JP2014076438A - Method for cleaning electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for cleaning an electronic component which can inexpensively and surely remove dust attached to electronic components respectively stored in a plurality of storage recesses of a tray, or dust existing in the circumference thereof.SOLUTION: A method for cleaning an electronic component includes: storing electronic components 3 in each of a plurality of storage recesses 1 formed in a tray 2; disposing, on an upper surface side of the tray 2, a planar mesh member 4 having an opening of a size not permitting passage of the electronic component 3 so as to cover a region in which the plurality of storage recesses 1 of the tray 2 are disposed; and sucking the interior of the storage recesses 1 by a suction means with the planar mesh member 4 interposed therebetween, so as to suck and remove dust 10 attached to the electronic components 3 and dust existing in the storage recesses 1.

Description

  The present invention relates to a method for cleaning an electronic component, and in particular, is attached to an electronic component accommodated in an accommodation recess of a tray or is present in the periphery of the processing waste and dust generated during processing such as cutting and polishing. And the like.

  In recent years, various electronic devices have been widely used for mobile communication terminals and the like. When mounting electronic parts such as module parts, shield cases, and coaxial cables on such electronic equipment, it is necessary to keep the various electronic parts clean so as not to cause malfunction of the electronic equipment. become.

  However, since these electronic components usually have processing debris and dust generated during manufacturing, remove the debris and dust adhering to the electronic component before mounting on electronic equipment. That is, it becomes necessary to clean the electronic component.

As a method for cleaning such electronic components, for example,
(1) A wet process using a cleaning liquid such as an organic solvent as described in Patent Document 1,
(2) There is a dry process in which a gas such as air is blown as described in Patent Document 2.

  However, in the case of the wet process described in Patent Document 1, there is a problem that depending on the type of the organic solvent, the electronic component may be damaged and the reliability is low. This requires a process for removing the organic solvent adhering to the substrate and the organic solvent that has permeated into the interior of the apparatus, resulting in a complicated and large process and equipment.

  Further, in the case of the dry process as described in Patent Document 2, the risk of damaging the electronic component itself is small, but a mechanism for blowing air from each direction, or for removing removed processing waste, etc. However, there is a problem that the process and equipment become complicated and large.

JP 2003-300025 A JP 2010-99550 A

  SUMMARY OF THE INVENTION The present invention solves the above-described problems, and is an electronic component that can reliably and inexpensively remove processing waste or dust that adheres to or exists around an electronic component housed in a tray. An object of the present invention is to provide a cleaning method.

In order to solve the above problems, the electronic component cleaning method of the present invention comprises:
Storing electronic components in each of the plurality of storage recesses formed in the tray; and
Disposing a flat mesh member having an opening of a size that does not allow the electronic component to pass therethrough so as to cover an area of the tray where the plurality of receiving recesses are disposed;
Suctioning and removing the dust adhering to the electronic component and the dust present in the housing recess by sucking the inside of the housing recess through the flat mesh member by the suction means. It is a feature.

  In the present invention, the flat mesh member is a net-like or lattice-like member, or a member such as punching metal in which a through hole is provided in a metal plate, and is a dust or gas such as processing waste or dust. Means a flat member having an opening of a size that allows the electronic component to pass but does not allow the electronic component to pass.

In the electronic component cleaning method of the present invention,
As the suction means, use is made of a suction means that can cover a plurality of the receiving recesses and has a suction port of a size that does not cover the entire area of the tray where the plurality of receiving recesses are disposed. ,
The suction port performs suction while moving the surface of the flat mesh member, and the suction port is allowed to pass through the entire area of the surface of the flat mesh member where the plurality of receiving recesses are disposed. Accordingly, it is preferable to perform suction for all of the plurality of housing recesses.

