JP2014038902A - Vapor cooling device - Google Patents
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- JP2014038902A JP2014038902A JP2012179343A JP2012179343A JP2014038902A JP 2014038902 A JP2014038902 A JP 2014038902A JP 2012179343 A JP2012179343 A JP 2012179343A JP 2012179343 A JP2012179343 A JP 2012179343A JP 2014038902 A JP2014038902 A JP 2014038902A
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- 238000001816 cooling Methods 0.000 title claims abstract description 28
- 239000003507 refrigerant Substances 0.000 claims abstract description 62
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims abstract description 48
- 239000010702 perfluoropolyether Substances 0.000 claims abstract description 12
- 238000009835 boiling Methods 0.000 claims description 35
- 239000004215 Carbon black (E152) Substances 0.000 claims description 22
- 229930195733 hydrocarbon Natural products 0.000 claims description 22
- 150000002430 hydrocarbons Chemical class 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 19
- 239000011259 mixed solution Substances 0.000 abstract description 5
- 210000003000 inclusion body Anatomy 0.000 abstract description 4
- 239000000243 solution Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 26
- 239000002826 coolant Substances 0.000 description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 9
- 238000007710 freezing Methods 0.000 description 7
- 230000008014 freezing Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- IYRWEQXVUNLMAY-UHFFFAOYSA-N carbonyl fluoride Chemical compound FC(F)=O IYRWEQXVUNLMAY-UHFFFAOYSA-N 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
この発明は、冷媒の相変化を利用して発熱体を冷却する沸騰冷却装置に関する。 The present invention relates to a boiling cooling device that cools a heating element by using a phase change of a refrigerant.
たとえば、半導体素子や、半導体素子およびその制御回路が一体化されたパワー半導体モジュールを冷却する冷却装置として、冷媒の相変化を利用して発熱体を冷却する沸騰冷却装置を用いることが考えられている。 For example, as a cooling device that cools a semiconductor element or a power semiconductor module in which a semiconductor element and its control circuit are integrated, it is considered to use a boiling cooling device that cools a heating element using a phase change of a refrigerant. Yes.
この種の沸騰冷却装置として、外部からの熱を受ける中空状受熱部、外部に熱を放出する中空状放熱部、および受熱部内と放熱部内とを通じさせる冷媒流通部を有する冷媒封入体と、冷媒封入体内に封入されかつ潜熱として熱を輸送する冷媒とを備えており、冷媒が、水とエタノールとの混合液からなる沸騰冷却装置が知られている（特許文献１参照）。 As this type of boiling cooling apparatus, a refrigerant enclosing body having a hollow heat receiving portion that receives heat from the outside, a hollow heat radiating portion that releases heat to the outside, and a refrigerant circulation portion that passes through the heat receiving portion and the heat radiating portion, and a refrigerant There is known a boiling cooling device that includes a refrigerant enclosed in an enclosure and transports heat as latent heat, and the refrigerant is a mixture of water and ethanol (see Patent Document 1).
特許文献１記載の沸騰冷却装置によれば、冷媒が、水とエタノールとの混合液からなるので、冷媒の凝固点が氷点下となり、氷点下となる環境下でも使用可能になる。 According to the boiling cooling device described in Patent Document 1, since the refrigerant is a mixed liquid of water and ethanol, the freezing point of the refrigerant is below freezing point, and it can be used even in an environment where the freezing point is below freezing point.
しかしながら、水とエタノールとの混合液からなる冷媒を用いた沸騰冷却装置の場合、熱抵抗、すなわち冷媒封入体の壁から冷媒、および冷媒から冷媒封入体の壁に熱が伝わる際の抵抗が水に比べて高くなるので、水を用いた沸騰冷却装置に比べて冷却効率が低下する。 However, in the case of a boiling cooling device using a refrigerant composed of a mixture of water and ethanol, the thermal resistance, that is, the resistance when heat is transferred from the refrigerant enclosure wall to the refrigerant and from the refrigerant to the refrigerant enclosure wall is water. Therefore, the cooling efficiency is lower than that of a boiling cooling device using water.
