JP2014053367A - Organic semiconductor device and attachment method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inhibit contact between a sealing member and an organic semiconductor element even if force is applied to the sealing member and a substrate.SOLUTION: An organic semiconductor element 20 is mounted on a first surface 12 of a substrate 10. A sealing member 30 contacts with the first surface 12 of the substrate 10 at a part (an end part in an example shown in the figure) thereof and shields a space including the organic semiconductor element 20 from the exterior. First magnets 50 are attached to the sealing member 30. Second magnets 52 are attached to a second surface 14 that is an opposite surface of the first surface 12 in the substrate 10 in a manner that the second magnets repel the first magnets 50.

Description

  The present invention relates to an organic semiconductor device and a method for mounting the organic semiconductor device.

  In recent years, organic semiconductor devices such as organic EL (Electroluminescence) devices have been developed. As a technique regarding the organic EL device, there are techniques described in Patent Documents 1 to 4, for example.

  Patent Document 1 describes that a magnet layer is provided on the surface opposite to the light extraction side of the substrate on which the organic EL element is formed. This magnet layer is used for attaching a lighting device having an organic EL device to another object.

  Patent Document 2 describes that a magnet sheet is mounted on the back surface of a main body having an organic EL sheet. This magnet sheet is also used to attach the main body to another object.

  Patent Document 3 describes a device in which an organic EL panel is attached to a lighting fixture. Patent Document 3 describes that, as a method of attaching an organic EL panel to a lighting fixture, both the electrode of the organic EL panel and the electrode of the lighting fixture are used as magnets.

  Patent Document 4 describes that an insulating film is bonded to a substrate made of a ferromagnetic material, and that a light-emitting element having a layer containing an organic compound is provided on the insulating film.

International Publication No. 2009/025286 Pamphlet JP 2006-012758 A JP 2011-243431 A International Publication No. 2004/040649 Pamphlet

  An organic semiconductor element included in an organic semiconductor device is often sealed with a sealing member in order to improve durability. For example, a sealing member is provided on a substrate on which an organic semiconductor element is formed, and a space including the organic semiconductor element is shielded from the outside. In this case, when a force is applied to the sealing member or the substrate, the sealing member or the substrate is deformed, and as a result, there is a possibility that the sealing member and the organic semiconductor element come into contact with each other. When the sealing member and the organic semiconductor element come into contact with each other, the organic semiconductor element is damaged.

  An example of a problem to be solved by the present invention is to suppress contact between the sealing member and the organic semiconductor element even when a force is applied to the sealing member or the substrate.

The invention according to claim 1 is an organic semiconductor element;
A substrate on which the organic semiconductor element is mounted on the first surface;
A sealing member that is partially in contact with the first surface of the substrate, has an overlapping region that overlaps the organic semiconductor element in plan view, and shields a space including the organic semiconductor element from the outside;
A proximity suppression unit that suppresses the overlapping region from approaching the first surface;
It is an organic semiconductor device provided with.

The invention according to claim 7 is an organic EL element;
A substrate on which the organic EL element is mounted on the first surface;
A sealing member that partially contacts the first surface of the substrate and shields a space including the organic EL element from the outside;
A first magnet attached to the sealing member;
A second magnet attached to a second surface, which is a surface opposite to the first surface of the substrate, in a direction repelling the first magnet;
Preparing an organic semiconductor device comprising:
After installing the organic semiconductor device, the step of removing the magnet attached to the emission surface that emits the light emitted by the organic EL element to the outside from the first magnet and the second magnet;
An organic semiconductor device mounting method comprising:

It is sectional drawing which shows the structure of the organic-semiconductor device which concerns on 1st Embodiment. It is sectional drawing which shows the structure of the organic EL element which is an example of an organic semiconductor element. It is a figure for demonstrating the manufacturing method of an organic-semiconductor device. It is a figure for demonstrating the usage method of an organic-semiconductor device. It is a figure for demonstrating the usage method of an organic-semiconductor device. It is a figure for demonstrating the 1st example of the plane layout of a 1st magnet, a 2nd magnet, and a desiccant. It is a figure for demonstrating the 2nd example of the planar layout of a 1st magnet, a 2nd magnet, and a desiccant. It is sectional drawing which shows the modification of FIG. It is sectional drawing which shows the structure of the organic-semiconductor device which concerns on 2nd Embodiment. It is sectional drawing which shows the structure of the organic-semiconductor device which concerns on 3rd Embodiment. It is sectional drawing which shows the modification of FIG. It is sectional drawing which shows the structure of the organic-semiconductor device which concerns on 4th Embodiment. It is sectional drawing which shows the structure of the organic-semiconductor device which concerns on 5th Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