  A suction port that moves when the suction means has a suction port that covers a plurality of receiving recesses but does not cover the entire area of the tray where the receiving recesses are disposed. The air is sucked from the surroundings to generate air currents in a plurality of corresponding recesses corresponding to the positions of the suction ports, so that effective cleaning can be performed. Further, since the suction port is configured to cover a plurality of the housing recesses, highly reliable cleaning can be performed without sacrificing efficiency.

  Moreover, it is preferable to use the tray comprised so that the distribution | circulation of gas may be permitted as a said tray between a bottom face side and an upper surface side.

  By using a tray that allows gas to flow between the bottom surface side and the top surface side, when the inside of the housing recess is suctioned by the suction means via the flat mesh member disposed on the top surface side of the tray In addition, since an air flow is generated from the bottom surface side to the top surface side of the tray, more effective cleaning can be performed.

  In addition, for example, when suction is performed using a suction means provided with a suction port that covers the entire area of the tray in which the plurality of receiving recesses are provided as a suction port of the suction means, Since an air flow is generated from the bottom surface side of the tray to the upper surface side including the concave portion, the entire tray can be sucked at a time and efficient cleaning can be performed.

  In addition, “a tray configured to allow gas flow between the bottom surface side and the top surface side” means, for example, a through hole having a size that prevents electronic components from passing through the bottom of the housing recess. This means that the bottom of the tray itself is formed of a flat mesh member, and the flat mesh member (bottom) and a partition member are combined to form a plurality of receiving recesses. .

  Further, it is preferable that the method further includes a step of turning the tray upside down and sucking from the bottom surface side of the tray by the suction means in a state where the flat mesh member is disposed on the upper surface side.

  In addition to the above-described step of sucking the inside of the accommodating recess through the flat mesh member arranged on the upper surface side of the tray, the method further includes the step of turning the tray over and sucking from the bottom surface side of the tray by the suction means. This makes it possible to perform more effective cleaning.

In the electronic component cleaning method of the present invention, the electronic component is accommodated in each of the plurality of accommodating recesses formed in the tray, and the electronic component is not allowed to pass through so as to cover a region where the plurality of accommodating recesses are disposed. In the state where the flat mesh member having the opening is disposed on the upper surface side of the tray, the inside of the housing recess is sucked by the suction means through the flat mesh member, so that the electronic component is accommodated in the housing recess. It is possible to suck and remove the dust adhering to the electronic component and the dust existing in the housing recess by performing suction while floating inside. Further, even if the electronic component is sucked while being floated in the housing recess, the position of the electronic component does not move after cleaning.
Therefore, it is possible to reliably clean the electronic components in a short time without using a complicated configuration of equipment.
In the present invention, “dust” means processing waste and dust generated when processing such as cutting and polishing in the electronic component manufacturing process, and dust generated when handling the tray. .

In Embodiment 1 of this invention, it is a figure which shows the state which accommodated the electronic component (module component) in the some accommodating recessed part of a tray, Comprising: (a) is a top view, (b) is front sectional drawing. In Embodiment 1 of this invention, it is a figure which shows the state which has arrange | positioned the flat mesh member on the upper surface of the tray which accommodated the electronic component (module component) in the several accommodating recessed part, (a) is a top view, (B) is front sectional drawing. In Embodiment 1 of this invention, it is a figure which shows the state which attracts | sucks the inside of the storage recessed part of a tray via a flat mesh member, and is cleaning the electronic component (module component), (a) A top view and (b) are front sectional views. In Embodiment 1 of this invention, it is a figure which shows the state after attracting | sucking the inside of the storage recessed part of a tray via a flat mesh member, and cleaning the electronic component (module component), (a) Is a plan view, and (b) is a front sectional view. It is front sectional drawing which shows the structure of the tray used in Embodiment 2 of this invention. Embodiment 2 of the present invention shows a state in which the electronic component (module component) is being cleaned by sucking the inside of the storage recess of the tray through a flat mesh member disposed on the upper surface side of the tray. It is front sectional drawing. It is front sectional drawing which shows the modification of Embodiment 2 of this invention. It is front sectional drawing which shows the structure of the tray used in Embodiment 3 of this invention. In Embodiment 3 of this invention, it is front sectional drawing which shows the state which has attracted | sucked the inside of the storage recessed part of a tray via the flat mesh member arrange | positioned at the upper surface side of the tray. In Embodiment 3 of this invention, it is front sectional drawing which shows the state which has reversed the tray and suck | inhaled the inside of an accommodation recessed part via the flat mesh member which comprises the bottom part of a tray.

