JP2013211480A - Component built-in substrate - Google Patents

Abstract

A heat dissipation characteristic is improved.
A component-embedded substrate is a multilayer structure in which first to third printed wiring boards having a built-in electronic component are stacked. The electronic component 90 accommodated in the opening 29 of the second printed wiring board 20 includes a plurality of grooves 94 formed on the side surface 91c. In these groove portions 94, a metal layer 93 made of copper or the like is formed. On the second printed wiring board 20, heat radiation wiring (heat radiation plate) composed of the wiring 22, the plating via 23 and the plating layer 22 a is formed, and the plating layer 22 a is formed on the inner peripheral surface of the opening 29. The electronic component 90 is connected to a heat dissipation wiring formed on the second resin base material 21 via a heat dissipating body 99 having a metal layer 93 made of a conductive paste or the like.
[Selection] Figure 1

Description

  The present invention relates to a component-embedded substrate having a multilayer structure in which electronic components are incorporated.

  In order to realize high-density mounting of electronic components, a component-embedded substrate in which electronic components are embedded in a multilayer substrate is known. In such a component-embedded substrate, since the electronic component is embedded in an insulating layer formed on the substrate, how to efficiently release the heat generated in the electronic component to the outside becomes a problem. The conventional component-embedded substrate is conducted through the insulating layer with excellent thermal conductivity to the heat dissipating inner layer pattern made of a metal member formed on the insulating layer so as to dissipate the heat generated in the electronic component. (See Patent Document 1).

JP 2009-277784 A

  However, in the conventional component-embedded substrate disclosed in Patent Document 1 described above, since a resin such as an insulating layer is interposed between the electronic component and the heat dissipation inner layer pattern, a sufficient heat dissipation effect is always obtained. There is a problem that can not be.

  An object of the present invention is to provide a component-embedded substrate that can solve the above-described problems of the prior art and improve the heat dissipation characteristics.

  The component-embedded substrate according to the present invention is a multilayered component-embedded substrate having a multilayer structure in which a wiring pattern is formed on at least one surface and a conductive paste via is formed and an electronic component is embedded. Wiring boards arranged in the same layer are formed with an opening in a part thereof, and a heat dissipation wiring made of the wiring pattern is formed around the opening, and the electronic component is accommodated in the opening of the wiring board. The side surface of the electronic component is connected to the heat radiation wiring via a heat radiator.

  According to the component-embedded substrate according to the present invention, since the side surface of the built-in electronic component is connected to the heat dissipation wiring via the heat sink, the heat from the electronic component passes through the heat sink connected to the side surface. It is dissipated after being efficiently conducted to the heat dissipation wiring. Thereby, compared with the conventional one, the heat dissipation effect can be increased and the heat dissipation characteristics can be improved.

  In one embodiment of the present invention, the heat radiating body is solder or a conductive paste.

  In another embodiment of the present invention, the electronic component has a plurality of grooves on the side surface. In this case, it is more desirable that a metal layer is formed in the groove of the electronic component. The metal layer may be formed along the groove of the electronic component or may be formed to fill the groove of the electronic component.

  In still another embodiment of the present invention, the metal layer is formed by plating.

  According to the present invention, the heat dissipation characteristics can be improved.

It is sectional drawing which shows the structure of the component built-in board | substrate which concerns on one Embodiment of this invention. It is A-A 'sectional drawing of FIG. It is a flowchart which shows the manufacturing process of the same component built-in board. It is a flowchart which shows the manufacturing process of the same component built-in board. It is a flowchart which shows the manufacturing process of the same component built-in board. It is a flowchart which shows the manufacturing process of the same component built-in board. It is a flowchart which shows the manufacturing process of the same component built-in board. It is sectional drawing which shows the same component built-in board | substrate for every manufacturing process. It is sectional drawing which shows the same component built-in board | substrate for every manufacturing process. It is sectional drawing which shows the same component built-in board | substrate for every manufacturing process. It is sectional drawing which shows the same component built-in board | substrate for every manufacturing process. It is a top view which shows a part of manufacturing process of FIG. It is sectional drawing which shows the same component built-in board | substrate for every manufacturing process. It is sectional drawing which shows a part of component-embedded substrate which concerns on other embodiment of this invention. It is sectional drawing which shows a part of component-embedded board which concerns on further another embodiment of this invention.

