JP2014057008A - Circuit device manufacturing method, semiconductor component mounting structure, and circuit device - Google Patents

Abstract

A method of manufacturing a circuit device, a semiconductor device mounting structure, and a circuit device capable of reinforcing a resin at a joint portion in a narrow space, having an excellent mounting joint ratio after joining, and suppressing generation of voids. provide.
A semiconductor component 3 having a conductive connecting member 4 supplied with solder is prepared, and a portion of the circuit board 1 on which the semiconductor component 3 is mounted is in a range along a side peripheral portion 3a of the semiconductor component 3. The conductive connecting member 4 and the land 2 disposed on the outermost side at least along the side peripheral portion 3a of the semiconductor component 3 are first coated with a thermosetting resin composition 6a for side fill containing an organic acid as an activator. By connecting the conductive connecting member 4 and the land 2 by soldering and interfacing between the semiconductor component 3 and the circuit board 1 by being brought into contact with the bonding structure 7, the thermosetting resin for side fill is obtained. The side fill 6b is formed simultaneously by curing the composition 6a.
[Selection] Figure 1

Description

  The present invention relates to a method for manufacturing a mounted circuit device in which a semiconductor component such as a semiconductor package such as a CSP (Chip Scale Package) or a BGA (Ball Grid Array) is mounted on a circuit board, a mounting structure of the semiconductor component, and a circuit device.

  With the spread of small portable devices, semiconductor devices are becoming smaller. For this reason, semiconductor packages such as CSP and BGA are widely used.

  On the other hand, reinforcing resin such as underfill and sidefill has been dispensed and cured for the purpose of reinforcing the joint between the semiconductor package and the circuit board from impact and thermal stress due to dropping.

  As shown in FIGS. 2A to 2D, the underfill is reinforced by previously printing or applying a solder paste 11 on the land 2 on the circuit board 1 (FIG. 2A). A semiconductor component 3 such as CSP or BGA is placed via a conductive connection member 4 such as a bump and connected in a reflow process (FIGS. 2B and 2C). Thereafter, the underfill 12 is dispensed and further after-cured to seal and reinforce the bonding structure 7 of the land 2 and the conductive connection member 5 (FIG. 2D).

  In addition, there is a method of using a pre-coated underfill that is dispensed before mounting in order to cope with high-density mounting, but a void may enter the underfill during simultaneous connection in the reflow process.

  On the other hand, after connecting in the reflow process, instead of dispensing underfill, a method of dispensing and reinforcing side fill only at corner portions is also used.

  However, due to the recent high-density mounting, the space between the mounted components is narrowed, and it becomes difficult to dispense the side fill after connection.

  In order to solve such a problem, as another reinforcing method by the side fill, as shown in FIGS. 3A to 3D, a solder paste 11 is printed or applied in advance on the land 2 on the circuit board 1. After the side fill 13 is dispensed so as not to contact the land 2 (FIG. 3 (a)) (FIG. 3 (b)), the semiconductor component 3 such as CSP or BGA is placed thereon, and the conductive connection member such as a bump. 4 (FIGS. 3C and 3D) have been proposed (see, for example, Patent Document 1).

JP 2007-281393 A

  According to such a reinforcing process by the side fill 13, the post-reflow post-process is not required because the side fill 13 is first applied and the joined structure 7 of the land 2 and the conductive connecting member 5 is reinforced at the same time as the reflow. Is excellent.

  However, since the solder paste 11 is supplied in advance to the lands 2 of the circuit board 1, if the side fill 13 adheres to the land 2 or interferes with the conductive connection member 5, a conduction failure occurs, and the mounting joint ratio after bonding is reduced. There was a problem such as.

  Further, in order to avoid this problem, it is necessary to provide a bonding space for the side fill 13 at the edge portion of the semiconductor component 3, so that it is difficult to apply to a narrow space and the applicable components are limited. There was also.

  The present invention has been made in view of the circumstances as described above, and it is possible to reinforce the resin in the joint portion in a narrow space, has an excellent mounting joint ratio after joining, and can suppress generation of voids. An object of the present invention is to provide a device manufacturing method, a semiconductor component mounting structure, and a circuit device.

