JP2013113798A - X-ray apparatus, x-ray irradiation method, and method for manufacturing structure - Google Patents

Abstract

An X-ray apparatus capable of suppressing a decrease in detection accuracy is provided.
An X-ray apparatus detects X-rays transmitted through an object by irradiating the object with X-rays. The X-ray apparatus includes a chamber member that forms a first space, an X-ray source that is disposed in the first space and irradiates an object with X-rays, a stage that is disposed in the first space and holds the object, and an X-ray A detector that detects at least part of transmitted X-rays emitted from the source and passed through the object, and a support member that is disposed in the first space and supports the X-ray source and the stage.
[Selection] Figure 1

Description

  The present invention relates to an X-ray apparatus, an X-ray irradiation method, and a structure manufacturing method.

  As a device that acquires information inside an object non-destructively, for example, it has an X-ray source that irradiates an object with X-rays as disclosed in the following patent document, and detects transmitted X-rays transmitted through the object. An X-ray apparatus including a detector that performs the above-described process is known.

US Patent Application Publication No. 2009/0268869

  In the X-ray apparatus, there is a possibility that the detection accuracy of transmitted X-rays may decrease due to, for example, a change in the relative position between the X-ray source and the object.

  An object of an aspect of the present invention is to provide an X-ray apparatus, an X-ray irradiation method, and a structure manufacturing method that can suppress a decrease in detection accuracy.

  According to a first aspect of the present invention, there is provided an X-ray apparatus that detects X-rays transmitted through an object by irradiating the object with X-rays, the chamber member forming the first space, and the first space An X-ray source arranged to irradiate the object with X-rays, a stage arranged in the first space and holding the object, and at least part of transmitted X-rays emitted from the X-ray source and passing through the object are detected. An X-ray apparatus is provided that includes a detector and a support member that is disposed in a first space and supports an X-ray source and a stage.

  According to the second aspect of the present invention, an X-ray source disposed in a chamber member that forms the first space, and a stage that holds a measurement object irradiated with X-rays from the X-ray source are provided as a support member. Are provided, an X-ray irradiation method including irradiating a measurement object with X-rays from an X-ray source and detecting transmitted X-rays that have passed through the measurement object with a detector.

  According to the third aspect of the present invention, the design process for creating the design information related to the shape of the structure, the molding process for creating the structure based on the design information, and the shape of the produced structure are the second. There is provided a method for manufacturing a structure including a step of measuring using the X-ray irradiation method of the aspect, and an inspection step of comparing shape information obtained in the measurement step with design information.

  According to the aspect of the present invention, it is possible to suppress a decrease in detection accuracy.

1 is a schematic configuration diagram illustrating an example of an X-ray apparatus according to a first embodiment. It is a top view which shows a part of X-ray apparatus which concerns on 1st Embodiment. It is a figure which shows an example of the X-ray source which concerns on 1st Embodiment. It is a schematic block diagram which shows an example of the X-ray apparatus which concerns on 2nd Embodiment. It is a figure which shows a part of X-ray apparatus which concerns on 3rd Embodiment. It is a figure which shows an example of the structure manufacturing system provided with the detection apparatus. It is the flowchart which showed the flow of the process by a structure manufacturing system.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as the Z-axis direction, a direction orthogonal to the Z-axis direction in the horizontal plane is defined as the X-axis direction, and a direction orthogonal to each of the Z-axis direction and the X-axis direction (that is, the vertical direction) is defined as the Y-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic configuration diagram illustrating an example of an X-ray apparatus 1 according to the first embodiment. FIG. 2 is a plan view showing a part of the X-ray apparatus 1 according to the first embodiment.

  The X-ray apparatus 1 irradiates the measurement object S with X-rays and detects transmitted X-rays transmitted through the measurement object S. X-rays are electromagnetic waves having a wavelength of about 1 pm to 30 nm, for example. The X-ray includes at least one of an ultra-soft X-ray of about 50 eV, a soft X-ray of about 0.1 to 2 keV, an X-ray of about 2 to 20 keV, and a hard X-ray of about 20 to 100 eKV.

  In the present embodiment, the X-ray apparatus 1 irradiates the measurement object S with X-rays, detects transmitted X-rays transmitted through the measurement object S, and detects information inside the measurement object S (for example, an internal structure). X-ray CT inspection apparatus which acquires non-destructively. In the present embodiment, the measurement object S includes, for example, mechanical parts, electronic parts, and other industrial parts. The X-ray CT inspection apparatus includes an industrial X-ray CT inspection apparatus that irradiates industrial parts with X-rays and inspects the industrial parts.

  1 and 2, an X-ray apparatus 1 includes an X-ray source 2 that emits X-rays, a stage 3 that can move while holding a measurement object S, and an X-ray source 2 that is emitted from the X-ray source 2 and held on the stage 3. The detector 4 that detects at least a part of the transmitted X-rays that have passed through the measured object S, the support member 80 that supports the X-ray source 2 and the stage 3, and the control device that controls the operation of the entire X-ray apparatus 1. And 5.

  In this embodiment, the X-ray apparatus 1 includes a chamber member 6 that forms an internal space SP in which X-rays emitted from the X-ray source 2 travel. In the present embodiment, the X-ray source 2, the stage 3, the detector 4, and the support member 80 are disposed in the internal space SP.

  In the present embodiment, the chamber member 6 is disposed on the support surface FR. The support surface FR includes a floor surface of a factory or the like. The chamber member 6 is supported by a plurality of legs 6S. The chamber member 6 is arrange | positioned on the support surface FR via the leg part 6S. In the present embodiment, the lower surface of the chamber member 6 and the support surface FR are separated by the leg portion 6S. That is, a space is formed between the lower surface of the chamber member 6 and the support surface FR. Note that at least a part of the lower surface of the chamber member 6 may be in contact with the support surface FR.

