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JP2013191685A - Light-emitting device and luminaire using the same - Google Patents

Light-emitting device and luminaire using the same Download PDF

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JP2013191685A
JP2013191685A JP2012056094A JP2012056094A JP2013191685A JP 2013191685 A JP2013191685 A JP 2013191685A JP 2012056094 A JP2012056094 A JP 2012056094A JP 2012056094 A JP2012056094 A JP 2012056094A JP 2013191685 A JP2013191685 A JP 2013191685A
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light emitting
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Kenichiro Tanaka
健一郎 田中
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Panasonic Corp
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Abstract

【課題】複数種のLEDを用いた発光装置において、蛍光体を含有する波長変換部の熱を、効率的に放熱する。
【解決手段】発光装置1は、互いに発光色の異なる複数種の発光部2と、これら発光部2が搭載される基板5と、各発光部2に共通して設けられる透光性カバー7と、を備える。発光部2の各々は、同一種のLED21と、LED21を夫々被覆してLED21からの出射光の波長を各発光部2間で互いに異なる波長に変換する波長変換部22R,22G,22B(総称して22)と、を有する。透光性カバー7は、各波長変換部22の光出射面に共通して接し、LED21及び波長変換部22から発生した熱を放熱する。この構成によれば、発光部2の出力差や蛍光体の発熱特性の違いがあっても、透光性カバー7によって熱を効率的に拡散、放熱することができる。従って、発光部2間の温度ばらつきが生じ難くなり、照明装置1の照射光の色ムラを抑制することができる。
【選択図】図3
In a light emitting device using a plurality of types of LEDs, heat of a wavelength conversion unit containing a phosphor is efficiently radiated.
A light emitting device includes a plurality of types of light emitting units having different emission colors, a substrate on which the light emitting units are mounted, and a translucent cover that is provided in common to the light emitting units. . Each of the light emitting units 2 includes the same type of LED 21 and wavelength conversion units 22R, 22G, and 22B (generically named) that convert the wavelengths of the light emitted from the LEDs 21 to different wavelengths between the light emitting units 2 by covering the LEDs 21, respectively. 22). The translucent cover 7 is in contact with the light emitting surface of each wavelength conversion unit 22 in common and radiates heat generated from the LED 21 and the wavelength conversion unit 22. According to this configuration, even if there is a difference in output of the light emitting unit 2 or a difference in heat generation characteristics of the phosphor, heat can be efficiently diffused and radiated by the translucent cover 7. Therefore, temperature variations between the light emitting units 2 are less likely to occur, and color unevenness of the irradiation light of the lighting device 1 can be suppressed.
[Selection] Figure 3

Description

本発明は、複数の固体発光素子を備えた発光装置及びそれを用いた照明装置に関する。   The present invention relates to a light emitting device including a plurality of solid state light emitting elements and an illumination device using the same.

発光ダイオード(LED)は、低電力で高輝度の発光が可能であり、表示等や照明器具等の様々な電気機器の光源として使用されている。近年では、赤色LED及び緑色LEDに加えて、青色LEDが実用化され、これらRGB3色のLEDを組み合わせたり、LEDと、LEDから出射する光の波長を変換する蛍光体と組み合わせることで、様々な光色を発光することができる。   Light emitting diodes (LEDs) can emit light with high power and high luminance, and are used as light sources for various electric devices such as displays and lighting equipment. In recent years, in addition to red LEDs and green LEDs, blue LEDs have been put into practical use. By combining these RGB three-color LEDs, or combining LEDs with phosphors that convert the wavelength of light emitted from the LEDs, there are various types of LEDs. Light color can be emitted.

しかし、蛍光体は、周囲温度が高くなるに従って変換効率が低下することが知られている。そのため、LEDの発光により、蛍光体が長期間又は高出力の光に曝されると、発光効率が低下するだけなく、発光波長が変化し、光色の色合いが変化してしまう虞がある。特に、近年では、LEDを用いた発光装置が、照明器具用光源として利用され、発光装置の高出力化が進んでおり、蛍光体に対する負荷も大きくなっている。そのため、蛍光体の周囲の温度上昇を抑制することが、発光装置の信頼性を確保する上で必要となる。   However, it is known that the conversion efficiency of the phosphor decreases as the ambient temperature increases. Therefore, when the phosphor is exposed to light of a long period or high output due to light emission of the LED, not only the light emission efficiency is lowered, but also the light emission wavelength is changed, and the light color may be changed. In particular, in recent years, light emitting devices using LEDs have been used as light sources for lighting fixtures, and the output of light emitting devices has been increasing, and the load on the phosphor has also increased. Therefore, it is necessary to suppress the temperature rise around the phosphor in order to ensure the reliability of the light emitting device.

そこで、絶縁性の放熱部材上に導体配線をパターニングし、この上にLEDをフリップチップ実装することにより、LEDからの熱が効率的に放熱されるようにした発光装置が知られている(例えば、特許文献1参照)。   Therefore, a light emitting device is known in which a conductor wiring is patterned on an insulating heat dissipation member, and an LED is flip-chip mounted thereon, so that heat from the LED is efficiently radiated (for example, , See Patent Document 1).

