JP2013258354A - Mold package and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize an insulation layer which is excellent in adhesion to a mold resin and is suitable for inhibiting resin burrs in a mold package where an island, in which an electronic component is mounted on one surface side and the insulation layer is provided on the other surface side, is sealed by the mold resin composed of a thermosetting resin including an epoxy resin so that the insulation layer is exposed.SOLUTION: A mold resin 40 seals an end part 10a of an island 10 and an end part 33 of an insulation layer 30 at the other surface 12 side of the island 10. A surface 32 in the insulation layer 30, which is opposite to the other surface 12 of the island 10, is exposed from the mold resin 40. The insulation layer 30 is composed of a thermoplastic resin having a functional group that is chemically bonded to an epoxy resin forming the mold resin 40.

Description

  In the present invention, an island in which an electronic component is mounted on one side and an insulating layer is provided on the other side is sealed with a mold resin made of a thermosetting resin including an epoxy resin so that the insulating layer is exposed. The present invention relates to a mold package and a method for manufacturing such a mold package.

  Conventionally, as this type of mold package, generally, a plate-like island in which one surface and the other surface are in a relation of front and back surfaces, an electronic component mounted on one surface of the island, one surface of the island, and an electron And a mold resin made of an epoxy-based thermosetting resin for sealing a component, and the other surface of the island is exposed from the mold resin.

  Further, in order to ensure electrical insulation and high heat dissipation on the other surface of the island, a thermosetting resin made of a ceramic substrate (see Patent Document 1) or an epoxy resin is used as an electrically insulating insulating layer on the other surface of the island. A layer (see Patent Document 2) was provided so as to cover the other surface of the island, and this insulating layer, specifically, the surface of the insulating layer opposite to the other surface of the island was exposed from the mold resin.

JP 2010-245188 A JP 2009-302526 A

  By the way, in such a mold package, an electronic component is mounted on one surface of the island, and the insulating layer is provided on the other surface of the island, and then the insulating layer is formed on the inner surface of the cavity in the mold for molding resin molding. Specifically, it is manufactured by filling and sealing one surface side of the island with a mold resin while being pressed against the lower mold.

  However, when this mold resin is filled, there is a problem that the mold resin flows between the insulating layer and the mold and a thin resin burr is generated on the insulating layer on the other surface side of the island. In particular, when the insulating layer is a ceramic substrate, a gap is likely to occur between the hard ceramic substrate and the mold, and resin burrs are likely to occur.

  In general, the resin burrs are often chemically or mechanically deburred after the molding process, which greatly increases the cost. In addition, the surface of the insulating layer opposite to the other surface of the island is exposed from the mold resin, but the end portion of the insulating layer located on the outer wall is sealed with the mold resin.

  Then, in the case where the insulating layer is a thermosetting resin layer made of an epoxy resin, there is a possibility of peeling at the end of the insulating layer sealed with the mold resin because of poor adhesion to the epoxy mold resin. There is. In order to suppress this, the surface of the thermosetting resin layer made of the epoxy resin needs to be surface-treated with plasma, UV, or the like to improve the adhesion with the mold resin.

  The present invention has been made in view of the above-described problems, and an epoxy resin is mounted so that an island in which an electronic component is mounted on one side and an insulating layer is provided on the other side is exposed. An object of the present invention is to realize an insulating layer that is excellent in adhesion to a mold resin and suitable for suppressing resin burrs in a mold package that is sealed with a mold resin made of a thermosetting resin.

In order to achieve the above object, according to the first aspect of the present invention, the plate-like island (10) in which the one surface (11) and the other surface (12) are in the relation of the front and back plates, A mounted electronic component (20), an electrically insulating insulating layer (30) provided on the other surface so as to cover the other surface of the island, and an epoxy resin for sealing one surface of the island and the electronic component A mold resin (40) made of a thermosetting resin,
Furthermore, the mold resin seals the end portion (10a) of the island and also seals the end portion (33) of the insulating layer on the other surface side of the island. The opposite surface (32) is exposed from the mold resin, and the insulating layer is characterized by being made of a thermoplastic resin having a functional group chemically bonded to the epoxy resin constituting the mold resin.