  Hereinafter, a component-embedded substrate according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a cross-sectional view showing the structure of a component-embedded substrate according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line A-A ′ of FIG. 1. As shown in FIG. 1, the component-embedded substrate 1 has a structure in which a first printed wiring board 10, a second printed wiring board 20, and a third printed wiring board 30 are collectively laminated by, for example, thermocompression bonding. . The component built-in substrate 1 may be mounted on a mounting surface of a mounting substrate (not shown).

  The component-embedded substrate 1 is sandwiched between the first printed wiring board 10 and the third printed wiring board 30 in the opening 29 formed in the second resin base material 21 of the second printed wiring board 20. A built-in electronic component 90 is provided. Further, the component-embedded substrate 1 includes a solder resist 38 and a bump 39 made of solder formed on the mounting surface 30b side of the third printed wiring board 30 to the mounting board (not shown).

  The first to third printed wiring boards 10 to 30 are respectively formed on at least one side of the first, second and third resin base materials 11, 21 and 31 and the first to third resin base materials 11 to 31. Wiring 12, 22, 32. In addition, the first and third printed wiring boards 10 and 30 are respectively filled with the conductive paste vias 14 filled in the via holes 2 formed in the first resin base material 11 and the via holes 3 formed in the adhesive layer 9. 34 is provided.

  The plating via 23 is formed so as to conduct the wirings 22 on both surfaces of the second resin base material 21. Similarly, the third printed wiring board 30 includes plating vias 33 formed so as to conduct the wirings 32 on both surfaces of the third resin base material 31 in the via holes 4 formed in the third resin base material 31.

  These 1st-3rd printed wiring boards 10-30 can use a single-sided copper clad laminated board (single-sided CCL), a double-sided copper clad laminated board (double-sided CCL), etc., for example. In this example, the 2nd and 3rd printed wiring boards 20 and 30 are formed based on double-sided CCL, and the 1st printed wiring board 10 is formed based on single-sided CCL. Accordingly, the wirings 22 and 32 of the second and third printed wiring boards 20 and 30 are formed on both surfaces of the second and third resin base materials 21 and 31, and the plating vias 23 and 33 are formed on the wirings 22 and 32 on both surfaces. Are connected in layers.

  The plating vias 23 and 33 are made of LVH plating vias having a structure in which a through hole formed from the other wirings 22 and 32 is plated without penetrating the one wirings 22 and 32, for example. It is formed by copper (Cu) plating. Accordingly, plating layers 22a and 32a are formed on the wirings 22 and 32 formed on at least the surface opposite to the surface on which the plating vias 23 and 33 are formed.

  In the second printed wiring board 20, the plating layer 22 a is also formed on the side surface of the second resin base material 21 in the opening 29 so as to be continuous with the plating via 23. The wiring 22, the plating via 23, and the plating layer 22 a of the second printed wiring board 20 also function as heat radiation wiring (heat radiation plate) inside the component built-in substrate 1. Similarly, the wiring 32, the plating via 33, and the plating layer 32a of the third printed wiring board 30 also function as heat radiation wiring (heat radiation plate).

  Although not shown, the second and third printed wiring boards 20 and 30 have a structure in which a conductive paste is filled in the through holes instead of the plating vias 23 and 33 for plating in the through holes. Vias may be formed, or plated through holes having a structure in which plating is performed in through holes penetrating between the wirings 22 and 32 on both sides may be formed.

  The first to third resin base materials 11 to 31 are each formed of a resin film having a thickness of about 25 μm, for example. Here, as the resin film, for example, a resin film made of polyimide (PI), polyolefin (PO), liquid crystal polymer (LCP) or the like, a resin film made of thermosetting epoxy resin (EP), or the like can be used. .

  The electronic component 90 is, for example, a semiconductor component such as an IC chip, a passive component, or the like, and includes a WLP (Wafer Level Package) subjected to rewiring. A plurality of rewiring electrodes 91 formed on pads (not shown) are provided on the electrode forming surface 91b of the electronic component 90. An insulating layer (not shown) is formed on the electrode formation surface 91b around the rewiring electrode 91.

  Furthermore, a metal layer 93 made of a metal member such as copper is formed on the side surface 91c of the electronic component 90 over the entire circumference. As shown in FIG. 2, for example, a plurality of wavy groove portions 94 are formed on the side surface 91 c of the electronic component 90, and the metal layer 93 has a shape that follows, for example, the shape of the plurality of groove portions 94. Is formed. Note that an insulating layer made of an oxide film or the like may be interposed between the side surface 91c of the electronic component 90 and the metal layer 93.

