JP2013191741A - Probe device, and probe card attachment method of probe device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe device capable of surely delivering a probe card when transferring and attaching the probe card in order to suppress an occurrence of damage or the like of the probe card, and to provide a probe card attachment method of the probe device.SOLUTION: The probe device includes a card clamp mechanism 13, a wafer chuck 10, a tray 21 with an alignment mark provided on the undersurface, a tray support mechanism 14 capable of supporting the tray 21, a camera 15, a movement mechanism 17 for transferring the tray 21 to a delivery position to the tray support mechanism 14, and control means for detecting a position of the alignment mark of the tray 21 arranged at the delivery position by the movement mechanism 17 by imaging the alignment mark with the camera 15, delivering a probe card 20 from the movement mechanism 17 to the tray support mechanism 14 in the case that the position of the alignment mark is within a prescribed range, and stopping delivering the probe card 20 in the case of being outside the prescribed range.

Description

  The present invention relates to a probe device and a probe card mounting method of the probe device.

  In the manufacturing process of a semiconductor device, a probe apparatus for performing an electrical inspection of a semiconductor device formed on a semiconductor wafer is used. Such a prober device uses a probe card in which a large number of probes that are brought into contact with electrode pads on a semiconductor wafer are arranged.

  Then, an inspection signal is supplied from the tester to the semiconductor device to be measured via the probe of the probe card, and an electrical inspection of the semiconductor device to be measured is performed by measuring a signal from the semiconductor device to be measured. Yes. In addition, by exchanging the probe card, different types of semiconductor devices to be measured are supported.

  Further, the above-described probe card is placed on a transport tray, and the tray and the probe card placed on the tray are transported using a wafer chuck driving mechanism for placing and moving a semiconductor wafer, and the card. A probe device configured to be mounted on a clamp mechanism is known (for example, see Patent Document 1).

JP 2001-24039 A

  As described above, conventionally, a probe card mounted on a transfer tray is transported using a wafer chuck drive mechanism, and the probe card is mounted on the card clamp mechanism. In this case, the tray and the probe card are placed on an arm or the like equipped with a slide mechanism or the like and placed at a predetermined delivery position in the probe device (housing), and the tray and the probe card are arranged around the wafer chuck. The delivery of receiving by the support mechanism is required. Conventionally, with respect to such a delivery position, a method of guaranteeing accuracy by adjusting a mechanism portion has been adopted. However, for example, the adjusted position may be shifted due to poor adjustment, parts failure, aging, etc.If the probe card is delivered in that state, the delivery will not be performed normally, and the expensive probe card may be damaged. There is a problem that may occur.

  The present invention has been made in response to the above-described conventional circumstances, and when the probe card is transported and mounted, the delivery can be performed reliably, and the occurrence of breakage of the probe card can be suppressed. It is an object of the present invention to provide a probe device and a probe card mounting method for the probe device.

  One aspect of the probe device of the present invention is a card clamp mechanism that detachably fixes a probe card having a large number of probes, and a semiconductor wafer that can be placed on the card clamp mechanism by driving the drive mechanism. A wafer chuck for contacting an electrode formed on the semiconductor wafer with the probe of the fixed probe card, a tray on which the probe card is mounted on the upper surface, and an alignment mark is disposed on the lower surface; A tray support mechanism disposed around the wafer chuck and movable by the drive mechanism to support the tray; a camera capable of imaging the alignment mark; and the tray. A moving mechanism for carrying in the transfer position with the tray support mechanism, and the transfer mechanism arranged at the transfer position The alignment mark on the tray is picked up by the camera to detect the position of the alignment mark. When the position of the alignment mark is within a predetermined range, the moving mechanism Control means for performing delivery of the tray to the tray support mechanism and stopping the delivery of the tray from the moving mechanism to the tray support mechanism when the position of the alignment mark is outside a predetermined range; It is characterized by comprising.