  In order to solve the above problems, a method for manufacturing a circuit device according to the present invention includes a step of preparing a semiconductor component having a plurality of conductive connection members supplied with solder, and the semiconductor of a circuit board having a plurality of lands. A step of pre-applying a thermosetting resin composition for side fill containing an organic acid as an activator in a range along the side periphery of the semiconductor component in a portion where the component is mounted; and the conductive connecting member; The semiconductor component is mounted on the circuit board by aligning the land, and the pre-applied thermosetting resin composition for side fill is formed on the back surface along the side periphery of the semiconductor component and the Interfacing with the surface of the circuit board and contacting the junction structure of the conductive connection member and the land disposed at least on the outermost side along the side periphery of the semiconductor component; By performing the process, it is characterized by comprising the step of performing the formation of side-fill due to the curing of the conductive connecting member and the solder according to the side fill thermosetting resin composition for a connection to the land at the same time.

  In this method of manufacturing a circuit device, the side fill seals between the back surface along the side periphery of the semiconductor component and the surface of the circuit board without being exposed to the outside from the side periphery of the semiconductor component. It is preferable to do.

  In this method of manufacturing a circuit device, the thermosetting resin composition for side fill is connected to the conductive connection member disposed on the outermost side along the side periphery of the semiconductor component in the circuit board. It is preferably applied in a range including at least the surface of the land.

  In this method for producing a circuit device, the thermosetting resin composition for side fill is preferably an epoxy resin composition containing an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and the organic acid. .

  In this circuit device manufacturing method, the organic acid is preferably at least one selected from adipic acid, abietic acid, and sebacic acid.

  In this method of manufacturing a circuit device, it is preferable that the plurality of conductive connecting members supplied with the solder have a solder paste on the surface or a flux on the surface of the solder ball.

  In this method of manufacturing a circuit device, the color of the thermosetting resin composition for side fill and the cured product thereof is different from the color of the circuit board and the color of the sealing material of the semiconductor component by visual recognition. It is preferable.

  In the semiconductor component mounting structure of the present invention, the conductive connection member of the semiconductor component and the land of the circuit board are connected by solder, and the side fill is disposed at least on the outermost side along the side periphery of the semiconductor component. A back surface along the side periphery of the semiconductor component and the front surface of the circuit board without being exposed to the outside from the side periphery of the semiconductor component and in contact with the joint structure of the conductive connection member and the land It is characterized by adhesive reinforcement between them.

  The semiconductor component mounting structure of the present invention is a thermosetting resin composition for side fill, in which the conductive connection member of the semiconductor component and the land of the circuit board are connected by solder, and the side fill contains an organic acid as an activator. It is a cured product, and is in contact with a joint structure of the conductive connection member and the land arranged at least on the outermost side along the side periphery of the semiconductor component.

  In the semiconductor component mounting structure, the side fill thermosetting resin composition is preferably an epoxy resin composition containing an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and the organic acid. .

  In this semiconductor component mounting structure, the organic acid is preferably at least one selected from adipic acid, abietic acid, and sebacic acid.

  The circuit device of the present invention is characterized by including the above-described semiconductor component mounting structure.

  According to the method of manufacturing a circuit device, the mounting structure of a semiconductor component, and the circuit device of the present invention, it is possible to reinforce the resin in the joint portion in a narrow space, and has an excellent mounting joint ratio after joining and generation of voids. Can be suppressed.

It is a schematic sectional drawing which shows one Embodiment of the manufacturing method of the circuit apparatus of this invention in order of a process. It is a schematic sectional drawing which shows the reinforcement process by the conventional underfill in order of a process. It is a schematic sectional drawing which shows the reinforcement process by the conventional side fill in order of a process. It is a schematic sectional drawing which shows one Embodiment of the mounting structure of the semiconductor component of this invention. It is a schematic sectional drawing which shows the mounting structure by the conventional side fill.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic cross-sectional view showing an embodiment of a method of manufacturing a circuit device of the present invention, and FIG. 4 is a schematic cross-sectional view showing an embodiment of a semiconductor component mounting structure of the present invention.

