JP2013162083A - Circuit board and circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of easily and sufficiently connecting a ground of a circuit board and a ground outside the circuit board with few design restrains to the circuit board having a plate-like wiring board.SOLUTION: A circuit board 1 having a plate-like wiring board 3 to which a wiring of an electric circuit is applied has a plating-side end 2 at which at least one portion of an outer peripheral end of the wiring board 3 is plated with metal. The plating-side end 2 and a ground G of the electric circuit are electrically connected to each other.

Description

  The present invention relates to a circuit board including a plate-like wiring board on which wiring of an electric circuit is applied, and a circuit device configured by housing the circuit board in a board case.

  Conventionally, in an electric circuit (including an electronic circuit), various countermeasures (noise countermeasures) for suppressing radiation noise generated from the electric circuit and enhancing resistance to external noise arriving at the electric circuit have been taken. It was. As an effective technique for countermeasures against noise, it is known to strengthen the power supply (including ground) of an electric circuit. For example, it is often practiced to reduce the impedance of the electric circuit to the power source by electrically connecting a conductive case that houses the circuit board and the ground of the electric circuit. Thereby, noise generated from the electric circuit can be absorbed by the power source to suppress radiation noise, and noise arriving at the electric circuit can also be absorbed by the power source to enhance resistance to external noise.

  Japanese Patent Application Laid-Open No. 11-191560 (Patent Document 1) has an example in which a side ribbon made of a highly conductive gold ribbon is provided so as to hang from the upper surface to the lower surface of the circuit board so as to contact the side surface of the circuit board. It is disclosed. The side ribbon is provided so as to be electrically connected to a ground pattern provided on the outer surface of the circuit board (the lower surface in Patent Document 1). Then, the side surface of the circuit board on which the side ribbon is installed is attached to a conductive case (for example, made of aluminum) through conductive means constituted by a member having elasticity and conductivity, such as conductive rubber or a spring. Press contact. That is, the ground of the circuit board is short-circuited to the conductive case via the side ribbon and the conductive means, and the ground of the circuit board is strengthened (paragraphs 3, 16-19, FIGS. 1, 2 and the like).

  However, as described in Patent Document 1, such a side ribbon is attached to the circuit board mounting surface (including both front and back surfaces in the case of double-sided mounting), as pasted from the upper surface to the lower surface of the circuit board. Part is needed. That is, a certain amount of pasting area is required also on the mounting surface of the circuit board. When the mounting density of the circuit board is high, it may be difficult to move or rearrange the mounted components to secure the pasting area. Further, as the parts are moved or the wiring is changed, the electrical characteristics may be changed and the circuit needs to be re-evaluated, or the electrical characteristics may be degraded and the product performance may be affected.

JP 11-191560 A

  In view of the above-mentioned background art, there are few design restrictions on a circuit board provided with a plate-like wiring board, and a technique that can easily and satisfactorily connect the ground of the circuit board and the external ground of the circuit board It is desirable to provide

In view of the above problems, the characteristic configuration of the circuit board according to the present invention is:
A circuit board comprising at least a plate-like wiring board on which wiring of an electric circuit is provided, and having a plating side end portion in which metal plating is applied to at least a part of an outer peripheral side end face of the wiring board, and the plating The side end portion and the ground of the electric circuit are electrically connected.

  Metal plating on the wiring board can be performed in a general board manufacturing process. At the time of passing through the substrate manufacturing process, the plated substrate side end portion is provided on the wiring substrate. Therefore, unlike Patent Document 1, there is no need to newly provide a process of attaching a gold ribbon with good conductivity after the completion of the wiring board. As a result, the manufacturing cost of the wiring board and the circuit board using the wiring board can be reduced. Moreover, the area of the direction along the mounting surface of a plating side edge part is generally about 0.5-2 mm. For example, as in Patent Document 1, a gold ribbon attached to the circuit board from the upper surface to the lower surface is bent at about 90 degrees at the side edge of the substrate. The adhesive margin required to attach the gold ribbon requires an adhesive force that can overcome the restoring force of the folded gold ribbon. Therefore, the adhesive margin is often required to be approximately 10 mm or more from the outer peripheral end of the circuit board. On the other hand, when the plating side end portion is provided as in this characteristic configuration, the area required in the direction along the mounting surface is greatly reduced. Therefore, there are almost no design restrictions in the mounting design. Further, the plating side end portion is provided on the outer peripheral side end surface of the wiring board, and is exposed to the outside of the circuit board. Therefore, it is possible to easily and satisfactorily connect the ground of the circuit board and the ground outside the circuit board through the plating side end.

