JP2014182090A - Load applying device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize highly accurate measurement of joint strength between a substrate 2 and a resin member 1 in a test piece 1.SOLUTION: A load applying device 1A comprises a guide member 10 having a guide hole 13, and comprises: a slide member 20 that is provided in a manner slidable along a bottom surface 13a of the guide hole 13 in a prescribed direction in the guide hole 13; a pressing member 30 that fixes a test piece 1 to the guide member 10 in a state of facing a resin member 1 of the test piece 1 toward the bottom surface 13a side of the guide hole 13; and restricting members 40 and 41 that restrict the movement of the slide member 20 in a depth direction of the guide hole 13. The slide member 20 applies a load to the resin member 1 located within the guide hole 13 through the movement in the prescribed direction.

Description

  The present invention relates to a load application device.

  Conventionally, in order to measure the bonding strength between a semiconductor element formed in a thin plate shape and a lead frame bonded to an edge of the semiconductor element, a load is applied to the semiconductor element from a direction perpendicular to the semiconductor element. There is a measuring device that measures the bonding strength (see, for example, Patent Document 1).

JP-A-8-29307

  In recent years, in developing and designing a semiconductor device mounting structure, it has become very important to predict a peeling life between two members in a short time.

  Therefore, the present inventor uses a test piece 3 (see FIG. 7) in which the resin member 1 is mounted on the substrate 2 on the basis of the measurement of the above-mentioned Patent Document 1, and between the substrate 1 and the resin member 2. Evaluation of joint strength was studied.

  The resin member 1 is formed so as to protrude from the substrate 2 in the plate thickness direction, and the cross section in the surface direction of the substrate 2 is circular. The resin member 1 is formed of a sealing resin material for sealing a semiconductor chip or the like in a semiconductor device. As the substrate 2, any one of a metal plate, a ceramic substrate, a resin substrate, and the like used in the semiconductor device is used. That is, the test piece 3 is used for measurement using the bonding strength between the sealing resin material and the substrate without using a semiconductor device.

  For example, when the test piece 3 is molded by injection molding using a mold, the resin member 1 may be formed in a pudding shape having a draft angle so that the resin member 1 can be easily removed from the mold. I need it.

  Here, the pudding shape is a shape in which the cross-sectional area in the surface direction of the substrate 2 in the resin member 1 decreases from the substrate 2 side toward the tip end side of the resin member 1. Therefore, in the resin member 1, the side surface of the resin member 1 is formed in a tapered shape that is inclined with respect to the thickness direction of the substrate 2.

  For example, as shown in FIG. 8, in a state where the test piece 3 is fixed to the pedestal 4 by the fixing member 5, the rod-shaped jig 6 is attached to the resin member 1 in the surface direction of the substrate 2 (direction of arrow A in the figure). Load is applied by the load cell 110. Then, the bonding strength between the resin member 1 and the substrate 2 is evaluated by determining whether or not peeling has occurred between the resin member 1 and the substrate 2.

  In this case, since the resin member 1 is formed in a pudding shape as described above, the portion of the resin member 1 to which a load is applied from the jig 6 is one side in the thickness direction of the substrate 2 (arrow B in FIG. 6). Direction). This is because the tip of the jig 4 slides with respect to the side surface of the resin member 1.

  When the portion of the resin member 1 to which the load is applied is shifted from the jig 4, the stress applied to the interface between the substrate 2 and the resin member 1 is changed, causing a variation in the measurement data of the bonding strength. become. That is, the stress applied to the interface varies every time the jig 4 applies a load to the resin member 1 of the test piece 3 due to the displacement of the portion. As a result, the measurement data of the bonding strength between the resin member 1 and the substrate 2 varies.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a load applying device that suppresses displacement of a portion to which a load is applied among mounted members mounted on a substrate of a test piece.

In order to achieve the above object, the invention according to claim 1 includes a guide member (10) having a guide hole (13) extending in a predetermined direction,
The guide hole opens on one side in the depth direction orthogonal to the predetermined direction,
A bottom surface (13a) is provided on the other side in the depth direction of the guide hole,
A slide member (20) provided to be slidable in the predetermined direction in the guide hole along the bottom surface;
A fixing member (30) for fixing the substrate to the guide member in a state where the mounted member of the test piece (3) having the mounted member (1) mounted on the substrate (2) is disposed in the guide hole. When,
A restriction member (40, 41) for restricting movement of the slide member to one side in the depth direction,
The slide member is configured to apply a load to the mounted member in the guide hole by movement in the predetermined direction.

