JP2013248664A - Lead-free solder alloy and solder paste - Google Patents
Lead-free solder alloy and solder paste Download PDFInfo
- Publication number
- JP2013248664A JP2013248664A JP2012127341A JP2012127341A JP2013248664A JP 2013248664 A JP2013248664 A JP 2013248664A JP 2012127341 A JP2012127341 A JP 2012127341A JP 2012127341 A JP2012127341 A JP 2012127341A JP 2013248664 A JP2013248664 A JP 2013248664A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- alloy
- solder
- free solder
- solder alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 47
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 39
- 239000000956 alloy Substances 0.000 title claims abstract description 39
- 238000000227 grinding Methods 0.000 claims description 4
- 229910052797 bismuth Inorganic materials 0.000 abstract description 14
- 229910052718 tin Inorganic materials 0.000 abstract description 12
- 230000003647 oxidation Effects 0.000 abstract description 6
- 238000007254 oxidation reaction Methods 0.000 abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- 238000002844 melting Methods 0.000 description 11
- 230000008018 melting Effects 0.000 description 11
- 230000004907 flux Effects 0.000 description 10
- 229910020830 Sn-Bi Inorganic materials 0.000 description 5
- 229910018728 Sn—Bi Inorganic materials 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020888 Sn-Cu Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910019204 Sn—Cu Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
本発明は、鉛フリーはんだ合金およびはんだペーストに関する。 The present invention relates to a lead-free solder alloy and a solder paste.
従来、回路実装基板へのはんだ接合にはＳｎとＰｂを主成分とする合金が使用されてきた。しかし、人体あるいは環境への配慮からＰｂを含まない成分から成る合金、いわゆる、鉛フリーはんだ合金への置き換えがなされてきた。一般的に鉛フリーはんだとして使用されてきた合金は、Ｓｎ−Ａｇを主成分とする合金やＳｎ−Ｃｕ、あるいは、Ｓｎ−Ａｇ−Ｃｕを主成分とするはんだ合金が用いられてきた。しかし、これらの合金の融点は高く、部品および基板の耐熱性の問題で、これらの合金が使用できない場合がある。 Conventionally, an alloy mainly composed of Sn and Pb has been used for solder bonding to a circuit mounting board. However, in consideration of the human body or the environment, replacement with an alloy made of a component not containing Pb, that is, a so-called lead-free solder alloy has been made. An alloy that has been generally used as a lead-free solder has been an alloy containing Sn-Ag as a main component, Sn-Cu, or a solder alloy mainly containing Sn-Ag-Cu. However, these alloys have a high melting point, and these alloys may not be used due to heat resistance problems of parts and substrates.
一方、鉛フリーはんだの候補として考えられてきた合金で、ＳｎとＢｉを主成分とする合金が知られていた。このＳｎ−Ｂｉ合金は、Ｂｉの成分比率によりＳｎ−Ｐｂ合金やＳｎ−Ｃｕ合金、Ｓｎ−Ａｇ−Ｃｕ合金と比較して融点がそれ以下であり、耐熱性が低い部品や基板に使用できる利点がある（例えば、特許文献１参照）。 On the other hand, an alloy that has been considered as a candidate for lead-free solder, and an alloy mainly containing Sn and Bi has been known. This Sn-Bi alloy has the melting point lower than that of Sn-Pb alloy, Sn-Cu alloy and Sn-Ag-Cu alloy due to the component ratio of Bi, and can be used for parts and substrates with low heat resistance. (For example, refer to Patent Document 1).
しかし、Ｓｎ−Ｂｉ系はんだは上記のはんだ合金と比較して酸化しやすく、またその酸化物の除去が困難なためはんだ付け性が悪い場合がある。例えば、図２および図３に示すように、不ぬれ部Ｘが生じる虞れがあった。また、はんだ付け後のはんだ表面やフラックス残渣に黒色の残渣が付着・混入し、外観検査時の不良が発生しやすい。図４ははんだＨ表面に黒色の残渣Ｚが付着した状態を示す。図５はフラックス残渣Ｆに粒状（コロイド状）の黒色の残渣Ｚが混入した状態を示す。この黒色の残渣Ｚは、ＳｎおよびＢｉの酸化物と考えられる。 However, Sn—Bi solder is likely to be oxidized as compared with the above-described solder alloy, and the solderability may be poor because it is difficult to remove the oxide. For example, as shown in FIG. 2 and FIG. Also, black residue adheres to and mixes with the solder surface and flux residue after soldering, and defects during visual inspection are likely to occur. FIG. 4 shows a state in which the black residue Z adheres to the surface of the solder H. FIG. 5 shows a state in which a granular (colloidal) black residue Z is mixed in the flux residue F. FIG. This black residue Z is considered to be an oxide of Sn and Bi.
