JP2013171980A - Small-sized electronic component module, and manufacturing method and manufacturing device of small-sized electronic component module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small-sized electronic component module of the same size as electronic components mounted on a substrate, and configuring a module upper surface; and a manufacturing method and a manufacturing device of the same.SOLUTION: A substrate smaller than the size of an electronic component configuring a module upper surface is used. A package of the electronic component mounted on the substrate has a BGA structure, and a position of a solder ball of the BGA structure is disposed on the inner side than the outline of the electronic component. In an aggregate substrate state, when cut into individual pieces, the substrate is cut from an opposite surface of a mounting surface of the electronic component. By using a space (a clearance) for the solder ball between the electronic component with the BGA structure mounted on the substrate and the substrate, only the substrate is cut. The cutting is carried out twice separately.

Description

  The present invention relates to a small electronic component module, a method for manufacturing the small electronic component module, and a manufacturing apparatus therefor.

  The spread of mobile electronic devices typified by mobile phone devices is expanding, and not only the functions are further increased, but further miniaturization is required. In terms of downsizing, module technology for cutting out a part of a circuit and miniaturizing it while proceeding with high-density mounting has been preceded, for example, Patent Documents 1 to 4 are disclosed.

  Patent Document 1 discloses a semiconductor device that is excellent in moisture resistance and reflow resistance and that can reliably connect a large number of terminals and a method for manufacturing the same.

  Patent Document 2 discloses a technology that can reduce the size and thickness of a semiconductor device and improve the reliability of the semiconductor device.

  Patent Document 3 discloses a large number of printed wiring boards on which high-definition components are mounted at an easy process and low cost, and a manufacturing method thereof.

  Patent Document 4 discloses a method for manufacturing a semiconductor device, which efficiently obtains a semiconductor chip piece to which an adhesive is attached, and is capable of satisfactorily connecting a semiconductor chip and a wiring board. A manufacturing method is disclosed.

JP 20041655311 A JP 2011-086766 A International Publication No. 2007/043639 International Publication No. 2007/148724

  Each disclosure of the above prior art document is incorporated herein by reference. The following analysis has been made from the viewpoint of the present invention.

  For example, as shown in FIG. 2, the conventional module is mounted on a substrate and is made using a substrate larger than the electronic component constituting the upper surface of the module. Therefore, the module size is larger than the electronic component mounted on the substrate. The size was getting bigger.

  As a module manufacturing method, for example, a conventional module manufacturing method is shown in FIG. To summarize FIG. 4, the electronic component built-in substrate (also simply referred to as a substrate) is designed in step (1), and solder bumps (terminals) are formed on the back surface (terminal surface) of the substrate in step (2). In the step (3), an electronic component is mounted on the surface of the substrate. Here, an electronic component (for example, LSI) having a BGA (ball grid array) structure is used as a package of the electronic component to be mounted. And, as shown in the step (4), in the conventional manufacturing method, when cutting into individual pieces, it is mounted on the substrate, taking into account the clearance of the electronic parts constituting the module upper surface, and the accuracy of the dicer, Since the substrate was cut larger than the size of the electronic component, the size of the module was larger than the electronic component mounted on the substrate.

  Where further downsizing of electronic devices continues to be required, in the conventional module manufacturing method, as described above, when an electronic component module is manufactured, the electronic component that constitutes the upper surface of the module when cut into individual pieces Since a larger substrate was created and the electronic component was cut into pieces with a cutting clearance (FIG. 2c), the size of the module would be larger than the electronic component mounted on the substrate, Further improvements are needed to support the further development of electronic devices that continue to pursue miniaturization.

  Accordingly, the present invention has been made in view of the above, and provides a small electronic component module having the same size as an electronic component mounted on a substrate and constituting the upper surface of the module, and a manufacturing method and manufacturing apparatus thereof. With the goal.