  In the circuit device manufacturing method of this embodiment, first, as a first step, a semiconductor component 3 including a plurality of conductive connection members 4 to which solder is supplied is prepared.

  The semiconductor component 3 can be a semiconductor package such as CSP or BGA. Alternatively, a bare chip may be used.

  Examples of the conductive connection member 4 include terminals such as bumps. As shown in FIG. 1B, the conductive connection member 4 includes a solder paste 5a on the surface, and a flux 5b on the solder ball surface. It is done.

  The solder can be used without particular limitation as long as it is usually used for joining the circuit board 1 and the semiconductor component 3. Examples of the solder supply method include a transfer or printing method.

  For example, the solder paste 5a can be used suitably from the ease of solder supply. Here, as the solder paste 5a, for example, a material called cream solder can be used. Cream solder is a composition containing solder particles, a flux component, and a solvent. In component mounting using the cream solder, the solder particles are melted by heating the cream solder to a temperature equal to or higher than the melting point of the solder particles in a reflow furnace. At the same time, the oxide layer on the surface of the solder particles is removed by the flux component at a high temperature, and the solder particles are integrated, thereby ensuring conduction between the land 2 of the circuit board 1 and the conductive connection member 4 of the semiconductor component 3. The In a component mounting process (solder reflow process) using such cream solder, many components can be connected together, and productivity can be improved.

  Further, when supplying the solder, the flux 5b can be supplied to the surface of the solder ball for the purpose of cleaning the conductive connecting member 4 or the like. As the flux 5b, conventionally known materials such as rosin component materials typified by abietic acid, various amines and salts thereof, and high melting point organic acids such as sebacic acid and adipic acid can be used. .

  In the method for manufacturing a circuit device according to this embodiment, as a next step, as shown in FIG. 1A, the semiconductor component 3 in a portion where the semiconductor component 3 of the circuit board 1 having a plurality of lands 2 is mounted. A side-fill thermosetting resin composition 6a containing an organic acid as an activator as a corner reinforcing material is first applied to a range along the side periphery 3a.

  As the thermosetting resin composition 6a for side fill, for example, an epoxy resin composition that is liquid at room temperature containing an epoxy resin, a curing agent, an inorganic filler, and an activator organic acid can be used.

  In the present specification, “liquid at normal temperature” means having fluidity in a temperature range of 5 to 28 ° C. under atmospheric pressure, particularly around 18 ° C. at room temperature.

  As long as the epoxy resin blended in the thermosetting resin composition 6a for side fill has two or more epoxy groups in one molecule, the molecular weight and molecular structure are not particularly limited, and various types are used. Can do.

  Specifically, for example, various epoxy resins such as a glycidyl ether type, a glycidyl amine type, a glycidyl ester type, and an olefin oxidation type (alicyclic), particularly an epoxy resin that is liquid at normal temperature can be used.

  More specifically, for example, bisphenol type epoxy resins such as bisphenol A type epoxy resins and bisphenol F type epoxy resins, hydrogenated bisphenol type epoxy resins such as hydrogenated bisphenol A type epoxy resins and hydrogenated bisphenol F type epoxy resins, Biphenyl type epoxy resin, naphthalene ring-containing epoxy resin, alicyclic epoxy resin, dicyclopentadiene type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, triphenylmethane type epoxy resin, aliphatic epoxy resin, tri Glycidyl isocyanurate or the like can be used. These may be used alone or in combination of two or more.

  The curing agent blended in the thermosetting resin composition 6a for side fill can be used without particular limitation as long as it is usually used as a curing agent for epoxy resins. Specific examples thereof include dicyandiamide, acid anhydrides. , Amine compounds, novolak-type phenol resins (phenol novolak, cresol novolak, phenol aralkyl resin, etc.), various polyhydric phenol compounds such as naphthol aralkyl, naphthol compounds, and the like can be used. These may be used alone or in combination of two or more.

  The blending amount of the curing agent can be appropriately set according to the curing agent to be used. Usually, the stoichiometric equivalent ratio of the curing agent to the epoxy resin (curing agent equivalent / epoxy group equivalent) is 0 to 1.4. More preferably, the equivalent ratio is 0.4 to 1.0.

