JP2014017404A - Printed circuit board manufacturing method - Google Patents

Abstract

A printed circuit board manufacturing method capable of accurately positioning a printed circuit board that has been cut with high accuracy and mounting surface components at low cost.
A first positioning jig 3 and a second positioning jig 4 are in contact with a plurality of outer cutting surfaces a, b, c of a printed circuit board 1, respectively. A V-shaped contact portion 8 is formed on the first positioning jig 3 and presses the printed circuit board 1 at two arc-shaped points of the printed circuit board 1, and a horizontal surface is disposed on the second positioning jig 4. And two horizontal surfaces at the lower end of the printed circuit board 1 press the second positioning jig 4. At this time, the shape of the first and second positioning jigs 3 and 4 is the same as that of the second positioning jig in which the resultant force of two points pressing the printed board 1 of the first positioning jig 3 is pressed by the printed board 1. It is formed to be equal to the resultant force of the tool 4.
[Selection] Figure 2

Description

  The present invention relates to a method for manufacturing a printed circuit board.

  Conventionally, in a solder printing apparatus that performs solder (cream solder) printing on a component land formed on a printed circuit board or a component mounting apparatus that mounts surface components on a printed circuit board, a substrate recognition mark formed on the printed circuit board, etc. Some of these recognition marks are photographed with a camera, a center position of the recognition mark is obtained by an image processing technique, and a positioning function for correcting a positional deviation of each printed circuit board is available. For the recognition mark on the printed circuit board, it is common to use a copper foil formed at the same time as the component land for soldering. The mask for solder printing is positioned to perform solder printing or for soldering. The component mounting position can be corrected at the position of the component land. Then, a mounting position correction technique has been proposed for securely mounting a surface component on the solder printed on such a printed circuit board (see, for example, Patent Document 1).

  The technique described in Patent Document 1 includes a pattern mark for positioning a printed circuit board and a solder printing mask by an image recognition technique and a solder mark that is printed simultaneously when solder is applied to the printed circuit board. The surface component mounting position is calculated from the pattern mark, and the solder printing deviation amount is calculated from the solder mark position, and the surface component is mounted at the position where the pattern mark position is corrected. As a result, an effect of preventing solder bridging is obtained.

Japanese Patent No. 3264395

  However, the correction of the position where the surface component is mounted as described above is performed by arithmetic processing based on image recognition using a recognition mark provided on the printed circuit board. For this reason, a detection camera, image processing software, and an actuator for positioning and correcting the printed circuit board are required, which may result in significant capital investment and an increase in manufacturing cost. Further, in the above manufacturing method, the accuracy of the outer shape of each cut-out printed board may be poor. For this reason, it is necessary to position the printed circuit board with high accuracy in common with the subsequent processes of mounting each board in the solder printing process, the component mounting process, and the resin molding process.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a printed board manufacturing method capable of accurately positioning a printed board that has been cut and mounting surface components at low cost. There is.

  In order to solve the above-mentioned problem, a printed circuit board manufacturing method according to claim 1, wherein a printed circuit board, a circuit pattern for mounting a surface component on the printed circuit board, a position of the circuit pattern are determined, and the printed circuit board A circuit pattern reference position and an outer shape processing reference mark provided at the same position as the circuit pattern reference position, and cutting the outer shape of the printed circuit board based on the outer shape processing reference mark. Is the gist.

  According to the above configuration, the printed circuit board manufacturing method according to the present invention provides the outline processing reference mark at the same position as the reference position of the circuit pattern (component land) for mounting the surface component provided on the printed circuit board. Since the outer shape of the printed circuit board is cut based on the outer shape processing reference mark and the processed surface is formed with high accuracy, the printed circuit board can be mechanically accurately positioned on each substrate mounting device in the subsequent process.

  The printed circuit board manufacturing method according to claim 2 is the printed circuit board manufacturing method according to claim 1, wherein a printing process for printing solder on the circuit pattern, a mounting process for mounting the surface component, A molding step of molding the joint with resin, and in the three steps, at least two positioning jigs are configured to be swingable so as to press the plurality of cutting surfaces of the printed circuit board, The gist is that the resultant force of one of the positioning jigs pressing the printed circuit board is balanced with the other combined force of the positioning jig pressed by the printed circuit board.

