JP2014006482A - Substrate for display device, and display device having the same - Google Patents

Abstract

An object of the present invention is to detect a substrate that may cause a short circuit in a display wiring line due to a foreign substance, and to prevent occurrence of defects in the market due to this.
A power supply wiring (23Vgh) provided on a base substrate (21), an insulating film (24) covering the power supply wiring (23Vgh), and a power supply wiring (23Vgh) in plan view on the insulating film (24) Inspection wiring (29) provided along the power supply wiring (23Vgh) in a region overlapping with the power supply wiring (23Vgh), a first terminal (27) electrically connected to the power supply wiring (23Vgh), and inspection wiring (29) And a second terminal (29t) electrically connected to the terminal.
[Selection] Figure 4

Description

  The present invention relates to a display device substrate and a display device including the same, and more particularly to a technique for inspecting a wiring short circuit caused by a remaining foreign matter.

  Liquid crystal display devices using thin film transistors (TFTs) are displays such as personal computers, mobile phones, and television receivers as thin, lightweight, low power consumption, high-quality image displays. Has been widely adopted.

  In general, a liquid crystal display device includes a liquid crystal display panel in which a liquid crystal layer is sealed between a TFT substrate and a counter substrate which are arranged to face each other. The TFT substrate is provided with a TFT and a pixel electrode for each pixel constituting the display area. On the counter substrate, a common electrode is provided in a region facing the group of pixel electrodes.

  A connection region in which the TFT substrate protrudes from the counter substrate is provided on the outer peripheral edge of the liquid crystal display panel. In this connection region, a plurality of gate drivers TCP (Tape Carrier Package) on which gate driver integrated circuit (IC) chips are mounted and source drivers TCP on which source driver IC chips are mounted along the periphery of the panel. Are connected. These two drivers TCP are connected to an external circuit board, and their driving is controlled by a control circuit on the circuit board.

  As such a liquid crystal display device, there is a so-called gate substrate-less type liquid crystal display device in which the gate driver TCP is not directly connected to an external circuit board in order to reduce the number of wirings and reduce the cost and component cost for mounting. It is known (see, for example, Patent Document 1).

  This gate substrate-less type liquid crystal display device employs a so-called signal transmission method in which a signal or the like input to one gate driver TCP is sequentially transmitted to adjacent gate drivers TCP. A gate driver driving wiring for connecting the two is formed on the TFT substrate in a state of being covered with an insulating film except for its terminals.

JP 2006-343540 A

  By the way, in the process of manufacturing the TFT substrate, when the gate driver driving wiring is formed, if relatively large conductive foreign matter such as metal powder generated from the movable part of the manufacturing apparatus adheres to the wiring, Even with an insulating film formed so as to cover the surface, the foreign material may not be covered, and the foreign material may remain protruding from the substrate surface.

  In such a liquid crystal display device in which a TFT substrate in which foreign matter remains is incorporated, the distance to the common electrode at the foreign matter remaining portion is narrowed by the amount of foreign matter protruding, so when subjected to physical stress in the market The foreign matter and the common electrode are likely to come into contact with each other.

  Among the gate driver driving wirings, in particular, the power source wiring for driving the gate driver IC is generally driven by a high potential direct current. Therefore, when foreign matter adheres to the power source wiring, the foreign matter, the common electrode, May cause overcurrent to flow between the power supply wiring and the common electrode and generate heat, resulting in high temperatures in the vicinity of these contact parts, and serious defects such as burning of the polarizing plate may occur in the market. is there.

  The present invention has been made in view of such points, and the object of the present invention is to detect a display device substrate that may cause a short circuit in the display wiring due to the remaining foreign matter, and in the market caused by this. The purpose is to prevent the occurrence of defects.

  In order to achieve the above object, according to the present invention, there is provided an inspection pattern for inspecting whether or not a conductive foreign matter exists on a display wiring and the foreign matter protrudes from an insulating film covering the wiring. It was decided to provide a new one.

  Specifically, the present invention is directed to a display device substrate such as a TFT substrate and a display device including the same, and the following solution is taken.

That is, the first invention is a substrate for a display device,
A base substrate having a connection region connected to an external circuit;
Display wiring provided on the base substrate;
An insulating film covering the display wiring;
A conductive layer that is provided along the display wiring in a region overlapping the display wiring in a plan view on the insulating film, and is electrically disconnected from the external circuit;
A first terminal provided in the connection region and electrically connected to the display wiring;
And a second terminal provided in the connection region and electrically connected to the conductive layer.

  Here, “plan view” means viewing in the thickness direction of the base substrate.

  According to the first aspect of the present invention, only by measuring the electrical resistance between the first terminal and the second terminal, there is a conductive foreign substance on the display wiring, and the foreign substance is removed from the insulating film covering the wiring. It can be inspected whether or not it sticks out.

  In other words, there is no conductive foreign matter on the display wiring during the manufacturing process, or even if it is attached, the foreign matter is buried in the insulating film that covers the wiring and does not cause defects in the market. Since the display wiring and the conductive layer are insulative, the predetermined distance between the first terminal and the second terminal electrically connected to the display wiring and the conductive layer is determined. The insulation resistance value is measured. On the other hand, if conductive foreign matter adheres to the display wiring during the manufacturing process and the foreign matter protrudes from the insulating film covering the wiring and remains in a state that causes defects in the market, Since the display wiring and the conductive layer are short-circuited through the foreign matter, an electrical resistance value having a relatively low conduction level between the first terminal and the second terminal electrically connected to the display wiring and the conductive layer. Is measured.

  As described above, since the electrical resistance value measured between the first terminal and the second terminal differs depending on the presence or absence of foreign matter on the display wiring and the remaining state thereof, the electrical resistance value measured between these two terminals. Based on the above, it is possible to inspect whether or not a conductive foreign matter exists on the display wiring and the foreign matter protrudes from the insulating film covering the wiring. As a result, it is possible to detect the display device substrate that may cause a short circuit in the display wiring due to the remaining foreign matter, and prevent the occurrence of defects in the market due to this.

  In the first invention, since both the first terminal and the second terminal are provided in the connection region connected to the external circuit, the display device substrate according to the present invention is bonded to the counter substrate for display. When the device is configured, the inspection process for measuring the electrical resistance between these two terminals can be performed even after the display device substrate and the counter substrate are bonded together.

  Therefore, a defect inspection having a higher probability of occurrence than a short circuit of the display wiring due to the remaining foreign matter, for example, a defect inspection such as a point defect due to a TFT defect, is performed first, and then the electrical connection between the first terminal and the second terminal is performed. An inspection process for measuring resistance can be performed. Thereby, the test | inspection efficiency of the board | substrate for display apparatuses can be improved.

The second invention is the display device substrate of the first invention, wherein:
The conductive layer, the first terminal, and the second terminal are inspected for a short circuit between the display wiring and the conductive layer by measuring an electrical resistance between the first terminal and the second terminal. It is characterized in that an inspection pattern is formed.

  According to the second invention, the operational effects of the first invention are specifically exhibited.

  The conductive layer, the first terminal, and the second terminal are not configured exclusively for the inspection pattern, but are configured to be used for other purposes such as a conductive pattern that functions as an electromagnetic shield for protecting the display wiring. May be.