解決しようとする課題は、Ｓｎ−Ｂｉ系はんだは酸化しやすく、またその酸化物の除去が困難なためはんだ付け性が悪くなる虞れがある点である。また、はんだ付け後のはんだＨ表面やフラックス残渣Ｆに黒色の残渣Ｚが付着・混入し、外観検査時の不良が発生しやすい点である。 The problem to be solved is that Sn-Bi solder is likely to be oxidized, and it is difficult to remove the oxide, so that solderability may be deteriorated. Moreover, the black residue Z adheres to and mixes with the solder H surface and the flux residue F after soldering, and the defect at the time of an external appearance test | inspection tends to generate | occur | produce.
そこで、本発明に係る鉛フリーはんだ合金は、Ｂｉを20〜60質量％、Ａｌを0.001 〜0.01質量％、を含み、残部の主成分をＳｎとしたものである。
また、Ｂｉを35〜58質量％含むものである。
また、本発明に係るはんだペーストは、上記の鉛フリーはんだ合金を粉末状にした粉末状鉛フリーはんだ合金を含有するものである。
Therefore, the lead-free solder alloy according to the present invention contains 20 to 60% by mass of Bi, 0.001 to 0.01% by mass of Al, and the remaining main component is Sn.
Moreover, it contains 35 to 58% by mass of Bi.
Moreover, the solder paste according to the present invention contains a powdered lead-free solder alloy obtained by powdering the above lead-free solder alloy.
本発明の鉛フリーはんだ合金によれば、融点が低いＳｎ−Ｂｉ系はんだ合金に於て、ＳｎおよびＢｉの酸化を防止することができ、ぬれ性が改善でき、これに伴って、はんだ表面およびフラックス残渣の黒化を抑制する効果があり、はんだ付け性も向上できる。
また、本発明のはんだペーストによれば、融点が低く、かつ、ＳｎおよびＢｉの酸化を防止することができ、ぬれ性が改善でき、これに伴って、はんだ表面およびフラックス残渣の黒化を抑制する効果があり、はんだ付け性も向上できる。
According to the lead-free solder alloy of the present invention, Sn and Bi can be prevented from being oxidized in a Sn-Bi based solder alloy having a low melting point, and wettability can be improved. There is an effect of suppressing blackening of the flux residue, and solderability can be improved.
In addition, according to the solder paste of the present invention, the melting point is low, the oxidation of Sn and Bi can be prevented, the wettability can be improved, and the blackening of the solder surface and flux residue is suppressed accordingly. And can improve solderability.
本発明の鉛フリーはんだ合金は、Ｂｉを20〜60質量％（20質量％以上60質量％以下。本発明に於て、同様の表記方法を用いる。）、Ａｌを0.001 〜0.01質量％、を含み、残部の主成分がＳｎとされる（残部には、不可避不純物も含まれる）。好ましくは、Ｂｉを35〜58質量％含む。Ａｌ含有量が上記範囲にある場合、ＳｎおよびＢｉの酸化を適切に防止することができる。Ａｌ含有量が0.001 質量％未満の場合、ＳｎおよびＢｉの酸化が急に進むという欠点がある。Ａｌ含有量が0.01質量％を超えると、はんだ付け性が悪くなる。 In the lead-free solder alloy of the present invention, Bi is 20 to 60% by mass (20% to 60% by mass. The same notation is used in the present invention), Al is 0.001 to 0.01% by mass. The remaining main component is Sn (the remaining portion includes unavoidable impurities). Preferably, 35 to 58% by mass of Bi is contained. When Al content exists in the said range, the oxidation of Sn and Bi can be prevented appropriately. When the Al content is less than 0.001% by mass, there is a drawback that the oxidation of Sn and Bi proceeds rapidly. When Al content exceeds 0.01 mass%, solderability will worsen.