  According to one aspect of the probe card mounting method of the probe device of the present invention, a card clamp mechanism for detachably fixing a probe card having a large number of probes, a semiconductor wafer can be placed, and a drive mechanism is driven. A wafer chuck for contacting an electrode formed on the semiconductor wafer to the probe of the probe card fixed to the card clamp mechanism, the probe card is placed on the upper surface, and an alignment mark is disposed on the lower surface A tray, a tray support mechanism for supporting the tray, which is disposed around the wafer chuck and movable by the drive mechanism, and a camera capable of imaging the alignment mark; And a moving mechanism for carrying the tray into a delivery position with the tray support mechanism. A probe card mounting method for detecting the position of the alignment mark by imaging the alignment mark of the tray placed at the transfer position by the moving mechanism by the camera. When the position of the alignment mark is within a predetermined range, the tray is transferred from the moving mechanism to the tray support mechanism, and when the position of the alignment mark is outside the predetermined range The delivery of the tray from the moving mechanism to the tray support mechanism is stopped.

  According to the present invention, there is provided a probe device and a probe card mounting method for a probe device capable of reliably delivering and suppressing the occurrence of damage to the probe card when the probe card is transported and mounted. Can be provided.

The figure which shows typically the structure of the probe apparatus which concerns on one Embodiment of this invention. The figure for demonstrating the probe card mounting method of the probe apparatus which concerns on one Embodiment of this invention. The figure for demonstrating the probe card mounting method of the probe apparatus which concerns on one Embodiment of this invention. The figure for demonstrating the probe card mounting method of the probe apparatus which concerns on one Embodiment of this invention. The figure for demonstrating the probe card mounting method of the probe apparatus which concerns on one Embodiment of this invention. The figure for demonstrating the probe card mounting method of the probe apparatus which concerns on one Embodiment of this invention. The figure for demonstrating the probe card mounting method of the probe apparatus which concerns on one Embodiment of this invention. The figure for demonstrating the probe card mounting method of the probe apparatus which concerns on one Embodiment of this invention. The flowchart of the probe card mounting method of the probe apparatus which concerns on one Embodiment of this invention.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  First, a configuration of a probe apparatus that inspects a semiconductor device formed on a semiconductor wafer will be described with reference to FIG. As shown in FIG. 1, the probe apparatus 1 includes a housing 2, and a wafer chuck 10 for placing a semiconductor wafer W is disposed in the housing 2. The wafer chuck 10 includes a drive mechanism 11 and is movable in the x, y, z, and θ directions.

  The casing 2 positioned above the wafer chuck 10 is provided with a circular opening, and an insert ring 12 is disposed along the peripheral edge of the circular opening. The insert ring 12 is provided with a card clamp mechanism 13, and the probe card 20 is detachably held by the card clamp mechanism 13.

  The probe card 20 includes a wiring board and a plurality of probes (not shown) electrically connected to the wiring board, and the probes of the probe card 20 are semiconductors formed on the semiconductor wafer W. It is arranged corresponding to the electrode of the device.

  A tray support mechanism 14 for supporting a tray 21 for placing and transporting the probe card 20 is disposed around the wafer chuck 10. As will be described later, on the tray support mechanism 14, The probe card 20 and the tray 21 can be transported by supporting the tray 21 on which the probe card 20 is placed and driving the drive mechanism 11 of the wafer chuck 10.

  Further, a camera 15 is disposed on the side of the wafer chuck 10 so as to be directed upward and capable of capturing an upper image. The camera 15 is composed of, for example, a CCD camera or the like, and is conventionally provided mainly for imaging a probe of a probe card and aligning with the probe. In the present embodiment, as will be described later, the camera 15 is used in the mounting process of the probe card 20.

  A loading / unloading port 2a for carrying the probe card 20 into and out of the housing 2 from the outside of the housing 2 is provided on one side wall portion of the housing 2, in this embodiment, on the front side (right side in FIG. 1). It is arranged. An arm 16 for configuring a SACC (Semi Automatic Probe Card Changer) is disposed below the carry-in / out port 2a. As shown by the arrows in the figure, the arm 16 is rotatable up and down around a support shaft disposed on the wall surface of the housing 2. FIG. 1 shows a state in which the arm 16 is rotated upward (bounced up) and fixed.