  That is, in one aspect of the present invention, an electronic component module including an electronic component built-in substrate (also simply referred to as a substrate) and an electronic component mounted on the substrate, the size of the substrate being on the substrate There is provided an electronic component module that is smaller in size than the electronic component (also referred to as a mounted component) that is mounted and constitutes the upper surface of the module. Here, the package of the electronic component (mounted component) mounted on the substrate has a BGA (ball grid array) structure, and the position of the solder ball of the BGA structure that joins the electronic component and the substrate is the electronic component. It is preferable that it is arranged inside the outer shape.

  In another aspect of the present invention, there is provided an electronic component module manufacturing method including an electronic component built-in substrate (also simply referred to as a substrate) and an electronic component (also referred to as a mounted component) mounted on the substrate. In the state, when cutting into individual pieces, a method of manufacturing an electronic component module is provided, which includes cutting from the opposite surface (terminal surface of the substrate) of the electronic component mounting surface. Here, when cutting into individual pieces in the collective substrate state, only the substrate is cut using the space (gap) between the solder balls of the electronic components constituting the BGA structure mounted on the substrate. It is preferable to do. Moreover, it is preferable to cut in two steps so that the chips at the time of individual piece cutting do not go around the mounting surface of the electronic component.

  In still another aspect of the present invention, an electronic component module manufacturing apparatus including an electronic component built-in substrate (also simply referred to as a substrate) and an electronic component (also referred to as a mounted component) mounted on the substrate, A dicer for cutting a substrate in a substrate state from a surface opposite to the electronic component mounting surface (terminal surface of the substrate) and a drive control unit thereof are provided, and the dicer is mounted on the substrate. An apparatus for manufacturing an electronic component module is provided, which includes control of cutting only the substrate using a space (gap) between the solder balls of the electronic component constituting the BGA structure and the substrate. . Here, it is preferable that the dicer of the manufacturing apparatus is controlled to be cut in two steps so that the chips at the time of individual piece cutting do not wrap around the mounting surface of the electronic component.

  According to each aspect of the present invention, the small electronic component module of the present invention is finished using a substrate smaller than an electronic component (for example, LSI) constituting the upper surface of the module, and the substrate is used as an electronic component built-in substrate. As a result, the size can be further reduced as compared with the prior art, thereby reducing the mounting area.

  Therefore, according to the present invention, when the module is cut into individual pieces, it is possible to cut only the substrate from the back side by utilizing the electronic component mounted on the substrate with the BGA structure. It is possible to realize a module having at least the same size as an electronic component (for example, an LSI or the like) constituting the. In addition, when the module is cut into two pieces with a dicer, the chips and other dust are cut into two pieces so that chips and other debris can be removed from the bottom of the BGA-structured electronic component (that is, the solder between the electronic component and the substrate). It is possible to prevent the ball from entering the space (gap) for the ball and shorting between the terminals. Also, at this time, the pattern of the solder ball is arranged so that there is no conductive wiring pattern at the end of the board when the board is cut because the position of the solder ball is arranged inside the outer shape of the electronic component mounted on the board. In this way, conductive chip dust can be eliminated, and in combination with the characteristic cut in the present invention described above, short-circuiting between terminals can be reliably prevented.

It is sectional drawing which shows an example of the small electronic component module of the individual piece state of this invention. It is sectional drawing which shows the conventional small electronic component module. It is a flowchart which shows Example 1 of the manufacturing method of this invention. It is a flowchart which shows the conventional manufacturing method. It is a flowchart which shows Example 2 of the manufacturing method of this invention. It is sectional drawing which shows an example of the small electronic component module of this invention which attached | subjected the wiring pattern.

  The outline of one embodiment of the present invention will be described below. Note that the reference numerals of the drawings attached to this summary are merely examples for facilitating understanding, and are not intended to limit the present invention to the illustrated embodiment.

  First, an outline of an embodiment of the present invention will be described with reference to the drawings.

