JP2013214514A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

A substrate processing apparatus for immediately solidifying a solution printed on a substrate.
A substrate processing apparatus is coupled to a support member on which a substrate is disposed, an application unit assembly including an application unit that applies a solution to the substrate, and movable to both sides of the support member. And a solidification unit 300 that provides suction pressure to the solution applied to the substrate. The application unit 200a includes an application transfer member that is coupled so as to be movable to both sides of the support member 100, and an application member that is coupled to the application transfer member and applies the solution to the substrate in an inkjet manner.
[Selection] Figure 1A

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method for forming a pattern on a substrate in a direct writing method.

  Information processing apparatuses are rapidly being developed in search of various forms of functions and faster information processing speeds. Such an information processing apparatus has a display device for displaying information. In the past, a CRT tube (Cathode ray tube) monitor has been mainly used as a display device, but a liquid crystal display (LCD) is mainly used at present. However, the liquid crystal display device requires a separate light source and has limited brightness, viewing angle, and large area, so recently it has low voltage drive, magnetoluminescence, light weight and thin, wide viewing angle, and fast response speed. Organic light emitting diode displays using organic light emitting devices having advantages such as the above are in the spotlight.

  The organic light emitting display includes a thin film transistor (TFT), a pixel electrode, an organic light emitting diode, and a common electrode, which are sequentially formed on a substrate. An organic light emitting device includes a hole injection layer (HIL), a hole transport layer (HTL), an organic light emitting layer, an electron transport layer (ETL), and an electron injection layer, which are sequentially formed. (Electron injection layer: EIL). A vapor deposition method is used to form each layer constituting the organic light emitting device on the substrate. First, after a fine metal mask having the same pattern as that of one layer is aligned with the substrate, one material is deposited / patterned. Thereafter, after the fine metal mask is moved and aligned on the substrate by about 1 pixel, another material is formed into a vapor deposition pattern. However, in the process of aligning the fine metal mask with the substrate, the previously formed layer is damaged by contact with the fine metal mask. In addition, since the vapor deposition process is performed in vacuum, a large organic light emitting display device is expensive. Therefore, it is required to develop a manufacturing process of an organic light emitting device that can save costs.

Japanese Patent Laid-Open No. 2005-230807

  An object of this invention is to provide the substrate processing apparatus which prints each layer used as an organic light emitting element on a board | substrate.

  Another object of the present invention is to provide a substrate processing apparatus that immediately solidifies a solution printed on a substrate.

  According to one aspect of the present invention, the substrate is disposed so as to be movable to both sides of the support member, the support member on which the substrate is disposed, the coating unit assembly including the coating unit that applies the solution to the substrate. A solidifying unit for providing suction pressure to the solution applied to the coating member, the coating unit being coupled to the support member so as to be movable on both sides, and coupled to the coating transport member. In addition, a substrate processing apparatus including an application member that applies the solution to the substrate by an inkjet method may be provided.

  The solidification unit may be provided as a solidification member that is coupled to the coating transfer member.

  The coating unit further includes a traveling member coupled to the coating transfer member so that the coating unit can move in a direction parallel to the plane of the support member, and the coating member and the solidifying member are coupled to the traveling member. Can be done.

  The solidification unit includes a solidification transfer member that is coupled so as to move to both sides of the support member, and a solidification member that is coupled to the solidification transfer member and sucks a gas above the substrate. Can be included.

  The application unit may further include an application traveling member coupled to the application transport member so as to move in a direction parallel to the plane of the support member, and the application member may be coupled to the application travel member.

  The solidification unit further includes a solidification traveling member coupled to the solidification transfer member so that the solidification unit can move in a direction parallel to a plane of the support member, and the solidification member is the solidification traveling member. Can be combined.

  The solidification member may be connected to a pump through a first line, and the solidification member may be formed with a suction hole through which a gas flows.

The solidifying member is connected to a tank for supplying gas through the second line,
An injection hole for injecting the gas supplied to the second line may be formed on the lower surface of the solidification member.

  The second line may be provided with a temperature adjusting member that adjusts the temperature of the gas.

  The temperature adjusting member may be a heater that heats the gas.

  The temperature adjusting member may be a cooler that cools the gas.

  The coating unit assembly includes five coating units, and the five coating units apply the first solution, the second solution, the third solution, the fourth solution, and the fifth solution to the substrate, respectively. Can do.

  Further, the five application units may be sequentially arranged on the opposite side of the support member.

  In addition, each of the first solution to the fifth solution may form a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and an electron injection layer on the upper surface of the substrate.

  In addition, a bake member may be further included that is positioned on the support member so as to be able to get on and off up and down.

  The bake member may be connected to a gas tank by a line, and the line may be provided with a valve for adjusting the amount of gas supplied from the gas tank to the bake member.

  The line may be provided with a heater for heating the gas.

  The inspection unit further includes an inspection unit for inspecting the upper surface of the substrate, the inspection unit being coupled to be movable to both sides of the support member, and an upper surface of the substrate coupled to the inspection transport member. And an inspection member for photographing the image.

  The repair unit assembly may further include a repair unit that repairs a defect of the substrate, and the repair unit may be provided in the same number as the coating unit.

  The repair unit is connected to the repair transfer member so that the repair unit can move to both sides of the support member and the repair transfer member so that the repair unit can move in a direction parallel to the plane of the support member. A member and a repair member that is provided with a length shorter than the length of the application member and applies the solution to the substrate can be included.