  In this embodiment, the chamber member 6 contains lead. The chamber member 6 suppresses the X-rays in the internal space SP from leaking into the external space RP of the chamber member 6.

  In the present embodiment, the X-ray apparatus 1 has a member 6 </ b> D attached to the chamber member 6 and having a lower thermal conductivity than the chamber member 6. In the present embodiment, the member 6D is disposed on the outer surface of the chamber member 6. The member 6D suppresses the temperature of the internal space SP from being affected by the temperature (temperature change) of the external space RP. That is, the member 6D functions as a heat insulating member that suppresses the heat of the external space RP from being transmitted to the internal space SP. The member 6D includes, for example, plastic. In the present embodiment, the member 6D includes, for example, polystyrene foam.

  The X-ray source 2 irradiates the measurement object S with X-rays. The X-ray source 2 has an emission unit 8 that emits X-rays. The X-ray source 2 forms a point X-ray source. In the present embodiment, the emission unit 8 includes a point X-ray source. The X-ray source 2 irradiates the measurement object S with conical X-rays (so-called cone beam). The X-ray source 2 may be capable of adjusting the intensity of the emitted X-ray. When adjusting the intensity of the X-rays emitted from the X-ray source 2, it may be based on the X-ray absorption characteristics or the like of the measurement object S. The shape of the X-rays emitted from the X-ray source 2 is not limited to a conical shape, and may be, for example, a fan-shaped X-ray (so-called fan beam).

  In the present embodiment, at least part of the X-rays from the X-ray source 2 travels in the Z-axis direction in the internal space SP. In the present embodiment, the injection unit 8 faces the + Z direction. In the present embodiment, at least a part of the X-rays emitted from the emission unit 8 travels in the + Z direction in the internal space SP.

  In the present embodiment, the X-ray source 2 and the stage 3 are arranged in the Z-axis direction. In the present embodiment, the stage 3 is disposed on the + Z side of the X-ray source 2.

  In the present embodiment, the stage 3 moves on the support member 80. In the present embodiment, the X-ray apparatus 1 includes a guide member 81 that is disposed on the support member 80 and guides the stage 3. The guide member 81 is long in the Z-axis direction. The guide member 81 guides the stage 3 with respect to the Z-axis direction.

  In addition, the X-ray apparatus 1 includes a drive system 82 that moves the stage 3. The drive system 82 moves the stage 3 at least in the Z-axis direction. The drive system 82 includes, for example, a linear motor. The drive system 82 includes, for example, a linear motor stator disposed on the guide member 81 and a linear motor mover disposed on at least a part of the stage 3.

  In the present embodiment, the drive system 82 moves the stage 3 (the holding unit that holds the measurement object S among the stages 3) in six directions including the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ directions. It is movable.

  The drive system 82 may include a piezo element. For example, the drive system 82 may move the stage 3 in the Z-axis direction using a piezo element. In addition, the drive system 82 uses a piezo element to hold the stage 3 in the at least one direction of the X axis, the Y axis, the Z axis, θX, θY, and θZ (the holding unit that holds the measurement object S of the stages 3). ) May be moved.

  In the present embodiment, the X-ray apparatus 1 includes a measuring device 99 that measures the position of the stage 3. The measuring device 99 includes, for example, an encoder system. The encoder system includes, for example, at least one of a linear encoder and a rotary encoder. In the present embodiment, the measuring device 99 can measure the position of the stage 3 in six directions including the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions. For example, an encoder that measures the position of the stage 3 in the Z-axis direction includes a scale member that has a scale disposed on the guide member 81 and an encoder head that detects the scale of the scale member. Note that at least a part of the scale member may be disposed on the support member 80.

  The support member 80 is disposed on the bottom surface 6T of the internal space SP. The position of the support member 80 is fixed in the internal space SP. The support member 80 supports both the X-ray source 2 and the stage 3. The support member 80 supports the X-ray source 2 and the stage 3 together.

  The support member 80 has a smaller coefficient of thermal expansion than the chamber member 6. The support member 80 is less likely to be thermally deformed than at least the chamber member 6.

  In the present embodiment, the support member 80 is formed of a low thermal expansion material. In the present embodiment, the support member 80 includes, for example, invar. Invar is an alloy of about 36% nickel and about 64% iron.

  In the present embodiment, the support member 80 is composed of one member. Note that the support member 80 may be a combination of a plurality of members. When combining a plurality of members, it is desirable that the coefficients of thermal expansion are close.

  In the present embodiment, the stage 3 is movable in the internal space SP. The stage 3 is disposed on the + Z side of the X-ray source 2. The stage 3 can move in a space on the + Z side of the injection unit 8 in the internal space SP. At least a part of the stage 3 can face the injection unit 8. The stage 3 can arrange the held measurement object S at a position facing the injection unit 8. The stage 3 can arrange the measurement object S on a path through which the X-rays emitted from the emission unit 8 pass. The stage 3 can arrange the measurement object S within the irradiation range of the X-rays emitted from the emission unit 8.

  The detector 4 is arranged on the + Z side with respect to the X-ray source 2 and the stage 3 in the internal space SP. The position of the detector 4 is fixed. The detector 4 may be movable. The stage 3 can move in the space between the X-ray source 2 and the detector 4 in the internal space SP.

  The detector 4 includes a scintillator unit 34 having an incident surface 33 on which X-rays from the X-ray source 2 including transmitted X-rays transmitted through the measurement object S are incident, and a light receiving unit 35 that receives light generated in the scintillator unit 34. And have. The incident surface 33 of the detector 4 can face the measuring object S held on the stage 3.