A third invention is a substrate for a display device according to the first or second invention,
In the connection area, a plurality of printed circuit boards having driver ICs as the external circuit are connected side by side,
The display wiring is a driver driving wiring for electrically connecting the printed circuit boards to each other.

  In the third invention, the display wiring is a driver driving wiring. The driver driving wiring is wiring formed on a so-called source substrate-less type or gate substrate-less type display device substrate that does not connect a printed circuit board including a source driver to an external circuit board. In particular, since the power supply wiring for driving the driver IC is generally driven by a high potential direct current, if the power supply wiring is short-circuited to another conductor via a foreign substance, a serious defect occurs in the market. There is a fear.

  On the other hand, according to the present invention, it is possible to inspect the short circuit of the wiring due to the remaining foreign matter with the driver driving wiring as an inspection target, so that a board that may cause the driver driving wiring to be short-circuited is detected and the market resulting therefrom It is possible to prevent the occurrence of serious defects in the case.

4th invention is the board | substrate for display apparatuses of 1st or 2nd invention,
The display wiring is a plurality of gate wirings extending in parallel with each other,
The first terminal is provided for each predetermined number of the gate wirings and is electrically connected to the predetermined number of gate wirings.
The conductive layer is provided for each gate wiring,
The second terminal is provided for each of the predetermined number of conductive layers extending in a region overlapping each gate wiring to which the first terminal is electrically connected, and is electrically connected to the predetermined number of conductive layers. It is characterized by that.

  According to the fourth aspect of the present invention, the gate wiring can be inspected for a short circuit of the wiring due to the remaining foreign matter. Therefore, a display device substrate that may cause the gate wiring to be short-circuited is detected, and a defect in the market due to this is detected. Can be prevented in advance.

  In the fourth invention, the conductive layer, the first terminal, and the second terminal are provided for each predetermined number of gate wirings, and a short circuit of the gate wiring can be inspected in a predetermined number unit. Compared with the case where the conductive layer, the first terminal, and the second terminal are provided, the short-circuit inspection of the gate wiring can be efficiently performed.

  In addition, according to the fourth aspect of the present invention, since it is possible to determine in units of a predetermined number whether or not there is a possibility that the gate wiring may be short-circuited due to remaining foreign matter, the gate wiring having such a possibility may be determined as a specific gate wiring group, that is, It is possible to narrow down to a predetermined number of levels, and when repairing the foreign matter remaining part of the gate wiring, the repair work of the repaired part can be efficiently performed.

A fifth invention is the display device substrate of the first or second invention,
The display wiring is a plurality of auxiliary capacitance wirings extending in parallel with each other, and each of the display wirings is electrically connected to the same first terminal,
The conductive layer is provided for each of the display wirings and is electrically connected to the same second terminal.

  In the fifth aspect of the present invention, the short circuit of the wiring due to the remaining foreign matter can be inspected with the auxiliary capacity wiring as the inspection target, so that the display device substrate that may cause the short circuit of the auxiliary capacity wiring is detected, and this is caused in the market. It is possible to prevent the occurrence of defects.

A sixth invention is the display device substrate according to any one of the first to fifth inventions,
The conductive layer is formed to have the same width as or wider than the display wiring and covers the display wiring over the entire width direction through the insulating film.

  In the sixth aspect of the invention, since the conductive layer covers the entire width direction of the display wiring via the insulating film, when foreign matter remains on the display wiring and protrudes from the insulating film, The foreign matter can be reliably brought into contact with the conductive layer. Therefore, it is possible to reliably detect the display device substrate that may cause a short circuit due to the remaining foreign matter.

A seventh invention is the display device substrate according to any one of the first to sixth inventions,
The conductive layer is made of a transparent conductive material.

  In the seventh aspect of the invention, since the conductive layer has transparency, the display device substrate according to the present invention is bonded to the counter substrate via a photo-curing type or light and heat combined curing type sealing material. Even in the case of the configuration, it is possible to avoid the conductive layer from causing light irradiation to the sealing material when the sealing material is cured and causing the sealing material to be hardened.

The eighth invention is the display device substrate according to any one of the first to seventh inventions,
A plurality of pixel electrodes arranged in a matrix;
The conductive layer and the second terminal are formed of the same film as the pixel electrode.

  In the eighth invention, since the conductive layer and the second terminal are formed of the same film as the existing pixel electrode, an independent film forming step and the film forming step for forming the conductive layer and the second terminal are provided. The conductive layer and the second terminal can be formed without increasing the number of steps without adding a patterning step of patterning the conductive film formed by the above.

A ninth invention is a display device,
A substrate for a display device according to any one of the first to eighth inventions;
A counter substrate disposed to face the display device substrate;
A display medium layer provided between the display device substrate and the counter substrate;
An electrode is formed in a region of the counter substrate facing the display wiring.

  According to the ninth invention, the display device substrates of the first to eighth inventions have an excellent characteristic that it is possible to detect whether or not there is a risk of short-circuiting the display wiring due to residual foreign matter. Therefore, it is possible to prevent the occurrence of defects in the market due to electrical contact between the display wiring when a physical stress is applied and the electrode formed on the counter substrate facing the display wiring.

The tenth invention is the display device of the ninth invention,
A display area for displaying an image and a non-display area located outside the display area;
The laminated structure of the display wiring, the insulating film, and the conductive layer is formed in the non-display region.

  According to the tenth aspect of the present invention, it is possible to inspect a wiring short circuit due to the remaining foreign matter, with the display wiring formed in the non-display area as an inspection target.

The eleventh invention is the display device of the ninth or tenth invention,
The display medium layer is a liquid crystal layer.

  In the eleventh aspect of the invention, a liquid crystal display device including a liquid crystal layer as a display medium layer is configured. Also in this liquid crystal display device, the effects of the first invention are effectively exhibited.

  According to the present invention, the conductive layer provided along the display wiring in a region overlapping the display wiring in a plan view on the insulating film covering the display wiring, and the first electrically connected to the display wiring. There is one terminal and a second terminal electrically connected to the conductive layer, and only by measuring the electrical resistance between the first terminal and the second terminal, there is a conductive foreign matter on the display wiring. In addition, it is possible to inspect whether the foreign matter protrudes from the insulating film covering the wiring. As a result, it is possible to detect a substrate that may cause a wiring short circuit due to the remaining foreign matter, and to prevent occurrence of defects in the market due to this.

FIG. 1 is a plan view illustrating a schematic configuration of the liquid crystal display device according to the first embodiment. FIG. 2 is a cross-sectional view showing a cross-sectional structure taken along the line II-II in FIG. FIG. 3 is a plan view showing a routing configuration of the gate driver driving wiring of the liquid crystal display panel according to the first embodiment. FIG. 4 is an enlarged plan view illustrating a terminal portion in the configuration of the inspection pattern according to the first embodiment. FIG. 5 is a cross-sectional view showing a cross-sectional structure of a portion corresponding to the power supply wiring for driving the gate driver IC in the liquid crystal display panel according to the first embodiment. FIG. 6 is a cross-sectional view showing a cross-sectional structure of a portion corresponding to the wiring when a foreign object remains on the power supply wiring for driving the gate driver IC in the liquid crystal display panel according to the first embodiment. FIG. 7 is a plan view showing a lead wiring configuration of the liquid crystal display panel according to the second embodiment. FIG. 8 is an enlarged plan view showing a terminal portion in the configuration of the inspection pattern according to the second embodiment. FIG. 9 is a plan view showing a configuration for drawing out the auxiliary capacity wiring of the liquid crystal display panel according to the third embodiment. FIG. 10 is an enlarged plan view illustrating a terminal portion in the configuration of the test pattern according to the third embodiment. FIG. 11A is a cross-sectional view showing a cross-sectional structure of a portion corresponding to the wiring when a foreign substance remains on a gate driver driving wiring in a liquid crystal display device having a conventional configuration. FIG. 11B is a cross-sectional view showing a cross-sectional structure of a portion corresponding to a gate driver driving wiring showing a state when a foreign matter remaining portion is subjected to physical stress in a liquid crystal display device having a conventional configuration.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments.