図１は、Ｂｉ、Ａｌを含み、Ａｌ含有量が0.005 質量％、ＢｉおよびＡｌの残部をＳｎおよび不可避不純物とした鉛フリーはんだ合金のＢｉ含有量の変化に対する融点の変化を表したグラフ図である。Ｂｉ含有量が20％未満又は60％を超える場合、融点が、Ｓｎ−Ｐｂ合金（Ｓｎが63％、Ｐｂが37％から成る合金）の融点である187℃を超えてしまう。 FIG. 1 is a graph showing a change in melting point with respect to a change in Bi content of a lead-free solder alloy containing Bi and Al, with an Al content of 0.005 mass%, and the balance of Bi and Al with Sn and inevitable impurities. is there. When the Bi content is less than 20% or exceeds 60%, the melting point exceeds 187 ° C. which is the melting point of the Sn—Pb alloy (alloy consisting of 63% Sn and 37% Pb).
本発明のはんだペーストは、上述の鉛フリーはんだ合金を粉末状にした粉末状鉛フリーはんだ合金を用いたはんだペーストである。例えば、上述の鉛フリーはんだ合金を粉末状にしたものと、ペースト状のフラックスとを混ぜ合わせたはんだペーストである。粉末状鉛フリーはんだ合金の平均粒径を20〜50μｍとするのが好ましい。平均粒径が20μｍ未満の場合、製造コストが高くなる。平均粒径が50μｍを超える場合、適切にはんだ付けができない虞れがある。 The solder paste of the present invention is a solder paste using a powdered lead-free solder alloy obtained by powdering the above lead-free solder alloy. For example, a solder paste obtained by mixing a powder of the above lead-free solder alloy with a paste-like flux. The average particle size of the powdered lead-free solder alloy is preferably 20 to 50 μm. When the average particle size is less than 20 μm, the production cost increases. If the average particle size exceeds 50 μm, soldering may not be performed properly.
ＪＩＳ Ｚ ３２８４ 付属書10のぬれ効力およびディウェッティング試験法により、はんだの広がり度合とはんだ表面およびフラックス残渣の着色の有無を試験した。結果を表１に示す。表１に示すように、Ａｌを添加したものは、比較例１と比較していずれもぬれ性は向上し、はんだＨ表面およびフラックス残渣Ｆの着色は見られなかった。適量のＡｌが添加されているので、ＳｎおよびＢｉの酸化が防止されたことによると考えられる。
なお、本発明は、設計変更可能であって、例えば、Ｐ、Ｇｅ、Ｇａ、Ｃｏ、Ｃｕ、Ａｇ等の一種類又は複数種類をさらに添加するも良い。 In the present invention, the design can be changed, and for example, one or more kinds such as P, Ge, Ga, Co, Cu, and Ag may be further added.
以上のように、本発明は、Ｂｉを20〜60質量％、Ａｌを0.001 〜0.01質量％、を含み、残部の主成分をＳｎとしたので、融点が低いＳｎ−Ｂｉ系はんだ合金に於て、ＳｎおよびＢｉの酸化を防止することができ、ぬれ性が改善でき、これに伴って、はんだＨ表面およびフラックス残渣Ｆの黒化を抑制する効果があり、はんだ付け性も向上できる。従って、耐熱性が低い部品や基板に用いるのに好適である。
また、Ｂｉを35〜58質量％含むので、融点を一層低くすることができ、耐熱性が特に低い部品や基板にも用いることができる。
As described above, the present invention contains 20 to 60% by mass of Bi, 0.001 to 0.01% by mass of Al, and the remaining main component is Sn. Therefore, in the Sn—Bi solder alloy having a low melting point, , Sn and Bi can be prevented from being oxidized, and wettability can be improved. In accordance with this, there is an effect of suppressing blackening of the surface of the solder H and the flux residue F, and solderability can also be improved. Therefore, it is suitable for use in parts and substrates with low heat resistance.