  The scintillator unit 34 includes a scintillation substance that generates light having a wavelength different from that of the X-rays when it hits the X-rays. The light receiving unit 35 includes a photomultiplier tube. The photomultiplier tube includes a phototube that converts light energy into electrical energy by a photoelectric effect. The light receiving unit 35 amplifies the light generated in the scintillator unit 34, converts it into an electrical signal, and outputs it.

  The detector 4 has a plurality of scintillator sections 34. A plurality of scintillator sections 34 are arranged in the XY plane. The scintillator units 34 are arranged in an array. The detector 4 has a plurality of light receiving portions 35 so as to be connected to each of the plurality of scintillator portions 34. The detector 4 may directly convert incident X-rays into electric signals without converting them into light.

  FIG. 3 is a cross-sectional view showing an example of the X-ray source 2 according to the present embodiment. In FIG. 3, the X-ray source 2 includes a filament 39 that generates electrons, a target 40 that generates X-rays by collision of electrons or transmission of electrons, and a conductor member 41 that guides electrons to the target 40. . In the present embodiment, the X-ray source 2 includes a housing 42 that houses at least a part of the conductor member 41. In the present embodiment, each of the filament 39, the conductor member 41, and the target 40 is accommodated in the housing 42.

  The filament 39 includes, for example, tungsten. The filament 39 is wound in a coil shape. When a current flows through the filament 39 and the filament 39 is heated by the current, electrons (thermoelectrons) are emitted from the filament 39. The tip of the filament 39 is pointed. Electrons are emitted from the pointed portion of the filament 39.

  The target 40 includes, for example, tungsten, and generates X-rays by electron collision or electron transmission. In the present embodiment, the X-ray source 2 is a so-called transmission type. In the present embodiment, the target 40 generates X-rays by transmission of electrons.

  For example, when a voltage is applied between the target 40 and the filament 39 using the target 40 as an anode and the filament 39 as a cathode, the thermoelectrons jumping out of the filament 39 are accelerated toward the target (anode) 40, and the target 40 is irradiated. Thereby, X-rays are generated from the target 40.

  The conductor member 41 is disposed between at least a part of the periphery of the electron path from the filament 39 between the filament 39 and the target 40. The conductor member 41 includes, for example, an electron lens such as a focusing lens and an objective lens, or a polarizer, and guides electrons from the filament 39 to the target 40. The conductor member 41 causes electrons to collide with a partial region (X-ray focal point) of the target 40. The size (spot size) of the region where the electrons collide in the target 40 is sufficiently small. Thereby, a point X-ray source is substantially formed.

  When the target 40 is irradiated with electrons in the X-ray source 2, a part of the energy of the electrons becomes X-rays and a part of the energy becomes heat. There is a possibility that the temperature of the target 40 increases due to the irradiation of electrons on the target 40. In addition, the temperature of the space around the target 40 may increase. When the temperature of the target 40 or the like rises, for example, the temperature of the support member 80 that supports the X-ray source 2 may also rise.

  In the present embodiment, the support member 80 supports the housing 42 of the X-ray source 2. In the present embodiment, both the X-ray source 2 and the stage 3 are disposed on the support member 80. Therefore, for example, even if the temperature of the support member 80 changes and the support member 80 is thermally deformed, the relative position of the X-ray source 2 and the stage 3 (measurement S) changes (changes relative to the ideal relative position). Is suppressed. Therefore, a decrease in detection accuracy (inspection accuracy, measurement accuracy) of the X-ray apparatus 1 due to a change in relative position between the X-ray source 2 and the stage 3 (measurement object S) is suppressed. Further, the occurrence of measurement failure (detection failure) of the measurement object S is suppressed.

  In the present embodiment, the support member 80 is formed of a low thermal expansion material. Therefore, even if the temperature of the target 40 or the like rises, thermal deformation of the support member 80 is suppressed. Therefore, the fluctuation | variation of the relative position of the X-ray source 2 and the stage 3 (measurement object S) is suppressed. For example, in the present embodiment, the variation in the distance between the X-ray source 2 and the stage 3 (measurement object S) in the Z-axis direction (change with respect to the ideal distance) is suppressed. Further, there is a change in the relative position between the X-ray source 2 and the stage 3 (measurement S) in relation to the direction intersecting the Z axis (one or both of the X axis direction and the Y axis direction) (change relative to the ideal relative position). It is suppressed. Therefore, a decrease in detection accuracy (inspection accuracy, measurement accuracy) of the X-ray apparatus 1 due to a change in relative position between the X-ray source 2 and the stage 3 (measurement object S) is suppressed. In addition, the occurrence of measurement failure (detection failure) of the measurement object S is suppressed.

  In the present embodiment, the X-ray source 2 and the stage 3 are arranged in the Z-axis direction (X-ray traveling direction). Therefore, even if the support member 80 is thermally deformed, a change in the position of the stage 3 (measurement object S) relative to the X-ray source 2 in the direction intersecting the Z axis (at least one of the X axis direction and the Y axis direction) (ideal) Change with respect to the correct position) is suppressed. That is, the occurrence of so-called axis deviation is suppressed. Therefore, the occurrence of a measurement failure (detection failure) of the measurement object S due to a change in the relative position between the X-ray source 2 and the stage 3 (measurement object S) is suppressed.