(First embodiment)
FIG. 1 is a cross-sectional view illustrating a configuration of an organic semiconductor device 100 according to the first embodiment. The organic semiconductor device 100 includes the organic semiconductor element 20, the substrate 10, the sealing member 30, and the proximity suppressing unit (the first magnet 50 and the second magnet 52). The organic semiconductor element 20 is mounted on the first surface 12 of the substrate 10. The sealing member 30 is partially in contact with the first surface 12 of the substrate 10 (the end in the example shown in the figure) and has an overlapping region 32 that overlaps the organic semiconductor element 20 in plan view. . The sealing member 30 shields the space including the organic semiconductor element 20 from the outside. The proximity suppression unit suppresses the overlapping region 32 from approaching the first surface 12. For this reason, even if force is applied to the substrate 10 or the sealing member 30, the contact between the sealing member 30 and the organic semiconductor element 20 can be suppressed. Details will be described below.

  In the example shown in the figure, the proximity suppressing unit includes a first magnet 50 and a second magnet 52. The first magnet 50 is attached to the sealing member 30. The second magnet 52 is attached to the second surface 14 of the substrate 10, which is the surface opposite to the first surface 12, so as to repel the first magnet 50. For this reason, even if force is applied to the substrate 10 or the sealing member 30, the first magnet 50 and the second magnet 52 repel each other, so that the sealing member 30 and the organic semiconductor element 20 can be prevented from contacting each other.

  The organic semiconductor element 20 has a plurality of organic layers. The organic semiconductor element 20 is formed by laminating the plurality of organic layers on the substrate 10. The organic semiconductor element 20 is, for example, an organic EL element, an organic memory, and an organic solar battery. The substrate 10 is formed of a resin such as quartz, glass, metal, or plastic.

  In the example shown in this figure, the organic semiconductor device 100 is a lighting device, and the organic semiconductor element 20 is an organic EL element. The light emitted from the organic semiconductor element 20 is emitted to the outside through the substrate 10. For this reason, the substrate 10 needs to transmit light emitted from the organic semiconductor element 20. In this case, the substrate 10 is made of quartz, glass, or a transparent resin.

  The sealing member 30 blocks the organic semiconductor element 20 from the outside air. The sealing member 30 is made of a resin such as quartz, glass, metal, or plastic. The sealing member 30 has a shape in which the edge of the flat plate is bent by approximately 90 ° toward the substrate 10. In addition, the end surface of the bent portion of the sealing member 30 is fixed to the substrate 10 via the fixed layer 64. The fixed layer 64 is, for example, an adhesive layer. Note that a space surrounded by the sealing member 30 and the substrate 10 is filled with a specific gas or liquid.

  The first magnet 50 is fixed to the sealing member 30 using, for example, an adhesive or a double-sided tape. A recess may be formed in a portion of the sealing member 30 to which the first magnet 50 is attached. In this case, an adhesive or a double-sided tape is provided in the recess. The depth of the recess may be set so that the upper surface of the first magnet 50 forms the same surface as the outer surface of the sealing member 30, or the upper surface of the first magnet 50 is more than the outer surface of the sealing member 30. You may set so that it may come out.

  In the present embodiment, the first magnet 50 is fixed to the outer surface of the sealing member 30. For this reason, even if the first magnet 50 is attached to the sealing member 30, the first magnet 50 does not contact the organic semiconductor element 20.

