JP2014141264A - Manufacturing method of package with mount - Google Patents

Abstract

Provided is a package with a mount capable of enlarging the object of an article to be packaged in shrink film packaging, and a method for manufacturing the same.
A package with a mount includes a mount, an article packaged with a heat-shrinkable film, and an adhesive layer that joins the heat-shrinkable film and the mount. 1. As the adhesive layer, a foamed hot melt adhesive layer containing bubbles is used as a hot melt adhesive that can reversibly repeat melting and solidification by heat.
[Selection] Figure 1A

Description

  The present invention relates to a package with a mount and a method for manufacturing the same. More specifically, the present invention relates to a package with a mount formed using a hot melt adhesive and a method for manufacturing the same.

Conventionally, blister packaging has been frequently used as a packaging form. Blister packaging heats and softens a thin thermoplastic resin plate, accommodates the article in a relatively hard transparent plastic molded to match the shape of the article, and puts the plastic on the mount on which the article name and article information are printed It is the packaging form which affixes. Because of transparent packaging, there is an advantage that the contents can be visually confirmed while packaging the article. However, in recent years, attention has been focused on shrink film packaging as a packaging form that replaces blister packaging from the viewpoint of reducing CO ₂ emissions from packaging materials and reducing the volume of garbage.

  As a manufacturing method of shrink film packaging, for example, in Patent Document 1, (a) a board supply step for supplying a single board onto the conveyor one by one, (b) a plate roll on the surface of the board that is supplied and conveyed on the conveyor And (c) cylindrical film sticking for supplying and sticking a tubular film that can be heat-shrinkable to the backing sheet coated with the adhesive one by one. A method of manufacturing a mount with shrink film (mount with mount capable of heat shrinking) by a process is disclosed. Patent Document 2 proposes a method of manufacturing a mount with shrink film (mount with mount capable of heat shrinking) that can arbitrarily change the shape of the mount.

  As an adhesive for bonding the shrink film and the mount, for example, in Patent Document 3, it is possible to use a pressure-sensitive adhesive, a hot-melt adhesive, or a reactive hot-melt adhesive. It describes the use of a water-based emulsion type adhesive generally used and called a glue, a hot melt adhesive, and a reactive hot melt. Moreover, in patent document 5, the reactive hot-melt-adhesive melt | dissolved was discharged and apply | coated to the base_sheet | mounting_paper, the shrink film formed in the cylinder shape was affixed on the apply | coated application part, and it was made to adhere. A method of manufacturing a package with a mount is disclosed.

JP-A-8-244832 JP-A-11-208715 JP 2012-188127 A JP 2012-166659 A JP 2012-121590 A

According to the shrink film packaging, as described above, since the cost reduction, volume reduction, CO ₂ reduction derived from the packaging material, and the like can be realized as compared with the blister packaging, its use is increasing in recent years. However, in blister packaging, the edge of the plastic molded in accordance with the shape of the article is joined to the mount with an adhesive, so the shape of the article does not matter at the time of joining, whereas in shrink film packaging, the article And the backing sheet are fixed through the adhesive layer and the heat-shrinked film (heat-shrinked shrink film), so that the shape of the article is limited. In other words, blister packaging is superior to shrink film packaging in that there are many objects of articles to be packaged, and in shrink film packaging, a technique that can expand the scope of applicable articles is required. It was.

  The present invention has been made in view of the above-described background, and its object is to provide a package with a mount capable of expanding the object of an article to be packaged in a shrink film packaging and a method for manufacturing the same. It is to be.

  As a result of extensive studies by the present inventors, it has been found that the problems of the present invention can be solved in the following modes, and the present invention has been completed. That is, the package with a mount according to the present invention is a package with a mount comprising a mount, an article packaged with a heat-shrinkable film, and an adhesive layer that joins the heat-shrinkable film and the mount. The adhesive layer is composed of a foamed hot melt adhesive layer containing bubbles in a hot melt adhesive that can reversibly repeat melting and solidification by heat.

  According to the package with a mount according to the present invention, the foamed hot melt adhesive layer is used as the adhesive layer, so that the elasticity of the adhesive layer is increased, and the article to be joined (heat-shrinkable film or mount) or article is obtained. And the followability with the adhesive layer can be improved. Further, by increasing the followability, the contact area with the bonded portion can be increased, and the adhesive force can be improved. Therefore, it is possible to provide a package with a mount that can expand the object of the article to be packaged.

In a preferred embodiment of the packaging body with a mount of the present invention, the hot melt adhesive has a melt viscosity of 1,000 mPa · s or more and 50,000 mPa · s or less in a state not containing bubbles. Here, the “state not including bubbles” means that before the foaming process is performed, and bubbles and the like contained in a very small amount before the foaming process are in a “state not including bubbles”.
In a preferred embodiment of the method for producing a package with a mount of the present invention, the step of forming the hot melt adhesive layer and the step of bonding the mount and the heat-shrinkable film include melting the hot melt adhesive. There is something that is continuously performed while maintaining the state.
Moreover, in a preferable embodiment of the package with a mount of the present invention, there is one in which the foaming hot melt adhesive layer has a foaming ratio of 1.1 or more and 10 or less calculated from the following formula (1).
<Number _{1> V} 1 _/ V 2 ··· formula (1)
In the formula, V ₁ is the volume of the foamed hot melt adhesive layer recovered from the package with mount, and V ₂ is obtained by heating and melting the foam hot melt adhesive layer recovered from the package with mount. The volume after defoaming.

  The manufacturing method of the packaging body with mount of the 1st aspect which concerns on this invention is the board | substrate, the article packaged with the heat-shrinked film, the foaming hot-melt-adhesive layer which joins the said heat-shrinkable film and the said mount, A process for producing a package with a mount comprising the steps of: covering the article with a heat-shrinkable film, heat-shrinking the film, and reversibly repeating melting and solidification by heat Preparing an adhesive and forming a foamed hot melt adhesive containing bubbles, forming a foamed hot melt adhesive layer on at least one of the mount and the heat-shrinkable film, and the foaming hot melt A bonding step of bonding the mount and the heat-shrinked film with an adhesive layer interposed therebetween.

  According to the second aspect of the present invention, there is provided a method for manufacturing a package with a mount, comprising: a mount; an article packaged with a heat-shrinkable film; and a foamed hot melt adhesive layer that joins the heat-shrinkable film and the mount. A process for producing a packaging body with a mount, comprising a hot melt adhesive capable of reversibly repeating melting and solidification by heat, and forming a foamed hot melt adhesive containing bubbles, Forming a foamed hot-melt adhesive layer using the foamed hot-melt adhesive layer on at least one of the mount and the heat-shrinkable film before shrinking the heat-shrinked film; and the foamed hot-melt adhesive A step of joining the mount and the heat-shrinkable film with a layer interposed therebetween to obtain a heat-shrinkable film mount, and the article, the heat-shrinkable film In coated, and a step of the film to heat shrink, it can be listed.

Moreover, in one preferable aspect of the manufacturing method of the package with a mount according to the first aspect or the second aspect of the present invention, the melt viscosity in a state of not containing air bubbles of the hot melt adhesive is 1,000 mPa · s or more. , 50,000 mPa · s or less.
Moreover, in one preferable aspect of the manufacturing method of the package with a mount according to the first aspect or the second aspect of the present invention, the expansion ratio obtained from the formula (2) of the foamed hot melt adhesive is 1.1 or more. There are 10 or less.
<Equation 2> V ₃ / V ₄ Formula (2)
In the formula, V ₃ is a mass per 100 cc of the hot melt adhesive before foaming, and V ₄ is a mass per 100 cc of the foamed hot melt adhesive.

