JP2013172115A - Wafer manufacturing method for ecological processing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer manufacturing method for ecological processing, which is capable of selecting and recycling indefectible chips among defective wafers to improve production yield and reduce manufacturing costs, is capable of reducing the quantity of waste wafers to achieve energy saving and the reduction of carbon dioxide, and is capable of meeting the needs for environment protection.SOLUTION: In the wafer manufacturing method for ecological processing, one defective wafer is processed. First, the defective damaged (or indefectible) wafer is cut to form a plurality of independent chips. Rear surfaces of the chips are polished into prescribed thicknesses in accordance with required chip thicknesses, and further, polished indefectible chips are sequentially laid out in arrangement grooves of a plate, whereby processing is completed.

Description

The present invention relates to an eco-processed wafer manufacturing method. In particular, a wafer that has been judged to have a poor yield as a result of a test by a tester, or a wafer that is defective due to other factors has been discarded due to defects due to defects. However, by cutting, polishing, and selecting those wafers, it is possible to select and reuse complete chips from wrinkled wafers, increasing production yields and lowering production costs, The present invention relates to an eco-processed wafer manufacturing method capable of reducing the amount of waste, saving energy and reducing carbon dioxide, and responding to the demand for environmental protection.

Wafers are the basis for making integrated circuits, and the wafer manufacturing process mainly consists of several steps: First, a high-purity liquid semiconductor raw material (for example, silicon) is prepared, and subsequently pulled up using a seed crystal, a cylindrical ingot is generated. Thereafter, further slicing is performed and the ingot is cut into a dish shape to form a wafer.

After the wafer is manufactured, the wafer is sent to a tester and a wafer test is performed. The main purpose of this wafer test is to identify which good chips can be used for packaging in the wafer, and finally calculate the number of good chips that meet the required electrical parameters. This allows tester staff to analyze the effectiveness of the entire wafer. However, a wafer that has been tested by a tester and determined to have a low yield is regarded as a wrinkled and difficult-to-process wafer and is discarded or considered as an inventory surplus. Also, in the process of manufacturing a wafer, a wafer that has become defective due to other factors (for example, a partially damaged wafer or a wafer with a non-uniform thickness) is also considered a flawed wafer and discarded. The

Therefore, a wafer that has been tested by a tester and considered to be poor in yield, or a wafer that is defective due to other factors, is considered as a stock that is left over and has a flaw that is difficult to process and should be discarded. Are treated as waste. Not only does this increase the amount of wafer waste, but because many discarded wafers are plated with metal and other oxides, the environment is contaminated by those metals and oxides. .

  The present invention can select and reuse complete chips out of wrinkled wafers, increase production yield and lower production costs, reduce wafer waste quantity, save energy and reduce carbon dioxide It is an object of the present invention to provide an eco-processed wafer manufacturing method that can reduce the amount of waste and can meet the demand for environmental protection.

In order to solve the above-mentioned conventional technical problems and disadvantages, the eco-processed wafer manufacturing method according to the present invention is a single wafer with defects (for example, a wafer having a broken outer periphery, a broken wafer, a complete wafer, Alternatively, a wafer having a low chip yield) is processed, and the entire wafer is cut to form a plurality of independent chips, and a predetermined thickness with respect to the back surface of the chip according to the required chip thickness. When the polishing is completed and the complete chips after polishing are sequentially arranged in the arrangement grooves of the plate, it is completed.

Another eco-fabricated wafer manufacturing method according to the present invention is to process a single wrinkled wafer (for example, a wafer with a broken outer periphery, a broken wafer, a complete wafer, or a wafer with poor chip yield). By cutting the entire wafer leaving the thickness of the bottom surface, a plurality of interconnected chips are formed, and the bottom surface of the back surface of the interconnected chips is polished and the thickness is reduced. When the connected chips are made into a plurality of independent chips, and the polished complete chips are sequentially arranged in the arrangement grooves of the plate, the process is completed.