  According to the first aspect of the present invention, when the slide member moves in the guide hole in the predetermined direction, the restricting member restricts the slide member from moving to one side in the depth direction. For this reason, it can suppress that the site | part which a slide member contacts among mounted members shifts. Therefore, even if the shape of the mounted member is a pudding shape, it is possible to suppress the shift of the portion of the mounted member to which the load is applied from the slide member.

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

It is a front view of the load application device in one embodiment of the present invention. It is an exploded view of the load application apparatus in the said embodiment. It is a top view of the load application device in the embodiment. It is a top view of the load application device in the embodiment. It is the elements on larger scale of the load application apparatus in the said embodiment. It is a figure which shows the measurement state of the joint strength using the load application apparatus in the said embodiment. It is a figure which shows the structure of the test piece in the said embodiment. It is a front view of the load application apparatus in the comparative example of this invention.

  Hereinafter, an embodiment of a load application device 1A of the present invention will be described with reference to FIGS.

  FIG. 1 is a front view of a load application device 1A of the present embodiment, and FIG. 2 is an exploded view of the load application device 1A as viewed from the front. In FIG. 2, the limiting members 40 and 41 are omitted. 3 is a view taken in the direction of arrow A in the drawing, and shows the load application device 1A in a state in which the slide member 20, the pressing member 30, and the limiting members 40 and 41 are removed from the load application device 1A in FIG. It is. FIG. 4 is a view taken in the direction of arrow A in FIG. 1 and shows the load application device 1A in a state in which the pressing member 30 and the limiting members 40 and 41 are removed from the load application device 1A.

As shown in FIGS. 1 and 2, the load application device 1 </ b> A of the present embodiment includes a guide member 10, a slide member 20, a pressing member 30, and limiting members 40 and 41.
In addition, the dashed-dotted line in FIG. 1 has shown the external shape of the part which overlapped with the guide member 10 among the slide members 20. FIG. The guide member 10 includes a guide bottom member 11 and a guide side member 12.

  As shown in FIG. 3, the guide-side member 12 is formed in a substantially Y shape in which side portions 11a and 11b extending in a predetermined direction are connected on the other side in the predetermined direction. A guide hole 13 is formed between the side portions 11a and 11b. The guide hole 13 is formed to extend in a predetermined direction (vertical direction in FIG. 3). That is, the side portions 11 a and 11 b are arranged on both sides in the width direction with respect to the guide hole 13. The width direction is a direction orthogonal to the predetermined direction. FIG. 4 shows a state in which the slide member 20 is in the guide hole 13 of the guide member 10.

  Here, one side of the guide hole 13 in the predetermined direction (upper side in FIG. 3) is opened. The other side of the guide hole 13 in the predetermined direction (the lower side in FIG. 3) is closed. The guide hole 13 is opened on one side in the depth direction (the front side in FIG. 3). The depth direction is a direction orthogonal to the width direction and orthogonal to the predetermined direction.

  As shown in FIG. 2 or 3, the side portion 11 a is provided with convex portions 50 and 51 that are convex toward one side in the depth direction. The convex portions 50 and 51 are arranged so as to be shifted in a predetermined direction. Concave portions 52 and 53 are formed as second concave portions between the convex portions 50 and 51. The recesses 52 and 53 are arranged so as to be shifted in a predetermined direction. The bottom surfaces of the recesses 52 and 53 are each formed parallel to a predetermined direction. Between the recesses 52 and 53, a recess 54 that is recessed on the other side in the depth direction is formed.

  The depth dimensions of the recesses 52 and 53 are the same, and are smaller than the dimension S in the plate thickness direction of the substrate 2 of the test piece 3 (see S in FIG. 7). The depth direction dimension of the recess 54 is larger than the depth direction dimension of the recesses 52 and 53.

  Note that the test piece 3 is obtained by mounting the pudding-like resin member 1 on the substrate 2 as described above. The test piece 3 of this embodiment is used for evaluating the bonding strength between a sealing resin used for sealing an IC chip, a lead frame, and the like in a semiconductor device and the substrate. The semiconductor device constitutes an electronic circuit device that forms an electronic circuit on a substrate.

