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JP2013128027A5 - - Google Patents

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Publication number
JP2013128027A5
JP2013128027A5 JP2011276654A JP2011276654A JP2013128027A5 JP 2013128027 A5 JP2013128027 A5 JP 2013128027A5 JP 2011276654 A JP2011276654 A JP 2011276654A JP 2011276654 A JP2011276654 A JP 2011276654A JP 2013128027 A5 JP2013128027 A5 JP 2013128027A5
Authority
JP
Japan
Prior art keywords
heat radiating
heat
unit housing
unit
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011276654A
Other languages
Japanese (ja)
Other versions
JP5717619B2 (en
JP2013128027A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2011276654A priority Critical patent/JP5717619B2/en
Priority claimed from JP2011276654A external-priority patent/JP5717619B2/en
Publication of JP2013128027A publication Critical patent/JP2013128027A/en
Publication of JP2013128027A5 publication Critical patent/JP2013128027A5/ja
Application granted granted Critical
Publication of JP5717619B2 publication Critical patent/JP5717619B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Description

１、１３ ユニット筐体（ユニット板金）
１ａ 背面開口部
１ｂ 前面開口部
１ｃ 底面開口部
２ 前面パネル
３ 回路基板
４、１０ 発熱ＩＣ
５、１２、１４、１６ Ｌ字放熱板（放熱板）
５ａ、１２ａ、１４ａ、１５ａ、１６ａ 第一の放熱面部
５ｂ、１２ｂ、１４ｂ、１５ｂ、１６ｂ 第二の放熱面部
６ ヒートシンク
７ 固定金具
８、９、１１ 放熱ラバー（放熱部材）
１５ Ｕ字放熱板（放熱板）
１５ｃ 前面パネル部
１７ ガイドレール
１８、１９ ユニット板金。 1, 13 Unit housing (unit sheet metal)
DESCRIPTION OF SYMBOLS 1a Back opening 1b Front opening 1c Bottom opening 2 Front panel 3 Circuit board 4, 10 Heat generation IC
5, 12, 14, 16 L-shaped heat sink (heat sink)
5a, 12a, 14a, 15a, 16a First heat dissipating surface 5b, 12b, 14b, 15b, 16b Second heat dissipating surface 6 Heat sink 7 Fixing bracket 8, 9, 11 Heat dissipating rubber (heat dissipating member)
15 U-shaped heat sink (heat sink)
15c Front panel part 17 Guide rail 18, 19 Unit sheet metal.

Claims (7)

