JP2014055879A - Substrate inspection device and substrate inspection method - Google Patents

Abstract

The accuracy of substrate inspection is improved.
A probe unit 2 configured such that tips of a plurality of probes come into contact with a plurality of contact target regions on a substrate 100, and a moving process for moving the probe unit 2 toward the substrate 100 are executed. The probe includes a moving mechanism 3, an inspection unit 6 that inspects the substrate, and a processing unit 8 that specifies variation in the separation distance between each tip and each contact target region, and each probe is a pair of probes that are close to each other. Is arranged so that each tip is in contact with each contact target region for each set, and the inspection unit 6 is configured so that the pair of probes in each set is in a state where the movement process is being performed. When it is determined whether or not each tip portion is in contact with the contact target region, and the processing unit 8 determines that the tip portion of the pair of probes and the contact target region are in contact by the inspection unit 6 Identifying for each set of variations in the distance on the basis of the displacement of the probe unit 2 in.
[Selection] Figure 1

Description

  The present invention relates to a substrate inspection apparatus and a substrate inspection method for inspecting a substrate using a probe unit having a plurality of probes.

  As this type of board inspection apparatus, a circuit board inspection apparatus disclosed in Japanese Patent Application Laid-Open No. 2011-145136 is known. This circuit board inspection apparatus includes a set base, a pin board, a drive unit, and the like, and is configured to be able to inspect a circuit board. The pin board is provided with a plurality of contact probes, and each contact probe is brought into contact with the circuit board at the time of inspection. The contact probe includes a plunger that comes into contact with the conductive portion of the substrate to be inspected, a barrel into which the plunger is inserted, and an elastic member that is disposed in the barrel and presses the plunger. On the plunger, a marking that is hidden in the barrel when the protruding amount (stroke) of the tip from the barrel is 2/3 of the maximum protruding amount (full stroke) is formed by applying a phosphorescent paint. In addition, a light receiving amount sensor that detects light emitted from the luminous paint of the plunger is provided on the upper surface of the set base. In this circuit board inspection device, the protrusion amount (stroke) of the plunger is determined based on the detection of light by the received light amount sensor, and the pin board is moved by the drive unit so that the protrusion amount becomes an appropriate protrusion amount. Thus, even when the protruding amount of the plunger differs (varies) for each contact probe, each contact probe can be brought into contact with the circuit board.

JP 2011-145136 A (page 8-10, FIG. 1-5)

  However, the conventional circuit board inspection apparatus has the following problems. That is, in this type of circuit board inspection apparatus, for example, depending on the screw tightening method when the pinboard is screwed to the drive unit, the pinboard may be attached in an inclined state with respect to the drive unit. . In such a case, even when there is no variation (or small) in the protruding amount of the plunger for each contact probe, the separation distance between the circuit board and the tip of each contact probe varies (varies) for each contact probe. Therefore, the pressing force against the circuit board by the tip portion of each contact probe differs for each contact probe, and this may cause a decrease in inspection accuracy. In this case, if the variation in the separation distance between the circuit board and the tip of each contact probe can be specified, the inclination of the pinboard relative to the drive unit can be grasped from the result, and as a result, the pinboard Can be corrected. However, in the above circuit board inspection apparatus, although the protrusion amount of the plunger for each contact probe can be determined, the separation distance between the circuit board and the tip of each contact probe is specified for each contact probe. Therefore, it is difficult to cope with such a case.

  The present invention has been made in view of such problems, and a main object of the present invention is to provide a substrate inspection apparatus and a substrate inspection method capable of improving the accuracy of substrate inspection.