  Further, similarly to the side portion 11a, the side portion 11b is provided with convex portions 50 and 51 and concave portions 52, 53 and 54. The convex part 50 of the side part 11 a and the convex part 50 of the side part 11 b are opposed to each other through the guide hole 13. The convex portion 51 of the side portion 11 a and the convex portion 51 of the side portion 11 b are opposed to each other through the guide hole 13. The concave portion 52 of the side portion 11 a and the concave portion 52 of the side portion 11 b are opposed to each other through the guide hole 13. The concave portion 53 of the side portion 11 a and the concave portion 53 of the side portion 11 b are opposed to each other through the guide hole 13. The concave portion 54 of the side portion 11 a and the concave portion 54 of the side portion 11 b are opposed to each other through the guide hole 13.

  The guide side member 12 is provided with a fixing portion 11c that protrudes to the other side in the predetermined direction. The fixing | fixed part 11c is used when fixing the guide member 10 to the base 100 so that it may mention later.

  The guide bottom member 11 is disposed on the other side in the depth direction with respect to the guide side member 12. The guide bottom member 11 is formed in a long plate shape and is disposed so as to cover the guide hole 13 from the other side in the depth direction. As a result, the guide bottom member 11 can form the bottom surface 13 a of the guide hole 13. The bottom surface 13a is formed to extend in a predetermined direction.

  Note that the space between the guide bottom member 11 and the guide side member 12 is fixed by a fastening member 60 such as a screw. 1-4, the code | symbols 62 and 63 have shown the screw hole.

  As shown in FIGS. 1, 2, and 4, the slide member 20 includes a slide body 21 and a slide support portion 22.

  The slide body 21 is formed in a prismatic shape and is formed so as to be slidable in a predetermined direction in the guide hole 13. As shown in FIG. 2, recesses 70 and 71 that are recessed on the other side in the depth direction are provided on one side of the slide body 21 in the depth direction. The recess 70 is a first recess disposed on the other side in the predetermined direction with respect to the recess 71. The bottom surface 70 a of the recess 70 is disposed on the other side in the depth direction than the bottom surface 71 a of the recess 71. That is, the dimension of the recess 70 in the depth direction is larger than the dimension of the recess 71 in the depth direction.

  Here, a blade portion 80 (see FIG. 5) is provided between the bottom surface 71 a of the recess 71 and the side portion 70 b of the recess 70. FIG. 5 is an enlarged view in which the blade portion 80 and its periphery are enlarged. The blade portion 80 is formed so as to protrude from the side portion 70b of the concave portion 70 to one side in a predetermined direction, and the inclined surface 70c and the bottom surface 71a of the concave portion 71 intersect at an angle θ to constitute a tip portion. . That is, the blade part 80 is formed so that the area of the cross section parallel to the predetermined direction and parallel to the depth direction becomes smaller toward the tip part on one side in the predetermined direction.

  In the present embodiment, the angle θ in the blade portion 80 is set to an acute angle of less than 90 degrees. The inclined surface 70 c and the bottom surface 71 a constitute first and second surfaces that are parallel to the width direction of the guide hole 13. The inclined surface 70c is formed between the bottom surface 71a and the side portion 70b. The side portion 70b constitutes the concave portion 70, and is disposed between the bottom surfaces 71a and 70a on the other side in the predetermined direction with respect to the bottom surface 70a of the concave portion 70.

  The slide support portion 22 is formed so as to protrude from the slide body 21 to the other side in the predetermined direction. As will be described later, the slide support portion 22 is used to support a rod 130 (see FIG. 6) used for applying a load.

  The pressing member 30 is disposed on one side in the depth direction with respect to the recesses 52 and 53 of the guide member 10. The pressing member 30 is formed so as to cover the substrate 2 of the test piece 3 from one side in the depth direction. As will be described later, the pressing member 30 presses the substrate 2 of the test piece 3 from one side in the depth direction in a state where the substrate 2 of the test piece 3 is disposed in the recesses 52 and 53. The pressing member 30 is fixed to the guide member 10 by fastening members 31 and 32 such as screws.

  The limiting members 40 and 41 are each formed in a long plate shape extending in the width direction of the guide hole 13.

  The limiting member 40 is disposed on the other side in the predetermined direction with respect to the recesses 52 and 53 of the guide side member 12. A fastening member 90 such as a screw is fixed between the limiting member 40 and the side portion 11 a of the guide side member 12. A fastening member 90 such as a screw is fixed between the limiting member 40 and the side portion 11 b of the guide side member 12.