  According to the above configuration, according to the printed circuit board manufacturing method of the present invention, at least two positioning jigs are formed so that the resultant force is balanced in the three steps of mounting the surface component on the board. While pressing multiple cutting surfaces of the printed circuit board that is displaced from the position, a rotational moment is generated on the printed circuit board and it is rotated, so the positional displacement of the printed circuit board is corrected by fixing the positioning jig. Thus, the printed circuit board can be accurately positioned.

  According to the present invention, it is possible to provide a printed circuit board manufacturing method capable of accurately positioning a printed circuit board cut with high accuracy and mounting surface components at low cost.

1 is a plan view showing a schematic configuration of a printed circuit board according to an embodiment of the present invention. Schematic which shows the relationship between a printed circuit board and a positioning jig. The flowchart which shows the process sequence of the surface component mounting method of a printed circuit board.

Next, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a front view showing a schematic configuration of a printed circuit board 1 according to an embodiment of the present invention. As shown in FIG. 1, a printed circuit board 1 includes a plurality of (six in this embodiment) circuit boards that are manufactured simultaneously for taking a large number (multiple) from one large board (master board) 6. It is formed by cutting out the outline of. Here, the printed circuit board 1 is formed of a multilayer substrate via an insulating layer bonded on a metal, for example, an aluminum plate, on which a surface component 5 constituting an electronic circuit such as a chip component or an IC is mounted on one side. Aluminum substrate. This aluminum substrate is mounted on a vehicle and used as a circuit board for motor control of an electric power steering device that assists steering operation or an electric oil pump device that generates hydraulic pressure, for example.

  The printed circuit board 1 on which components are mounted has chip components such as capacitors and electronic components (hereinafter referred to as surface components) 5 such as semiconductor elements mounted on the upper surface of a laminate formed by laminating a plurality of insulator layers. It is formed by. An electrode pad (not shown) corresponding to the connection electrode of the surface component 5 is formed on the upper surface of the laminate, and the electrode pad and the connection electrode of the surface component 5 are electrically connected via solder (cream solder). Mechanically connected. An internal wiring pattern is formed inside the laminate, and a predetermined electronic circuit is configured by connecting the surface component 5 via a via-hole conductor or the like.

  Further, the printed circuit board 1 is provided with a circuit pattern reference position 7 (see FIG. 2) which serves as a reference for determining the position of the circuit pattern and positioning the printed circuit board 1. One contour processing reference mark 2 representing the origin of the substrate contour processing machine that cuts the printed circuit board 1 is provided at the same position as the circuit pattern reference position 7, and this is recognized and a cutting tool (for example, a router, The printed circuit board 1 is cut out while ensuring the accuracy of the outer shape by processing with a laser, ultrasonic wave, or the like. The outline processing reference mark 2 is formed, for example, by making a hole of a predetermined size in the printed circuit board 1. The printed circuit board 1 can obtain the position of the outline processing reference mark 2 by image recognition using a camera. The substrate position is determined by inserting a positioning pin into the hole of the contour processing mark 2 and attached to the mounting portion of the substrate contour processing machine.

  Next, FIG. 2 is a schematic diagram showing the relationship between the printed circuit board 1 of FIG. 1 and the first and second positioning jigs 3 and 4. As shown in FIG. 2, the first positioning jig 3 and the second positioning jig 4 are respectively formed on the cutting surfaces a, b, and c (indicated by broken lines in FIG. 2) of the outer shape of the printed circuit board 1. Abut. A V-shaped contact portion 8 is formed on the first positioning jig 3 and presses the printed circuit board 1 at two arc-shaped points of the printed circuit board 1, and a horizontal surface is disposed on the second positioning jig 4. The abutting portion 9 is formed, and the second positioning jig 4 is pressed by two horizontal surfaces at the lower end of the printed circuit board 1. At this time, the shape of the first and second positioning jigs 3 and 4 is, for example, a second force in which the resultant force of two points pressing the printed board 1 of the first positioning jig 3 is pressed against the printed board 1. It is formed to be equal to the resultant force of the positioning jig 4.