  When the equivalent ratio is within this range, it is possible to suppress insufficient curing, a decrease in heat resistance of the cured product, a decrease in strength of the cured product, an increase in moisture absorption of the cured product, and the like.

  As the curing accelerator blended in the thermosetting resin composition 6a for side fill, those usually used as a curing accelerator for the resin composition constituting the underfill or side fill can be used without any particular limitation. Specific examples thereof include phosphine compounds such as triphenylphosphine, trimethylphosphine, triethylphosphine, tributylphosphine, tri (p-methylphenyl) phosphine, tri (nonylphenyl) phosphine, and salts thereof, 2-methylimidazole, 2 , 4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecylimidazole, imidazole compounds, imidazole microcapsule type curing accelerators, trie Ruamine, benzyldimethylamine, dimethylbenzylmethylamine, 2- (dimethylaminomethyl) phenol, 2,4,6-tris (dimethylaminomethyl) phenol, 1,8-diazabicyclo (5,4,0) undecene-7, etc. These amine compounds are included. These may be used alone or in combination of two or more.

  As the inorganic filler blended in the thermosetting resin composition 6a for side fill, those usually used as inorganic fillers for the resin composition constituting the underfill and side fill can be used without particular limitation. Specific examples thereof include fused silica, crystalline silica, fine silica, alumina, silicon nitride, and magnesia. These may be used alone or in combination of two or more. The thermal expansion coefficient of the cured product can be adjusted by blending the inorganic filler.

  Examples of the organic acid blended in the side fill thermosetting resin composition 6a include abietic acid, sebacic acid, adipic acid, isophthalic acid, maleic acid, citric acid, glutaric acid, tartaric acid, oxalic acid, propanetricarboxylic acid, and levulin. Examples include acid, phenylbutyric acid, malic acid, succinic acid, malonic acid, phthalic acid, salicylic acid, lactic acid, pyromellitic acid, palmitic acid, oleic acid, stearic acid, and ethylhexanoic acid. Among these, abietic acid Sebacic acid and adipic acid can be preferably used. These organic acids may be used alone or in combination of two or more.

  The content of the organic acid is preferably in the range of 0.1 to 50% by mass and more preferably in the range of 0.5 to 5% by mass with respect to the total amount of the thermosetting resin composition 6a for side fill. If it is within this range, sufficient action as a flux can be exhibited, and the required performance of the side fill 6b can be ensured.

  When the thermosetting resin composition 6a for side fill comes into contact with the conductive connection member 4 of the semiconductor component 3 or the land 2 of the circuit board 1 by blending an organic acid with the thermosetting resin composition 6a for side fill. In addition, it can be given a role as a flux for removing oxide films and dirt on the metal surface.

  That is, by making the thermosetting resin composition 6a for side fill into the above-described configuration, the thermosetting property for side fill can be applied to the conductive connecting member 4 and the land 2 by virtue of the strong adhesiveness of the epoxy resin and the role as flux. Even in a state where the resin composition 6a is in contact, the side fill 6b having sufficient reinforcement and an excellent mounting joint ratio after joining can be obtained.

  The thermosetting resin composition 6a for side fill can further contain other components. Specific examples of such other components include pigments and coupling agents.

  The thermosetting resin composition 6a for side fill can be manufactured by the following procedure, for example. An epoxy resin, a curing agent, a curing accelerator, an organic acid, and other additives are blended simultaneously or separately, and stirring, dissolution, mixing, and dispersion are performed while performing heat treatment or cooling treatment as necessary. Next, an inorganic filler is added to the mixture, and a side-fill thermosetting resin composition 6a is obtained by stirring, mixing, and dispersing again while performing heat treatment or cooling treatment as necessary. Can do. For this stirring, dissolution, mixing, and dispersion, a disper, a planetary mixer, a ball mill, three rolls, or the like can be used in combination.