  And between the plating layer 22a in the opening part 29 of the 2nd printed wiring board 20, and the metal layer 93 of the side surface 91c of the electronic component 90 accommodated in this opening part 29, conductive paste, solder, etc. A heat dissipating body 99 made of a conductive member is arranged in a state of connecting the plating layer 22a and the metal layer 93 over the entire circumference.

  Thereby, the heat generated in the electronic component 90 is, for example, from the side surface 91c to the metal layer 93, the radiator 99, the plating layer 22a, the wiring 22 and the plating via 23, the conductive paste via 34, the plating layer 32a and the wiring 32, and the plating via. 33 is efficiently transmitted to the mounting substrate via the bumps 39.

  As described above, the heat of the electronic component 90 is transmitted through the bumps 39 through a path shorter than the heat dissipation path from the rewiring electrode 91, so that the heat can be effectively radiated to the outside. Moreover, since the side surface 91c of the electronic component 90 has a wave-like shape in which a plurality of groove portions 94 are formed, the contact area between the metal layer 93 and the heat radiating body 99 can be increased as compared with the planar shape. It is possible to conduct heat efficiently. Furthermore, by forming the plating layer 22a, the heat dissipating body 99, and the metal layer 93 with the same metal material, the mutual adhesion is enhanced and the heat conduction efficiency is improved. The wirings 12, 22, and 32 of the first to third printed wiring boards 10 to 30 are formed by patterning a conductive material such as copper foil.

  The conductive paste constituting the conductive paste vias 14 and 34 and the radiator 99 includes at least one kind of low electrical resistance metal particles selected from gold, silver, copper, aluminum, iron, etc., tin, bismuth, and indium. And at least one low melting point metal particle selected from lead and the like. The conductive paste is made of, for example, a paste obtained by mixing these metal particles with a binder component mainly composed of epoxy, acrylic, urethane, or the like.

  In the conductive paste thus configured, the contained low melting point metal particles can be melted at 200 ° C. or less to form an alloy, and particularly an intermetallic compound can be formed with copper or silver. With characteristics. Therefore, the connection portion between the conductive paste vias 14 and 34 and the wiring 12, the rewiring electrode 91, the plating via 23, and the plating layer 32a, and the connection portion between the radiator 90, the metal layer 93, and the plating layer 22a are collectively laminated. It is alloyed by an intermetallic compound at the time of thermocompression bonding.

  In this case, the conductive paste has a characteristic that electrical connection is made when the metal particles come into contact with each other. Examples of the method for applying and filling the conductive paste in the via holes 2 and 3 or the plating layer 22a or the metal layer 93 in the opening 29 include, for example, a printing method, a spin coating method, a spray coating method, a dispensing method, and a laminate method. A construction method and a construction method using both of these methods can be employed.

  The first to third printed wiring boards 10 to 30 and the electronic component 90 in the opening 29 are laminated via the adhesive layer 9 provided in advance on the first and third printed wiring boards 10 and 30. . The adhesive layer 9 is made of, for example, a thermosetting resin or a thermoplastic resin. As described above, the electronic component 90 disposed in the opening 29 of the second printed wiring board 20 has the side surface 91c via the plating layer 22a and the heat dissipating body 99 in the opening 29 of the second printed wiring board 20. In the contact state, it is fixed in the opening 29 by the adhesive layer 9.

Next, the manufacturing method of the component built-in substrate 1 according to the present embodiment will be described.
3-7 is a flowchart which shows the manufacturing process of a component built-in board | substrate. 8 to 11 and 13 are cross-sectional views showing the component-embedded substrate for each manufacturing process. FIG. 12 is a plan view showing a part of the manufacturing process of FIG. 3 and 8 show the first printed wiring board 10, FIGS. 4 and 9 show the second printed wiring board 20, FIGS. 5 and 10 show the third printed wiring substrate 30, and FIGS. 12 and FIG. 12 show the details of the respective manufacturing processes for the electronic component, and FIGS.

  First, the manufacturing process of the first printed wiring board 10 will be described with reference to FIG. As shown in FIG. 8A, a single-sided CCL in which a conductor layer 8 made of a solid copper foil or the like is formed on one surface of the first resin base 11 is prepared (step S100). Next, after forming an etching resist on the conductor layer 8 by photolithography, etching is performed to form a wiring pattern such as the wiring 12 as shown in FIG. 8B (step S102).

