JP2014091652A - Substrate segmentation apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate segmentation apparatus provided with an adsorption reversal mechanism capable of reducing operation time from reversing a substrate to mounting the substrate on a table in the next step.SOLUTION: A substrate segmentation apparatus comprises a scribe unit D forming a scribe line on the surface of a brittle material substrate W, a carrying mechanism E transferring the scribed substrate W to an adsorption reversal mechanism G, the adsorption reversal mechanism G having an adsorption plate 29 formed so as to be reversible by a rotation shaft 28, taking the substrate from the carrying mechanism E, reversing the substrate W vertically and mounting on a table 15 of a breaking unit F and the breaking unit F breaking the substrate W taken from the adsorption reversal mechanism G. The rotation shaft 28 of the adsorption plate 29 of the adsorption reversal mechanism G is extended from one end of the adsorption plate 29 in a direction nearly perpendicular to the carrying direction of the substrate W and arranged in the vicinity of the table 15 of the breaking unit F so that, when the adsorption plate 29 adsorbed with the substrate is reversed with the rotation shaft 28 as the supporting point, the reversed substrate W is mounted on the table 15 of the breaking unit F.

Description

  The present invention relates to a substrate cutting apparatus for a brittle material substrate such as a glass substrate. In particular, the present invention relates to a substrate cutting apparatus that forms a scribe line on a substrate and breaks along the scribe line.

  Conventionally, a mother board placed on a table is orthogonal to each other by rolling a cutter wheel (also called a scribing wheel) with a scribing device or using thermal distortion caused by laser beam irradiation. A plurality of parallel scribe lines are formed, and then the mother substrate is inverted by a suction inversion mechanism and placed on the table of the breaker, and the break bar is formed from the surface opposite to the surface on which the scribe lines are provided. A method is known in which a substrate is divided by pressing and bending the substrate to take out a unit product.

  In addition, when the mother substrate on which the two glass substrates are bonded together is cut, the cutter wheel is rolled on the mother substrate placed on the table of the scribe device so that A is one surface of the substrate. A scribe line is formed on the surface. Next, after the substrate is sucked and reversed by the suction reversing mechanism, it is placed on the table of the breaker, and the substrate B surface which is the back surface of the substrate A surface is pressed with a break bar or the like to divide the substrate A surface. . Next, in the same manner as described above, a scribe line is formed on the surface of the substrate B, the substrate is inverted, and then the surface of the substrate A is pressed with a break bar or the like to divide the surface of the substrate B. Thereafter, a method of removing the material of the divided substrate from the breaking device and moving to the next step is disclosed in, for example, Patent Document 2 (FIG. 45).

International Publication WO2005 / 053925 International Publication No. WO2002 / 057192

  Generally, in order to improve work efficiency, a scribing device that performs scribing on a substrate, a suction reversing mechanism that reverses the scribed substrate, and a breaker that breaks the reversed substrate are used. In addition, it is desirable to transport the substrate to the stage of each process in the shortest possible working time. However, the suction reversing mechanism incorporated in the conventional substrate cutting apparatus operates to move to the table of the breaking apparatus after receiving and reversing the substrate scribed by the scribing apparatus, for example, as shown in Patent Document 1 above. In addition, the inverted substrate is placed on the table of the breaker by performing a lowering operation on the table. For this reason, there is a problem in that it takes time to transport the substrate to the breaking device after turning over the substrate, and the total work time required for dividing the substrate becomes long. In addition, since a moving mechanism up to the breaking device and a lifting mechanism to the table are required, the structure of the device becomes complicated and the cost increases.

  Therefore, in view of the above-described conventional problems, the present invention provides a substrate cutting apparatus including a suction reversal mechanism that can shorten the work time required to reverse a substrate and place it on the next process table. Objective.

  In order to achieve the above object, the present invention takes the following technical means. That is, the substrate cutting apparatus according to the present invention includes a scribing device that forms a scribe line on the surface of the brittle material substrate in the middle of the main route, and a scribing device in the first direction. A transport mechanism that transfers the brittle material substrate on which the scribe line is formed from the table of the scribe device to a suction reversal mechanism described later, and a suction plate that can be turned upside down via a rotating shaft. The brittle material substrate is received on the suction plate and turned upside down, and the reversed brittle material substrate is placed on a table of a breaker described later, and the brittle material substrate received from the suction reverse mechanism. And a break device that breaks along the scribe line, the rotation of the suction plate in the suction reversing mechanism. The shaft extends at one end of the suction plate along a direction substantially perpendicular to the first direction, and when the suction plate that sucks the brittle material substrate is reversed with the rotation shaft as a fulcrum. In addition, the rotating shaft is arranged in the vicinity of the table of the break device so that the inverted brittle material substrate can be placed on the table of the break device.