  Moreover, in one preferable aspect of the manufacturing method of the package with a mount according to the first aspect or the second aspect of the present invention, the joining step is continuously performed while maintaining the molten state of the foamed hot melt adhesive. There are aspects.

  According to the present invention, in shrink film packaging, there is an excellent effect that it is possible to provide a package with a mount that can expand the object of an article to be packaged and a method for manufacturing the same.

Schematic explanatory drawing of the packaging body with mount which concerns on 1st Embodiment. IB-IB cutting part sectional drawing of FIG. 1A. Typical explanatory drawing which shows 1st Embodiment in the manufacturing method of a package with a mount. Typical explanatory drawing which shows 1st Embodiment in the manufacturing method of a package with a mount. Typical explanatory drawing which shows 1st Embodiment in the manufacturing method of a package with a mount. The flowchart figure of 1st or 2nd embodiment in the manufacturing method of the package with a mount. Schematic explanatory drawing of the packaging body with mount which concerns on 2nd Embodiment. 4B is a cross-sectional view taken along the line IVB-IVB in FIG. 4A. Schematic explanatory drawing which shows 3rd Embodiment in the manufacturing method of a package with a mount. Schematic explanatory drawing which shows 3rd Embodiment in the manufacturing method of a package with a mount. Schematic explanatory drawing which shows 3rd Embodiment in the manufacturing method of a package with a mount. The flowchart figure of 3rd or 4th embodiment in the manufacturing method of the package body with mount.

  The packaging body with a mount according to the present invention is obtained by bonding a heat-shrinkable film formed by packaging an article and the mount with an adhesive layer interposed therebetween. This adhesive layer is a foamed hot-melt adhesive layer made of a hot-melt adhesive that can reversibly repeat melting and solidification by heat and contains bubbles. Hereinafter, specific embodiments of the package with mount and the method for manufacturing the same according to the present invention will be described. Needless to say, other embodiments are also included in the scope of the present invention as long as they meet the spirit of the present invention. Further, matters other than matters specifically mentioned in the present specification and necessary for the implementation of the present invention can be grasped as design matters for those skilled in the art based on the prior art in this field. Further, the following embodiments are preferably combined with each other.

[First Embodiment]
FIG. 1A is a schematic explanatory view of a package with a mount according to the first embodiment, and FIG. 1B is a sectional view taken along the line IB-IB in FIG. 1A. The packaging body 1 with the mount is a packaging article in which the film packaging article 21 is attached to the mount 12 with the adhesive layer 13 interposed therebetween, and the heat-shrinkable film 11 is bonded to the mount 12 with the adhesive layer 13 interposed therebetween. It is a thing. The packaging body 1 with a mount may have other members without departing from the gist of the present invention. For example, a cushion material for protecting the product from impact, a heat insulating member for protecting the article from heat at the time of forming the adhesive layer 13, a heat radiating member, and the like can be exemplified. The adhesive layer 13 is for bonding the heat-shrinkable film 11 and the mount 12, but the heat-shrinkable film 11 and the mount 12 are not limited to those directly bonded to the adhesive layer 13, A mode in which the adhesive layer 13 is joined via a member such as another sheet formed integrally with the heat-shrinkable film 11 and / or the mount 12 is also included.

  The heat-shrinked film 11 plays a role of covering at least a part of the article 20 and packaging the article 20, and is a film obtained by heat-shrinking a so-called shrink film. As in the example of FIG. 1A, the entire side surface portion of the article 20 may be packaged by the heat-shrinkable film 11, only the central portion of the article may be packaged in a belt shape, or the entire article may be packaged. The heat-shrinkable film 11 is preferably colorless and transparent or colored and transparent, but may be non-transparent so that the state of the packaged article can be confirmed. The heat-shrinkable film 11 may be printed with visible character information or the like, or may be printed with various images.

  The heat-shrinkable film 11 is not limited as long as it is obtained by heat-shrinking a heat-shrinkable film such as a stretched film, and any commonly used film can be used without limitation. For example, polystyrene, polyethylene, polypropylene, and polyvinyl chloride can be exemplified. In addition, a polylactic acid-based thermoplastic resin (polyester resin or the like) is also suitable as an environmentally friendly biodegradable film. The heat-shrinkable film 11 may be provided with a perforation 15 as shown in FIG. 1A or an opening 16 formed with two or more rows of perforations according to needs.

  The mount 12 mainly plays a role as a base material for wrapping the article 20 and a role as an information providing unit such as an article name and article information. The mount 12 may be provided with a hanging hole 14 or the like as a display means for the article 20. The material of the mount 12 is not particularly limited as long as the material does not deform when the article 20 is pasted. Preferable examples include polyester films, nylon films, vinylidene chloride, polyolefin films such as polyethylene and polypropylene, or plastic sheets made of laminates thereof, paper, metal sheets, composite sheets made of composite materials, and laminates thereof. The body can be exemplified. For example, a laminate of a plastic film and an aluminum foil may be used. What is necessary is just to select suitably the thickness, raw material, etc. of the base_sheet | mounting_paper 12 according to the mass, size, etc. of the articles | goods 20. FIG. In addition to the flat plate shape, the mount 12 may have a curved surface shape, a bent shape, or the like. Also, an L-shaped or U-shaped mount may be used. Furthermore, in order to make it easy to take out the article 20 from the package 1 with the mount, a perforation or an opening may be provided in a contact portion with the article 20 on the back side of the mount 12 or in the vicinity thereof.

  The adhesive layer 13 plays a role of bonding the heat-shrinkable film 11 and the mount 12, and bubbles are contained in a hot-melt adhesive exhibiting high-melting thermoplasticity that can reversibly repeat melting and solidification by heat. A foamed hot melt adhesive layer. The adhesive layer 13 used in the present invention is solid at room temperature, can be melted by heating, and can be applied to the bonded portion, and is solidified by returning the bonded portion to the normal temperature after application to be bonded to the bonded portion. It demonstrates its power. That is, the adhesive used in the present invention is subjected to a post-treatment process for bonding (such as an aging process or a UV curing process to advance curing by moisture or heat) after the heat-shrinkable film 11 and the base 12 are bonded. This is different from the necessary reactive hot melt adhesive and so-called sealant of high viscosity type. The adhesive layer 13 may be a pressure sensitive adhesive layer.

  The hot melt adhesive of the present invention contains at least a thermoplastic resin and a tackifying resin. The hot melt adhesive preferably contains a wax. In addition, hot melt adhesives include fillers, softeners, plasticizers, colorants, antiblocking agents, antioxidants, UV absorbers, silane coupling agents, thixotropic agents, foaming agents, etc. Can be contained. The hot melt adhesive preferably contains no solvent. The material of the hot melt adhesive is not particularly limited as long as it does not depart from the gist of the present invention, but preferred examples include the following.

  Examples of the thermoplastic resin include hot-melt adhesives such as styrene polymers, ethylene vinyl acetate (EVA), ethylene-unsaturated ester copolymers, polyamides, polyesters, and polyolefins. These may be block copolymers. Styrene polymers include styrene-ethylene-butylene-styrene block polymer (SEBS), styrene-ethylene-propylene-styrene block polymer (SEPS), styrene-isoprene-styrene block polymer (SIS), styrene-butylene-butadiene-styrene. A block polymer (SBBS) etc. can be illustrated. A thermoplastic resin can be used individually or in combination of 2 or more types.

  The MFR (JIS K7210 200 ° C./5 kg) of the thermoplastic resin used is preferably 0.01 to 100 g. By making MRF 100 g or less, it becomes easy to balance heat resistance and adhesiveness when a hot melt adhesive is prepared by adding other components. On the other hand, it becomes easy to maintain the adhesiveness in a low-temperature atmosphere by making MFR 0.01g or more. In addition, in this invention, MFR is the mass of the thermoplastic resin calculated | required by conditions (temperature 200 degreeC, weight 5kg) by the method prescribed | regulated to JISK7210. A more preferable range of MFR of the thermoplastic resin is 0.1 to 80, and a more preferable range is 1 to 70.