  As a result, while pressing the printed circuit board 1 on which the first and second positioning jigs 3 and 4 are displaced, printing is performed in a direction (on the line of action) in which the resultant force of the first positioning jig 3 acts. Since the center of gravity of the substrate 1 is not present, a force in the rotational direction is generated on the printed circuit board 1, and the printed circuit board 1 rotates (indicated by a broken arrow in FIG. 2). At this time, the printed circuit board 1 moves so as to be in a correct posture, and is corrected to an accurate position and positioned and fixed. After the printed circuit board 1 is supported and fixed on the three surfaces, it can be assembled in each process. Here, the first positioning jig 3 is driven by, for example, a cylinder or a stepping motor, and the second positioning jig 4 is fixed.

Next, each process for manufacturing the printed circuit board 1 will be described.
First, in a state before solder printing, a circuit pattern for mounting the surface component 5 is formed on the mounting side surface of the printed circuit board 1 with a conductor such as copper foil. The arrangement of these circuit patterns is determined based on position data created at the time of designing a printed circuit board. Each printed board 1 is cut out from the master board 6 by cutting using a board outline processing machine.

FIG. 3 is a flowchart showing a processing procedure of the surface component mounting method of the printed circuit board 1.
Each printed circuit board 1 cut out from the master substrate 6 is pressed with reference to a plurality of (three in the present embodiment, three) outer cutting surfaces a, b, and c as a reference with reference to FIG. It is positioned and fixed to each assembly processing device (solder printing device, component mounting device, resin molding device) in a subsequent process.

  First, the printed circuit board 1 on which the circuit pattern is formed is carried into a solder printing apparatus, and the three cutting surfaces are pressed and positioned (step S301). Next, cream solder is printed on the printed circuit board 1 at a position of a predetermined opening formed in a single solder printing mask (metal mask) (not shown). Based on the position of the outline processing recognition mark 2 of the printed circuit board 1 positioned in the solder printing apparatus, the position of the solder printing mask is adjusted (step S302). The solder printing mask has an opening for solder printing on a circuit pattern (land), and an opening for alignment at the position of the outline processing recognition mark 2.

  Next, the solder printing apparatus prints and applies cream solder onto the electrode pads of the circuit pattern formed on the printed circuit board 1 (step S303), discharges the printed circuit board 1, and ends the solder printing process.

  Subsequently, the printed circuit board 1 is carried into a component mounting apparatus (mounter), and similarly, three cutting surfaces are pressed and positioned (step S304). Bonds are applied to the surface of the printed circuit board 1 (step S305), and each surface component 5 is mounted on the solder printed printed circuit board 1 using a component mounting apparatus (step S306).

  Then, the printed circuit board 1 with the surface component 5 mounted thereon is obtained, the cream solder is heated and melted in a reflow furnace, and the surface component 5 is soldered and fixed to the electrode pad of the printed circuit board 1 (step S307). The printed circuit board 1 on which the surface component 5 is mounted is discharged, and the component mounting process ends.

  Further, when a semiconductor element without a package (for example, a bare chip IC, FET, etc.) is mounted on the printed circuit board 1, the printed circuit board 1 is limited to these semiconductor elements after wire bonding, It is carried into the resin mold device, and the three cut surfaces are pressed and positioned (step S308).

  And the junction part of a semiconductor element and a gold wire is sealed with an epoxy resin (step S309), the printed circuit board 1 is discharged | emitted, and a resin molding process is complete | finished. Thus, the surface component mounting process is completed.

  Next, the operation and effect of the method for manufacturing the printed circuit board 1 according to the present embodiment configured as described above will be described.

  According to the above configuration, a predetermined hole is provided as the outline processing reference mark 2 at the same position as the reference position of the circuit pattern provided on the printed circuit board 1, and the outline processing reference mark 2 is formed on the outline processing reference mark 2 using the substrate outline processing machine. Based on this, the outer shape of the printed circuit board 1 is cut, and each printed circuit board 1 is cut out. Then, the printed circuit board 1 is positioned and fixed to the apparatus for each process of solder printing, component mounting, and resin molding with reference to the plurality of (three in this embodiment) cutting surfaces a, b, and c. At this time, each apparatus has two positioning jigs (chucks), and the first and second positioning jigs 3 and 4 are arranged so that the printed circuit board 1 placed at a position shifted from the reference position is 3. Press on the surface. At this time, since there is no center of gravity of the printed circuit board 1 in the direction (on the line of action) in which the resultant force of the first positioning jig 3 acts, the printed circuit board 1 rotates.