前面部が開口されたユニット筐体、上記ユニット筐体の前面部から内部側に挿入される回路基板、上記回路基板に実装された発熱ＩＣ、上記発熱ＩＣに放熱部材を介して接触する第一の放熱面部と、上記第一の放熱面部に延在し、上記ユニット筐体の背面部に設けられた背面開口部に露出される第二の放熱面部とを含む放熱板を備えたことを特徴とする電子機器ユニット。   A unit housing having an open front surface, a circuit board inserted from the front surface of the unit housing to the inside, a heat generating IC mounted on the circuit substrate, and a first contacting the heat generating IC via a heat dissipation member A heat radiating plate including a heat radiating surface portion and a second heat radiating surface portion that extends to the first heat radiating surface portion and is exposed to a back opening provided in a back surface portion of the unit housing. Electronic equipment unit. 上記放熱板は、上記回路基板に平行配置される上記第一の放熱面部と、上記第一の放熱面部に直交し、上記ユニット筐体の背面開口部の一部を塞ぐ上記第二の放熱面部よりなるＬ字形状の部分を含むことを特徴とする請求項１記載の電子機器ユニット。 The heat dissipation plate and the first radiating surface which is arranged parallel to the circuit board, the orthogonal to the first radiating surface, said unit said second radiating surface for closing a portion of the rear opening of the housing The electronic device unit according to claim 1, further comprising an L-shaped portion. 上記放熱板の上記第二の放熱面部には、上記ユニット筐体の背面開口部から外側へ突出するようにヒートシンクが取り付けられたことを特徴とする請求項１または請求項２に記載の電子機器ユニット。   3. The electronic device according to claim 1, wherein a heat sink is attached to the second heat radiating surface portion of the heat radiating plate so as to protrude outward from a rear opening portion of the unit housing. unit. 上記放熱板は、上記回路基板の上面側、裏面側の各々に配置されたことを特徴とする請求項１〜３のいずれか一項記載の電子機器ユニット。   The electronic device unit according to claim 1, wherein the heat radiating plate is disposed on each of an upper surface side and a back surface side of the circuit board. 上記ユニット筐体は、底面部が開放された形状であり、上記放熱板の上記第一の放熱面部が、上記ユニット筐体の底面部を遮蔽することを特徴とする請求項１〜４のいずれか一項記載の電子機器ユニット。   The said unit housing | casing is a shape by which the bottom face part was open | released, The said 1st heat radiating surface part of the said heat sink is shielding the bottom face part of the said unit housing | casing. The electronic device unit according to claim 1. 上記放熱板は、上記第一の放熱面部に延在し、上記ユニット筐体の前面部を塞ぐ前面パネル部を含むことを特徴とする請求項１〜５のいずれか一項記載の電子機器ユニット。   The electronic device unit according to claim 1, wherein the heat radiating plate includes a front panel portion that extends to the first heat radiating surface portion and closes a front surface portion of the unit housing. . 上記ユニット筐体の内側面下端側に設けられたガイドレールに、上記第一の放熱面部の端部を嵌合させ、上記放熱板を介して上記回路基板を上記ユニット筐体に保持させることを特徴とする請求項５記載の電子機器ユニット。   The end of the first heat radiating surface is fitted to a guide rail provided on the lower end of the inner side surface of the unit housing, and the circuit board is held on the unit housing via the heat radiating plate. 6. The electronic device unit according to claim 5, wherein
JP2011276654A 2011-12-19 2011-12-19 Electronic equipment unit Expired - Fee Related JP5717619B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011276654A JP5717619B2 (en) 2011-12-19 2011-12-19 Electronic equipment unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011276654A JP5717619B2 (en) 2011-12-19 2011-12-19 Electronic equipment unit

Publications (3)

Publication Number Publication Date
JP2013128027A JP2013128027A (en) 2013-06-27
JP2013128027A5 true JP2013128027A5 (en) 2014-03-27
JP5717619B2 JP5717619B2 (en) 2015-05-13

Family

ID=48778406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011276654A Expired - Fee Related JP5717619B2 (en) 2011-12-19 2011-12-19 Electronic equipment unit

Country Status (1)

Country Link
JP (1) JP5717619B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6588253B2 (en) * 2015-06-30 2019-10-09 Ｎｅｃプラットフォームズ株式会社 Housing structure and electronic device using the same
JP6631581B2 (en) * 2017-04-17 2020-01-15 株式会社デンソー Electronic equipment
JP7363610B2 (en) * 2020-03-12 2023-10-18 オムロン株式会社 Power supply unit
CN115855345B (en) * 2022-11-25 2025-06-06 浙江双友物流器械股份有限公司 A pull-out shell structure of a strap pre-tightening force monitor

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121191U (en) * 1981-01-21 1982-07-28
JPH0534153Y2 (en) * 1989-10-12 1993-08-30
JPH0923082A (en) * 1995-07-07 1997-01-21 Oki Electric Ind Co Ltd Cooling structure of electronic circuit unit
FR2752661B1 (en) * 1996-08-23 1998-10-30 Giat Ind Sa METHOD FOR MANUFACTURING A DEVICE FOR DISSIPATING THERMAL ENERGY PRODUCED BY ELECTRONIC COMPONENTS IMPLANTED ON A PRINTED CIRCUIT BOARD, AND DEVICE THUS OBTAINED
JP2002324993A (en) * 2001-04-24 2002-11-08 Toshiba Corp Electronic equipment
JP2005142349A (en) * 2003-11-06 2005-06-02 Hitachi Cable Ltd Heat dissipation structure for electronic components
JP2009016605A (en) * 2007-07-05 2009-01-22 Nec Saitama Ltd Radiation structure, manufacturing method thereof, and indoor base station apparatus using the heat dissipation structure

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