Another eco-fabricated wafer manufacturing method according to the present invention is to prepare an incomplete wafer in which a plurality of chips are left or a chip is originally too thick, and then the complete chips are sequentially arranged in plates or arrangement grooves. When the back surface of the chip is polished to a predetermined thickness and the complete chip after polishing is again placed in the arrangement groove of the plate in order, it is completed. .

Detailed features and implementation of the present invention will be described in detail below using embodiments with reference to the drawings. The contents are configured so that an engineer familiar with this area can understand and implement the technical contents of the present invention. Based on the contents and figures described in this specification, this area is fully understood. Anyone skilled in the art can easily understand the objects and advantages of the present invention.

It is a 1st implementation flowchart of the wafer manufacturing method of this invention. It is explanatory drawing which showed the flow of Example 1 of the wafer manufacturing method of this invention. It is explanatory drawing which showed the flow of Example 2 of the wafer manufacturing method of this invention. It is a 2nd implementation flowchart of the wafer manufacturing method of this invention. It is explanatory drawing which showed the flow of Example 3 of the wafer manufacturing method of this invention. It is explanatory drawing which showed the flow of Example 4 of the wafer manufacturing method of this invention. It is a 3rd implementation flowchart of the wafer manufacturing method of this invention. It is explanatory drawing which showed the flow of Example 5 of the wafer manufacturing method of this invention. It is explanatory drawing which showed the flow of Example 6 of the wafer manufacturing method of this invention.

In order for the examiner to understand the other features / contents and advantages of the present invention, and to further clarify the effects achieved by the present invention, the present invention combines the features of the present invention with the drawings. The advantages will be described in detail. The following examples are intended to explain the aspects of the invention in more detail and are not intended to limit the scope of the invention.

As shown in FIGS. 1, 2 and 3, the eco-processed wafer manufacturing method according to the present invention comprises the following procedures.

A wafer 1 having defects (for example, a damaged wafer, a broken wafer, a complete wafer, or a wafer with a low yield of chips 11) is prepared (procedure 100). The wafer 1 is cut to form a plurality of independent chips 11 (procedure 110). A predetermined thickness is polished on the back surface of the chip 11 (procedure 120). The polished complete chips 11 are sequentially placed on the carrier (for example, the plate 6 having the placement grooves 61) (procedure 130).

In this way, the wafer 1 that was originally regarded as a defective product and intended to be discarded is cut (procedure 110), polished (procedure 120), and selected (procedure 130), so that the wafer 1 with defects is completely removed. A new chip 11 can be selected and reused. As a result, the production yield can be improved, the production cost can be reduced, and the number of wafers to be discarded can be reduced, so that energy can be saved and carbon dioxide can be reduced. .

Moreover, the implementation method (illustrated in FIG. 2) of the present invention based on the above-described procedures 100 to 130 will be given. A single wafer 1 (for example, a damaged wafer) with some wrinkles is processed. First, the wafer 1 is provided on the adhesive film 2 and the surface of the wafer 1 is faced up, and the entire wafer 1 is cut. At the time of cutting, a plurality of independent chips 11 are formed by cutting the surface of the wafer 1 so as to intersect the horizontal direction and the vertical direction with the cutter 3. Further, another adhesive film 2 is provided on the surface of the wafer 1 that has already been cut, and turned upside down so that the back surface of the wafer 1 faces upward (the adhesive film originally provided on the back surface of the wafer 1). 2 can be removed), depending on the required thickness of the chip 11, the back surface of the chip 11 is polished to a predetermined thickness. When polishing, the polishing device 4 polishes the back surface of the chip 11, and after polishing, the ultraviolet light 5 is applied to the adhesive film 2 and the chip 11 (at this time, the adhesive film 2 is The tip 11 is directed downward), whereby the degree of adhesion of the adhesive film 2 is lowered. Finally, the complete chip 11 is peeled off from the adhesive film 2 with the spatula 7 and placed in the placement groove 61 of the plate 6 in order (or placed on another carrier) to complete.