この発明の目的は、上記問題を解決し、熱抵抗を低減しうる沸騰冷却装置を提供することにある。 An object of the present invention is to provide a boiling cooling device that can solve the above-described problems and reduce the thermal resistance.
本発明は、上記目的を達成するために以下の態様からなる。 In order to achieve the above object, the present invention comprises the following aspects.
1)外部からの熱を受ける中空状受熱部、外部に熱を放出する中空状放熱部、および受熱部内と放熱部内とを通じさせる冷媒流通部を有する冷媒封入体と、冷媒封入体内に封入されかつ潜熱として熱を輸送する冷媒とを備えた沸騰冷却装置において、冷媒が、パーフルオロポリエーテルとハイドロカーボンとの混合液からなり、前記混合液におけるハイドロカーボンの含有量が４０〜６０質量％である沸騰冷却装置。 1) a refrigerant enclosing body having a hollow heat receiving portion that receives heat from the outside, a hollow heat radiating portion that releases heat to the outside, and a refrigerant circulation portion that passes through the heat receiving portion and the heat radiating portion; and In a boiling cooling apparatus including a refrigerant that transports heat as latent heat, the refrigerant is a mixed liquid of perfluoropolyether and hydrocarbon, and the content of hydrocarbon in the mixed liquid is 40 to 60% by mass. Boiling cooler.
2)前記ハイドロカーボンがｎ−ペンタンからなる上記1)記載の沸騰冷却装置。 2) The boiling cooling device according to 1) above, wherein the hydrocarbon comprises n-pentane.
上記1)および2)の沸騰冷却装置によれば、冷媒が、パーフルオロポリエーテルとハイドロカーボンとの混合液からなり、前記混合液におけるハイドロカーボンの含有量が４０〜６０質量％であるから、特許文献１記載の水とエタノールとの混合液からなる冷媒を用いた沸騰冷却装置に比べて、熱交換量が増加しても熱抵抗が低くなる。しかも、冷媒の凝固点が氷点下になるので、氷点下となる環境下でも使用可能である。 According to the boiling cooling apparatus of the above 1) and 2), the refrigerant is composed of a mixed liquid of perfluoropolyether and hydrocarbon, and the hydrocarbon content in the mixed liquid is 40 to 60% by mass. Compared with the boiling cooling apparatus using the refrigerant | coolant which consists of the liquid mixture of water and ethanol of patent document 1, even if a heat exchange amount increases, thermal resistance becomes low. Moreover, since the freezing point of the refrigerant is below freezing point, it can be used even in an environment below freezing point.
さらに、各種存在するパーフルオロカーボンの中でパーフルオロポリエーテルを用いているので、次の効果を奏する。すなわち、一般に沸騰現象は沸騰曲線で表され、受熱する熱流束の増加とともに熱伝達率が上昇する核沸騰状態となる。熱流束が最大値である臨界熱流束を超えると沸騰状態が核沸騰から膜沸騰に遷移し、沸騰面（冷媒封入体の受熱部内面）が気泡で覆われて沸騰面温度は急激に上昇し、熱抵抗が上昇する。そして、パーフルオロポリエーテルとハイドロカーボンとの混合液からなり、前記混合液におけるハイドロカーボンの含有量が４０〜６０質量％である冷媒を用いると、核沸騰が起こりやすくなって熱交換量が少ない場合であっても熱抵抗は低く、しかも膜沸騰への遷移が、熱交換量が比較的多くなるまで起こりにくい。したがって、沸騰現象を利用した沸騰冷却装置において、安全な使用範囲を広くとることができる。また、安全な使用範囲を最小に設計することにより設計マージンを抑制することができ、コストの削減を図ることができる。 Furthermore, since perfluoropolyether is used among the various perfluorocarbons, the following effects can be obtained. That is, in general, the boiling phenomenon is represented by a boiling curve, and becomes a nucleate boiling state in which the heat transfer rate increases as the heat flux to receive heat increases. When the heat flux exceeds the maximum critical heat flux, the boiling state transitions from nucleate boiling to film boiling, the boiling surface (inner surface of the heat receiving part of the refrigerant enclosure) is covered with bubbles, and the boiling surface temperature rises rapidly. , Heat resistance rises. And if it uses the refrigerant | coolant which consists of a liquid mixture of perfluoropolyether and hydrocarbon and the content of hydrocarbon in the said liquid mixture is 40-60 mass%, nucleate boiling will occur easily and there will be little heat exchange amount. Even in this case, the thermal resistance is low, and the transition to film boiling is unlikely to occur until the amount of heat exchange is relatively large. Therefore, in the boiling cooling device using the boiling phenomenon, a safe use range can be widened. In addition, the design margin can be suppressed by designing the safe use range to the minimum, and the cost can be reduced.