  According to this, since the insulating layer is made of a thermoplastic resin having a functional group that chemically bonds with the epoxy resin that constitutes the mold resin, the chemical bond is generated by heat at the time of molding the mold resin, and the insulating layer and the mold resin Is ensured.

  In addition, since the insulating layer is a thermoplastic resin, it becomes softer than the conventional ceramic substrate and epoxy resin due to heat during molding of the mold resin, and easily adheres securely to the inner surface of the mold without any gap. For these reasons, according to the present invention, it is possible to realize an insulating layer that has excellent adhesion to the mold resin and is suitable for suppressing resin burrs.

  Here, as in the invention described in claim 2, the thermoplastic resin may be polyimide, polyamide, or polyamideimide.

  Further, as in the third aspect of the present invention, the insulating layer is smaller in plane size than the island and can be located on the inner periphery of the outer shell of the island. According to this, the entire insulating layer made of a thermoplastic resin having low rigidity and easily deformed is supported in contact with the island, which is preferable in terms of suppressing deformation of the insulating layer.

  In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

It is a figure which shows schematic sectional structure of the mold package concerning 1st Embodiment of this invention. FIG. 2 is a top schematic plan view in FIG. 1. It is process drawing which shows the manufacturing method of the mold package concerning the said 1st Embodiment. It is a figure which shows schematic sectional structure of the mold package concerning 2nd Embodiment of this invention. It is a figure which shows schematic plan structure of the mold package concerning 3rd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
The mold package P1 according to the first embodiment of the present invention will be described with reference to FIGS. In FIG. 2, components inside the mold resin 40 are shown through the mold resin 40.

  The mold package P1 of the present embodiment is roughly divided into a plate-like island 10, an electronic component 20 mounted on one surface 11 of the island 10, and an electrically insulating insulation provided on the other surface 12 of the island 10. The layer 30 includes a mold resin 40 made of a thermosetting resin including an epoxy resin that seals the island 10 and the electronic component 20.

  The island 10 has a plate-like shape in which the one surface 11 and the other surface 12 are in a relationship of front and back plate surfaces, and is made of a conductive metal. For example, the island 10 is made of a plate material such as Cu or 42 alloy, and has a flat rectangular plate shape here.

  In the present embodiment, as shown in FIGS. 1 and 2, a suspension lead 13 is connected to an end portion 10 a located on the outline of the island 10. The suspension lead 13 is integral with the island 10 and is made of the same material as the island 10. Here, the suspension lead 13 is provided only in a portion of the end portion 10a of the island 10 near the outer periphery of the mold resin 40, and has a so-called one-side suspension configuration.

  Here, the end portion 10 a of the island 10 is an end surface 10 a that is four sides of the rectangular island 10, and the suspension lead 13 is provided on the end portion 10 a of the side located near the outer periphery of the mold resin 40. The suspension leads 13 are in the form of elongated strips that are significantly smaller in width than the islands 10. Here, one suspension lead 13 is provided for each island 10.

  In the present embodiment, the suspension lead 13 is exposed to the outside of the mold resin 40 with the other end 15 side opposite to the one end 14 located on the end 10 a side of the island 10 extending above the one surface 11 of the island 10. It has a bent shape. That is, the suspension lead 13 is bent from the flat plate-shaped island 10 to the one surface 11 side of the island 10.

  The electronic component 20 is typically a semiconductor chip such as an IC chip, but may be any other surface-mounted component that can be mounted on the island 10. The electronic component 20 is bonded and fixed to one surface 11 of the island 10 via a die bond material 21 made of solder, Ag (silver) paste, or the like.