  According to another aspect of the present invention, one of the solutions forming the hole injection layer, the hole transport layer, the organic light emitting layer, the electron transport layer, or the electron injection layer on the upper surface of the substrate disposed on the support member. Then, a substrate processing method may be provided in which a suction pressure is applied to an upper surface of a substrate disposed on the support member to perform a solidification process on the solution.

  In addition, after the solidification process is performed, a baking process for heating the substrate positioned on the support member may be performed to flatten the solution applied to the substrate.

  In addition, after flattening the solution, the upper surface of the substrate positioned on the support member can be photographed to inspect defects on the upper surface of the substrate.

  In addition, the defect can be repaired by applying the solution at a position where the defect exists in the upper surface of the substrate positioned on the support member.

  According to an embodiment of the present invention, each layer of the organic light emitting device can be printed on the substrate.

  In addition, according to an embodiment of the present invention, each layer of the organic light emitting device printed on the substrate can be immediately solidified to shorten the process time.

  Moreover, according to one Embodiment of this invention, each layer of an organic light emitting element can be test | inspected.

  In addition, according to an embodiment of the present invention, defects in each layer of the organic light emitting device can be repaired.

1 is a view showing a substrate processing apparatus according to an embodiment of the present invention. It is drawing which shows a part of substrate processing apparatus of FIG. It is drawing which shows a part of substrate processing apparatus of FIG. 2 is a diagram illustrating a form in which the substrate processing apparatus of FIG. 1 applies a first solution to a substrate. It is the sectional side view which showed the form by which a 1st solution is apply | coated to a board | substrate. 3 is a diagram illustrating a form in which a baking process is performed. 2 is a diagram illustrating a form in which the substrate processing apparatus of FIG. 1 performs an inspection process. It is drawing which shows the form by which a 1st repair unit is moved to a supporting member direction by the substrate processing apparatus of FIG. It is drawing which shows this repair unit in the lower part. 5 is a diagram illustrating a process in which a first repair unit repairs a substrate. It is drawing which shows the form which a solidification unit and a test | inspection unit move in the substrate processing apparatus of FIG. 2 is a diagram illustrating a form in which the substrate processing apparatus of FIG. 1 applies a second solution to a substrate. It is the sectional side view which showed the form with which a 2nd solution is apply | coated to a board | substrate. It is drawing which shows the coating unit and solidification unit by other embodiment. It is drawing explaining operation | movement of the coating unit and solidification unit of FIG. It is drawing which shows the solidification member by other embodiment. It is drawing which shows operation | movement of the solidification member of FIG. 6 is a view illustrating a substrate processing apparatus according to another embodiment. 6 is a diagram illustrating a substrate processing apparatus according to another embodiment. FIG. 18 is a side sectional view of a defect beam, a coating member, and a solidifying member in the substrate processing apparatus of FIG. 17.

  Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. Embodiments of the present invention can be modified in various forms, and the scope of the present invention is not construed as being limited to the following embodiments. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Accordingly, in the drawings, the shape of each element is exaggerated to emphasize a clearer description.

  1A is a view showing a substrate processing apparatus according to an embodiment of the present invention, and FIGS. 1B and 1C are views showing a part of the substrate processing apparatus of FIG.

  Referring to FIGS. 1A to 1C, the substrate processing apparatus 10 includes a support member 100, a coating unit assembly 200, a solidification unit 300, a bake member 400, an inspection unit 500, and a repair unit assembly 600.

  Hereinafter, the lateral direction (extension direction) of the first rail 701 is the first direction (1), and when viewed from above, the direction perpendicular to the first direction (1) (the width direction of the first rail 701) is the second direction. (2) A direction perpendicular to the first direction 1 and the second direction (2) (the height direction of the first rail) is referred to as a third direction (3). The left side in the first direction (1) is referred to as the front, and the right side from the first direction (1) is referred to as the rear.

  The support member 100 is provided in a plate shape. A substrate s to be processed is disposed on the upper surface of the support member 100. The upper surface of the support member 100 may be provided more than the area of the substrate s to be processed. The substrate s can be transferred from the outside to the top of the support member 100 by a robot arm (not shown), and can be carried out from the top of the support member 100 to the outside. A hole (not shown) may be formed in the support member 100. Lift holes (not shown) are provided in the holes. Lift pins assist in loading or unloading the substrate s. The support member 100 may be provided so as to be movable in the first direction (1).

  The coating unit assembly 200 includes a first coating unit 200a, a second coating unit 200b, a third coating unit 200c, a fourth coating unit 200d, and a fifth coating unit 200e. The first application unit 200a includes a first application transfer member 201a and a first application member 205a.

  The first application transfer member 201a includes a first application combined beam 202a and a first application support base 203a. The first coating combined beam 202a is provided in a bar shape extending in the second direction (2). Both ends of the first coating / coupling beam 202a are coupled to the first coating / supporting base 203a. The first coating support 203a is provided in a bar shape extending in the third direction (3). The first coating combined beam 202a can move in the third direction (3) according to the first coating support base 203a. A pair of first rails 701 are provided on both sides of the support member 100 along the first direction (1). The first rails 701 are spaced apart from each other in the second direction (2) by a distance corresponding to the length of the first coating and coupling beam 202a. The first coating support base 203 a is installed on the first rail 701. The first application transfer member 201 a moves in the first direction (1) according to the first rail 701 and can move to both sides of the support member 100.