上記2)の沸騰冷却装置によれば、上記1)で述べた効果が一層顕著になる。 According to the boiling cooling device of 2), the effect described in 1) is more remarkable.
以下、この発明の実施形態を、図面を参照して説明する。 Embodiments of the present invention will be described below with reference to the drawings.
以下の説明において、「アルミニウム」という用語には、純アルミニウムの他にアルミニウム合金を含むものとする。 In the following description, the term “aluminum” includes aluminum alloys in addition to pure aluminum.
図１はこの発明の沸騰冷却装置の全体構成を概略的に示す。 FIG. 1 schematically shows the overall configuration of the boiling cooling apparatus of the present invention.
図１において、沸騰冷却装置(1)は、外部からの熱を受ける中空状受熱部(3)、外部に熱を放出する中空状放熱部(4)、および受熱部(3)内と放熱部(4)内とを通じさせる冷媒流通部(5)を有するアルミニウム製の冷媒封入体(2)と、冷媒封入体(2)内に封入されて受熱部(3)に貯留されておりかつ潜熱として熱を輸送する冷媒(6)とを備えている。冷媒(6)は、冷媒封入体(2)内を真空状態として封入されている。冷媒封入体(2)は、受熱部(3)、放熱部(4)および冷媒流通部(5)を含めて全体がアルミニウムにより形成されている。 In FIG. 1, the boiling cooling device (1) includes a hollow heat receiving part (3) that receives heat from the outside, a hollow heat radiating part (4) that releases heat to the outside, and the heat receiving part (3) and the heat radiating part. (4) An aluminum refrigerant enclosure (2) having a refrigerant circulation section (5) that passes through the interior, and is stored in the heat receiving section (3) enclosed in the refrigerant enclosure (2) and stored as latent heat. And a refrigerant (6) for transporting heat. The refrigerant (6) is sealed in a vacuum state in the refrigerant enclosure (2). The refrigerant enclosure (2) is entirely made of aluminum including the heat receiving part (3), the heat radiating part (4), and the refrigerant circulation part (5).
冷媒封入体(2)の受熱部(3)の外面に、たとえば半導体素子からなるパワーデバイスを備えたパワーモジュールなどからなる発熱体(7)が、図示しない熱伝導性グリスを介して取り付けられるようになっており、発熱体(7)から発せられる熱が冷媒封入体(2)の壁を経て受熱部(3)内の冷媒(6)に伝わる。 A heating element (7) made of, for example, a power module including a power device made of a semiconductor element is attached to the outer surface of the heat receiving portion (3) of the refrigerant enclosure (2) via a heat conductive grease (not shown). Thus, the heat generated from the heating element (7) is transmitted to the refrigerant (6) in the heat receiving part (3) through the wall of the refrigerant enclosure (2).