  The limiting member 41 is disposed on one side in the predetermined direction with respect to the recesses 52 and 53 of the guide side member 12. A space between the limiting member 41 and the side portion 11a of the guide side member 12 is fixed by a fastening member 90 such as a screw. A fastening member 90 such as a screw is fixed between the limiting member 41 and the side portion 11b of the guide side member 12.

  Here, the dimension between the limiting member 40 and the bottom surface 13a of the guide hole 13 and the dimension between the limiting member 41 and the bottom surface 13a of the guide hole 13 are the same. And let the dimension between the limitation member 40 (or 41) and the bottom face 13a of the guide hole 13 be the dimension H1 (refer FIG. 1).

  The maximum dimension (H2 in FIG. 2) in the depth direction on the other side in the predetermined direction with respect to the recess 70 in the slide body 21 is the same as the dimension H1. For this reason, the restricting member 40 restricts the other side of the slide body 21 in the predetermined direction with respect to the recess 70 from moving to the one side in the depth direction. The maximum dimension in the depth direction on one side in the predetermined direction with respect to the recess 70 in the slide body 21 is the same as the dimension H1. For this reason, the restricting member 41 restricts one side of the slide body 21 in the predetermined direction with respect to the recess 70 from moving to one side in the depth direction.

  In the present embodiment, the guide member 10, the slide member 20, the pressing member 30, and the limiting members 40 and 41 are each made of a metal such as stainless steel, for example.

  Next, a method for evaluating the bonding strength using the load application device 1A of the present embodiment will be described. The bonding strength evaluation method is used when designing and developing a mounting structure of a semiconductor device.

  First, the load application device 1 </ b> A with the pressing member 30 removed from the guide member 10 is prepared.

  Next, the fixing portion 11c of the guide side member 12 is fixed to the pedestal 110 in a state where the predetermined direction of the load applying device 1A is aligned with the top and bottom direction. Then, the load cell 110 and the rod 120 are installed on the other side in the predetermined direction of the slide support portion 22. At this time, the rod 120 is supported by the slide support portion 22.

  Next, the substrate 2 of the test piece 3 is placed in the recesses 52 and 53 in a state where the recess 70 of the slide member 20 overlaps the recesses 54 of the side portions 11 a and 11 b of the guide member 10.

  At this time, the thickness direction of the substrate 2 of the test piece 3 is made to coincide with the depth direction of the recesses 52 and 53 (that is, the depth direction of the guide hole 13). In addition to this, the resin member 1 of the test piece 3 is directed toward the bottom surface 70 a of the recess 70 of the slide member 20 (that is, the bottom surface 13 a of the guide hole 13). As a result, the resin member 1 of the test piece 3 is positioned in the recess 70 of the slide member 20 (that is, in the guide hole 13).

  Here, as described above, the depth dimensions of the recesses 52 and 53 are smaller than the dimension S in the plate thickness direction of the substrate 2 of the test piece 3 (see S in FIG. 7). For this reason, the back surface (surface on one side in the depth direction) of the substrate 2 is positioned on one side in the depth direction with respect to the convex portions 50 and 51.

  At this time, between the pressing member 30 and the guide member 10 is fixed by the fastening members 31 and 32 in a state where the substrate 2 is pressed against the bottom surface side (that is, the other side in the depth direction) of the concave portions 52 and 53 by the pressing member 30. .

  Next, a load is applied to one side in a predetermined direction by the load cell 110 via the rod 120 to the slide body 21 of the slide member 20. For this reason, the slide member 20 slides to one side in a predetermined direction along the bottom surface 13 a of the guide hole 13. Accordingly, the blade portion 80 of the slide main body 21 contacts the resin member 1 of the test piece 3 from the other side in the predetermined direction and applies a load.

  At this time, the limiting member 40 limits the movement of the other side in the predetermined direction with respect to the recess 70 in the slide member 20 to the one side in the depth direction. The limiting member 41 limits the movement of one side in the predetermined direction with respect to the recess 70 in the slide member 20 to one side in the depth direction.

  In this manner, the load is applied to the resin member 1 of the test piece 3 through the slide member 20 by the load cell 110 repeatedly.