  The single-sided CCL used in step S100 has a structure in which the first resin base material 11 having a thickness of about 25 μm is bonded to the conductor layer 8 made of, for example, a copper foil having a thickness of about 12 μm. As this single-sided CCL, for example, a material produced by applying a polyimide varnish to a copper foil and curing the varnish by a known casting method can be used.

  In addition, as single-sided CCL, a seed layer is formed on a polyimide film by sputtering, and copper is grown by plating to form a conductor layer 8, or a rolled or electrolytic copper foil and a polyimide film are bonded together with an adhesive. It is also possible to use the one produced by the above.

  Note that the first resin base 11 does not necessarily need to be made of polyimide, and may be made of a plastic film such as a liquid crystal polymer as described above. In addition, an etchant mainly composed of ferric chloride or cupric chloride can be used for the etching in step S102.

  When the wiring 12 is formed, as shown in FIG. 8C, the adhesive material 9a and the mask material 7 are attached to the surface of the first resin base 11 opposite to the wiring 12 formation surface by thermocompression bonding (step) S104). For example, an epoxy thermosetting film having a thickness of about 25 μm can be used as the adhesive material 9a attached in step S104. For thermocompression bonding, a vacuum laminator is used, and the adhesive 9a is pressed under a pressure of 0.3 MPa at a temperature at which the adhesive 9a is not cured in a reduced pressure atmosphere.

  The interlayer adhesive used for the adhesive layer 9 and the adhesive 9a is not only an epoxy thermosetting resin, but also an acrylic adhesive, a thermoplastic adhesive represented by thermoplastic polyimide, and the like. It is done. Further, the interlayer adhesive does not necessarily need to be in the form of a film, and may be obtained by applying a varnish-like resin. As the mask material 7, in addition to the above-described resin film and plastic films such as PET and PEN, various films that can be bonded and peeled off by UV irradiation can be used.

  Then, as shown in FIG. 8D, the mask material 7 and the adhesive material 9a are irradiated with laser light from the attached mask material 7 side toward the wiring 12 using, for example, a UV-YAG laser device. And the via hole 2 which penetrates the 1st resin base material 11 is formed in a predetermined location (step S106). The via hole 2 is subjected to desmearing such as plasma desmear after the formation.

In addition, the via hole 2 formed in step S106 may be formed by a carbon dioxide laser (CO ₂ laser), an excimer laser, or the like, or may be formed by drilling or chemical etching. The desmear treatment can be performed with a mixed gas of CF ₄ and O ₂ (tetrafluoromethane + oxygen), but other inert gas such as Ar (argon) can also be used. Alternatively, wet desmear treatment using a chemical solution may be used.

  Thereafter, as shown in FIG. 8E, the conductive paste via 13 is formed by filling the formed via hole 2 with a conductive paste by, for example, screen printing (step S108), and the mask material 7 is peeled off. The first printed wiring board 10 having the first resin base material 11 provided with the adhesive layer 9 is formed while the wiring 12 and the conductive paste via 13 are formed (step S110).

  Next, the manufacturing process of the second printed wiring board 20 will be described with reference to FIG. In addition, the part already demonstrated may attach | subject the same code | symbol, and may omit description, and suppose that the content mentioned above is applicable to the specific processing content of each step. First, as shown in FIG. 9A, a double-sided copper-clad laminate (double-sided CCL) in which the conductor layer 8 is formed on both surfaces of the second resin base material 21 is prepared (step S120), and FIG. As shown in FIG. 5, the via hole 3 is formed at a predetermined location and the opening 29 is formed (step S122), and for example, a plasma desmear process is performed.

  Next, as shown in FIG. 9C, panel plating is performed on the entire surface of the second resin base material 21 (step S124), and the plating layer 22a is formed on the conductor layer 8, in the via hole 3, and in the opening 29. Form. The plated layer 22a in the via hole 3 is used later as the plated via 23, and is electrically connected to the conductor layers 8 on both surfaces of the second resin base material 21.

  Finally, as shown in FIG. 9D, wiring patterns such as wirings 22 and plating vias 23 are formed on both surfaces of the second resin base material 21 by etching or the like (step S126), and the second printed wiring board 20 is mounted. Form.