  A general substrate manufacturing process includes a process of forming a through hole. Through-holes are those in which metal plating is applied around the inner wall portion of the through-hole penetrating in the direction perpendicular to the mounting surface of the substrate and the opening portions of the through-holes on both surfaces of the substrate, thereby conducting both surfaces of the substrate. . After forming the through hole, the substrate can be cut so that the inner wall portion of the through hole is exposed, so that the inner wall portion can be used as a plating side end portion. Further, it is common practice to cut a substrate manufactured through the substrate manufacturing process into a plurality of substrate pieces. Therefore, it is possible to obtain a circuit board having a plated side end portion in which metal plating is applied to at least a part of the outer peripheral side end surface by using a general board manufacturing process or board assembly process. That is, by using the through hole, it is possible to obtain a wiring substrate having a plated side end portion with almost no increase in manufacturing cost. Further, the outermost end surface of the substrate that has undergone the punching process in the general substrate manufacturing process has a broken surface. It is difficult to apply metal plating to such a fracture surface, and it is necessary to devise measures such as increasing the thickness of the plating. On the other hand, the inner wall portion of the through hole in which the through hole is formed is not such a fracture surface, but is a cutting surface by a drill, a cutter, or the like, so that metal plating can be easily performed.

  As described above, as one aspect of using the through hole, the circuit board according to the present invention penetrates the substrate material to be the wiring board in a direction orthogonal to the mounting surface, and the metal plating is applied to the inner wall portion. The metal plating through-hole is formed, and a dividing line is set that crosses the opening of the metal plating through-hole in the mounting surface along the mounting surface and can divide the substrate material into at least two. The wiring board is configured using at least one board material after the board material is cut by the dividing line, and the plating side end portion is exposed on the outer peripheral side end face of the wiring board. It is preferable that the inner wall portion of the plated through hole is used. The dividing lines are not limited to those set by lines physically formed on the substrate material, such as grooves, continuous holes (perforations), marking (printing), and the like. It may be an invisible virtual line that serves as a guideline.

  Here, the substrate material is set on the second direction side opposite to the first direction, with the wiring portion configured on the first direction side along the mounting surface with respect to the dividing line. It is preferable that the wiring board is constituted by the wiring part after the substrate material is cut by the dividing line. According to this configuration, it is possible to manufacture a wiring board using a substrate material in which a non-wiring part having at least an area capable of forming a metal plating through hole is secured for a wiring part to be a wiring board. Therefore, it is possible to obtain a wiring board having a plated side end without substantially increasing the manufacturing cost.

  Here, it is further preferable that the non-wiring portion is a support portion that supports the substrate material when a circuit component is mounted on the wiring portion before the substrate material is cut. In order to mount circuit components on the wiring part (wiring board) (mounting circuit parts and soldering), in terms of circuit reliability and work efficiency, the board material is used in places other than the wiring part. Is preferably supported. Since the non-wiring portion is not mounted with circuit components and is not wired, it is preferable to support the substrate material with the non-wiring portion and mount the circuit components on the wiring portion.

  From another point of view, generally, in order to mount circuit components on the wiring part, a substrate material to which a non-wiring part serving as a support part is added is often manufactured. In many cases, after the circuit components are mounted, such a non-wiring portion is cut and the circuit board on which the circuit components are mounted becomes a circuit board mounted on a product. In this case, the non-wiring portion is a discarded board that is discarded after the component mounting process. When the metal plating through hole is formed between the non-wiring portion and the wiring portion which become such a discarded substrate, it is not necessary to newly provide the non-wiring portion in order to form the metal plating through hole. Therefore, it is possible to obtain a wiring substrate having a plating side end without increasing the area of the substrate material at all.

