JP2014190701A - X-ray inspection system and x-ray inspection method - Google Patents
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- 238000007689 inspection Methods 0.000 title claims abstract description 222
- 238000000034 method Methods 0.000 title claims abstract description 43
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 135
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- 238000001514 detection method Methods 0.000 claims description 12
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- 238000005476 soldering Methods 0.000 description 12
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Abstract
Description
本発明は、Ｘ線検査システム及びＸ線検査方法に関する。 The present invention relates to an X-ray inspection system and an X-ray inspection method.
近年、表面実装技術（ＳＭＴ；Ｓｕｒｆａｃｅ Ｍｏｕｎｔ Ｔｅｃｈｎｏｌｏｇｙ）において、Ｘ線検査装置を用いて、チップ等の表面に実装された部品の下のはんだ面積や、リード部のはんだ厚や、ＢＧＡ（Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ）等の表面実装形のパッケージ（電子部品）のはんだ付け部の検査が行われている。Ｘ線検査装置の検査方式には、例えば、ＣＴ（Ｃｏｍｐｕｔｅｄ Ｔｏｍｏｇｒａｐｈｙ）方式、ラミノグラフィ方式等がある。ＣＴ方式は、検査対象の３次元データを取得することができる方式である。ラミノグラフィ方式は、検査対象の高さ方向のスライス画像を取得する方式である。 In recent years, in surface mount technology (SMT), using an X-ray inspection apparatus, the solder area under a component mounted on the surface of a chip or the like, the solder thickness of a lead portion, BGA (Ball Grid Array), etc. ) And the like are inspected for soldered portions of surface mount type packages (electronic parts). Examples of the inspection method of the X-ray inspection apparatus include a CT (Computed Tomography) method and a laminography method. The CT method is a method capable of acquiring three-dimensional data to be inspected. The laminography method is a method of acquiring a slice image in the height direction of an inspection object.
ＣＴ方式又はラミノグラフィ方式のＸ線検査装置は、一般的に、検査対象にＸ線を照射するＸ線源、検査対象を透過したＸ線を受光する検出部を有する。また、検出部は、Ｘ線透過率等の情報を得る。そのため、基板の表面側の検査対象部位と検出部との間に、基板の裏面側のはんだ等の障害物があると、基板の表面側のはんだ付け部のはんだ面積やはんだ厚を正確に検査することができない場合がある。 A CT or laminography X-ray inspection apparatus generally has an X-ray source that irradiates an inspection target with X-rays and a detection unit that receives X-rays that have passed through the inspection target. The detection unit obtains information such as X-ray transmittance. Therefore, if there is an obstacle such as solder on the back side of the board between the inspection target part on the front side of the board and the detection part, the solder area and solder thickness of the soldering part on the front side of the board are accurately inspected. You may not be able to.
そこで、ラミノグラフィ方式では、検査対象である基板に対してＸ線をななめ方向から照射するように、Ｘ線源と検出部とを配置する。そして、Ｘ線源と検出部とを、基板に垂直な軸周りに回転させながら測定を行う。この際、Ｘ線源と検出器とを回転させることにより、基板の表面側のＸ線の焦点位置がずれないように、予めＸ線源の高さを合わせておく。
これにより、基板の表面側に実装された部品を透過するＸ線は、Ｘ線源と検出器の回転角度によらず常に検出部上の同じ位置に照射される。一方、基板の裏面側に実装された部品を透過するＸ線は、Ｘ線源と検出器の回転角度によって検出部上の異なる位置に照射される。そのため、各回転角度におけるＸ線検査結果の画像を重ね合わせると、基板の裏面側に実装された部品の像のみをぼかすことができる。これにより、基板の表面側に実装された部品の像をより正確に検査することができる。通常、ラミノグラフィ方式以外の方式でも、同様の原理に基づいて、基板の裏面側に実装された部品等の影響を抑えている。
Therefore, in the laminography method, the X-ray source and the detection unit are arranged so as to irradiate the substrate to be inspected with X-rays from the licking direction. Then, measurement is performed while rotating the X-ray source and the detection unit around an axis perpendicular to the substrate. At this time, by rotating the X-ray source and the detector, the height of the X-ray source is adjusted in advance so that the focal position of the X-ray on the surface side of the substrate does not shift.
Thereby, the X-rays transmitted through the components mounted on the surface side of the substrate are always irradiated to the same position on the detection unit regardless of the rotation angle of the X-ray source and the detector. On the other hand, X-rays that pass through components mounted on the back side of the substrate are irradiated at different positions on the detection unit depending on the rotation angle of the X-ray source and the detector. Therefore, if the images of the X-ray inspection results at each rotation angle are superimposed, only the image of the component mounted on the back side of the substrate can be blurred. Thereby, the image of the component mounted on the surface side of the substrate can be inspected more accurately. In general, methods other than the laminography method also suppress the influence of components mounted on the back side of the substrate based on the same principle.
しかしながら、基板の裏面側に実装された部品が大きかったり、基板の裏面側のはんだ付け部のはんだ面積が大きかったりする場合、基板の裏面側の部品やはんだの影響が上記の方法によっても十分に消去することができない場合がある。そのため、検査対象である基板の表面側に実装された部品やはんだの像をより正確に検査することができないという問題がある。 However, if the component mounted on the back side of the board is large or the solder area of the soldering part on the back side of the board is large, the influence of the parts on the back side of the board and the solder is sufficient even by the above method. Sometimes it cannot be erased. Therefore, there is a problem that it is not possible to more accurately inspect the image of the component or solder mounted on the surface side of the substrate to be inspected.
特許文献１は、基板の裏面にのみ部品等を実装した基板のＸ線検査結果の画像を予め取得しておき、検査対象の基板のＸ線検査結果の画像を、予め取得した基板の裏面にのみ部品等を実装した基板のＸ線検査結果を用いて補正することを開示している。 In Patent Document 1, an image of an X-ray inspection result of a substrate on which components and the like are mounted only on the back surface of the substrate is acquired in advance. The correction is disclosed using the X-ray inspection result of the substrate on which only the components are mounted.
また、特許文献２は、基板の表面又は裏面にのみ部品等を実装した基板のＸ線検査結果の画像を予め取得しておき、検査対象の基板のＸ線検査結果の画像から、予め取得した基板の表面又は裏面にのみ部品等を実装した基板のＸ線検査結果の画像を減じて得られる画像と、予め取得した基板の表面又は裏面にのみ部品等を実装した基板のＸ線検査結果の画像とを比較して、はんだ付けの良否を判定することを開示している。 Patent Document 2 previously acquired an image of an X-ray inspection result of a substrate on which components or the like are mounted only on the front surface or the back surface of the substrate, and acquired in advance from an image of the X-ray inspection result of the substrate to be inspected. The image obtained by subtracting the image of the X-ray inspection result of the substrate on which the component is mounted only on the front surface or the back surface of the substrate, and the X-ray inspection result of the substrate on which the component is mounted only on the front surface or the back surface of the substrate It is disclosed that the quality of soldering is determined by comparing with an image.
また、特許文献３は、基板の外観検査結果と、基板のＸ線検査結果と、当該外観検査結果に基づく部品の実装及びはんだ付けの良否判定結果と、当該Ｘ線検査結果に基づく部品の実装及びはんだ付けの良否判定結果と、を一括して管理することを開示している。 Patent Document 3 discloses a board appearance inspection result, a board X-ray inspection result, a component mounting and soldering quality determination result based on the appearance inspection result, and a component mounting based on the X-ray inspection result. In addition, it is disclosed to collectively manage soldering quality determination results.