Examples of the tackifying resin include a phenol resin, a modified phenol resin, a terpene phenol resin, a xylene phenol resin, a cyclopentadiene-phenol resin, and a xylene resin. Also suitable are aliphatic, alicyclic and aromatic petroleum resins, hydrogenated aliphatic, alicyclic and aromatic petroleum resins, and phenol-modified petroleum resins. is there. Also suitable are rosin resins such as rosin ester resins and hydrogenated rosin ester resins. Further examples include low molecular weight polystyrene resins, terpene resins, hydrogenated terpene resins, and the like. Tackifying resins can be used alone or in combination of two or more.
The softening point of the tackifying resin used is preferably 80 to 160 ° C. By setting the softening point to 80 ° C. or higher, it is possible to make the bubbles in the hot melt after foaming difficult to be crushed even at high temperatures and to improve the adhesive strength. On the other hand, by setting the softening point to 160 ° C. or lower, it is possible to improve the tackiness in a low-temperature atmosphere and to maintain good adhesion. In the present invention, the softening point is a temperature determined by a method defined in JIS K 6863. A more preferable range of the softening point of the tackifier is 90 to 140 ° C from the viewpoint of balancing adhesiveness, heat resistance, and cold resistance, and a more preferable range is 100 to 130 ° C.

The waxes include carnauba wax, canderia wax, montan wax, paraffin wax, microwax, Fischer-Tropsch wax, polyethylene wax, polypropylene wax, oxides of these waxes, ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer. A polymer etc. are mentioned. Waxes can be used alone or in combination of two or more. The melt viscosity at 150 ° C. of the wax is preferably 10 to 2,000 mPa · s, more preferably 15 to 1,000 mPa · s, and still more preferably 15 to 500 mPa · s. By using the wax, the viscosity of the hot melt adhesive can be lowered and coating can be facilitated.
The softening point of the wax used is preferably 70 to 120 ° C. When the softening point is 70 ° C. or higher, there is no possibility that the wax melts at a high temperature and the adhesive strength is reduced. On the other hand, when the softening point is 120 ° C. or lower, the temperature at which the hot melt is melted by heating is lowered, so that the coating property of the hot melt can be ensured. In the present invention, the softening point is a temperature determined by a method defined in JIS K 6863. A more preferable range of the softening point of the thermoplastic resin is 80 to 140 ° C, and a more preferable range is 90 to 130 ° C.

Examples of the colorant include titanium oxide.
Examples of the antiblocking agent include silicone, unsaturated fatty acid amides such as erucic acid amide and oleic acid amide, and saturated fatty acid amides such as stearic acid amide and behenic acid amide.
Antioxidants include high molecular weight hindered polyhydric phenols, triazine derivatives, high molecular weight hindered phenols, dialkyl phenol sulfides, 2,2-methylene-bis- (4-methyl-6-tert-butylphenol), 4 , 4-methylene-bis- (2,6-di-tert-butylphenol), 2,6-di-tert-butylphenol-p-cresol, 2,5-di-tert-butylhydroquinone, 2,2 , 4-trimethyl-1,2-dihydroquinone, 2,2,4-trimethyl-1,2-dihydroquinone, nickel dibutyl dithiocarbamate, 1-oxy-3-methyl-4-isopropylbenzene, 4,4- Examples include butylidenebis- (3-methyl-6-tert-butylphenol) and 2-mercaptobenzimidazole.

  In the hot melt adhesive of the present invention, the thermoplastic resin is preferably in the range of 30 to 80 parts by mass from the viewpoint of improving heat resistance in 100 parts by mass of the hot melt adhesive, and adhesive from the viewpoint of improving the adhesive force. The imparting resin is preferably contained in the range of 40 to 80 parts by mass. Moreover, it is preferable to use a wax from a viewpoint of adjusting a viscosity appropriately.

  Although the softening point of the hot melt adhesive of the present invention may vary depending on the use environment temperature, it is preferably 80 to 160 ° C. in consideration of outdoor use. When the softening point is 80 ° C. or higher, it becomes easy to balance the adhesive force and the cohesive force. On the other hand, by setting the softening point to 160 ° C. or lower, it becomes easy to maintain tack even in a low temperature atmosphere. In the present invention, the softening point is a temperature determined by a method defined in JIS K 6863. A more preferable range of the softening point of the hot melt adhesive of the present invention is 90 to 140 ° C, and a more preferable range is 100 to 130 ° C.

It is preferable that the expansion ratio calculated | required from the following formula | equation (1) of the adhesive bond layer 13 is the range of 1.1-10 from a viewpoint of maintaining adhesive force and followability effectively. By setting it as the said range, the adhesiveness and followability at the time of high temperature use can be pulled out more effectively. More preferably, it is 1.5-5, More preferably, it is 1.5-3.
<Number _{3> V} 1 _/ V 2 ··· formula (1)
In the formula, V ₁ is the volume of the foamed hot-melt adhesive layer recovered from the packaging body with the mount, and V ₂ is after the foamed hot-melt adhesive layer recovered from the packaging body with the heating is melted and defoamed Of the volume.
For example, it is possible to collect the foamed hot melt adhesive layer per 1 cm ² and determine the volume, and then determine the volume of the adhesive after heating and melting to completely defoam the foam. The volume of the adhesive after recovery and after defoaming can be determined using a measuring instrument such as a specific gravity bottle that measures the porosity of the powder. In other words, an arbitrary amount of hot melt adhesive is isolated, hot melt adhesive is put into a measuring instrument whose container volume is known, the mass is weighed, and the difference from the mass with water so that there is no void, The hot melt volume can be determined based on the water specific gravity.

  The article 20 is not particularly limited as long as it is suitable for packaging with the heat-shrinkable film 11. For example, cosmetics, medicines, foods, batteries, toys, clothing, stationery items, miscellaneous goods and the like can be exemplified. The number of articles 20 to be packaged may be singular or plural. Moreover, the purpose of packaging can be used for various purposes such as transportation packaging as well as a mode of displaying products as a storefront.

  Next, an example of a method for manufacturing a package with mount according to the first embodiment will be described with reference to FIGS. 2A to 2C and FIG. 3. In the method for manufacturing a package with a mount according to the first embodiment, the article 20 is covered with a heat-shrinkable film 10, and the heat-shrinkable film 10 is heated and packaged with a heat-shrinkable film 11. Is manufactured, and is bonded to the mount 12 via the adhesive layer 13. Details will be described below.

  First, the article 20 is packaged with a heat-shrinkable film 10 to obtain a film-wrapped article 21 packaged with a heat-shrinkable film 11 (step 1). In the example of FIGS. 2A to 2C, an article 20 is inserted into a cylindrical heat-shrinkable film 10 (see FIG. 2A), and then the heat-shrinkable film is heated to obtain a heat-shrinkable film. The film 11 that has been shrunk and thermally shrunk to the article 20 is fitted (adhered) (see FIG. 2B). A conventionally used method can be arbitrarily applied as the method for heating and shrinking the heat-shrinkable film 10. By these steps, the film packaging article 21 covered with the heat-shrinked film 11 is obtained. The film 10 that can be heat-shrinkable may be individually cut in advance, or the heat-shrinkable film 10 wound up in a roll shape may be cut immediately before heat shrinkage.