  A slide mechanism 17 that is movable in the horizontal direction is disposed on the arm 16 as indicated by an arrow in FIG. The slide mechanism 17 has a bifurcated fork shape on the front end side (left side in FIG. 1), and the tray 21 can be supported by the fork-shaped portion on the front end side. Note that the probe card 20 can be placed on the upper surface of the tray 21. When the probe card 20 is transported, the probe card 20 is placed on the tray 21 and transported.

  The tray 21 on which the probe card 20 is placed is carried by the slide mechanism 17 from the carry-in / out port 2a to the delivery position in the housing 2, and the drive mechanism 11 of the wafer chuck 10 is driven at this delivery position. The tray 21 on which the probe card 20 is placed is transferred onto the tray support mechanism 14.

  Further, as shown by a dotted line in FIG. 1, an inspection signal is sent above the probe card 20 and connected to a tester for detecting the signal from the semiconductor device and inspecting the state of the semiconductor device. A test head 30 is provided.

  The operation of the probe device 1 having the above-described configuration is comprehensively controlled by a control unit 40 including a CPU and the like. The control unit 40 includes an operation unit 41 and a storage unit 42.

  The operation unit 41 includes a keyboard that allows a process manager to input commands to manage the probe device 1, a display that visualizes and displays the operating status of the probe device 1, and the like.

  The storage unit 42 stores a control program (software), inspection condition data, and the like for realizing various operations (for example, mounting of a probe card described later) performed by the probe device 1 under the control of the control unit 40. Stored recipes are stored. Then, if necessary, various recipes in the probe apparatus 1 are controlled under the control of the control unit 40 by calling an arbitrary recipe from the storage unit 42 according to an instruction from the operation unit 41 and causing the control unit 40 to execute the recipe. Is done. Also, recipes such as control programs and processing condition data may be stored in a computer-readable computer recording medium (for example, hard disk, CD, flexible disk, semiconductor memory, etc.), or It is also possible to transmit the data from other devices as needed via a dedicated line and use it online.

  When an electrical inspection of a semiconductor device formed on the semiconductor wafer W is performed using the probe apparatus 1 configured as described above, the semiconductor wafer W is placed on the wafer chuck 10 and the wafer chuck 10 As a result, the semiconductor wafer W is raised. Each electrode of the semiconductor wafer W is brought into contact with the corresponding probe of the probe card 20 to obtain electrical continuity, and the electrical characteristics of the semiconductor device are inspected by a tester connected to the test head 30. The

  Next, with reference to FIGS. 2-9, the probe card mounting method of the probe apparatus which concerns on one Embodiment of this invention is demonstrated.

  As shown in FIG. 2, alignment marks 22 are arranged in advance at predetermined positions on the lower surface side of the tray 21. In FIG. 2, only one alignment mark 22 is shown, but in the present embodiment, a total of two alignment marks 22 are separated from each other by a predetermined distance (100 mm in the present embodiment) in a direction perpendicular to the paper surface of FIG. An alignment mark 22 is provided. As long as the shape of the alignment mark 22 can be recognized by imaging with the camera 15. Any thing is acceptable.

  And the probe card 20 mounted on the tray 21 and the tray 21 by the slide mechanism 17 is arrange | positioned in the predetermined delivery position in the housing | casing 2 from the carrying in / out port 2a shown in FIG. At the same time, the wafer chuck 10 is moved below the delivery position, and the alignment mark 22 is imaged by the camera 15 to recognize the position of the alignment mark 22 (step 101 shown in FIG. 9). The position of the alignment mark 22 is recognized by the control unit 40 shown in FIG. 1 based on the imaging signal.

  Next, based on the recognized position of the alignment mark 22, the control unit 40 transfers the tray 21 between the slide mechanism 17 and the tray support mechanism 14 according to the position of the alignment mark 22. It is determined whether or not the position is within the range of positions that can be transferred (step 102 shown in FIG. 9).