Embodiment 1 of the Invention
In Embodiment 1, a liquid crystal display device S that displays an image by modulating light using a liquid crystal composition will be described as an example of a display device according to the present invention.

  FIG. 1 is a plan view showing a schematic configuration of the liquid crystal display device S. FIG. FIG. 2 is a cross-sectional view showing a cross-sectional structure taken along the line II-II in FIG. 1, illustration of the polarizing plate 17 on the counter substrate 40 shown in FIG. 2 is omitted.

  The liquid crystal display device S of this embodiment is used as a display of an OA (Office Automation) device such as a television receiver or a personal computer, or a portable information terminal such as a smartphone.

-Configuration of liquid crystal display device S-
As shown in FIGS. 1 and 2, the liquid crystal display device S is of a gate substrate-less type, and includes a liquid crystal display panel 10 and a printed circuit board mounted on the surface of the substrate 20 constituting the liquid crystal display panel 10. A plurality of (three in the example shown in FIG. 1) gate driver TCP50 and source driver TCP60, and an external circuit board 70 to which each source driver TCP60 is directly connected. S does not include an external circuit board to which the gate driver TCP50 is directly connected.

  In addition, when the liquid crystal display device S is a transmissive or semi-transmissive liquid crystal display device (also referred to as a reflection / transmission type), the liquid crystal display device S is disposed on the back side of the liquid crystal display panel 10. A backlight unit (not shown) as a planar light source device configured to emit planar light to the 10 side is further provided.

<Configuration of Liquid Crystal Display Panel 10>
The liquid crystal display panel 10 includes a TFT substrate 20 and a counter substrate 40 which are formed, for example, in a rectangular shape and are opposed to each other, and the outer peripheral edges of both the substrates 20, 40 are, for example, a rectangular frame-shaped sealing material. 11, and a liquid crystal layer 13 is sealed as a display medium layer in a space formed inside the sealing material 11 between the TFT substrate 20 and the counter substrate 40.

  Alignment films (not shown) are provided on the inner surfaces of the TFT substrate 20 and the counter substrate 40 facing each other. Further, as shown in FIG. 2, polarizing plates 15 and 17 having light transmission axes different from each other by 90 ° are provided on the outer surfaces of both the substrates 20 and 40, respectively. The sealing material 11 is made of, for example, a photo-curing type resin including an epoxy resin or the like, and a light and heat combined curing type resin. The liquid crystal layer 13 is made of, for example, a nematic liquid crystal composition having electro-optical characteristics.

  The liquid crystal display panel 10 is an area where the TFT substrate 20 and the counter substrate 40 overlap and is an inner area of the sealing material 11, that is, an area where the liquid crystal layer 13 is provided. 1) (hatched area 1) 10D. Although not shown, the display area 10D includes a plurality of pixels that are the minimum unit for image display arranged in a matrix.

  In addition, the liquid crystal display panel 10 includes a frame region 10F having a rectangular frame shape, for example, which is a non-display region, around the display region 10D. Then, on the two adjacent sides (the upper side and the right side in FIG. 1) of the frame region 10F, a connection region 10T in which the TFT substrate 20 partially protrudes from the counter substrate 40 and the surface of the counter substrate 40 is exposed. Is provided.

<Configuration of TFT substrate 20>
The TFT substrate 20 is formed to be slightly larger than the counter substrate 40 by the amount constituting the connection region 10T. The TFT substrate 20 includes a base substrate 21 having transparency such as a glass substrate, and a display device substrate having a laminated structure 22 including various wirings and elements formed by laminating thin films on the base substrate 21. It is.

  Although not shown, a large number of gate lines and source lines are formed in the display region 10D of the TFT substrate 20 so as to intersect with each other via a gate insulating film. These two wirings are provided so as to form a lattice shape as a whole, and partition each pixel.

  Further, in the display area 10 </ b> D of the TFT substrate 20, auxiliary capacitance lines extending along the individual gate lines are formed. Each auxiliary capacitance line is formed of the same film as the gate line, and extends across a plurality of pixels aligned along the corresponding gate line so as to cross the central portion of each pixel, for example.

  The TFT substrate 20 includes, for each pixel, a TFT connected to the corresponding gate wiring and source wiring, a pixel electrode connected to the drain electrode of the TFT, and an auxiliary capacitance element.

  The TFT and the auxiliary capacitance element are covered with an interlayer insulating film. The pixel electrodes are arranged in a matrix on the interlayer insulating film and are made of a transparent conductive material such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide). Each of these pixel electrodes is electrically connected to a drain electrode of a TFT provided in the same pixel through a contact hole formed in the interlayer insulating film.

  The auxiliary capacitive element has a structure in which a lower electrode and an upper electrode face each other with a dielectric layer interposed therebetween. The lower electrode is constituted by a part of the auxiliary capacitance wiring. The upper electrode is formed from the same film as the drain electrode of the TFT provided in the same pixel, and is configured integrally with the drain electrode. The dielectric layer is composed of a film common to the gate insulating film interposed at the intersection of the gate wiring and the source wiring.

  FIG. 3 is a plan view showing a routing configuration of the gate driver driving wiring 23 to be inspected in the present embodiment.

  In the frame region 10F of the TFT substrate 20, as shown in FIG. 3, the gate driver TCP50, the source driver TCP60, and the adjacent gate drivers TCP50 adjacent to each other across the corner of the connection region 10T are arranged as display wirings. Gate driver driving wirings 23 for electrical connection are provided.

  One source driver TCP60 close to the gate driver TCP50 and a plurality of gate drivers TCP50 are connected in series by a gate driver driving wiring 23, and display control signals input via the source driver TCP60 are adjacent to each other. The data is sequentially transmitted to the gate driver TCP 50 by a relay method.

  Examples of the gate driver driving wiring 23 include a clock signal wiring, a start pulse signal wiring, and the like, in addition to the power source wiring 23Vgh for driving the gate driver IC 52.

  Each gate driver driving wiring 23 is routed between portions where the driver TCPs 50 and 60 are connected in the connection region 10T so as to pass through the inner region of the sealing material 11, that is, the region where the liquid crystal layer 13 is provided. The entire pattern is formed in the frame region 10F. Each of these gate driver driving wirings 23 is formed of the same film as the gate wiring, and is covered with a laminated insulating film 24 (shown in FIG. 5 referred later) in which the gate insulating film and the interlayer insulating film are laminated. It has been broken.