  The first application member 205a is coupled to one surface of the first application combined beam 202a. As an example, the first application member 205a may be attached to the side surface or the lower surface of the first application combined beam 202a. The first application member 205a is provided in a shape extended in the second direction (2). The length of the first application member 205a may be provided to be greater than the width of the substrate s. The first application member 205a is connected to the first tank 207a by the first line 206a. The first tank 207a supplies the first solution to the first application member 205a. The first application member 205 a applies the first solution to the upper surface of the substrate s located on the support member 100. The first application member 205a applies the first solution to the direct writing method using an inkjet method. A large number of solution discharge portions (208a in FIG. 3) are formed on the lower surface of the first application member 205a. Each solution discharger 208a independently controls the discharge of the first solution. As an example, the first application member 205a may be provided as an inkjet head.

  The second application unit 200b includes a second application transfer member 201b and a second application member 205b. The second application member 205b is connected to the second tank 207b by the second line 206b. The second tank 207b stores the second solution. The second application unit 200b is positioned in front of the first application unit 200a. The second application member 205b applies the second solution to the substrate s.

  The third application unit 200c includes a third application transfer member 201c and a third application member 205c. The third application member 205c is connected to the third tank 207c by the third line 206c. The third tank 207c stores the third solution. The third application unit 200c is positioned in front of the second application unit 200b. The third application member 205c applies the third solution to the substrate s.

  The fourth application unit 200d includes a fourth application transfer member 201d and a fourth application member 205d. The fourth application member 205d is connected to the fourth tank 207d by a fourth line 206d. The fourth tank 207d stores the fourth solution. The fourth application unit 200d is positioned in front of the third application unit 200c. The fourth application member 205d applies the fourth solution to the substrate s.

  The fifth application unit 200e includes a fifth application transfer member 201e and a fifth application member 205e. The fifth application member 205e is connected to the fifth tank 207e by a fifth line 206e. The fifth tank 207e stores the fifth solution. The fifth application unit 200e is positioned in front of the fourth application unit 200d. The fifth application member 205e applies the fifth solution to the substrate s.

  Since the configuration of the second coating unit 200b to the fifth coating unit 200e corresponds to the first coating unit 200a, a duplicate description is omitted.

  The solidification unit 300 includes a solidification transfer member 301 and a solidification member 305. The solidification transfer member 301 includes a solidification support base 303 and a solidification combined beam 302.

  The solidified combined beam 302 is provided in a bar shape extending in the second direction (2). The solidified combined beam 302 is formed shorter than the first coating combined beam 202a. Both ends of the solidified combined beam 302 are coupled to the solidified support table 303 so as to be movable in the third direction (3). The solidification support table 303 is provided in a bar shape extending in the third direction (3). The solidification support base 303 is provided shorter than the first coating support base 203a. A second rail 702 is provided between the support member 100 and the first rail 701 in the first direction (1). The solidification support base 303 is positioned on the second rail 702. The solidification unit 300 can move in the first direction (1) according to the second rail 702.

  The solidifying member 305 is coupled to one side of the solidified combined beam 302. As an example, the solidifying member 305 can be coupled to the side or bottom surface of the solidified combined beam 302. The horizontal direction of the solidifying member 305 is provided in the second direction (2). The length of the solidifying member 305 may be provided to be greater than the width of the substrate s. A suction hole (306 in FIG. 3) is formed on the lower surface of the solidifying member 305. The solidifying member 305 is connected to the pump 308 by a sixth line 307. When the pump 308 operates, the gas below the solidifying member 305 flows into the suction hole 306.

  The bake member 400 is located on the support member 100. The bake member 400 may be provided in a plate shape corresponding to the support member 100. The bake member 400 is connected to the gas tank 403 through the seventh line 402. The seventh line 402 is provided with a heater 404 and a valve 405. The heater 404 heats the gas supplied to the bake member 400 to a certain temperature. The valve 405 adjusts the flow rate of the gas supplied to the bake member 400. A plurality of holes (not shown) through which gas is injected are formed on the lower surface of the bake member 400. A loading / unloading load 401 is provided on the upper surface of the bake member 400. The loading / unloading load 401 is extended in the third direction (3) on the upper surface of the bake member 400. The other end of the loading / unloading load 401 is connected to a loading / unloading means (not shown). As an example, the entry / exit means may be provided by a hydraulic cylinder. The bake member 400 can be moved in the third direction (3) by the loading / unloading load 401.

  The inspection unit 500 includes an inspection transfer member 501 and an inspection member 505. The inspection transport member 501 includes an inspection support base 503 and an inspection combined beam 502. The inspection coupled beam 502 is provided in a bar shape extending in the second direction (2). The inspection coupled beam 502 is provided to correspond to the distance that the second rails 702 are spaced apart from each other in the second direction (2). Both ends of the inspection coupling beam 502 are coupled to the inspection support base 503. The inspection support base 503 is provided in a bar shape extending in the third direction (3). The inspection support base 503 is positioned on the second rail 702. The inspection unit 500 can move in the first direction (1) according to the second rail 702.

  Inspection member 505 is coupled to inspection coupling beam 502. As an example, the inspection member 505 is coupled to the lower or side surface of the inspection combined beam 502 and provided in the second direction (2). The inspection member 505 inspects the upper surface of the substrate s to inspect for defects in the substrate s. As an example, the inspection member 505 may be provided by a camera that photographs the upper surface of the substrate s.