  As a result of the above determination, when the position is out of the range of positions that can be delivered, delivery of the probe card 20 placed on the tray 21 and the tray 21 is stopped and the process is terminated (step 110 shown in FIG. 9). . Note that before stopping the delivery of the probe card 20, the position may be finely adjusted by the drive mechanism to check whether the position of the alignment mark is within a predetermined range. In this case, the fine adjustment of the position is, for example, in the range of ± 1.6 mm in the horizontal direction (direction perpendicular to the paper surface in FIG. 2) and in the range of ± 1.2 mm in the vertical direction (left-right direction along the paper surface in FIG. 2). Preferably it is done.

  On the other hand, when the position is within the range of the position where delivery is possible, the drive mechanism 11 of the wafer chuck 10 is driven based on the recognized position of the alignment mark 22 to move the wafer chuck 10 and the tray support mechanism 14 in the horizontal direction. To the proper delivery position (step 103 shown in FIG. 9).

  Next, as shown in FIG. 3, the drive mechanism 11 of the wafer chuck 10 is driven to raise the wafer chuck 10 and the tray support mechanism 14, and deliver the tray 21 and the probe card 20 onto the tray support mechanism 14. (Step 104 shown in FIG. 9).

  Next, as shown in FIG. 4, by driving the drive mechanism 11 of the wafer chuck 10, the wafer chuck 10 and the tray support mechanism 14 are moved in the horizontal direction, and the probe card 20 is centered on the probe of the probe apparatus 1. Matching to the centering position (step 105 shown in FIG. 9).

  Next, as shown in FIG. 5, by driving the drive mechanism 11 of the wafer chuck 10, the wafer chuck 10 and the tray support mechanism 14 are raised, and the probe is moved to the clamp position by the card clamp mechanism 13 (see FIG. 1). The card 20 is positioned (step 106 shown in FIG. 9).

  Next, after the probe card 20 placed at the clamp position is clamped by the card clamp mechanism 13 (see FIG. 1), the drive mechanism 11 of the wafer chuck 10 is driven as shown in FIG. Then, the tray support mechanism 14 is lowered and the tray 21 is lowered (step 107 shown in FIG. 9).

  Next, as shown in FIG. 7, by driving the drive mechanism 11 of the wafer chuck 10, the wafer chuck 10 and the tray support mechanism 14 are moved in the horizontal direction, and the tray 21 is transferred to the slide mechanism 17 described above. (Step 108 shown in FIG. 9).

  Next, as shown in FIG. 8, by driving the drive mechanism 11 of the wafer chuck 10, the wafer chuck 10 and the tray support mechanism 14 are lowered, and the tray 21 is transferred from the tray support mechanism 14 to the slide mechanism 17 (see FIG. 8). Step 109 shown in FIG. 9), and the process ends (Step 110 shown in FIG. 9).

  Through the above steps, the mounting of the probe card 20 to the probe device 1 is completed. When the probe card 20 is mounted, in the present embodiment, as described above, the position of the tray 21 supported by the slide mechanism 17 by imaging the alignment mark 22 previously arranged on the tray 21 by the camera 22. Is recognized, and when the position of the tray 21 is outside the range that can be delivered to the tray support mechanism 14, delivery to the tray support mechanism 14 is stopped.

  Therefore, for example, when the adjusted delivery position is shifted due to an adjustment failure, a component failure, a change with time, etc., and delivery is impossible, the tray 21 and the probe card 20 are delivered from the slide mechanism 17 to the tray support mechanism 14. There is nothing. This can reduce the possibility of damage to expensive probe cards.

  Further, when the position of the tray 21 supported by the slide mechanism 17 is within a range in which the tray 21 can be transferred to the tray support mechanism 14, the tray support mechanism 14 is appropriately transferred based on the recognized position of the tray 21. Then, the tray 21 and the probe card 20 are transferred to the tray support mechanism 14. Therefore, the tray 21 and the probe card 20 can be reliably delivered.

  Although the present invention has been described above with reference to the embodiments, the present invention is not limited to the above-described embodiments, and various modifications are of course possible.