  The side fill thermosetting resin composition 6a is preferably liquid at 25 ° C. from the viewpoint of workability and workability. Further, the viscosity of the thermosetting resin composition 6a for side fill is preferably 1 to 1000 Pa · s, more preferably 1 to 500 Pa · s, and 1 to 200 Pa · s at 25 ° C. Is more preferable. When the viscosity is within this range, it is possible to suppress a decrease in workability when supplying the side fill thermosetting resin composition 6 a onto the circuit board 1. Here, the viscosity is a value when measured using an E-type rotational viscometer at 25 ° C. and a rotational speed of 0.5 rpm.

  As a method of applying the thermosetting resin composition 6a for side fill onto the circuit board 1 in advance, a normal dispensing method or the like can be applied.

  Further, at least the surface of the land 2 connected to the conductive connection member 4 disposed on the outermost side along the side peripheral portion 3a of the semiconductor component 3 in the circuit board 1 is applied to the side fill thermosetting resin composition 6a. It can also apply | coat to the range to include. The reason why the side fill thermosetting resin composition 6a can be applied to the land 2 is that, as described above, the function as a flux is imparted to the side fill thermosetting resin composition 6a.

  In the circuit device manufacturing method of this embodiment, as a next step, as shown in FIG. 1C, the conductive connection member 4 and the land 2 are aligned, and the semiconductor component 3 is mounted on the circuit board 1, Further, the pre-applied thermosetting resin composition 6a for side fill is interposed between the back surface along the side periphery 3a of the semiconductor component 3 and the surface of the circuit board 1, and at least the semiconductor component 3 It is made to contact with the junction structure 7 of the conductive connection member 4 and the land 2 arranged on the outermost side along the side periphery 3a.

  Here, the semiconductor component 3 can be mounted on the circuit board 1 using a mounter or the like.

  In the method of manufacturing the circuit device of this embodiment, as the next step, as shown in FIG. 1D, a reflow process is performed to connect the conductive connection member 4 and the land 2 with solder and heat for side filling. The side fill 6b is formed at the same time by curing the curable resin composition 6a.

  According to the circuit device manufacturing method of this embodiment as described above, first, the side fill thermosetting resin composition 6a containing an organic acid is dispensed on the circuit board 1, and the conductive connection of the semiconductor component 3 is performed. By supplying and bonding the solder to the member 4, the mounting process can be simplified and mounting in a narrow space is possible.

  Then, the color of the side fill thermosetting resin composition 6a and the cured side fill 6b is the color of the circuit board 1 and the sealing material of the semiconductor component 3 (for example, outside of the semiconductor package in the case of CSP or BGA). It is preferable that the color of the sealing material of the molded body covering the material is a different color distinguished by visual recognition. Thereby, it can confirm visually that the thermosetting resin composition for side fills is apply | coated before and after mounting, and the productivity at the time of mass production can be improved significantly.

  As shown in FIG. 4, the mounting structure of the semiconductor component of this embodiment obtained as described above is such that the conductive connecting member 4 of the semiconductor component 3 and the land 2 of the circuit board 1 are connected by solder, and the side fill 6b is formed. , At least in contact with the joint structure 7 between the conductive connecting member 4 and the land 2 disposed on the outermost side along the side peripheral portion 3 a of the semiconductor component 3 and exposed to the outside from the side peripheral portion 3 a of the semiconductor component 3. Without bonding, the back surface of the semiconductor component 3 along the side periphery 3a and the surface of the circuit board 1 are bonded and reinforced.

  The conductive connecting member 4 of the semiconductor component 3 and the land 2 of the circuit board 1 are connected by solder, and the side fill 6b is a cured product of the thermosetting resin composition 6a for side fill containing an organic acid as an activator. In addition, it is in contact with the junction structure 7 between the conductive connection member 4 and the land 2 arranged at least on the outermost side along the side periphery 3 a of the semiconductor component 3.

  According to such a structure, since the resin composition for the underfill 13b does not contain an organic acid as in the prior art of FIGS. 3 and 5, the underfill 13b is a bonded structure between the semiconductor component 3 and the circuit board 1. Unlike the case where it is separated from 7 and exposed to the outside from the side peripheral portion 3a of the semiconductor component 3, the resin reinforcement of the joint portion in a narrow space is possible, and it has an excellent mounting joint ratio after joining. , The generation of voids can be suppressed.

  EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.

Table 1 shows the components of the underfill and sidefill resin compositions. The following were used as a compounding component. In addition, the compounding quantity of the following compounding components shown in Table 1 represents a mass part.
(Epoxy resin)
Bisphenol F type epoxy resin, Nippon Steel Chemical Co., Ltd. “YDF8170”
(Curing agent)
Acid anhydride, DIC Corporation “B650”
(Curing accelerator)
Microcapsule type latent curing accelerator, Asahi Kasei Chemical Co., Ltd. “HX3722”
(Inorganic filler)
Inorganic filler 1: Tatsumori "SO-32R"
Inorganic filler 2: Nippon Aerosil "# 300"
(Organic acid)
Adipic acid (Tokyo Kasei)
Abietic acid (Tokyo Kasei)
Sebacic acid (Tokyo Kasei)
Glutaric acid (Tokyo Kasei)
The underfill and sidefill resin compositions were prepared by the following method. First, each compounding component other than the inorganic filler shown in Table 1 is blended in the proportions shown in Table 1, and mixed uniformly with a mixer. Then, the inorganic filler is added to this mixture, and stirring, mixing, and dispersion are performed again. Underfill and side fill resin compositions were obtained.

  In addition, cream solder (Senju Metal, S70G Type 4) was used as the solder used in each reinforcing process.

Using the underfill and sidefill resin compositions obtained by the above blending and method, mounting reinforcement of Examples 1 to 8 and Comparative Examples 1 to 4 was performed under the following conditions.
Pre-applied side fill: performed by the process shown in FIG.
Post-fill underfill: Performed by the process shown in FIG.
Post-fill side fill: In the step shown in FIG. 2, the side fill was dispensed in place of the underfill 12 dispense.
Pre-application underfill: In the step shown in FIG. 2, the underfill 12 was dispensed on the substrate in advance before the semiconductor component 3 was placed.
Reflow conditions: 130 ° C. to 185 ° C. (70 s), 220 ° C. to 250 ° C. (1 min)
Underfill after cure conditions: 120 ° C., 60 min
With respect to the circuit device created under the above conditions, measurement and evaluation were performed for dispensing, applying a void under the package after mounting reinforcement, and mounting joint ratio after joining.
[Dispensing]
The distance between the underfill and the side fill that protruded from the side peripheral portion (edge portion) of the semiconductor component in a mounted and reinforced state was measured.
[Void generation under the package after mounting]
The semiconductor component and the circuit board in a state where the mounting was reinforced were cut, and visually evaluated for the presence or absence of voids in the underfill and sidefill.
[Mounting joint rate]
The electrical resistance value was measured for the connectivity of the semiconductor device in which the mounting was reinforced, and the mounting joint ratio was measured from the result.

In addition, the heat cycle test and repairability were evaluated under the following conditions.
[Heat cycle test]
A 0.75 mm thick, 14 mm square semiconductor package was used as the semiconductor package, and an FR-4 circuit board was used as the circuit board.

A semiconductor package was mounted on a circuit board under the above conditions to manufacture a circuit device. The electrical operation of the circuit device was performed, and a non-defective product was subjected to a liquid phase heat cycle test at -40 ° C. for 5 minutes and 85 ° C. for 5 minutes, and then the circuit device after 1000 cycles. The operation was performed and the quality was judged according to the following criteria.
○: Defect rate 0-39%
Δ: Defect rate 40% to 69%
×: defective rate 70% to 100%
[Repairability]
An underfill or sidefill resin composition was applied and cured on an FR-4 substrate at 120 ° C. for 1 h.

Is it possible to heat the test piece to 200 ° C on a hot plate and remove the underfill or side fill on the FR-4 substrate with the bamboo skewer in the heated state to remove the underfill or side fill neatly? Was evaluated according to the following criteria.
○: Underfill or side fill is removed cleanly. Mode in which no underfill or side fill remains on the substrate ×: Underfill or side fill remains. Mode in which resist on substrate is peeled Table 1 shows the results of the above measurement and evaluation.