Moreover, another implementation method (illustrated in FIG. 3) of the present invention based on the above-described procedures 100 to 130 will be given. A single wafer 1 (for example, a damaged wafer) with some wrinkles is processed. First, the wafer 1 is provided on the adhesive film 2 and the surface of the wafer 1 is faced up, and the entire wafer 1 is cut. At the time of cutting, a plurality of independent chips 11 are formed by cutting the surface of the wafer 1 so as to intersect the horizontal direction and the vertical direction with the cutter 3. Further, another adhesive film 2 is provided on the surface of the wafer 1 that has already been cut, and turned upside down so that the back surface of the wafer 1 faces upward (the adhesive film originally provided on the back surface of the wafer 1). 2 can be removed), depending on the required thickness of the chip 11, the back surface of the chip 11 is polished to a predetermined thickness. When polishing, the polishing machine 4 polishes the back surface of the chip 11. After polishing, another adhesive film 2 is provided on the back surface of the wafer 1 (the adhesive film 2 originally provided on the front surface of the wafer 1 can be removed), and ultraviolet light is applied to the adhesive film 2 and the chip 11. By irradiating the light 5 (at this time, the adhesive film 2 is directed upward and the chip 11 is directed downward), the degree of adhesion of the adhesive film 2 is lowered. Finally, the surface of the chip 11 is sucked by the sucker 8, and the complete chip 11 is peeled off from the adhesive film 2, and sequentially placed in the placement groove 61 of the plate 6 (or placed on another carrier). It will be completed.

As shown in FIGS. 4, 5, and 6, another eco-processed wafer manufacturing method according to the present invention includes the following procedures. A wrinkled wafer 1 (for example, a damaged wafer, a broken wafer, a complete wafer, or a wafer with a low yield of chips 11) is prepared (procedure 200). The wafer 1 is cut while leaving a predetermined thickness on the bottom surface to form chips 11 in which a plurality of chips are connected to each other (procedure 210). The bottom surface having a predetermined thickness on the back surface of the chip 11 connected to each other is polished to reduce the thickness, thereby forming a plurality of independent chips 11 from the chip 11 connected to each other (procedure 220). ). The complete chips 11 after the polishing are finished are sequentially placed on the carrier (for example, the plate 6 having the placement grooves 61) (procedure 230).

In this manner, the wafer 1 that was originally regarded as a defective product and was intended to be discarded is cut (procedure 210), polished (procedure 220), and selected (procedure 230), so that the wafer 1 with defects is completely removed. A new chip 11 can be selected and reused. In the same way, it is possible to increase production yields and lower production costs, reduce the number of wafer waste, save energy and reduce carbon dioxide, and respond to the demand for environmental protection. it can.

Moreover, the implementation method (shown in FIG. 5) of this invention based on the above-mentioned procedures 200-230 is mentioned. A single wafer 1 with several wrinkles (for example, a damaged wafer) is processed. If necessary, first, the wafer 1 is provided on the adhesive film 2 and the surface of the wafer 1 is directed to cut the entire wafer 1. To do. Alternatively, the collected wafer 1 is directly cut. When cutting, the cutting device 3 cuts the surface of the wafer 1 while leaving the thickness of the bottom so as to intersect the horizontal direction and the vertical direction, thereby forming a chip 11 in which a plurality of bottom surfaces are connected to each other. Further, another adhesive film 2 is provided on the surface of the wafer 1 that has already been cut, and the wafer 1 is turned upside down so that the back surface of the wafer 1 faces upward, and is connected to each other according to the required thickness of the chip 11. The bottom surface of the back surface of the chip 11 is polished to reduce the thickness, and the chips 11 connected to each other are made into a plurality of independent chips 11. When polishing, the back surface of the chip 11 is polished by the polishing machine 4, and after polishing, the adhesive film 2 and the chip 11 are irradiated with ultraviolet light 5 (at this time, the adhesive film 2). The tip 11 is directed downward, and the adhesiveness of the adhesive film 2 is lowered. Finally, the spatula 7 is used to peel the complete chip 11 from the adhesive film 2 and, in turn, the arrangement groove of the plate 6. When it is placed in 61 (or placed on another carrier), it is completed.