また、特許文献４は、原稿の表面の画像と裏面の画像とを読み取り、原稿の表面の出力画像データを、原稿の裏面の画像データを用いて補正することにより、裏うつりの無い良質な画像を得るデジタル複写機を開示している。 Further, Patent Document 4 reads a front image and a back image of a document, and corrects output image data on the front surface of the document by using image data on the back surface of the document. Discloses a digital copier.
しかしながら、特許文献１乃至３に記載の技術は、検査対象の二次元の平面画像を取得するＸ線検査装置についてのものである。具体的には、特許文献１では、比較的単純な方法で、基板の裏面側のはんだが基板の表面のＸ線検査結果に移り込む部分の影響を補正している。同様に、特許文献２においても、比較的単純な方法で、はんだ付けの良否を判定している。また、特許文献３は、基板の裏面側のはんだが基板の表面のＸ線検査結果に移り込むことによる影響を全く考慮していない。また、特許文献４に記載の技術は、Ｘ線検査方法に関するものではない。 However, the techniques described in Patent Documents 1 to 3 relate to an X-ray inspection apparatus that acquires a two-dimensional plane image to be inspected. Specifically, in Patent Document 1, the influence of the portion where the solder on the back surface side of the substrate moves into the X-ray inspection result on the surface of the substrate is corrected by a relatively simple method. Similarly, in Patent Document 2, the quality of soldering is determined by a relatively simple method. Further, Patent Document 3 does not consider the influence of the solder on the back side of the substrate being transferred to the X-ray inspection result on the surface of the substrate. Further, the technique described in Patent Document 4 is not related to an X-ray inspection method.
一方、ラミノグラフィ方式のＸ線検査装置が取得するのは、検査対象の三次元のＸ線画像である。ラミノグラフィ方式のＸ線検査装置では、基板の裏面側のはんだの影響が基板の表面のＸ線検査結果に写り込む影響を低減するため、複数の異なる方向から基板に対してＸ線を照射し、各照射方向における画像を合成する。そのため、特許文献１乃至４に記載の技術を用いても、ラミノグラフィ方式のＸ線検査装置が取得した三次元のＸ線検査結果から、基板の裏面側のはんだが移り込むことによる影響を除去することはできない。よって、ラミノグラフィ方式のＸ線検査装置が取得したＸ線画像を用いて、基板の表面に実装された部品やはんだの像をより正確に検査することができない。 On the other hand, a laminographic X-ray inspection apparatus acquires a three-dimensional X-ray image to be inspected. In the X-ray inspection apparatus of the laminography method, in order to reduce the influence that the influence of the solder on the back side of the substrate is reflected in the X-ray inspection result on the surface of the substrate, the substrate is irradiated with X-rays from a plurality of different directions, The images in each irradiation direction are synthesized. Therefore, even if the techniques described in Patent Documents 1 to 4 are used, the influence caused by the transfer of the solder on the back side of the substrate is removed from the three-dimensional X-ray inspection result acquired by the laminography X-ray inspection apparatus. It is not possible. Therefore, it is not possible to more accurately inspect the image of components and solder mounted on the surface of the substrate using the X-ray image acquired by the laminographic X-ray inspection apparatus.
本発明の第１の態様にかかるＸ線検査システムは、Ｘ線検査装置と、情報処理装置と、を備える。Ｘ線検査装置は、基板の表面のＸ線画像であるＸ線検査結果を取得する。また、情報処理装置は、前記基板の裏面の外観検査結果又は前記基板の裏面のＸ線検査結果に基づいて、前記基板の裏面にはんだ付けされたはんだに関するはんだ情報を取得する。また、情報処理装置は、前記はんだ情報及び前記基板の裏面にはんだ付けされるはんだの設計情報の少なくとも１つと、前記基板の厚さに関する情報、及び前記Ｘ線検査装置のＸ線源と検出部との位置関係に関する情報に基づいて、前記基板の裏面にはんだ付けされたはんだが前記基板の表面のＸ線検査結果に写り込む位置及び前記基板の裏面にはんだ付けされたはんだが前記基板の表面のＸ線検査結果に写り込む濃淡値を算出する。そして、情報処理装置は、前記位置及び前記濃淡値に基づいて、前記基板の表面のＸ線検査結果に写り込む前記基板の裏面のはんだの影響を除去する。 An X-ray inspection system according to a first aspect of the present invention includes an X-ray inspection apparatus and an information processing apparatus. The X-ray inspection apparatus acquires an X-ray inspection result that is an X-ray image of the surface of the substrate. Further, the information processing apparatus acquires solder information related to solder soldered to the back surface of the substrate based on the appearance inspection result on the back surface of the substrate or the X-ray inspection result on the back surface of the substrate. In addition, the information processing apparatus includes at least one of the solder information and design information of solder to be soldered to the back surface of the substrate, information on the thickness of the substrate, and an X-ray source and a detection unit of the X-ray inspection device. And the position where the solder soldered to the back surface of the substrate is reflected in the X-ray inspection result of the surface of the substrate and the solder soldered to the back surface of the substrate is the surface of the substrate The gray value reflected in the X-ray inspection result is calculated. Then, the information processing apparatus removes the influence of the solder on the back surface of the substrate, which is reflected in the X-ray inspection result on the surface of the substrate, based on the position and the gray value.
本発明の第２の態様にかかるＸ線検査方法は、基板の表面のＸ線画像であるＸ線検査結果を取得する。また、前記基板の裏面の外観検査結果又は前記基板の裏面のＸ線検査結果に基づいて、前記基板の裏面にはんだ付けされたはんだに関するはんだ情報を取得する。また、前記はんだ情報及び前記基板の裏面にはんだ付けされるはんだの設計情報の少なくとも１つと、前記基板の厚さに関する情報、及びＸ線検査装置のＸ線源と検出部との位置関係に関する情報に基づいて、前記基板の裏面にはんだ付けされたはんだが前記基板の表面のＸ線検査結果に写り込む位置及び前記基板の裏面にはんだ付けされたはんだが前記基板の表面のＸ線検査結果に写り込む濃淡値を算出する。そして、前記位置及び前記濃淡値に基づいて、前記基板の表面のＸ線検査結果に写り込む前記基板の裏面のはんだの影響を除去する。 The X-ray inspection method according to the second aspect of the present invention acquires an X-ray inspection result that is an X-ray image of the surface of the substrate. In addition, based on the appearance inspection result on the back surface of the substrate or the X-ray inspection result on the back surface of the substrate, solder information related to solder soldered to the back surface of the substrate is acquired. In addition, at least one of the solder information and design information of solder to be soldered to the back surface of the substrate, information on the thickness of the substrate, and information on a positional relationship between the X-ray source and the detection unit of the X-ray inspection apparatus The position where the solder soldered to the back surface of the substrate is reflected in the X-ray inspection result of the front surface of the substrate and the solder soldered to the back surface of the substrate become the X-ray inspection result of the front surface of the substrate. Calculate the shade value to be reflected. Then, based on the position and the gray value, the influence of the solder on the back surface of the substrate reflected in the X-ray inspection result on the surface of the substrate is removed.