  The heat-shrinkable film 10 is prepared with a desired size and shape by printing, forming perforations 15, slits, signatures, opening 16 and the like as necessary. Moreover, the film 10 which can be thermally contracted is selected so that the contraction rate differs depending on the direction, if necessary. Note that the example of FIG. 2A and the like is an example, and various modifications are possible. For example, the sheet-like heat-shrinkable film 10 may be wound around the article 20 and the overlapping portions may be joined with an adhesive. Alternatively, the sheet-like heat-shrinkable film 10 may be used as it is without using an adhesive, or the string-like heat-shrinkable film 10 may be wound around the article 20. As a method of using the sheet-like heat-shrinkable film 10 as it is, for example, the side periphery (body part) of the article 20 is wound one or more times with the film 10 that can be heat-shrinked, heated quickly, and the film 10 that can be heat-shrinked. Can be exemplified by a method in which the film 11 subjected to heat shrinkage is fitted (adhered) to the article 20. The same method can be illustrated also in the case of the film | membrane 10 which can carry out the heat shrink of the string shape.

  The film wrapping article 21 may be manufactured in the process of manufacturing the package 1 with the mount, or may be packaged at the same time as the product is completed in a factory or the like that manufactures the article 20. It may be packaged at the same time as the product is completed so that the article is properly protected during transportation and storage.

  Next, the adhesive layer 13 is formed on the mount 12 or / and the heat-shrinked film 11 (step 2). In the first embodiment, an example in which the adhesive layer 13 is formed on the mount 12 will be described. The mount 12 forms printing, decoration, hanging holes 14 and the like as necessary. On the mount 12 side, a perforation for facilitating taking out the article 20, a cut for opening, or the like may be provided. The mount 12 may be cut in advance for each product, or may be cut before and after applying the adhesive. Further, it is possible to separate the mount 12 at the final stage after the film packaging article 21 is attached. From the viewpoint of increasing the efficiency of the manufacturing process, a method of winding the mount 12 in a roll shape and cutting in the process of manufacturing the package 1 with the mount can be exemplified.

  As described above, the adhesive layer 13 includes a foamed hot melt adhesive layer containing bubbles in a hot melt adhesive that can reversibly repeat melting and solidification by heat. The timing of foaming the hot melt adhesive is not particularly limited, but from the viewpoint of improving productivity and managing the quality with high accuracy, the hot melt adhesive is hot immediately before forming the adhesive layer 13, during coating, or immediately after coating. It is preferred to foam the melt adhesive. Among these, foaming is more preferable immediately before coating or at the time of coating. The adhesive layer 13 is obtained by applying a molten hot melt adhesive to a predetermined position of the mount 12.

  The method and apparatus for incorporating air bubbles into the hot melt adhesive are not particularly limited, but a method of foaming the hot melt adhesive by blowing gas is suitable. Further, a heat decomposable foaming agent may be added to the hot melt adhesive so that fine bubbles are generated when the adhesive layer 13 is formed.

For example, a device for blowing a gas into a hot melt adhesive and foaming it includes, for example, a heated stirring container that melts and heats the hot melt adhesive under normal pressure or pressure, and a volatile substance that introduces a volatile substance such as a gas into the heated stirring container. The agitation conditions (number of revolutions, etc.) according to the viscosity of the hot melt adhesive, etc., the substance supply means, the sensor for monitoring the temperature and viscosity in the heated stirring container, the stirring means provided in the heated stirring container An apparatus having a controllable control unit can be exemplified. Although a volatile substance is not specifically limited, Inert gas, such as nitrogen and argon, can be illustrated and nitrogen can be used conveniently.
Moreover, you may use the gas which interacts between the component of an adhesive agent and a molecule | numerator, and can hold | maintain inside an adhesive bond layer. Depending on the type of the adhesive layer, carbon dioxide can be exemplified as such an example. The gas may be introduced at normal pressure, but it is efficient to carry out under pressure. It is also possible to use supercritical carbon dioxide or the like.

  From the viewpoint of efficiently introducing bubbles, the melt viscosity of the hot melt adhesive when the gas is blown is preferably in the range of 1,000 to 50,000 mPa · s, more preferably 5,000. It is the range of -20,000 mPa * s, Especially preferably, it is the range of 5,000-15,000 mPa * s. The foaming temperature depends on the type of hot melt adhesive used, but is usually 120 to 180 ° C, and preferably 120 to 150 ° C. After forming the foamed hot melt adhesive, it is usually returned to room temperature. Thereby, an adhesive agent solidifies and a foaming part is also fixed.

The appropriate foaming ratio of the hot melt adhesive can vary depending on the application and needs, and can be arbitrarily set. From the viewpoint of enhancing the versatility with respect to the shape of the article, it is preferable that the mass ratio when filled in a 100 cc container in the molten state is in the range of 1.1 to 10 in the following formula (2). More preferably, it is 1.5-5, Especially preferably, it is the range of 1.5-3.
<Equation 4> V ₃ / V ₄ Formula (2)
In the formula, V ₃ is the mass of 100 cc of the unfoamed hot melt adhesive, and V ₄ is the mass of 100 cc of the foamed hot melt adhesive.

  Subsequently, the film wrapping article 21 wrapped with the heat-shrinked film 11 and the mount 12 are bonded together with an adhesive layer (foamed hot melt adhesive layer) 13 interposed therebetween (step 3, see FIG. 2C). For joining, it is necessary that the melted adhesive layer 13 is in contact with the part to be joined, and then the adhesive layer 13 is solidified. Therefore, from the viewpoint of productivity, the step of forming the adhesive layer 13 in Step 2 and the step of joining the film packaging article 21 and the mount 12 in Step 3 are continued while maintaining the molten state of the adhesive layer 13. It is preferable to carry out. As a preferable example, for example, a molten adhesive is foamed and applied to a predetermined position of the mount 12 to form a molten / foamed adhesive layer 13, which is packaged with a film that is rapidly heat-shrinked while maintaining this state. An example is a method in which the adhesive layer 13 is solidified and bonded together while the foamed state is maintained by natural cooling after contacting the finished article 21.

  The method for joining the film packaging article 21 and the mount 12 is not limited to the above method, and various modifications are possible. For example, after applying a hot melt adhesive in a melted / foamed state to a predetermined position of the mount 12, the adhesive layer 13 is cooled at one end, and when the film packaging article 21 and the mount 12 are attached, the adhesive is again bonded. It is possible to heat the adhesive layer 13 to such an extent that the foamed state can be maintained, and to bond the film packaging article 21 to the melted / foamed adhesive layer 13. According to this method, it becomes possible to perform each manufacturing process of the mount 12 with the adhesive layer 13, the film packaging article 21, and the package 1 with the mount at different timings and places. Heating for melting the adhesive layer 13 for bonding the film packaging article 21 and the mount 12 may be performed from the surface of the adhesive layer 13 or from the back side or the side of the mount 12. For example, the adhesive layer 13 can be melted by hot air from the back side of the mount 12 to such an extent that the foamed state can be maintained, and the film packaging article 21 and the mount 12 can be joined. Moreover, you may heat using a lamp | ramp etc. Further, when the mount 12 is plastic, it can be performed with steam.

  The adhesive layer 13 in the package 1 with mount can confirm foaming visually. However, the expansion ratio is usually smaller than the value of the above-described formula (2). This is because bubbles in the adhesive layer 13 are reduced during the step of attaching the article 21 covered with the heat-shrinked film 11 and the mount 12. In addition, the bubbles may be bonded due to the mass of the article 20 or the bonding force may be stronger due to the adhesive properties of the adhesive layer 13 itself, and the bubbles may collapse and the apparent expansion ratio may decrease. is there. Therefore, the expansion ratio is somewhat smaller than the initial value in the manufacturing process and over time. As described above, the expansion ratio of the adhesive layer 13 in the packaging body 1 with the mount is in the predetermined range described above, as described above, from the viewpoint of effectively maintaining the adhesive force and the followability. It is preferable.