特開2008−16583号公報JP 2008-16583 A

しかしながら、蛍光体は、LEDからの出射光の波長を変換する際に、励起されてそれ自体が発熱する。ところが、上記特許文献1に記載の発光装置では、LEDの熱を効果的に放熱できるものの、波長変換部に含有される蛍光体の熱を放熱するには適していない。   However, when the wavelength of the light emitted from the LED is converted, the phosphor is excited to generate heat. However, although the light emitting device described in Patent Document 1 can effectively dissipate the heat of the LED, it is not suitable for dissipating the heat of the phosphor contained in the wavelength conversion unit.

また、発光色が異なる複数種のLED発光部を用いて、照射光の色度を可変とした照明装置においては、LED発光部の出力差や、蛍光体の発熱特性の違いにより、温度にばらつきが生じ易くなる。そのため、このような複数種のLED発光部を用いた発光装置では、照射光の色度が設定された色度にならなかったり、色ムラを生じる虞がある。   In addition, in a lighting device in which the chromaticity of irradiated light is variable using a plurality of types of LED light emitting units having different emission colors, the temperature varies depending on the output difference of the LED light emitting unit and the heat generation characteristics of the phosphor. Is likely to occur. For this reason, in such a light emitting device using a plurality of types of LED light emitting units, there is a possibility that the chromaticity of the irradiation light does not become the set chromaticity or color unevenness occurs.

本発明は、上記課題に鑑みてなされたものであり、発光色が異なる複数種のLED発光部を用いた構成において、蛍光体を含有する波長変換部の熱を、効率的に放熱することができる発光装置、及びそれを用いた照明装置を提供することを目的とする。   This invention is made | formed in view of the said subject, In the structure using several types of LED light emission part from which luminescent color differs, it can thermally radiate | emit the heat | fever of the wavelength conversion part containing a fluorescent substance efficiently. An object of the present invention is to provide a light-emitting device that can be used and a lighting device using the same.

上記課題を解決するため、本発明に係る発光装置は、互いに発光色の異なる複数種の発光部と、前記複数種の発光部が搭載される基板と、前記複数種の発光部に共通して設けられる透光性カバーと、を備え、前記複数種の発光部の各々は、同一種の固体発光素子と、前記固体発光素子を夫々被覆して各固体発光素子からの出射光の波長を各発光部間で互いに異なる波長に変換する波長変換部と、を有し、前記透光性カバーは、前記複数種の波長変換部の光出射面に共通して接し、前記固体発光素子及び波長変換部から発生した熱を放熱することを特徴とする。   In order to solve the above problems, a light emitting device according to the present invention is commonly used for a plurality of types of light emitting units having different emission colors, a substrate on which the plurality of types of light emitting units are mounted, and the plurality of types of light emitting units. Each of the plurality of types of light-emitting portions each covering the same type of solid-state light-emitting element and the solid-state light-emitting element, and changing the wavelength of light emitted from each solid-state light-emitting element. A wavelength converting unit that converts the light emitting units to wavelengths different from each other, and the translucent cover is in common contact with a light emission surface of the plurality of types of wavelength converting units, and the solid-state light emitting element and the wavelength converting unit The heat generated from the part is dissipated.

上記発光装置において、前記透光性カバーは、ガラス素材によって構成されることが好ましい。   In the light-emitting device, the translucent cover is preferably made of a glass material.

上記発光装置において、前記複数種の発光部、前記基板及び前記透光性カバーを収容するケースを更に備え、前記ケースは、熱伝導性の高い材料から形成され、前記透光性カバーの周縁と接していることが好ましい。   The light emitting device may further include a case that accommodates the plurality of types of light emitting units, the substrate, and the translucent cover, and the case is formed of a material having high thermal conductivity, and the periphery of the translucent cover It is preferable to contact.

上記発光装置において、前記複数種の発光部は、赤色光を出射する赤色発光部と、緑色光を出射する緑色発光部と、青色光を出射する青色発光部と、を有し、前記赤色発光部が、前記緑色発光部及び青色発光部よりも前記基板の周縁に近接する位置に搭載されていることが好ましい。   In the light emitting device, the plurality of types of light emitting units include a red light emitting unit that emits red light, a green light emitting unit that emits green light, and a blue light emitting unit that emits blue light, and the red light emitting unit. The part is preferably mounted at a position closer to the periphery of the substrate than the green light emitting part and the blue light emitting part.

上記発光装置において、前記透光性カバーは、前記複数種の波長変換部の光出射面の全面及び前記基板の発光部が搭載される面を被覆していることが好ましい。   In the light emitting device, it is preferable that the translucent cover covers the entire surface of the light emitting surface of the plurality of types of wavelength conversion units and the surface on which the light emitting unit of the substrate is mounted.

上記発光装置は、照明装置に用いられることが好ましい。   The light emitting device is preferably used for a lighting device.