  As the substrate, there is a multilayer substrate having a wiring layer on the inner layer of the substrate in addition to the front and back surfaces which are the outer surface (surface layer surface). The wiring on the inner layer of the board can be connected to the metal plating on the inner layer of the board that is parallel to the plane perpendicular to the mounting surface of the board (the outer edge of the board or the inner wall of the through hole). It is. For example, if the plating side end formed on the outer peripheral side end surface of the wiring board is connected to the ground wiring of the inner layer of the board, the plating side end and the ground of the electric circuit are used without using the wiring on the outer surface of the board. And can be connected. That is, on the mounting surface on the outer surface of the wiring board, the plating side end and the ground of the electric circuit can be connected with almost no mounting restrictions. As one aspect using a multilayer substrate, in the circuit board according to the present invention, the wiring board has at least one inner wiring layer in an inner layer of the substrate, and at least one of the inner wiring layers is It is an inner layer ground layer corresponding to the ground of the electric circuit, and it is preferable that the plating side end and the inner layer ground layer are electrically connected.

  As described above, the plating-side end portion is provided on the outer peripheral side end surface of the wiring board and is exposed to the outside of the circuit board. Therefore, it is possible to easily and satisfactorily connect the ground of the circuit board and the ground outside the circuit board through the plating side end. As one aspect of such a circuit device, the circuit device according to the present invention contains a circuit board, a board case made of a conductive material, and the circuit board housed in the board case. It is preferable to include a conductive member disposed between the plating side end and the inner wall of the substrate case facing the plating side end. According to this configuration, the ground of the electric circuit and the ground realized by the substrate case are satisfactorily connected via the plating side end portion and the conductive member.

  Here, it is preferable that the conductive member is disposed so as to protrude from the inner wall of the substrate case facing the plating side end portion toward the circuit board. According to this configuration, the plating-side end portion of the circuit board can be reliably and easily brought into contact with the conductive member.

  Further, the substrate case has a position defining portion that defines a position of the circuit board with respect to the substrate case, the conductive member is configured by an elastic member, and the conductive member is formed by the conductive member. It is preferable that the circuit board is provided so as to restrict the movement of the circuit board in the urging direction. According to this configuration, the conductive member and the plating-side end portion are in close contact with each other by the elastic force of the conductive member and the regulation force by the position defining portion, and good conductivity is ensured.

Sectional drawing of the circuit device provided with the board case which accommodated the circuit board A plan view schematically showing an example of a circuit board Outline drawing schematically showing an example of the board material constituting the wiring board Cross-sectional view of substrate showing structure of V-cut groove Outline drawing schematically showing an example of the board material constituting the wiring board Outline drawing schematically showing an example of wiring board Explanatory drawing which shows the manufacturing process of a circuit device typically Outline drawing schematically showing an example of the board material constituting the wiring board Outline drawing schematically showing an example of the board material constituting the wiring board Outline drawing schematically showing an example of the board material constituting the wiring board Outline drawing schematically showing an example of the board material constituting the wiring board Outline drawing schematically showing an example of the board material constituting the wiring board Outline drawing schematically showing an example of wiring board Sectional drawing which shows an example of a wiring board typically Sectional drawing which shows an example of a wiring board typically Sectional drawing which shows an example of the conventional circuit device typically

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, the gist of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 shows a cross-sectional view of a circuit device 9 including a circuit board 1 according to the present invention and a board case 7 containing the circuit board 1. FIG. 2 shows a plan view of the circuit board 1. The circuit board 1 is constituted by a plate-like wiring board 3 on which an electric circuit (including an electronic circuit) is wired. Here, the wiring of the electric circuit includes lands for mounting components and performing soldering, connection lines for connecting the components, and the like. A circuit board 1 (wiring board 3) shown in FIG. 1 and FIG. 2 is a multilayer board having an inner wiring layer capable of applying a wiring pattern to the inner layer of the board. In FIG. 1 and FIG. 2, only the inner ground layer 3g corresponding to the ground G of the electric circuit constructed on the wiring board 3 is shown as an inner layer for simplification. In FIG. 2, reference numeral 31 simulates a component mounting land formed on the wiring board 3. However, the land 31 is schematically shown in the description of the assembled board to be described later with reference to FIGS. It does not correspond. Therefore, consistency with other drawings (for example, the perspective view of FIG. 7 and the cross-sectional view of FIG. 1) is not guaranteed.