冷媒封入体(2)の放熱部(4)内には、冷却液を冷媒封入体(2)の外部から供給するとともに冷媒封入体(2)の外部に戻す冷却液循環管(8)が配置されている。そして、冷媒(6)により受熱部(3)から輸送されてきた熱を、冷却液循環管(8)内を流れる冷却液を介して冷媒封入体(2)の外部に放熱するようになっている。 A coolant circulation pipe (8) for supplying the coolant from the outside of the coolant enclosure (2) and returning it to the outside of the coolant enclosure (2) is disposed in the heat radiating section (4) of the coolant enclosure (2). Has been. The heat transported from the heat receiving section (3) by the refrigerant (6) is radiated to the outside of the refrigerant enclosure (2) through the coolant flowing in the coolant circulation pipe (8). Yes.
冷媒(6)は、パーフルオロポリエーテルとハイドロカーボンとの混合液からなる。前記混合液におけるハイドロカーボンの含有量は４０〜６０質量％の範囲内で選択すべきである。なお、前記混合液におけるパーフルオロポリエーテルとハイドロカーボンとの合計量は１００質量％である。前記パーフルオロポリエーテルとしては、たとえばソルベイソレクシス（Ｓｏｌｖａｙ Ｓｏｌｅｘｉｓ）社製のガルデンＨＴ−５５を用いることが好ましい。また、前記ハイドロカーボンとしては、ｎ−ペンタンを用いることが好ましい。 The refrigerant (6) is composed of a mixed liquid of perfluoropolyether and hydrocarbon. The hydrocarbon content in the mixed solution should be selected within the range of 40 to 60% by mass. The total amount of perfluoropolyether and hydrocarbon in the mixed liquid is 100% by mass. As the perfluoropolyether, for example, Galden HT-55 manufactured by Solvay Solexis is preferably used. Moreover, it is preferable to use n-pentane as the hydrocarbon.
ここで、冷媒(6)を構成するパーフルオロポリエーテルとハイドロカーボンとの混合液におけるハイドロカーボンの含有量を４０〜６０質量％としたのは、次のような実験を行った結果、図２および図３に示すような結果が得られたからである。 Here, the content of the hydrocarbon in the mixed liquid of the perfluoropolyether and the hydrocarbon constituting the refrigerant (6) was set to 40 to 60% by mass as a result of the following experiment. This is because the results shown in FIG. 3 were obtained.
すなわち、図１に示す沸騰冷却装置(1)を使用して、水、ガルデンＨＴ−５５(A)、ｎ−ペンタン(B)、水とエタノールとの混合液(C)（混合液中のエタノール含有量は５０質量％）、パーフルオロケトン（住友スリーエム社製、Ｎｏｖｅｃ６４９）とｎ−ペンタンとの混合液(D)（混合液中のｎ−ペンタンの含有量は５０質量％）、ガルデンＨＴ−５５とｎ−ペンタンとの混合液(E)（混合液中のｎ−ペンタンの含有量は５０質量％）の熱抵抗を求めた。 That is, using the boiling cooling device (1) shown in FIG. 1, water, Galden HT-55 (A), n-pentane (B), a mixture of water and ethanol (C) (ethanol in the mixture) Content: 50% by mass), perfluoroketone (manufactured by Sumitomo 3M, Novec649) and n-pentane (D) (content of n-pentane in the mixture is 50% by mass), Galden HT- The thermal resistance of a mixed liquid (E) of 55 and n-pentane (the content of n-pentane in the mixed liquid is 50% by mass) was determined.
熱抵抗は、発熱体(7)からの発熱量をＱ(W)、発熱体(7)の温度をＴｈ（℃）、冷却液循環管(8)内に送り込まれる冷却液の温度をＴｃ（℃）として、（Ｔｈ−Ｔｃ）／Ｑ（℃／Ｗ）という式により求めた。その結果を図２に示す。なお、図２においては、水の熱抵抗を１００％とした場合の各物質の熱抵抗を示す。 The heat resistance is defined as Q (W) for the amount of heat generated from the heating element (7), Th (° C) for the temperature of the heating element (7), and Tc () for the temperature of the coolant sent into the coolant circulation pipe (8). (° C.) was obtained by the formula (Th−Tc) / Q (° C./W) The result is shown in FIG. FIG. 2 shows the thermal resistance of each substance when the thermal resistance of water is 100%.