  In one embodiment of the present invention, the small electronic component module of the present invention is configured as follows. FIG. 1 is a cross-sectional view of a small electronic component module manufactured in Examples 1 and 2 described below. As shown in FIG. 1, an electronic component (mounted component) mounted on a substrate of a small electronic component module is configured to mount a BGA package structure, and a BGA structure solder that joins the electronic component and the substrate. The position of the ball is arranged inside the outer shape of the electronic component mounted on the substrate. As for the substrate, a board with a built-in electronic component is used for compact and high-density mounting, and bumps are formed on the module terminals to improve soldering reliability during secondary mounting.

  That is, the configuration of the small electronic component module of the present invention can be understood by comparing the cross-sectional view of the module created by the conventional manufacturing method shown in FIG. The size of the electronic component mounted on the upper surface of the substrate is a BGA structure package, and the position of the BGA structure solder ball that joins the electronic component and the substrate is as follows. It is preferable that it is arranged inside the outer shape of the mounted component.

  Moreover, such a small electronic component module is manufactured by the manufacturing method of the small electronic component module of this invention as another embodiment of this invention. As shown in FIG. 3, the manufacturing method of the small electronic component module of the present invention cuts only the substrate from the module back surface (terminal surface) in the step of cutting into individual pieces (FIG. 3 (4)) in the collective substrate state. Including doing. This is because the electronic component mounted on the substrate is a BGA-structured electronic component, so it floats from the surface of the substrate by the amount of the solder ball, and cuts only the substrate using the space (gap). It is. At that time, as shown in FIG. 5, particularly, FIGS. 5 (4) to (6), chips at the time of individual piece cutting are mounted on the lower part (that is, on the substrate) of the electronic components constituting the upper surface of the module. It is preferable to divide into two times with a dicer so as not to go around the space (gap) for the solder ball between the electronic component and the substrate.

  Furthermore, such a method for manufacturing a small electronic component module includes, as still another embodiment of the present invention, at least a dicer for performing characteristic piece cutting in the manufacturing method and a drive control unit. Made by manufacturing equipment. An apparatus for manufacturing a small electronic component module according to the present invention includes a dicer for cutting a substrate in a collective substrate state into individual pieces, a dicer for cutting from the opposite surface (terminal surface of the substrate) of the electronic component, and a drive control unit thereof The dicer is controlled so as to cut only the substrate by utilizing the space (gap) between the solder balls of the electronic components constituting the BGA structure and the individual piece cut. It is preferable to control to cut in two steps so that the chips of the time do not go around the electronic component mounting surface.

  In this way, when manufacturing a small electronic component module, the electronic components to be mounted on the substrate in the state of the assembly board of the modules are mounted at the minimum interval of the component tolerance and the tolerance of the mounting machine. ) By cutting only the board, it can be mounted on the board and cut to be the same as or smaller than the electronic components that make up the module upper surface. The same size as the constituent electronic components is realized.

In addition, although a part or all of said embodiment may be described like the following forms, it is not restricted to the following.
[Mode 1] As in the first aspect, an electronic component module having an electronic component built-in substrate (substrate) and an electronic component mounted on the substrate, the size of the substrate being mounted on the substrate , Smaller than the size of the electronic component (also referred to as a mounted component) constituting the upper surface of the module.
[Mode 2] The package of the mounted component has a BGA (ball grid array) structure, and the position of the solder ball of the BGA structure that joins the electronic component and the substrate is disposed inside the outer shape of the mounted component. Preferably it is.
[Mode 3] As described in the second aspect, a method of manufacturing an electronic component module having an electronic component built-in substrate (substrate) and an electronic component mounted on the substrate, which is cut into individual pieces in a collective substrate state When cutting, cut from the surface opposite to the mounting surface of the electronic component (terminal surface of the substrate).
[Mode 4] When cutting into individual pieces in the collective substrate state, it is possible to cut only the substrate using a space (gap) between the solder balls of the electronic components constituting the BGA structure. preferable.
[Embodiment 5] It is preferable to cut in two steps so that the chips at the time of cutting the individual pieces do not go around the mounting surface of the electronic component.
[Mode 6] An electronic component module manufactured by the method according to any one of modes 3 to 5.
[Mode 7] An electronic component module manufacturing apparatus having an electronic component built-in substrate (substrate) and an electronic component mounted on the substrate, the electronic device for cutting a substrate in a collective substrate state into individual pieces A dicer that cuts from a surface opposite to the component mounting surface (terminal surface of the substrate) and a drive control unit thereof are provided, and the dicer is a space (with a substrate corresponding to a solder ball of an electronic component constituting the BGA structure) Control is performed so that only the substrate is cut using the gap.
[Embodiment 8] It is preferable that the cutting is performed in two steps so that the chips at the time of cutting the individual pieces do not wrap around the mounting surface of the electronic component.