  Embodiments of the present invention will be described below to describe the features of the present invention in more detail.

[Embodiment 1]
In the first embodiment, as an electronic component, for example, a module component which is an electronic component in which a surface mount component such as a semiconductor chip or a capacitor chip is mounted on or inside a ceramic substrate, a resin substrate, or the like, as an example, a cleaning method thereof Will be described.

  FIG. 1A is a diagram illustrating a state in which electronic components (module components) are accommodated in a plurality of accommodating recesses of the tray, where FIG. 1A is a plan view and FIG. 1B is a front cross-sectional view.

  First, as shown in FIGS. 1A and 1B, a plate-like tray 2 provided with a plurality of receiving recesses 1 in a matrix is prepared. The accommodation recess 2 of the tray 2 is given a shape corresponding to the shape so that the electronic component (module component) 3 to be accommodated can be reliably accommodated.

Then, the module component 3 is accommodated in each of the plurality of accommodating recesses 1 of the tray 2.
When the module component 3 is accommodated in the accommodating recess 1 as described above, the module component 3 and the accommodating recess 2 of the tray 2 are processed when processing scraps and trays generated when the module component is processed are handled. Dust 10 such as dust generated on the surface adheres.

  Next, as shown in FIGS. 2A and 2B, the flat mesh member 4 is disposed on the upper surface side of the tray 2 so as to cover the entire area of the tray 2 where the receiving recess 1 is disposed. To do. As the flat mesh member 4, a net member, a lattice member, a so-called punching metal in which a large number of through holes are provided in a metal plate, and the like can be used.

  In the first embodiment, as the flat mesh member 4, a stainless steel plate having a mesh-shaped opening having a size such that the module component 3 does not pass when sucked by the suction means is used.

Next, as shown in FIGS. 3A and 3B, the suction port (suction nozzle) 5 of the suction means is disposed on the upper surface side of the flat mesh member 4.
The suction port 5 of the suction means can cover a plurality of the housing recesses 1, but does not cover the entire area of the tray 2 where the plurality of housing recesses 1 are disposed, that is, the entire top surface of the tray 2. The size is assumed.

  In the first embodiment, a hand-held small vacuum cleaner provided with the suction port 5 is used as the suction means. However, the suction means is not limited to this, and various structures such as a structure in which a suction port is connected to a blower or the like via a hose can be used.

  Then, suction is performed while bringing the suction port 5 of the suction means into contact with the flat mesh member 4, and the plurality of receiving recesses 1 in which the module parts 3 of the tray 2 of the flat mesh member 4 are stored. Are sequentially moved so as to trace the upper surface of the corresponding position, and all the housing recesses 1 and the module parts 3 housed in the housing recesses 1 are cleaned.

  At this time, the suction port 5 of the suction means covers a plurality of the receiving recesses 1 but has a size that does not cover the entire area of the tray 2 where the receiving recesses 1 are arranged, that is, the entire upper surface of the tray 2. Therefore, in each housing recess 1, air flows into the housing recess 1 located below the suction port 5 from a region around the suction port 5 that is not covered by the suction port 5. Thus, air mixed with dust can be efficiently sucked from the housing recess 1 located in the region covered with 5.