  From Table 1, Examples 1-8 which carried out mounting reinforcement by applying the thermosetting resin composition for side fills which contains an organic acid as an activator previously showed the outstanding characteristic in all the results.

  On the other hand, Comparative Example 1 in which the mounting reinforcement was performed by the later-inserted underfill and Comparative Example 2 in which the mounting reinforcement was performed by the later-inserted sidefill had a larger dispensing margin than those in Examples 1 to 8, and were mounted in a narrow space. Was confirmed to be difficult.

  Moreover, generation of voids was confirmed in Comparative Examples 1 and 3 using underfill, and the repairability was also inferior.

  Furthermore, the comparative example 4 which did not mix | blend the organic acid with the resin composition of a sidefill was remarkably inferior in mounting joining ratios compared with Examples 1-8.

DESCRIPTION OF SYMBOLS 1 Circuit board 2 Land 3 Semiconductor component 3a Side periphery 4 Conductive connection member 5a Solder paste 5b Flux 6a Thermosetting resin composition for side fill 6b Side fill 7 Joining structure

Claims (12)

Preparing a semiconductor component having a plurality of conductive connection members supplied with solder;
A thermosetting resin composition for side fill containing an organic acid as an activator in a range along a side peripheral portion of the semiconductor component in a portion where the semiconductor component is mounted on a circuit board having a plurality of lands. Applying step;
The conductive connection member and the land are aligned, the semiconductor component is mounted on the circuit board, and the pre-applied thermosetting resin composition for side fill is applied to the side periphery of the semiconductor component. The conductive connecting member disposed between the back surface along the surface and the surface of the circuit board and disposed at least on the outermost side along the side periphery of the semiconductor component is brought into contact with the bonding structure of the land. Process,
A step of performing a reflow process to simultaneously perform solder connection between the conductive connection member and the land and formation of side fill by curing of the thermosetting resin composition for side fill. A method of manufacturing a circuit device.   The said side fill seals between the back surface along the side periphery of the said semiconductor component, and the surface of the said circuit board, without exposing outside from the side periphery of the said semiconductor component. A method for manufacturing the circuit device according to 1.   In the range in which the thermosetting resin composition for side fill includes at least the surface of the land connected to the conductive connection member disposed on the outermost side along the side periphery of the semiconductor component in the circuit board. The circuit device manufacturing method according to claim 1, wherein the circuit device is applied.   The thermosetting resin composition for side fill is an epoxy resin composition containing an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and the organic acid. A manufacturing method of a circuit device given in any 1 paragraph.   The method of manufacturing a circuit device according to claim 1, wherein the organic acid is at least one selected from adipic acid, abietic acid, and sebacic acid.   6. The circuit device according to claim 1, wherein the plurality of conductive connection members supplied with the solder have a solder paste on a surface or a flux on a surface of a solder ball. 6. Manufacturing method.   The color of the thermosetting resin composition for side fill and the cured product thereof is different from the color of the circuit board and the color of the sealing material of the semiconductor component, which are distinguished by visual recognition. The manufacturing method of the circuit apparatus as described in any one of Claim 1 to 6.   The conductive connection member of the semiconductor component and the land of the circuit board are connected by solder, and the side fill is disposed at least on the outermost side along the side periphery of the semiconductor component. It is in contact with the body and adhesively reinforced between the back surface along the side periphery of the semiconductor component and the surface of the circuit board without being exposed to the outside from the side periphery of the semiconductor component. Mounting structure of semiconductor parts.   The conductive connection member of the semiconductor component and the land of the circuit board are connected by solder, and the side fill is a cured product of a thermosetting resin composition for side fill containing an organic acid as an activator, and at least the semiconductor A mounting structure of a semiconductor component, wherein the semiconductor component mounting structure is in contact with a joint structure of the conductive connection member and the land arranged on the outermost side along the side periphery of the component.   The thermosetting resin composition for side fill is an epoxy resin composition containing an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and the organic acid. Mounting structure of semiconductor parts.   11. The semiconductor component mounting structure according to claim 9, wherein the organic acid is at least one selected from adipic acid, abietic acid, and sebacic acid.   A circuit device comprising the mounting structure for a semiconductor component according to claim 8.

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