  The second magnet 52 is attached to the second surface 14 of the substrate 10. As described above, the light emitted from the organic semiconductor element 20 is radiated to the outside through the substrate 10. For this reason, when the second magnet 52 remains attached to the substrate 10, the light emitted from the organic semiconductor element 20 is blocked by the second magnet 52. On the other hand, in the present embodiment, the second magnet 52 is provided so as to be removable from the substrate 10. Specifically, the second magnet 52 is attached to the second surface 14 (the emission surface) of the substrate 10 via a release sheet 70 (a release member). The release sheet 70 is provided so as to be peelable from the substrate 10. For this reason, after the possibility that force is applied to the substrate 10 and the sealing member 30 is eliminated, the second magnet 52 can be removed from the substrate 10 by peeling the release sheet 70 from the second surface 14 of the substrate 10. In this case, the light emitted from the organic semiconductor element 20 is not blocked by the second magnet 52.

  The second magnet 52 is fixed to the release sheet 70 through the fixed layer 62. The fixed layer 62 is, for example, an adhesive or a double-sided tape.

  In the present embodiment, the first magnet 50 and the second magnet 52 at least partially overlap each other in plan view. If it does in this way, since the repulsive force of the 1st magnet 50 and the 2nd magnet 52 becomes large, it can further suppress that sealing member 30 and organic-semiconductor element 20 contact.

  In addition to the organic semiconductor element 20, a desiccant 40 is also disposed in the space surrounded by the sealing member 30 and the substrate 10. In the example shown in the figure, the desiccant 40 is fixed to the inner surface of the sealing member 30, that is, the surface facing the substrate 10. In this case, since the desiccant 40 protrudes from the inner surface of the sealing member 30 toward the organic semiconductor element 20, the desiccant 40 is easier to contact the organic semiconductor element 20 than the sealing member 30. However, in this embodiment, since the 1st magnet 50 and the 2nd magnet 52 are being fixed to the direction which mutually repels, it can suppress that the desiccant 40 and the organic-semiconductor element 20 contact.

  In particular, in the present embodiment, the desiccant 40 at least partially overlaps the first magnet 50 and the second magnet 52 in plan view. For this reason, it can further suppress that desiccant 40 contacts organic semiconductor element 20.

  FIG. 2 is a cross-sectional view illustrating the structure of an organic EL element that is an example of the organic semiconductor element 20. This organic EL element has a laminated structure in which an anode 202, a hole injection layer 204, a hole transport layer 206, a light emitting layer 208, an electron transport layer 210, an electron injection layer 212, and a cathode 214 are laminated on the substrate 10 in this order. have. Among these, the anode 202, the hole injection layer 204, the hole transport layer 206, the light emitting layer 208, the electron transport layer 210, and the electron injection layer 212 may be formed by any method of coating and vapor deposition. In addition, when formed by a vapor deposition method, the following are illustrated as a material of each layer.

  Examples of the phosphorescent organic compound used for the light-emitting layer 208 include iridium complexes such as Bis (3,5-difluoro-2- (2-pyridyl) phenyl- (2-carboxypyridyl) iridium (III), Tris (2-phenylpyridine). ) iridium (III), Bis (2-phenylbenzothiazolato) (acetylacetonate) iridium (III), Osmium (II) bis (3-trifluoromethyl-5- (2-pyridyl) -pyrazolate) dimethylphenylphosphine, a rare earth compound Tris Examples include (dibenzoylmethane) phenanthroline europium (III), platinum complexes 2,3,7,8,12,13,17,18-Octaethyl-21H, 23H-porphine, platinum (II) and the like.

  In addition, as an organic compound having an electron transporting property which is a main component of the light-emitting layer 208, the electron transport layer 210, and the electron injection layer 212, polycyclic compounds such as p-terphenyl and quaterphenyl and derivatives thereof, naphthalene Condensed polycyclic hydrocarbon compounds such as tetracene, pyrene, coronene, chrysene, anthracene, diphenylanthracene, naphthacene, phenanthrene and their derivatives, phenanthroline, bathophenanthroline, phenanthridine, acridine, quinoline, quinoxaline, phenazine, etc. Ring compounds and their derivatives, fluorescein, perylene, phthaloperylene, naphthaloperylene, perinone, phthaloperinone, naphthaloperinone, diphenylbutadiene, tetraphenylbutadiene, oxadiazole, alda Bisbenzoxazoline, bisstyryl, pyrazine, cyclopentadiene, oxine, aminoquinoline, imine, diphenylethylene, vinylanthracene, diaminocarbazole, pyran, thiopyran, polymethine, merocyanine, quinacridone, rubrene, etc. and their derivatives be able to.