  Terminals (not shown) for connecting to the gate driver TCP 50 or the source driver TCP 60 are provided at both ends of each gate driver driving wiring 23 located at the edge of the substrate 20. The terminal of each of these gate driver driving wirings 23 has a structure in which the tip of the wiring 23 is connected to a connection terminal pad provided on the insulating film 24 through a contact hole formed in the laminated insulating film 24. Have.

  In addition, although not shown, the gate wiring, the source wiring, and the auxiliary capacitance wiring are drawn from the display area 10D to the connection area 10T in the frame area 10F of the TFT substrate 20. Terminals for connection to the gate driver TCP 50 or the source driver TCP 60 are provided in alignment along the edge of the substrate 20 at the leading end of the various wirings positioned at the edge of the substrate 20.

<Configuration of counter substrate 40>
As shown in FIG. 2, the counter substrate 40 includes a transparent base substrate 41 such as a glass substrate, and a black matrix 43, a color filter 44, and a common electrode 45 are stacked on the base substrate 41. Color filter substrate.

  The black matrix 43 includes a frame portion 43f located at the outer peripheral edge portion of the base substrate 41, and a lattice portion (not shown) corresponding to the gate wiring and the source wiring inside the frame portion 43f. The color filter 44 includes a plurality of color filter layers, for example, a red layer, a green layer, and a blue layer, which are provided so as to be periodically arranged between the lattices of the black matrix (lattice portion) 43. The common electrode 45 is provided so as to cover the color filters 44 and to face the group of pixel electrodes.

  The frame portion 43f of the black matrix 43 is formed in a region corresponding to the sealing material 11 so as to be wider than the sealing material 11, and each frame region 43f is located in an inner region (region where the liquid crystal layer 13 is provided) of the sealing material 11. The gate driver driving wiring 23 is provided so as to overlap the entire portion. The common electrode 45 is also formed on the frame portion 43 f of the black matrix 43 and is also disposed in a region facing the gate driver driving wiring 23.

<Configuration of Gate Driver TCP50 / Source Driver TCP60>
The plurality of gate drivers TCP50 are connected side by side along the edge of the substrate 20 on one side (the right side in FIG. 1) of the connection region 10T. Each gate driver TCP 50 is an electronic component in which a gate driver IC 52 as an external circuit is mounted on a flexible printed wiring board 51 on which a wiring pattern is formed by a TAB (Tape Automated Bonding) mounting method.

  The gate driver IC 52 is configured to supply a gate signal line-sequentially to each gate wiring by driving. Each gate driver TCP 50 is electrically connected to an external circuit board 70 via a source driver TCP 60 by a gate driver drive wiring 23 formed on the TFT substrate 20, and a display transmitted from the external circuit board 70. It is driven based on the control signal.

  The plurality of source drivers TCP60 are connected side by side along the edge of the substrate 20 on the other side (upper side in FIG. 1) of the connection region 10T. Each source driver TCP 60 is an electronic component in which a source driver IC 62 as an external circuit is mounted on a flexible printed wiring board 61 on which a wiring pattern is formed by a TAB mounting method.

  The source driver IC 62 is configured to supply source signals to the source lines all at once by driving. Each source driver TCP 60 is directly connected to the external circuit board 70 and is driven based on a display control signal transmitted from the external circuit board 70.

<Operation of the liquid crystal display device S>
In the liquid crystal display device S configured as described above, in each pixel, a gate signal is sent from the gate driver TCP50 to the TFT via the gate wiring, and when the TFT is turned on, the source signal is sent from the source driver TCP60 to the source wiring. To the on-state TFT, a predetermined charge is written to the pixel electrode via the TFT, and the auxiliary capacitance element is charged. At this time, a potential difference is generated between each pixel electrode of the TFT substrate 20 and the common electrode 45 of the counter substrate 40, and a predetermined voltage is applied to the liquid crystal layer 13. In the liquid crystal display device S, by controlling the magnitude of the voltage applied to the liquid crystal layer 13 for each pixel and changing the alignment state of the liquid crystal molecules, the light transmittance in the liquid crystal layer 13 is adjusted, and the image is displayed. Is displayed.

<Configuration of Inspection Pattern 25>
FIG. 4 is an enlarged plan view showing the terminal portion and its periphery (region indicated by reference symbol A in FIG. 3) in the configuration of the test pattern 25 in the present embodiment. FIG. 5 is a cross-sectional view showing a cross-sectional structure of a portion corresponding to the power supply wiring 23Vgh for driving the gate driver IC 52 in the gate driver driving wiring 23. As shown in FIG.

  The test pattern 25 shown in FIGS. 4 and 5 is formed in the frame region 10F of the liquid crystal display panel 10 in the present embodiment. The inspection pattern 25 is provided for each pattern of the independent gate driver driving wiring 23.

  Each inspection pattern 25 is electrically connected to the first terminal 27 electrically connected to the power supply wiring 23Vgh for driving the gate driver IC 52, the inspection wiring 29 which is a conductive layer, and the inspection wiring 29. The second terminal 29t is configured to be capable of inspecting whether or not there is a short circuit between the power supply wiring 23Vgh for driving the gate driver IC 52 and the inspection wiring 29.

  The first terminal 27 is provided in the connection region 10T and is disposed slightly inside the substrate 20 than the terminal for connecting the gate driver TCP50 in the power supply wiring 23Vgh for driving the gate driver IC52. As shown in FIG. 4, the power supply wiring 23Vgh for driving the gate driver IC 52 has a branch line 23b extending from the power supply wiring 23Vgh to the side. The first terminal 27 is constituted by a connection terminal pad 27 formed on the laminated insulating film 24 so as to be wider than the branch line 23 b, and the front end of the branched line 23 b is formed through a contact hole 24 h formed in the laminated insulating film 24. 23t.

  As shown in FIGS. 4 and 5, the inspection wiring 29 is provided on the laminated insulating film 24 so as to extend along the power supply wiring 23Vgh in a region overlapping the power supply wiring 23Vgh for driving the gate driver in plan view. ing. Here, “plan view” means viewing in the thickness direction of the base substrate 21. This is the same in the following embodiments.

  The inspection wiring 29 is provided over the substantially entire length of the power supply wiring 23Vgh corresponding to the power supply wiring 23Vgh for driving the gate driver IC 52 in the laminated insulating film 24. The inspection wiring 29 is formed to be slightly wider than the power supply wiring 23Vgh and covers the power supply wiring 23Vgh across the entire width direction with the laminated insulating film 24 interposed therebetween.

  The inspection wiring 29 is not electrically connected to the power supply wiring 23Vgh for driving the gate driver and to other display wiring (gate wiring, source wiring, auxiliary capacitance wiring), TFT, and the like. Thus, it is electrically independent on the TFT substrate 20. Further, the inspection wiring 29 is not electrically connected to the gate driver TCP50 and the source driver TCP60.

  As shown in FIG. 4, the second terminal 29 t is provided side by side with the first terminal 27 in the connection region 10 </ b> T outside the region corresponding to the power supply wiring 23 </ b> Vgh for driving the gate driver IC 52 on the stacked insulating film 24. The inspection wiring 29 has an extending portion 29e extending along the branch line 23b on the side of the inspection wiring 29 in the connection region 10T. The second terminal 29t is integrally connected to the tip of the extending portion 29e, and is constituted by a connection terminal pad 29t formed wider than the extending portion 29e.