  Next, a manufacturing process of the third printed wiring board 30 will be described with reference to FIG. First, as shown in FIG. 10A, a double-sided copper-clad laminate (double-sided CCL) in which the conductor layer 8 is formed on both sides of the third resin base material 31 is prepared (step S130), and FIG. As shown in FIG. 5, via holes 4 are formed at predetermined locations (step S132), and plasma desmear processing is performed.

  Next, as shown in FIG. 10C, panel plating is performed on the entire surface of the third resin base material 31 (step S <b> 134) to form a plating layer 32 a on the conductor layer 8 and in the via hole 4. The plated layer 32a in the via hole 4 is used later as the plated via 33, and is electrically connected to the conductor layers 8 on both surfaces of the third resin base 31.

  Then, as shown in FIG. 10D, wiring patterns such as the wiring 32 and the plating via 33 are formed on both surfaces of the third resin base material 31 by etching or the like (step S135), as shown in FIG. Next, the adhesive 9a and the mask material 7 are attached to the surface of the second resin base 31 opposite to the opening side of the plating via 33 by thermocompression bonding (step S136).

  Next, as shown in FIG. 10 (f), laser light is irradiated from the attached mask material 7 side toward the plating layer 32a, and via holes 3 penetrating the mask material 7 and the adhesive material 9a are formed at predetermined positions. (Step S137). Note that the desmear process as described above is performed in the via hole 3.

  Finally, as shown in FIG. 10G, the conductive paste is filled in the via hole 3 (step S138), the conductive paste via 34 is formed, and the mask material 7 is peeled off and removed (step S139). ), A third printed wiring board 30 is formed. As described above, the adhesive layer 9 is disposed on the upper surface of the third resin base 31 so that the conductive paste via 34 of the third printed wiring board 30 can be connected to the plating via 23.

  Next, a manufacturing process of the electronic component 90 built in the opening 29 of the second printed wiring board 20 will be described with reference to FIG. First, as shown in FIG. 11A, a wafer 98 before dicing on which an inorganic insulating layer such as silicon oxide or silicon nitride is formed is prepared (step S140).

  Next, as shown in FIG. 11B and FIG. 12, a plurality of holes 90a are formed along the portion that becomes the side surface of each electronic component 90 to be manufactured (step S142), and shown in FIG. As described above, the metal layer 93 is formed on the inner peripheral surface of each hole 90a by plating or the like (step S146).

  After the metal layer 93 is formed, as shown in FIG. 11 (d), dicing is performed, and cutting is performed at an intermediate portion of the hole 90a to separate it (step S148), whereby the electronic component 90 is manufactured. In addition, although description is abbreviate | omitted, the manufacturing process of the rewiring electrode 91 is also included in the said process. In this case, an oxide film is formed on the electronic component 90, and a metal layer 93 is further formed. Further, since such a process is the same process as the through wiring, the through wiring can be simultaneously formed in the electronic component 90 in this process.

  Thus, after the first to third printed wiring boards 10 to 30 and the electronic component 90 are produced, a final process for collectively laminating them is performed. The final process will be described with reference to FIG. First, as shown in FIG. 13A, a part 99a of a radiator 99 made of a conductive paste or the like is formed on the plating layer 22a in the opening 29 of the second printed wiring board 20, for example, an inkjet method or a dispenser. Etc. are applied (step S150).

  Next, as shown in FIG. 13B, the rewiring electrode 91 of the electronic component 90 and the end face of the conductive paste via 14 are aligned by an electronic component mounting machine, and the electronic component 90 is placed in the first printed wiring. Mounting on the substrate 10 (step S152).

  Then, as shown in FIG. 13C, the conductive layers 9 of the first and third printed wiring boards 10 and 30 and the conductive paste vias 14 and 34 of the first and third printed wiring boards 10 and 30 are electrically conductive. The printed wiring boards 10 to 30 and the electronic component 90 are positioned and stacked in a state where the conductive paste or the part 99a of the heat dissipating body 99 is not cured, respectively (step S156).

  After that, for example, using a vacuum curing press, heating and pressurizing in a reduced pressure atmosphere of 1 kPa or less, and then laminating together by thermocompression bonding (step S158). As a result, the component built-in substrate 1 as shown in FIG. At this time, the adhesive layers 9 between the layers and the resin base materials 11 to 41 are cured simultaneously with the curing and alloying of the conductive paste filled in the via holes and the part 99a of the radiator 99 are joined. The radiator 99 is formed. Therefore, an alloy layer of an intermetallic compound is formed between the conductive paste and the wiring in contact with the radiator 99 as described above.