  The repair unit assembly 600 includes a first repair unit 600a, a second repair unit 600b, a third repair unit 600c, a fourth repair unit 600d, and a fifth repair unit 600e.

  The first repair unit 600a includes a first repair transfer member 601a and a first repair member 605a.

  The first repair transfer member 601a includes a first repair combined beam 602a and a first repair support 603a. The first repair combined beam 602a is provided in a bar shape extended in the second direction (2). Both ends of the first repair combined beam 602a are coupled to the first repair support 603a. The first repair support base 603a is provided in a bar shape extending in the third direction (3). The first repair combined beam 602a can move in the third direction (3) according to the first repair support base 603a. A third rail 703 is provided between the support member 100 and the second rail 702. The first repair combined beam 602a has a length corresponding to the distance at which the third rail 703 is separated. The first repair support base 603 a is installed on the third rail 703. The first repair transfer member 601a can move in the first direction (1) according to the third rail 703.

  The first repair member 605a is coupled to one surface of the first repair combined beam 602a. As an example, the first repair member 605a may be attached to the side surface or the lower surface of the first repair combined beam 602a. The lateral direction of the first repair member 605a is provided in the second direction (2). The length of the first repair member 605a is provided to be shorter than the length of the first application member 205a. The first repair member 605a is connected to the first tank 207a by an eighth line 606a.

  The first repair member 605 a applies the first solution to the upper surface of the substrate s located on the support member 100. The first repair member 605a applies the first solution to the inkjet method. A number of solution discharge portions are formed on the lower surface of the first repair member 605a. Each discharge part is independently controlled to discharge the first solution. As an example, the first repair member 605a may be provided on the inkjet head.

  The second repair unit 600b includes a second repair transfer member 601b and a second repair member 605b. The second repair member 605b is connected to the second tank 207b by a ninth line 606b. The second repair unit 600b is positioned in front of the first repair unit 600a. The second repair member 605b applies the second solution to the substrate s.

  The third repair unit 600c includes a third repair transfer member 601c and a third repair member 605c. The third repair member 605c is connected to the third tank 207c by a tenth line 606c. The third repair unit 600c is positioned in front of the second repair unit 600b. The third repair member 605c applies the third solution to the substrate s.

  The fourth repair unit 600d includes a fourth repair transfer member 601d and a fourth repair member 605d. The fourth repair member 605d is connected to the fourth tank 207d by an eleventh line 606d. The fourth repair unit 600d is positioned in front of the third repair unit 600c. The fourth repair member 605d applies the fourth solution to the substrate s.

  The fifth repair unit 600e includes a fifth repair transfer member 601e and a fifth repair member 605e. The fifth repair member 605e is connected to the fifth tank 207e by a twelfth line 606e. The fifth repair unit 600e is positioned in front of the fourth repair unit 600d. The fifth repair member 605e applies the fifth solution to the substrate s.

  Since the configurations of the second repair unit 600b to the fifth repair unit 600e correspond to the first repair unit 600a, the duplicate description is omitted.

  FIG. 2 is a view showing a form in which the substrate processing apparatus of FIG. 1 applies the first solution to the substrate, and FIG. 3 is a side sectional view showing a form in which the first solution is applied to the substrate.

  A process of applying the first solution to the upper surface of the substrate s will be described with reference to FIGS.

  A substrate s is positioned on the upper surface of the support member 100. For example, the substrate s is used to manufacture an organic light emitting diode display. A thin film transistor (TFT) for controlling on / off of a pixel provided as an organic light emitting diode is formed on the substrate s. In addition, a pixel electrode that supplies power to each pixel and a pixel wall that partitions each pixel may be formed.

  The first application unit 200a is positioned in front of the support member 100. The first application combined beam 202a moves downward, and the first application member 205a is positioned at a certain distance from the upper surface of the substrate s. As an example, the first application combined beam 202a may be moved so that the first application member 205a is at the same height as the solidifying member 305. The solidification unit 300 is positioned in front of the first coating unit 200a at a certain distance. Thereafter, the first coating unit 200a and the solidification unit 300 are moved from the front to the back while maintaining a certain distance from each other. The first application unit 200a applies the first solution to the pixels provided on the upper surface of the substrate s. The solidification unit 300 provides suction pressure to the upper part of the substrate s. The solvent contained in the first solution applied to the substrate s is evaporated by a certain amount. The evaporated solvent is sucked into the solidification unit 300. Therefore, evaporation of the solvent is promoted by the first solution. When the solvent is evaporated, the first solution is solidified.

  After the first solution is applied to the substrate s, the solvent is evaporated and solidified. The substrate s can be subjected to an additional process for the evaporation of the solvent. When the substrate s is transferred to perform an additional process, the substrate s may be shaken or inclined. As a result, the surface of the first solution applied to the substrate s becomes uneven. According to the embodiment of the present invention, since the first solution is solidified immediately after being applied, the surface of the first solution becomes uniform. In addition, according to the embodiment of the present invention, since the solidification is performed immediately after the application of the first solution, the process time is shortened.

  FIG. 4 is a diagram illustrating a form in which a baking process is performed.

  A baking process is demonstrated with reference to FIG.