Even when the support member 80 is deformed as the temperature rises, it is desirable that the support member 80 be uniformly deformed as the temperature rises. For example, in the case of deformation along the Z-axis direction due to the heat of the support member 80, the deformation occurs along the Z-axis direction in proportion to the temperature. In this case, the support member 80 expands in the Z-axis direction. In this case, it is desirable to store the expansion amount for each temperature of the support member 80 in advance. By measuring the temperature of the support member 80, the expansion amount (deformation amount) of the support member 80 at that temperature can be estimated. Thereby, the distance between the measuring object S on the support member 80 and the X-ray source 2 can be calculated. Therefore, the occurrence of a measurement failure (detection failure) due to a change in the relative position between the X-ray source 2 and the stage 3 (measurement object S) is suppressed. In addition, although the deformation | transformation along the Z-axis direction was mentioned as an example with the heat | fever of the support member 80, the deformation | transformation along the X-axis and Y-axis direction is also the same. Further, even when the deformation of the support member 80 is deformed along a plurality of directions (for example, the X and Y axis directions) in the X, Y, and Z axis directions, the expansion amount for each temperature of the support member 80 is previously set. Since the deformation of the support member 80 can be estimated by storing it, the occurrence of measurement failure (detection failure) due to the relative position fluctuation between the X-ray source 2 and the stage 3 (measurement object S) is suppressed. The The method for estimating the expansion amount of the support member 80 is not limited to the temperature measurement of the support member 80. For example, by measuring or predicting in advance the amount of deformation of the support member 80 along with the passage of the measurement time (for example, the elapsed time from the start of X-ray emission from the X-ray source 2), From the passage of the measurement time, the deformation amount of the support member 80 can be estimated. Note that the measured or predicted result may be stored in the apparatus.
The shape of the support member 80B is preferably a shape that isotropically changes even if there is a change in shape due to a temperature change. For example, it is desirable to use a rectangular parallelepiped shape.

  In the present embodiment, the support member 80 is formed of a low thermal expansion material, but may not be formed of a low thermal expansion material. For example, the support member 80 may have a larger thermal expansion coefficient than the chamber member 6. The thermal expansion coefficient of the support member 80 and the thermal expansion coefficient of the chamber member 6 may be substantially the same.

  In the present embodiment, the X-ray source 2 and the stage 2 are supported by the support member 80, but the X-ray source 2 may be further supported by a member different from the support member 80. For example, the X-ray source 2 may be additionally supported by the chamber member 6. Further, for example, the stage 3 and the chamber member 6 may be additionally supported. In this case, the support member 80 and the chamber member 6 may not be in contact with each other.

  Next, an example of the operation of the X-ray apparatus 1 according to this embodiment will be described. In the detection, the measurement object S is held on the stage 3. The control device 5 controls the stage 3 to place the measurement object S between the X-ray source 2 and the detector 4.

  The control device 5 passes a current through the filament 39 in order to emit X-rays from the X-ray source 2. Thereby, the filament 39 is heated and electrons are emitted from the filament 39. The electrons emitted from the filament 39 are applied to the target 40. Thereby, X-rays are generated from the target 40.

  At least a part of the X-rays generated from the X-ray source 2 is irradiated on the measurement object S. When the measurement object S is irradiated with X-rays from the X-ray source 2, at least a part of the X-rays irradiated on the measurement object S passes through the measurement object S. The transmitted X-rays that have passed through the measurement object S enter the incident surface 33 of the detector 4. The detector 4 detects transmitted X-rays that have passed through the measurement object S. The detector 4 detects an image of the measurement object S obtained based on the transmitted X-rays transmitted through the measurement object S. The detection result of the detector 4 is output to the control device 5.

  In this embodiment, the control device 5 changes the position of the measurement object S from the X-ray source 2 while changing the position of the measurement object S in order to change the irradiation region of the measurement object S from the X-ray source 2. X-rays are irradiated. That is, the control device 5 irradiates the measurement object S with X-rays from the X-ray source 2 at each position of the plurality of measurement objects S, and detects the transmitted X-rays transmitted through the measurement object S with the detector 4. To do.

  In the present embodiment, the control device 5 changes the position of the measurement object S with respect to the X-ray source 2 by rotating the stage 3 holding the measurement object S (the holding unit that holds the measurement object S among the stages 3). Thus, the irradiation region of the X-ray from the X-ray source 2 in the measurement object S is changed.

  That is, in the present embodiment, the control device 5 irradiates the measurement object S with X-rays while rotating the stage 3 that holds the measurement object S (the holding unit that holds the measurement object S among the stages 3). . Transmitted X-rays (X-ray transmission data) that have passed through the measurement object S at each position (each rotation angle) of the stage 3 are detected by the detector 4. The detector 4 acquires an image of the measuring object S at each position.

  The control device 5 calculates the internal structure of the measurement object S from the detection result of the detector 4. In the present embodiment, the control device 5 acquires an image of the measurement object S based on transmitted X-rays (X-ray transmission data) that have passed through the measurement object S at each position (each rotation angle) of the measurement object S. That is, the control device 5 acquires a plurality of images of the measurement object S.

  The control device S performs a calculation based on a plurality of X-ray transmission data (images) obtained by rotating the measurement object S and irradiating the measurement object S with X-rays, and obtains a tomographic image of the measurement object S. Is reconstructed to obtain three-dimensional data (three-dimensional structure) of the internal structure of the measuring object S. Thereby, the internal structure of the measuring object S is calculated. Examples of the reconstruction method of the tomographic image of the measurement object include a back projection method, a filter-corrected back projection method, and a successive approximation method. The back projection method and the filtered back projection method are described in, for example, US Patent Application Publication No. 2002/0154728. The successive approximation method is described, for example, in US Patent Application Publication No. 2010/0220908.

