JP2013182900A - Lamp and illuminating device - Google Patents

Abstract

A lamp capable of improving luminance by securing a new heat radiation path is provided.
A lamp 1 includes an LED module 505 having an LED chip (semiconductor light emitting element) 22 and a phase change between a gas phase and a liquid phase or a phase change between a solid phase and a liquid phase while the LED module 505 is turned on. And a heat transfer material 670 that forms a material circulation path and transfers heat generated by the LED module 505 to the base 61 side (low temperature region) of the cylindrical member 640.
[Selection] Figure 1

Description

  The present invention relates to a lamp using a semiconductor light emitting element and an illuminating device using the lamp, and more particularly to improving heat dissipation of the semiconductor light emitting element.

2. Description of the Related Art In recent years, light emitting diodes (LEDs) have been used as lamp applications because they have achieved a certain level of light output and luminous efficiency.
By the way, since the luminous efficiency of the LED decreases when the temperature rises, the brightness decreases even if the supplied power is the same if the temperature is high. Therefore, in the lamp using this LED, in order to suppress the temperature rise of the LED, improvement of the heat dissipation characteristic of the lamp is required.

In particular, as a lighting manufacturer, the value cannot be improved beyond the luminous efficiency of the LED module (LED element) produced by the device manufacturer. Therefore, under such circumstances, it is important to improve the heat dissipation characteristics of the lamp.
In contrast, conventionally, the heat generated in the LED module is mainly conducted to the housing and the base, and then released from the outer surface of the housing to the outside, or from the base to the luminaire side through the socket. There has been proposed a lamp to be discharged (see Patent Document 1).

JP 2006-313717 A

  However, in the technique described in Patent Document 1, when the power supplied to the LED module is increased to improve the luminance beyond a certain level, the heat dissipation is not sufficient, and the temperature rise of the LED cannot be sufficiently suppressed, The luminous efficiency of the LED is reduced. Therefore, in order to improve the luminance, it is necessary to increase the heat dissipation path of the lamp from the base to the lighting fixture through the socket, or to secure a new heat dissipation path.

  The present invention has been made in view of the above reasons, and an object of the present invention is to provide a lamp capable of achieving high output, that is, further improving luminance by securing a new heat radiation path.

  In order to achieve the above object, a lamp according to the present invention includes a gas phase between an LED module having a semiconductor light emitting element and a base thermally coupled to a housing portion during lighting of the LED module. A heat transfer material that forms a material circulation path using a phase change between the liquid phases or a phase change between the solid phase and the liquid phase is sealed in the container wall.

  According to this configuration, during the lighting of the LED module, a material circulation path is formed using the phase change between the gas phase and the liquid phase or the phase change between the solid phase and the liquid phase, and the heat generated in the LED module is generated. Equipped with a heat transfer material that transmits heat to low temperatures. Therefore, the heat generated in the LED module is transferred to the low temperature region of the path through the material circulation path in which the phase change between the gas phase and the liquid phase by the heat transfer material or the phase change between the solid phase and the liquid phase is involved. The heat transferred to the low-temperature region of the wall is further guided to the outside of the housing by heat conduction through the base. Thereby, even if it raises an output, since the temperature rise of an LED module can be suppressed, the fall of the luminous efficiency of LED can be suppressed and the element destruction of LED can be suppressed. As a result, high output of the LED module can be achieved.

FIG. 3 is a partially broken perspective view of the lamp according to the first embodiment. Sectional drawing of the lamp | ramp which concerns on Embodiment 1. FIG. The LED module which concerns on Embodiment 1 is shown, (a) is a top view, (b) is the A-A 'arrow directional cross-sectional view in (a). The figure for demonstrating the thermal radiation model of the lamp | ramp which concerns on Embodiment 1. FIG. FIG. 4 is a partially cutaway side view of the lighting apparatus according to Embodiment 2. Sectional drawing of the lamp | ramp which concerns on a modification. Sectional drawing of the lamp | ramp which concerns on a modification.