  The heat radiator 99 is formed by, for example, applying a part on the metal layer 93 formed on the side surface 91 c of the electronic component 90 or laminating the second printed wiring board 20 on the first printed wiring board 10. Alternatively, it may be formed by directly filling the plated layer 22a and the metal layer 93 in the opening 29 with an ink jet, a printing method, or the like. Thereafter, although not shown, a solder resist 38 is pattern-formed on the mounting surface 30b side of the third resin base 31 of the third printed wiring board 30 in the component-embedded substrate 1. Finally, if the bump 39 is formed, the component built-in substrate 1 as shown in FIG. 1 is completed.

  As described above, according to the component-embedded substrate 1 according to the present embodiment, the plurality of groove portions 94 in which the metal layer 93 is formed are formed on the side surface 91c of the built-in electronic component 90, and the metal layer 93 is the wiring 22, It is connected to a heat dissipation wiring composed of the via 23 and the plating layer 22a through a heat dissipation body 99. For this reason, the heat from the electronic component 90 is efficiently conducted to the heat radiating plate through the metal layer 93 of the groove portion 94 of the side surface 91c and the heat radiating body 99, and then radiated, so that the heat radiation effect is enhanced and the heat radiation characteristics are improved. Can be made.

  FIG. 14 is a cross-sectional view showing a part of a component built-in substrate according to another embodiment of the present invention. As shown in FIG. 14, in the component-embedded substrate according to the present embodiment, the metal layer 93 formed on the side surface 91c of the electronic component 90 is connected to at least one redistribution electrode 91, via this The point connected to the conductive paste via 14 is different from that according to the previous embodiment. With such a structure, the heat of the electronic component 90 can be released from both the front and back sides of the component-embedded substrate, so that the heat dissipation effect can be further enhanced and the heat dissipation characteristics can be improved.

  FIG. 15 is a cross-sectional view showing a part of a component-embedded substrate according to still another embodiment of the present invention. As shown in FIG. 15, the component built-in substrate according to the present embodiment shows an example in which a metal layer 93 formed on the side surface 91 c of the electronic component 90 is embedded in the groove portion 94. The component-embedded substrate of this embodiment can be formed by embedding a metal material in the hole 90a after the drilling step shown in FIG. 12, and then separating the electronic component 90 by dicing. According to this embodiment, since the side surfaces are straight, the metal layer 93 is more advantageous than the heat dissipating body 99 in addition to the advantage that chipping is less likely to occur compared to the case where the side surfaces are uneven as in the previous embodiment. In the case where the heat dissipation property is high, there is an advantage that the overall heat dissipation efficiency is improved.

DESCRIPTION OF SYMBOLS 1 Component built-in board 2, 3, 4 Via hole 7 Mask material 8 Conductor layer 9 Adhesion layer 10 1st printed wiring board 11 1st resin base material 12, 22, 32 Wiring 14, 34 Conductive paste via 20 2nd printed wiring board 21 2nd resin base material 22a, 32a Heat dissipation wiring (plating layer)
23, 33 Heat dissipation wiring (plating via)
DESCRIPTION OF SYMBOLS 29 Opening part 30 3rd printed wiring board 31 3rd resin base material 38 Solder resist 39 Bump 90 Electronic component 90a Hole 91 Rewiring electrode 91b Electrode formation surface 91c Side surface 93 Metal layer 94 Groove part 99 Heat sink

Claims (7)

In a component-embedded board having a multilayer structure in which a wiring pattern on which at least one surface is formed and a conductive paste via is formed is laminated and an electronic component is built-in,
The wiring board disposed in the same layer as the electronic component has an opening formed in part and a heat dissipation wiring formed of the wiring pattern around the opening.
The electronic component is housed in an opening of the wiring board, and a side surface of the electronic component is connected to the heat dissipation wiring via a heat radiator. The component built-in board according to claim 1, wherein the heat radiating body is solder or a conductive paste. The component-embedded substrate according to claim 1, wherein the electronic component has a plurality of groove portions on the side surface. The component built-in substrate according to claim 3, wherein a metal layer is formed in the groove portion of the electronic component. The component built-in substrate according to claim 4, wherein the metal layer is formed along a groove of the electronic component. The component built-in substrate according to claim 4, wherein the metal layer is formed so as to fill a groove portion of the electronic component. The component built-in substrate according to claim 1, wherein the metal layer is formed by plating.

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