  When the first solution is applied to the pixels of the substrate s, the bake member 400 is moved toward the support member 100 along the third direction (3). The bake member 400 is stopped at a position separated from the upper surface of the substrate s by a certain distance. The gas supplied from the gas tank 403 is heated to a constant temperature by the heater 404. When the gas reaches a certain temperature, the valve 405 is opened. The valve 405 adjusts the gas flow so that a certain amount of gas is supplied to the bake member 400. The gas injected from the bake member 400 is supplied to the upper surface of the substrate s. The gas flows while supplying heat to the upper surface of the substrate s. The solvent evaporated in the first solution is separated from the upper surface of the substrate s by the gas. Accordingly, a small amount of solvent is formed on the upper surface of the substrate s, and evaporation of the solvent is promoted by the first solution. In addition, the heat supplied as a gas performs a baking process. When the baking process is completed, a hole injection layer (HIL) is formed on the upper surface of the substrate s.

  According to the embodiment of the present invention, after the first solution is applied, the baking process is performed without transferring the substrate s. Therefore, the process time is shortened.

  FIG. 5 is a diagram illustrating a form in which the substrate processing apparatus of FIG. 1 performs an inspection process.

  With reference to FIG. 5, a process of performing the inspection process will be described.

  When the baking process is completed, the baking member 400 is moved (upward) away from the support member 100 along the third direction (3). Thereafter, the inspection unit 500 is moved from the front to the rear. As the inspection coupled beam 502 is moved downward, the inspection member 505 is positioned so as to be separated by a certain distance on the upper surface of the substrate s. While the inspection unit 500 moves from the front to the rear, the inspection member 505 inspects for defects in the hole injection layer.

  FIG. 6 is a view illustrating a form in which the first repair unit is moved toward the support member in the substrate processing apparatus of FIG. 1.

  Referring to FIG. 6, when the inspection process is completed, the first repair unit 600a is moved toward the support member 100. If no defect is found in the hole injection layer, the first repair unit 600 a passes through the support member 100. If a defect is found in the hole injection layer, the first repair unit 600a performs a repair process.

  FIG. 7 is a view showing the repair unit as viewed from below.

  Referring to FIG. 7, a first repair traveling member 603a is provided in the first repair combined beam 602a. The first repair traveling member 603a may be provided on the lower surface or side surface of the first repair combined beam 602a. The first repair traveling member 603a can move in a direction parallel to the plane of the support member 100, that is, in the second direction (2), according to the first repair combined beam 602a. The first repair member 605a is fixed to the traveling member.

  The second repair unit 600b, the third repair unit 600c, the fourth repair unit 600d, and the fifth repair unit 600e include a second repair travel member 605b, a third repair travel member 605c, a fourth repair travel member 605d, and a second repair travel member 605d, respectively. 5 repair running member 605e is provided. Since the operations of the second repair traveling member 605b to the fifth repair traveling member 605e are the same as those of the first repair traveling member 603a, a duplicate description is omitted.

  FIG. 8 is a diagram illustrating a process in which the first repair unit repairs the substrate.

  With reference to FIG. 8, a process of performing the repair process will be described.

  The first repair transfer member 601a moves in the first direction (1) and is stopped at a position corresponding to the position of the defect d. Thereafter, the first repair member 605a moves in the second direction (2) and is stopped at the upper part of the defect d. The first repair member 605a applies the first solution to the defect d to repair the defect generated in the pixel.

  According to the embodiment of the present invention, the first repair member 605a is provided with a narrower width than the first application member 205a, and the lower surface of the first repair member 605a has fewer solution discharge portions than the first application member 205a. Provided. Therefore, it is easy to control so that the first solution is discharged only where there is a pixel defect.

  In addition, according to the embodiment of the present invention, the hole transport layer is formed, the substrate s is not transferred, and the repair process is performed, so that the process time is shortened.

  FIG. 9 is a view showing a form in which the solidification unit 300 and the inspection unit 500 move in the substrate processing apparatus of FIG.

  Referring to FIG. 9, before the second solution is applied to the substrate s, the solidification unit 300 and the inspection unit 500 are moved from the rear to the front. The solidification unit 300 or the inspection unit 500 may be moved before the inspection process is performed, or may be moved after the inspection process is performed.

  FIG. 10 is a view showing a form in which the substrate processing apparatus of FIG. 1 applies the second solution to the substrate, and FIG. 11 is a side sectional view showing a form in which the second solution is applied to the substrate.

  With reference to FIGS. 10 and 11, the process of applying the second solution to the upper surface of the substrate s will be described.

  The second coating unit 200b is positioned in front of the support member 100. The second coating combined beam 202b moves downward, and the second coating member 205b is positioned at a certain distance from the upper surface of the substrate s. As an example, the second application combined beam 202b may be moved so that the second application member 205b is at the same height as the solidifying member 305. The solidifying unit 300 is positioned in front of the second coating unit 200b at a certain distance. Thereafter, the second coating unit 200b and the solidifying unit 300 are moved from the front to the rear while maintaining a certain distance from each other. The second application unit 200b applies the second solution to the pixels provided on the upper surface of the substrate s. The solidification unit 300 provides suction pressure to the upper part of the substrate s. The solvent contained in the second solution applied to the substrate s is evaporated by a certain amount. The evaporated solvent is sucked into the solidification unit 300. Therefore, evaporation of the solvent is promoted by the second solution. When the solvent is evaporated, the second solution is solidified.

  If the second solution is applied to the pixel, the baking process and the inspection process of FIGS. 4 to 5 are performed. The second solution forms a hole transporting layer (HTL) on the upper surface of the hole injection layer. Then, the second repair unit 600b performs the repair process by the same method as the first repair unit 600a of FIGS.