  Here, the load cell 110 is a device for applying a load to the resin member 1 and measuring the applied load. For this reason, the presence or absence of peeling between the resin member 1 of the test piece 3 and the substrate 2 is determined while measuring the load applied to the test piece 3 by the load cell 110. As a result, the bonding strength between the resin member 1 of the test piece 3 and the substrate 2 can be measured. Thereby, the peeling lifetime between the resin member 1 and the board | substrate 2 can be evaluated in an accelerated manner.

  According to the present embodiment described above, the load application device 1 </ b> A includes the guide member 10 having the guide hole 13 extending in a predetermined direction, and the guide hole 13 opens on one side in the depth direction of the guide hole 13. The load application device 1 </ b> A includes a slide member 20 provided so as to be slidable in a predetermined direction in the guide hole 13 along the bottom surface 13 a of the guide hole 13. The load application device 1 </ b> A includes a pressing member 30 that fixes the substrate 2 of the test piece 1 to the guide member 10 in a state where the resin member 1 of the test piece 1 faces the bottom surface 13 a of the guide hole 13.

  Here, when the dimension between the limiting member 40 (or 41) and the bottom surface 13a of the guide hole 13 is a dimension H1, the maximum dimension in the depth direction on the other side in the predetermined direction with respect to the recess 70 in the slide body 21 is It is the same as the dimension H1. The maximum dimension in the depth direction on one side in the predetermined direction with respect to the recess 70 in the slide body 21 is the same as the dimension H1.

  According to the above, when the slide member 20 slides in the guide hole 13 to one side in the predetermined direction, the slide member 20 is restricted from moving on the one side in the depth direction by the limiting members 40 and 41. For this reason, when the slide member 20 applies a load to the resin member 1, it is possible to prevent the portion of the resin member 1 that contacts the blade portion 80 of the slide member 20 from shifting. Thereby, even if the shape of the resin member 1 is a pudding shape, it can suppress that the site | part to which a load is given from the blade part 80 of the slide member 20 among the resin members 1 shifts | deviates. Therefore, it is possible to suppress the occurrence of variation in the measurement data of the bonding strength. For this reason, the bonding strength between the substrate 2 and the resin member 1 can be measured and evaluated with high accuracy.

  In this embodiment, a load is applied to the resin member 1 from the other side in a predetermined direction by the blade portion 80 of the slide member 20. For this reason, the area of the contact part between the slide member 20 and the resin member 1 can be made small. Thereby, it can further suppress that slide member 20 shifts to resin member 1. Accordingly, it is possible to further suppress the occurrence of variation in the measurement data of the bonding strength between the resin member 1 and the substrate 2.

  In the present embodiment, the substrate 2 is fixed to the guide member 10 in a state where the substrate 2 of the test piece 3 is disposed in the recesses 52 and 53. For this reason, it can prevent that the test piece 3 shifts | deviates to a predetermined direction or the width direction with the side wall which comprises the recessed parts 52 and 53. FIG. For this reason, it is possible to accurately apply the load to the test piece 3.

  In this embodiment, the depth dimensions of the recesses 52 and 53 are smaller than the dimension S in the plate thickness direction of the substrate 2 of the test piece 3 as described above. For this reason, the back surface of the board | substrate 2 will be located in the depth direction one side rather than the convex parts 50 and 51. FIG. The holding member 30 is formed so as to cover the substrate 2 of the test piece 3. For this reason, the pressing member 30 can press the substrate 2 against the bottom surfaces of the recesses 52 and 53 over the entire surface direction.

  In addition, in this embodiment, the pressing member 30 and the guide member 10 are fixed by the fastening members 31 and 32 in a state where the substrate 2 is pressed against the bottom surface side of the recesses 52 and 53 by the pressing member 30. Thereby, the board | substrate 2 can be arrange | positioned in the recessed parts 52 and 53, correcting the curvature of the board | substrate 2. FIG. Therefore, even if the substrate 2 is warped, the contact portion between the resin member 1 and the blade portion 80 can be set at the same position for each test piece 3. Alternatively, even if the thickness of the substrate 2 varies, the contact portion between the resin member 1 and the blade 80 can be set at the same position for each test piece 3.

  As described above, it is possible to further suppress the variation in the measurement data of the bonding strength.

  In the present embodiment, a concave portion 54 is provided between the concave portions 52 and 53 in the side portions 11 a and 11 b of the guide member 10. For this reason, in a state where the test piece 3 is fixed to the guide member 10, the user can visually recognize the actual state of the resin member 1 through the recess 54. Thereby, the user can determine the peeling of the resin member 1 from the substrate 2 in a state where the test piece 3 is fixed to the guide member 10.