  Further, as an organic compound having an electron transporting property, a metal chelate complex compound, particularly a metal chelated oxanoid compound, tris (8-quinolinolato) aluminum, bis (8-quinolinolato) magnesium, bis [benzo (f) -8-quinolinolato ] Zinc, bis (2-methyl-8-quinolinolato) (4-phenyl-phenolato) aluminum, tris (8-quinolinolato) indium, tris (5-methyl-8-quinolinolato) aluminum, 8-quinolinolatolithium, tris Examples also include metal complexes having at least one 8-quinolinolato or a derivative thereof such as (5-chloro-8-quinolinolato) gallium and bis (5-chloro-8-quinolinolato) calcium as a ligand.

  In addition, oxadiazoles, triazines, stilbene derivatives, distyrylarylene derivatives, styryl derivatives, and diolefin derivatives can also be suitably used as the organic compound having an electron transporting property.

  Furthermore, as an organic compound that can be used as an organic compound having an electron transporting property, 2,5-bis (5,7-di-t-benzyl-2-benzoxazolyl) -1,3,4-thiazole, 4, 4′-bis (5,7-t-pentyl-2-benzoxazolyl) stilbene, 4,4′-bis [5,7-di- (2-methyl-2-butyl) -2-benzoxazoly Ru] stilbene, 2,5-bis (5.7-di-t-pentyl-2-benzoxazolyl) thiophene, 2,5-bis [5- (α, α-dimethylbenzyl) -2-benzoxa Zolyl] thiophene, 2,5-bis [5,7-di- (2-methyl-2-butyl) -2-benzoxazolyl] -3,4-diphenylthiophene, 2,5-bis (5- Methyl-2-benzoxazolyl) thiophene, 4,4'-bis (2-benzoxazolyl) biphenyl, 5-methyl-2- {2- [4- (5-methyl-2-benzoxazolyl) phenyl] vinyl} benzoxazole, 2- [2- (4-chlorophenyl) ) Vinyl] naphtho (1,2-d) oxazole and other benzoxazoles, 2,2 ′-(p-phenylenedipinylene) -bisbenzothiazole and other benzothiazoles, 2- {2- [4- ( And 2-benzoimidazolyl) phenyl] vinyl} benzimidazole, 2- [2- (4-carboxyphenyl) vinyl] benzimidazole, and the like.

  Furthermore, as an organic compound having an electron transporting property, 1,4-bis (2-methylstyryl) benzene, 1,4-bis (3-methylstyryl) benzene, 1,4-bis (4-methylstyryl) benzene, Distyrylbenzene, 1,4-bis (2-ethylstyryl) benzene, 1,4-bis (3-ethylstyryl) benzene, 1,4-bis (2-methylstyryl) -2-methylbenzene, 1,4 -Bis (2-methylstyryl) -2-ethylbenzene and the like are also included.

  Further, as an organic compound having an electron transporting property, 2,5-bis (4-methylstyryl) pyrazine, 2,5-bis (4-ethylstyryl) pyrazine, 2,5-bis [2- (1- Naphthyl) vinyl] pyrazine, 2,5-bis (4-methoxystyryl) pyrazine, 2,5-bis [2- (4-biphenyl) vinyl] pyrazine, 2,5-bis [2- (1-pyrenyl) vinyl ] Pyrazine etc. are mentioned.

  In addition, as an organic compound having an electron transporting property, 1,4-phenylene dimethylidin, 4,4′-phenylene dimethylidin, 2,5-xylylene dimethylidin, 2,6-naphthylene dimethyl methacrylate Din, 1,4-biphenylene dimethylidin, 1,4-p-terephenylene dimethylidin, 9,10-anthracenediyl dimethylidin, 4,4 ′-(2,2-di-t-butylphenyl vinyl) A well-known thing conventionally used for preparation of organic electroluminescent element, such as biphenyl and 4,4'- (2, 2- diphenyl vinyl) biphenyl, can be used suitably.