<Embodiment 1>
<1> Configuration The overall configuration of the lamp 1 according to the present embodiment will be described with reference to FIGS. 1 and 2. Here, FIG. 1 is a perspective view of the lamp 1, and FIG. 2 is a cross-sectional view of the lamp 1. A chain line J in FIG. 2 indicates the lamp axis of the lamp 1.

  As shown in FIGS. 1 and 2, a lamp 1 according to the present embodiment is a light bulb-shaped LED lamp that replaces an incandescent light bulb, and receives power from an LED module 505 that is a light source and a bulb 7. A base 11, a support member 17, and a moisture fixing material 570 are provided. Furthermore, the lamp 1 according to the present embodiment includes a case (housing) 9, a pair of lead wires 49 and 51, and a circuit unit 15.

As shown in FIG. 1 and FIG. 2, a light bulb shaped LED lamp in which the LED module 505 is arranged in the center of the lamp 1 and light is emitted in all directions through a light-transmitting bulb 7 is excellent. The lighting psychological effect (a glittering feeling imitating a clear incandescent light bulb) has been accepted by lighting users, and has attracted attention among lighting users.
<1-1> LED Module FIG. 3 is a diagram illustrating the structure of the LED module 505. FIG. 3A is a plan view of the LED module 505, and FIG. 3B is a cross-sectional view taken along the line AA ′ in FIG.

As shown in FIGS. 3A and 3B, the LED module 505 includes a module substrate 521, a plurality of LED chips 22 mounted on the surface of the module substrate 521, and a sealing body that seals the LED chips 22. 23.
The module substrate 521 has a circular shape in plan view, and through holes 26 having a circular shape in plan view are formed in both ends facing each other across the central portion, and a rectangular shape in plan view is formed in the substantially central portion. A hole 25 is formed. Further, on the module substrate 521, the LED chips 22 are electrically connected to each other (in series connection or / and parallel connection), or the LED chip 22 and the circuit unit 15 are electrically connected. A pattern is formed. This wiring pattern includes power supply terminals 24 a and 24 b formed on the outer periphery of each through hole 26. Here, each through-hole 26 is for inserting the end portions of the lead wires 49 and 51 that electrically connect the LED chip 22 and the circuit unit 15. The through hole 25 is used for coupling the module substrate 521 and the support member 17. Details will be described later.

  The module substrate 521 is made of a light-transmitting material so as not to block light emitted backward from the light emitted from the LED chip 22. That is, the module substrate 521 is made of a light-transmitting material so that light emitted from the LED chip 22 on the upper surface side of the module substrate 521 and directed to the module substrate 521 passes through the module substrate 521 and is emitted from the bulb 7 as it is. doing. Examples of the translucent material include glass and alumina. In consideration of utilization of light emitted from the LED chip 22 to the substrate side, the wiring pattern is also preferably made of a light-transmitting material, and such a light-transmitting material includes ITO. In addition, as the module board | substrate 521, you may employ | adopt what consists of a metal plate and the insulating sheet affixed on the surface side in which the LED chip 22 of the said metal plate is mounted, for example.

There are a plurality of LED chips 22, which are arranged on a circular module substrate 521 at intervals (for example, at equal intervals). The LED chip 22 is a so-called blue-violet light emitting diode formed from a GaN-based semiconductor. Note that the number, arrangement, and the like of the LED chips 22 may be appropriately changed depending on the luminance required for the lamp 1.
The sealing body 23 is mainly made of a translucent material. The sealing body 23 has a function of preventing air and moisture from entering the LED chip 22. Here, the LED chip 22 which comprises the said row | line | column is coat | covered by the row | line | column unit by which the several LED chip 22 is distribute | arranged to linear form.