  As described above, according to this embodiment, since both the X-ray source 2 and the stage 3 are arranged on the support member 80, the X-ray source 2 and the stage 3 ( Variations in the relative position with the measured object S) are suppressed. Therefore, it is possible to suppress a decrease in detection accuracy (inspection accuracy, measurement accuracy) of the X-ray apparatus 1 due to a change in relative position between the X-ray source 2 and the stage 3 (measurement object S). For example, the X-ray apparatus 1 can accurately acquire information related to the internal structure of the measurement object S.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 4 is a diagram illustrating an example of the X-ray apparatus 1B according to the second embodiment. In FIG. 4, the X-ray apparatus 1B is disposed in the chamber member 6B that forms the internal space SP, the X-ray source 2 that is disposed in the internal space SP and irradiates the measurement object S with X-rays, and the internal space SP. A stage device 300 that holds the measurement object S, a detector 4 that detects at least part of transmitted X-rays that have been emitted from the X-ray source 2 and passed through the measurement object S, and an internal space SP that are disposed in the X-ray source. 2 and a support member 80B that supports at least a part of the stage apparatus 300. The support member 80B has a smaller thermal expansion coefficient than the chamber member 6B. In the present embodiment, the support member 80B is formed of a low thermal expansion material such as Invar. In the present embodiment, X-rays emitted from the emission unit 8 of the X-ray source 2 travel in the + Z direction.

  In the present embodiment, the stage apparatus 300 includes a first stage 300A and a second stage 300B that are arranged in the Z-axis direction. In the present embodiment, the X-ray source 2 and the first stage 300A are supported by the support member 80B. Further, the position of the first stage 300A is measured by the measuring device 99B. The second stage 300B is disposed between the support member 80B and the detector 4. In the present embodiment, the first stage 300A is disposed closer to the X-ray source 2 than the second stage 300B. That is, in the present embodiment, the distance between the first stage 300A and the X-ray source 2 along the Z-axis direction is shorter than the distance between the second stage 300B and the X-ray source 2 along the Z-axis direction.

  In the present embodiment, the internal space SP formed by the chamber member 6B includes the first space SP1, in which the X-ray source 2, the first stage 300A, and the support member 80B are disposed, the second stage 300B, and the detector 4. And the second space SP2 to be arranged. The first space SP1 and the second space SP2 are partitioned by the partition portion 100. The partition part 100 has a passage part 101 through which X-rays from the X-ray source 2 can pass. X-rays emitted from the X-ray source 2 are supplied to the second space SP2 via the passage unit 101.

  Further, in the present embodiment, the X-ray apparatus 1B includes a supply port 7 that is disposed in at least a part of the internal space SP and supplies the temperature-adjusted gas G. The supply port 7 supplies the temperature-adjusted gas G to at least a part of the X-ray source 2. In the present embodiment, the supply port 7 faces the first space SP1.

  In the present embodiment, the detection apparatus 1B includes an adjustment device 36 that adjusts the temperature of the gas G. The adjusting device 36 is operated by electric power, for example. The supply port 7 supplies the gas G from the adjustment device 36 to the first space SP1.

  In the present embodiment, the adjusting device 36 is disposed in the external space RP of the chamber member 6B. In the present embodiment, the adjusting device 36 is disposed on the support surface FR. The adjusting device 36 is connected to the conduit 37. The conduit 37 is disposed in the external space RP. The adjusting device 36 and the chamber member 6B are separated from each other. At least a part of the conduit 37 and the chamber member 6B are separated from each other.

  The chamber member 6B has a conduit 38. The conduit 38 is formed so as to connect the internal space SP (first space SP1) and the external space RP. The opening at one end of the conduit 38 is arranged to face the external space RP. The opening at the other end of the conduit 38 is disposed so as to face the first space SP1. The flow path of the conduit 37 is connected to the opening at one end of the conduit 38. In the present embodiment, the opening at the other end of the conduit 38 functions as the supply port 7.

  In the present embodiment, the adjusting device 36 takes in the gas in the external space RP, for example, and adjusts the temperature of the gas. The gas G whose temperature has been adjusted by the adjusting device 36 is sent to the supply port 7 through the flow path of the conduit 37 and the conduit 38 of the chamber member 6B. The supply port 7 is disposed so as to face at least a part of the X-ray source 2. The supply port 7 supplies the gas G from the adjustment device 36 to at least a part of the X-ray source 2. The conduit 37 and the conduit 38 may be integrated, or the conduit 37 and at least a part of the conduit 38 may be separate members.

  In the present embodiment, the first stage 300A and the measuring device 99B that measures the position of the first stage 300A have the same configuration as the stage 3 and the measuring device 99 described in the first embodiment. A description of the first stage 300A and the measuring device 99B is omitted.

  In the present embodiment, the second stage 300B includes a table 12 that holds the measurement object S, a first movable member 13 that supports the table 12 so as to be movable, and a second movable that supports the first movable member 13 so as to be movable. It has the member 14 and the 3rd movable member 15 which supports the 2nd movable member 14 so that a movement is possible.

  The table 12 is rotatable while holding the measurement object S. The table 12 can be moved (rotated) in the θY direction. The first movable member 13 is movable in the X axis direction. When the first movable member 13 moves in the X-axis direction, the table 12 moves in the X-axis direction together with the first movable member 13. The second movable member 14 is movable in the Y axis direction. When the second movable member 14 moves in the Y-axis direction, the first movable member 13 and the table 12 move together with the second movable member 14 in the Y-axis direction. The third movable member 15 is movable in the Z-axis direction. When the third movable member 15 moves in the Z-axis direction, the second movable member 14, the first movable member 13, and the table 12 move in the Z-axis direction together with the third movable member 15.

  In the present embodiment, the X-ray apparatus 1B includes a drive system 10 that can move at least a part of the second stage 300B. The drive system 10 includes a rotary drive device 16 that rotates the table 12 on the first movable member 13, a first drive device 17 that moves the first movable member 13 in the X-axis direction on the second movable member 14, 2 includes a second driving device 18 that moves the movable member 14 in the Y-axis direction, and a third driving device 19 that moves the third movable member 15 in the Z-axis direction.