本発明によれば、発光部の出力差や蛍光体の発熱特性の違いがあっても、波長変換部材と接する透光性カバーによって熱を効率的に拡散、放熱することができる。従って、発光部間の温度ばらつきが生じ難くなり、照射光の色ムラを抑制することができる。   According to the present invention, even if there is a difference in output of the light emitting part or a difference in heat generation characteristics of the phosphor, heat can be efficiently diffused and radiated by the translucent cover in contact with the wavelength conversion member. Therefore, temperature variations between the light emitting portions are less likely to occur, and color unevenness of the irradiated light can be suppressed.

本発明の一実施形態に係る発光装置の構成図。The block diagram of the light-emitting device which concerns on one Embodiment of this invention. 同発光装置の一部分解斜視図。The partially exploded perspective view of the light-emitting device. 図2のA−A線側断面図。FIG. 3 is a side sectional view taken along line AA in FIG. 2. 同発光装置を照明装置に適用した構成を示す側断面図。FIG. 3 is a side sectional view showing a configuration in which the light emitting device is applied to a lighting device. 上記実施形態の変形例に係る発光装置の一部分解斜視図。The partially exploded perspective view of the light-emitting device which concerns on the modification of the said embodiment. 図5のA−A線側断面図。FIG. 6 is a side sectional view taken along line AA in FIG. 5.

本発明の一の実施形態に係る発光装置について、図1〜図4を参照して説明する。本実施形態の発光装置1は、図1に示されるように、光源として固体発光素子(以下、LED)を用いた複数種の発光部2と、所定の色度を設定する色度設定部3と、発光部2の光出力を色度設定部3によって設定された色度に調整する制御部4と、を備える。本実施形態においては、発光部2は、夫々色度の異なる光を出射するように構成された少なくとも3つ、ここでは赤色光を出射する赤色発光部2Rと、緑色光を出射する緑色発光部2Gと、青色光を出射する青色発光部2Bと、の3種が用いられた構成を示す。なお、以下の説明では、これら3種の発光部2R,2G,2Bについて、特に光色を限定しないときは、単に発光部2という。   A light emitting device according to an embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, the light emitting device 1 of the present embodiment includes a plurality of types of light emitting units 2 using solid light emitting elements (hereinafter referred to as LEDs) as light sources, and a chromaticity setting unit 3 that sets a predetermined chromaticity. And a control unit 4 that adjusts the light output of the light emitting unit 2 to the chromaticity set by the chromaticity setting unit 3. In the present embodiment, the light emitting unit 2 includes at least three light emitting units each configured to emit light having different chromaticities, here, a red light emitting unit 2R that emits red light, and a green light emitting unit that emits green light. A configuration in which three types of 2G and a blue light emitting unit 2B that emits blue light are used is shown. In the following description, these three types of light emitting units 2R, 2G, and 2B are simply referred to as the light emitting unit 2 when the light color is not particularly limited.

各発光部2は、夫々複数個がパッケージとして基板5に搭載される。なお、図例では、赤色発光部2R、緑色発光部2Gが夫々4つ、青色発光部2Bが5つ用いられた構成を示すが、各発光部2の個数はこの例に限られず、また、4種以上の発光部2が用いられてもよい。基板5には、同種の発光部2に用いられるLEDが直列に接続されるように、配線回路51R,51G,51Bが形成されている。   A plurality of each light emitting unit 2 is mounted on the substrate 5 as a package. In the illustrated example, four red light emitting units 2R and four green light emitting units 2G and five blue light emitting units 2B are used, but the number of each light emitting unit 2 is not limited to this example, Four or more types of light emitting units 2 may be used. Wiring circuits 51R, 51G, and 51B are formed on the substrate 5 so that LEDs used in the light emitting unit 2 of the same type are connected in series.

色度設定部3は、各発光部2の出射光を混色した混色光、すなわち発光装置1の照射光の色温度を所定の値に設定するためのボリュームコントローラ31を備える。ボリュームコントローラ31は、ユーザによる摘みの回転操作によって、発光装置1をオフ状態からオン状態へ切り替え、回転範囲に応じて発光装置1の光出力を変化させる。また、ボリュームコントローラ31は、発光装置1がオン状態となって光出力が小さい間は低い色温度の光を照射し、摘みを更に回転させることによって、光出力を大きくすると共に、漸次的に低い色温度から高い色温度の光を照射する調光操作を可能とする。   The chromaticity setting unit 3 includes a volume controller 31 for setting the color temperature of the emitted light of each light emitting unit 2, that is, the color temperature of the irradiation light of the light emitting device 1 to a predetermined value. The volume controller 31 switches the light emitting device 1 from the off state to the on state by a rotation operation of the knob by the user, and changes the light output of the light emitting device 1 according to the rotation range. Further, the volume controller 31 emits light of a low color temperature while the light emitting device 1 is in the on state and the light output is small, and further increases the light output by further rotating the knob, and gradually decreases. A light control operation for irradiating light with a color temperature higher than the color temperature is enabled.