  As shown in FIG. 2, a plating-side end portion 2 on which metal plating is applied is formed on a side surface at the outer peripheral end portion of the mounting surface of the wiring board 3, that is, at least a part of the outer peripheral end surface. FIG. 1 shows a cross section in which a line passing through the plating side end portion 2 is a cross sectional line in a state where the circuit board 1 is accommodated in the substrate case 7. The plating side end portion 2 is electrically connected to the ground of the electric circuit constructed on the wiring board 3. In the example shown in FIG. 1, the inner layer ground layer constituted by the inner wiring layer corresponds to the ground layer of the electric circuit. And as shown in sectional drawing of FIG. 1, the inner-layer ground layer and the plating side edge part are electrically connected.

  The substrate case 7 is made of a conductive material. In a state in which the circuit board 1 is accommodated in the board case 7, the space between the plating side end 2 of the circuit board 1 (wiring board 3) and the inner wall 7 a of the board case 7 that opposes the plating side end 2. Is provided with a conductive member 71. In the example of FIG. 1, the conductive member 71 is configured by a spring-like member (elastic member) arranged in a state of protruding from the inner wall 7 a of the substrate case 7 facing the plating side end portion 2 to the circuit board 1 side. ing. The circuit board 1 is restricted from moving in the direction in which the spring-like member is biased by positioning pins 72 (position defining portions) that pass through the positioning through holes 3 h of the circuit board 1. For this reason, the spring-like member (conductive member 71) in a close contact state and the plating side end portion 2 are electrically connected. Thereby, the ground of the electric circuit constructed on the circuit board 1 is electrically connected to the board case 7 made of a conductive material via the plating side end 2 and the conductive member 71. Therefore, the ground of the electric circuit is strengthened.

  According to the present invention, a circuit board 1 including a plate-like wiring board 3 on which at least an electric circuit wiring is provided has a plating side end 2 in which metal plating is applied to at least a part of the outer peripheral side end face of the wiring board 3. And the plating side end 2 and the ground G of the electric circuit are electrically connected. In addition, the circuit device 9 according to the present invention accommodates the circuit board 1 and includes a substrate case 7 made of a conductive material, the plating-side end portion 2 of the circuit board 1 accommodated in the substrate case 7, and the circuit board 9. It is characterized by comprising a conductive member 71 disposed between the inner side 7a of the substrate case 7 facing the plating side end 2. The gist of the present invention has been described above. Hereinafter, the present invention having such characteristics will be described by exemplifying a preferred embodiment that more specifically realizes the present invention.

  As shown in FIG. 2, the wiring substrate 3 has a plating side end portion 2 in which metal plating such as copper plating is applied to at least a part of the outer peripheral side end surface. The plating side end portion 2 may be provided on the outer peripheral side end surface of the substrate manufactured through the punching step in a general substrate manufacturing process, but such an outer peripheral side end surface has a fractured surface and is uniformly metal. It is not easy to apply plating. For this reason, for example, the plating thickness may need to be increased more than usual, and the material cost may increase. In addition, if a process for performing metal plating on the outer peripheral side end face is provided after the punching process, the number of processes in the substrate manufacturing process may be increased, and the manufacturing cost may be increased.

  Therefore, in the present embodiment, the plating-side end portion 2 is formed using a through-hole generating process included in a general substrate manufacturing process. The inner wall portion of the through hole in which the through hole is formed is not a fracture surface but a cutting surface by a drill or a cutter. Therefore, the inner wall can be easily plated with metal. Specifically, as shown in FIG. 3, a through-hole penetrating in the direction perpendicular to the mounting surface is formed in the substrate material 8 to be the wiring board 3, and the inner wall portion 6a of the through-hole is subjected to metal plating. The metal plating through hole 6 is used. That is, the metal plating through hole 6 is generated in the through hole generation step, as with the other signal through holes of the wiring board 3.

  Furthermore, the dividing line 5 which can divide the board | substrate material 8 into at least two is set to the board | substrate material 8 across the opening part of the metal plating through-hole 6 in a mounting surface along a mounting surface. For example, as shown in FIG. 4, the dividing line 5 can be a V-cut groove 51 formed in the substrate material 8 by providing a groove having a V-shaped cross section. If the dimensional accuracy of the outer shape of the wiring board 3 is allowed, as shown in FIG. 5, a virtual line (perforation line 52) constituted by perforations in which the through holes 89 are arranged may be used as the dividing line 5. Good. Alternatively, when the substrate material 8 is cut by a cutter or the like, a line (cut line) defined by a positioning land or the like formed on the substrate material 8 may be used as the dividing line 5. Such a cut line may be an invisible virtual line. Moreover, it is not limited to a blade such as a cutter, and may be cut by laser irradiation or the like, and in this case, an invisible virtual line that serves as a guide for cutting may be set as a cut line. Of course, in order to visualize the virtual line, the cut line (partition line 5) may be formed on the substrate material 8 by silk printing or the like.