  Moreover, the electronic component 20 is electrically connected to the suspension lead 13 via a bonding wire 50 made of Al (aluminum), Au (gold), or the like as necessary. Thereby, the electronic component 20 is electrically connected to each part in the mold package P1 via the bonding wire 50 to form a circuit.

  In the mold resin 40, other lead terminals (not shown) are provided as in a typical mold package, and these lead terminals and the electronic component 20 are connected by bonding wires or the like. Therefore, each part suspension lead 13 of the electronic component 20 and the electronic component 20 may be configured not to be connected by the bonding wire 50.

  Here, the other end 15 of the suspension lead 13 protrudes from the outline of the mold resin 40 and is exposed. The other end 15 of the suspension lead 13 only needs to be in accordance with the form of the mold package. For example, the suspension lead 13 is exposed from the mold resin 40 as a cut surface cut in the same plane as the outline of the mold resin 40. It may be.

  The insulating layer 30 is made of a thermoplastic resin having a functional group chemically bonded to the epoxy resin constituting the mold resin 40, and is provided on the other surface 12 so as to cover the other surface 12 of the island 10. .

  Such an insulating layer 30 is provided on the other surface 12 of the island 10 by printing, transferring or pasting a molded sheet. Here, a surface on the other surface 12 side of the island in the layered insulating layer 30 is a first surface 31, and a surface opposite to the first surface 31 is a second surface 32.

  Here, as shown in FIG. 1, the mold resin 40 seals the end portion 10 a located on the outline of the island 10, and the end located on the outline of the insulating layer 30 on the other surface 12 side of the island 10. The portion 33 is sealed. The second surface 32 opposite to the other surface 12 of the island 10 in the insulating layer 30 is exposed from the mold resin 40.

  Although it does not limit, the thermoplastic resin which comprises the insulating layer 30 is a polyimide, polyamide, or a polyamideimide. In the case of these thermoplastic resins, for example, a functional group such as an amide group or an imide group reacts with an epoxy group or the like of the mold resin 40 to form a chemical bond such as a covalent bond or a hydrogen bond. Thereby, in the contact part of the insulating layer 30 and the mold resin 40, the adhesiveness of the both 30 and 40 is ensured.

  Further, the thermosetting resin including the epoxy resin constituting the mold resin 40, that is, the epoxy thermosetting resin has a linear expansion coefficient α = 14 and a Young's modulus E = 12.5 GPa, for example. On the other hand, the thermoplastic resin constituting the insulating layer 30 has a significantly small linear expansion coefficient and a Young's modulus that is one digit or more smaller.

  In addition, as shown in FIGS. 1 and 2, the insulating layer 30 has a smaller planar size than the island 10 and is located on the inner periphery of the outline of the island 10. Here, the insulating layer 30 has a rectangular plate shape that is slightly smaller than the rectangular plate island 10.

  In consideration of heat dissipation, the insulating layer 30 is thinner than the island 10. For example, the thickness of the island 10 is about 250 μm to 500 μm, whereas the thickness of the insulating layer 30 is about 30 μm or less.

  In such a mold package P1, heat generated in the electronic component 20 is radiated from the island 10 to the outside of the package through the insulating layer 30. Here, a heat radiating member (not shown) or the like may be brought into contact with the second surface 32 of the insulating layer 30.

  Next, a method for manufacturing the mold package P1 will be described with reference to FIG. First, the island 10 having the suspension leads 13 and the electronic component 20 are prepared (preparation process).

  In this preparation process, as shown in FIG. 3A, as a material of the island 10, a flat surface in which the suspension leads 13 are connected only to a portion of the end portion 10 a of the island 10 near the outer periphery of the mold resin 40. A flat plate 1 is prepared. Here, a flat plate surface of the flat plate 1 is defined as a reference plane K1.

  Then, as shown in FIG. 3B, the suspension lead 13 in the flat plate 1 is bent by a press or the like, thereby forming the bent suspension lead 13. At the same time, as shown in FIG. 3B, by this bending process, the side opposite to the suspension lead 13 relative to the portion of the end portion 10a of the island 10 on the suspension lead 13 side with respect to the reference plane K1. This part is in a state of being lowered to the other surface 12 side of the island 10.