  The third coating unit 200c and the third repairing unit 600c, the fourth coating unit 200d and the fourth repairing unit 600d, and the fifth coating unit 200e and the fifth repairing unit 600e repeatedly perform a similar process to repeat the hole transport layer. An organic light emitting layer, an electron transport layer (ETL), and an electron injection layer (EIL) are sequentially formed on the upper surface of the substrate. The operations of the third coating unit 200c and the third repair unit 600c, the fourth coating unit 200d and the fourth repair unit 600d, and the fifth coating unit 200e and the fifth repair unit 600e are the first coating unit 200a and the first repair unit 600a. Because of this, duplicate description is omitted.

  As another embodiment, one or more of the second coating unit 200b to the fifth coating unit 200e may be omitted. The repair units 600a, 600b, 600c, 600d, and 600e are provided in the same number as the coating units 200a, 200b, 200c, 200d, and 200e.

  In another embodiment, the application unit assembly 200 may be additionally provided with a sixth application unit and a seventh application unit. The solutions supplied from the first coating unit 200a, the second coating unit 200b, the third coating unit 200c, the fourth coating unit 200d, the fifth coating unit 200e, the sixth coating unit, and the seventh coating unit are each injecting holes. Layer (Hole injection layer: HIL), hole transport layer (Hole transporting layer: HTL), R organic light emitting layer, G organic light emitting layer, B organic light emitting layer, electron transport layer (ETL) and electron injection layer (Electron injection layer: EIL).

  FIG. 12 is a view showing a coating unit and a solidification unit according to another embodiment.

  Referring to FIG. 12, a first application traveling member 214a is provided in the first application unit 210a. The first application traveling member 214a may be provided on the lower surface or the side surface of the first application combined beam 212a. The first application traveling member 214a can move in a direction parallel to the plane of the support member 100, that is, in the second direction (2), according to the first application combined beam 212a. The first application member 215a is fixed to the first application traveling member 214a. The first application member 215a is provided shorter than the width in the second direction (2) of the substrate s.

  The second coating unit 210b, the third coating unit 210c, the fourth coating unit 210d, and the fifth coating unit 210e include a second coating traveling member 214b, a third coating traveling member 214c, a fourth traveling member coating 214d, and a second coating member 210d, respectively. A five application travel member 214e is provided. The second application travel member 214b, the third application travel member 214c, the fourth travel member application 214d, and the fifth travel member 214e are respectively provided with a second application member 215b, a third application member 215c, a fourth application member 215d, and a second application member. The 5 application member 215e is fixed. Since the configuration of the second application traveling member 214b to the fifth application traveling member 214e is the same as that of the first application traveling member 214a, a duplicate description is omitted.

  The solidifying unit 310 is provided with a solidified traveling member 314. A solidified travel member 314 may be provided on the bottom or side of the solidified combined beam 312. The solidified traveling member 314 can move in the direction parallel to the plane of the support member 100, that is, the second direction (2), according to the solidified combined beam 312. The solidified member 315 is fixed to the solidified traveling member 314. The length of the solidifying member 315 can be provided more than the length of the application member.

  FIG. 13 is a view for explaining the operation of the coating unit and the solidification unit of FIG.

  Referring to FIG. 13, the solidification member 315 is positioned side by side with one of the application members 215a, 215b, 215c, 215d, and 215e. One of the coating members 215a, 215b, 215c, 215d, and 215e and the solidification unit 310 are moved from one end of the substrate s to the other while maintaining a certain distance. The applying member applies the solution to the substrate s, and the solidifying member 315 provides the suction pressure to the substrate s. When one of the coating members 215a, 215b, 215c, 215d, and 215e and the solidification unit 310 reach the other end of the substrate s, they move to one end of the substrate s again. At this time, one of the coating members 215a, 215b, 215c, 215d, and 215e and the solidification unit 310 do not operate. At one end of the substrate s, one of the coating members 215a, 215b, 215c, 215d, and 215e and the solidifying member 315 are moved in the second direction (2). One of the coating members 215a, 215b, 215c, 215d, and 215e and the solidification unit 310 perform application of a solution and suction of gas on the upper surface of the substrate s while moving from one end to the other end of the substrate s. Such a process is repeatedly performed until the solution is applied to the entire upper surface of the substrate s.

  FIG. 14 is a view showing a solidified member according to another embodiment.

  Referring to FIG. 14, a suction hole 321 and an injection hole 322 are formed in the solidifying member 320. The suction hole 321 is connected to the pump 323 through the first line 322. The injection hole 322 is connected to the tank 325 through the second line 324. The tank 325 supplies gas to the injection hole 322. A valve 327 and a temperature adjustment member 326 are provided on the second line 324. The temperature adjustment member 326 adjusts the temperature supplied to the second line 324. As an example, the temperature adjustment member 326 may be provided as a heater or a cooler. Alternatively, the temperature adjustment member 326 may include both a heater and a cooler to perform gas heating and cooling. The valve 327 adjusts the amount of gas supplied to the injection hole 322. The injection hole 322 is located behind the suction hole 321.

  FIG. 15 is a view showing the operation of the solidifying member of FIG.

  The solidifying member 320 moves from the front to the back on the upper part of the substrate s. The injection hole 322 passes through one point on the substrate s and then the suction hole 321 passes. The ejection hole 322 ejects a gas having a constant temperature onto the upper surface of the substrate s on which the first solution to the fifth solution are ejected. The jetted gas forms an airflow on the upper part of the substrate s. The air flow heats or cools the solution and the substrate s while being exchanged with the solution and the substrate s. The air stream also promotes evaporation of the solvent of the solution.