  Hereinafter, the manufacturing method of the small electronic component module of the present invention will be described in detail with reference to the accompanying drawings.

  First, the method shown in FIG. 3 will be described. As shown in step (1) of FIG. 3, in a component peripheral circuit having a BGA structure, peripheral accessory components (capacitors, etc.) are used in an area smaller than the electronic component constituting the upper surface of the module using the electronic component built-in substrate. An electronic component built-in substrate (also simply referred to as a substrate) was designed. In step (2) of FIG. 3, solder bumps (terminals) were formed on the back surface (terminal surface) of the substrate by solder printing and reflowing in order to ensure soldering reliability during secondary mounting. In step (3) of FIG. 3, an electronic component was mounted on the surface of the substrate. An electronic component package (for example, LSI) having a BGA structure was used as a package of the electronic component mounted on the substrate. In addition, the mounting interval was the minimum interval of component tolerance and mounting machine tolerance. In addition, the method in particular of implementing step (1)-(3) is not restrict | limited, You may carry out using a well-known method.

  Next, as shown in step (4) of FIG. 3, the substrate was cut with a dicer from the back surface (terminal surface) of the substrate. The upper surface of the electronic component, which is the module surface (upper surface), was fixed with a plate or the like so as not to be separated after being cut into pieces. Then, it cut | disconnected from the back surface (terminal surface) of the board | substrate. Since the electronic component mounted on the substrate is a BGA-structured component, the solder ball part floats from the substrate, and only the substrate is cut using the gap. The cutting in step (4) was performed by a device (not shown) including at least a dicer controlled to cut only the substrate and a drive control unit thereof.

  Here, it can be understood by comparing with the step (4) of FIG. 4 showing the conventional manufacturing method, but the manufacturing method described above makes the substrate smaller than the electronic component size of the BGA mounted on the substrate. Since it can be cut, the size of the small electronic component module was finally finished with the same dimensions as the electronic component having the BGA structure mounted on the substrate.

  Next, a method shown in FIG. 5 will be described in Embodiment 2 of the present invention.

  The final cross section of the small electronic component module is the same as the cross section shown in FIG. 1 (that is, the cross section of the small electronic component module manufactured in Example 1), and (1) to (1) in FIG. 3) Steps up to step are the same as those in the first embodiment (that is, (1) to (3) in FIG. 3). Therefore, as for the manufacturing method of the present embodiment, as shown in (4) to (6) of FIG. 5, the step of dividing into individual pieces is cut in two times, and its specific The method will be described below.

  In the present embodiment, when a BAG structure electronic component is mounted on the surface of the substrate and cut from the back surface of the substrate, chips and other debris are collected under the BGA structure electronic component (that is, on the substrate). It is possible to prevent a short circuit between terminals that may occur when the dust is electrically conductive by entering the space (gap) of the solder ball between the electronic component of the BGA structure mounted on the board and the substrate.

  The steps (4) to (6) in FIG. 5 will be specifically described below. Here, in steps (4) and (6), the apparatus (not used) includes at least a dicer controlled to cut only the substrate and cut the substrate in two steps, and a drive control unit thereof. As shown).