  In order to achieve the above object, the substrate inspection apparatus according to claim 1 has a plurality of probes so that each tip portion of each probe comes into contact with a plurality of contact target regions provided on a substrate to be inspected. Based on an electrical signal input via the probe unit, a moving mechanism for executing a moving process for relatively moving one of the probe unit and the substrate toward the other, and the probe unit. A substrate inspection apparatus including an inspection unit for inspecting a substrate, the apparatus including a processing unit for identifying a variation in a separation distance between each of the tip portions and each of the contact target regions, wherein the probes are close to each other A pair of the probes to be arranged is arranged so that each tip part contacts each contact target area corresponding to each of a plurality of sets each including a pair of probes. In the state where the movement process is being performed by the movement mechanism, the inspection unit determines whether the tip end portions of the pair of probes in the pair and the contact target region are in contact with each other. The determination is made based on the electrical signal input through the probe, and the processing unit is determined by the inspection unit to determine that the tip portions of the pair of probes and the contact target region are in contact with each other. The variation in the separation distance is specified for each group based on the relative movement amount by the movement mechanism.

  The substrate inspection apparatus according to claim 2 is the substrate inspection apparatus according to claim 1, wherein the processing unit uses the separation distance for one of the groups as a reference value. Information that associates the difference value between the separation distance and the reference value and the arrangement position of each pair with respect to the other sets except for is generated as information indicating the distribution of the separation distance and stored in the storage unit. Let

  The substrate inspection apparatus according to claim 3 is the substrate inspection apparatus according to claim 2, wherein the processing unit displays an image indicating the distribution of the variation based on information indicating the distribution of the variation in the separation distance. To display.

  According to a fourth aspect of the present invention, there is provided a method for inspecting a plurality of contact target regions provided on a substrate to be inspected in association with a plurality of sets each including a pair of probes adjacent to each other. The probe unit arranged so that each tip portion of each probe is in contact with each group and the substrate are moved relative to each other and input through the probe. A substrate inspection method for inspecting the substrate based on an electrical signal, wherein the tip portions of the pair of probes in the pair and the contact target region are in contact with each other in a state in which the movement process is performed. Is determined based on the electric signal input through the pair of probes, and the tip portions of the pair of probes are in contact with the contact target region. Based on the amount of relative movement until it is determined that identifies a variation in the distance between the respective tip the each contact target area for each of the respective sets.

  Further, the substrate inspection method according to claim 5 is the substrate inspection method according to claim 4, wherein the other distances other than the one set are set by using the separation distance for one of the sets as a reference value. Information in which the difference value between the separation distance and the reference value and the arrangement position of each set are associated with each other is generated as information indicating a distribution of the variation in the separation distance and stored in the storage unit.

  A substrate inspection method according to a sixth aspect is the substrate inspection method according to the fifth aspect, in which an image indicating the distribution of the variation is displayed on the display unit based on the information indicating the distribution of the variation in the separation distance.

  The substrate inspection apparatus according to claim 1 and the substrate inspection method according to claim 4, wherein each set is performed in a state in which a movement process of relatively moving one of the probe unit and the substrate toward the other is performed. For each pair between the tip of each probe and each contact target area based on the relative movement amount of the probe unit relative to the substrate until it is determined that the pair of probes in contact with the contact target area The variation in the separation distance is specified. For this reason, according to this board | substrate inspection apparatus and board | substrate inspection method, the probe unit is attached in the state which inclined with respect to the attachment part of a moving mechanism, or the protrusion amount of the front-end | tip part of a probe may be uneven. Can be easily grasped from the state of variation in the separation distance. For this reason, in this board inspection device and board inspection, the accuracy of the board inspection can be sufficiently improved by performing maintenance to correct the probe unit mounting state or to correct the uneven protrusion of the probe. Can do. Moreover, in this board | substrate inspection apparatus and board | substrate inspection method, the dispersion | variation in a separation distance is specified in the state which is performing the movement process. That is, the variation in the separation distance is specified when the inspection of the inspection target substrate is executed. For this reason, according to this board | substrate inspection apparatus and board | substrate inspection method, since it is not necessary to perform the process which pinpoints the dispersion | variation in a separation distance separately from a test | inspection, test efficiency can fully be improved correspondingly.