本発明により、基板の表面側のはんだ付け部をより正確に検査することができるＸ線検査システム及びＸ線検査方法を提供することができる。 According to the present invention, it is possible to provide an X-ray inspection system and an X-ray inspection method capable of more accurately inspecting a soldered portion on the surface side of a substrate.
以下、本発明を適用可能な実施の形態について説明する。なお、本発明は、下記の実施の形態に限定されるものではない。
実施の形態１．
図１に、本発明の実施の形態１にかかるＸ線検査システム１００の構成を示す。図１に示すように、Ｘ線検査システム１００は、情報処理装置１、Ｘ線検査装置２等を備える。
情報処理装置１は、ＣＰＵ（Ｃｅｎｔｒａｌ Ｐｒｏｃｅｓｓｉｎｇ Ｕｎｉｔ）、メモリ等を備える。そして、情報処理装置１のＣＰＵがメモリ等に記憶された各種プログラムを実行することにより、情報処理装置１の各種機能が実現する。
Ｘ線検査装置２は、基板の表面のＸ線画像であるＸ線検査結果を取得する。
Embodiments to which the present invention can be applied will be described below. In addition, this invention is not limited to the following embodiment.
Embodiment 1 FIG.
FIG. 1 shows a configuration of an X-ray inspection system 100 according to the first embodiment of the present invention. As shown in FIG. 1, the X-ray inspection system 100 includes an information processing apparatus 1, an X-ray inspection apparatus 2, and the like.
The information processing apparatus 1 includes a CPU (Central Processing Unit), a memory, and the like. Various functions of the information processing apparatus 1 are realized by the CPU of the information processing apparatus 1 executing various programs stored in a memory or the like.
The X-ray inspection apparatus 2 acquires an X-ray inspection result that is an X-ray image of the surface of the substrate.
図２に、本発明の実施の形態１にかかるＸ線検査装置２の構成を簡略的に示す。図２に示すように、Ｘ線検査装置２は、Ｘ線源であるＸ線管２１、ディテクタ２２（検出部）等を備える。Ｘ線管２１は、検査対象である基板３に対してＸ線を照射する。ディテクタ２２は、基板３を透過したＸ線を受光する。また、実施の形態１にかかるＸ線検査装置２は、従来のラミノグラフィ方式のＸ線検査装置と同様のＸ線検査装置である。ここで、ラミノグラフィ方式は、検査対象の高さ方向のスライス画像を取得する方式である。そして、検査対象である基板３に対してＸ線をななめ方向から照射するように、Ｘ線管２１とディテクタ２２とが配置されている。また、Ｘ線検査装置２は、Ｘ線管２１とディテクタ２２とを、基板３に垂直な軸周りに回転させながら測定を行う。この際、Ｘ線管２１とディテクタ２２とを回転させることにより、基板３の表面側のＸ線の焦点位置がずれないように、予めＸ線管２１の高さを合わせておく。
そして、Ｘ線検査装置２は、Ｘ線管２１とディテクタ２２の各回転角度におけるＸ線検査結果の画像を重ね合わせたものを、Ｘ線検査結果とする。なお、本発明は、ラミノグラフィ方式以外のＸ線検査装置に対しても適用可能である。
FIG. 2 schematically shows the configuration of the X-ray inspection apparatus 2 according to the first embodiment of the present invention. As shown in FIG. 2, the X-ray inspection apparatus 2 includes an X-ray tube 21 that is an X-ray source, a detector 22 (detection unit), and the like. The X-ray tube 21 irradiates the substrate 3 to be inspected with X-rays. The detector 22 receives X-rays that have passed through the substrate 3. The X-ray inspection apparatus 2 according to the first embodiment is an X-ray inspection apparatus similar to a conventional laminography type X-ray inspection apparatus. Here, the laminography method is a method of acquiring a slice image in the height direction of an inspection object. And the X-ray tube 21 and the detector 22 are arrange | positioned so that X-ray | X_line may be irradiated to the board | substrate 3 which is a test object from a licking direction. Further, the X-ray inspection apparatus 2 performs measurement while rotating the X-ray tube 21 and the detector 22 around an axis perpendicular to the substrate 3. At this time, by rotating the X-ray tube 21 and the detector 22, the height of the X-ray tube 21 is adjusted in advance so that the focal position of the X-ray on the surface side of the substrate 3 is not shifted.
Then, the X-ray inspection apparatus 2 uses an X-ray inspection result obtained by superimposing images of X-ray inspection results at each rotation angle of the X-ray tube 21 and the detector 22. The present invention is also applicable to X-ray inspection apparatuses other than the laminography system.
これにより、基板３の表面側に実装された部品（図２の部品Ａ）を透過するＸ線は、Ｘ線管２１とディテクタ２２の回転角度によらず常にディテクタ２２上の同じ位置に照射される。一方、基板３の裏面側に実装された部品（図２の部品Ｂ）を透過するＸ線は、Ｘ線管２１とディテクタ２２の回転角度によってディテクタ２２上の異なる位置に照射される。そのため、各回転角度におけるＸ線検査結果の画像を重ね合わせると、基板３の裏面側に実装された部品Ｂの像のみをぼかすことができる。これにより、基板の表面側に実装された部品Ａの像をより正確に検査することができる。 Thus, X-rays that pass through the component mounted on the surface side of the substrate 3 (component A in FIG. 2) are always irradiated to the same position on the detector 22 regardless of the rotation angle of the X-ray tube 21 and the detector 22. The On the other hand, X-rays that pass through a component (component B in FIG. 2) mounted on the back side of the substrate 3 are irradiated to different positions on the detector 22 depending on the rotation angles of the X-ray tube 21 and the detector 22. Therefore, when the images of the X-ray inspection results at the respective rotation angles are superimposed, only the image of the component B mounted on the back surface side of the substrate 3 can be blurred. Thereby, the image of the component A mounted on the surface side of the substrate can be inspected more accurately.
図３に、従来のＸ線検査装置によって得られるＸ線検査結果の画像の一例を示す。図３の右側の画像は、図３の左側の実線で囲んだ部分を拡大したものである。また、図３は、従来のＸ線検査装置によって、基板の表面側に実装されたＳＯＰ（Ｓｍａｌｌ Ｏｕｔｌｉｎｅ Ｐａｃｋａｇｅ）のはんだ付け部に焦点を合わせて撮像した画像である。図３右側の画像に示すように、基板の裏面側に実装された部品やはんだ等の影響を多少受けて背景色が灰色となっているが、各リードのはんだ付け部がそれぞれ分離されて確認することができる。そして、図３に示す画像を用いて、基板の表面に実装された部品の下側に位置するはんだの面積や、基板の表面に実装されたリードのはんだ付け部のはんだの厚さを検査することができる。 FIG. 3 shows an example of an image of an X-ray inspection result obtained by a conventional X-ray inspection apparatus. The image on the right side of FIG. 3 is an enlarged view of the portion surrounded by the solid line on the left side of FIG. FIG. 3 is an image captured by a conventional X-ray inspection apparatus while focusing on a soldering portion of an SOP (Small Outline Package) mounted on the surface side of the substrate. As shown in the image on the right side of Fig. 3, the background color is gray due to the influence of parts and solder mounted on the back side of the board, but the soldered parts of each lead are separated and confirmed. can do. Then, using the image shown in FIG. 3, the area of the solder located below the component mounted on the surface of the board and the thickness of the solder of the soldered portion of the lead mounted on the surface of the board are inspected. be able to.