  On the other hand, as an organic compound having a hole transporting property, which is used for the hole transporting layer 206 or the hole transporting light emitting layer, N, N, N ′, N′-tetraphenyl-4,4′-diaminophenyl is used. N, N′-diphenyl-N, N′-di (3-methylphenyl) -4,4′-diaminobiphenyl, 2,2-bis (4-di-p-tolylaminophenyl) propane, N, N , N ′, N′-tetra-p-tolyl-4,4′-diaminobiphenyl, bis (4-di-p-tolylaminophenyl) phenylmethane, N, N′-diphenyl-N, N′-di ( 4-methoxyphenyl) -4,4′-diaminobiphenyl, N, N, N ′, N′-tetraphenyl-4,4′-diaminodiphenyl ether, 4,4′-bis (diphenylamino) quadriphenyl, 4, -N, N-diphenylamino- (2-diphe Nylvinyl) benzene, 3-methoxy-4′-N, N-diphenylaminostilbenzene, N-phenylcarbazole, 1,1-bis (4-di-p-triaminophenyl) -cyclohexane, 1,1-bis ( 4-di-p-triaminophenyl) -4-phenylcyclohexane, bis (4-dimethylamino-2-methylphenyl) -phenylmethane, N, N, N-tri (p-tolyl) amine, 4- (di -P-tolylamino) -4 '-[4 (di-p-tolylamino) styryl] stilbene, N, N, N', N'-tetra-p-tolyl-4,4'-diamino-biphenyl, N, N , N ′, N′-tetraphenyl-4,4′-diamino-biphenyl N-phenylcarbazole, 4,4′-bis [N- (1-naphthyl) -N-phenyl-amino] biphenyl, 4,4 ′ '-Bis [N- (1-naphthyl) -N-phenyl-amino] p-terphenyl, 4,4'-bis [N- (2-naphthyl) -N-phenyl-amino] biphenyl, 4,4' -Bis [N- (3-acenaphthenyl) -N-phenyl-amino] biphenyl, 1,5-bis [N- (1-naphthyl) -N-phenyl-amino] naphthalene, 4,4'-bis [N- (9-anthryl) -N-phenyl-amino] biphenyl, 4,4 ″ -bis [N- (1-anthryl) -N-phenyl-amino] p-terphenyl, 4,4′-bis [N— (2-Phenanthryl) -N-phenyl-amino] biphenyl, 4,4′-bis [N- (8-fluoranthenyl) -N-phenyl-amino] biphenyl, 4,4′-bis [N- (2 -Pyrenyl) -N-phenyl-amino] biphenyl, , 4′-bis [N- (2-perylenyl) -N-phenyl-amino] biphenyl, 4,4′-bis [N- (1-coronenyl) -N-phenyl-amino] biphenyl, 2,6-bis (Di-p-tolylamino) naphthalene, 2,6-bis [di- (1-naphthyl) amino] naphthalene, 2,6-bis [N- (1-naphthyl) -N- (2-naphthyl) amino] naphthalene 4.4 ″ -bis [N, N-di (2-naphthyl) amino] terphenyl, 4.4′-bis {N-phenyl-N- [4- (1-naphthyl) phenyl] amino} biphenyl 4,4′-bis [N-phenyl-N- (2-pyrenyl) -amino] biphenyl, 2,6-bis [N, N-di (2-naphthyl) amino] fluorene, 4,4 ″- Bis (N, N-di-p-tolylamino) terphenyl, bis ( N-1-naphthyl) (N-2-naphthyl) amine and the like can be exemplified.

  Furthermore, as the organic compound having a hole transporting property, those obtained by dispersing the above-described organic compound in a polymer or those obtained by polymerizing can be used. So-called π-conjugated polymers such as polyparaphenylene vinylene and derivatives thereof, hole-transporting non-conjugated polymers represented by poly (N-vinylcarbazole), and sigma-conjugated polymers of polysilanes can also be used.

  The hole injection layer 204 is not particularly limited, but conductive polymers such as metal phthalocyanines such as copper phthalocyanine (CuPc: Copper Phthalocyanine) and metal-free phthalocyanines, carbon films, and polyaniline can be preferably used.

  Each drawing in FIG. 3 is a diagram for explaining a method of manufacturing the organic semiconductor device 100. First, as shown in FIG. 3A, the organic semiconductor element 20 is formed on the first surface 12 of the substrate 10. The organic semiconductor element 20 is formed by sequentially stacking the layers shown in FIG. 2 on the first surface 12.