  Further, in the substrate inspection apparatus according to claim 2 and the substrate inspection method according to claim 5, the separation distance for one set is used as a reference value, and the separation distance and the reference value for another set excluding the one set. Is generated as information indicating the distribution of the variation in the separation distance by associating the difference value with the arrangement position of each set, and stored in the storage unit. Therefore, according to the substrate inspection apparatus and the substrate inspection method, the probe unit is inclined with respect to the mounting portion of the moving mechanism by reading out the information from the storage unit as needed and analyzing the information. And that the amount of protrusion at the tip of the probe is uneven can be easily grasped.

  Further, in the substrate inspection apparatus according to claim 3 and the substrate inspection method according to claim 6, movement is performed by displaying an image showing the distribution of variation on the display unit based on information indicating the distribution of variation in the separation distance. It can be intuitively understood from the image that the probe unit is inclined with respect to the attachment portion of the mechanism and that the protruding amount of the tip portion of the probe is not uniform.

1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1. FIG. 2 is a configuration diagram showing a configuration of a probe unit 2. FIG. 2 is a plan view showing a configuration of a probe unit 2. FIG. It is explanatory drawing explaining the board | substrate inspection method using the board | substrate inspection apparatus.

  Embodiments of a substrate inspection apparatus and a substrate inspection method according to the present invention will be described below with reference to the drawings.

  First, the configuration of the substrate inspection apparatus 1 will be described. As shown in FIG. 1, the substrate inspection apparatus 1 shown in FIG. 1 includes a probe unit 2, a moving mechanism 3, a mounting table 4, a measurement unit 5, an inspection unit 6, a storage unit 7, and a processing unit 8, which will be described later. The substrate 100 can be inspected according to the substrate inspection method.

  As an example, the probe unit 2 includes a support portion 11, a plurality of probes 12, and an electrode plate 13, as shown in FIG.

  As shown in FIG. 2, the support unit 11 includes, for example, a first support plate 31, a second support plate 32, and a connecting unit 33, and is configured to support the probe 12. The first support plate 31 is a member that supports the distal end portion 21 side of the probe 12 and is formed in a plate shape from a non-conductive resin material or the like. The first support plate 31 has a plurality of insertion holes. In this case, the insertion hole allows the insertion of the distal end portion 21 of the probe 12 and has a size capable of restricting the insertion of the central portion 22 of the probe 12, that is, its diameter is larger than the diameter of the distal end portion 21. In addition, the diameter is smaller than the diameter of the central portion 22.

  The second support plate 32 is a member that supports the proximal end portion 23 side of the probe 12 and is formed in a plate shape from a non-conductive resin material or the like. The second support plate 32 has a plurality of insertion holes. In this case, the insertion hole is formed so that the center portion 22 of the probe 12 can be inserted, that is, the diameter thereof is larger than the diameter of the center portion 22.

  As shown in FIG. 2, the connecting portion 33 connects the first support plate 31 and the second support plate 32 in a parallel state.

  The probe 12 is used to input / output an electric signal by bringing the tip 21 into contact with a conductor pattern 101 (corresponding to a contact target region: see FIG. 4) of the substrate 100 at the time of inspection. It is formed in the shape of a rod that can be elastically deformed by a metallic material having a property (for example, beryllium copper alloy, SKH (high speed tool steel), tungsten steel, etc.). Further, as shown in FIG. 2, the distal end portion 21 and the proximal end portion 23 of the probe 12 are each formed sharply. An insulating layer is formed on the peripheral surface of the central portion 22 of the probe 12. For this reason, the diameter of the central portion 22 is larger than the diameter of the distal end portion 21 and the diameter of the proximal end portion 23.

  In the probe unit 2, the probe 12 is in a state where the distal end portion 21 is inserted through the insertion hole of the support plate 31 and the proximal end portion 23 is inserted through the insertion hole of the second support plate 32 as shown in FIG. 2. It is supported by the support part 11. Further, as shown in the figure, the probe 12 is supported by the support portion 11 in a state where the central portion 22 is slightly curved in the initial state. In this case, when the probe unit 2 is moved as a whole in a direction approaching the substrate 100, the tip 21 comes into contact with the conductor pattern 101 of the substrate 100, and the probe 12 from the conductor pattern 101 applied at this time The amount of bending of the central portion 22 increases or decreases according to the pressing force (reaction force), and thereby the amount of protrusion from the support portion 11 (first support plate 31) changes (increases or decreases).