  According to the method of inserting the article after the heat shrinkable film 10 is attached to the mount 12 and converting it to the heat-shrinkable film 11 by heating, an article having a particularly unbalanced shape, a movable article, When it is desired to wrap a plurality of articles, the article 20 may be misaligned. On the other hand, according to the method for manufacturing a package with a mount according to the first embodiment, since the film wrapping article 21 is formed first and this is attached to the mount 12, Misalignment can be prevented. In particular, the present invention can be suitably applied to a case where the article 20 has an unbalanced shape, a movable article, or a case where a plurality of articles are desired to be packaged.

  By the way, in order to improve the heat resistance of the adhesive layer, an adhesive that is not easily softened at a high temperature is generally used. However, when an adhesive that is difficult to soften at high temperature is used, the adhesive layer has a drawback that it is hard at low temperatures and easily cracked. In addition, when an adhesive that is difficult to soften at high temperature is used, the followability of the adhesive layer to a minute uneven surface is deteriorated, and curved surface followability is also deteriorated. In addition, in recent years, reactive hot melt adhesives that have been actively developed are bonded to a film that can be thermally shrunk through an adhesive and a backing sheet, and then the time for moisture curing and UV A curing process is required. By these curing treatments, it is possible to imagine the advantage of increasing the heat resistance by increasing the curability of the adhesive layer. However, the elastic force of the adhesive layer is reduced and the followability is reduced by the improvement in heat resistance due to curing. The decrease in followability becomes a problem particularly at low temperatures. As a means for increasing the adhesive force, there is a method of lowering the viscosity by increasing the temperature of the adhesive and improving the wettability to the heat-shrinked film or mount. However, if the adhesive is simply heated to a high temperature, thermal damage to the article cannot be ignored.

  According to the packaging body 1 with the mount according to the first embodiment, the adhesive layer 13 is foamed, whereby the elasticity and the adhesive force are superior to those of the unfoamed adhesive layer. Since the adhesive layer 13 becomes rich in elasticity, even if it is a hard adhesive having excellent heat resistance, it is possible to increase elasticity by foaming and make it difficult to crack at low temperatures. Moreover, due to the improved elasticity, the followability of the adhesive layer 13 is enhanced when the backing sheet 12 and the film wrapping article 21 are bonded together, and the adhesive is applied to the fine irregularities on the surface of the backing sheet 12, the heat-shrinkable film 11 or the article. The layer 13 follows well. It is considered that the adhesive force is increased because the adhesive area between the adhesive layer 13 and the bonded portion increases.

  In shrink film packaging, as described above, it has been required to expand the scope of packaging articles. There are various shapes of articles to be packaged, and some of the side surfaces of the articles have a curved shape due to constriction or the like. Such a curved portion is likely to float when the film packaging article 21 and the mount 12 are joined. According to the packaging body 1 with the mount according to the first embodiment, even in the case of such an article, the bonding area is increased by pressing the constricted portion against the mount 12 by using an adhesive layer rich in elasticity. It is possible to increase the adhesive strength sufficiently. Therefore, it is possible to expand the application target of the article 20 that is a packaged object.

  Further, by using the foamed adhesive layer 13, thermal damage to the article 20 can be reduced as compared with the case of using an unfoamed hot melt adhesive. This is because heat conductivity is reduced by bubbles existing in the foamed adhesive layer 13, so that heat propagation to the article 20 can be suppressed, and heating and melting can be performed by including bubbles in the adhesive layer 13. It is considered that the subsequent cooling efficiency was increased and the thermal load during the joining was reduced. That is, it is possible to improve wettability to the heat-shrinked film 11 and the mount 12 by using the adhesive layer 13 having a high temperature and low viscosity while suppressing thermal damage. Furthermore, improvement in wettability can expand the types of articles to be packaged.

  Moreover, according to the packaging body with a mount according to the first embodiment, since the foamed hot melt adhesive layer is used, the specific gravity can be lowered and the amount of adhesive used can be reduced. As a result, although the amount per product is small, the weight is reduced, and when a large amount of products are transported, the total cost including transportation costs can be reduced. Furthermore, according to the packaging body with a mount according to the present invention, since a hot melt adhesive that can reversibly repeat melting and solidification by heat is used, the heat-shrinkable film and the mount are joined in a molten state. There is also an advantage that the process is completed only by the step of bonding through the adhesive layer.

[Second Embodiment]
Next, an example of the manufacturing method of the packaging body with a mount different from the said embodiment is demonstrated. The manufacturing method of the packaging body with mount according to the second embodiment is the same as the first embodiment except for the following points. That is, in the second embodiment, the adhesive layer 13 is formed on the film wrapping article 21, and the adhesive layer 13 is formed on the mount 12 at a point where the adhesive layer 13 is bonded to the mount 12. This is different from the manufacturing method of the first embodiment to be bonded.

  According to the method for manufacturing a package with a mount according to the second embodiment, after obtaining the film packaging article 21 packaged with the heat-shrinkable film 11 as shown in FIG. A melted / foamed adhesive layer 13 is provided, and this is bonded to the mount 12.

  According to the method of the second embodiment, the same effect as in the first embodiment can be obtained. In addition, since the adhesive layer 13 is formed on the film packaging article 21, it is possible to more reliably prevent the position of the adhesive layer 13 and the joining position from being shifted when the film packaging article 21 and the mount 12 are joined. In consideration of the thermal effect on the heat-shrinkable film 11 and the article 20, the first embodiment in which the melted / foamed adhesive layer 13 is formed on the mount 12 side as shown in FIG. 2C is preferable. However, for example, as shown in FIG. 4, it is particularly useful in the case where the article tends to cause poor bonding due to a slight misalignment, such as when the article is narrow, such as a toothbrush. Further, the second embodiment is also useful when it is desired to bond a plurality of film packaging articles 21 to one mount or when packaging an article having a complicated shape having an opening or the like.

[Third Embodiment]
The manufacturing method of the packaging body with mount according to the third embodiment is the same as the first embodiment except for the following points and the basic configuration and manufacturing method. That is, in the manufacturing method of the third embodiment, a board with heat-shrinkable film is manufactured, and then an article is inserted into the heat-shrinkable film 10 and then the heat-shrinkable film 10 is heat-shrinked. This is a method for producing a package with a mount. That is, the third embodiment is different from the first embodiment in that the mount 12 and the film 10 that can be thermally contracted are bonded together prior to the step of covering the article. The third embodiment will be described with reference to FIGS. 5A to 5C and FIG.

  In the third embodiment, first, an adhesive layer 13 is formed on the mount 12 as shown in FIG. 5A (step 1a). As described above, the adhesive layer 13 is a foamed hot melt adhesive layer in which bubbles are included in a hot melt adhesive that can reversibly repeat melting and solidification by heat. Examples of the method for foaming the hot melt adhesive include the same method as in the first embodiment.

  Thereafter, the film 10 that can be thermally shrunk by pressing the film 10 that can be thermally shrunk through the adhesive layer 13 in a melted / foamed state to a predetermined position of the mount 12 and pressed at a predetermined pressure, Are attached to obtain a film-mounted mount 2 that can be thermally contracted (see step 2a, FIG. 5B). For example, the heat-shrinkable film 10 and the mount 12 can be rolled at a desired pressure by two pressing rollers. From the viewpoint of improving the efficiency of the manufacturing process, the film 10 that can be immediately heat-shrinked in the steps 1a and 2a can be performed immediately after the adhesive layer 13 is applied while the foamed hot-melt adhesive is maintained in a molten state. And the mount 12 are preferably bonded together. 5A and 5B show a cylindrical film 10 that can be heat-shrinkable. However, as in the case of the first embodiment, for example, a sheet-like film 10 that can be heat-shrinkable is rounded into a cylindrical shape and overlapped. What joined the part with the adhesive agent can also be used.