また、ガルデンＨＴ−５５とｎ−ペンタンとの混合液中のｎ−ペンタンの含有量を種々変更し、ｎ−ペンタンの含有量が９５質量％の混合液(F)、ｎ−ペンタンの含有量が６０質量％の混合液(G)、ｎ−ペンタンの含有量が５０質量％の混合液(H)、ｎ−ペンタンの含有量が３７質量％の混合液(I)を用いて、上述し方法により熱抵抗を求めた。その結果を図３に示す。なお、図３においては、水の熱抵抗を１００％とした場合のｎ−ペンタンの含有量が異なっている種々の混合液の熱抵抗を示す。 In addition, the content of n-pentane in the mixed solution of Galden HT-55 and n-pentane was variously changed, and the mixed solution (F) having an n-pentane content of 95% by mass and the content of n-pentane. The mixture liquid (G) having a content of 60% by mass, the liquid mixture (H) having a content of n-pentane of 50% by mass, and the liquid mixture (I) having a content of n-pentane of 37% by mass are described above. The thermal resistance was determined by the method. The result is shown in FIG. In addition, in FIG. 3, the thermal resistance of the various liquid mixture from which content of n-pentane differs when the thermal resistance of water is 100% is shown.
図２に示す結果から、ガルデンＨＴ−５５とｎ−ペンタンとの混合液(E)の熱抵抗は、ガルデンＨＴ−５５(A)、ｎ−ペンタン(B)、および水とエタノールとの混合液(C)の熱抵抗よりも低くなり、パーフルオロケトンとｎ−ペンタンとの混合液(D)と同様であることが分かる。また、ガルデンＨＴ−５５とｎ−ペンタンとの混合液(E)と、パーフルオロケトンとｎ−ペンタンとの混合液(D)とを比較すると、混合液(E)の方がより広範な熱交換量において熱抵抗が低くなっていることが分かる。さらに、図３に示す結果から、ガルデンＨＴ−５５とｎ−ペンタンとの混合液におけるｎ−ペンタンの含有量が４０〜６０質量％の場合に、熱交換量が比較的多くなるまで、熱抵抗の上昇が起こりにくいことが分かる。そして、図２および図３に示す結果から、ガルデンＨＴ−５５とハイドロカーボンとの混合液におけるハイドロカーボンの含有量が、４０〜６０質量％に決められたのである。 From the results shown in FIG. 2, the thermal resistance of the liquid mixture (E) of Galden HT-55 and n-pentane is Galden HT-55 (A), n-pentane (B), and a liquid mixture of water and ethanol. It becomes lower than the thermal resistance of (C), and it is understood that it is the same as the mixed liquid (D) of perfluoroketone and n-pentane. In addition, when the mixed liquid (E) of Galden HT-55 and n-pentane is compared with the mixed liquid (D) of perfluoroketone and n-pentane, the mixed liquid (E) has a wider range of heat. It can be seen that the thermal resistance is low in the exchange amount. Furthermore, from the result shown in FIG. 3, when the content of n-pentane in the mixed liquid of Galden HT-55 and n-pentane is 40 to 60% by mass, the heat resistance is increased until the heat exchange amount becomes relatively large. It can be seen that the rise is difficult to occur. From the results shown in FIGS. 2 and 3, the hydrocarbon content in the mixture of Galden HT-55 and hydrocarbon was determined to be 40 to 60% by mass.