  In the present embodiment, after the test piece 3 is fixed to the guide member 10, a load is applied to the resin member 1 of the test piece 3 by sliding the slide member 20 along the bottom surface 13 a of the guide hole 13. Can do.

  For example, as shown in FIG. 8, when a load is applied to the resin member 1 of the test piece 3 by the jig 6, it is necessary to adjust the position of the jig 6 with respect to the resin member 1.

  On the other hand, in the present embodiment, as described above, a load can be applied to the resin member 1 of the test piece 3 by sliding the slide member 20 along the bottom surface 13a of the guide hole 13. For this reason, it is not necessary to adjust the position of the slide member 20 with respect to the test piece 3.

(Other embodiments)
In the said embodiment, although the example which evaluates the joining strength between the resin member for sealing used with a semiconductor device and a board | substrate using the test piece 3 replaced with a semiconductor device was demonstrated, instead of this, (1), (2), and (3) may be used.
(1) The bonding strength between the resin member and the substrate is evaluated using a semiconductor device instead of the test piece 3. Specifically, a test piece 3 that is cut out by a laser from a semiconductor device in which an IC chip, a lead frame, or the like is sealed with a sealing resin material is used. In this case, for example, a test piece 3 in which a resin member (mounted member) 2 is mounted on a lead frame as the substrate 1 can be cut out from the semiconductor device.
(2) In the semiconductor device, the test piece 3 is cut out from an IC chip (integrated circuit) formed by forming electronic elements on a semiconductor substrate. In this case, the electronic element constitutes a mounted member. As the electronic element, a capacitor, a coil, a diode, a transistor, or the like can be used.
(3) In an electronic circuit device other than the semiconductor device, the bonding strength between the mounted member and the substrate is evaluated. Specifically, the test piece 3 is cut out from an electronic circuit device in which an electronic element as a mounted member is mounted on a substrate. Thereby, the joint strength between the electronic element and the substrate can be evaluated.

  In this case, not only the case where a part of the electronic circuit device cut out from the electronic circuit device is used as the test piece 3, but the entire electronic circuit device is used as the test piece 3 to evaluate the bonding strength between the mounted member and the substrate. Also good.

In the above-described embodiment, the example in which the bonding strength evaluation method of the present invention is used when designing and developing a mounting structure of a semiconductor device has been described. Instead, the following (4) and (5) are used. It may be.
(4) The bonding strength evaluation method according to the present invention is applied to a manufacturing method for manufacturing a semiconductor device. For example, an arbitrary semiconductor device is extracted as a sample from the manufacturing process of manufacturing the semiconductor device, and the test piece 3 is obtained by cutting the semiconductor device as the extracted sample with a laser. Then, the pass / fail of the semiconductor device is determined by evaluating the bonding strength of the test piece 3. If the bonding strength is less than a certain value, the test is rejected. If the bonding strength is a certain value or more, the test is accepted.
(5) The bonding strength evaluation method according to the present invention is applied to a manufacturing method for manufacturing an electronic circuit device other than a semiconductor device. Also in this case, similarly to the above (4), an arbitrary electronic circuit device is extracted as a sample from the manufacturing process of manufacturing the electronic circuit device, and the test piece 3 is cut out from the electronic circuit device as the extracted sample by a laser. And

  In this case, not only the case where a part of the electronic circuit device cut out from the electronic circuit device is used as the test piece 3, but the entire electronic circuit device is used as the test piece 3 to evaluate the bonding strength between the mounted member and the substrate. Also good.

  In the above embodiment, an example in which a pudding-like member as the resin member 1 is used as a mounted member has been described. Instead, a member other than a pudding-like shape (for example, a columnar shape) is used as a mounted member. It may be used as

  In the above-described embodiment, the example in which the test piece 3 is disposed on one side in the depth direction of the guide member 10 has been described. However, the test piece 3 may be disposed in the guide hole 13 instead.

  In the above-described embodiment, the example in which the angle θ that forms the tip portion between the inclined surface 70c and the bottom surface 71a in the blade portion 80 is set to an acute angle has been described. You may set the angle (theta) which comprises a front-end | tip part between at right angles or an obtuse angle.