しかしながら、基板の裏面側に実装された部品が大きかったり、基板の裏面側のはんだ付け部のはんだ面積が大きかったりする場合、基板の裏面側の部品やはんだの影響が上記の方法によっても十分に消去することができない場合がある。
図４に、裏面側と表面側との同じ位置に部品が実装されている基板の一例を示す。また、図５に、図４に示す基板の裏面のＸ線検査結果を示す。また、図６の左側に、図４に示す基板をラミノグラフィ方式のＸ線検査装置により撮像して得られる画像を示し、図６の右側に、図６の左側の実線で囲んだ部分を拡大したものを示す。図４に示すように、基板の裏面側に実装された部品が大きかったり、基板の裏面側のはんだ付け部のはんだ面積が大きかったりする場合、図６の実線で囲んだ部分に示すように、基板の裏面のはんだが基板の表面のＸ線検査結果へ写り込む。そのため、検査対象である基板の表面側に実装された部品やはんだの像をより正確に検査することができないという問題がある。なお、ここで、「基板の裏面のはんだが基板の表面のＸ線検査結果へ写り込む。」とは、基板の表面を撮像したＸ線画像に、意図しない、基板の裏面のはんだの像が形成されてしまうことを意味する。
However, if the component mounted on the back side of the board is large or the solder area of the soldering part on the back side of the board is large, the influence of the parts on the back side of the board and the solder is sufficient even by the above method. Sometimes it cannot be erased.
FIG. 4 shows an example of a substrate on which components are mounted at the same position on the back surface side and the front surface side. FIG. 5 shows the X-ray inspection result of the back surface of the substrate shown in FIG. In addition, an image obtained by imaging the substrate shown in FIG. 4 with a laminography type X-ray inspection apparatus is shown on the left side of FIG. 6, and a part surrounded by a solid line on the left side of FIG. 6 is enlarged on the right side of FIG. Show things. As shown in FIG. 4, when the component mounted on the back side of the substrate is large or the solder area of the soldering part on the back side of the substrate is large, as shown in the part surrounded by the solid line in FIG. The solder on the back surface of the substrate is reflected in the X-ray inspection result on the front surface of the substrate. Therefore, there is a problem that it is not possible to more accurately inspect the image of the component or solder mounted on the surface side of the substrate to be inspected. Here, “the solder on the back surface of the substrate is reflected in the X-ray inspection result on the surface of the substrate” means that an unintended image of the solder on the back surface of the substrate appears in the X-ray image obtained by imaging the surface of the substrate. It means that it will be formed.
そこで、本実施の形態１にかかるＸ線検査システム１００においては、情報処理装置１が、基板３の裏面にはんだ付けされたはんだが基板３の表面のＸ線検査結果に写り込む位置及び基板３の裏面にはんだ付けされたはんだが基板３の表面のＸ線検査結果に写り込む濃淡値を算出する。そして、情報処理装置１が、当該位置及び当該濃淡値に基づいて、基板３の表面のＸ線検査結果に写り込む基板３の裏面のはんだの影響を除去する。 Therefore, in the X-ray inspection system 100 according to the first embodiment, the information processing apparatus 1 determines the position at which the solder soldered to the back surface of the substrate 3 is reflected in the X-ray inspection result on the surface of the substrate 3 and the substrate 3. The gray value that the solder soldered to the back surface of the substrate is reflected in the X-ray inspection result of the surface of the substrate 3 is calculated. Then, the information processing apparatus 1 removes the influence of the solder on the back surface of the substrate 3 that is reflected in the X-ray inspection result on the surface of the substrate 3 based on the position and the gray value.
具体的には、情報処理装置１は、図７に示すように、基板３の裏面の外観検査結果又は基板３の裏面のＸ線検査結果に基づいて、基板３の裏面にはんだ付けされたはんだに関するはんだ情報を取得する（ステップＳ１）。また、情報処理装置１は、基板３の裏面にはんだ付けされるはんだの設計情報を予め情報処理装置１のメモリ（図示省略）に格納する（ステップＳ１）。
ここで、はんだ情報とは、基板３の裏面のはんだ付け部の位置及び大きさ等に関する情報である。また、基板３の裏面の外観検査結果は、光学式外観検査装置が基板３の裏面を撮像することにより取得した画像データであり、情報処理装置１のメモリ（図示省略）に予め保存されている。また、基板３の裏面のＸ線検査結果は、例えば、Ｘ線検査装置２が基板３の裏面を撮像することにより取得した画像データであり、情報処理装置１のメモリ（図示省略）に予め保存されている。
Specifically, as illustrated in FIG. 7, the information processing apparatus 1 is soldered to the back surface of the substrate 3 based on the appearance inspection result on the back surface of the substrate 3 or the X-ray inspection result on the back surface of the substrate 3. The solder information regarding is acquired (step S1). Further, the information processing apparatus 1 stores in advance the design information of solder to be soldered to the back surface of the substrate 3 in a memory (not shown) of the information processing apparatus 1 (step S1).
Here, the solder information is information relating to the position and size of the soldering portion on the back surface of the substrate 3. Further, the appearance inspection result on the back surface of the substrate 3 is image data acquired by the optical appearance inspection device capturing an image of the back surface of the substrate 3, and is stored in advance in a memory (not shown) of the information processing apparatus 1. . The X-ray inspection result on the back surface of the substrate 3 is, for example, image data acquired by the X-ray inspection apparatus 2 imaging the back surface of the substrate 3 and is stored in advance in a memory (not shown) of the information processing apparatus 1. Has been.
また、情報処理装置１は、当該はんだ情報及び当該はんだの設計情報の少なくとも１つと、基板３の厚さに関する情報、及びＸ線検査装置２のＸ線管２１とディテクタ２２との位置関係に関する情報に基づいて、基板３の裏面にはんだ付けされたはんだが基板３の表面のＸ線検査結果に写り込む位置を算出する（ステップＳ２）。また、情報処理装置１は、当該はんだ情報及び当該はんだの設計情報の少なくとも１つと、基板３の厚さに関する情報、及びＸ線検査装置２のＸ線管２１とディテクタ２２との位置関係に関する情報に基づいて、基板３の裏面にはんだ付けされたはんだが基板３の表面のＸ線検査結果に写り込む濃淡値を算出する（ステップＳ２）。 The information processing apparatus 1 also includes at least one of the solder information and the design information of the solder, information on the thickness of the substrate 3, and information on the positional relationship between the X-ray tube 21 and the detector 22 of the X-ray inspection apparatus 2. Based on the above, the position where the solder soldered to the back surface of the substrate 3 is reflected in the X-ray inspection result on the surface of the substrate 3 is calculated (step S2). The information processing apparatus 1 also includes at least one of the solder information and the design information of the solder, information on the thickness of the substrate 3, and information on the positional relationship between the X-ray tube 21 and the detector 22 of the X-ray inspection apparatus 2. Based on the above, the gray value that the solder soldered to the back surface of the substrate 3 is reflected in the X-ray inspection result of the surface of the substrate 3 is calculated (step S2).