  The first terminal 27, the inspection wiring 29, and the second terminal 29t are made of a transparent conductive material such as ITO or IZO, and are formed of the same film as the pixel electrode.

  FIG. 6 is a cross-sectional view showing a cross-sectional structure of a portion corresponding to the wiring 23Vgh when the foreign object X remains on the power supply wiring 23Vgh for driving the gate driver IC 52. FIG. 11A is a cross-sectional view showing a cross-sectional structure of a portion corresponding to the wiring 23Vgh when the foreign substance X remains on the power supply wiring 23Vgh for driving the gate driver IC 52 in the liquid crystal display device S having a conventional configuration. FIG. 11B is a cross-sectional view showing a cross-sectional structure of a portion corresponding to the power supply wiring 23Vgh for driving the gate driver IC 52 in a liquid crystal display device S having a conventional configuration, showing a state when the remaining portion of the foreign matter X receives physical stress. It is. In FIGS. 11A and 11B, for the sake of convenience, the same reference numerals as those of the liquid crystal display device S of the present embodiment are given to portions corresponding to the respective constituent elements in the liquid crystal display device S of the present embodiment. .

  If the test pattern 25 is used, the electrical resistance between the first terminal 27 and the second terminal 29t is measured in the manufacturing process of the liquid crystal display device S, and the conductive pattern is electrically connected to the power supply wiring 23Vgh for driving the gate driver IC 52. It is possible to inspect whether or not the alien substance X adheres and remains in a state that causes a defect in the market.

  That is, the conductive foreign matter X does not adhere to the power supply wiring 23Vgh for driving the gate driver IC 52 in the manufacturing process, or even if it adheres, the foreign matter X is buried in the laminated insulating film 24 covering the power supply wiring 23Vgh. If the power supply wiring 23Vgh for driving the gate driver IC 52 and the inspection wiring 29 are in an insulated state when they remain in a state that does not cause defects in the market, these wirings 23Vgh, 29 A predetermined insulation resistance value is measured between the first terminal 27 and the second terminal 29t that are electrically connected to each other. On the other hand, as shown in FIG. 6, conductive foreign matter X adheres to the power supply wiring 23Vgh for driving the gate driver IC 52 in the manufacturing process, and the foreign matter X protrudes from the laminated insulating film 24 covering the power supply wiring 23Vgh. If the power source wiring 23Vgh for driving the gate driver IC 52 and the inspection wiring 29 are short-circuited through the foreign matter X, the wiring 23Vgh, 29 A relatively low electrical resistance value is measured between the first terminal 27 and the second terminal 29t that are electrically connected to each other.

  As described above, the measured electrical resistance value differs between the first terminal 27 and the second terminal 29t depending on the presence / absence of the foreign matter X on the power supply wiring 23Vgh for driving the gate driver IC 52 and the remaining state thereof. Based on the electrical resistance value measured between the elements 27 and 29t, the conductive foreign matter X is present on the power supply wiring 23Vgh for driving the gate driver IC 52, and the foreign matter X covers the power supply wiring 23Vgh. It can be inspected whether or not it sticks out.

  Since the liquid crystal display device S having the conventional configuration does not include the inspection pattern 25 and the short circuit inspection due to the foreign matter X remaining in the power supply wiring 23Vgh for driving the gate driver IC 52 cannot be performed, the liquid crystal display device S shown in FIG. Thus, even when the conductive foreign matter X remains on the power supply wiring 23Vgh in a state of protruding from the laminated insulating film 24, the liquid crystal display device S including such a TFT substrate 20 is distributed in the market as it is. Therefore, as shown in FIG. 11B, when the liquid crystal display panel 10 is subjected to physical stress in the market, the foreign matter X and the common electrode 45 are likely to come into contact with each other. Serious defects such as burning may occur in the market.

  On the other hand, the liquid crystal display device S of the present embodiment includes the inspection pattern 25 that can inspect the presence or absence of a short circuit between the power supply wiring 23Vgh for driving the gate driver IC 52 and the inspection wiring 29. The TFT substrate 20 or the liquid crystal display panel 10 including the TFT substrate 20 that may be short-circuited to the power source wiring 23Vgh for driving the gate driver IC 52 due to the remaining foreign matter X is detected, and the occurrence of defects in the market due to this is detected. Can be prevented.

-Manufacturing method of liquid crystal display device S-
In order to manufacture the liquid crystal display device S, first, the TFT substrate 20 and the counter substrate 40 are respectively produced.

  The TFT substrate 20 is formed on a base substrate 21 such as a glass substrate prepared in advance, and the above-described various wirings (gate wiring, source wiring, auxiliary capacitance wiring, gate driver driving wiring 23, inspection wiring 29, etc.) and their terminals. (First terminal 27, second terminal 29t, etc.), pixel electrode and various elements (auxiliary capacitor element, TFT), etc., a film forming process using photolithography and a film formed by the film forming process are patterned. It can be manufactured by forming by a well-known method of repeatedly performing the patterning step.

  At this time, the first terminal 27, the inspection wiring 29, and the second terminal 29t constituting the inspection pattern 25 are formed from the same film as the pixel electrode. Thereby, it is not necessary to add an independent film forming step and patterning step for forming the inspection pattern 25, and thus the inspection pattern 25 can be formed without increasing the number of steps.

  The counter substrate 40 can be manufactured by forming the black matrix 43, the color filter 44, and the common electrode 45 on a base substrate 41 such as a glass substrate prepared in advance by a well-known method using photolithography. it can.

  Next, after forming alignment films on the surfaces of the TFT substrate 20 and the counter substrate 40 by a printing method or the like, a rubbing process is performed as necessary. Thereafter, the sealing material 11 made of, for example, an ultraviolet curable resin or an ultraviolet and heat combined type curable resin is drawn in a frame shape on the surface of the TFT substrate 20 or the counter substrate 40 with a dispenser or the like. A predetermined amount of liquid crystal material is dropped on the inner region of the substrate.

  Then, after the TFT substrate 20 and the counter substrate 40 are bonded together under reduced pressure via the sealing material 11 and the liquid crystal material to form the liquid crystal layer 13, the bonded bonded body is released under atmospheric pressure, Pressurize the surface of the bonded body. Further, in this state, the sealing material 11 is cured by irradiating the sealing material 11 with ultraviolet rays from the TFT substrate 20 side, and then heating the sealing material 11 together with the bonded body as necessary.

  At this time, the inspection wiring 29 is formed at the corresponding portion of the sealing material 11 on the TFT substrate 20. However, since the inspection wiring 29 has transparency, it can block the irradiation of ultraviolet rays to the sealing material 11. In other words, the sealing material 11 does not cause a curing failure.

  Thus, the liquid crystal display panel 10 is manufactured by bonding the TFT substrate 20 and the counter substrate 40 together. Thereafter, polarizing plates 15 and 17 are attached to both surfaces of the liquid crystal display panel 10, that is, the outer surfaces of the TFT substrate 20 and the counter substrate 40, respectively.

  In the present embodiment, the liquid crystal material is dropped on the substrate on which the sealing material 11 is drawn before the TFT substrate 20 and the counter substrate 40 are bonded, so that the substrates 20 and 40 are bonded to each other. The liquid crystal display panel 10 is manufactured by a so-called drop drop method (ODF) in which a liquid crystal material is filled in a space formed inside the sealing material 11. A sealing material is drawn in a substantially frame shape having a cut line at 40, and both substrates 20 and 40 are bonded via the sealing material to form a bonded body having void cells, and the sealing material is formed in the void cells of the bonded body. A liquid crystal material is injected from the inlet formed by the cut using a pressure difference caused by evacuation, and then the inlet is sealed with a sealing material. Nell 10 may be produced.