  The second drive device 18 includes a screw shaft 20B disposed on a nut included in the second movable member 14, and an actuator 20 that rotates the screw shaft 20B. The screw shaft 20B is rotatably supported by bearings 21A and 21B. In the present embodiment, the screw shaft 20B is supported by the bearings 21A and 21B so that the axis of the screw shaft 20B and the Y axis are substantially parallel. In the present embodiment, a ball is disposed between the nut of the second movable member 14 and the screw shaft 20B. That is, the second drive device 18 includes a so-called ball screw drive mechanism.

  The third drive device 19 includes a screw shaft 23B disposed on a nut included in the third movable member 15, and an actuator 23 that rotates the screw shaft 23B. The screw shaft 23B is rotatably supported by bearings 24A and 24B. In the present embodiment, the screw shaft 23B is supported by the bearings 24A and 24B so that the axis of the screw shaft 23B and the Z-axis are substantially parallel. In the present embodiment, a ball is disposed between the nut included in the third movable member 15 and the screw shaft 23B. That is, the third drive device 19 includes a so-called ball screw drive mechanism.

  The third movable member 15 includes a guide mechanism 25 that guides the second movable member 14 in the Y-axis direction. The guide mechanism 25 includes guide members 25A and 25B that are long in the Y-axis direction. At least a part of the second driving device 18 including the actuator 20 and the bearings 21 </ b> A and 21 </ b> B that support the screw shaft 20 </ b> B is supported by the third movable member 15. When the actuator 20 rotates the screw shaft 20B, the second movable member 14 moves in the Y-axis direction while being guided by the guide mechanism 25.

  In the present embodiment, the detection device 1 </ b> B has a base member 26. The base member 26 is supported by the chamber member 6B. In the present embodiment, the base member 26 is supported on the inner wall (inner surface) of the chamber member 6B via a support mechanism. The position of the base member 26 is fixed.

  The base member 26 has a guide mechanism 27 that guides the third movable member 15 in the Z-axis direction. The guide mechanism 27 includes guide members 27A and 27B that are long in the Z-axis direction. At least a part of the third drive device 19 including the actuator 23 and the bearings 24 </ b> A and 24 </ b> B that support the screw shaft 23 </ b> B is supported by the base member 26. When the actuator 23 rotates the screw shaft 23 </ b> B, the third movable member 15 moves in the Z-axis direction while being guided by the guide mechanism 27.

  Although not shown, in the present embodiment, the second movable member 14 has a guide mechanism that guides the first movable member 13 in the X-axis direction. The first driving device 17 includes a ball screw mechanism that can move the first movable member 13 in the X-axis direction. The rotation drive device 16 includes a motor that can move (rotate) the table 12 in the θY direction.

  In the present embodiment, the measuring object S held on the table 12 can be moved by the drive system 10 in four directions including the X axis, the Y axis, the Z axis, and the θY direction. In addition, the drive system 10 may move the measuring object S held on the table 12 in six directions including the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ directions. In the present embodiment, the drive system 10 includes the ball screw drive mechanism, but may include a voice coil motor, for example. For example, the drive system 10 may include a linear motor or a planar motor. Further, the drive system 10 may include a piezo element.

  In the present embodiment, the second stage 300B is movable in the second space SP2. The second stage 300B can arrange the measurement object S on the path through which the X-rays emitted from the emission unit 8 pass. The second stage 300 </ b> B can arrange the measurement object S within the irradiation range of the X-ray XL emitted from the emission unit 8.

  In the present embodiment, the detection apparatus 1B includes a measurement device 28 that measures the position of the second stage 300B. In the present embodiment, the measuring device 28 includes an encoder system.

  The measuring device 28 includes a rotary encoder 29 that measures the amount of rotation of the table 12 (position in the θY direction), a linear encoder 30 that measures the position of the first movable member 13 in the X axis direction, and a second movable in the Y axis direction. The linear encoder 31 that measures the position of the member 14 and the linear encoder 32 that measures the position of the third movable member 15 in the Z-axis direction are provided.

  In the present embodiment, the rotary encoder 29 measures the amount of rotation of the table 12 relative to the first movable member 13. The linear encoder 30 measures the position of the first movable member 13 with respect to the second movable member 14 (position in the X-axis direction). The linear encoder 31 measures the position of the second movable member 14 with respect to the third movable member 15 (position in the Y-axis direction). The linear encoder 32 measures the position of the third movable member 15 with respect to the base member 26 (position in the Z-axis direction).

  The rotary encoder 29 includes, for example, a first scale member disposed on the first movable member 13 and a first encoder head disposed on the table 12 and detecting the scale of the first scale member. The first scale member is fixed to the first movable member 13. The first encoder head is fixed to the table 12. The first encoder head can measure the amount of rotation of the table 12 relative to the first scale member (first movable member 13).

  The linear encoder 30 includes, for example, a second scale member disposed on the second movable member 14 and a second encoder head disposed on the first movable member 13 and detecting a scale of the second scale member. The second scale member is fixed to the second movable member 14. The second encoder head is fixed to the first movable member 13. The second encoder head can measure the position of the first movable member 13 with respect to the second scale member (second movable member 14).

  The linear encoder 31 includes a third scale member disposed on the third movable member 15 and a third encoder head disposed on the second movable member 14 and detecting a scale of the third scale member. The scale member is fixed to the third movable member 15. The third encoder head is fixed to the second movable member 14. The third encoder head can measure the position of the second movable member 14 relative to the scale member 31A (third movable member 15).

  The linear encoder 32 includes a fourth scale member disposed on the base member 26 and a fourth encoder head disposed on the third movable member 15 and detecting the scale of the fourth scale member. The fourth scale member is fixed to the base member 26. The fourth encoder head is fixed to the third movable member 15. The fourth encoder head can measure the position of the third movable member 15 with respect to the fourth scale member (base member 26).