そして、情報処理装置１は、当該位置及び当該濃淡値に基づいて、基板３の表面のＸ線検査結果に写り込む基板３の裏面のはんだの影響を除去する。具体的には、情報処理装置１は、当該濃淡値が一定値以上である場合に、基板３の裏面にはんだ付けされたはんだが基板３の表面のＸ線検査結果に写り込む位置を、Ｘ線検査装置２の検査範囲から除外する（ステップＳ３）。より具体的には、情報処理装置１は、当該濃淡値が一定値以上である場合に、基板３の裏面にはんだ付けされたはんだが基板３の表面のＸ線検査結果に写り込む位置を除外した範囲を検査範囲として、Ｘ線検査装置２に送信する。 Then, the information processing apparatus 1 removes the influence of the solder on the back surface of the substrate 3 that is reflected in the X-ray inspection result on the surface of the substrate 3 based on the position and the gray value. Specifically, the information processing apparatus 1 determines the position where the solder soldered to the back surface of the substrate 3 is reflected in the X-ray inspection result on the surface of the substrate 3 when the gray value is a certain value or more. Exclude from the inspection range of the line inspection apparatus 2 (step S3). More specifically, the information processing apparatus 1 excludes the position where the solder soldered to the back surface of the substrate 3 appears in the X-ray inspection result on the surface of the substrate 3 when the gray value is equal to or greater than a certain value. The obtained range is transmitted to the X-ray inspection apparatus 2 as the inspection range.
図８に、Ｘ線検査装置２の検査範囲の一例を示す。図８に示すように、基板３の表面にリードが実装されており、Ｘ線検査装置２の検査範囲は、当該リードの周囲（図８の破線で囲んだ部分）である。
図９〜図１２を用いて、図８に示す検査対象をＸ線検査装置２により撮像した場合に、基板の裏面のはんだが基板の表面のＸ線検査結果へ写り込むことについて、簡略的に説明する。図９、図１０において、基板３の表面には部品（図９、図１０のＡ）が実装されており、基板３の裏面にははんだ（図９、図１０のＢ）がはんだ付けされている。
FIG. 8 shows an example of the inspection range of the X-ray inspection apparatus 2. As shown in FIG. 8, a lead is mounted on the surface of the substrate 3, and the inspection range of the X-ray inspection apparatus 2 is the periphery of the lead (portion surrounded by a broken line in FIG. 8).
9 to 12, when the inspection object shown in FIG. 8 is imaged by the X-ray inspection apparatus 2, the solder on the back surface of the substrate is reflected in the X-ray inspection result on the surface of the substrate. explain. 9 and 10, components (A in FIGS. 9 and 10) are mounted on the surface of the substrate 3, and solder (B in FIGS. 9 and 10) is soldered on the back surface of the substrate 3. Yes.
図９に示すように、Ｘ線管２１が、紙面向かってななめ右上から基板３の表面に対してＸ線を照射した場合、ディテクタ２２上の部品Ａの像が形成される箇所（図９の実線で囲む部分）の紙面向かって右側に、一部重なるようにして、はんだＢの像（図９の破線で囲む部分）が写り込む。この時のはんだＢが写り込む範囲をｂ１とする。
また、図１０に示すように、Ｘ線管２１が、紙面向かってななめ左上から基板３の表面に対してＸ線を照射した場合、ディテクタ２２上の部品Ａの像が形成される箇所（図１０の実線で囲む部分）の紙面向かって左側に、一部重なるようにして、はんだＢの像（図１０の破線で囲む部分）が写り込む。この時のはんだＢが写り込む範囲をｂ２とする。
As shown in FIG. 9, when the X-ray tube 21 irradiates the surface of the substrate 3 from the upper right corner with respect to the paper surface, an image of the part A on the detector 22 is formed (see FIG. 9). An image of the solder B (portion surrounded by a broken line in FIG. 9) appears so as to partially overlap the right side of the paper surface of the portion surrounded by a solid line). The range in which the solder B appears at this time is b1.
Further, as shown in FIG. 10, when the X-ray tube 21 irradiates the surface of the substrate 3 from the upper left with the licking toward the paper surface, the part A image on the detector 22 is formed (see FIG. 10). An image of the solder B (portion surrounded by a broken line in FIG. 10) is reflected so as to partially overlap the left side of the paper surface of the portion surrounded by a solid line 10). The range in which the solder B appears at this time is b2.
そこで、情報処理装置１は、はんだ情報及びはんだの設計情報の少なくとも１つと、基板３の厚さに関する情報、及びＸ線検査装置２のＸ線管２１とディテクタ２２との位置関係に関する情報に基づいて、基板３の裏面のはんだＢが基板３の表面のＸ線検査結果に写り込む位置（範囲ｂ１及び範囲ｂ２）を算出する。 Therefore, the information processing apparatus 1 is based on at least one of solder information and solder design information, information on the thickness of the substrate 3, and information on the positional relationship between the X-ray tube 21 and the detector 22 of the X-ray inspection apparatus 2. Thus, the positions (range b1 and range b2) where the solder B on the back surface of the substrate 3 is reflected in the X-ray inspection result on the surface of the substrate 3 are calculated.
次に、情報処理装置１は、基板３の裏面のはんだＢが基板３の表面のＸ線検査結果に写り込む濃淡値を算出する。具体的には、図１１Ａに示すように、基板３の表面の部品Ａの像が形成される位置の左右に、一部重なるようにして、基板３の裏面のはんだＢが写り込む。また、基板３の裏面のはんだＢが写り込む範囲ｂ１と基板３の裏面のはんだＢが写り込む範囲ｂ２とは一部重なっている。そのため、基板３の裏面のはんだＢが写り込む範囲内で、基板３の裏面のはんだＢが写り込む度合い（濃淡値）は異なる。例えば、図１１Ｂに示すように、基板３の裏面のはんだＢが写り込む範囲ｂ１と基板３の裏面のはんだＢが写り込む範囲ｂ２とが重なり合わない範囲においては、写り込み度（濃淡値）が３０であるのに対し、基板３の裏面のはんだＢが写り込む範囲ｂ１と基板３の裏面のはんだＢが写り込む範囲ｂ２とが重なり合う範囲においては、写り込み度（濃淡値）が８０となる。 Next, the information processing apparatus 1 calculates a gray value that the solder B on the back surface of the substrate 3 appears in the X-ray inspection result on the surface of the substrate 3. Specifically, as shown in FIG. 11A, the solder B on the back surface of the substrate 3 is reflected so as to partially overlap the left and right of the position where the image of the component A on the surface of the substrate 3 is formed. In addition, a range b1 where the solder B on the back surface of the substrate 3 is reflected and a range b2 where the solder B on the back surface of the substrate 3 is partially overlapped. For this reason, the degree of the reflection of the solder B on the back surface of the substrate 3 (the gray value) is different within the range where the solder B on the back surface of the substrate 3 is reflected. For example, as shown in FIG. 11B, in the range where the range b1 in which the solder B on the back surface of the substrate 3 is reflected and the range b2 in which the solder B on the back surface of the substrate 3 is not overlapped, the degree of reflection (gray value). Is 30, but in a range where the range b1 in which the solder B on the back surface of the substrate 3 is reflected and the range b2 in which the solder B on the back surface of the substrate 3 is overlapped, the degree of reflection (shading value) is 80. Become.