  Whatever the dividing line 5 is set, the wiring board 3 is configured using at least one substrate material 8 after the substrate material 8 is divided by the dividing line 5. As illustrated in FIG. 3, the substrate material 8 includes a wiring portion 8a configured on the first direction Y1 side along the mounting surface with respect to the dividing line, and a second direction Y2 opposite to the first direction Y1. And a non-wiring portion 8b set on the side. The wiring substrate 3 is configured using the wiring portion 8 a after the substrate material 8 is cut by the dividing line 5.

  In the substrate material 8 illustrated in FIG. 3, the substrate material 8 on one side after the substrate material 8 is divided by the dividing line 5, that is, the substrate material 8 of the wiring portion 8 a on the first direction Y <b> 1 side is the wiring substrate 3. Become. The substrate material 8 on the other side, that is, the substrate material 8 of the non-wiring portion 8b on the second direction Y2 side, becomes the non-wiring substrate 4. As one aspect, the non-wiring board 4 is a discarded board that is not used for products or the like. When the substrate material 8 is cut at the dividing line 5, the inner wall portion 6 a of the metal plating through hole 6 is exposed at the outer peripheral side end face of the wiring substrate 3. That is, as shown in FIG. 6, the plating-side end portion 2 of the wiring substrate 3 is constituted by an inner wall portion 6 a of the metal plating through hole 6 exposed at the outer peripheral side end surface of the wiring substrate 3 after being cut at the dividing line 5. Is done.

  Here, the circuit board 1 constituted by the wiring board 3 illustrated in FIGS. 3 to 6 is accommodated in the board case 7 in a state in which the conductive board case 7 and the ground of the circuit board 1 are electrically connected, A preferred mode of configuring the circuit device 9 is illustrated in FIG. As shown in FIG. 7, circuit components are mounted on a substrate material 8 (raw substrate) configured to include a wiring portion 8 a and a non-wiring portion 8 b, thereby forming a substrate assembly 11. Next, the non-wiring portion 8b of the board material 8 constituting the board assembly 11 is removed, and the board assembly 11 becomes the circuit board assembly 12 (circuit board 1). As shown in FIG. 7, the metal plating through-hole 6 is formed in the substrate material 8, and when the non-wiring portion 8 b is removed, the inner wall portion 6 a of the metal plating through-hole 6 becomes the outer periphery of the wiring substrate 3. It is exposed as a side end face. As a result, the inner wall portion 6 a becomes the plating side end portion 2. FIG. 7 illustrates a form in which perforations are formed in the substrate material 8 as illustrated in FIG.

  A metallic spring-like member (elastic member) is disposed on the inner wall 7a of the substrate case 7 as the conductive member 71 so as to protrude from the inner wall 7a to the circuit board 1 side. The circuit board 1 is accommodated in the board case 7 so as to press the plating side end 2 of the circuit board 1 against the spring-like member. Although not shown in FIG. 7, the outer peripheral side end surface of the circuit board 1 opposite to the side on which the plating side end 2 is provided is, for example, the inner wall of the substrate case 7 (the inner wall 7a on which the conductive member 71 is disposed). It is preferable to contact the inner wall on the opposite side. Thereby, the movement of the circuit board 1 due to the urging force of the conductive member 71 formed of a metal spring-like member can be restricted. In this case, the inner wall of the substrate case 7 functions as a position defining portion.

  Of course, the outer peripheral side end surface of the circuit board 1 is not in contact with the inner wall of the substrate case 7 but is brought into contact with a contact portion such as a boss separately provided in the substrate case 7 to restrict the movement thereof. May be. In this case, the contact portion functions as a position defining portion. Further, as illustrated in FIG. 1, the circuit board 1 and the substrate case 7 may be positioned by inserting positioning pins 72 provided on the substrate case 7 into the positioning through holes 3 h of the circuit substrate 1. . In this case, the movement of the circuit board 1 due to the urging force of the conductive member 71 is restricted by the contact between the outer peripheral end surface of the positioning pin 72 and the inner wall portion of the positioning through hole 3h. In this case, as described above, the positioning pin 72 functions as a position defining portion.