In addition to the function of preventing intrusion of air or the like, the sealing body 23 is capable of converting the wavelength of the light emitted from the LED chip 22 to a wavelength different from the wavelength of the light. It also has a wavelength conversion function for converting wavelengths. The wavelength conversion function can be realized, for example, by mixing a phosphor material into a light transmissive material.
As a translucent material constituting the sealing body 23, for example, a silicone resin can be used. In addition, when the wavelength conversion function is provided, for example, phosphor particles can be used as the conversion material. As described above, when the LED chip 22 emits blue light, when the yellow phosphor particles that convert blue-violet light into yellow light are dispersed in the translucent material, the LED chip 22 is emitted from the LED chip 22. White light mixed with the blue-violet light and the yellow light wavelength-converted by the phosphor particles is emitted. Moreover, in order to improve color rendering properties, phosphor particles of other emission colors may be included.

<1-2> Bulb As shown in FIGS. 1 and 2, the bulb 7 has the same shape as that of an incandescent bulb. Here, the bulb 7 is a so-called A type having a shape similar to that of a general incandescent bulb (bulb having a filament). Note that the shape of the valve 7 is not necessarily the A shape.

The valve 7 includes a hollow spherical portion 7a and a tubular portion 7b. The cylindrical portion 7b is reduced in diameter as it is away from the spherical portion 7a.
The bulb 7 is made of glass which is a light transmissive material. The bulb 7 may be formed of, for example, a translucent resin material or translucent ceramic.
<1-3> Base The base 11 is a member for receiving electric power from the socket of the lighting device when the lamp 1 is attached to the lighting device and turned on. The type of the base 11 is not particularly limited, and examples thereof include Edison type E26 base and E17 base. As shown in FIG. 2, the base 11 includes a shell portion 27 having a substantially cylindrical shape and an outer peripheral surface being a male screw, and an eyelet portion 31 attached to the shell portion 27 via an insulating portion 29. . Here, the lead wire 33 is connected to the shell portion 27, and the lead wire 35 is connected to the eyelet portion 31. Then, the power received by the base 11 is input to the circuit unit 15 via the two lead wires 33 and 35. Further, a screwing portion for screwing into the case 9 is formed on the inner peripheral surface of the base 11.

<1-4> Case (housing)
The case 9 is a case for housing the circuit unit 15. As shown in FIG. 2, the case 9 includes a cylindrical first case portion 9a and a cylindrical second case portion 9b connected to the first case portion 9a.
The first case portion 9a has an inner diameter that is substantially the same as the outer diameter of the valve 7 on the opening 7c side, and the valve 7 is fixed to the upper end portion with an adhesive. Further, a groove 9c is formed at the lower end of the first case portion 9a over the entire circumference of the peripheral wall, and the circuit unit 15 is configured such that a peripheral portion of a circuit board 41 described later is fitted into the groove 9c. Is fixed to the first case portion 9a. Therefore, the heat generated in the circuit unit 15 is conducted from the peripheral portion of the circuit board 41 described later to the first case portion 9a. The outer surface of the first case portion 9a is exposed to the outside air, and heat conducted to the case 9 is released to the outside from the outer surface of the first case portion 9a.

  The second case portion 9b is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the base 11, and a threaded portion for screwing with the base 11 is formed on the outer peripheral surface of the second case portion 9b. ing. The second case portion 9b and the base 11 are in contact with each other by this screwing portion. Therefore, the heat conducted from the circuit unit 15 to the case 9 is also conducted to the base 11 via the second case portion 9 b and is radiated from the outer surface of the base 11. Further, a groove portion 9d into which the leading end portion of the lead wire 33 is fitted is formed in a part of the outer wall of the second case portion 9b.

The case 9 is made of a resin material such as polybutylene terephthalate (PBT). The case 9 is integrally formed by injection molding.
Incidentally, a structure constituted by the valve 7 and the base 61 described below is fixed to the first case portion 9 a of the case 9. This structure is fixed to the first case portion 9a with an adhesive made of a heat-insulating resin material. Thereby, heat generated in the circuit unit 15 and conducted to the case 9 is not conducted to the valve 7 and the base 61. Therefore, the heat generated in the circuit unit 15 can be prevented from being conducted to the LED module 505, and the temperature rise of the LED module 505 can be suppressed.