  In addition, the sealing member 30 is prepared, and the desiccant 40 and the first magnet 50 are fixed to the sealing member 30. Next, the sealing member 30 is fixed to the first surface 12 of the substrate 10 using the fixing layer 64.

  Next, as shown in FIG. 3B, a release sheet 70 is attached on the second surface 14 of the substrate 10. Thereafter, the second magnet 52 is fixed to the release sheet 70 using the fixing layer 62. The second magnet 52 may be fixed to the release sheet 70 before the release sheet 70 is attached to the substrate 10. In this way, the organic semiconductor device 100 is formed.

  In the example shown in FIG. 3, the second magnet 52 is not attached to the substrate 10 in the step of fixing the sealing member 30 to the substrate 10. For this reason, when fixing the sealing member 30 to the board | substrate 10, it can suppress that the sealing member 30 and the board | substrate 10 mutually repel each other.

  Note that the second magnet 52 may be attached to the substrate 10 before the step of attaching the substrate 10 to the sealing member 30 and the first magnet 50 may not be attached to the sealing member 30 instead. Further, both the first magnet 50 and the second magnet 52 may be attached after the sealing member 30 is fixed to the substrate 10.

  4 and 5 are diagrams for explaining a method of using the organic semiconductor device 100. FIG. In the example described here, the organic semiconductor device 100 includes an organic EL element as the organic semiconductor element 20.

  When the organic semiconductor device 100 is used as an illumination or a display, the organic semiconductor device 100 may be fixed to a specific place, for example, a wall or a ceiling. During the fixing operation, a force in a direction in which the sealing member 30 or the desiccant 40 approaches the organic semiconductor element 20 may be applied to the substrate 10 or the sealing member 30. On the other hand, in the present embodiment, the second magnet 52 is attached to the substrate 10, and the first magnet 50 is attached to the sealing member 30. For this reason, it can suppress that the sealing member 30 and the desiccant 40 contact the organic-semiconductor element 20. FIG.

  Then, after fixing the organic semiconductor device 100 to the wall or ceiling, the release sheet 70 is removed from the substrate 10 as shown in FIG. Thereby, as shown in FIG. 5, the second magnet 52 is removed from the second surface 14 of the substrate 10. For this reason, the light emitted from the organic semiconductor element 20 is not blocked by the second magnet 52.

  FIG. 6 is a diagram for explaining a first example of a planar layout of the first magnet 50, the second magnet 52, and the desiccant 40. As described above, when the desiccant 40 is fixed to the inner surface of the sealing member 30, the desiccant 40 is easier to contact the organic semiconductor element 20 than the sealing member 30. On the other hand, as shown in this figure, when the first magnet 50 and the second magnet 52 are overlapped with the desiccant 40, the desiccant 40 is less likely to contact the organic semiconductor element 20.

  In addition, when the several desiccant 40 is being fixed to the inner surface of the sealing member 30, it is preferable to provide the 1st magnet 50 and the 2nd magnet 52 in the position which overlaps with each of these some desiccant 40. FIG. However, the first magnet 50 and the second magnet 52 do not have to overlap with any of the desiccants 40.

  FIG. 7 is a view for explaining a second example of the planar layout of the first magnet 50, the second magnet 52, and the desiccant 40. The center of the sealing member 30 is most likely to approach the organic semiconductor element 20. On the other hand, in the example shown in this drawing, the first magnet 50 and the second magnet 52 are provided at a position overlapping the center of the sealing member 30 in plan view. If it does in this way, it will become difficult for the sealing member 30 to contact the organic-semiconductor element 20. FIG.

  In the layout shown in FIG. 6, the first magnet 50 and the second magnet 52 may be provided at a position overlapping the center of the sealing member 30 in plan view.

  As described above, according to the present embodiment, the organic semiconductor device 100 includes the proximity suppressing unit (the first magnet 50 and the second magnet 52). The proximity suppression unit suppresses the overlapping region 32 from approaching the first surface 12. For this reason, the sealing member 30 or the desiccant 40 is in contact with the organic semiconductor element 20 even when a force in a direction in which the organic semiconductor element 20 and the sealing member 30 approach each other is applied to the sealing member 30 or the substrate 10. Can be suppressed. Moreover, in this embodiment, although the 1st magnet 50 and the 2nd magnet 52 are used as a proximity | contact suppression part, in order to remove the 2nd magnet 52, after fixing the organic-semiconductor apparatus 100, the organic-semiconductor element 20 radiate | emits. It is possible to prevent light from being blocked by the second magnet 52.