  Since the substrate cutting apparatus according to the present invention is configured as described above, the substrate reversing operation and the substrate after reversing can be placed on the table of the breaking device simply by reversing the suction plate with the rotating shaft as a fulcrum. The operation time can be performed at the same time, and the working time can be greatly reduced. In addition, the suction reversing mechanism can have a simple configuration including a suction plate and a rotary shaft provided at one end of the suction plate, and is effective in reducing the size and cost.

In the present invention, the suction plate of the suction reversing mechanism is preferably formed so that the vertical position can be adjusted.
Thereby, when the substrate is sucked and the suction plate is reversed, the vertical position of the suction plate can be adjusted so that the substrate can be accurately placed on the table of the breaker.

In the present invention, the transport mechanism serves to supply the brittle material substrate to the table of the scribe device and to remove the brittle material substrate broken from the table of the break device in the next step. It is good to form like this.
Accordingly, a mechanism for supplying the brittle material substrate to the table of the scribing device and a mechanism for removing the material from the substrate broken by the breaking device in the next process are omitted. Thus, there is an effect that the substrate cutting apparatus can be configured in a compact manner.

1 is a schematic perspective view showing an overall configuration of a substrate cutting apparatus according to the present invention. FIG. 2 is a schematic plan view of the substrate cutting apparatus in FIG. 1. The side view of the conveyance mechanism in the board | substrate cutting apparatus of FIG. The perspective view of the scribe apparatus in the board | substrate cutting apparatus of FIG. The perspective view of the breaking apparatus in the board | substrate cutting apparatus of FIG. The side view of the adsorption | suction inversion mechanism in the board | substrate cutting apparatus of FIG. Schematic explanatory drawing which shows the 1st step of the cutting process by the board | substrate cutting apparatus of this invention. Schematic explanatory drawing which shows the 2nd step of a board | substrate parting process. Schematic explanatory drawing which shows the 3rd step of a board | substrate parting process. Schematic explanatory drawing which shows the 4th step of a board | substrate parting process. Schematic explanatory drawing which shows the 5th step of a board | substrate parting process. Schematic explanatory drawing which shows the 6th step of a board | substrate parting process. Schematic explanatory drawing which shows the 7th step of a board | substrate parting process.

Hereinafter, the details of the substrate cutting apparatus according to the present invention will be described with reference to the drawings.
FIG. 1 is a schematic perspective view showing the overall configuration of a substrate cutting apparatus according to the present invention, and FIG. 2 is a schematic plan view thereof.

As shown in FIGS. 1 and 2, the substrate cutting apparatus shown in this embodiment includes a carry-in conveyor C, a scribe device D, a break device F, a transport mechanism E, an adsorption reversal mechanism G, and a discharge conveyor H. It consists of.
The substrate W to be processed is sequentially transferred along a straight line L extending in the first direction from the carry-in conveyor C to the discharge conveyor H through the scribe device D and the break device F. The first direction is displayed as the X direction on the drawing. The substrate feed path along the first direction is a processing line, and is referred to as a “substrate main path” in the present invention. A direction orthogonal to the first direction is referred to as a second direction.

  As shown in FIG. 4, the scribing device D extends along a rail 4 extending in a second direction (Y direction) orthogonal to the direction of the main path of the substrate (that is, the X direction) on the plane. A moving table 5 is provided, which is driven by a screw shaft 7 that is rotated by a motor 6. Further, the table 5 can be rotated in a horizontal plane by a rotation drive unit 8 incorporating a motor. A pair of left and right support columns 9 and 9 and a beam 11 having a guide 10 extending in the X direction bridged by these support columns 9 and 9 form a gate-shaped support. A scribe head 13 having a cutter wheel 12 is attached to the guide 10 so as to be movable along the guide 10 in the X direction.