  Further, since the module component 3 in the housing recess 1 is lifted by this suction, not only the dust adhering to the module component 3 but also the lower surface (back surface) of the module component 3 and the bottom of the housing recess 1 (that is, the tray 2 The dust in the space between the bottom and the like can be sucked together. Further, since the module component 3 not only floats but also vibrates due to suction, dust attached to the surface of the module component 3 and the inner wall of the housing recess 1 can be more reliably sucked.

  As a result, as shown in FIGS. 4A and 4B, the dust adhering to the module component 3 and the dust existing around the module component 3 are surely removed, so that not only the module component 3 but also the recessed portion of the tray 2 is accommodated. 1 can be sufficiently cleaned.

[Embodiment 2]
In Embodiment 2, an electronic component cleaning method according to another embodiment of the present invention will be described.
In the second embodiment, as shown in FIG. 5, the tray 2 has a through hole 11 formed in the bottom portion 2 a, and is configured to allow gas to flow between the bottom surface side and the top surface side. Is used.
That is, the tray 2 is configured such that gas passes from the bottom surface side thereof to the upper surface side through the through hole 11.

As shown in FIG. 6, the tray 2 configured as described above is sucked by bringing the suction port 5 of the suction means into contact with the flat mesh member 4 arranged on the upper surface side of the tray 2. At this time, as in the case of the above-described first embodiment, a plurality of the plate-like mesh member 4 in which the module components 3 of the tray 2 are accommodated while the suction port 5 is in contact with the plate-like mesh member 4. It moves sequentially so that the upper surface of the position corresponding to the accommodation recessed part 1 may be traced, and the module component 3 accommodated in all the accommodation recessed parts 1 and the accommodation recessed parts 1 is cleaned.
In the case of the second embodiment, since an air flow is generated from the bottom surface side of the housing recess 1 toward the upper surface side of the tray 2, more effective cleaning than in the case of the first embodiment can be performed.

  At this time, as in the case of the above-described first embodiment, a plurality of the plate-like mesh member 4 in which the module components 3 of the tray 2 are accommodated while the suction port 5 is in contact with the plate-like mesh member 4. It moves sequentially so that the upper surface of the position corresponding to the accommodation recessed part 1 may be traced, and the module component 3 accommodated in all the accommodation recessed parts 1 and the accommodation recessed parts 1 is cleaned.

  For example, as shown in FIG. 7, the suction means 5 is provided as a suction means so as to cover the entire area of the tray 2 in which the plurality of receiving recesses 1 are disposed (that is, the entire tray 2). It is also possible to use a suction means and arrange the suction port 5 so as to cover the entire tray 2 to perform suction. In that case, since an air flow is generated from the bottom surface side of the housing recess 1 toward the upper surface side of the tray 2, the entire tray 2 can be sucked at a time to perform efficient cleaning.

  Further, as shown in FIG. 8, the bottom portion of the tray is a flat mesh member 4a similar to the above-described flat mesh member 4 (see FIG. 7) disposed on the upper surface side of the tray 2 (see FIG. 7). It is also possible to use a structure in which a plurality of receiving recesses 1 are provided by combining and forming the flat mesh member 4a that forms the bottom and the partition member 6. The tray 2 shown in FIG. Even when used, the same effects as those of the configuration of the second embodiment can be obtained.

[Embodiment 3]
In the third embodiment, the bottom portion shown in FIG. 8 is formed using a flat mesh member 4a similar to the flat mesh member 4 disposed on the upper surface side of the tray 2, and this flat mesh member. A tray 2 in which a plurality of receiving recesses 1 are formed by combining a bottom portion 4a and a partition member 6 is used.

  First, (a) as shown in FIG. 9, through the flat mesh member 4 disposed on the upper surface side of the tray 2 from the suction port 5 in the same manner as in the first and second embodiments. Then, the inside of the housing recess 1 is sucked and cleaning (primary cleaning) is performed.