  In this way, the island 10 having the suspension leads 13 is prepared. This is the preparation process. Next, as shown in FIG. 3B, an insulating layer 30 is provided on the other surface 12 of the island 10 (insulating layer installation step). As described above, the insulating layer 30 is installed by printing, transferring, sheet pasting, or the like.

  Next, as shown in FIG. 3C, the electronic component 20 is mounted on the one surface 11 of the island 10 (component mounting step). In this component mounting process, the electronic component 20 is bonded to the island 10 via the die bond material 21 and, further, wire bonding is performed between the electronic component 20 and the suspension lead 13 as necessary, thereby bonding wires. 50 is formed.

  Next, as shown in FIG. 3D, the mold resin 40 is molded using a mold 100 for molding resin molding (molding process). A mold 100 used in this molding process is the same as that used in a typical transfer molding method, and an upper mold 101 and a lower mold 102 are matched to form a cavity between the upper and lower molds 101 and 102. It is.

  At this time, the island 10 and the electronic component 20 are installed in the mold 100 with the second surface 32 of the insulating layer 30 in contact with the inner surface of the mold 100. Here, in the present embodiment, the island 10 is configured such that the suspension lead 13 is connected to the end portion 10 a, and the other end portion 15 side of the suspension lead 13 extends toward the upper side of the one surface 11 of the island 10. It has a bent shape.

  Then, the other end 15 side of the suspension lead 13 is supported between the upper mold 101 and the lower mold 102 so that the workpiece is supported by the mold 100. Then, the second surface 32 of the insulating layer 30 is pressed against the inner surface of the mold 100 facing the second surface 32, that is, the inner surface of the lower mold 102 by the spring elasticity of the suspension lead 13. .

  In particular, in the present embodiment, as described above, the suspension lead 13 is connected only to a portion of the end portion 10 a of the island 10 that is near the outer periphery of the mold resin 40, and the suspension lead 13 of the end portion 10 a of the island 10 is connected. The part on the side opposite to the suspension lead 13 is in a state of being lowered to the other surface 12 side of the island 10 as compared with the part on the side.

  Therefore, when the work is placed on the mold 100, the insulating layer 30 on the other surface 12 side of the island 10 is placed on the inner surface of the mold 100 facing this first from the portion opposite to the suspension lead 13. Contact. While receiving the elastic force of the suspension lead 13, the portion of the insulating layer 30 on the suspension lead 13 side also comes into contact. Therefore, the entire insulating layer 30 reliably contacts the inner surface of the mold 100.

  In this way, the second surface 32 of the insulating layer 30 is pressed against the inner surface of the mold 100 by the spring elasticity of the suspension lead 13, and after the workpiece is placed on the mold 100, the workpiece 100 is placed in the mold 100 in this state. The mold resin 40 is formed by filling the mold resin 40. This is the molding process.

  Thereafter, as shown in FIG. 3 (d), the work sealed with the mold resin 40 is taken out from the mold 100. At this time, since the second surface 32 of the insulating layer 30 is in close contact with the inner surface of the mold 100, it is exposed from the mold resin 40. Thereafter, lead cutting or the like is performed outside the mold resin 40 as necessary. The above is the present manufacturing method, and according to this manufacturing method, the mold package P1 of the present embodiment is appropriately manufactured.

  As described above, the other end 15 side of the suspension lead 13 is supported by the mold 100 in the molding process, but from one end portion 14 to the other end portion 15 of the suspension lead 13 having a bent shape. The height is desirably equal to or greater than the step dimension T of the lower mold 102 (see FIG. 3D). Thus, by bending the suspension lead 13 in the preparation process, the insulating layer 30 is reliably pressed against the inner surface of the lower mold 102 by the spring elastic force of the suspension lead 13.