  As described above, the circuit board 1 is restricted from moving in the direction in which the spring-like member as the conductive member 71 is biased by the position defining portion such as the positioning pin 72. For this reason, the spring-like member (conductive member 71) in a close contact state and the plating side end portion 2 are electrically connected. Thereby, the ground G of the electric circuit constructed on the circuit board 1 is electrically connected to the board case 7 made of a conductive material via the plating side end 2 and the conductive member 71. Therefore, the ground of the electric circuit is strengthened.

  By the way, in many cases, a discarded board such as the non-wiring board 4 is used in an automatic board assembly apparatus used when a component is mounted on the wiring board 3 (the board material 8 as a raw board). 8) is a support portion 8c for transporting. The automatic board assembly apparatus is, for example, a solder paste apparatus that applies cream solder to the wiring part 8a (wiring board 3) of the board material 8, or an automatic mounting machine that places electronic components or the like on the wiring part 8a of the board material 8. A reflow device (automatic soldering device) that performs soldering by melting cream solder, and a flow device that performs soldering by bringing the wiring portion 8a of the substrate material 8 into contact with the water surface of the solder tank in which the melted solder is stored (automatic) Soldering device).

  The automatic board assembly apparatus moves the wiring board 3 (board material 8) on a conveyor such as a belt conveyor, and sequentially advances the mounting process for each wiring board 3 (each wiring portion 8a of the board material 8). . At this time, it is of course not preferable to bring the transport belt, the transport roller, or the like of the transport device into contact with the wiring board 3 (wiring portion 8a of the substrate material 8) on which the components are mounted. Therefore, in general, the non-wiring substrate 4 serving as the support portion 8 c is provided along with the wiring substrate 3. In other words, the non-wiring portion 8b of the substrate material 8 is preferably a support portion 8c that supports the substrate material 8 when circuit components are mounted on the wiring portion 8a before the substrate material 8 is divided. In addition, an operator may place a component or perform soldering in a state where the substrate material 8 is installed on a jig or the like without using the transfer device. Of course, even in this case, the non-wiring portion 8b functions as a support portion 8c that supports the substrate material 8 when circuit components are mounted on the wiring portion 8a.

  The metal plating through-hole 6 described above is preferably formed across the non-wiring board 4 and the wiring board 3 which are the support portions 8c. That is, when the metal plating through-hole 6 on the mounting surface is formed so that the opening thereof is located on the dividing line 5 set at the boundary between the non-wiring substrate 4 and the wiring substrate 3 that becomes the support portion 8c. Is preferred. In other words, the dividing line 5 is set at the boundary between the non-wiring board 4 and the wiring board 3 to be the support portion 8c, and crosses the opening of the metal plating through hole 6 on the mounting surface along the mounting surface. It is preferable that the plate 8 is set at a position where it can be divided into at least two.

  When the non-wiring board 4 is a support portion 8c used when the board material 8 is conveyed in the automatic board assembling apparatus, the non-wiring board 4 is preferably provided on both sides of the wiring board 3. In this case, there are two boundaries between the wiring board 3 and the non-wiring board 4, but the dividing line 5 in which the metal plating through-hole 6 is formed on the line is either one as shown in FIG. It is sufficient if it is provided only in the area. However, when it is desired to conduct with the substrate case 7 at a plurality of locations on the circuit board 1, metal plated through holes 6 are formed at the boundary between the wiring substrate 3 and the non-wiring substrate 4 as shown in FIG. May be. In particular, the ground for enhancing the noise resistance is preferably configured so that the number of ends (terminals) is as small as possible by, for example, turning around, rather than the presence of dead ends (ends). When the circuit board 1 is configured to be electrically connected to the substrate case 7 at a plurality of locations, particularly at two points apart from each other, the end portions are reduced and the noise resistance of the circuit device 9 is increased.

  By the way, the wiring board 3 is cut out from a large-sized standardized board material called a workpiece. Also, there are cases where the automatic board assembly apparatus has a board size with good transport efficiency and mounting efficiency. For this reason, an assembled substrate in which a plurality of wiring substrates 3 are formed on one substrate material 8 is often used. For example, as shown in FIG. 10, when an assembled substrate including two wiring substrates 3 is configured as the substrate material 8, the boundary between both the left and right non-wiring substrates 4 is a dividing line 5, and both dividing lines 5 A metal plating through hole 6 may be provided.