  In the present embodiment, the resolution of the measuring device 99B that measures the position of the first stage 300A is higher than the resolution of the measuring device 28 that measures the position of the second stage 300B. The resolution includes, for example, the resolution of the scale member of the encoder system. The resolution of the scale member includes the scale member interval. That is, in this embodiment, the scale member scale interval of the measurement device 99B that measures the position of the first stage 300A is larger than the scale member scale interval of the measurement device 28 that measures the position of the second stage 300B. Is also small.

  Note that the resolution of the measuring device 99B that measures the position of the first stage 300A and the resolution of the measuring device 28 that measures the position of the second stage 300B may be the same.

  As described above, according to the present embodiment, since both the X-ray source 2 and the first stage 300A are arranged on the support member 80B, even if a temperature change occurs, Variations in relative position with the one stage 300A (measurement object S) can be suppressed. Therefore, it is possible to suppress a decrease in detection accuracy (inspection accuracy and measurement accuracy) of the X-ray apparatus 1B due to a change in relative position between the X-ray source 2 and the first stage 300A (measurement object S). For example, the X-ray apparatus 1B can accurately acquire information regarding the internal structure of the measurement object S.

  In the embodiment of FIG. 4, the stage (300) on which the light source 2 and the object S are disposed is disposed on the support member 80B, but other constituent members may be disposed. For example, the support member 80B may support the X-ray source 2, the first stage 300A, the second stage 300B, and the detector 4. However, when cone beam X-rays are used, the X-rays spread in the vertical direction (Y direction in FIG. 4), so that the detection surface used for the actual measurement of the detector 4 as shown in FIG. It is preferable to limit the length of the support member 80 in the Z direction to the extent that it does not block X-rays incident on this range. The influence of the positional deviation between the object S and the target 8 on the detection becomes large when the distance between the object S and the target 8 is relatively small. Therefore, even if the length of the support member 80 is limited, the detection accuracy is lowered by supporting the light source and the stage with the support member 80 only in a range along the Z direction relatively close to the target 8 that affects the detection accuracy. Can be suppressed.

<Third Embodiment>
Next, a third embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 5 is a diagram showing a part of the X-ray source 2C of the X-ray apparatus 1C according to the third embodiment. In the present embodiment, the X-ray source 2C is a so-called reflection type. In the present embodiment, the X-ray source 2 </ b> C includes an electron emission unit 70 including a filament and a conductor member, and a target 71. In this embodiment, the electron emission part 70 is provided with the housing 72 which accommodates a filament and a conductor member. The target 71 is disposed outside the housing 72 (electron emitting unit 70). The conductor member of the electron emitting unit 70 guides electrons generated from the filament to the target 71. Electrons from the electron emitting unit 70 collide with the target 71. The target 71 generates X-rays by electron collision.

  In the present embodiment, the target 71 has a first surface 71A that is irradiated with electrons from the electron emitting portion 70, and a second surface 71B and a third surface 71C that face in different directions from the first surface 71A. In the present embodiment, X-rays are generated by irradiating the first surface 71A with electrons.

  In the present embodiment, the X-ray apparatus 1C includes a support member 80C that supports an X-ray source 2C and a stage that holds the measurement object S. In FIG. 5, the stage is not shown. In the present embodiment, the support member 80 </ b> C supports the target 71. In the present embodiment, the support member 80 </ b> C also supports the electron emission unit 70.

  As described above, in the present embodiment, since at least a part of the X-ray source 2C including the target 71 and the stage are both arranged on the support member 80C, even if a temperature change occurs, Variations in relative position between the X-ray source 2C and the stage (measurement object S) can be suppressed. Therefore, it is possible to suppress a decrease in detection accuracy (inspection accuracy, measurement accuracy) of the X-ray apparatus 1C due to a change in relative position between the X-ray source 2C and the stage (measurement object S).

<Fourth embodiment>
Next, a fourth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  In 4th Embodiment, the structure manufacturing system provided with X-ray apparatus 1 (1B, 1C) mentioned above is demonstrated.

  FIG. 6 is a block configuration diagram of the structure manufacturing system 200. The structure manufacturing system 200 includes the X-ray apparatus 1 described above, a molding apparatus 120, a control apparatus 130, and a repair apparatus 140. In the present embodiment, the structure manufacturing system 200 creates a molded product such as an electronic component including an automobile door portion, an engine component, a gear component, and a circuit board.

  The design device 110 creates design information related to the shape of the structure, and transmits the created design information to the molding device 120. In addition, the design device 110 stores the created design information in a coordinate storage unit 131 (to be described later) of the control device 130. Here, the design information is information indicating the coordinates of each position of the structure. The molding apparatus 120 produces the structure based on the design information input from the design apparatus 110. The forming process of the forming apparatus 120 includes at least one of casting, forging, and cutting.

  The X-ray device 1 transmits information indicating the measured coordinates to the control device 130. The control device 130 includes a coordinate storage unit 131 and an inspection unit 132. Design information is stored in the coordinate storage unit 131 by the design device 110. The inspection unit 132 reads design information from the coordinate storage unit 131. The inspection unit 132 creates information (shape information) indicating the created structure from information indicating the coordinates received from the X-ray apparatus 1. The inspection unit 132 compares information (shape information) indicating coordinates received from the shape measuring device 170 with design information read from the coordinate storage unit 131. Based on the comparison result, the inspection unit 132 determines whether or not the structure is molded according to the design information. In other words, the inspection unit 132 determines whether or not the created structure is a non-defective product. If the structure is not molded according to the design information, the inspection unit 132 determines whether or not the structure can be repaired. If repair is possible, the inspection unit 132 calculates a defective part and a repair amount based on the comparison result, and transmits information indicating the defective part and information indicating the repair amount to the repair device 140.

