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JP2013518440A - 高感度実時間形状制御渦電流モニタシステム - Google Patents

高感度実時間形状制御渦電流モニタシステム Download PDF

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Publication number
JP2013518440A
JP2013518440A JP2012551207A JP2012551207A JP2013518440A JP 2013518440 A JP2013518440 A JP 2013518440A JP 2012551207 A JP2012551207 A JP 2012551207A JP 2012551207 A JP2012551207 A JP 2012551207A JP 2013518440 A JP2013518440 A JP 2013518440A
Authority
JP
Japan
Prior art keywords
protrusion
eddy current
polishing
platen
magnetic core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012551207A
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English (en)
Japanese (ja)
Inventor
ハサン ジー． イラバニ，
クン シュー，
ボグスロー エー． スウェデク，
ユチョン ワン，
ウェン−チャン トゥー，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2013518440A publication Critical patent/JP2013518440A/ja
Pending legal-status Critical Current

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Classifications

    • H10P74/207—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • H10P52/00—
    • H10P74/203—
    • H10P52/403—
    • H10P74/238—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2012551207A 2010-01-29 2011-01-21 高感度実時間形状制御渦電流モニタシステム Pending JP2013518440A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29988310P 2010-01-29 2010-01-29
US61/299,883 2010-01-29
PCT/US2011/022132 WO2011094135A2 (en) 2010-01-29 2011-01-21 High sensitivity real time profile control eddy current monitoring system

Publications (1)

Publication Number Publication Date
JP2013518440A true JP2013518440A (ja) 2013-05-20

Family

ID=44320063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012551207A Pending JP2013518440A (ja) 2010-01-29 2011-01-21 高感度実時間形状制御渦電流モニタシステム

Country Status (5)

Country Link
US (1) US20110189925A1 (zh)
JP (1) JP2013518440A (zh)
KR (1) KR20130033346A (zh)
TW (1) TW201201957A (zh)
WO (1) WO2011094135A2 (zh)

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US9023667B2 (en) 2011-04-27 2015-05-05 Applied Materials, Inc. High sensitivity eddy current monitoring system
US10052739B2 (en) 2011-09-12 2018-08-21 Applied Materials, Inc. Carrier head with composite plastic portions
US9418904B2 (en) 2011-11-14 2016-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Localized CMP to improve wafer planarization
US20130210173A1 (en) * 2012-02-14 2013-08-15 Taiwan Semiconductor Manufacturing Co., Ltd. Multiple Zone Temperature Control for CMP
US10065288B2 (en) 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
US9465049B2 (en) * 2012-04-13 2016-10-11 James B. Colvin Apparatus and method for electronic sample preparation
US9067295B2 (en) 2012-07-25 2015-06-30 Applied Materials, Inc. Monitoring retaining ring thickness and pressure control
DE102012014812A1 (de) * 2012-07-26 2014-01-30 Etel S.A. Vorrichtung zum Testen von Wafern
US9205527B2 (en) 2012-11-08 2015-12-08 Applied Materials, Inc. In-situ monitoring system with monitoring of elongated region
US9281253B2 (en) * 2013-10-29 2016-03-08 Applied Materials, Inc. Determination of gain for eddy current sensor
CN105659363B (zh) * 2013-10-29 2019-05-03 应用材料公司 涡电流传感器增益的确定
US9754846B2 (en) 2014-06-23 2017-09-05 Applied Materials, Inc. Inductive monitoring of conductive trench depth
US9911664B2 (en) 2014-06-23 2018-03-06 Applied Materials, Inc. Substrate features for inductive monitoring of conductive trench depth
TW201822953A (zh) 2016-09-16 2018-07-01 美商應用材料股份有限公司 基於溝槽深度的電磁感應監控進行的過拋光
KR102547156B1 (ko) 2016-10-21 2023-06-26 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 전자기 유도 모니터링 시스템을 위한 코어 구성
CN110178208B (zh) 2017-01-13 2023-06-06 应用材料公司 基于电阻率调整原位监测的测量值
TWI789385B (zh) 2017-04-21 2023-01-11 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
KR20190038070A (ko) * 2017-09-29 2019-04-08 삼성전자주식회사 반도체 장치의 제조 시스템 및 반도체 장치의 제조 방법
TWI845444B (zh) 2018-04-03 2024-06-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
TWI828706B (zh) 2018-06-20 2024-01-11 美商應用材料股份有限公司 用於原位電磁感應監控的基板摻雜補償的方法、電腦程式產品及研磨系統
CN111886686B (zh) 2018-09-26 2024-08-02 应用材料公司 针对原位电磁感应监测的边缘重建中的基板掺杂的补偿
US11658078B2 (en) 2020-05-14 2023-05-23 Applied Materials, Inc. Using a trained neural network for use in in-situ monitoring during polishing and polishing system
TWI809389B (zh) * 2020-06-08 2023-07-21 美商應用材料股份有限公司 用於在拋光相鄰導電層的堆疊期間的輪廓控制的系統、方法及電腦程式產品
WO2021262450A1 (en) 2020-06-24 2021-12-30 Applied Materials, Inc. Determination of substrate layer thickness with polishing pad wear compensation
US11794302B2 (en) 2020-12-15 2023-10-24 Applied Materials, Inc. Compensation for slurry composition in in-situ electromagnetic inductive monitoring

Citations (1)

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JP2007501509A (ja) * 2003-07-31 2007-01-25 アプライド　マテリアルズ　インコーポレイテッド イン・シトゥー・プロファイル計測のための渦電流システム

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Publication number Priority date Publication date Assignee Title
JP2007501509A (ja) * 2003-07-31 2007-01-25 アプライド　マテリアルズ　インコーポレイテッド イン・シトゥー・プロファイル計測のための渦電流システム

Also Published As

Publication number Publication date
US20110189925A1 (en) 2011-08-04
WO2011094135A3 (en) 2011-11-17
KR20130033346A (ko) 2013-04-03
TW201201957A (en) 2012-01-16
WO2011094135A2 (en) 2011-08-04

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