  It is preferable that the heat-shrinkable film 10 and the mount 12 are bonded together via a melted / foamed adhesive layer 13 and then cooled so that the adhesive layer 13 is solidified. The cooling may be natural cooling or forced cooling. By this step, the film 10 and the mount 12 that can be thermally contracted are bonded together, and the film-mounted mount 2 that can be thermally contracted is obtained (see FIG. 5B).

  Next, an article 20 as a package is inserted into the cylindrical film 10 that can be thermally contracted (see FIG. 5C), and the film 10 that can be thermally contracted is thermally contracted. A package with a mount formed by fixing the article 21 packaged with the contracted film 11 on the mount 12 is obtained (step 3a). In addition, when the mount 12 to which the adhesive layer 13 is applied is prepared in advance and the film 10 and the mount 12 that can be thermally contracted are bonded, the adhesive layer 13 is heated and melted again to be thermally contracted with the mount 12. The resulting film 10 may be joined.

  The adhesive layer 13 in the film-backed mount 2 that can be thermally contracted according to the third embodiment can be visually confirmed as foamed. However, the expansion ratio is usually smaller than the value of the above-described formula (2). This is because the adhesive layer is used in the step of attaching the film 10 that can be heat-shrinkable to the mount 12 or the film step that heat-shrinks the film 10 that can be heat-shrinked after inserting the article 20 into the film 10 that can be heat-shrinkable. This is because bubbles in 13 are reduced. Further, since the bonding force becomes stronger due to the adhesive property of the adhesive layer 13 itself, the bubbles may collapse and the apparent expansion ratio may be reduced. In addition, after the article is inserted, the bubbles may join due to the mass of the article. Therefore, the expansion ratio is somewhat smaller than the initial value in the manufacturing process and over time. The expansion ratio of the adhesive layer in the film-mountable mount and the expansion ratio of the adhesive layer of the package with the mount after the article is inserted are as described above from the viewpoint of effectively maintaining the adhesive force and the followability. It is preferable that the value calculated from Equation (1) is within the predetermined range described above.

  According to the packaging body with mount and the manufacturing method thereof according to the third embodiment, since the foamed hot-melt adhesive layer is used, the same effect as in the first embodiment can be obtained.

[Fourth Embodiment]
Next, an example of the manufacturing method of the packaging body with a mount different from 3rd Embodiment is demonstrated. The manufacturing method of the package with mount according to the fourth embodiment is the same as the third embodiment except for the following points. That is, in the fourth embodiment, when manufacturing a board with heat-shrinkable film, the adhesive layer 13 is formed on the heat-shrinkable film 10 and is bonded to the board 12. This is different from the manufacturing method of the third embodiment in which the adhesive layer 13 is formed on the film 10 and bonded to the film 10 that can be thermally contracted.

In the fourth embodiment, first, the adhesive layer 13 is formed on the heat-shrinkable film 10 (step 1a). Next, by attaching this to the mount 12, a mount with film that can be thermally shrunk as shown in FIG. 5B is obtained. Thereafter, as shown in FIG. 5C, the article 20 to be packaged is placed in a film 10 that can be heat-shrinked, and is heat-treated to heat-shrink the film 10 that can be heat-shrinked, thereby closely contacting the article 20. 1 can be obtained.
According to the method of the fourth embodiment, the same effect as in the third embodiment can be obtained.

<Example>
EXAMPLES Hereinafter, the present invention will be described specifically and in detail with reference to examples. However, these examples are only one aspect of the present invention, and the present invention is not limited to these examples. In the examples, “part” means “part by mass”, and “%” means “% by mass”.

[Production Example (Production Example of Foamed Hot Melt Adhesive)]
<Production Example 1>
To a table kneader equipped with a heating device (PNV-1H manufactured by Irie Shokai), 480 g of tackifier resin 1, 160 g of elastomer 1 and 8 g of antioxidant were added, and the mixture was heated and stirred at 120 to 140 ° C. for 3 hours. During stirring, the pressure was reduced by a vacuum pump to prevent thermal deterioration. After confirming that there was no undissolved residue of the elastomer, the hot melt adhesive of Production Example 1 was obtained.
<Production Examples 2-8>
Hot melt adhesives of Production Examples 2 to 8 were obtained in the same manner as in Production Example 1 except that the tackifier resin, elastomer type, number of parts, and stirring conditions were changed according to Table 1.

Abbreviations for tackifying resins, elastomers and antioxidants listed in Table 1 are shown below.
Tackifying resin 1: partially aromatic hydrogenated resin, softening point 100 ° C.
Tackifying resin 2: aromatic hydrogenated resin, softening point 100 ° C.
Tackifying resin 3: partially hydrogenated terpene resin, softening point 105 ° C.
Tackifying resin 4: hydrogenated terpene resin, softening point 105 ° C.
Tackifying resin 5: rosin ester, softening point 108 ° C.
Tackifying resin 6: hydrogenated rosin ester, softening point 105 ° C.
Elastomer 1: Styrene-isoprene-styrene copolymer
MFR15g / 10min (JISK7210 200 ℃ / 10kg)
Elastomer 2: Styrene-ethylene / polyisoprene-styrene copolymer
MFR 100g / 10min (JISK7210 200 ℃ / 10kg)
Elastomer 3: Styrene-butadiene-styrene copolymer
MFR 20g / 10min (JISK7210 200 ℃ / 5kg)
Elastomer 4: Styrene-ethylene / butylene-styrene copolymer
MFR 8g / 10min (JISK7210 200 ℃ / 5kg)
Elastomer 5: Styrene-isoprene / butadiene-styrene copolymer
MFR11g / 10min (JISK7210 200 ℃ / 5kg)
Elastomer 6: Styrene-hydrogenated poly (isoprene / butadiene) -styrene copolymer MFR <0.1 g / 10 min (JISK7210 200 ° C./10 kg)
Antioxidant: phosphorus processing stabilizer + hindered phenol antioxidant, density 1.1 g / cm ² (20 ° C.)

<Softening point>
It was measured by the ring and ball method. Samples were packed into a regular ring and held horizontally in a glycerin bath. When a specified sphere (JIS B 1501) is placed in the center of the sample, the temperature of glycerin is raised at a specified rate, the sample softens and the sample or sphere touches the bottom plate of the ring base due to the weight of the sphere Temperature was defined as the softening point (JIS K 6863).

<Viscosity>
In a 500 mL capacity can, 300 g of hot melt adhesive in a state not containing air bubbles was put. After setting the temperature of the hot melt adhesive to 180 ° C., the rotor M4 was set in a B-type rotational viscometer (RB80L type viscometer), and the hot melt adhesive was immersed to the rotor mark. And the value when rotating for 30 seconds at 12 rpm was defined as the viscosity (JIS K 6862).

<Examples 1 to 8 (Sample Preparation 1)>
500 g of the hot melt adhesives of Production Examples 1 to 8 were put in a melting tank of a foaming hot melt coating apparatus (CF-03 manufactured by Suntool Co.) and heated to 180 ° C. The hose and nozzle were set at 180 ° C. The foaming ratio was 2.5, and about 0.4 g of adhesive was applied to a mount with a width of about 5 mm and a length of about 10 cm. The conversion coating amount was 4 g / m.
Separately, prepare an oval cylindrical plastic bottle (total mass 140 g) containing 120 mL of sunscreen gel as an article, wrap the article with a perforated heat shrinkable film, and then apply hot air with a dryer, A packaged article (an article packaged with a heat-shrinkable film) was obtained by shrinking a heat-shrinkable film.
A foamed hot melt adhesive layer was formed on the mount, and the sample (packaging with mount) of Examples 1 to 8 was obtained by bonding the heat-shrinked film of the packaged article and the mount after an open time of 8 seconds.
<Comparative Examples 1 to 8 (Sample Preparation 1)>
Samples of Comparative Examples 1 to 8 (with mount) except that the hot melt adhesives of Production Examples 1 to 8 were not subjected to foaming treatment (for convenience, also referred to as “foaming ratio 1”). Package).