  In addition, this invention is not limited to above-described embodiment, In the range described in the claim, it can change suitably. In the above embodiment, when referring to the shape, positional relationship, etc. of components, the shape, position, etc., unless otherwise specified and in principle limited to a specific shape, positional relationship, etc. It is not limited to relationships.

1 Resin member (mounted member)
2 Substrate 3 Test piece 10 Guide member 11 Guide bottom member 12 Guide side member 13a Bottom surface 20 Slide member 30 Holding member (fixing member)
40, 41 Restriction member

Claims (14)

A guide member (10) having a guide hole (13) extending in a predetermined direction;
The guide hole opens on one side in the depth direction orthogonal to the predetermined direction,
A bottom surface (13a) is provided on the other side in the depth direction of the guide hole,
A slide member (20) provided to be slidable in the predetermined direction in the guide hole along the bottom surface;
A fixing member (30) for fixing the substrate to the guide member in a state where the mounted member of the test piece (3) having the mounted member (1) mounted on the substrate (2) is disposed in the guide hole. When,
A restriction member (40, 41) for restricting movement of the slide member to one side in the depth direction,
The load applying device, wherein the slide member applies a load to the mounted member in the guide hole by movement in the predetermined direction.   The load application device according to claim 1, wherein the limiting member is supported by the guide member. The slide member is provided with a blade portion (80) formed so as to protrude to one side in the predetermined direction,
3. The load applying device according to claim 1, wherein the slide member is configured such that the blade portion applies a load to the mounted member from the other side in the predetermined direction by the movement of the slide member. The slide member has first and second surfaces (71a, 70c) that are orthogonal to the predetermined direction and parallel to the width direction of the guide hole that is orthogonal to the depth direction,
The said blade part is formed so that it may protrude on the one side of the said predetermined direction, when the said 1st, 2nd surface cross | intersects at an acute angle and forms a front-end | tip part. The load applying device described in 1. A first recess (70) that is recessed on the other side in the depth direction is provided on one side in the depth direction of the slide member,
The load applying device according to claim 3 or 4, wherein the blade portion is formed so as to protrude into the first recess from a side surface (70b) forming the first recess.   The load application device according to claim 5, wherein the fixing member fixes the substrate to the guide member in a state where the mounted member of the test piece is positioned in the first recess. First and second limiting members are provided as the limiting member,
The first restricting member (41) restricts one side of the predetermined direction of the slide member from moving to one side of the depth direction,
The load applying device according to claim 6, wherein the second restricting member (40) restricts movement of the other side of the predetermined direction of the slide member to one side of the depth direction. . By making the dimension between the first limiting member and the bottom surface of the guide hole the same as the dimension in the depth direction on one side in the predetermined direction of the slide member, the slide member has the depth. The first restricting member restricts movement to one side of the direction;
By making the dimension between the second restriction member and the bottom surface of the guide hole the same as the dimension in the depth direction on the other side in the predetermined direction of the slide member, the slide member has the depth. The load applying device according to claim 7, wherein the second restricting member restricts movement to one side of the direction. A second recess (52, 53) that is recessed on the other side in the depth direction is provided on one side in the depth direction of the guide member,
The said fixing member fixes the said board | substrate to the said guide member in the state by which the said board | substrate is arrange | positioned in the said 2nd recessed part of the said guide member, The one of Claim 1 thru | or 8 characterized by the above-mentioned. Load application device.   The load applying device according to claim 9, wherein the fixing member fixes the substrate to the guide member in a state where the substrate is pressed against a bottom surface side of the second recess.   11. The load application device according to claim 9, wherein a dimension in a depth direction of the second recess is smaller than a dimension in a thickness direction of the substrate. The guide member is provided with two second recesses,
A third recess (54) that is recessed on the other side in the depth direction is provided on one side in the depth direction of the guide member,
One of the two second recesses (53) is provided on one side of the predetermined direction with respect to the third recess,
Of the two second recesses, the other second recess (52) is provided on the other side in the predetermined direction with respect to the third recess,
12. The load application according to claim 8, wherein a dimension in the depth direction of the third recess is larger than a dimension in the depth direction of the two second recesses. apparatus.   A bonding strength evaluation method, wherein the bonding strength between the substrate and the mounted member is evaluated using the load application device according to claim 1.   An electronic circuit device manufacturing method, comprising: manufacturing an electronic circuit device using the evaluation method according to claim 13.

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