  DESCRIPTION OF SYMBOLS 1 ... Probe apparatus, 2 ... Housing, 2a ... Loading / unloading exit, 10 ... Wafer chuck, 11 ... Drive mechanism, 12 ... Insert ring, 13 ... Card clamp mechanism, 14 ... Tray support mechanism, DESCRIPTION OF SYMBOLS 15 ... Camera, 16 ... Arm, 17 ... Slide mechanism, 20 ... Probe card, 21 ... Tray, 22 ... Positioning mark, 30 ... Test head, 40 ... Control part, 41 ... Operation unit, 42... Storage unit.

Claims (8)

A card clamping mechanism for removably fixing a probe card having a large number of probes;
A wafer chuck capable of placing a semiconductor wafer, and contacting an electrode formed on the semiconductor wafer with the probe of the probe card fixed to the card clamp mechanism by driving a drive mechanism;
A tray on which the probe card is placed on the upper surface and an alignment mark is disposed on the lower surface;
A tray support mechanism disposed around the wafer chuck and movable by the drive mechanism to support the tray;
A camera capable of imaging the alignment mark;
A moving mechanism for carrying the tray into a delivery position with the tray support mechanism;
The alignment mark of the tray placed at the transfer position by the moving mechanism is imaged by the camera to detect the position of the alignment mark, and the position of the alignment mark is within a predetermined range. In some cases, the tray is transferred from the moving mechanism to the tray supporting mechanism. When the position of the alignment mark is outside a predetermined range, the tray from the moving mechanism to the tray supporting mechanism is used. Control means for canceling the delivery of
A probe apparatus comprising: The probe device according to claim 1,
The control means finely adjusts the position by the drive mechanism before stopping the delivery of the tray from the moving mechanism to the tray support mechanism, and the position of the alignment mark is within a predetermined range. A probe device characterized by checking whether or not. The probe device according to claim 2,
The probe device is characterized in that the fine adjustment of the position is performed in a range of ± 1.6 mm in the horizontal direction and in a range of ± 1.2 mm in the vertical direction. The probe device according to any one of claims 1 to 3,
When the position of the alignment mark is within a predetermined range, the control means moves the tray support mechanism to an appropriate delivery position based on the position detection result of the alignment mark. The probe card is moved up and transferred from the moving mechanism to the tray support mechanism. A card clamping mechanism for removably fixing a probe card having a large number of probes;
A wafer chuck capable of placing a semiconductor wafer, and contacting an electrode formed on the semiconductor wafer with the probe of the probe card fixed to the card clamp mechanism by driving a drive mechanism;
A tray on which the probe card is placed on the upper surface and an alignment mark is disposed on the lower surface;
A tray support mechanism disposed around the wafer chuck and movable by the drive mechanism to support the tray;
A camera capable of imaging the alignment mark;
A moving mechanism for carrying the tray into a delivery position with the tray support mechanism;
A probe card mounting method for a probe device comprising:
Detecting the position of the alignment mark by imaging the alignment mark of the tray placed at the delivery position by the moving mechanism with the camera;
When the detected position of the alignment mark is within a predetermined range, transfer the tray from the moving mechanism to the tray support mechanism,
When the position of the alignment mark is outside a predetermined range, delivery of the tray from the moving mechanism to the tray support mechanism is stopped. A probe card mounting method for a probe device according to claim 5,
Before stopping the transfer of the tray from the moving mechanism to the tray support mechanism, fine adjustment of the position is performed by the drive mechanism to check whether the position of the alignment mark is within a predetermined range. A probe card mounting method for a probe device. A probe card mounting method for a probe device according to claim 6,
The probe card mounting method for a probe device, wherein the fine adjustment of the position is performed within a range of ± 1.6 mm in the horizontal direction and a range of ± 1.2 mm in the vertical direction. A probe card mounting method for a probe device according to any one of claims 5 to 7,
When the position of the alignment mark is within a predetermined range, based on the position detection result of the alignment mark, the tray support mechanism is moved to an appropriate delivery position and then lifted to A probe card mounting method for a probe apparatus, wherein the probe card is transferred from a moving mechanism to the tray support mechanism.

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