ボリュームコントローラ31によって所定の色温度が入力されると、色度設定部3は、入力された色温度における黒体放射軌跡上の色度、つまり、この色温度における色度図上の等色温度線と黒体放射軌跡との交点座標を、設定された色度(以下、設定色度)とする。また、色度設定部3は、設定色度の制御情報を含むduty信号を制御部4へ出力する。   When a predetermined color temperature is input by the volume controller 31, the chromaticity setting unit 3 causes the chromaticity on the black body radiation locus at the input color temperature, that is, the equal color temperature on the chromaticity diagram at this color temperature. The intersection coordinates of the line and the black body radiation locus are set to the set chromaticity (hereinafter, set chromaticity). Further, the chromaticity setting unit 3 outputs a duty signal including control information on the set chromaticity to the control unit 4.

制御部4は、発光装置1を点灯させる電源ユニット(不図示)に組み込まれており、各発光部2のパッケージの種類に応じた複数の出力端子(図例では、出力R,G,B)を備える。また、制御部4は、商用電源(不図示)からの給電を受けてこれを所定の直流電流に変換すると共に、色度設定部3からのduty信号に対応するよう各発光部2R,2G,2Bを調光制御するための印加する電圧を制御する整流変圧回路(不図示)を有する。各出力(端子)R,G,Bは、配線41R,41G,41Bによって夫々配線回路51R,51G,51Bに接続される。   The control unit 4 is incorporated in a power supply unit (not shown) for lighting the light emitting device 1, and has a plurality of output terminals (in the example shown, outputs R, G, B) corresponding to the type of package of each light emitting unit 2. Is provided. The control unit 4 receives power from a commercial power source (not shown) and converts it into a predetermined direct current, and also emits light from the light emitting units 2R, 2G, and so on corresponding to the duty signal from the chromaticity setting unit 3. It has a rectification transformer circuit (not shown) for controlling the voltage to be applied for dimming control of 2B. Each output (terminal) R, G, B is connected to wiring circuits 51R, 51G, 51B by wiring 41R, 41G, 41B, respectively.

図2及び図3に示すように、発光装置1は、基板5を保持する枠体6と、各発光部2に共通して設けられる透光性カバー7と、を更に備える。枠体6は、一面に開口を有する有底円筒形状の構造部材であり、熱伝導性の高い金属材料又はフィラー等を添加して熱伝導性を高めた樹脂材料等によって形成される。   As shown in FIGS. 2 and 3, the light emitting device 1 further includes a frame body 6 that holds the substrate 5 and a translucent cover 7 that is provided in common to the respective light emitting units 2. The frame body 6 is a bottomed cylindrical structural member having an opening on one surface, and is formed of a resin material or the like that is enhanced in thermal conductivity by adding a metal material or filler that has high thermal conductivity.

各発光部2の各々は、同一種のLED21と、これらのLED21を夫々被覆して各LED21からの出射光の波長を各発光部2間で互いに異なる波長に変換する波長変換部22R,22G,22B(総称して、22)と、を有する。LED21には、いずれも発光色が同じであり、好ましくは、近紫外〜青色波長領域の光を出射する汎用の窒化物半導体が用いられる。各発光部2に同一種のLED21を用いれば、部品調達費を抑制することができる。また、波長変換部22R,22G,22Bの配置や個数を変えることにより、照射光の色温度を広い範囲で変更することができる。   Each of the light emitting units 2 includes the same type of LEDs 21 and wavelength conversion units 22R, 22G, which cover these LEDs 21 and convert the wavelengths of light emitted from the LEDs 21 to different wavelengths between the light emitting units 2, respectively. 22B (collectively 22). The LEDs 21 have the same luminescent color, and a general-purpose nitride semiconductor that emits light in the near ultraviolet to blue wavelength region is preferably used. If the same type of LED 21 is used for each light emitting unit 2, component procurement costs can be reduced. Moreover, the color temperature of irradiation light can be changed in a wide range by changing the arrangement and number of the wavelength conversion units 22R, 22G, and 22B.