<1-5> Circuit Unit The circuit unit 15 supplies the power received via the base 11 to the LED module 505. The circuit unit 15 includes a circuit board 41 and various circuit elements 43 mounted on the circuit board 41.
The circuit board 41 is fixed using a locking structure inside the first case portion 9 a of the case 9. Specifically, the peripheral portion of the circuit board 41 is locked to the groove portion 9c inside the first case portion 9a.

  The circuit unit 15 includes a rectifying and smoothing circuit that rectifies and smoothes AC power supplied from the base 11 via the lead wires 33 and 35, and a power conversion circuit that steps up and down the input voltage from the rectifying and smoothing circuit and outputs the boosted voltage to the LED module 505. And. The circuit unit 15 may be configured by appropriately combining other circuits such as a dimming circuit. However, in this embodiment, the circuit unit 15 is not driven, and the LED module 505 is turned on by supplying power from an external DC power source.

<1-6> Lead Wire The lead wires 49 and 51 are for supplying power from the circuit unit 15 to the LED module 505.
One end of the lead wire 49 is electrically connected to the power supply terminal 24a of the LED module 505 via the conductive bonding member 90, and the other end is electrically connected to the output terminal on the high potential side of the circuit unit 15. It is connected to the. Further, one end of the lead wire 51 is electrically connected to the power supply terminal 24 b via the conductive bonding member 90, and the other end is electrically connected to the output terminal on the low potential side of the circuit unit 15. Has been. Here, the one end portions of the lead wires 49 and 51 are fixed to the power supply terminals 24 a and 24 b (see FIG. 3) by the conductive bonding member 90 while being inserted into the through hole 26. As described above, the lead wires 49 and 51 in this embodiment are connected to an external DC power source.

<1-7> Support Member The support member 17 extends from the upper surface of the base 61 (the inner peripheral surface of the valve 7) toward the inside of the valve 7. The support member 17 has a rod-like shape, and the LED module 505 is fixed to the distal end portion (the upper surface of the top portion 17 c), and the base end portion is fixed to the base 61.
Further, the top surface of the top portion 17c of the support member 17 is flat, and a convex portion 17d having a rectangular shape in plan view protruding in the extending direction of the support member 17 is provided on the top surface of the top portion 17c. The planar view shape of the convex portion 17d matches the planar view shape of the through hole 525 in the module substrate 521 of the LED module 505, and the top portion of the support member 17 is in a state where the convex portion 17d and the through hole 525 are fitted. The LED module 505 is placed on the upper surface of 17c. Thereby, it can suppress that the LED module 505 rotates on the upper surface of the top part 17c of the supporting member 17 about the extending direction of the supporting member 17 as an axis | shaft.

The support member 17 has a solid structure formed of a material having a thermal conductivity larger than that of the module substrate 521 of the LED module 505. Specifically, the support member 17 is made of aluminum. Note that the support member 17 may be formed of another metal material or the like.
The base end portion of the support member 17 is fixed to the base 61 with an adhesive. As this adhesive, for example, an adhesive made of silicone resin can be used. Thereby, the heat transmitted from the LED module 505 to the support member 17 can be efficiently conducted to the base 61. However, further improvement in efficiency cannot be achieved only by this heat conduction path. That is, in order to further lower the thermal resistance by this heat conduction, it is necessary to increase the support column diameter of the support member 17, but in this case, there is an increasing concern that the lamp light distribution will be disturbed. Further, in the modified example of the present embodiment, the support member 17 may be omitted, and instead, the cylindrical member 540 described below may be changed to a sealed container.

<1-8> Base The base 61 has a substantially disk shape, and the base end portion of the support member 17 is fixed with an adhesive. That is, the base 61 supports the support member 17 in a state where the other end side in the longitudinal direction of the support member 17 is fixed. The base 61 and the support member 17 may be integrally processed. Further, the base 61 is fixed to the case 9 with its peripheral surface contacting the inner peripheral surface of the case 9. That is, a step portion 61 c is formed on the entire peripheral portion of the base 61, and the valve 7 is formed in a gap generated between the step portion 61 c and the peripheral wall of the case 9 in a state where the base 61 is fixed to the case 9. In the state where the opening side end portion 7c is positioned, it is fixed by an adhesive made of silicone resin. Furthermore, a through hole 61b for inserting lead wires 49 and 51 for supplying power from the circuit unit 15 to the LED module 505 is provided in each of two locations across the central portion of the base 61. .