そこで、情報処理装置１は、はんだ情報及びはんだの設計情報の少なくとも１つと、基板３の厚さに関する情報、及びＸ線検査装置２のＸ線管２１とディテクタ２２との位置関係に関する情報に基づいて、基板３の裏面のはんだＢが写り込む範囲の重なる箇所を算出する。そして、情報処理装置１は、基板３の裏面のはんだＢが写り込む範囲の重なり等に基づいて、基板３の裏面のはんだＢが基板３の表面のＸ線検査結果に写り込む濃淡値を算出する。 Therefore, the information processing apparatus 1 is based on at least one of solder information and solder design information, information on the thickness of the substrate 3, and information on the positional relationship between the X-ray tube 21 and the detector 22 of the X-ray inspection apparatus 2. Thus, the overlapping portion of the range where the solder B on the back surface of the substrate 3 is reflected is calculated. Then, the information processing apparatus 1 calculates the gray value that the solder B on the back surface of the substrate 3 appears in the X-ray inspection result on the surface of the substrate 3 based on the overlap of the range where the solder B on the back surface of the substrate 3 appears. To do.
次いで、情報処理装置１は、基板３のはんだＢが写り込む濃淡値が一定値以上である、基板３のはんだＢが写り込む範囲を特定する。図１２に、基板３のはんだＢが写り込む濃淡値が一定値以上である、基板３のはんだＢが写り込む範囲ｂを示す（図１２の破線で囲む部分）。換言すれば、情報処理装置１は、図１３Ａに示すように、基板３の表面の検査対象範囲（図１３Ａの破線で囲む部分）において、基板３のはんだＢが写り込む濃淡値が一定値以上である、基板３のはんだＢが写り込む範囲（図１３Ａの破線の楕円で囲む部分）を特定する。そして、情報処理装置１は、基板３のはんだＢが写り込む濃淡値が一定値以上である、基板３のはんだＢが写り込む範囲（図１３Ａの破線の楕円で囲む部分）を、Ｘ線検査装置２の検査範囲から除外する。より具体的には、情報処理装置１は、当該濃淡値が一定値以上である基板３のはんだＢが写り込む範囲を除外した範囲を検査範囲として、Ｘ線検査装置２に送信する。 Next, the information processing apparatus 1 specifies a range in which the solder B of the board 3 is reflected, and the gray value in which the solder B of the board 3 is reflected is equal to or greater than a certain value. FIG. 12 shows a range b in which the solder B of the substrate 3 is reflected where the gray value reflected by the solder B of the substrate 3 is equal to or greater than a certain value (portion surrounded by a broken line in FIG. 12). In other words, as shown in FIG. 13A, the information processing apparatus 1 has a gray level value at which the solder B of the substrate 3 appears in a range to be inspected on the surface of the substrate 3 (a portion surrounded by a broken line in FIG. 13A) above a certain value. The range in which the solder B of the substrate 3 is reflected (the portion surrounded by the dashed ellipse in FIG. 13A) is specified. Then, the information processing apparatus 1 performs an X-ray inspection on the range in which the solder B of the substrate 3 is reflected where the gray value reflected by the solder B of the substrate 3 is equal to or greater than a certain value (a portion surrounded by a dashed ellipse in FIG. 13A). Exclude from the inspection range of the device 2. More specifically, the information processing apparatus 1 transmits to the X-ray inspection apparatus 2 the range excluding the range in which the solder B of the substrate 3 whose gray value is a certain value or more is excluded as the inspection range.
以上に説明した、本発明の実施の形態１にかかるＸ線検査システム１００及びＸ線検査方法においては、情報処理装置１が、基板３の裏面の外観検査結果又は基板３の裏面のＸ線検査結果に基づいて、基板３の裏面にはんだ付けされたはんだに関するはんだ情報を取得する。また、情報処理装置１は、当該はんだ情報及び基板３の裏面にはんだ付けされるはんだの設計情報の少なくとも１つと、基板３の厚さに関する情報、及びＸ線検査装置２のＸ線管２１とディテクタ２２との位置関係に関する情報に基づいて、基板３の裏面にはんだ付けされたはんだが基板３の表面のＸ線検査結果に写り込む位置及び基板３の裏面にはんだ付けされたはんだが基板３の表面のＸ線検査結果に写り込む濃淡値を算出する。そして、情報処理装置１は、当該位置及び当該濃淡値に基づいて、基板３の表面のＸ線検査結果に写り込む３基板の裏面のはんだの影響を除去する。 In the X-ray inspection system 100 and the X-ray inspection method according to the first embodiment of the present invention described above, the information processing apparatus 1 performs the appearance inspection result on the back surface of the substrate 3 or the X-ray inspection on the back surface of the substrate 3. Based on the result, the solder information regarding the solder soldered to the back surface of the substrate 3 is acquired. The information processing apparatus 1 also includes at least one of the solder information and design information of solder to be soldered to the back surface of the board 3, information on the thickness of the board 3, and the X-ray tube 21 of the X-ray inspection apparatus 2. Based on the information regarding the positional relationship with the detector 22, the position where the solder soldered to the back surface of the substrate 3 is reflected in the X-ray inspection result on the surface of the substrate 3 and the solder soldered to the back surface of the substrate 3 are the substrate 3. The gray value reflected in the X-ray inspection result on the surface of the surface is calculated. Then, the information processing apparatus 1 removes the influence of the solder on the back surface of the three substrates that is reflected in the X-ray inspection result on the surface of the substrate 3 based on the position and the gray value.
すなわち、情報処理装置１は、当該はんだ情報及び当該設計情報の少なくとも１つと、基板３の厚さ、及びＸ線検査装置２のＸ線管２１とディテクタ２２との位置関係に関する情報に基づいて、基板３の裏面のはんだが基板３の表面のＸ線検査結果に写り込む位置及び濃淡値を算出する。特に、情報処理装置１は、Ｘ線検査装置２のＸ線管２１とディテクタ２２との位置関係にも基づいて、当該位置及び濃淡値を算出する。そのため、それぞれのＸ線の照射方向で、ラミノグラフィ方式位のＸ線検査装置２が取得するＸ線画像において、基板３の裏面のはんだが写り込む位置及び濃淡値を算出することができる。そのため、ラミノグラフィ方式のＸ線検査装置２が取得した三次元のＸ線検査結果から、基板３の裏面側のはんだが移り込むことによる影響を除去することができる。よって、ラミノグラフィ方式のＸ線検査装置２が取得したＸ線画像を用いて、基板３の表面に実装された部品やはんだの像をより正確に検査することができる。すなわち、基板３の表面側のはんだ付け部をより正確に検査することができるＸ線検査システム１００及びＸ線検査方法を提供することができる。 That is, the information processing apparatus 1 is based on information on the positional relationship between the X-ray tube 21 and the detector 22 of the X-ray inspection apparatus 2, the thickness of the substrate 3, and at least one of the solder information and the design information. The position and gray value at which the solder on the back surface of the substrate 3 is reflected in the X-ray inspection result on the surface of the substrate 3 are calculated. In particular, the information processing apparatus 1 calculates the position and the gray value based on the positional relationship between the X-ray tube 21 and the detector 22 of the X-ray inspection apparatus 2. Therefore, in each X-ray irradiation direction, in the X-ray image acquired by the X-ray inspection apparatus 2 of the laminography type, the position and the gray value at which the solder on the back surface of the substrate 3 is reflected can be calculated. Therefore, it is possible to remove the influence caused by the transfer of the solder on the back surface side of the substrate 3 from the three-dimensional X-ray inspection result acquired by the laminographic X-ray inspection apparatus 2. Therefore, it is possible to more accurately inspect the image of components and solder mounted on the surface of the substrate 3 using the X-ray image acquired by the laminographic X-ray inspection apparatus 2. That is, it is possible to provide the X-ray inspection system 100 and the X-ray inspection method that can inspect the soldering portion on the surface side of the substrate 3 more accurately.