  By the way, according to the mold package P1 of the present embodiment, the insulating layer 30 is made of a thermoplastic resin having a functional group chemically bonded to the epoxy resin constituting the mold resin 40. As a result, adhesion between the insulating layer 30 and the mold resin 40 is ensured.

  Further, since the insulating layer 30 is a thermoplastic resin, it becomes softer than a conventional ceramic substrate or epoxy resin due to heat during the molding process, and easily adheres securely to the inner surface of the mold 100 without a gap. From these things, according to this embodiment, the insulating layer 30 which is excellent in adhesiveness with the mold resin 40 and suitable for suppressing resin burrs can be realized.

  In addition, according to the mold package P1 of the present embodiment, the insulating layer 30 is smaller in planar size than the island 10 and is located on the inner periphery of the outline of the island 10. According to this, since the whole insulating layer 30 made of a thermoplastic resin having low rigidity and easily deformed is supported in contact with the island 10, it is preferable in terms of suppressing deformation of the insulating layer 30.

  Here, the insulating layer 30 may have a peripheral portion that protrudes beyond the outline of the island 10. However, in this case, especially before the sealing with the mold resin 40, the peripheral portion of the insulating layer 30 is not supported, and therefore, it easily deforms. In this respect, according to the present embodiment, such a point can be avoided.

  As described above, in the present embodiment, the suspension lead 13 having the bent shape is connected to the end portion 10 a of the island 10. According to this, in the molding process, the other end 15 side of the suspension lead 13 is supported by the mold 100, and the spring elastic force of the suspension lead 13 acts in the direction of pressing the insulating layer 30 against the mold 100.

  As described above, in the present embodiment, by adopting the island 10 to which the suspension lead 13 having the bent shape is connected, the second surface 32 of the insulating layer 30 can be formed on the inner surface of the mold 100 without a gap in the molding process. It becomes easy to adhere and becomes preferable for prevention of resin burrs on the second surface 32.

  In particular, in the present embodiment, even when the island 10 is in a single suspended state as described above, by adopting a configuration in which the portion of the prepared island 10 opposite to the suspension lead 13 is lowered as described above. The adhesion between the insulating layer 30 and the inner surface of the mold 100 in the molding process can be easily ensured.

(Second Embodiment)
A mold package according to a second embodiment of the present invention will be described with reference to FIG. Here, the difference from the first embodiment will be mainly described.

  In the first embodiment, the suspension lead 13 is provided only in the portion of the end portion 10a of the island 10 near the outer periphery of the mold resin 40. In addition, the suspension lead 13 of the end portion 10a of the island 10 is molded resin. It may be provided also in the part which opposes the part of 40 near the outline. That is, the island 10 may be a double suspended configuration.

  Also in this case, when the island 10 with the insulating layer 30 attached is installed in the mold 100, the other end 15 side of each bent suspension lead 13 is supported by the mold 100, and the spring elastic force of the suspension lead 13 is increased. This acts in the direction of pressing the insulating layer 30 against the mold 100. Therefore, it becomes easy to ensure the adhesiveness of the insulating layer 30 and the metal mold | die 100, and it becomes difficult to produce | generate a resin burr | flash.

(Third embodiment)
A mold package according to a third embodiment of the present invention will be described with reference to FIG. In FIG. 5, bonding wires and the like are omitted. Here, the difference from the first embodiment will be mainly described.

  In the first embodiment, as shown in FIGS. 1 and 2, one suspension lead 13 is provided for one island 10 to realize a single suspension configuration. On the other hand, in such a one-side suspension configuration, as shown in FIG. 5, two or more suspension leads 13 may be provided at the end portion 10 a of the side located near the outline of the mold resin 40. .

  Further, as shown in FIG. 5, the size of the electronic component 20 mounted on the island 10 may be variously different. For example, in FIG. 5, two electronic components 20 on the right side are IC chips, and one large electronic component 20 on the left side is a circuit board such as a ceramic substrate or a printed board.