In addition, since Bi is contained in an amount of 35 to 58% by mass, the melting point can be further lowered, and it can be used for components and substrates having particularly low heat resistance.
また、上記の鉛フリーはんだ合金を粉末状にした粉末状鉛フリーはんだ合金を含有するので、融点が低く、かつ、ＳｎおよびＢｉの酸化を防止することができ、ぬれ性が改善でき、これに伴って、はんだＨ表面およびフラックス残渣Ｆの黒化を抑制する効果があり、はんだ付け性も向上できる。従って、耐熱性が低い部品や基板に用いるのに好適である。 In addition, since it contains a powdered lead-free solder alloy obtained by powdering the above lead-free solder alloy, the melting point is low, and oxidation of Sn and Bi can be prevented, and wettability can be improved. Along with this, there is an effect of suppressing blackening of the surface of the solder H and the flux residue F, and the solderability can be improved. Therefore, it is suitable for use in parts and substrates with low heat resistance.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012127341A JP2013248664A (en) | 2012-06-04 | 2012-06-04 | Lead-free solder alloy and solder paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012127341A JP2013248664A (en) | 2012-06-04 | 2012-06-04 | Lead-free solder alloy and solder paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2013248664A true JP2013248664A (en) | 2013-12-12 |
Family
ID=49847866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012127341A Pending JP2013248664A (en) | 2012-06-04 | 2012-06-04 | Lead-free solder alloy and solder paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013248664A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022070910A1 (en) * | 2020-10-01 | 2022-04-07 | アートビーム有限会社 | Low-temperature solder, method for producing low-temperature solder, and low-temperature solder coated lead wire |
-
2012
- 2012-06-04 JP JP2012127341A patent/JP2013248664A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022070910A1 (en) * | 2020-10-01 | 2022-04-07 | アートビーム有限会社 | Low-temperature solder, method for producing low-temperature solder, and low-temperature solder coated lead wire |
| JPWO2022070910A1 (en) * | 2020-10-01 | 2022-04-07 | ||
| JP7576805B2 (en) | 2020-10-01 | 2024-11-01 | アートビーム株式会社 | Low-temperature solder, manufacturing method thereof, and low-temperature solder-coated lead wire |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101436714B1 (en) | No-clean lead-free solder paste | |
| JP5533876B2 (en) | Solder paste, bonding method using the same, and bonding structure | |
| JP5018978B1 (en) | Conductive material, connection method using the same, and connection structure | |
| TWI383052B (en) | Low silver solder alloy and solder paste composition | |
| CN113977132B (en) | Lead-free solder alloy compositions and methods for preparing lead-free solder alloys | |
| JP5664664B2 (en) | Bonding method, electronic device manufacturing method, and electronic component | |
| CN101642855B (en) | Rear-earth-containing halogen free Sn-Ag-C series tinol | |
| JP2013252548A (en) | Solder paste for joining micro component | |
| CN104487203A (en) | Solder alloy, solder paste, and electronic circuit board | |
| WO2013038817A1 (en) | Electroconductive material, and connection method and connection structure using same | |
| WO2013038816A1 (en) | Electroconductive material, and connection method and connection structure using same | |
| JP2011156558A (en) | Lead-free solder alloy | |
| JP2017064758A (en) | Flux composition, solder composition and electronic substrate | |
| TW201804001A (en) | Solder alloys, solder balls, wafer solder, solder paste and solder joints | |
| JP2018058090A (en) | Solder paste and solder alloy powder | |
| JP2012183558A (en) | Lead-free solder alloy and solder joint using the same | |
| JPWO2014061085A1 (en) | Low temperature solder paste soldering method | |
| EP3238872A1 (en) | Flux for fast-heating method, and solder paste for fast-heating method | |
| WO2015022719A1 (en) | Flux, solder paste and soldered joint | |
| TWI695893B (en) | Solder paste | |
| JP6548537B2 (en) | Solder alloy and solder composition | |
| JP7287606B2 (en) | Lead-free solder alloy | |
| JP6730833B2 (en) | Solder alloy and solder composition | |
| JP2013248664A (en) | Lead-free solder alloy and solder paste | |
| JP5773444B2 (en) | Solder alloy for aluminum joining |