  A thermal damage test and an adhesion test were performed on heat-shrinked films (hereinafter, also referred to as “shrink films”) of the samples produced using the hot melt adhesives of Production Examples 1 to 8. Moreover, in order to evaluate the adhesive force by the presence or absence of foaming of a hot-melt-adhesive, about the hot-melt adhesive of the manufacture examples 1-8, the adhesive force in the same volume was calculated | required about each foamed and unfoamed sample. The evaluation results are shown in Table 2.

<Thermal damage test for shrink film>
The shrink film of the sample (packaging with mount) obtained in Sample Preparation 1 is peeled off from the perforation to remove the plastic bottle as the article, and the foamed hot melt adhesive layer (Example) and the unfoamed hot melt adhesive The state of heat shrinkage of the shrink film (heat-shrinked film) in contact with the layer (comparative example) was confirmed, and thermal damage to the shrink film was evaluated according to the following criteria.
○: Wrinkles and shrinkage were not observed in the shrink film.
X: Wrinkles and shrinkage were observed in the shrink film.

<Adhesion test>
The adhesive state of the adhesive layer in each of the examples and comparative examples obtained in Sample Preparation 1 was evaluated visually according to the following criteria.
A: The shrink film and the mount are bonded, and the followability to the curved surface is excellent.
○: The shrink film and the mount are bonded.
X: There is an adhesion failure portion in the adhesion between the shrink film and the mount.

<Adhesive strength at the same volume>
A 6 mL hot melt adhesive (foaming hot melt adhesive with an expansion ratio of 2.5, hot foam adhesive without foaming (foaming ratio of 1)) was applied to the backing paper in a bead shape having a width of about 10 mm and a thickness of about 5 mm. Then, a sample was prepared by laminating a film capable of heat shrinking after an open time of 10 seconds. Then, after the hot melt adhesive has cooled sufficiently, the temperature is adjusted for 10 minutes in a constant temperature room at 23 ° C., and then the film that can be thermally shrunk at a peeling angle of 180 ° and 300 mm / min in a 23 ° C. environment is peeled off. The adhesive strength of was measured. The obtained adhesive strength was evaluated according to the following criteria.
○: Peel strength is 20N or more.
X: Peel strength is less than 20N.

<Examples 9 to 14, Comparative Example 9 (Sample Preparation 2)>
Using the hot melt adhesive of Production Example 4 shown in Table 1 and according to Examples 9 to 14 and Comparative Example 9 in the same manner as Example 1 and Comparative Example 1 except that the expansion ratio was appropriately set to 1 to 10. A sample (packaging with mount) was obtained.

  About the sample produced using the obtained hot-melt-adhesive, the peeling test in 50 degreeC and the adhesive force test in 23 degreeC and 0 degreeC were done. The evaluation results are shown in Table 3.

<Peeling at 50 ° C>
The state of the sample when the sample obtained in Sample Preparation 2 was suspended in an oven controlled at 50 ° C. and stored for 72 hours was evaluated according to the following criteria.
○: There is no peeling of the packaged article, and there is no positional deviation of the attaching position.
(Triangle | delta): Although there is no peeling of a packaging article, the shift | offset | difference of less than 10 mm was seen in the sticking position.
X: The packaged article was peeled off and / or a deviation of 10 mm or more was observed at the attaching position.

<Adhesive strength at 23 ° C.>
The shrink film of the sample obtained in Sample Preparation 2 is peeled off from the perforation, the plastic bottle is removed, the temperature is controlled for 10 minutes in a constant temperature room at 23 ° C., and the peel angle is 180 ° at 300 mm / min in a 23 ° C. environment. The adhesive strength when peeled off was measured, and the adhesive strength at 23 ° C. was evaluated according to the following criteria.
○: Peel strength is 10 N or more.
Δ: Peel strength is 5N or more and less than 10N.
X: Peel strength is less than 5N.

<Adhesive strength at 0 ° C>
The shrink film of the sample obtained in Sample Preparation 2 is peeled off from the perforation, the plastic bottle is removed, the temperature is adjusted for 10 minutes in an environment of 0 ° C., and 300 mm / mm at a peeling angle of 180 ° in the environment of 0 ° C. The adhesive strength when peeled in minutes was measured and evaluated according to the following criteria.
○: Peel strength is 5N or more.
Δ: Peel strength is 1N or more and less than 5N.
X: Peel strength is less than 1N.

Examples 1 to 8 (see Table 2) using a foamed hot melt adhesive with a foaming ratio of 2.5 were compared with the same hot melt adhesive without foaming (foaming ratio: 1.0). It turned out that the outstanding adhesive force is obtained compared with Examples 1-8. In addition, it was found that the thermal damage to the shrink film was less when foamed than when not foamed.
Furthermore, from the results of Examples 9 to 14 in Table 3, it was found that better adhesive strength was obtained when the expansion ratio was 1.5 to 5. In addition, about Example 9-14, after manufacturing a packaging body with a mount and storing for 3 months at 23 degreeC, when the foaming state of the foaming hot-melt-adhesive layer was confirmed, the foaming ratio of formula (1) 1. It confirmed that it was contained in the range of 1-10.
<Appendix>
The present specification also discloses the invention of the technical idea shown below, which is grasped from the above-described embodiment.

(Appendix 1)
Mount and
A heat-shrinkable film mount comprising: a heat-shrinkable film for packaging an article; and an adhesive layer that joins the heat-shrinkable film and the mount,
The adhesive layer is a foamed hot melt adhesive layer containing bubbles in a hot melt adhesive capable of reversibly repeating melting and solidification by heat, and is a film-backed mount with heat shrinkage.
(Appendix 2)
Mount and
An adhesive layer that joins a heat-shrinkable film, and a method for producing a heat-shrinkable film-mounted board comprising:
Preparing a hot melt adhesive capable of reversibly repeating melting and solidification by heat, and forming a foamed hot melt adhesive containing bubbles;
Forming an adhesive layer using the foamed hot melt adhesive on at least one of the mount and the heat-shrinkable film;
A method of manufacturing a mount with heat-shrinkable film, comprising a bonding step of bonding the mount and the heat-shrinkable film with the foamed hot melt adhesive layer interposed therebetween.

DESCRIPTION OF SYMBOLS 1 Package with mount 2 Mount with film which can be heat-shrinkable 10 Film which can be heat-shrinked 11 Film 12 which has been heat-shrinked Mount 13 Adhesive layer 14 Hanging hole 15 Perforation 16 Opening opening 20 Article 21 Film packaging article

The MFR (JIS K7210 200 ° C./5 kg) of the thermoplastic resin used is preferably 0.01 to 100 g. By making M FR 100 g or less, it becomes easy to balance heat resistance and adhesiveness when a hot melt adhesive is prepared by adding other components. On the other hand, it becomes easy to maintain the adhesiveness in a low-temperature atmosphere by making MFR 0.01g or more. Note that the MFR in the present invention, as a condition by the method specified in JIS K7210 (temperature 200 ° C., load weight 5 kg) is the mass of the thermoplastic resin obtained by. A more preferable range of MFR of the thermoplastic resin is 0.1 to 80, and a more preferable range is 1 to 70.