  Next, an inspection process is performed on the liquid crystal display panel 10. In this inspection process, first, a lighting display inspection for inspecting defects such as point defects due to TFT defects is performed, and then a power source for driving the gate driver IC 52 is used by using an inspection pattern 25 formed on the liquid crystal display panel 10. A short circuit inspection is performed to inspect whether or not the wiring 23Vgh is short-circuited with the inspection wiring 29.

  In this short circuit inspection, the electrical resistance between the first terminal 27 and the second terminal 29t formed in the connection region 10T of the liquid crystal display panel 10 is measured using a known electrical resistance measuring instrument, and the measured electrical resistance is measured. Based on the resistance value, the presence or absence of a short circuit in the power supply wiring 23Vgh for driving the gate driver IC 52 is inspected.

  Specifically, when the electrical resistance value measured between the first terminal 27 and the second terminal 29t is a predetermined insulation resistance value, the power supply wiring 23Vgh for driving the gate driver IC 52 and the inspection wiring 29 Is judged not to be short-circuited, and is stored in an acceptable product cassette and put into the next polarizing plate attaching step. On the other hand, when the electrical resistance value measured between these terminals 27 and 29t is a relatively low conduction level, it is determined that the power supply wiring 23Vgh for driving the gate driver IC 52 and the inspection wiring 29 are short-circuited. Then, it is stored in the correction target product cassette, and is put into a correction process for repairing the short circuit of the power supply wiring 23Vgh.

  About the liquid crystal display panel 10 thrown into the polarizing plate sticking process through the said inspection process, the polarizing plates 15 and 17 are stuck on both surfaces, respectively. Subsequently, an ACF is attached to the connection region 10T of the liquid crystal display panel 10 at the connection portion of the gate driver TCP50 and the source driver TCP60, and the gate driver TCP50 and the source driver TCP60 are connected by thermocompression bonding via the ACF. After that, the liquid crystal display device S is completed by combining the liquid crystal display panel 10 to which the drivers TCP 50 and 60 are connected with a backlight unit or the like as necessary.

  Here, after the liquid crystal display panel 10 is manufactured, the short circuit inspection is performed using the inspection pattern 25 formed on the TFT substrate 20, but not limited thereto, before the liquid crystal display panel 10 is manufactured, A short circuit inspection using the inspection pattern 25 may be performed on the TFT substrate 20.

-Effect of Embodiment 1-
According to the first embodiment, since the test pattern 25 capable of inspecting the presence / absence of a short circuit between the power supply wiring 23Vgh for driving the gate driver IC 52 and the test wiring 29 is provided, the power supply provided in the test pattern 25 The power supply wiring 23Vgh for driving the gate driver IC 52 can be obtained simply by measuring the electrical resistance between the first terminal 27 electrically connected to the wiring 23Vgh and the second terminal 29t electrically connected to the inspection wiring 29. It is possible to inspect whether or not the conductive foreign matter X is present and the foreign matter X protrudes from the laminated insulating film 24 covering the power supply wiring 23Vgh. As a result, the TFT substrate 20 or the liquid crystal display panel 10 including the TFT substrate 20 that may cause a short circuit in the power supply wiring 23Vgh for driving the gate driver IC 52 due to the remaining foreign matter X is detected, and this is caused in the market. It is possible to prevent the occurrence of defects.

<< Embodiment 2 of the Invention >>
FIG. 7 is a plan view showing a lead-out configuration of the gate wiring 31 of the liquid crystal display panel 10 according to the second embodiment. FIG. 8 is an enlarged plan view showing the terminal portion and its periphery (region indicated by reference numeral B in FIG. 7) in the configuration of the test pattern 25 according to the second embodiment.

  In each of the following embodiments, the configuration of the test pattern 25 is the same as that of the first embodiment except that the configuration of the test pattern 25 is different from that of the first embodiment. Only the relevant part will be described, and the same components will be left to the description of the first embodiment based on FIGS. 1 to 6 and the detailed description thereof will be omitted.

  In the first embodiment, the inspection pattern 25 is provided with the power supply wiring 23Vgh for driving each gate driver IC 52 as an inspection target. However, in the present embodiment, the inspection pattern 25 is provided with the gate wiring 31 as an inspection target. Is provided.

  As shown in FIG. 7, a plurality of gate wirings 31 are formed in the display region 10D of the TFT substrate 20 so as to extend in parallel with each other, and one end side (the right end side in FIG. 7) is led out to the connection region 10T. ing. A terminal (not shown) for connecting to the gate driver TCP 50 is provided at the leading end of each gate wiring 31.

  In the connection region 10T in the liquid crystal display panel 10 of the present embodiment, a gate connection line 33 extending in a direction intersecting with the gate wiring 31 is provided as shown in FIG. The gate connection line 33 is provided for each predetermined number of gate wirings 31, and the predetermined number of gate wirings 31 intersect with each other at a portion located slightly inward of the substrate 20 from the terminal of the wiring 31 and are integrally formed. Has been. As a result, the gate connection line 33 electrically connects a predetermined number of gate wirings 31 to each other to form an inspection unit wiring group 32.

  As shown in FIG. 8, the inspection pattern 25 of the present embodiment includes a first terminal 35, an inspection wiring 29, and a second terminal 29t, and is provided for each inspection unit wiring group 32 described above.

  The first terminal 35 is provided in the connection region 10 </ b> T and is connected to one end of the gate connection line 33. That is, the gate lines 31 constituting the inspection unit line group 32 are electrically connected to the same first terminal 35. The first terminal 35 is constituted by a connection terminal pad 35 formed on the laminated insulating film 24 so as to be wider than the gate connecting line 33, and the gate connecting line 33 is formed through a contact hole 24 h formed in the laminated insulating film 24. Is connected to one end 33t.

  The inspection wiring 29 is provided for each gate wiring 31 and is formed on the laminated insulating film 24 so as to extend along the gate wiring 31 in a region overlapping the gate wiring 31 in plan view. Each of these inspection wirings 29 is provided over the substantially entire length of the gate wiring 31 corresponding to the gate wiring 31 in the laminated insulating film 24 and is formed wider than the gate wiring 31. 24, the gate wiring 31 is covered over the entire width direction.

  Each inspection wiring 29 is electrically independent on the TFT substrate 20 as in the first embodiment, and is not electrically connected to the gate driver TCP50 and the source driver TCP60.

  In addition, an inspection connection line 29c extending along the gate connection line 33 is provided in the connection region 10T. The inspection connection line 29 c is provided for each inspection unit wiring group 32 and intersects with the inspection wirings 29 corresponding to the gate wirings 31 constituting the inspection unit wiring group 32 and is integrally formed. As a result, the inspection connection line 29c electrically connects a predetermined number of inspection wirings 29 to each other to form an inspection wiring group 30.