<1-9> Cylindrical Member The cylindrical member 540 has one end in the central axis direction fixed to the side opposite to the LED chip 22 and the sealing body 23 side of the module substrate 521 with an adhesive, and the other end is a base. It is fixed to the base 61 with an adhesive. The peripheral wall of the cylindrical member 540 constitutes an inner wall. The cylindrical member is formed from a translucent material such as glass. Here, as an adhesive for fixing the cylindrical member 540 and the base 61 or the cylindrical member 540 and the module substrate 521, a material having excellent adhesion and airtightness, for example, a silicone resin is suitable. . The cylindrical member 540 may have a container configuration as described above.

<1-10> Moisture Fixing Material The moisture fixing material 570 is disposed in a state where water as the heat transfer material 670 is sorbed on the module substrate 521 side in the region S5 surrounded by the module substrate 521 and the cylindrical member 540. Has been. On the other hand, the water vapor in the cylindrical member 540 is evaporated (desorbed) from the moisture fixing material 570. In other words, the moisture fixing material 570 has a function of reversibly collecting and attaching the water molecules present in the cylindrical member 540 on the spot. Here, “sorption” refers to the adsorption of water molecules on the surface of the moisture fixing material 570 and the absorption of water molecules adsorbed on the surface of the moisture fixing material 570 into the highly hydrophilic polymer constituting the moisture fixing material 570. This is a phenomenon that occurs simultaneously. The moisture fixing material 570 is mainly made of a highly hygroscopic polymer (hereinafter referred to as “hygroscopic polymer”). In the moisture fixing material 570, water molecules are adsorbed in the form of hydrogen bonds with the hydrophilic polar group of the hygroscopic polymer, and further enter the hygroscopic polymer and be absorbed. An example of this hygroscopic polymer is polyvinyl alcohol (PVA). In addition, the moisture fixing material 570 includes fibers made of polyacrylate and silica gel (silica / ethanol obtained by treating silica gel with alcohol in this embodiment).

As a moisture fixing material 570 according to the present embodiment, a material having about 0.1 g of polyacrylate and about 5 mg of silica / ethanol absorbed by about 1.0 g of 10% PVA water was used as a specific example. .
<2> Regarding Heat Dissipation Characteristics of Lamp Next, heat dissipation characteristics of the lamp 1 according to the present embodiment will be described.

  First, the result of measuring the temperature in the vicinity of the LED module 505 in the lighting state with the lamp 1 according to the present embodiment and the lamp according to the comparative example will be described. Here, the lamp according to the comparative example has substantially the same configuration as the lamp 1 according to the present embodiment, but is different from the lamp 1 according to the present embodiment in that the cylindrical member 540 is not provided. The power supplied to each of the lamp 1 and the lamp according to the comparative example was set to 6.5 W by an external power source that is continuously operated by DC.

In the case of the lamp according to the comparative example, in the lighting state, the temperature of the base 61 is about 88.4 ° C., whereas the temperature near the LED module 505 is 107 ° C. (the base 61 and the LED module). The temperature difference near 505 is 18.6 ° C.).
On the other hand, in the lamp 1 according to the present embodiment, in the base-up lighting state, the temperature of the base 61 is 88.5 ° C., whereas the temperature near the LED module 505 is about 96.5 ° C. The temperature difference between the base 61 and the vicinity of the LED module 505 was 8.0 ° C.

  Table 1 summarizes the results of this experiment.