また、情報処理装置１は、当該濃淡値が一定値以上である場合に、基板３の裏面にはんだ付けされたはんだが基板３の表面のＸ線検査結果に写り込む位置を、Ｘ線検査装置２の検査範囲から除外する。
これにより、複雑な画像処理等を行わずに、ラミノグラフィ方式のＸ線検査装置２が取得した三次元のＸ線検査結果から、基板３の裏面側のはんだが移り込むことによる影響を除去することができる。
また、当該濃淡値が一定値以上である場合にのみ、基板３の裏面にはんだ付けされたはんだが基板３の表面のＸ線検査結果に写り込む位置を、Ｘ線検査装置２の検査範囲から除外するため、不必要に検査範囲を狭めなくて済む。
Further, the information processing apparatus 1 determines the position at which the solder soldered to the back surface of the substrate 3 is reflected in the X-ray inspection result on the surface of the substrate 3 when the gray value is equal to or greater than a certain value. Exclude from the inspection range of 2.
This eliminates the influence of the solder on the back side of the substrate 3 from the three-dimensional X-ray inspection result obtained by the laminography-type X-ray inspection apparatus 2 without performing complicated image processing or the like. Can do.
Further, from the inspection range of the X-ray inspection apparatus 2, the position where the solder soldered to the back surface of the substrate 3 appears in the X-ray inspection result on the surface of the substrate 3 only when the gray value is a certain value or more. Since it is excluded, it is not necessary to narrow the inspection range unnecessarily.
実施の形態２．
図１４は、本発明の実施の形態２にかかるＸ線検査方法を説明するフローチャートである。なお、本発明の実施の形態２にかかるＸ線検査システム１００の構成は、実施の形態１にかかるＸ線検査システム１００の構成と同様であるため、その説明を省略する。
Embodiment 2. FIG.
FIG. 14 is a flowchart for explaining an X-ray inspection method according to the second embodiment of the present invention. In addition, since the structure of the X-ray inspection system 100 concerning Embodiment 2 of this invention is the same as that of the structure of the X-ray inspection system 100 concerning Embodiment 1, the description is abbreviate | omitted.
図１４に示すように、実施の形態２にかかるＸ線検査方法において、ステップＳ１０１及びステップＳ１０２の処理は、図７のステップＳ１及びステップＳ２の処理と同様であり、ステップＳ１０３の処理のみが、図７のステップＳ３の処理と異なる。よって、ステップＳ１０１及びステップＳ１０２の処理についての説明は省略する。 As shown in FIG. 14, in the X-ray inspection method according to the second embodiment, the processes in steps S101 and S102 are the same as the processes in steps S1 and S2 in FIG. 7, and only the process in step S103 is performed. This is different from the processing in step S3 in FIG. Therefore, the description about the process of step S101 and step S102 is abbreviate | omitted.
情報処理装置１は、基板３の裏面にはんだ付けされたはんだが基板３の表面のＸ線検査結果に写り込む濃淡値が一定値以上である場合に、当該濃淡値に基づいて、基板３の表面のＸ線検査結果を補正する（ステップＳ１０３）。
具体的には、まず、情報処理装置１は、図１５Ａに示すように、基板３の表面の検査対象範囲（図１５Ａの破線で囲む部分）において、基板３のはんだが写り込む濃淡値が一定値以上である、基板３のはんだが写り込む範囲（図１５Ａの一点鎖線で囲む部分）を特定する。
The information processing apparatus 1 is configured such that when the solder value soldered to the back surface of the substrate 3 is reflected in the X-ray inspection result on the surface of the substrate 3 is equal to or greater than a certain value, The surface X-ray inspection result is corrected (step S103).
Specifically, first, as illustrated in FIG. 15A, the information processing apparatus 1 has a constant gray value in which the solder of the substrate 3 is reflected in the inspection target range (the portion surrounded by the broken line in FIG. 15A) on the surface of the substrate 3. A range (a portion surrounded by a one-dot chain line in FIG. 15A) in which the solder of the board 3 is reflected is specified.
次に、情報処理装置１は、当該濃淡値が一定値以上である、基板３の裏面のはんだが写り込む範囲（図１５Ａの破線の楕円で囲む部分）に対応するＸ線検査結果のデータを、当該濃淡値に基づいて補正する。具体的には、図１５Ｂに示すように、Ｘ線検査結果のデータが実線で示す値であり、基板３の裏面のはんだが写り込む濃淡値のデータが一点鎖線で示す値である場合、図１５Ｃに示すように、Ｘ線検査結果のデータから基板３の裏面のはんだが写り込む濃淡値のデータを差し引く等の補正を行う。なお、図１５Ｂ、図１５Ｃにおいて、縦軸は濃淡値を示し、横軸は検査範囲における位置（例えば、図１５Ａの一点鎖線上における位置）を示す。また、図１５Ｄに、情報処理装置１が、基板３の裏面のはんだが写り込む濃淡値に基づいて、Ｘ線検査結果を補正した範囲（図１５Ｄのハッチングで示す範囲）を示す。 Next, the information processing apparatus 1 obtains X-ray inspection result data corresponding to a range (a portion surrounded by a dashed ellipse in FIG. 15A) in which the gray value is a certain value or more and the solder on the back surface of the substrate 3 is reflected. The correction is made based on the gray value. Specifically, as shown in FIG. 15B, when the data of the X-ray inspection result is a value indicated by a solid line, and the gray value data reflected by the solder on the back surface of the substrate 3 is a value indicated by an alternate long and short dash line, As shown in FIG. 15C, correction such as subtraction of the gray value data reflected by the solder on the back surface of the substrate 3 from the X-ray inspection result data is performed. In FIG. 15B and FIG. 15C, the vertical axis indicates the gray value, and the horizontal axis indicates the position in the inspection range (for example, the position on the one-dot chain line in FIG. 15A). FIG. 15D shows a range (range indicated by hatching in FIG. 15D) in which the information processing apparatus 1 corrects the X-ray inspection result based on the gray value on which the solder on the back surface of the substrate 3 is reflected.
以上に説明した実施の形態２にかかるＸ線検査システム１００及びＸ線検査方法によれば、実施の形態１にかかるＸ線検査システム１００及びＸ線検査方法と同様の効果が得られることは勿論のこと、特に、当該濃淡値が一定値以上である場合に、当該濃淡値に基づいて、基板３の表面のＸ線検査結果を補正する。そのため、当該濃淡値が一定値以上である、基板３の裏面のはんだが写り込む範囲が広い場合に、実施の形態１では検査範囲が狭くなってしまうが、実施の形態２では、検査範囲を狭めることなく、基板３の表面側のはんだ付け部をより正確に検査することができる。
また、当該濃淡値が一定値以上である場合にのみ、当該濃淡値に基づいて、基板３の表面のＸ線検査結果を補正する。そのため、補正処理を行う範囲を必要最低限に抑えることができ、検査の効率を向上することができる。
According to the X-ray inspection system 100 and the X-ray inspection method according to the second embodiment described above, the same effects as those of the X-ray inspection system 100 and the X-ray inspection method according to the first embodiment can be obtained. In particular, when the gray value is equal to or greater than a certain value, the X-ray inspection result on the surface of the substrate 3 is corrected based on the gray value. For this reason, the inspection range is narrowed in the first embodiment when the gray value is equal to or greater than a certain value and the range in which the solder on the back surface of the substrate 3 is reflected is wide. In the second embodiment, the inspection range is reduced. The soldering portion on the surface side of the substrate 3 can be inspected more accurately without narrowing.