  Further, as shown in FIG. 11, a metal plating through-hole 6 may be provided at the boundary between adjacent wiring boards 3 in an assembled board including two wiring boards 3. In this case, the metal plating through hole 6 does not remain on the non-wiring substrate 4 side after the substrate material 8 is divided. That is, all of the inner wall portion 6 a of the metal plating through hole 6 becomes the plating side end portion 2 of the wiring board 3. Therefore, the metal plating material can be used without any surplus.

  The present invention has been described above by exemplifying various embodiments. Here, as a comparative example, a conventional representative form of connecting the circuit board 1 and the substrate case 7 is illustrated. FIG. 16 is a cross-sectional view showing the relationship between a conventional circuit board 101, a board case 107 that houses the circuit board 101, and a conductive member 171 that conducts the board case 107 and the ground G of the circuit board 101. . The conductive member 171 is fixed to the inner wall 107 a of the substrate case 7. On the circuit board 101, a contact land 102 for electrically connecting the conductive member 171 and the ground G by contact with the conductive member 171 is formed. The contact lands 102 are formed on both mounting surfaces of the circuit board 101 having mounting surfaces formed on both sides. The metallic conductive member 171 is a clip-like member that can sandwich the plate-like circuit board 101 in the thickness direction. When the clip portion of the conductive member 171 contacts the contact land 102 of the circuit board 101 and presses the circuit board 101 in the plate thickness direction, conduction between the conductive member 171 and the contact land 102 is ensured.

  In such a form, when the conductive member 171 and the ground G of the circuit board 101 are electrically connected, the conductive member 171 sandwiches the circuit board 101 so that the length D from the outer peripheral edge of the circuit board 101 to the inside. An area where component mounting and wiring cannot be performed is required. On the other hand, as illustrated in FIG. 1 and FIG. 7, when the present invention is applied, there is almost no region in which mounting and wiring are impossible from the outer peripheral end of the circuit board 1 to the inside. Therefore, when the present invention is applied, design restrictions in mounting design hardly occur.

  Further, for example, as illustrated and described in FIGS. 3 to 11 and the like, between the non-wiring portion 8b to be a discarded substrate in the substrate material 8 and the wiring portion 8a of the substrate material 8, the plating side end Since the portion 2 is formed, the circuit board 1 already used for a product can be easily improved. That is, even when a new noise countermeasure is required for a circuit board 1 that has already been mass-produced, the plating-side end 2 can be added with almost no change in mounting design. That is, by using the boundary portion between the non-wiring portion 8b and the wiring portion 8a, the plating side end portion 2 is provided on the wiring board 3 (circuit board 1) with almost no change in the mounting design in the wiring portion 8a. Can do. In the conventional technique as illustrated in FIG. 16, there is a possibility that the mounting area or the wiring area in the wiring portion 8a has to be trimmed, which may require a change in the mounting design. In the present invention, when a circuit board 1 is newly designed for mounting, the degree of freedom in mounting design is high, the mounting density can be increased, and noise countermeasures are added to the circuit board 1 after mounting design. Has little effect on the pre-designed mounting design.

[Other Embodiments]
Hereinafter, other embodiments of the present invention will be described. Note that the configuration of each embodiment described below is not limited to being applied independently, and can be applied in combination with the configuration of other embodiments as long as no contradiction arises.

(1) In the above embodiment, the substrate material 8 including the two wiring substrates 3 is exemplified as the assembled substrate. However, as a matter of course, a configuration in which three or more wiring substrates 3 are provided in one substrate material 8 is adopted. You can also. As an example, as shown in FIG. 12, a mode in which four wiring boards 3 are provided on one board material 8 and a metal plating through hole 6 is provided at a boundary portion of these wiring boards 3 is one of the preferred embodiments. is there.

(2) In the above embodiment, the conductive member 71 is exemplified by a metal spring-like member. However, the conductive member 71 is not limited to this form. For example, a configuration in which the conductive member 71 is configured by a gasket in which an outer surface of a sponge-like elastic material is surrounded by a metal mesh is also a preferred embodiment. By installing this gasket on the inner wall 7a of the substrate case 7, the circuit board 1 can be easily accommodated in the substrate case 7 as in the embodiment illustrated in FIG.