That is, in the lamp 1 according to the present embodiment, the difference between the temperature in the vicinity of the LED module 505 and the temperature of the base 61 is reduced as compared with the lamp according to the comparative example, and the effect of reducing the thermal resistance value is recognized. ing.
Next, a heat dissipation model of the lamp 1 according to this modification will be described with reference to FIG.
When the heat generated in the LED module 505 is conducted to the moisture fixing material 570, the water molecules, which are heat transfer materials sorbed on the moisture fixing material 570, absorb the heat conducted to the moisture fixing material 570 and desorb. . The evaporation (desorption) of water molecules from the moisture fixing material 570 uses the heat from the moisture fixing material 570, and the part is cooled.

Water molecules desorbed from the moisture fixing material 570 (see arrow A51 in FIG. 4 (a)) increase the water vapor pressure in the space created by the cylindrical member, but the pressure is the lowest temperature in the space. If the saturated vapor pressure is exceeded, condensation (liquefaction) of water begins at that site (see B52 in FIG. 4A). At that time, the heat of condensation is transferred to the same site.
Subsequently, the condensed water adhering to the inner surface of the base 61 falls as water droplets due to gravity (see C53 in FIG. 4A) and is again sorbed to the moisture fixing material 570.

Thereafter, the water molecules sorbed in the moisture fixing material 570 again absorb the heat conducted from the LED module 505 to the moisture fixing material 570 and desorb (evaporate) from the moisture fixing material 570 (FIG. 4A). (See arrow A51 in the middle).
As described above, in the case of the base-up lighting shown in FIG. 4A (the base includes an oblique direction), the water molecules from the moisture fixing material 570 are formed in the region S5 inside the tube wall formed by the cylindrical member 540. Circulation occurs such as desorption, condensation on the surface of the base 61 (liquefaction), dropping of water molecules from the base 61 into the moisture fixing material 570, and sorption onto the moisture fixing material 570. Thereby, the water molecules held by the moisture fixing material 570 when the lamp 1 is turned on are maintained at a constant amount without decreasing. Accordingly, the LED module 505 can be continuously cooled while the lamp 1 is lit. Even if the support member 17 is eliminated and the cylindrical member 540 is changed to the sealed container 740 specification (see FIG. 4B), it can be expected to obtain the same result as in the previous embodiment. It should be noted that this configuration does not cause a major problem with the lamp light distribution.

  Eventually, in the lamp 1 according to the present embodiment, during the lighting of the LED module 505, a material circulation path is formed using the phase change between the gas phase and the liquid phase, and the heat generated in the LED module is reduced to a low temperature range. Provide water to convey. Accordingly, the heat generated in the LED module is transmitted to the low temperature region through the material circulation path in which the phase change between the gas phase and the liquid phase due to water is involved. The heat transmitted to the low temperature region in the cylindrical member 540 is further guided to the outside of the case 9 by heat conduction via the base 61. Thereby, since the temperature rise of the LED module 505 can be suppressed, the fall of the luminous efficiency of LED22 can be suppressed and the element destruction of LED22 can be suppressed. As a result, high output of the LED module 505 can be achieved.

<Embodiment 2>
The lighting device according to the present embodiment will be described with reference to FIG. FIG. 5 is a partially broken side view of lighting device 100 according to the present embodiment.
As illustrated in FIG. 5, the lighting device 100 is used by being mounted on, for example, an indoor ceiling C, and includes the lamp 1 according to the first embodiment and the lighting device 102.

The lighting fixture 102 includes a fixture main body 103 attached to the ceiling C and a bowl-shaped lamp cover 104 that covers the lamp 1.
The instrument main body 103 has a socket 103a. The base 11 of the lamp 1 is screwed into the socket 103a. Electric power is supplied from the external power source to the lamp 1 through the socket 103a.

Note that the illumination device 100 illustrated in FIG. 5 is an example, and may include at least a socket for holding the lamp 1 and supplying power to the lamp 1. Moreover, although the illuminating device 100 shown in FIG. 5 was provided with the one lamp | ramp 1, it may be provided with the some lamp | ramp 1. FIG. Alternatively, the lamp 2 according to the second embodiment may be provided.
<Modification>
(1) In Embodiment 1, the case where the heat transfer material 670 is water molecules has been described. However, the present invention is not limited to this. For example, naphthalene may be used.