透光性樹脂材料に、LED21の出射光の波長を変換する蛍光体が含有され、この蛍光体含有樹脂材料をLED21の出射面に被覆させることにより形成される。このとき、赤色発光部2Rには、LED21の出射光の波長を赤色波長領域の光に変換する赤色蛍光体(例えばCASN蛍光体(CaAlSiN:Eu等))が用いられる。緑色発光部2Gには、LED21の出射光の波長を緑色波長領域の光に変換する緑色蛍光体(例えばCSO蛍光体(CaSc:Ce等))が用いられる。青色発光部2Bには、用いられるLED21自体が青色光を出射し、この青色光の色度が所定の色度範囲にあれば、必ずしも蛍光体は要しない。また、LED21が近紫外〜紫色光を出射するものであれば、LED21の出射光の波長を青色波長領域の光に変換する青色蛍光体(例えば、BAM:Eu,Mn蛍光体等)が用いられる。一方、LED21自体が青色光を出射するものであっても、この青色光の色度が所定の色度範囲になければ、色度調整用の青色蛍光体が用いられる。 The translucent resin material contains a phosphor that converts the wavelength of the emitted light from the LED 21, and the phosphor-containing resin material is coated on the emitting surface of the LED 21. At this time, a red phosphor (for example, CASN phosphor (CaAlSiN 3 : Eu, etc.)) that converts the wavelength of the light emitted from the LED 21 into light in the red wavelength region is used for the red light emitting unit 2R. A green phosphor (for example, a CSO phosphor (CaSc 2 O 4 : Ce, etc.)) that converts the wavelength of light emitted from the LED 21 into light in the green wavelength region is used for the green light emitting unit 2G. If the LED 21 itself used emits blue light and the chromaticity of the blue light is within a predetermined chromaticity range, the phosphor is not necessarily required for the blue light emitting unit 2B. Further, if the LED 21 emits near-ultraviolet to violet light, a blue phosphor (for example, BAM: Eu, Mn phosphor or the like) that converts the wavelength of the emitted light of the LED 21 into light in the blue wavelength region is used. . On the other hand, even if the LED 21 itself emits blue light, if the chromaticity of the blue light is not within a predetermined chromaticity range, a blue phosphor for chromaticity adjustment is used.

このように構成された各発光部2は、基板5の略中央領域に青色発光部2Bが、その周辺に緑色発光部2G及び青色発光部2Bが配される。好ましくは、赤色発光部2Rが、緑色発光部2G及び青色発光部2Bよりも基板5の周縁に近接する位置に搭載される。   In each of the light emitting units 2 configured as described above, the blue light emitting unit 2B is disposed in a substantially central region of the substrate 5, and the green light emitting unit 2G and the blue light emitting unit 2B are disposed in the vicinity thereof. Preferably, the red light emitting unit 2R is mounted at a position closer to the periphery of the substrate 5 than the green light emitting unit 2G and the blue light emitting unit 2B.

透光性カバー7は、各波長変換部22R,22G,22Bの光出射面に共通して接し、LED21及び各波長変換部22R,22G,22Bから発生した熱を放熱する。透光性カバー7は、枠体6の開口に嵌り込んで各波長変換部22R,22G,22Bの光出射面に接するカバー本体71と、カバー本体71の周縁に設けられた鍔部72と、を有する。鍔部72は、枠体6の開口縁と接し、カバー本体71の発光部2側の面と基板5との間に所定の隙間が形成されるように、透光性カバー7を保持する。また、鍔部72は、その外径が枠体6の外径と一致するように形成される。この透光性カバー7は、熱伝導性の高いガラス素材によって構成される。   The translucent cover 7 is in common contact with the light emitting surfaces of the wavelength conversion units 22R, 22G, and 22B, and dissipates heat generated from the LEDs 21 and the wavelength conversion units 22R, 22G, and 22B. The translucent cover 7 is fitted into the opening of the frame body 6 so as to be in contact with the light emitting surface of each of the wavelength conversion units 22R, 22G, and 22B, a collar portion 72 provided on the periphery of the cover main body 71, Have The flange 72 is in contact with the opening edge of the frame 6 and holds the translucent cover 7 so that a predetermined gap is formed between the surface of the cover body 71 on the light emitting unit 2 side and the substrate 5. Further, the flange 72 is formed so that the outer diameter thereof matches the outer diameter of the frame body 6. The translucent cover 7 is made of a glass material having high thermal conductivity.

基板5は、汎用の発光モジュール用の基板であり、例えば、酸化アルミニウム(Al)や窒化アルミニウム(AlN)等の電気絶縁性を有する金属酸化物(セラミックスを含む)、金属窒化物、又は金属、樹脂、ガラス繊維等の材料から構成される。基板5にに形成された配線回路51(図1参照)は、絶縁材料によって被覆され、発光部2の各LED21の各正負電極と接続される箇所及び配線41R,41G,41Bと接続される箇所が夫々電極端子として露出している(不図示)。 The substrate 5 is a substrate for a general-purpose light emitting module. For example, a metal oxide (including ceramics) having electrical insulating properties such as aluminum oxide (Al 2 O 3 ) or aluminum nitride (AlN), a metal nitride, Or it is comprised from materials, such as a metal, resin, and glass fiber. The wiring circuit 51 (see FIG. 1) formed on the substrate 5 is covered with an insulating material and connected to the positive and negative electrodes of the LEDs 21 of the light emitting unit 2 and connected to the wirings 41R, 41G, and 41B. Are exposed as electrode terminals (not shown).