Moreover, another implementation method (illustrated in FIG. 6) of the present invention based on the above-described procedures 200 to 230 will be given. A single wafer 1 with several wrinkles (for example, a damaged wafer) is processed. If necessary, first, the wafer 1 is provided on the adhesive film 2 and the surface of the wafer 1 is faced up so that the entire wafer 1 is Disconnect. Alternatively, the collected wafer 1 is directly cut. When cutting, the cutting device 3 cuts the surface of the wafer 1 while leaving the thickness of the bottom so as to intersect the horizontal and vertical directions, thereby forming a chip 11 in which a plurality of bottoms are connected to each other. . Further, the adhesive film 2 is provided on the surface of the wafer 1 that has already been cut, and the chips 11 that are connected to each other according to the required thickness of the chips 11 are turned upside down so that the back surface of the wafer 1 faces upward. The bottom surface of the back surface is polished to reduce the thickness, and the chips 11 connected to each other are made into a plurality of independent chips 11. When polishing, the back surface of the chip 11 is polished by the polishing machine 4, and after polishing, another adhesive film 2 is provided on the back surface of the wafer 1 (note that it was originally provided on the front surface of the wafer 1). Further, the adhesive film 2 and the chip 11 are irradiated with ultraviolet light 5 (at this time, the adhesive film 2 is directed upward and the chip 11 is directed downward). , Decrease the degree of adhesion of the adhesive film 2. Finally, the sucker 8 sucks the surface of the chip 11, peels the adhesive film 2 from the complete chip 11, and sequentially arranges it in the arrangement groove 61 of the plate 6 (or arranges it on another carrier). To complete).

As shown in FIG. 7, FIG. 8, and FIG. 9, yet another eco-processed wafer manufacturing method according to the present invention comprises the following procedures. An incomplete wafer 1 in which a plurality of chips 11 remain or some of the chips 11 are too thick is prepared (procedure 300). Complete chips 11 are placed in order on the carrier (step 310). The back surface of the chip 11 is polished to reduce the thickness (procedure 320). After polishing, the complete chip 11 is further placed on the carrier in turn (for example, the plate 6 with the placement groove 61).

Thus, the chip 1 that was originally considered to be a defective product or not conforming to the standard and was intended to be discarded is polished (procedure 320) and selected (procedure 330) to complete the chip in the wafer 1 with defects. 11 can be selected and reused. In the same way, it is possible to increase production yields and lower production costs, reduce the number of wafer waste, save energy and reduce carbon dioxide, and respond to the demand for environmental protection. it can.

Moreover, the implementation method (illustrated in FIG. 8) of this invention based on the above-mentioned procedures 300-330 is mentioned. The incomplete wafer 1 in which a plurality of chips 11 remain or a part of the chips 11 is too thick is processed, and the complete chips 11 in the wafer 1 are sequentially arranged on the carrier. If the carrier is the plate 6, the chip 11 is first provided in the plate 6, and further, the adhesive film 2 is provided on the surface of the chip 11, and the back surface of the chip 11 is turned upside down. . When the carrier is the adhesive film 2, the chip 11 is provided on the adhesive film 2 (at this time, the back surface of the chip 11 faces upward), and depending on the required thickness of the chip 11, The back surface of the connected chip 11 is polished to reduce the thickness. When polishing, the polishing device 4 polishes the back surface of the chip 11, and after polishing, the adhesive film 2 and the chip 11 are irradiated with ultraviolet light 5 (at this time, the adhesive film 2 The tip 11 is directed downward) to lower the adhesiveness of the adhesive film 2, and finally, the spatula 7 is used to peel the complete chip 11 from the adhesive film 2, and in order, the arrangement groove 61 of the plate 6. When it is placed inside (or placed on another carrier), it is completed.