(3) In the above embodiment, the multilayer substrate is used as the circuit board 1 (wiring board 3). However, the circuit board 1 has a wiring layer formed only on the outer surface (surface layer surface) of the board. Alternatively, a double-sided substrate or a single-sided substrate may be used. For example, as illustrated in FIG. 13 and FIG. 14, the surface ground pattern 3 s formed on the outer surface of the circuit board 1 and the plating side end 2 formed on the outer peripheral side end face of the wiring board 3 are electrically connected. It may be connected. Since the same method as the embodiment described above with reference to FIGS. 3 to 12 and the like can be applied to the method for forming the plating side end portion 2, a detailed description thereof will be omitted.

(4) Moreover, even if it is a multilayer board | substrate, as illustrated in FIG. 15, the surface ground pattern 3s formed in the outer surface of the circuit board 1 and the plating side edge part 2 are taken. Can do. In this case, it is preferable that the inner ground layer 3g and the surface ground pattern 3s are connected by the through hole 3t.

(5) For example, in the embodiment shown in FIGS. 3 to 11, the case where the metal plating through-hole 6 is configured by one long hole is illustrated. However, the metal plating through-hole 6 may be constituted by a plurality of holes constituting perforations. In this case, the plating side end portion 2 is intermittently formed at a plurality of locations on the outer peripheral side end portion of the wiring board 3 (circuit board 1). On the side of the substrate case 7, the ground member G of the circuit board 1 and the substrate case 7 can be made to conduct well by installing the conductive member 71 in accordance with the plating-side end portion 2 formed intermittently. Is possible.

  The present invention can be applied to a circuit board provided with a plate-like wiring board on which wiring of an electric circuit is provided, and a circuit device configured by housing the circuit board in a board case.

1: Circuit board 2: Plating side end 3: Wiring board 3g: Inner layer ground layer 5: Dividing line 6: Metal plating through hole 6a: Inner wall part of metal plating through hole 7: Board case 7a: Inner wall 8 of board case: Substrate material 8a: wiring portion 8b: non-wiring portion 8c: support portion 9: circuit device 71: conductive member G: ground Y1: first direction Y2: second direction

Claims (8)

A circuit board comprising a plate-like wiring board on which wiring of at least an electric circuit is applied,
Having a plating side end portion subjected to metal plating on at least a part of the outer peripheral side end surface of the wiring board;
A circuit board in which the plating side end and the ground of the electric circuit are electrically connected. In the substrate material to be the wiring board,
While penetrating in the direction orthogonal to the mounting surface, the metal plating through hole with the metal plating is formed on the inner wall,
A dividing line is set that crosses the opening of the metal plating through hole in the mounting surface along the mounting surface and can divide the substrate material into at least two parts.
The wiring board is configured using at least one board material after the board material is cut by the dividing line,
2. The circuit board according to claim 1, wherein the plating side end portion is configured by an inner wall portion of the metal plating through hole exposed at an outer peripheral side end surface of the wiring board. The substrate material includes a wiring portion configured on a first direction side along the mounting surface with respect to the dividing line, and a non-wiring portion set on a second direction side opposite to the first direction. Comprising
The circuit board according to claim 2, wherein the wiring board is configured by the wiring portion after the board material is cut by the dividing line.   The circuit board according to claim 3, wherein the non-wiring portion is a support portion that supports the substrate material when a circuit component is mounted on the wiring portion before the substrate material is cut. The wiring board has at least one inner wiring layer in the board inner layer,
At least one of the inner wiring layers is an inner ground layer corresponding to the ground of the electric circuit,
The circuit board according to any one of claims 1 to 4, wherein the plating side end portion and the inner ground layer are electrically connected. A circuit board case containing the circuit board according to any one of claims 1 to 5 and made of a conductive material;
A circuit device comprising: a conductive member disposed between the plating side end portion of the circuit board housed in the substrate case and an inner wall of the substrate case facing the plating side end portion.   The circuit device according to claim 6, wherein the conductive member is disposed so as to protrude from an inner wall of the substrate case facing the plating side end portion toward the circuit board. The substrate case has a position defining portion that defines the position of the circuit board with respect to the substrate case,
The conductive member is constituted by an elastic member,
The circuit device according to claim 7, wherein the position defining portion is provided so as to restrict movement of the circuit board in a direction in which the conductive member biases the circuit board.

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