  The suction hole 321 provides suction pressure on the upper surface of the substrate s to promote the solidification of the solvent. The suction hole 321 sucks a gas containing a solvent.

  FIG. 16 shows a substrate processing apparatus according to another embodiment.

  Referring to FIG. 16, the substrate processing apparatus 11 may be implemented by omitting the inspection unit 500 and the repair unit assembly 600 from the substrate processing apparatus 10 of FIG. Since the operations of the support member 110, the coating unit assembly 220, the solidification unit 330, and the bake member 430 are the same as those of the substrate processing apparatus 10 of FIG. 1, repeated descriptions are omitted.

  In another embodiment, the bake member 400 may be omitted in the substrate processing apparatus 11 of FIG.

  FIG. 17 is a view showing a substrate processing apparatus according to another embodiment, and FIG. 18 is a side sectional view of a defect beam, a coating member, and a solidifying member.

  17 and 18, the substrate processing apparatus 12 includes a support member 140, a coating unit assembly 240, and solidification units 246a, 246b, 246c, 246d, and 246e.

  The configuration of the support member 140 is the same as that of the substrate processing apparatus 10 in FIG.

  The coating unit assembly 240 includes a first coating unit 240a, a second coating unit 240b, a third coating unit 240c, a fourth coating unit 240d, and a fifth coating unit 240e.

  The first application unit 240a includes a first application transfer member 241a and a first application member 245a.

  The first application transfer member 241a includes a first application support base 243a and a first application combined beam 242a. The first coating combined beam 242a is provided in a bar shape extending in the second direction (2). Both ends of the first coating / coupling beam 242a are coupled to the first coating / supporting base 243a. The first coating support base 243a is provided in a bar shape extending in the third direction (3). The first coating combined beam 242a is coupled to the first coating support base 243a so as to be movable in the third direction (3). A pair of rails 741 are provided on both sides of the support member 140 along the first direction (1). The rail 741 is spaced apart in the second direction (2) by a distance corresponding to the length of the first coating and coupling beam 242a. The first application support base 243 a is installed on the rail 741. The first application transfer member 241 a moves in the first direction (1) according to the rail 741 and can move to both sides of the support member 100.

  The second application unit 240b includes a second application transfer member 241b and a second application member 245b. The third application unit 240c includes a third application transfer member 241c and a third application member 245c. The fourth application unit 240d includes a fourth application transfer member 241d and a fourth application member 245d. The fifth application unit 240e includes a fifth application transfer member 241e and a fifth application member 245e.

  In the substrate processing apparatus 12 of FIG. 17, solidification units 246a, 246b, 246c, 246d, and 246e are provided as solidification members 246a, 246b, 246c, 246d, and 246e. The first application member 245a and the first solidification member 246a are coupled to the first application combined beam 242a. The second application member 245b and the second solidification member 246b are coupled to the second application combined beam 242b. The third application member 245c and the third solidifying member 246c are coupled to the third application combined beam 242c. The fourth application member 245d and the fourth solidification member 246d are coupled to the fourth application combined beam 242d. The fifth application member 245e and the fifth solidification member 246e are coupled to the fifth application combined beam 242e. The coating members 245a, 245b, 245c, 245d, and 245e are respectively positioned behind the solidifying members 246a, 246b, 246c, 246d, and 246e. The operation of the coating members 245a, 245b, 245c, 245d, and 245e and the solidifying members 246a, 246b, 246c, 246d, and 246e is performed by the coating members 205a, 205b, 205c, 205d, and 205e provided to the substrate processing apparatus of FIG. It is the same as the forming member 305.

  As another embodiment, the substrate processing apparatus 12 of FIG. 17 may further include the same bake member, inspection unit, and repair unit assembly as the substrate processing apparatus 10 of FIG. At this time, the coating unit assembly, the inspection unit, and the repair unit assembly are positioned on different rails as in FIG.

  As another embodiment, the first application transfer member 241a, the second application transfer member 241b, the third application transfer member 241c, the fourth application transfer member 241d, and the fifth application transfer member 241e of FIG. A first traveling member, a second traveling member, a third traveling member, a fourth traveling member, and a fifth traveling member similar to the first application traveling member 214a to the fifth application traveling member 214e may be provided.

  The lengths of the first application member 245a to the fifth application member 245e and the first solidification member 246a to the fifth solidification member 246e are provided to be shorter than the length of the substrate.

  The first application member 245a and the first solidification member 246a are coupled to the first traveling member. The second application member 245b and the second solidification member 246b are coupled to the second traveling member. The third application member 245c and the third solidification member 246c are coupled to the third traveling member. The fourth application member 245d and the fourth solidification member 246d are coupled to the fourth traveling member. The fifth application member 245e and the fifth solidification member 246e are coupled to the fifth traveling member.

  Since the operations of the first traveling member to the fifth traveling member are the same as those of the traveling members 603a, 603b, 603c, 603d, and 603e in FIG.

  The foregoing detailed description is merely illustrative of the invention. Also, the foregoing is intended to illustrate and describe the preferred embodiment of the present invention, and the present invention can be used in a variety of other combinations, modifications and environments. That is, changes or modifications can be made within the scope of the inventive concept disclosed in the present specification, the scope equivalent to the above-described disclosure, and / or the skill or knowledge of the industry. The above-described embodiments are for explaining the best state for embodying the technical idea of the present invention, and various modifications required in specific application fields and applications of the present invention are possible. Accordingly, the above detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other implementations.