Moreover, another implementation method (illustrated in FIG. 9) of the present invention based on the above-described procedures 300 to 330 will be given. The incomplete wafer 1 in which a plurality of chips 11 remain or a part of the chips 11 is too thick is processed, and the complete chips 11 in the wafer 1 are sequentially arranged on the carrier. When the carrier is the plate 6, the chip 11 is first placed in the plate 6, and the adhesive film 2 is provided on the surface of the chip 11, and the chip 11 is turned upside down so that the back surface of the chip 11 faces up. If the carrier is the adhesive film 2, the chip 11 is placed on the adhesive film 2 (at this time, the back surface of the chip 11 is up), and depending on the required thickness of the chip 11, the mutual Polishing is performed on the back surface of the chip 11 connected to, to reduce the thickness. When polishing is performed, the back surface of the chip 11 is polished by the polishing machine 4, and after polishing, another adhesive film 2 is further provided on the back surface of the wafer 1 (note that the wafer 1 is originally provided on the front surface of the wafer 1). Further, the adhesive film 2 and the chip 11 are irradiated with ultraviolet light 5 (at this time, the adhesive film 2 is directed upward and the chip 11 is directed downward). The adhesion degree of the adhesive film 2 is lowered, and finally the surface of the chip 11 is sucked by the sucker 8, and the complete chip 11 is peeled off from the adhesive film 2, and in order in the arrangement groove 61 of the plate 6 Once placed (or placed on another carrier), it is complete.

It should be noted that in each of the above-described embodiments, it is possible to select whether to irradiate the UV light 5 to the adhesive film 2 and the chip 11 according to the characteristics of the adhesiveness of the adhesive film 2. . That is, when the adhesion degree of the adhesive film 2 is low, the adhesive film 2 and the chip 11 do not need to be irradiated with the ultraviolet light 5. On the contrary, when the adhesive film 2 has a high degree of adhesion, the adhesive film 2 and the chip 11 can be irradiated with the ultraviolet light 5 to reduce the adhesive degree of the adhesive film 2, thereby It becomes easy to peel off from the adhesive film 2. The wrinkled wafer 1 described in the above-described procedures 100 and 200 is a damaged or broken wafer or a complete wafer.

To summarize the above-described contents, the technical feature of the present invention is that a complete chip is formed out of the wrinkled wafer 1 through a process of selecting the wafer 1 that originally had the wrinkle and had to be discarded because it was difficult to process. 11 can be selected, processed and reused. Therefore, the production yield can be improved, the production cost can be reduced, and the quantity of waste on the wafer can be reduced, so that energy can be saved and carbon dioxide can be reduced. Can respond.

The above detailed description is merely a specific description of an embodiment of the present invention, and the above embodiment is not intended to limit the present invention, and the embodiment having the same effect without departing from the technical spirit of the present invention. Modifications are intended to be within the scope of the claims of the present invention.

1 Wafer 11 Chip 2 Adhesive film 3 Cutting device 4 Polishing device 5 Ultraviolet light 6 Plate 61 Arrangement groove 7 Spatula 8 Absorber 100 Procedure 110 Procedure 120 Procedure 130 Procedure 200 Procedure 210 Procedure 220 Procedure 230 Procedure 300 Procedure 310 Procedure 320 Procedure 330 Procedure

Claims (22)