Examples of the tackifying resin include a phenol resin, a modified phenol resin, a terpene phenol resin, a xylene phenol resin, a cyclopentadiene-phenol resin, and a xylene resin. Also suitable are aliphatic, alicyclic and aromatic petroleum resins, hydrogenated aliphatic, alicyclic and aromatic petroleum resins, and phenol-modified petroleum resins. is there. Also suitable are rosin resins such as rosin ester resins and hydrogenated rosin ester resins. Further examples include low molecular weight polystyrene resins, terpene resins, hydrogenated terpene resins, and the like. Tackifying resins can be used alone or in combination of two or more.
The softening point of the tackifying resin used is preferably 80 to 160 ° C. By setting the softening point to 80 ° C. or higher, it is possible to make the bubbles in the hot melt after foaming difficult to be crushed even at high temperatures and to improve the adhesive strength. On the other hand, by setting the softening point to 160 ° C. or lower, it is possible to improve the tackiness in a low-temperature atmosphere and to maintain good adhesion. In the present invention, the softening point is a temperature determined by a method defined in JIS K 6863. A more preferable range of the softening point of the tackifying resin is 90 to 140 ° C., and a more preferable range is 100 to 130 ° C. from the viewpoint of balancing adhesiveness, heat resistance, and cold resistance.

The waxes include carnauba wax, canderia wax, montan wax, paraffin wax, microwax, Fischer-Tropsch wax, polyethylene wax, polypropylene wax, oxides of these waxes, ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer. A polymer etc. are mentioned. Waxes can be used alone or in combination of two or more. The melt viscosity at 150 ° C. of the wax is preferably 10 to 2,000 mPa · s, more preferably 15 to 1,000 mPa · s, and still more preferably 15 to 500 mPa · s. By using the wax, the viscosity of the hot melt adhesive can be lowered and coating can be facilitated.
The softening point of the wax used is preferably 70 to 120 ° C. When the softening point is 70 ° C. or higher, there is no possibility that the wax melts at a high temperature and the adhesive strength is reduced. On the other hand, when the softening point is 120 ° C. or lower, the temperature at which the hot melt is melted by heating is lowered, so that the coating property of the hot melt can be ensured. In the present invention, the softening point is a temperature determined by a method defined in JIS K 6863. A more preferable range of the softening point of the wax is 80 to 140 ° C, and a more preferable range is 90 to 130 ° C.

By the way, in order to improve the heat resistance of the adhesive layer, an adhesive that is not easily softened at a high temperature is generally used. However, when an adhesive that is difficult to soften at high temperature is used, the adhesive layer has a drawback that it is hard at low temperatures and easily cracked. In addition, when an adhesive that is difficult to soften at high temperature is used, the followability of the adhesive layer to a minute uneven surface is deteriorated, and curved surface followability is also deteriorated. In addition, in recent years, reactive hot melt adhesives that have been actively developed are bonded to a film that can be thermally shrunk through an adhesive and a backing sheet, and then the time for moisture curing and UV A curing process is required. By these curing treatments, it is possible to imagine the advantage of increasing the heat resistance by increasing the curability of the adhesive layer. However, minute for improved heat resistance by curing, bullet force of the adhesive layer decreases, followability is reduced. The decrease in followability becomes a problem particularly at low temperatures. As a means for increasing the adhesive force, there is a method of lowering the viscosity by increasing the temperature of the adhesive and improving the wettability to the heat-shrinked film or mount. However, if the adhesive is simply heated to a high temperature, thermal damage to the article cannot be ignored.

< Reference Examples 9 , 13, 14, Examples 10-12 , Comparative Example 9 (Sample Preparation 2)>
Reference Examples 9 , 13, 14, and Example 10 were performed in the same manner as in Example 1 and Comparative Example 1 except that the hot melt adhesive of Production Example 4 shown in Table 1 was used and the expansion ratio was appropriately set to 1 to 10. -12 The sample (packaging body with mount) which concerns on the comparative example 9 was obtained.

Examples 1 to 8 (see Table 2) using a foamed hot melt adhesive with a foaming ratio of 2.5 were compared with the same hot melt adhesive without foaming (foaming ratio: 1.0). It turned out that the outstanding adhesive force is obtained compared with Examples 1-8. In addition, it was found that the thermal damage to the shrink film was less when foamed than when not foamed.
Furthermore, from the results of Reference Examples 9 , 13, and 14 and Examples 10 to 12 in Table 3, it was found that better adhesive strength was obtained when the expansion ratio was 1.5 to 5. For Reference Examples 9 , 13, 14, and Examples 10 to 12 , after the packaging with the mount was manufactured and stored at 23 ° C. for 3 months, the foaming state of the foamed hot melt adhesive layer was confirmed. It confirmed that it was contained in the range of the expansion ratio 1.1-10 of (1).

Claims (8)

Mount and
Articles wrapped in heat-shrinkable film;
A package with a mount comprising the heat-shrinkable film and an adhesive layer that joins the mount,
The said adhesive bond layer is a packaging body with a mount which is a foaming hot-melt-adhesive adhesive layer which contains a bubble in the hot-melt-adhesive which can reversibly melt and solidify with heat.   2. The package with mount according to claim 1, wherein the hot melt adhesive has a melt viscosity of 1,000 mPa · s or more and 50,000 mPa · s or less in a state where no bubbles are included. The packaging body with a mount according to claim 1 or 2, wherein the foaming hot melt adhesive layer has an expansion ratio of 1.1 or more and 10 or less obtained from the formula (1).
<Number _{1> V} 1 _/ V 2 ··· formula (1)
In the formula, V ₁ is the volume of the foamed hot melt adhesive layer recovered from the package with mount, and V ₂ is obtained by heating and melting the foam hot melt adhesive layer recovered from the package with mount. The volume after defoaming. Mount and
Articles wrapped in heat-shrinkable film;
A method for producing a package with a mount comprising the heat-shrinkable film and a foamed hot melt adhesive layer for joining the mount,
Coating the article with a heat-shrinkable film, and heat-shrinking the heat-shrinkable film film;
Preparing a hot melt adhesive capable of reversibly repeating melting and solidification by heat, and forming a foamed hot melt adhesive containing bubbles;
Forming a foamed hot melt adhesive layer using the foamed hot melt adhesive on at least one of the mount and the heat-shrinked film;
A bonding step of bonding the mount and the heat-shrinkable film with the foamed hot melt adhesive layer interposed therebetween,
Manufacturing method of packaging body with mount. Mount and
Articles wrapped in heat-shrinkable film;
A method for producing a package with a mount comprising the heat-shrinkable film and a foamed hot melt adhesive layer for joining the mount,
Preparing a hot melt adhesive capable of reversibly repeating melting and solidification by heat, and forming a foamed hot melt adhesive containing bubbles;
Forming a foamed hot melt adhesive layer using the foamed hot melt adhesive on at least one of the mount and the heat shrinkable film before shrinking the thermally contracted film;
Joining the mount and the heat-shrinkable film through the foamed hot-melt adhesive layer, and obtaining a film-attached mount that can be heat-shrinked;
Covering the article with the heat-shrinkable film, and heat-shrinking the heat-shrinkable film.
Manufacturing method of packaging body with mount.   The method for producing a package with a mount according to claim 4 or 5, wherein the hot-melt adhesive has a melt viscosity of 1,000 mPa · s or more and 50,000 mPa · s or less in a state not including air bubbles. The method for producing a package with a mount according to any one of claims 4 to 6, wherein an expansion ratio obtained from the formula (2) of the foamed hot melt adhesive is 1.1 or more and 10 or less.
<Equation 2> V ₃ / V ₄ Formula (2)
In the formula, V ₃ is a mass per 100 cc of the hot melt adhesive in a state in which no bubbles of the hot melt adhesive are included, and V ₄ is a mass per 100 cc of the foamed hot melt adhesive. Forming the foamed hot melt adhesive layer;
The manufacturing method of the packaging body with a mount of any one of Claims 4-7 which performs the said joining process continuously, maintaining the molten state of the said foaming hot-melt-adhesive.

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