  In the probe unit 2, as shown in FIG. 3, each probe 12 is composed of a plurality (in this example, 110) of pairs each including a pair of adjacent probes 12 as one set. In addition, each probe 12 is arranged so that a pair of probes 12 in each set comes in contact with the conductor pattern 101 associated with each set (that is, in contact with the same conductor pattern 101 for each set). 12 is arranged.

  The electrode plate 13 is formed in a plate shape from a non-conductive resin material or the like, and is disposed on the upper portion of the second support plate 32 of the support portion 11 as shown in FIG. In addition, a terminal having conductivity is fitted into a contact portion of each electrode 12 on the electrode plate 13 with each base end portion 23, and the probe 12 and the measurement unit 5 are electrically connected to each terminal. Cables not shown for connection are connected to each other.

  The moving mechanism 3 includes an attachment portion (not shown) for attaching the probe unit 2, and the probe unit 2 is placed on the mounting table 4 (the substrate 100 placed on the mounting table 4) according to the control of the processing unit 8. A moving process is performed in which the robot moves in a direction toward and away from. The mounting table 4 is configured to be able to mount the substrate 100 and to be able to fix the mounted substrate 100. The measurement unit 5 measures the resistance value Rm based on an electric signal input / output via the probe 12 according to the control of the processing unit 8.

  The inspection unit 6 determines whether the substrate 100 is good or bad (whether the conductor pattern 101 is broken or short-circuited) from the resistance value Rm measured by the measurement unit 5 based on the electric signal input through the probe 12 according to the control of the processing unit 8. An inspection process for inspecting is executed. The inspection unit 6 determines whether or not the pair of probes 12 in each set of the probe units 2 and the conductor pattern 101 of the substrate 100 are in contact with each other in a state where the movement process is being performed by the movement mechanism 3. The contact determination process for determining based on the electric signal input through the probe 12 is executed.

  The storage unit 7 temporarily stores the resistance value Rm measured by the measurement unit 5 according to the control of the processing unit 8. Further, the reference value Rs used in the inspection process executed by the inspection unit 6 is stored. Furthermore, the storage unit 7 stores distribution data Dd described later generated by the processing unit 8.

  The processing unit 8 controls movement processing by the moving mechanism 3 and inspection processing by the inspection unit 6. Further, the processing unit 8 causes the moving mechanism 3 to move the probe unit 2 from when the movement starts until the pair of probes 12 and the conductor pattern 101 in each set come into contact with each other (when the inspection unit 6 determines that). The relative movement amount L (movement amount from the initial position) is specified, and the tip 21 of each probe 12 and each conductor pattern 101 at the movement start time (initial state) based on the movement amount L The separation distance A is specified for each group. Further, the processing unit 8 generates distribution data Dd indicating the distribution of variation in the separation distance A for each set and stores the distribution data Dd in the storage unit 7. Further, the processing unit 8 generates an image showing the distribution of the variation in the separation distance A based on the distribution data Dd and displays the generated image on a display unit (not shown).

  Next, a substrate inspection method for inspecting the substrate 100 using the substrate inspection apparatus 1 will be described with reference to the drawings.

  First, the substrate 100 is mounted on the mounting surface of the mounting table 4, and then the substrate 100 is fixed to the mounting table 4 by a fixing tool (not shown). Subsequently, the substrate inspection apparatus 1 is operated. At this time, the processing unit 8 controls the measurement unit 5 to execute the measurement process. In this measurement process, the measurement unit 5 repeatedly performs a process of measuring the resistance value Rm at predetermined time intervals based on electrical signals input / output via each probe 12.

  Further, the processing unit 8 controls the moving mechanism 3 to execute the moving process. In this moving process, the moving mechanism 3 moves (lowers) the probe unit 2 in a direction approaching the substrate 100 (the mounting surface of the mounting table 4).