A sectional view of the lamp 2 according to this modification is shown in FIG. In addition, about the structure similar to Embodiment 1, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.
As shown in FIG. 6, there is no support member and a sealed container 640 is provided. The sealed container 640 is closed at both ends in the central axis direction. The sealed container 640 is disposed in the valve 7. And the module board | substrate 521 which comprises a part of LED module 505 is adhering to the one end side in the center axis direction of the airtight container 640 with the adhesive agent. Further, a content enclosure tube 640a is projected from the other end of the sealed container 640 in the central axis direction. The peripheral wall of the hermetic container 640 constitutes an inner enclosure wall. The sealed container 640 is made of a light transmissive material such as alumina. Further, the sealed container 640 is highly pressure resistant. The sealed container 640 is filled with a heat transfer material 670 made of naphthalene (melting point is 80 ° C. of 100 ° C. or less).

  First, attention is focused on the phase change from the solid phase to the liquid phase in the heat transfer material 670 made of naphthalene at the beginning of lamp operation. When the ice melts in a mixed phase surrounded by water, the water temperature is maintained at the melting point of the ice of 0 ° C. The same can be said for the case where naphthalene is used as the heat transfer material 670. At the initial melting stage of naphthalene (heat transfer material 670), the temperature in the sealed container 640 that contacts the LED module 505 tends to be maintained at the melting temperature. That is, heat energy is spent on the work of “melting” rather than temperature rise (so-called latent heat). Incidentally, the heat of fusion of naphthalene is 19.29 kJ / mol.

When the temperature of the entire heat transfer material 670 reaches 80 ° C. or more, all of the naphthalene of the heat transfer material 670 melts, but thereafter, the same material having a different viscosity proceeds in the heat transfer material 670 having a different temperature distribution. In other words, the convection phenomenon becomes dominant. Here, unlike convection of gas molecules, the amount of heat transport is increased by the amount of liquid.
First, the result of measuring the temperature in the vicinity of the LED module 505 in the lighting state with the lamp 2 according to the present embodiment and the lamp according to the comparative example will be described. Here, the lamp according to the comparative example and the experimental result thereof are the same as those applied to the comparative example of the lamp 1 according to the present embodiment. In addition, the power supply to the lamp 2 was set to 6.5 W by an external power source for continuous DC operation.

In the case of the lamp according to the comparative example, in the lighting state, the temperature of the base 61 is about 88.4 ° C., whereas the temperature near the LED module 505 is 107 ° C. (the base 61 and the LED module). The temperature difference near 505 is 18.6 ° C.).
On the other hand, in the lamp 1 according to the present embodiment, in the lighting state, the temperature of the base 61 is 88.3 ° C., whereas the temperature near the LED module 505 is about 94.6 ° C. (The temperature difference between the base 61 and the vicinity of the LED module 505 is 6.3 ° C.).

  Table 2 summarizes the results of this experiment.

That is, in the lamp 1 according to the present embodiment, the difference between the temperature in the vicinity of the LED module 505 and the temperature of the base 61 is reduced as compared with the lamp according to the comparative example, and the effect of reducing the thermal resistance value is recognized. ing.
Eventually, in the lamp 1 according to the present embodiment, during the lighting of the LED module 505, a material circulation path is formed using the phase change between the solid phase and the liquid phase, and the heat generated in the LED module 505 is used as a base. Naphthalene is provided in the container wall for transmission to the 61 side (low temperature range). Therefore, the heat generated in the LED module 505 is transferred to the base 61 side (low temperature region) of the sealed container 640 through a material circulation path in which a phase change between the solid phase and the liquid phase caused by naphthalene is involved. The heat transmitted to the base 61 side is further guided to the outside of the case 9 by heat conduction via the base 61. Thereby, since the temperature rise of the LED module 505 can be suppressed, the fall of the luminous efficiency of LED22 can be suppressed and the element destruction of LED22 can be suppressed. As a result, high output of the LED module 505 can be achieved.