  The repair device 140 processes the defective portion of the structure based on the information indicating the defective portion received from the control device 130 and the information indicating the repair amount.

  FIG. 7 is a flowchart showing the flow of processing by the structure manufacturing system 200. First, the design apparatus 110 creates design information related to the shape of the structure (step S101). Next, the molding apparatus 120 produces the structure based on the design information (step S102). Next, the X-ray apparatus 1 measures coordinates relating to the shape of the structure (step S103). Next, the inspection unit 132 of the control device 130 inspects whether or not the structure is created according to the design information by comparing the shape information of the structure created from the X-ray apparatus 1 and the design information. (Step S104).

  Next, the inspection unit 132 of the control device 130 determines whether or not the created structure is a non-defective product (step S105). If the created structure is a non-defective product (YES in step S106), the structure manufacturing system 200 ends the process. On the other hand, when the created structure is not a non-defective product (NO in step S106), the inspection unit 132 of the control device 130 determines whether the created structure can be repaired (step S107).

  When the created structure can be repaired (YES in step S107), the repair device 140 performs reworking of the structure (step S108) and returns to the process of step S103. On the other hand, when the created structure cannot be repaired (step S107 YES), the structure manufacturing system 200 ends the process. Above, the process of this flowchart is complete | finished.

  As described above, since the X-ray apparatus 1 in the above embodiment can accurately measure the coordinates of the structure, the structure manufacturing system 200 can determine whether or not the created structure is a non-defective product. it can. In addition, the structure manufacturing system 200 can repair the structure by reworking the structure when the structure is not a good product.

  In each of the above embodiments, the X-ray apparatus has an X-ray source. However, the X-ray source may be an external apparatus for the X-ray apparatus. In other words, the X-ray source may not constitute at least a part of the X-ray apparatus.

  In each of the above-described embodiments, the measurement object S is not limited to an industrial part, and may be a human body, for example. Further, in each of the above-described embodiments, the X-ray apparatus may be used for medical purposes.

  In each of the embodiments described above, the X-ray source 2 and the detector 4 are fixed at predetermined positions, the stage is rotated, and an image of the measurement object S is acquired. However, the scanning method is not limited to this. One of the X-ray source and the detector may be fixed at a predetermined position, and the other may be movable. Further, both the X-ray source and the detector may be movable.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as it is permitted by law, the disclosure of all published publications and US patents related to the detection devices and the like cited in the above embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 1 ... X-ray apparatus, 2 ... X-ray source, 3 ... Stage, 4 ... Detector, 6 ... Chamber member, 7 ... Supply port, 40 ... Target, 42 ... Housing, 80 ... Support member, 81 ... Guide member, 300 ... Stage device, 300A ... First stage, 300B ... Second stage, RP ... External space, S ... Measurement object, SP ... Internal space.

Claims (16)

An X-ray apparatus for irradiating an object with X-rays and detecting transmitted X-rays passing through the object,
A chamber member forming a first space;
An X-ray source disposed in the first space and irradiating the object with X-rays;
A stage disposed in the first space and holding the object;
A detector that detects at least part of the transmitted X-rays emitted from the X-ray source and passed through the object;
An X-ray apparatus comprising: a support member disposed in the first space and supporting the X-ray source and the stage.   The X-ray apparatus according to claim 1, wherein the support member has a smaller thermal expansion coefficient than the chamber member. At least a portion of the X-rays from the X-ray source travels in a first direction in the first space;
The X-ray apparatus according to claim 1, wherein the X-ray source and the stage are arranged in the first direction.   The X-ray apparatus according to any one of claims 1 to 3, wherein the stage includes a first stage and a second stage arranged in the first direction. The X-ray source and the first stage are supported by the support member,
5. The X of claim 4, wherein the second stage is disposed between the support member and the detector, and the first stage is disposed closer to the X-ray source than the second stage. Wire device. A first measuring device for measuring the position of the first stage;
A second measuring device for measuring the position of the second stage,
The X-ray apparatus according to claim 4 or 5, wherein the resolution of the first measurement device is higher than the resolution of the second measurement device.   The first space includes the first portion and the second portion along the first direction, the first stage is disposed in the first portion, and the second stage is disposed in the second portion. The X-ray apparatus as described in any one of Claims 4-6.   The X-ray apparatus according to claim 1, wherein the stage includes a drive member that is driven on the support member.   The X-ray apparatus according to claim 7, further comprising a guide member that is disposed on the support member and guides the stage.   The X-ray apparatus according to any one of claims 1 to 9, further comprising a first supply port that is disposed in the first space and supplies a temperature-adjusted gas to at least a part of the X-ray source. The X-ray source includes a target that generates X-rays by electron collision or electron transmission,
The X-ray apparatus according to claim 1, wherein the support member supports the target. The X-ray source includes a target that generates X-rays by electron collision or electron transmission;
A housing that houses at least a part of a conductor member that guides the electrons to the target;
The X-ray apparatus according to claim 1, wherein the support member supports the housing. An X-ray source disposed in a chamber member that forms the first space, and a stage that holds a measurement object irradiated with X-rays from the X-ray source are supported by a support member disposed in the first space. Irradiating the measurement object with X-rays from the X-ray source;
Detecting the transmitted X-rays that have passed through the measurement object with a detector. A design process for creating design information on the shape of the structure;
A molding step for creating the structure based on the design information;
Measuring the shape of the fabricated structure using the X-ray irradiation method according to claim 13;
A method for manufacturing a structure, comprising: an inspection process for comparing the shape information obtained in the measurement process with the design information.   The method of manufacturing a structure according to claim 14, further comprising a repair process that is executed based on a comparison result of the inspection process and that performs a rework of the structure.   The method of manufacturing a structure according to claim 15, wherein the repairing step is a step of re-executing the forming step.

Images