  Moreover, the process part 8 controls the test | inspection part 6, and performs a contact determination process. In this contact determination process, the inspection unit 6 compares the resistance value Rm repeatedly measured by the measurement unit 5 with the reference value Rs stored in the storage unit 7 and compares the resistance value Rm between the pair of probes 12 in each group. When the resistance value Rm is equal to or less than the reference value Rs, it is determined that the pair of probes 12 (for example, the pair of probes 12 in the set C1 shown in FIG. 4) and the conductor pattern 101 are in contact with each other (hereinafter, It is also referred to as “contact judgment”. In this case, the reference value Rs is defined as a value slightly larger than the resistance value Rm measured by the measurement unit 5 when the pair of probes 12 in each set is in contact with the conductor pattern 101.

  In addition, the processing unit 8 moves when the moving mechanism 3 moves the probe unit 2 from the time when the probe unit 2 starts moving by the moving mechanism 3 to when the contact is determined when the inspection unit 6 determines the contact. The quantity L is specified. Further, the processing unit 8 specifies the separation distance A between the initial position (position before the start of the movement process) of the tip 21 of each probe 12 and each conductor pattern 101 based on the movement amount L.

  Next, the processing unit 8 specifies the movement amount L and the separation distance A based on the movement amount L every time when the inspection unit 6 determines contact with each of the pair of probes 12 in all sets. Further, when the identification of the separation distance A is completed for all the groups, the processing unit 8 identifies the variation in the separation distance A for each group. Specifically, the processing unit 8 is an example of a specific set (first set of each set) in which contact is first determined by the inspection unit 6. In this example, the set shown in FIG. Using the separation distance A for C1) as a reference value, a difference value between the reference value and the separation distance A for other groups is calculated for each group. Subsequently, the distribution data Dd in which the arrangement position of each set is associated with the calculated difference value is generated as information indicating the variation distribution of the separation distance A and stored in the storage unit 7.

  On the other hand, the processing unit 8 controls the moving mechanism 3 to move the probe unit 2 by a predetermined amount of movement when all the probes 12 contact the conductor pattern 101 (contact determination is made by the inspection unit 6). Further move (lower). Thereby, the front-end | tip part 21 of all the probes 12 is made to contact the conductor pattern 101 reliably.

  Next, the processing unit 8 controls the inspection unit 6 to execute inspection processing. In this inspection process, the inspection unit 6 inspects the conductor pattern 101 for disconnection and short circuit based on the resistance value Rm measured by the measurement unit 5. Subsequently, the processing unit 8 displays the inspection result on a display unit outside the drawing. Thus, the inspection of the substrate 100 is completed.

  Further, the processing unit 8 generates an image indicating the distribution of the variation in the separation distance A based on the distribution data Dd and displays the generated image on the display unit. Here, when the variation in the separation distance A is large, the probe unit 2 is attached in an inclined state with respect to the attachment portion of the moving mechanism 3 or the tip portion 21 of the probe 12 from the support portion 11 of the probe unit 2 is attached. The amount of protrusion may be uneven. In such a state, there is a possibility that a difference occurs in the pressure with which the tip portion 21 of each probe 12 presses the conductor pattern 101, which may cause a decrease in inspection accuracy. In this board inspection apparatus 1, the probe unit 2 is inclined with respect to the mounting portion of the moving mechanism 3 from the image showing the distribution of the variation in the separation distance A generated based on the distribution data Dd, It is possible to easily grasp that the protruding amount of the distal end portion 21 is not uniform.

  Specifically, for example, an image is displayed showing that the separation distance A gradually increases (or decreases) from one end of the probe unit 2 toward the other end facing the end. When this occurs, it can be easily grasped from the image that the probe unit 2 is inclined. Further, when an image showing that only the separation distance A of some probes 12 in the probe unit 2 is large (or small) is displayed, the amount of protrusion of the distal end portion 21 of the probe 12 from the image is not uniform. Can be easily grasped. For this reason, in this board | substrate inspection apparatus 1, the maintenance using such distribution data Dd can be performed, As a result, it is possible to remove reliably the cause of the fall of inspection accuracy.