LED21は、発光面とは反対側に電極端子(不図示)が設けられており、基板5に形成された配線回路51上にフリップチップ実装される。LED21が実装された基板5は、枠体6に取り付けられ、この状態で、各種蛍光体を含有する透光性樹脂がディスペンサ等によってLED21の発光面上に塗布される。塗布量は、複数のLED21間の間隔及び基板5と透光性カバー7との間に形成される隙間の高さを考慮して設定される。そして、透光性樹脂が硬化する前に、透光性カバー7が枠体6の開口に嵌め込まれる。このとき、透光性樹脂は、透光性カバー7によって押し潰され、その上面が平坦になった状態で硬化する。これにより、その上面(光出射面)が透光性カバー7に接する略円錐台形状の波長変換部22が形成される。なお、発光面側に電極端子が設けられたLEDを用いて、LEDをワイヤボンディングにより実装してもよいが、この場合、ワイヤが透光性カバー7に接触しないように、その長さや撓みを正確に制御する必要がある。   The LED 21 is provided with an electrode terminal (not shown) on the side opposite to the light emitting surface, and is flip-chip mounted on a wiring circuit 51 formed on the substrate 5. The substrate 5 on which the LED 21 is mounted is attached to the frame body 6, and in this state, a translucent resin containing various phosphors is applied onto the light emitting surface of the LED 21 by a dispenser or the like. The application amount is set in consideration of the interval between the plurality of LEDs 21 and the height of the gap formed between the substrate 5 and the translucent cover 7. Then, the translucent cover 7 is fitted into the opening of the frame 6 before the translucent resin is cured. At this time, the translucent resin is crushed by the translucent cover 7 and cured in a state where the upper surface thereof is flat. Thereby, the substantially frustoconical wavelength converter 22 whose upper surface (light emitting surface) is in contact with the translucent cover 7 is formed. In addition, although you may mount LED by wire bonding using LED with which the electrode terminal was provided in the light emission surface side, in this case, the length and the bending are carried out so that a wire may not contact translucent cover 7. It needs to be controlled accurately.

この構成によれば、波長変換部22の蛍光体の熱が、透光性カバー7に伝わって、大気及び枠体6に放熱されるので、波長変換部22の温度上昇を抑制することができる。その結果、波長変換部22に含まれる蛍光体の波長変換特性の機能低下が抑制され、照射光の色度を所望の色度にすることができる。また、この透光性カバー7が各発光部2と接しているので、発光部2の出力差や蛍光体の発熱特性の違いがあっても、透光性カバー7によって熱が拡散される。その結果、発光部2間の温度ばらつきが生じ難くなり、照明装置1の照射光の色ムラを抑制することができる。   According to this configuration, the heat of the phosphor of the wavelength conversion unit 22 is transmitted to the translucent cover 7 and is radiated to the atmosphere and the frame 6, so that the temperature increase of the wavelength conversion unit 22 can be suppressed. . As a result, the function deterioration of the wavelength conversion characteristic of the phosphor included in the wavelength conversion unit 22 is suppressed, and the chromaticity of the irradiation light can be set to a desired chromaticity. In addition, since the translucent cover 7 is in contact with each light emitting unit 2, heat is diffused by the translucent cover 7 even if there is a difference in output of the light emitting unit 2 or a difference in heat generation characteristics of the phosphor. As a result, temperature variations between the light emitting units 2 are less likely to occur, and color unevenness of the irradiation light of the lighting device 1 can be suppressed.

また、赤色発光部2Rは、緑色発光部2G及び青色発光部2Bよりも基板5の周縁に近接する位置に搭載されている。一般に赤色蛍光体は、温度上昇により波長変換効率が低下し易い。これに対して、上記構成によれば、赤色蛍光体の熱が、透光性カバー7から枠体6へ電熱され易いので、赤色蛍光体の温度上昇をより効率的に抑制することができる。その結果、赤色発光部2Rが長時間点灯制御されたときでも、赤色蛍光体の機能低下を抑制することができ、長期間に亘って照射光の色度を所望の色度にすることができる。   The red light emitting unit 2R is mounted at a position closer to the periphery of the substrate 5 than the green light emitting unit 2G and the blue light emitting unit 2B. In general, the wavelength conversion efficiency of red phosphors is likely to decrease due to temperature rise. On the other hand, according to the said structure, since the heat | fever of a red fluorescent substance is easy to be electrically heated from the translucent cover 7 to the frame 6, the temperature rise of a red fluorescent substance can be suppressed more efficiently. As a result, even when the red light emitting unit 2R is controlled to be lit for a long time, it is possible to suppress the deterioration of the function of the red phosphor, and the chromaticity of the irradiation light can be set to a desired chromaticity over a long period. .