  Thereby, since the outer shape of the printed circuit board 1 is formed with respect to the reference position of the circuit pattern, the cutting surface can be formed with high accuracy, and the cutting surface having a plurality of outer shapes can be used as a reference for positioning. . As a result, the printed circuit board 1 can be mechanically accurately positioned on the apparatus in each process.

  In addition, since the resultant force of the first positioning jig 3 and the second positioning jig 4 is balanced, the first and second positioning jigs 3 and 4 press the printed circuit board 1. During this time, a moment of rotational force is generated in the printed circuit board 1 and it is rotated. Therefore, the positional displacement of the printed circuit board is corrected by fixing the first and second positioning jigs 3 and 4, and the printed circuit board 1 is accurately positioned. Can do.

  Furthermore, according to the present invention, the printed circuit board 1 can be positioned in the assembly processing apparatus in each process with reference to the machined surface cut with high precision, so that there is no need for an arithmetic processing apparatus by image recognition for detecting a recognition mark. It is. As a result, the printed circuit board 1 can be mechanically accurately positioned and the manufacturing cost can be reduced.

  As described above, according to the present embodiment, it is possible to provide a printed circuit board manufacturing method capable of accurately positioning a printed circuit board that has been cut and processed on a printed circuit board mounting apparatus and mounting surface components at low cost.

  Although one embodiment according to the present invention has been described above, the present invention can also be implemented in other forms.

In the above embodiment, the hole formed in the printed circuit board 1 is used as the outline processing reference mark 2. However, the present invention is not limited to this, and the reference mark stamping or printing is provided on the printed circuit board 1 according to the substrate outline processing machine. May be good.
In the above-described embodiment, the first positioning jig 3 is described as having the V-shaped contact portion 8 formed thereon. However, the present invention is not limited to this, and a pair of cylinders, prisms, or the like is the contact portion. It may be provided in.

In the above embodiment, the second positioning jig 4 abuts on two planes at the lower end portion of the printed circuit board 1, but is not limited thereto, and may abut on only one point.
Further, the printed board 1 has a shape composed of an arc and a straight line, but when the printed board 1 has a disk shape, the second positioning jig 4 has a contact portion 9 having the same opening angle as the first positioning jig 3. It may be abutted at two points.
Further, although the second positioning jig 4 is fixed, it may be configured to be movable in the same manner as the first positioning jig 3.

  In the component mounting appearance inspection after the reflow heat treatment, the mounting state of the mounted printed circuit board 1 is inspected, and the printed circuit board 1 can be positioned and fixed by the same method as in the above embodiment. .

1: Printed circuit board, 2: External processing reference mark, 3: First positioning jig, 4: Second positioning jig, 5: Surface component (electronic component), 6: Master substrate, 7: Circuit pattern reference position , 8, 9: contact part,
a, b, c: Cutting surface

Claims (2)

A printed circuit board,
A circuit pattern for mounting a surface component on the printed circuit board;
A circuit pattern reference position for determining the position of the circuit pattern and positioning the printed circuit board;
An outer shape processing reference mark provided at the same position as the circuit pattern reference position,
A printed circuit board manufacturing method comprising cutting an outer shape of the printed circuit board based on the outer shape processing reference mark. In the manufacturing method of the printed circuit board of Claim 1,
A printing step of printing solder on the circuit pattern;
A mounting step of mounting the surface component;
A molding step of molding the joint portion of the surface component with a resin,
In the three steps, at least two positioning jigs are configured to be swingable so as to press the plurality of cutting surfaces of the printed board, and a resultant force of one of the positioning jigs pressing the printed board is A method for manufacturing a printed circuit board, wherein the printed circuit board is formed so as to be balanced with the other resultant force of the positioning jig pressed by the printed circuit board.

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