上述した沸騰冷却装置(1)において、発熱体(7)から発せられる熱が冷媒封入体(2)の壁を経て受熱部(3)内の冷媒(6)に伝わると、冷媒封入体(2)の受熱部(3)内に溜まっている冷媒(6)が加熱されて蒸発する。ガス状冷媒(6)は、冷媒流通部(5)を通って放熱部(4)に流れ、冷却液循環管(8)内を流れる冷却液に放熱して再液化し、再液化した冷媒(6)が冷媒流通部(5)を通って受熱部(3)に戻る。このような動作を繰り返すことによって、発熱体(7)から発せられる熱が、冷媒(6)により潜熱として放熱部(4)に輸送され、放熱部(4)から冷媒封入体(2)の外部に放熱される。 In the above-described boiling cooling device (1), when heat generated from the heating element (7) is transmitted to the refrigerant (6) in the heat receiving part (3) through the wall of the refrigerant inclusion body (2), the refrigerant inclusion body (2 The refrigerant (6) accumulated in the heat receiving part (3) is heated and evaporated. The gaseous refrigerant (6) flows through the refrigerant circulation part (5) to the heat radiating part (4), dissipates heat to the coolant flowing in the coolant circulation pipe (8), re-liquefies, and re-liquefied refrigerant ( 6) returns to the heat receiving part (3) through the refrigerant circulation part (5). By repeating such an operation, the heat generated from the heating element (7) is transported as latent heat by the refrigerant (6) to the heat radiating section (4), and from the heat radiating section (4) to the outside of the refrigerant enclosure (2). Heat is dissipated.
この発明による沸騰冷却装置は、たとえば半導体素子からなるパワーデバイスを備えたパワーモジュールなどからなる発熱体を冷却するのに好適に用いられる。 The boiling cooling device according to the present invention is suitably used for cooling a heating element including a power module including a power device including a semiconductor element, for example.
(1)：沸騰冷却装置
(2)：冷媒封入体
(3)：受熱部
(4)：放熱部
(5)：冷媒流通部
(6)：冷媒
(1): Boiling cooler
(2): Refrigerant enclosure
(3): Heat receiving part
(4): Heat radiation part
(5): Refrigerant distribution department
(6): Refrigerant
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012179343A JP2014038902A (en) | 2012-08-13 | 2012-08-13 | Vapor cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012179343A JP2014038902A (en) | 2012-08-13 | 2012-08-13 | Vapor cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2014038902A true JP2014038902A (en) | 2014-02-27 |
Family
ID=50286817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012179343A Pending JP2014038902A (en) | 2012-08-13 | 2012-08-13 | Vapor cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2014038902A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006307170A (en) * | 2005-03-29 | 2006-11-09 | Asahi Glass Co Ltd | Working fluid for latent heat transport device and method of operating latent heat transport device |
| JP2008519113A (en) * | 2004-11-04 | 2008-06-05 | ソルヴェイ フルオル ゲゼルシャフト ミット ベシュレンクテル ハフツング | Working fluid for heat transfer |
| JP2010196912A (en) * | 2009-02-23 | 2010-09-09 | Toyota Industries Corp | Ebullient cooling device |
| JP2011155107A (en) * | 2010-01-27 | 2011-08-11 | Toyota Industries Corp | Ebullient cooling device |
-
2012
- 2012-08-13 JP JP2012179343A patent/JP2014038902A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008519113A (en) * | 2004-11-04 | 2008-06-05 | ソルヴェイ フルオル ゲゼルシャフト ミット ベシュレンクテル ハフツング | Working fluid for heat transfer |
| JP2006307170A (en) * | 2005-03-29 | 2006-11-09 | Asahi Glass Co Ltd | Working fluid for latent heat transport device and method of operating latent heat transport device |
| JP2010196912A (en) * | 2009-02-23 | 2010-09-09 | Toyota Industries Corp | Ebullient cooling device |
| JP2011155107A (en) * | 2010-01-27 | 2011-08-11 | Toyota Industries Corp | Ebullient cooling device |
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