  In particular, when the organic semiconductor element 20 is an organic EL element, when the sealing member 30 or the desiccant 40 contacts a part of the organic semiconductor element 20, the organic semiconductor element 20 contacts the sealing member 30 or the desiccant 40. The part may not shine. In this case, even if the other part of the organic semiconductor element 20 is normal, the organic semiconductor device 100 is treated as a defective product. In the present embodiment, it is possible to suppress the organic semiconductor device 100 from becoming defective due to such a cause.

  In FIG. 1, the release sheet 70 is provided on the entire surface of the second surface 14 of the substrate 10. However, as shown in FIG. 8, the release sheet 70 has the second magnet 52 disposed on the second surface 14. It may be provided only in the surrounding area and its periphery.

(Second Embodiment)
FIG. 9 is a cross-sectional view showing the configuration of the organic semiconductor device 100 according to the second embodiment. In the present embodiment, the organic semiconductor element 20 is an organic EL element. The organic semiconductor device 100 according to this embodiment has the same configuration as that of the organic semiconductor device 100 according to the first embodiment except that the organic semiconductor device 100 includes the optical sheet 80.

  The optical sheet 80 is a sheet called a light extraction sheet, for example, and is attached between the second surface 14 of the substrate 10 and the release sheet 70. The optical sheet 80 is provided in order to improve the light emission efficiency from the substrate 10, and has a layer that scatters light, for example.

  In the present embodiment, the release sheet 70 is attached on the optical sheet 80. For this reason, even if the release sheet 70 is peeled off, the optical sheet 80 remains adhered to the second surface 14 of the substrate 10.

  Also according to this embodiment, the same effect as that of the first embodiment can be obtained. Moreover, since the optical sheet 80 is provided, the light extraction efficiency from the substrate 10 can be increased. In addition, since the release sheet 70 is affixed on the optical sheet 80, the optical sheet 80 can remain on the second surface 14 of the substrate 10 even if the release sheet 70 is peeled off.

(Third embodiment)
FIG. 10 is a cross-sectional view showing the configuration of the organic semiconductor device 100 according to the third embodiment. The organic semiconductor device 100 according to the present embodiment has the same configuration as the organic semiconductor device 100 according to the first embodiment except for the following points.

  First, the organic semiconductor element 20 is an organic EL element. The light emitted from the organic semiconductor element 20 is emitted from the sealing member 30 to the outside.

  The second magnet 52 is fixed to the substrate 10. The second magnet 52 is directly fixed to the substrate 10 using a double-sided tape or an adhesive layer. A concave portion may be formed in a portion of the substrate 10 where the second magnet 52 is attached. The depth of the recess may be set such that the upper surface of the second magnet 52 forms the same surface as the second surface 14 of the substrate 10, or the upper surface of the second magnet 52 protrudes from the second surface 14. It may be set as follows.

  The first magnet 50 is attached to the outer surface of the sealing member 30 via the release sheet 70. That is, in the present embodiment, the first magnet 50 is removed from the sealing member 30 by peeling the release sheet 70 from the sealing member 30 after the substrate 10 of the organic semiconductor device 100 is attached to a wall or a ceiling.

  For this reason, according to this embodiment, even if the sealing member 30 is a light extraction surface, the same effect as that of the first embodiment can be obtained.

  Moreover, in this embodiment, if the 2nd magnet 52 is attached to the board | substrate 10 before forming the organic-semiconductor element 20 in the board | substrate 10, the board | substrate 10 can be conveyed using the 2nd magnet 52. FIG. In this case, the transport mechanism for transporting the substrate 10 can be simplified.

  As shown in FIG. 11, in this embodiment, an optical sheet 80 may be provided between the sealing member 30 and the release sheet 70. If it does in this way, the same effect as a 2nd embodiment can be acquired.

