, the image processing unit 106 performs image processing on the captured image 20 and conversion into coordinate data (step S206). That is, as described above, the captured image 20 is binarized, and the portions irradiated with the slit lights 601 and 602 are extracted as the first irradiation position P ₁ ′ and the second irradiation position P ₂ ′. Convert to coordinate data.
Next, the detection unit 104 causes the difference Δd between the first reference position P ₁ and the first irradiation position P ₁ ′, and the second reference position P ₂ and the second irradiation position in the individual socket for inspection 61a. A difference Δd from P ₂ ′ is obtained (step S207). Similarly, the difference Δd between the first reference position P ₁ and the first irradiation position P ₁ ′ and the second reference position P ₂ and the second irradiation position P ₂ ′ in the individual socket for inspection 61b. And Δd are obtained respectively (step S207). Further, the difference Δd between the first reference position P ₁ and the first irradiation position P ₁ ′ and the difference between the second reference position P ₂ and the second irradiation position P ₂ ′ in the inspection individual socket 61c. Each Δd is obtained (step S207). The difference Δd between the first reference position P ₁ and the first irradiation position P ₁ ′ and the difference Δd between the second reference position P ₂ and the second irradiation position P ₂ ′ in the inspection individual socket 61d are obtained. Each is obtained (step S207).
Next, the determination unit 105 determines whether or not the IC device 100 remains based on whether each difference Δd exceeds the threshold value d (step S208). In addition, it does not specifically limit as the threshold value d, For example, it is preferable to set it as 0.1-1 mm, and it is more preferable to set it as 0.1-0.3 mm.

As shown in FIG. 16, in the individual socket for inspection 61a, the first reference position P ₁ and the first irradiation position P ₁ ′ are substantially overlapped, and the difference Δd is substantially zero. d or less. Further, the second reference position P ₂ and the second irradiation position P ₂ ′ are also substantially overlapped, and the difference Δd is substantially zero, that is, not more than the threshold value d. Since any difference Δd is equal to or less than the threshold value d, it is determined that the IC device 100 does not remain in the individual inspection socket 61a.

Moreover, the individual test socket 61b, a first reference position P ₁ and the first irradiation position P _{1 ',} and almost overlap, the difference Δd is less than the threshold value d. On the other hand, the second reference position P ₂ and the second irradiation position P ₂ ′ are not overlapped, that is, shifted, and the difference Δd exceeds the threshold value d. Since at least one of the differences Δd exceeds the threshold value d, it is determined that the IC device 100 remains in the inspection individual socket 61b.

As shown in FIG. 17, the individual test socket 61c, a first reference position P ₁ and the first irradiation position P _{1 ',} and almost overlap, the difference Δd is less than the threshold value d. Further, the second reference position P ₂ and the second irradiation position P ₂ ′ are almost overlapped, and the difference Δd is equal to or less than the threshold value d. Since any difference Δd is equal to or less than the threshold value d, it is determined that the IC device 100 does not remain in the inspection individual socket 61c.

Moreover, the individual test socket 61d, a first reference position P ₁ and the first irradiation position P _{1 ',} do not overlap, the difference Δd is beyond the threshold value d. Further, the second reference position P ₂ and the second irradiation position P ₂ ′ are not overlapped, and the difference Δd exceeds the threshold value d. Since any difference Δd exceeds the threshold value d, it is determined that the IC device 100 remains in the individual inspection socket 61d.
As a result of the determination in step S208, it is determined that there is at least one IC device 100 remaining in the inspection socket 6, and this is notified by the alarm device 900 (step S209). Thereby, the operator of the inspection apparatus 1 can move to the operation of removing the remaining IC device 100 from the inspection socket 6.

On the other hand, if it is determined in step S208 that there is no remaining IC device 100, the operation of the inspection robot 9 is resumed (step S210). Thereby, the inspection robot 9 can shift to the supply operation.
As described above, in the inspection apparatus 1, after the removal operation is performed on the IC device 100 accommodated in each inspection individual socket 61 of the inspection socket 6, the IC device 100 remains in or near the inspection individual socket 61. It can be detected whether or not. When performing the residual detection, the residual detection can be performed quickly and reliably by comparing the positional relationship between the reference position and the irradiation position with as little information as possible.