  At this time, as in the case of the above-described first embodiment, a plurality of housing recesses in which the module parts 3 of the tray 2 of the flat mesh member 4 are accommodated while the suction port 5 is in contact with the flat mesh member 4. 1 is sequentially moved so as to trace the upper surface of the position corresponding to 1, and cleaning (primary cleaning) of all the housing recesses 1 and the module parts 3 housed in the bottom is performed.

  Then, (b) as shown in FIG. 10, with the flat mesh member 4 disposed on the upper surface side of the tray 2, the tray 2 is turned over and the suction port 5 faces the bottom of the tray 2. The inside of the housing recess 1 is sucked through the mesh member 4a (that is, the bottom of the tray 2), and cleaning (secondary cleaning) is performed. This secondary cleaning is performed while moving the suction port 5 as in the case of the primary cleaning described above.

  Like this Embodiment 3, after performing the primary cleaning from the flat mesh member 4 side arrange | positioned at the upper surface side of the tray 2, the secondary cleaning is performed from the bottom face side (the flat mesh member 4a side) of the tray 2. As a result, more reliable cleaning can be performed.

  In the third embodiment, cleaning (primary cleaning) is first performed from the upper surface side of the tray 2, and then the tray 2 is turned over to perform cleaning (secondary cleaning) from the bottom surface side of the tray 2. It is also possible to perform a cleaning (primary cleaning) from the bottom side with the tray 2 turned over first, and then turn the tray 2 over and perform a cleaning (secondary cleaning) from the top side. .

  Although not particularly illustrated, in the case of the third embodiment as well, as a suction means, a suction port that covers the entire area of the tray 2 in which the plurality of receiving recesses 1 are disposed (that is, the entire surface of the tray 2). It is possible to use a suction means equipped with a so that the whole is sucked at once. Even in that case, since the gas can be circulated between the bottom surface side and the top surface side of the tray 2, efficient cleaning can be performed.

  In the first to third embodiments, the case where the module part 3 is cleaned has been described as an example. However, the cleaning object in the present invention is not limited to the module part as described above. Various electronic components used to configure various electronic devices such as antenna elements and antenna elements can be used as cleaning objects.

  In addition, the present invention is not limited to the above-described embodiment in other respects, but relates to a specific configuration of the tray, for example, the shape and arrangement of a plurality of receiving recesses, the configuration of the suction means, and the like. Various applications and modifications can be made within the scope of the invention.

1 receiving recess 2 tray 2a tray bottom 2a
3 Electronic parts (module parts)
DESCRIPTION OF SYMBOLS 4 Flat mesh member 4a Flat mesh member used as the bottom part of tray 5 Suction port of suction means 6 Tray partition member 10 Dust 11 Through hole

Claims (4)

Storing electronic components in each of the plurality of storage recesses formed in the tray; and
Disposing a flat mesh member having an opening of a size that does not allow the electronic component to pass therethrough so as to cover an area of the tray where the plurality of receiving recesses are disposed;
Suctioning and removing the dust adhering to the electronic component and the dust present in the housing recess by sucking the inside of the housing recess through the flat mesh member by the suction means. A method for cleaning an electronic component. As the suction means, use is made of a suction means that can cover a plurality of the receiving recesses and has a suction port of a size that does not cover the entire area of the tray where the plurality of receiving recesses are disposed. ,
The suction port performs suction while moving the surface of the flat mesh member, and the suction port is allowed to pass through the entire area of the surface of the flat mesh member where the plurality of receiving recesses are disposed. The electronic component cleaning method according to claim 1, wherein suction is performed for all of the plurality of housing recesses.   The method of cleaning an electronic component according to claim 1 or 2, wherein a tray configured to allow gas to flow between the bottom surface side and the top surface side is used as the tray.   4. The method according to claim 3, further comprising a step of turning the tray upside down and sucking from the bottom surface side of the tray by the suction means in a state where the flat mesh member is disposed on the upper surface side. Cleaning method for electronic components.

Images