  Next, when inspecting another substrate 100, a new substrate 100 is mounted on the mounting table 4 and fixed, and then the substrate inspection apparatus 1 is operated. At this time, the processing unit 8 executes each process described above. In this case, in the state in which the moving process is being performed by the moving mechanism 3, the processing unit 8 varies the separation distance A for each group between the tip portion 21 of each probe 12 and each conductor pattern 101. In particular, the distribution data Dd is generated. Further, the processing unit 8 controls each unit as described above to execute the inspection process.

  Thus, in the substrate inspection apparatus 1 and the substrate inspection method, the pair of probes 12 and the conductor pattern 101 in each set are in contact with each other in a state in which the movement process for moving the probe unit 2 toward the substrate 100 is performed. The distance A for each set between the tip 21 of each probe 12 and each conductor pattern 101 based on the amount of movement L (the amount of movement from the initial position) of the probe unit 2 until it is determined that Identify variations in For this reason, according to this board | substrate inspection apparatus 1 and a board | substrate inspection method, the probe unit 2 is attached in the state which inclined with respect to the attachment part of the moving mechanism 3, or the protrusion amount of the front-end | tip part 21 of the probe 12 is uneven. It can be easily grasped from the state of variation in the separation distance A. For this reason, in this board | substrate inspection apparatus 1 and a board | substrate inspection method, maintenance of correcting the attachment state of the probe unit 2 or correcting the protrusion amount of the non-uniform | heterogenous probe 12 is performed, and the precision of board | substrate inspection is enough. Can be improved. Moreover, in this board | substrate inspection apparatus 1 and a board | substrate inspection method, the dispersion | variation in the separation distance A is specified in the state which is performing the movement process moved toward the board | substrate 100. FIG. That is, the variation in the separation distance A is specified when the inspection of the substrate 100 to be inspected is performed. For this reason, according to this board | substrate inspection apparatus 1 and a board | substrate inspection method, since it is not necessary to perform the process which specifies the dispersion | variation in the separation distance A separately from a test | inspection, test efficiency can fully be improved correspondingly.

  Moreover, in this board | substrate inspection apparatus 1 and the board | substrate inspection method, the separation distance A about one group is made into a reference value, the difference value of the separation distance A and reference values about other groups except the one group, and each group The distribution data Dd indicating the distribution of the variation in the separation distance A is generated in association with the arrangement positions of the data and stored in the storage unit 7. For this reason, according to the substrate inspection apparatus 1 and the substrate inspection method, the distribution data Dd is read from the storage unit 7 as necessary, and the distribution data Dd is analyzed, whereby the attachment unit of the moving mechanism 3 is analyzed. It can be easily grasped that the probe unit 2 is inclined and the amount of protrusion of the tip portion 21 of the probe 12 is not uniform.

  Moreover, in this board | substrate inspection apparatus 1 and a board | substrate inspection method, with respect to the attachment part of the moving mechanism 3, it produces | generates the image which shows the distribution of the dispersion | variation in the separation distance A based on distribution data Dd, and displays it on a display part. It can be intuitively grasped from the image that the probe unit 2 is inclined and that the protruding amount of the tip portion 21 of the probe 12 is uneven.

  The substrate inspection apparatus and the substrate inspection method are not limited to the above configuration and method. For example, the example of executing the process for specifying the variation in the separation distance A for each inspection has been described above. However, the configuration and method for executing the process for specifying the variation in the separation distance A once for a plurality of inspections. It can also be adopted. In addition, a configuration and a method for executing a process for specifying a variation in the separation distance A using a dummy substrate configured similarly to the substrate 100 to be inspected may be employed.

  Further, the example in which the processing unit 8 generates an image indicating the distribution of the variation in the separation distance A based on the distribution data Dd and displays the image on the display unit has been described above. However, the distribution data Dd is captured by an external device such as a personal computer. The distribution data Dd is used to display an image showing the distribution of variation in the separation distance A, whether the probe unit 2 is inclined, and whether the amount of protrusion of the tip 21 of the probe 12 is uneven. It is also possible to employ a configuration and method that is used and determined by an external device.