Second Embodiment
FIG. 18 is a diagram showing a reference position in the inspection apparatus (second embodiment) of the present invention.
Hereinafter, the second embodiment of the handler and the inspection apparatus of the present invention will be described with reference to this figure, but the description will focus on differences from the above-described embodiment, and the description of the same matters will be omitted.
This embodiment is the same as the first embodiment except that the reference position setting configuration is different.

As shown in FIG. 18, in this embodiment, it is possible to change the first reference position P ₁ and the second reference position P _2, can be stored in the storage unit 103 for each change. Thus, it is possible to properly set the first reference position P ₁ and the second reference position P ₂ in accordance with the depth of the individual test socket 61, thus, it is possible to perform accurate residual detection.
In addition to this aspect, a plurality of types of first reference positions P ₁ and second reference positions P ₂ are stored in the storage unit 103, and according to the depth of the individual socket 61 for inspection, among these Depending on the depth of one individual socket 61 for inspection, it may be selected.

As mentioned above, although the illustrated embodiment of the handler and the inspection device of the present invention has been described, the present invention is not limited to this, and each part constituting the handler and the inspection device is an arbitrary one that can exhibit the same function. It can be replaced with the configuration of Moreover, arbitrary components may be added.
Further, the handler and the inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

Further, the grayscale image used for residual detection may be a monochrome image or a color image.
In addition, the number of laser light sources arranged is one in each of the embodiments described above, but is not limited thereto, and may be plural, for example.
In addition, the laser light source and the CCD camera are configured as separate bodies in each of the above embodiments, but may be formed as a single unit.

Further, the laser light source is fixed in each of the embodiments described above, but is not limited thereto, and may be supported movably, for example. In this case, the laser beam can be operated.
In addition, the laser light source is slit light in each of the embodiments described above, but is not limited thereto, and may be spot light, for example.

In addition, the number of laser beams irradiated to each individual inspection socket of the inspection socket is two in each of the above embodiments, but may be one or three or more.
In addition, each reference position is a position where slit light is irradiated on the bottom surface of the individual socket for inspection in a state where the IC device is not housed in the individual socket for inspection in each of the embodiments. It is not limited, For example, the position where a slit light is irradiated on the side surface of the individual socket for inspection may be sufficient.

In addition, the number of inspection individual sockets arranged in the inspection socket is four in each of the embodiments described above, but is not limited thereto, and may be one, two, three, five or more, for example. May be.
Further, in a factory where a plurality of inspection apparatuses are arranged, for example, the inspection apparatus can share the reference position by communication means.

DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus 11 ... Base 2 ... Supply tray 21 ... Pocket 23 ... Rail 3 ... Collection tray 31 ... Pocket 33 ... Rail 4 ... First shuttle 41 ... Base members 42, 43 ... ... Tray 421,431 ... Pocket 44 ... Rail 5 ... Second shuttle 51 ... Base member 52,53 ... Tray 521,531 ... Pocket 54 ... Rail 6 ... Inspection socket 61, 61a, 61b , 61c, 61d …… Individual socket for inspection (mounting part) 611 …… Bottom 612 …… Side (bank) 7 …… Supply robot 72 …… Support frame 721 …… Rail 73 …… Moving frame 74 …… Hand unit Support section 75 …… Hand unit 8 …… Recovery robot 82 …… Support frame 821 …… Rail 83 …… Moving frame 84 …… C Unit unit 85 ... hand unit 9 ... inspection robot (conveyance unit) 911 ... first frame 911a ... rail 912 ... second frame 912a, 912b ... rail 913 ... first hand unit support 914 …… Second hand unit support portion 92 …… First hand unit 93 …… Second hand unit 94 …… Support portion 941 …… Device mark 95 …… First moving portion 96 …… Second moving portion 97 …… Rotating section 98 …… Holding section 10 …… Control device (control section) 101 …… Inspection control section 102 …… Drive control section 103 …… Storage section 104 …… Detection section 105 …… Determination section 106 …… Image processing section 20 …… Captured image 100 …… IC device 100 a …… Upper surface (front side surface) 100 b ...... Lower surface (back side surface) 600 …… Laser light source (light irradiation unit) 70 ...... CCD (charge-coupled device) camera (image pickup section) 800 ...... display device (display unit) 900 ...... alarm device reference position (notification unit) _{P 1} ...... first reference position P ₂ ...... second P ₁ ′ ··· first irradiation position P ₂ ′ ··· second irradiation position S ··· region S 200 to S 210 ··· step θ ··· inclination angle Δd ··· difference d ··· threshold value