発光装置1が、照明装置として用いられるときには、各発光部2、基板5及び透光性カバー7を収容するケース8と、枠体6及びケース8を保持するダイキャスト9と、が備えられる。ケース8は、その内周が枠体6及び透光性カバー7の外周と接するように形成された筒状部材であり、枠体6と同様に、熱伝導性の高い材料から形成される。すなわち、ケース8の内周が、透光性カバー7の周縁と接している。ダイキャスト9は、放熱性の高いアルミ等の金属により形成され、放熱性を高めるために、複数のフィンが設けられている。この構成によれば、波長変換部22の熱を、透光性カバー7、ケース8及びダイキャスト9を介して、より効率的に放熱することができる。なお、図3及び図4では、放熱方向を点線矢印で示している。   When the light emitting device 1 is used as a lighting device, a case 8 that accommodates each light emitting section 2, the substrate 5, and the translucent cover 7, and a die cast 9 that holds the frame 6 and the case 8 are provided. The case 8 is a cylindrical member formed so that the inner periphery thereof is in contact with the outer periphery of the frame body 6 and the translucent cover 7, and is formed of a material having high thermal conductivity, like the frame body 6. That is, the inner periphery of the case 8 is in contact with the peripheral edge of the translucent cover 7. The die-cast 9 is made of a metal such as aluminum having a high heat dissipation property, and a plurality of fins are provided in order to improve the heat dissipation property. According to this configuration, the heat of the wavelength conversion unit 22 can be radiated more efficiently through the translucent cover 7, the case 8, and the die cast 9. 3 and 4, the heat radiation direction is indicated by a dotted arrow.

次に、上記実施形態の変形例に係る発光装置について、図5及び図6を参照して説明する。この変形例の発光装置1は、透光性カバー7は、複数種の波長変換部22の光出射面の全面及び基板5の発光部2がを搭載される面を被覆しているものである。具体的には、透光性カバー7のカバー本体71の基板5側の面の、各LED21と対応する位置に、波長変換部22が嵌る凹部73が形成されている。   Next, a light emitting device according to a modification of the above embodiment will be described with reference to FIGS. In the light emitting device 1 of this modification, the translucent cover 7 covers the entire surface of the light emitting surface of the plurality of types of wavelength conversion units 22 and the surface on which the light emitting unit 2 of the substrate 5 is mounted. . Specifically, a recess 73 into which the wavelength conversion unit 22 is fitted is formed at a position corresponding to each LED 21 on the surface of the cover body 71 of the translucent cover 7 on the substrate 5 side.

この変形例によれば、波長変換部22と透光性カバー7との接触面積が大きくなり、また、透光性カバー7が基板5にも接しているので、波長変換部22の熱を、基板5を介して、より効率的に放熱することができる。   According to this modification, the contact area between the wavelength conversion unit 22 and the translucent cover 7 is increased, and the translucent cover 7 is also in contact with the substrate 5. Heat can be radiated more efficiently through the substrate 5.

また、この変形例においては、透光性カバー7に形成された凹部73に、各種蛍光体を含有させた透光性樹脂を充填し、透光性樹脂が硬化する前にここに基板5と共にLED22を差し込むことにより、波長変換部22を形成することができる。上述したような、LED21上に塗布することで波長変換部22を形成する場合、樹脂の流動性を制御することが容易でなかった。すなわち、樹脂の流動性が高すぎると、塗布した際に、隣り合うLED21に樹脂が流れてしまうことがあり、流動性が低すぎると、透光性カバー7との密着性が悪くなることがある。これに対して、この変形例によれば、樹脂の流動性によらず、波長変換部22を容易に形成することができる。   Further, in this modification, the recess 73 formed in the translucent cover 7 is filled with a translucent resin containing various phosphors, and the substrate 5 is placed here before the translucent resin is cured. The wavelength converter 22 can be formed by inserting the LED 22. When forming the wavelength conversion part 22 by apply | coating on LED21 as mentioned above, it was not easy to control the fluidity | liquidity of resin. That is, if the fluidity of the resin is too high, the resin may flow to the adjacent LED 21 when applied, and if the fluidity is too low, the adhesiveness with the translucent cover 7 may deteriorate. is there. On the other hand, according to this modification, the wavelength converter 22 can be easily formed regardless of the fluidity of the resin.

なお、本発明は、上記実施形態に限らず、種々の変形が可能である。上記実施形態においては、青、緑、赤の3種の発光部を用いた構成を示したが、例えば、青色LEDに黄色蛍光体を被覆した所謂白色LEDを用いた白色発光部を更に追加してもよい。白色LEDとしては、例えば、米国で規定されたLED色度規定(ANSI規格)に準じたLEDユニットは、色度のばらつきが黒体軌跡から所定の範囲内に収まるように構成されている。従って、例えば、発光装置1において、使用頻度の高い色度については、上記規定に準じたLEDユニットを市場から入手して用いれば、発光装置1の製造効率がよくなり、また他の発光部2のLED21の負荷を低減することができる。   In addition, this invention is not restricted to the said embodiment, A various deformation | transformation is possible. In the above embodiment, a configuration using three types of light emitting units of blue, green, and red is shown. For example, a white light emitting unit using a so-called white LED in which a blue phosphor is coated with a yellow phosphor is further added. May be. As the white LED, for example, an LED unit conforming to LED chromaticity regulations (ANSI standards) defined in the United States is configured such that variations in chromaticity are within a predetermined range from a black body locus. Therefore, for example, in the light emitting device 1, for chromaticity that is frequently used, if an LED unit conforming to the above regulations is obtained from the market and used, the manufacturing efficiency of the light emitting device 1 is improved, and other light emitting units 2 are used. The load on the LED 21 can be reduced.