  The second terminal 29t is connected to one end of the inspection connection line 29c. That is, each second terminal 29t is provided for each inspection wiring 29 constituting the inspection wiring group 30, and each of these inspection wirings 29 is electrically connected to the same second terminal 29t. The second terminal 29t is provided side by side with the first terminal 35 in the connection region 10T outside the region corresponding to the gate wiring 31 on the stacked insulating film 24. The second terminal 29t is constituted by a connection terminal pad 29t formed wider than the inspection connection line 29c.

  The gate connection line 33 is formed of the same film as the gate wiring 31. The first terminal 35, the inspection wiring 29, the inspection connection line 29c, and the second terminal 29t are made of a transparent conductive material such as ITO or IZO, and are formed of the same film as the pixel electrode.

  If the test pattern 25 is used, the electrical resistance between the first terminal 35 and the second terminal 29t is measured for each test pattern 25 in the manufacturing process of the liquid crystal display device S. It is possible to inspect whether or not the conductive foreign matter X adheres to and remains in a state that causes a defect in the market.

  In the case of manufacturing the liquid crystal display device S of the present embodiment, after performing a short circuit inspection using the inspection pattern 25, the gate connection lines 33 are divided between the individual gate lines 31 by laser irradiation or the like. Thus, it is necessary to electrically isolate the gate wirings 31 forming each inspection unit wiring group 32.

-Effect of Embodiment 2-
According to the second embodiment, the inspection pattern 25 is provided with the gate wiring 31 as an inspection target. Therefore, if the inspection process using the inspection pattern 25 is performed, the foreign matter X remains and the gate wiring 31 is short-circuited. The TFT substrate 20 or the liquid crystal display panel 10 provided with the TFT substrate 20 may be detected to prevent occurrence of defects in the market due to this.

  Further, since the inspection pattern 25 is provided for each inspection unit wiring group 32 in which a predetermined number of gate wirings 31 are electrically connected to each other, a short circuit of the gate wiring 31 can be inspected for each inspection unit wiring group 32. Compared with the case where the inspection pattern 25 is provided for each gate wiring 31, the short-circuit inspection of the gate wiring 31 using the inspection pattern 25 can be performed efficiently.

  In addition, since it can be determined for each inspection unit wiring group 32 whether or not there is a possibility that the gate wiring 31 may be short-circuited due to the foreign matter X remaining, Can be narrowed down to. Thereby, when repairing the foreign substance X remaining part on the gate wiring 31, the repair work of the repair location can be performed efficiently.

  In other respects, the same effects as those of the first embodiment can be obtained.

<< Embodiment 3 of the Invention >>
FIG. 9 is a plan view showing a lead-out configuration of the auxiliary capacitance wiring 37 of the liquid crystal display panel 10 according to the third embodiment. FIG. 10 is an enlarged plan view showing the terminal portion and its periphery (region indicated by reference symbol C in FIG. 9) in the configuration of the test pattern 25 according to the third embodiment.

  In the present embodiment, the inspection pattern 25 is provided with the auxiliary capacitance wiring 37 as an inspection target.

  As shown in FIG. 9, a plurality of auxiliary capacitance lines 37 are formed in the display region 10D of the TFT substrate 20 so as to extend in parallel to each other. One end portion of the plurality of auxiliary capacitance wires 37 is a common connection wire 38 extending to a frame region 10F portion (corresponding to the frame portion 43f of the black matrix 43 shown in FIG. 9) where the liquid crystal layer 13 inside the sealing material 11 is provided. Are electrically connected to each other.

  The common connection wiring 38 extends in a direction orthogonal to the extending direction of each auxiliary capacitance wiring 37 and is connected to one end of each auxiliary capacitance wiring 37 to be integrally formed. The common connection wiring 38 is led out to the connection region 10T, and a terminal (not shown) for connecting to the source driver TCP 60 is provided at the leading end of the common connection wiring 38.

  As shown in FIG. 10, the test pattern 25 of the present embodiment includes a first terminal 39, a test wiring 29 and a second terminal 29 t, and only one is provided for the entire auxiliary capacitance wiring 37.

  The first terminal 39 is provided in the connection region 10 </ b> T and is disposed slightly inside the substrate 20 than the terminal for connecting the source driver TCP 60 in the common connection wiring 38. The common connection wiring 38 has a branch line 38 b extending from the connection wiring 38 to the side. The first terminal 39 is constituted by a connection terminal pad 39 formed on the laminated insulating film 24 so as to be wider than the branch line 38 b, and the front end portion of the branch line 38 b through the contact hole 24 h formed in the laminated insulating film 24. 38t. That is, each auxiliary capacitance line 37 is electrically connected to the same first terminal 39.

  The inspection wiring 29 is provided for each auxiliary capacitance wiring 37 and is formed on the laminated insulating film 24 so as to extend along the auxiliary capacitance wiring 37 in a region overlapping the auxiliary capacitance wiring 37 in plan view. Yes. Each of these inspection wirings 29 is provided over the entire length of the auxiliary capacitance wiring 37 corresponding to the auxiliary capacitance wiring 37 in the laminated insulating film 24 and is formed wider than the auxiliary capacitance wiring 37. The auxiliary capacitance lines 37 and 38 are covered over the entire width direction through the laminated insulating film 24.

  The inspection wiring 29 is also provided for the common connection wiring 38, and electrically connects the inspection wirings 29 corresponding to the auxiliary capacitance wirings 37 to each other. The inspection wiring 29 provided for the common connection wiring 38 extends over the substantially entire length along the common connection wiring 38 in a region overlapping the common connection wiring 38 in plan view on the laminated insulating film 24. And is formed wider than the common connection wiring 38 and covers the common connection wiring over the entire width direction with the laminated insulating film 24 interposed therebetween.

  Each inspection wiring 29 is electrically independent on the TFT substrate 20 as in the first embodiment, and is not electrically connected to the gate driver TCP50 and the source driver TCP60.

  The second terminal 29 t is provided side by side with the first terminal 39 in the connection region 10 T that is out of the region corresponding to the common connection wiring 38 on the stacked insulating film 24. The inspection wiring 29 provided for the common connection wiring 38 has an extending portion 29e extending from the inspection wiring 29 to the side along the branch line 38b in the connection region 10T. . The second terminal 29t is connected to the tip of the extension portion 29e, and is constituted by a connection terminal pad 29t formed wider than the extension portion 29e. That is, each inspection wiring 29 corresponding to the auxiliary capacitance wiring 37 is electrically connected to the same second terminal 29t.

  The common connection wiring 38 is formed of the same film as the auxiliary capacitance wiring 37. The first terminal 39, the inspection wiring 29, and the second terminal 29t are made of a transparent conductive material such as ITO or IZO, and are formed of the same film as the pixel electrode.

  If the test pattern 25 is used, only the electrical resistance between the first terminal 39 and the second terminal 29t is measured in the manufacturing process of the liquid crystal display device S. In addition, it is possible to inspect whether or not the conductive foreign matter X remains in a state that causes a failure in the market.

-Effect of Embodiment 3-
According to the third embodiment, since the inspection pattern 25 is provided with the auxiliary capacitance wiring 37 as an inspection target, if the inspection process using the inspection pattern 25 is performed, the foreign matter X remains on the auxiliary capacitance wiring 37. It is possible to detect the TFT substrate 20 or the liquid crystal display panel 10 including the TFT substrate 20 that is likely to be short-circuited, and prevent the occurrence of defects in the market due to this.

  In addition, the same effects as those of the first embodiment can be obtained.