100 support member,
200 coating unit assembly,
200a-e 1st-5th application unit,
201a-e 1st-5th application transfer member,
202a-e 1st-5th application combination beam,
203a-e 1st-5th coating support stand,
205a-e 1st-5th application member,
206a-e 1st to 5th lines,
207a-e first to fifth tanks,
300 solidification unit,
301 solidification transfer member,
305 solidified member,
308 pump,
400 bake members,
404 heater,
500 inspection units,
600 repair unit assembly,
600a-e 1st to 5th repair unit,
601a-e first to fifth repair transfer members,
701 to 703 First to third rails.

Claims (24)

A support member on which the substrate is disposed;
An application unit assembly including an application unit for applying a solution to the substrate;
A solidification unit that is movably coupled to both sides of the support member and provides a suction pressure to the solution applied to the substrate;
The application unit includes:
A coating transfer member coupled to be movable to both sides of the support member;
A substrate processing apparatus, comprising: an application member coupled to the application transfer member and applying the solution to the substrate by an inkjet method.   The substrate processing apparatus according to claim 1, wherein the solidification unit is provided as a solidification member coupled to the coating transfer member. The application unit further includes a traveling member coupled to the application transfer member so that the application unit can move in a direction parallel to the plane of the support member.
The substrate processing apparatus according to claim 2, wherein the coating member and the solidifying member are coupled to the traveling member. The solidification unit is
A solidification transfer member coupled to be movable to both sides of the support member;
The substrate processing apparatus according to claim 1, further comprising: a solidification member that is coupled to the solidification transfer member and sucks a gas above the substrate. The application unit further includes an application traveling member coupled to the application transfer member so that the application unit can move in a direction parallel to the plane of the support member.
The substrate processing apparatus according to claim 4, wherein the coating member is coupled to the coating traveling member. The solidification unit further includes a solidification traveling member coupled to the solidification transfer member so that the solidification unit can move in a direction parallel to the plane of the support member.
The substrate processing apparatus according to claim 4, wherein the solidification member is coupled to the solidification traveling member. The solidifying member is connected to the pump through the first line;
The substrate processing apparatus according to claim 2, wherein a suction hole into which a gas flows is formed on a lower surface of the solidification member. The solidifying member is connected to a tank for supplying gas through a second line,
The substrate processing apparatus according to claim 2, wherein an injection hole for injecting a gas supplied to the second line is formed on a lower surface of the solidification member.   The substrate processing apparatus of claim 8, wherein the second line is provided with a temperature adjusting member that adjusts a temperature of the gas.   The substrate processing apparatus according to claim 9, wherein the temperature adjusting member is a heater that heats the gas.   The substrate processing apparatus according to claim 9, wherein the temperature adjusting member is a cooler that cools the gas. The application unit assembly includes five application units,
The substrate processing apparatus according to claim 1, wherein each of the five application units applies a first solution, a second solution, a third solution, a fourth solution, and a fifth solution to the substrate.   The substrate processing apparatus according to claim 12, wherein the five coating units are sequentially arranged on the opposite side of the support member.   The said 1st solution thru | or the said 5th solution respectively form a positive hole injection layer, a positive hole transport layer, an organic light emitting layer, an electron carrying layer, and an electron injection layer in the upper surface of the said board | substrate. The substrate processing apparatus as described.   The substrate processing apparatus according to claim 1, further comprising a bake member that is positioned above the support member and provided so as to be able to get on and off.   The substrate processing apparatus of claim 15, wherein the bake member is connected to a gas tank by a line, and the line is provided with a valve that adjusts an amount of gas supplied from the gas tank to the bake member.   The substrate processing apparatus of claim 16, wherein the line is provided with a heater for heating the gas. An inspection unit for inspecting the upper surface of the substrate;
The inspection transfer member coupled to be movable to both sides of the support member;
The substrate processing apparatus according to claim 1, further comprising: an inspection member that is coupled to the inspection transfer member and photographs an upper surface of the substrate. A repair unit assembly including a repair unit for repairing a defect of the substrate;
The substrate processing apparatus according to claim 1, wherein the repair unit is provided in the same number as the coating unit. The repair unit is
A repair transfer member coupled to be movable to both sides of the support member;
A repair traveling member coupled to the repair transfer member so as to be movable in a direction parallel to the plane of the support member;
The substrate processing apparatus according to claim 19, further comprising a repair member that is provided with a length shorter than that of the coating member and that applies a solution to the substrate.   After applying one of the solutions for forming the hole injection layer, the hole transport layer, the organic light emitting layer, the electron transport layer or the electron injection layer on the upper surface of the substrate disposed on the support member, the substrate is disposed on the support member. A substrate processing method of performing a solidification process on the solution by providing a suction pressure to an upper surface of the substrate.   The substrate processing method according to claim 21, wherein, after the solidification step is performed, a baking step of heating the substrate positioned on the support member is performed to flatten the solution applied to the substrate.   23. The substrate processing method according to claim 22, wherein after the solution is flattened, a defect on the upper surface of the substrate is inspected by photographing the upper surface of the substrate positioned on the support member.   23. The substrate processing method according to claim 22, wherein the defect is repaired by applying the solution at a position where the defect is present on the upper surface of the substrate positioned on the support member.

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