  In step (4) of FIG. 5, the upper surface of the electronic component mounted on the substrate was fixed with a plate or the like, and half cut was performed with a dicer from the back surface using the above apparatus. Since the surface of the substrate is not completely cut, most of the chips do not wrap around the lower part of the electronic component mounted on the substrate (that is, the surface of the substrate) and can be half-cut. Then, the chips were cleaned from the back side. In the step (6) of FIG. 5, it was cut into individual pieces by the second cut by the above apparatus. The second cut of this example is the same as that of Example 1, and the electronic components mounted on the substrate are lifted from the substrate by the amount of solder balls. Therefore, only the substrate was cut using the gap.

  In the present embodiment, as shown in FIG. 6, there is no conductive wiring pattern at the substrate edge when the substrate is cut with respect to the portion of the substrate left without being cut at the time of the half cut in (4) step. So that the pattern was designed. In addition to the two cutting means of this embodiment, this pattern design can eliminate the generation of conductive chip dust, so that it was possible to reliably prevent shorting between terminals due to conductive dust.

  INDUSTRIAL APPLICABILITY The present invention is effective for downsizing and thinning electronic devices such as mobile phones, and in particular, mobile phones having high functions such as mobile phone terminals, smartphones, tablet devices, etc., for which further downsizing is pursued. It can be used for small electronic devices.

  It should be noted that the disclosures of prior art documents such as the above patent documents are incorporated herein by reference. Within the scope of the entire disclosure (including claims) of the present invention, the embodiments and examples can be changed and adjusted based on the basic technical concept. Further, various combinations or selections of various disclosed elements (including each element of each claim, each element of each embodiment, each element of each drawing, etc.) are possible within the scope of the claims of the present invention. It is. That is, the present invention of course includes various variations and modifications that could be made by those skilled in the art according to the entire disclosure including the claims and the technical idea.

1 Built-in component 2 Electronic component built-in substrate (substrate)
3 Electronic components (mounted components, BGA LSI)
4 Solder balls 5 Solder bumps 6 Dicer 7 Clearance 8 Dicer half cut 9 Dicer full cut 10 Wiring pattern 11 Design that prevents the wiring pattern from being exposed to the board edge when the board is cut a Size of components mounted on the board (Size)
b Size of substrate cut into pieces (size)
c Clearance

Claims (8)

  An electronic component module having an electronic component built-in substrate (substrate) and an electronic component mounted on the substrate, the size of the substrate being mounted on the substrate and constituting the upper surface of the module ( An electronic component module characterized by being smaller than the size of the mounting component).   The package of the electronic component mounted on the substrate has a BGA (ball grid array) structure, and the position of the solder ball of the BGA structure that joins the electronic component and the substrate is based on the outer shape of the electronic component. The electronic component module according to claim 1, wherein the electronic component module is disposed inside.   A method of manufacturing an electronic component module having an electronic component built-in substrate (substrate) and an electronic component (mounted component) mounted on the substrate, wherein the electronic component is cut into individual pieces in a collective substrate state. A manufacturing method characterized by cutting from the opposite surface (terminal surface of the substrate) of the mounting surface.   In the collective substrate state, when cutting into individual pieces, only the substrate is cut using a space (gap) with the substrate for the solder balls of the electronic components constituting the BGA structure. The method of manufacturing an electronic component module according to claim 3.   5. The method of manufacturing an electronic component module according to claim 4, wherein the chips at the time of cutting the individual pieces are cut in two steps so as not to wrap around the mounting surface of the electronic components.   The electronic component module manufactured by the method as described in any one of Claims 3 thru | or 5.   An electronic component module manufacturing apparatus having an electronic component built-in substrate (substrate) and an electronic component (mounted component) mounted on the substrate, the electronic device for cutting a substrate in a collective substrate state into individual pieces A dicer that cuts from a surface opposite to the component mounting surface (terminal surface of the substrate) and a drive control unit thereof, and the dicer is connected to the substrate corresponding to the solder balls of the electronic component constituting the BGA structure. A manufacturing apparatus controlled to cut only a substrate using a space (gap).   The dicer is controlled to be cut in two times so that chips when the individual pieces are cut do not wrap around the mounting surface of the electronic component. manufacturing device.

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