  Further, the example using the probe unit 2 provided with the elastically deformable rod-shaped probe 12 has been described above. However, the cylindrical housing, the rod-shaped (needle-shaped) slide portion in which the base end side is accommodated in the housing, and It is also possible to employ a configuration and method using a probe unit including a probe that is biased by a coil spring and configured to change the amount of protrusion of the tip from the housing.

  Further, although the configuration and method for moving the probe unit 2 toward the substrate 100 have been described above, a configuration and method for moving the substrate 100 toward the probe unit 2 may be employed. In this configuration and method, the movement amount by which the substrate 100 is moved toward the probe unit 2 corresponds to the above-described movement amount L (relative movement amount). Further, a configuration and a method in which both the probe unit 2 and the substrate 100 are moved so that the probe unit 2 and the substrate 100 are close to each other may be employed. In this configuration and method, the total value of the amount of movement of moving the probe unit 2 toward the substrate 100 and the amount of movement of moving the substrate 100 toward the probe unit 2 is the above-described movement amount L (relative to the substrate 100). This is equivalent to the relative movement amount of the probe unit 2.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 2 Probe unit 3 Movement mechanism 6 Inspection part 7 Memory | storage part 8 Processing part 12 Probe 21 Tip part 100 Substrate 101 Conductor pattern A Separation distance Dd Distribution data L Movement amount

Claims (6)

A probe unit configured to have a plurality of probes and a plurality of contact target areas provided on a substrate to be inspected to be in contact with each tip, and any of the probe unit and the substrate A substrate inspection apparatus comprising: a movement mechanism that performs a movement process for relatively moving one of the two toward the other; and an inspection unit that inspects the substrate based on an electrical signal input via the probe. ,
A processing unit that identifies variations in the separation distance between each of the tip portions and each of the contact target regions;
The probes are arranged so that the tip portions of the probes come into contact with the contact target regions respectively associated with a plurality of sets each including a pair of the probes adjacent to each other. And
In the state where the movement process is being performed by the movement mechanism, the inspection unit determines whether the tip end portions of the pair of probes in the pair and the contact target region are in contact with each other. Discriminate based on the electrical signal input through the probe,
The processing unit is based on the relative movement amount by the moving mechanism until the inspection unit determines that the tip portions of the pair of probes are in contact with the contact target region. A substrate inspection apparatus for specifying a variation in a separation distance for each set.   The processing unit uses the separation distance for one set of the sets as a reference value, and the difference value between the separation distance and the reference value for the other sets other than the one set, and the sets. The board | substrate inspection apparatus of Claim 1 which produces | generates the information matched with the arrangement position of this as information which shows the distribution of the dispersion | variation in the said separation distance, and memorize | stores it in a memory | storage part.   The substrate inspection apparatus according to claim 2, wherein the processing unit displays an image indicating the distribution of the variation on the display unit based on information indicating the distribution of the variation in the separation distance. Each tip portion of each probe is associated with each of a plurality of contact target areas provided on a substrate to be inspected in association with a plurality of sets each including a pair of probes adjacent to each other. A substrate that inspects the substrate based on an electrical signal that is input through the probe, by performing a movement process of relatively moving either one of the probe unit and the substrate arranged so as to contact each other toward the other. An inspection method,
In the state in which the movement process is being performed, the electrical signal that is input via the pair of probes whether or not the tip portions of the pair of probes in the pair are in contact with the contact target region Each tip portion and each contact target based on the relative movement amount until it is determined that the tip portions of the pair of probes are in contact with the contact target region. A substrate inspection method for specifying a variation in a separation distance between regions for each group.   Using the separation distance for one set of the sets as a reference value, a difference value between the separation distance and the reference value for the other sets other than the one set, and an arrangement position of each set The board | substrate inspection method of Claim 4 which produces | generates the matched information as information which shows the distribution of the dispersion | variation in the said separation distance, and memorize | stores it in a memory | storage part.   The substrate inspection method according to claim 5, wherein an image indicating the distribution of the variation is displayed on a display unit based on information indicating the distribution of the variation in the separation distance.

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