(2) The moisture fixing material 570 has a multilayer structure of two or more layers and has higher hygroscopicity, such as sodium polyacrylate cross-linked product, cross-linked carboxymethyl cellulose, starch / polyacrylonitrile hydrolyzate, starch -Polyacrylate cross-linked product, saponified product of vinyl acetate / methyl acrylate copolymer, etc. can be employed.
(3) As the hygroscopic polymer, for example, a polymer obtained by partially crosslinking polyvinyl alcohol may be used. Specific examples include those obtained by crosslinking polyvinyl alcohol with one of an organic titanium compound and an organic zirconium compound. Moreover, as a hygroscopic polymer, you may consist of a copolymer of polyvinyl alcohol, acrylic acid, and methyl methacrylate.

  Further, the hygroscopic polymer made of a material containing polyvinyl alcohol may be configured to adhere silica gel (SiO 2 · nH 2 O). This silica gel is useful for strengthening the function of the moisture fixing material and fixing to the container wall, and may be any type of A type silica gel and B type silica gel. Of course, the silica gel may be subjected to alcohol treatment to reduce the size of the gel particles.

(4) Further, the moisture fixing material 570 may be made porous by attaching activated carbon or zeolite to the hygroscopic polymer.
(5) Moreover, the inside of the cylindrical member 540 which used the water molecule as the heat transfer material may mainly contain a lower alcohol for antibacterial purposes. Furthermore, not only air at various atmospheric pressures but also at least one of oxygen and nitrogen and a rare gas may be sealed inside the cylindrical member 540.

  (6) In the first embodiment, the example in which the support member 17 is provided has been described. However, the present invention is not limited to this example. For example, as illustrated in FIG. 7, the support member 17 is not provided and the LED module 505 is cylindrical. The lamp 3 supported by the member 540 may be used.

  The lamp according to the present invention can be widely used in general lighting applications.

1, 2, 3 Lamp 7 Bulb 7a Spherical part 7b Tubular part 7c Opening 9 Case 9a First case part 9b Second case part 9c, 9d, 317f Groove part 11 Base 15 Circuit unit 17 Support member 22 LED chip 23 Sealing Body 24a, 24b Feed terminal 25, 26 Through-hole 27 Shell portion 29 Insulating portion 31 Eyelet portion 61 Base 100 Lighting device 102 Lighting fixture 103 Appliance main body 103a Socket 104 Lamp cover 505 LED module 521 Module substrate 540 Cylindrical member 570 Moisture fixing Material 670 Heat transfer material 640 Sealed container bottomed cylindrical member

Claims (7)

An LED module having a semiconductor light emitting element;
During the lighting of the LED module, a material circulation path is formed using the phase change between the gas phase and the liquid phase or the phase change between the solid phase and the liquid phase, and the heat generated in the LED module is transmitted to the low temperature region of the path. A lamp comprising a heat transfer material. An inner wall formed of a translucent material and encapsulating the heat transfer material therein;
The lamp according to claim 1, wherein the LED module is thermally coupled to a part of the outer surface of the inner enclosure wall. 3. The heat fixing material is made of water molecules, and a moisture fixing material mainly composed of a hygroscopic polymer is fixed to the inner enclosure wall on the LED module side. 3. The lamp described. The hygroscopic polymer includes polyvinyl alcohol, polyvinyl alcohol crosslinked product, polyvinyl methacrylate copolymer, sodium polyacrylate crosslinked product, crosslinked carboxymethyl cellulose, starch / polyacrylonitrile hydrolyzate, starch / polyacrylate crosslinked product, and The lamp according to claim 1, comprising at least one saponified product of vinyl acetate / methyl acrylate copolymer. The lamp according to claim 4, wherein the moisture fixing material further includes at least one of activated carbon, silica gel, and zeolite. The lamp according to claim 1, wherein the heat transfer material is made of naphthalene. An illumination device comprising the lamp according to any one of claims 1 to 6.

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