(Fourth embodiment)
FIG. 12 is a cross-sectional view showing the configuration of the organic semiconductor device 100 according to the fourth embodiment. The organic semiconductor device 100 according to the present embodiment has the same configuration as that of the organic semiconductor device 100 according to the first embodiment, except that the back plate 90 is attached to the sealing member 30. The back plate 90 is provided to reinforce the organic semiconductor device 100. The back plate 90 is made of a metal such as aluminum.

  Also according to this embodiment, the same effect as that of the first embodiment can be obtained. Further, since the back plate 90 is provided, it is possible to suppress the sealing member 30 from being bent.

  Further, when the back plate 90 is attached to the sealing member 30, the sealing member 30 may be bent and the sealing member 30 or the desiccant 40 may come into contact with the organic semiconductor element 20. On the other hand, in this embodiment, since the 1st magnet 50 and the 2nd magnet 52 are provided, this possibility can be made low.

  In the present embodiment, the optical sheet 80 may be provided as in the second embodiment. In this case, in addition to the effects described above, the effects shown in the second embodiment can also be obtained.

(Fifth embodiment)
FIG. 13 is a cross-sectional view illustrating a configuration of an organic semiconductor device 100 according to the fifth embodiment. The organic semiconductor device 100 according to the present embodiment has the same configuration as that of the organic semiconductor device 100 according to the third embodiment, except that a back plate 90 is attached to the second surface 14 of the substrate 10. Although the release sheet 70 is not provided in the example shown in this figure, the release sheet 70 may be provided as in FIG.

  According to this embodiment, the same effect as that of the third embodiment can be obtained. Further, since the back plate 90 is provided, it is possible to suppress the substrate 10 from being bent. Moreover, since the 1st magnet 50 and the 2nd magnet 52 are provided, when attaching the backplate 90 to the board | substrate 10, it can suppress that the sealing member 30 or the desiccant 40 contacts the organic-semiconductor element 20. FIG.

  As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

DESCRIPTION OF SYMBOLS 10 Board | substrate 12 1st surface 14 2nd surface 20 Organic-semiconductor element 30 Sealing member 32 Overlapping area | region 40 Desiccant 50 1st magnet (proximity suppression part)
52 2nd magnet (proximity suppression part)
70 Peeling sheet (peeling member)
80 Optical sheet 100 Organic semiconductor device

Claims (7)

An organic semiconductor element;
A substrate on which the organic semiconductor element is mounted on the first surface;
A sealing member that is partially in contact with the first surface of the substrate, has an overlapping region that overlaps the organic semiconductor element in plan view, and shields a space including the organic semiconductor element from the outside;
A proximity suppression unit that suppresses the overlapping region from approaching the first surface;
An organic semiconductor device comprising: The organic semiconductor device according to claim 1,
The proximity suppression unit is
A first magnet attached to the sealing member;
A second magnet attached to a second surface, which is a surface opposite to the first surface of the substrate, in a direction repelling the first magnet;
An organic semiconductor device having The organic semiconductor device according to claim 2,
The organic semiconductor device is an organic semiconductor device in which the organic semiconductor element is an organic EL element. The organic semiconductor device according to claim 3,
One of the sealing member and the substrate includes an emission surface that emits light emitted from the organic EL element to the outside,
An organic semiconductor device in which a magnet attached to the emission surface among the first magnet and the second magnet is detachably attached. The organic semiconductor device according to claim 4,
Further comprising a peeling member attached to the emitting surface so as to be peelable,
The organic semiconductor device, wherein the magnet attached to the emission surface is attached to the emission surface via the peeling member. The organic semiconductor device according to claim 5,
Comprising an optical film attached to the exit surface;
The peeling member is an organic semiconductor device attached to the optical film. An organic EL element;
A substrate on which the organic EL element is mounted on the first surface;
A sealing member that partially contacts the first surface of the substrate and shields a space including the organic EL element from the outside;
A first magnet attached to the sealing member;
A second magnet attached to a second surface, which is a surface opposite to the first surface of the substrate, in a direction repelling the first magnet;
Preparing an organic semiconductor device comprising:
After installing the organic semiconductor device, the step of removing the magnet attached to the emission surface that emits the light emitted by the organic EL element to the outside from the first magnet and the second magnet;
An organic semiconductor device mounting method comprising:

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