  As shown in FIG. 5, the breaking device F is a table 15 that moves along a rail 14 that extends in a second direction (Y direction) orthogonal to the direction of the main path of the substrate (X direction) on the plane. And is driven by a screw shaft 17 rotated by a motor 16. Further, the table 15 can be rotated in a horizontal plane by a rotation drive unit 18 incorporating a motor. A pair of left and right support columns 19 and 19 and a beam 21 provided with a horizontal frame 20 extending in the X direction and bridged by the support columns 19 and 19 form a gate-shaped support. A break bar 22 extending in the X direction is attached to the horizontal frame 20 so as to be moved up and down by a cylinder 23.

  As shown in FIG. 3, the transport mechanism E includes a guide rail 1 disposed along a straight line L (see FIG. 2) in the first direction, that is, the X direction, and a slide that moves along the guide rail 1. It consists of the member 2 and the adsorption | suction board 3 attached to the slide member 2 so that raising / lowering was possible in a horizontal attitude. The suction plate 3 has a large number of suction holes on its lower surface, and is connected to a decompression device using a vacuum pump and a suction pipe (not shown) so that the substrate W can be sucked and transported by suction air from the decompression device. Is formed. The guide rail 1 is arranged at an upper position of the cutting device so as not to hinder the operation of the scribing device D, the breaking device F, and the suction reversing mechanism G.

As shown in FIG. 6, the suction reversing mechanism G can be adjusted in the vertical position through a rectangular column support 25 fixed to the support 24 in a vertical posture and the support 25 via a vertical adjustment mechanism (not shown). The movable element 26 is attached to the movable element 26. The movable element 26 includes a horizontal rotary shaft 28 rotatably attached to a rotary mechanism 27 provided in the movable piece 26, and a horizontal suction plate 29 fixed to the rotary shaft 28. . The suction plate 29 is provided with a suction surface 29a having a large number of suction holes on one surface thereof, and is connected to a decompression device using a vacuum pump via an intake pipe (not shown). It is formed so that W can be adsorbed and reversed. The vertical position adjusting mechanism that adjusts the vertical position of the mover 26 can be formed by, for example, a driving mechanism using a combination of a rack and a pinion or a driving mechanism using a fluid cylinder as a power source.
The rotation shaft 28 of the suction plate 29 extends along a direction substantially orthogonal to the first direction and is provided at one end of the suction plate 29. Then, when the suction plate 29 that sucks the substrate W is reversed, the rotating shaft 28 is located on the side end of the table 15 of the breaking device F so that the reversed substrate W can be placed on the table 15 of the breaking device F. It is arranged in the vicinity.

Next, the process of cutting the mother substrate W by the above-described substrate cutting apparatus will be described in order with reference to FIGS. 2 and 7 to 13.
As shown in FIG. 7, the substrate W fed by the carry-in conveyor C is sucked by the suction plate 3 of the transport mechanism E and placed on the table 5 at the delivery position of the scribe device D. Next, after the table 5 is moved to the position of the scribe head 13 (see FIGS. 1 and 2) and the scribe lines in the XY directions intersecting each other are formed by the cutter wheel, the table 5 is returned to the original position (delivery position). It is.

  As shown in FIG. 8, the substrate W on which the scribe line has been formed is sucked by the suction plate 3 of the transport mechanism E, lifted from the table 5, and moved to above the suction plate 29 of the suction reversing mechanism G. The suction plate 29 of the suction reversing mechanism G stands by with the suction surface 29a facing upward, and the suction plate 3 of the transport mechanism E is lowered onto the suction surface 29a as shown in FIGS. Then, the substrate W is placed.

Next, as shown in FIG. 11, the suction plate 29 of the suction reversing mechanism G is rotated about the rotation shaft 28 as a fulcrum, and the substrate W that has been turned upside down is placed on the table 15 of the breaker F, and then FIG. As shown, the suction plate 29 is returned to the standby posture with the suction surface 29a facing upward.
In the breaker F, the table 15 on which the substrate W is placed is moved to a position below the break bar 22 (see FIGS. 1 and 2), and the break bar 22 breaks the substrate W along the scribe line. Is returned to the delivery position.
After that, as shown in FIG. 13, the broken substrate W is again sucked from the table 15 by the suction plate 3 of the transport device E and removed to the discharge conveyor H.