The procedure to prepare a wafer with a defect,
Cutting the wafer to form a plurality of independent chips;
A procedure of polishing the back surface of the chip with a predetermined thickness;
An eco-processed wafer manufacturing method comprising: a step of sequentially arranging complete chips after polishing on a carrier. The eco-fabricated wafer manufacturing method according to claim 1, wherein when the wafer is cut, cutting is performed so that the surface of the wafer intersects the horizontal direction and the vertical direction with a cutter. The eco-fabricated wafer manufacturing method according to claim 1, wherein when the chip is polished, the back surface of the chip is polished by a polishing machine. In the procedure of arranging the complete chips after polishing on the carrier in order, the carrier is a plate with an arrangement groove, and the complete chips after polishing are arranged in order in the arrangement groove of the plate. The method for manufacturing an eco-processed wafer according to claim 1, wherein: 2. The eco according to claim 1, wherein the chips are first provided on the adhesive film and irradiated with ultraviolet light before the procedure of sequentially arranging the complete chips after polishing on the carrier. Processing wafer manufacturing method. The eco-processed wafer manufacturing method according to claim 1, wherein the wrinkled wafer is a damaged or cracked wafer. The eco-processed wafer manufacturing method according to claim 1, wherein the wrinkled wafer is a complete wafer. The procedure to prepare a wafer with a defect,
Cutting the wafer leaving the bottom thickness, and forming a plurality of interconnected chips;
Polishing the bottom surface of the back surface of the interconnected chips to reduce the thickness, and making the interconnected chips into a plurality of independent chips,
An eco-processed wafer manufacturing method comprising: a step of sequentially arranging complete chips after polishing on a carrier. 9. The eco-fabricated wafer manufacturing method according to claim 8, wherein when the wafer is cut, cutting is performed so that the surface of the wafer intersects the horizontal and vertical directions with a cutter. The eco-fabricated wafer manufacturing method according to claim 8, wherein when the chip is polished, the back surface of the chip is polished with a polishing machine. In the procedure of arranging the complete chips after polishing on the carrier in order, the carrier is a plate with an arrangement groove, and the complete chips after polishing are arranged in order in the arrangement groove of the plate. The method for producing an eco-processed wafer according to claim 8, wherein: 9. The eco according to claim 8, wherein the chips are first provided on the adhesive film and irradiated with ultraviolet light before the procedure of sequentially arranging the complete chips after polishing on the carrier. Processing wafer manufacturing method. The eco-processed wafer manufacturing method according to claim 8, wherein the wrinkled wafer is a damaged or cracked wafer. The eco-processed wafer manufacturing method according to claim 8, wherein the wrinkled wafer is a complete wafer. A procedure for preparing an incomplete wafer with a plurality of chips remaining;
A sequence of placing complete chips on the carrier in sequence;
Polishing the back surface of the chip to reduce the thickness;
A method for producing an eco-processed wafer, comprising: a step of arranging complete chips after polishing again on a carrier in order. The eco-fabricated wafer manufacturing method according to claim 15, wherein when the chip is polished, the back surface of the chip is polished by a polishing machine. In the procedure of arranging the complete chips after polishing on the carrier in order, the carrier is a plate with an arrangement groove, and the complete chips after polishing are arranged in order in the arrangement groove of the plate. The eco-processed wafer manufacturing method according to claim 15, wherein: 16. The eco according to claim 15, wherein the chips are first provided on the adhesive film and irradiated with ultraviolet light before the procedure of sequentially arranging the complete chips after polishing on the carrier. Processing wafer manufacturing method. Procedure to prepare an incomplete wafer with some chips too thick,
A sequence of placing complete chips on the carrier in sequence;
Polishing the back surface of the chip to reduce the thickness;
An eco-processed wafer manufacturing method comprising: a step of arranging complete chips after polishing again on a carrier in order. 20. The eco-processed wafer manufacturing method according to claim 19, wherein when the chip is polished, the back surface of the chip is polished by a polishing machine. In the procedure of arranging the complete chips after polishing on the carrier in order, the carrier is a plate with an arrangement groove, and the complete chips after polishing are arranged in order in the arrangement groove of the plate. The eco-processed wafer manufacturing method according to claim 19, wherein 20. The eco according to claim 19, wherein the chips are first provided on the adhesive film and irradiated with ultraviolet light before the procedure of sequentially placing the complete chips after polishing on the carrier. Processing wafer manufacturing method.

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