Claims (12)

A socket installation part in which a socket having a placement part capable of placing an object to be conveyed is installed;
A transport unit for transporting the transported object subjected to the inspection from the socket to another position;
A light irradiation unit configured to irradiate light toward the placement unit after the transfer unit has started a transfer operation;
An imaging unit that images the socket in a state where the light from the light irradiation unit is irradiated;
Detecting the difference between the position of the placement unit in a state where the transport object is not placed on the socket and the irradiation position irradiated with the light, and the presence or absence of the transport object in the placement unit And a control unit for determining whether or not. The socket is plate-shaped,
The handler according to claim 1, wherein the light irradiation unit is configured to irradiate at least one slit light with an inclination with respect to the socket.   The control unit determines that the transport object is present when the difference exceeds a threshold value, and determines that the transport object is absent when the difference is equal to or less than the threshold value. Or the handler of 2. The transport object is a small piece having a front side surface and a back side surface,
The position of the placement unit in a state where the transport object is not placed on the socket is the placement surface,
In the irradiation position, when the conveyance object remains, at least a part of the irradiation position becomes the surface on the front side, and when the conveyance object does not remain, The handler according to any one of claims 1 to 3. The position of the placing portion in a state where the transport object is not placed on the socket is given as coordinate data,
The handler according to any one of claims 1 to 4, wherein the irradiation position is comparison data on the same coordinates as the coordinate data and compared with the coordinate data. The light irradiation unit irradiates a plurality of slit lights toward the placement unit, and in the captured image by the imaging unit, the irradiation position exists corresponding to each slit light, respectively.
The control unit detects the difference between the position of the placement unit in a state where the transport object is not placed on the socket and each irradiation position, and even one of the differences is detected. The handler according to any one of claims 1 to 5, wherein when the threshold value is exceeded, it is determined that the conveyance object is present. A storage unit that stores the position of the mounting unit in a state where the transport object is not mounted on the socket;
The said control part calls the position of the said mounting part of the state in which the said conveyance target object is not mounted in the said socket from the said memory | storage part, when detecting the said difference. The handler described in.   The control unit can change the position of the placement unit in a state where the transport object is not placed on the socket or the transport object is not placed on the socket. A plurality of types of positions of the placement unit are stored, and the transport target is placed in one socket from the position of the placement unit in a state where the transport target is not placed in the plurality of types of the sockets. The handler according to claim 7, wherein the position of the mounting portion in a state where it is not mounted is selected.   The handler according to any one of claims 1 to 8, further comprising a notification unit that notifies the presence of the conveyance object when the control unit determines that the conveyance object is present.   When the control unit determines that there is no conveyance object, the conveyance unit supplies the conveyance object that has not been inspected yet to the placement unit and performs a supply operation of placing the conveyance object. The handler according to any one of claims 1 to 9.   The handler according to any one of claims 1 to 10, wherein the imaging unit is a camera disposed to face the mounting unit side of the socket. A handler according to any one of claims 1 to 11,
An inspection apparatus comprising: a socket provided on the handler and having a placement portion on which the transport object can be placed.

Images