(Other embodiments)
In each of the above embodiments, the suspension lead 13 is bent so that the other end 15 side opposite to the one end 14 located on the end 10 a side of the island 10 extends above the one surface 11 of the island 10. It was a shape.

  On the other hand, the suspension lead 13 may be in the form of a flat strip plate located in the same plane as the island 10. Also in this case, it is apparent that the adhesion with the mold resin 40 and prevention of resin burrs can be realized by the effect of the insulating layer 30 made of the thermoplastic resin.

  Further, the thermoplastic resin constituting the insulating layer 30 may be any one having a functional group chemically bonded to the epoxy resin constituting the mold resin, and other than the above polyimide, polyamide, or polyamideimide. May be.

  Two or more electronic components 20 may be mounted on one island 10.

  In addition to the combination of the above-described embodiments, the above-described embodiments may be appropriately combined within the possible range, and the above-described embodiments are not limited to the illustrated examples.

DESCRIPTION OF SYMBOLS 10 Island 10a End part of island 11 One side of island 12 Other side of island 20 Electronic component 30 Insulating layer 32 Second side opposite to other side of island in insulating layer 33 End of insulating layer 40 Mold resin

Claims (8)

A plate-like island (10) in which the one surface (11) and the other surface (12) are in a relation of front and back plate surfaces;
An electronic component (20) mounted on one side of the island;
An electrically insulating insulating layer (30) provided on the other surface so as to cover the other surface of the island;
A mold resin (40) made of a thermosetting resin including an epoxy resin for sealing one surface of the island and the electronic component;
The mold resin seals the end (10a) of the island and the end (33) of the insulating layer on the other surface side of the island,
A surface (32) opposite to the other surface of the island in the insulating layer is exposed from the mold resin,
The mold package, wherein the insulating layer is made of a thermoplastic resin having a functional group chemically bonded to an epoxy resin constituting the mold resin.   The mold package according to claim 1, wherein the thermoplastic resin is polyimide, polyamide, or polyamideimide.   3. The mold package according to claim 1, wherein the insulating layer has a smaller planar size than the island and is located on the inner periphery of the outer shell of the island. A suspension lead (13) is connected to the end of the island,
The suspension lead extends so that the other end (15) side opposite to the one end (14) located on the end side of the island extends above one surface of the island and is exposed to the outside of the mold resin. 4. The mold package according to claim 1, wherein the mold package has a bent shape.   5. The mold package according to claim 4, wherein the suspension lead is provided only in a portion of the end portion of the island that is close to the outer periphery of the mold resin. A mold package manufacturing method for manufacturing the mold package according to claim 1,
A preparation step of preparing the island and the electronic component;
An insulating layer installation step of providing the insulating layer on the other surface of the island;
A component mounting step of mounting the electronic component on one surface of the island;
Next, using the mold for molding resin molding (100), the island and the electrons are placed in a state where the surface of the insulating layer opposite to the other surface of the island is in contact with the inner surface of the mold. A mold step of molding the mold resin by filling the mold resin into the mold after the components are installed in the mold; and
A method for manufacturing a mold package, comprising: In the preparation step, a suspension lead is connected to the end of the island as the island, and the suspension lead is the other end opposite to the one end located on the end of the island. Prepare a shape that is bent so that the side extends upward on one side of the island,
In the molding step, the other end side of the suspension lead is supported by the mold, and the surface opposite to the other surface of the island in the insulating layer is supported by the spring elasticity of the suspension lead. The mold package manufacturing method according to claim 6, wherein the mold resin is filled with the mold resin in such a state that the mold resin is pressed against the inner surface of the mold opposed to the mold.   In the preparation step, as the island, the suspension lead is connected only to a portion of the end portion of the island near the outer periphery of the mold resin, and to the portion of the end portion of the island on the suspension lead side. 8. The method of manufacturing a mold package according to claim 7, wherein a part in a state where the part opposite to the suspension lead is lowered toward the other side of the island is prepared.

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