Also, only when the gray value is equal to or greater than a certain value, the X-ray inspection result on the surface of the substrate 3 is corrected based on the gray value. Therefore, the range for performing the correction process can be minimized, and the inspection efficiency can be improved.
なお、本発明は上記実施の形態に限られたものではなく、趣旨を逸脱しない範囲で適宜変更することが可能である。例えば、情報処理装置１を省略して、Ｘ線検査装置２の制御部が情報処理装置１における処理と同様の処理を行ってもよい。 Note that the present invention is not limited to the above-described embodiment, and can be changed as appropriate without departing from the spirit of the present invention. For example, the information processing apparatus 1 may be omitted, and the control unit of the X-ray inspection apparatus 2 may perform the same process as the process in the information processing apparatus 1.
１ 情報処理装置
２ Ｘ線検査装置
２１ Ｘ線管（Ｘ線源）
２２ ディテクタ（検出部）
３ 基板
１００ Ｘ線検査システム
1 Information processing device 2 X-ray inspection device 21 X-ray tube (X-ray source)
22 Detector (Detector)
3 Substrate 100 X-ray inspection system
Claims (6)
前記基板の裏面の外観検査結果又は前記基板の裏面のＸ線検査結果に基づいて、前記基板の裏面にはんだ付けされたはんだに関するはんだ情報を取得し、
前記はんだ情報及び前記基板の裏面にはんだ付けされるはんだの設計情報の少なくとも１つと、前記基板の厚さに関する情報、及び前記Ｘ線検査装置のＸ線源と検出部との位置関係に関する情報に基づいて、前記基板の裏面にはんだ付けされたはんだが前記基板の表面のＸ線検査結果に写り込む位置及び前記基板の裏面にはんだ付けされたはんだが前記基板の表面のＸ線検査結果に写り込む濃淡値を算出し、
前記位置及び前記濃淡値に基づいて、前記基板の表面のＸ線検査結果に写り込む前記基板の裏面のはんだの影響を除去する情報処理装置と、
を備えるＸ線検査システム。 An X-ray inspection apparatus for acquiring an X-ray inspection result which is an X-ray image of the surface of the substrate;
Based on the appearance inspection result of the back surface of the substrate or the X-ray inspection result of the back surface of the substrate, obtaining solder information regarding the solder soldered to the back surface of the substrate,
At least one of the solder information and design information of solder to be soldered to the back surface of the substrate, information on the thickness of the substrate, and information on the positional relationship between the X-ray source and the detection unit of the X-ray inspection apparatus Based on the position, the solder soldered on the back surface of the substrate is reflected in the X-ray inspection result on the front surface of the substrate, and the solder soldered on the back surface of the substrate is reflected in the X-ray inspection result on the front surface of the substrate. To calculate the shade value
An information processing apparatus that removes the influence of the solder on the back surface of the substrate, which is reflected in the X-ray inspection result of the surface of the substrate, based on the position and the gray value,
X-ray inspection system.
前記濃淡値が一定値以上である場合に、前記基板の裏面にはんだ付けされたはんだが前記基板の表面のＸ線検査結果に写り込む位置を、前記Ｘ線検査装置の検査範囲から除外する、請求項１に記載のＸ線検査システム。 The information processing apparatus includes:
Excludes the position where the solder soldered to the back surface of the substrate appears in the X-ray inspection result on the surface of the substrate from the inspection range of the X-ray inspection apparatus when the gray value is a certain value or more. The X-ray inspection system according to claim 1.
前記濃淡値が一定値以上である場合に、当該濃淡値に基づいて、前記基板の表面のＸ線検査結果を補正する、請求項１に記載のＸ線検査システム。 The information processing apparatus includes:
The X-ray inspection system according to claim 1, wherein when the gray value is equal to or greater than a certain value, the X-ray inspection result on the surface of the substrate is corrected based on the gray value.
前記基板の裏面の外観検査結果又は前記基板の裏面のＸ線検査結果に基づいて、前記基板の裏面にはんだ付けされたはんだに関するはんだ情報を取得し、
前記はんだ情報及び前記基板の裏面にはんだ付けされるはんだの設計情報の少なくとも１つと、前記基板の厚さに関する情報、及びＸ線検査装置のＸ線源と検出部との位置関係に関する情報に基づいて、前記基板の裏面にはんだ付けされたはんだが前記基板の表面のＸ線検査結果に写り込む位置及び前記基板の裏面にはんだ付けされたはんだが前記基板の表面のＸ線検査結果に写り込む濃淡値を算出し、
前記位置及び前記濃淡値に基づいて、前記基板の表面のＸ線検査結果に写り込む前記基板の裏面のはんだの影響を除去する、Ｘ線検査方法。 Obtain X-ray inspection results that are X-ray images of the surface of the substrate,
Based on the appearance inspection result of the back surface of the substrate or the X-ray inspection result of the back surface of the substrate, obtaining solder information regarding the solder soldered to the back surface of the substrate,
Based on at least one of the solder information and design information of solder to be soldered to the back surface of the substrate, information on the thickness of the substrate, and information on a positional relationship between the X-ray source and the detection unit of the X-ray inspection apparatus. The position where the solder soldered to the back surface of the substrate is reflected in the X-ray inspection result on the surface of the substrate and the solder soldered to the back surface of the substrate is reflected in the X-ray inspection result on the surface of the substrate. Calculate the tint value,
An X-ray inspection method for removing the influence of solder on the back surface of the substrate, which is reflected in an X-ray inspection result on the surface of the substrate, based on the position and the gray value.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016180717A (en) * | 2015-03-25 | 2016-10-13 | 日本電気株式会社 | Inspection control device, inspection device, and inspection method |
| WO2020153063A1 (en) * | 2019-01-25 | 2020-07-30 | 東レ株式会社 | Inspection method and manufacturing method for structure and inspection apparatus and manufacturing apparatus for structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004219200A (en) * | 2003-01-14 | 2004-08-05 | Matsushita Electric Ind Co Ltd | X-ray tomography inspection method |
| JP2009115462A (en) * | 2007-11-01 | 2009-05-28 | Omron Corp | Method of inspecting solder electrode by X-ray tomographic image and board inspection apparatus using this method |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004219200A (en) * | 2003-01-14 | 2004-08-05 | Matsushita Electric Ind Co Ltd | X-ray tomography inspection method |
| JP2009115462A (en) * | 2007-11-01 | 2009-05-28 | Omron Corp | Method of inspecting solder electrode by X-ray tomographic image and board inspection apparatus using this method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016180717A (en) * | 2015-03-25 | 2016-10-13 | 日本電気株式会社 | Inspection control device, inspection device, and inspection method |
| WO2020153063A1 (en) * | 2019-01-25 | 2020-07-30 | 東レ株式会社 | Inspection method and manufacturing method for structure and inspection apparatus and manufacturing apparatus for structure |
| JP6777248B1 (en) * | 2019-01-25 | 2020-10-28 | 東レ株式会社 | Structure inspection method and manufacturing method, structure inspection equipment and manufacturing equipment |
| US11841332B2 (en) | 2019-01-25 | 2023-12-12 | Toray Industries, Inc. | Inspection method and manufacturing method for structure and inspection apparatus and manufacturing apparatus for structure |
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