1 発光装置
2 発光部
2R 赤色発光部
2G 緑色発光部
2B 青色発光部
21 LED(固体発光素子)
22R、22G、22B(22) 波長変換部
4 透光性カバー
5 基板
8 ケース
DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 Light-emitting part 2R Red light-emitting part 2G Green light-emitting part 2B Blue light-emitting part 21 LED (solid-state light emitting element)
22R, 22G, 22B (22) Wavelength converter 4 Translucent cover 5 Substrate 8 Case

Claims (6)

互いに発光色の異なる複数種の発光部と、前記複数種の発光部が搭載される基板と、前記複数種の発光部に共通して設けられる透光性カバーと、を備えた発光装置であって、
前記複数種の発光部の各々は、同一種の固体発光素子と、前記固体発光素子を夫々被覆して各固体発光素子からの出射光の波長を各発光部間で互いに異なる波長に変換する波長変換部と、を有し、
前記透光性カバーは、前記複数種の波長変換部の光出射面に共通して接し、前記固体発光素子及び波長変換部から発生した熱を放熱することを特徴とする発光装置。
A light emitting device comprising: a plurality of types of light emitting units having different emission colors; a substrate on which the plurality of types of light emitting units are mounted; and a translucent cover provided in common to the plurality of types of light emitting units. And
Each of the plurality of types of light emitting units includes the same type of solid state light emitting element and a wavelength that covers the solid state light emitting element and converts the wavelength of light emitted from each solid state light emitting element to a different wavelength between the respective light emitting units. A conversion unit,
The light-transmitting cover is in common contact with a light emitting surface of the plurality of types of wavelength conversion units, and dissipates heat generated from the solid light emitting element and the wavelength conversion unit.
前記透光性カバーは、ガラス素材によって構成されることを特徴とする請求項1に記載の発光装置。   The light-emitting device according to claim 1, wherein the translucent cover is made of a glass material. 前記複数種の発光部、前記基板及び前記透光性カバーを収容するケースを更に備え、
前記ケースは、熱伝導性の高い材料から形成され、前記透光性カバーの周縁と接していることを特徴とする請求項1又は請求項2に記載の発光装置。
A case for accommodating the plurality of types of light emitting units, the substrate, and the translucent cover;
The light emitting device according to claim 1, wherein the case is made of a material having high thermal conductivity and is in contact with a peripheral edge of the translucent cover.
前記複数種の発光部は、赤色光を出射する赤色発光部と、緑色光を出射する緑色発光部と、青色光を出射する青色発光部と、を有し、
前記赤色発光部が、前記緑色発光部及び青色発光部よりも前記基板の周縁に近接する位置に搭載されていることを特徴とする請求項1乃至請求項3のいずれか一項に記載の発光装置。
The plurality of types of light emitting units include a red light emitting unit that emits red light, a green light emitting unit that emits green light, and a blue light emitting unit that emits blue light,
The light emission according to any one of claims 1 to 3, wherein the red light emitting unit is mounted at a position closer to a periphery of the substrate than the green light emitting unit and the blue light emitting unit. apparatus.
前記透光性カバーは、前記複数種の波長変換部の光出射面の全面及び前記基板の発光部が搭載される面を被覆していることを特徴とする請求項1乃至請求項4のいずれか一項に記載の発光装置。   The said translucent cover has coat | covered the surface in which the light emission part of the said board | substrate and the light emission part of the said multiple types of wavelength conversion part are mounted, The one of Claim 1 thru | or 4 characterized by the above-mentioned. A light-emitting device according to claim 1. 請求項1乃至請求項5のいずれかに一項に記載の発光装置を用いた照明装置。   An illumination device using the light emitting device according to any one of claims 1 to 5.
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CN105276462A (en) * 2014-07-17 2016-01-27 付建中 Light-emitting diode (LED) ceiling lamp capable of transferring and dissipating heat based on lampshade
CN105276462B (en) * 2014-07-17 2020-10-30 芜湖晶鑫光电照明有限公司 LED ceiling lamp based on lamp shade conduction heat dissipation
US10283679B2 (en) 2014-08-06 2019-05-07 Nichia Corporation Light emitting device and light source module
JP2017034218A (en) * 2015-08-03 2017-02-09 株式会社東芝 Semiconductor light-emitting device
US10151443B2 (en) 2015-08-31 2018-12-11 Panasonic Intellectual Property Management Co., Ltd. LED module and light fixture with the same
CN107887371A (en) * 2017-11-10 2018-04-06 江西新月光电有限公司 It is easy to control the LED wiring constructions of light effect
JP2021506108A (en) * 2017-12-04 2021-02-18 トンシュー グループ カンパニー リミテッドTunghsu Group Co., Ltd. Top board for micro LED devices, micro LED devices and micro LED display devices
US11545607B2 (en) 2017-12-04 2023-01-03 Tunghsu Group Co., Ltd. Upper substrate for miniature LED component, miniature LED component, and miniature LED display device
JPWO2022163528A1 (en) * 2021-01-29 2022-08-04
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