  In each of the above embodiments, the inspection wiring 29 is formed to be slightly wider than the display wiring to be inspected (the power supply wiring 23Vgh for driving the gate driver IC 52, the gate wiring 31 or the auxiliary capacitance wiring 37). However, it is not limited to this.

  The inspection wiring 29 may be formed to have the same width as the display wiring to be inspected, and from the viewpoint of reliably detecting the TFT substrate 20 that may be short-circuited to the display wiring due to the foreign matter X remaining, It is preferable to cover the wiring over the entire width direction.

  In addition, if the inspection wiring 29 is provided on the laminated insulating film 24 so as to extend along the display wiring in a region overlapping the display wiring to be inspected, the inspection wiring 29 is slightly wider than the display wiring. It may be formed narrowly.

  In each of the above embodiments, the first terminals 27, 35, and 39 are connected to the driver TCPs 50 and 60 in the display wiring to be inspected (the power supply wiring 23 Vgh for driving the gate driver IC 52, the gate wiring 31, or the auxiliary capacitance wiring 37). However, the driver TCP 50 and 60 connection terminals may be used as the first terminals 27, 35, and 39.

  As mentioned above, although preferable embodiment of this invention was described, the technical scope of this invention is not limited to the range as described in each said embodiment. It is understood by those skilled in the art that the above embodiments are examples, and that various modifications can be made to the combinations of the respective constituent elements and processing processes, and such modifications are within the scope of the present invention. It is a place.

  For example, in each of the above embodiments, the mounting method of the gate driver IC 52 and the source driver IC 62 on the liquid crystal display panel 10 has been described as an example of the TAB mounting method, but the present invention is not limited thereto.

  As the mounting method of the driver IC chips 52 and 62, a gate driver COF (Chip On Film) in which the gate driver IC 52 is mounted on the film circuit board is used instead of the gate driver TCP50, and a film circuit board is used instead of the source driver TCP60. A COF mounting method using source drivers COF each having a source driver IC 62 mounted thereon may be employed.

  In addition, the liquid crystal display panel 10 may be configured as a monolithic display panel in which a gate driver IC and a source driver IC are integrally formed on the TFT substrate 20.

  In each of the above embodiments, the active matrix driving type liquid crystal display panel 10 including the TFT substrate 20 is described as an example. However, the liquid crystal mode, the pixel structure, and the driving method of the liquid crystal display panel 10 are arbitrary. In addition, as the display panel 10, any liquid crystal display panel can be used.

  Furthermore, the configuration of the display device according to the present invention includes not only the liquid crystal display device S, but also an organic EL (Electro Luminescence) display device having an EL (Electro Luminescence) layer as a display medium layer, an inorganic EL display device, and a display medium layer. It can be applied to a plasma display device having a gas layer such as neon gas or xenon gas as well as FED (Field Emission Display) and SED (Surface-conduction Electron-emitter Display). The present invention can also be widely applied to various display devices such as electrowetting display devices and display device substrates constituting these display devices.

  As described above, the present invention is useful for a display device substrate and a display device including the same, and in particular, a substrate that may cause a short circuit in display wiring due to residual foreign matter is detected and caused thereby. The present invention is suitable for a display device substrate and a display device including the substrate that are required to prevent occurrence of defects in the market.

S liquid crystal display device X foreign matter 10 liquid crystal display panel 10D display area 10F frame area (non-display area)
10T connection region 11 sealing material 13 liquid crystal layer (display medium layer)
15, 17 Polarizing plate 20 TFT substrate (display device substrate)
21 Base substrate 22 Laminated structure 23 Gate driver drive wiring (display wiring)
23b Branch line 23t Branch line tip 23Vgh Power supply wiring for gate driver IC drive (display wiring)
24 Laminated insulating film 24h Contact hole 25 Inspection pattern 27, 35, 39 First terminal 29 Inspection wiring (conductive layer)
29e extension part 29t second terminal 29c inspection connection line 31 gate wiring (display wiring)
33 Gate connection line 33t One end of the gate connection line 37 Auxiliary capacitance wiring (display wiring)
38 Common connection wiring 38b Branch line 38t Branch line tip 40 Counter substrate 41 Base substrate 43 Black matrix 43f Black matrix frame 45 Common electrode 50 Gate driver TCP (printed circuit board)
51 Flexible Wiring Board 52 Gate Driver IC (External Circuit; Driver Integrated Circuit)
60 Source Driver TCP (Printed Circuit Board)
61 Flexible wiring board 62 Source driver IC (external circuit; driver integrated circuit)
70 External circuit board

Claims (11)

A base substrate having a connection region connected to an external circuit;
Display wiring provided on the base substrate;
An insulating film covering the display wiring;
A conductive layer that is provided along the display wiring in a region overlapping the display wiring in a plan view on the insulating film, and is electrically disconnected from the external circuit;
A first terminal provided in the connection region and electrically connected to the display wiring;
A display device substrate comprising: a second terminal provided in the connection region and electrically connected to the conductive layer. The display device substrate according to claim 1,
The conductive layer, the first terminal, and the second terminal are inspected for a short circuit between the display wiring and the conductive layer by measuring an electrical resistance between the first terminal and the second terminal. A substrate for a display device, characterized in that an inspection pattern is formed. The display device substrate according to claim 1 or 2,
In the connection region, a plurality of printed circuit boards each including a driver integrated circuit as the external circuit are connected side by side,
The display device substrate, wherein the display wire is a driver drive wire for electrically connecting the printed circuit boards. The display device substrate according to claim 1 or 2,
The display wiring is a plurality of gate wirings extending in parallel with each other,
The first terminal is provided for each predetermined number of the gate wirings and is electrically connected to the predetermined number of gate wirings.
The conductive layer is provided for each gate wiring,
The second terminal is provided for each of the predetermined number of conductive layers extending in a region overlapping each gate wiring to which the first terminal is electrically connected, and is electrically connected to the predetermined number of conductive layers. A substrate for a display device. The display device substrate according to claim 1 or 2,
The display wiring is a plurality of auxiliary capacitance wirings extending in parallel with each other, and each of the display wirings is electrically connected to the same first terminal,
The display device substrate, wherein the conductive layer is provided for each of the display wirings and is electrically connected to the same second terminal. In the display device substrate according to any one of claims 1 to 5,
The display device substrate, wherein the conductive layer is formed to have the same width as or wider than the display wiring, and covers the display wiring over the entire width direction through the insulating film. . In the display device substrate according to any one of claims 1 to 6,
The display device substrate, wherein the conductive layer is made of a transparent conductive material. In the display device substrate according to any one of claims 1 to 7,
A plurality of pixel electrodes arranged in a matrix;
The display device substrate, wherein the conductive layer and the second terminal are formed of the same film as the pixel electrode. A substrate for a display device according to any one of claims 1 to 8,
A counter substrate disposed to face the display device substrate;
A display medium layer provided between the display device substrate and the counter substrate;
A display device, wherein an electrode is formed in a region of the counter substrate facing the display wiring. The display device according to claim 9, wherein
A display area for displaying an image and a non-display area located outside the display area;
The display device, wherein the display wiring, the insulating film and the conductive layer are stacked in the non-display region. The display device according to claim 9 or 10,
The display device, wherein the display medium layer is a liquid crystal layer.

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