  As described above, the step of dividing the single substrate W has been described in order. However, when the substrate W is divided continuously, the break operation of the first substrate W is performed by the break device F. Subsequent substrates scribed through the above-described steps of FIGS. 7 to 10 are made to stand by suction on the suction plate 29 of the suction reverse mechanism G. Then, after removing the first substrate W onto the discharge conveyor H, the suction reversing mechanism G is reversed, and the subsequent substrate is subjected to the steps of FIGS. It can be carried out.

  In the said Example, although described about the case where the board | substrate W of a single plate was divided | segmented, when dividing | segmenting the bonding board | substrate which bonded two glass substrates together, one of the board | substrates W with the break apparatus F according to the process mentioned above. After the break of the surface (surface A) is completed, the substrate W is sucked by the suction plate 3 of the transport device E and placed again on the table 5 of the scribe device D. Thereafter, after the same process as in FIGS. 7 to 12 is performed, the other surface (B surface) of the substrate is broken, and then the substrate W is placed on the table 15 of the breaking device F by the suction plate 3 of the transfer device E as shown in FIG. The material should be removed.

  In the embodiment described above, the transport mechanism E feeds the substrate W from the carry-in conveyor C to the table 5 of the scribe device D, and the substrate W broken from the table 15 of the break device F to the discharge conveyor H. Since the material removal operation is also performed, a mechanism for supplying the substrate W to the table 5 of the scribing device D and a mechanism for removing the substrate W broken by the breaking device F in the next process are provided. There is no need to install them separately, and the substrate cutting apparatus can be configured compactly.

  In the present invention, when the suction plate 29 of the suction reversing mechanism G is reversed with the substrate W placed thereon in the substrate cutting step described above, the reversed substrate W is placed on the table 15 of the breaker F. Since the rotary shaft 28 is disposed in the vicinity of the table 15 of the breaker F so that the substrate W can be placed, the reversing operation of the substrate W by the suction reversing mechanism G and the substrate after the reversal can be performed only by reversing the suction plate 29. The operation of placing W on the table 15 can be performed simultaneously. Thereby, the working time can be greatly shortened. Further, the suction reversing mechanism G can be configured simply by the suction plate 29 and the rotary shaft 28 provided at one end of the suction plate 29, so that both downsizing and cost reduction can be achieved. It becomes possible.

  The representative examples of the present invention have been described above. However, the present invention is not necessarily limited to the above-described embodiments, and the object of the present invention is achieved and appropriately modified within the scope of the claims. It is possible to change.

  The present invention is used in a substrate cutting apparatus that forms a scribe line on a substrate and breaks along the scribe line.

C Conveyor for loading D Scribing device E Conveying mechanism F Breaking device G Adsorption reversing mechanism H Conveyor for discharging W Mother substrate (brittle material substrate)
DESCRIPTION OF SYMBOLS 3 Adsorption plate of conveyance mechanism 5 Table of scribing device 15 Table of break device 28 Rotating shaft of adsorption plate 29 Adsorption plate of adsorption reversal mechanism

Claims (3)

A scribing device for forming a scribe line on the surface of the brittle material substrate in the middle of the main path, the main path for sequentially transporting the brittle material substrate,
A transport mechanism for transferring the brittle material substrate, on which a scribe line is formed by a scribe device, from the table of the scribe device to an adsorption reversal mechanism described later;
A suction plate formed so as to be turned upside down via a rotating shaft, receives the brittle material substrate from the transport mechanism on the suction plate, and is turned upside down. An adsorption reversal mechanism placed on
A break device for breaking the brittle material substrate received from the adsorption reversal mechanism along the scribe line is provided,
The rotating shaft of the suction plate in the suction reversing mechanism is extended at one end portion of the suction plate along a direction substantially perpendicular to the first direction, and the brittle material substrate with the rotational shaft as a fulcrum. The rotating shaft is arranged in the vicinity of the table of the break device so that the reversed brittle material substrate can be placed on the table of the break device when the suction plate that adsorbs the material is reversed. Substrate cutting device. The substrate cutting apparatus according to claim 1, wherein the suction plate of the suction reversing mechanism is formed so that the vertical position can be adjusted. The transport mechanism is formed to serve both as an operation for supplying the brittle material substrate to the table of the scribing device and an operation for removing the brittle material substrate broken from the table of the breaking device into the next step. The substrate cutting apparatus according to claim 1 or 2.

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