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JP2013149751A - Charged particle beam lens - Google Patents

Charged particle beam lens Download PDF

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JP2013149751A
JP2013149751A JP2012008318A JP2012008318A JP2013149751A JP 2013149751 A JP2013149751 A JP 2013149751A JP 2012008318 A JP2012008318 A JP 2012008318A JP 2012008318 A JP2012008318 A JP 2012008318A JP 2013149751 A JP2013149751 A JP 2013149751A
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anode
cathode
insulator
lens
charged particle
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Koichi Takasaki
晃一 高崎
Yoichi Ando
洋一 安藤
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Canon Inc
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Canon Inc
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Abstract

【課題】レンズ周辺部での沿面放電の発生を抑制して耐圧性を向上させた荷電粒子線レンズを提供することである。
【解決手段】荷電粒子線レンズは、板状の陽極11と、板状の陰極12と、陽極11と陰極12の間に配置される絶縁体13を有する。絶縁体13と陽極11と陰極12がそれぞれ荷電ビームを通す一つ以上のビーム通過部14を持ち、ビーム通過部14の周りにおいて、陽極11の外周側面aは絶縁体13の最外側面c及び陰極12の外周側面bそれぞれより、ビーム通過部14に近い内側に配置されている。
【選択図】図1
An object of the present invention is to provide a charged particle beam lens having improved pressure resistance by suppressing the occurrence of creeping discharge at the periphery of the lens.
A charged particle beam lens includes a plate-like anode, a plate-like cathode, and an insulator disposed between the anode and the cathode. The insulator 13, the anode 11, and the cathode 12 each have one or more beam passage portions 14 through which a charged beam passes. Around the beam passage portion 14, the outer peripheral side surface a of the anode 11 is the outermost surface c and the insulator 13. The cathode 12 is disposed on the inner side closer to the beam passing portion 14 than the outer peripheral side surface b of the cathode 12.
[Selection] Figure 1

Description

本発明は、電子ビーム等の荷電粒子線を用いた装置に使用される荷電粒子線光学系の技術分野に属し、特に露光装置などに用いられる荷電粒子線光学系に関するものである。 The present invention belongs to a technical field of a charged particle beam optical system used in an apparatus using a charged particle beam such as an electron beam, and particularly relates to a charged particle beam optical system used in an exposure apparatus or the like.

半導体デバイスの生産において、電子ビーム露光技術は、0.1μm以下の微細パターン露光を可能とするリソグラフィの有力候補である。これらの装置では、電子ビームの光学特性を制御するための電子光学素子が用いられる。特に、電子レンズには、電磁型と静電型があり、静電型は、電磁型に比べ、コイルコアを設ける必要がなく構成が容易であり小型化に有利となる。また、電子ビーム露光技術のうち、マスクを用いずに複数本の電子ビームで同時にパターンを描画するマルチビームシステムの提案がなされている。ビーム数は、マルチビーム型露光装置の内部に配置できる電子レンズのアレイ数により決まり、スループットを決定する大きな要因となる。そのため、近年、より高い配列密度が求められている。 In the production of semiconductor devices, the electron beam exposure technique is a promising candidate for lithography that enables fine pattern exposure of 0.1 μm or less. In these apparatuses, an electro-optical element for controlling the optical characteristics of the electron beam is used. In particular, the electron lens includes an electromagnetic type and an electrostatic type, and the electrostatic type is easy to configure and advantageous for miniaturization as compared with the electromagnetic type because it is not necessary to provide a coil core. In addition, among electron beam exposure techniques, a multi-beam system that simultaneously draws a pattern with a plurality of electron beams without using a mask has been proposed. The number of beams is determined by the number of electron lens arrays that can be arranged inside the multi-beam type exposure apparatus, and is a major factor in determining the throughput. Therefore, in recent years, higher arrangement density has been demanded.

静電型荷電粒子レンズは、電極間に電圧を印加するため、絶縁性(耐圧性)が求められる。荷電粒子線レンズの耐圧を向上させるための提案としては、電圧印加部を有する基板の基板間絶縁体と接する部位と電圧印加部との間に絶縁部を配置し、電圧印加部と絶縁体とを電気的に分離(絶縁)するといった手法がある(特許文献1参照)。また、荷電粒子線以外の分野では、超電導装置の熱アンカーにて、陽極と絶縁体の間に金属膜を配置することで、陽極側の三重点における電界集中を緩和し放電を抑制する提案がある(特許文献2参照)。 An electrostatic charged particle lens is required to have insulation (pressure resistance) in order to apply a voltage between electrodes. As a proposal for improving the withstand voltage of the charged particle beam lens, an insulating portion is disposed between a portion of the substrate having a voltage application portion that contacts the inter-substrate insulator and the voltage application portion, and the voltage application portion and the insulator are arranged. Is electrically isolated (insulated) (see Patent Document 1). In fields other than charged particle beams, a proposal has been made to reduce electric field concentration at the triple point on the anode side and suppress discharge by placing a metal film between the anode and the insulator at the thermal anchor of the superconducting device. Yes (see Patent Document 2).

特開2005-57110号公報JP 2005-57110 A 特開2004-165368号公報JP 2004-165368 A

上記の如き技術状況において、露光装置の更なる高スループット化と露光パターンの更なる高精細化に伴い、荷電粒子線レンズには更なる高電界が要求されるようになってきた。しかしながら上記特許文献1に記載の構成をこうした高電界で使った場合、絶縁耐圧が不足し、放電する可能性があり得る。この放電は、上記特許文献2で開示している陽極側の三重点ではなく、陰極側の三重点が原因であることが分かった。そのメカニズムは以下の通りである。 In the above-described technical situation, with a further increase in throughput of the exposure apparatus and a further definition of the exposure pattern, a higher electric field has been required for the charged particle beam lens. However, when the configuration described in Patent Document 1 is used in such a high electric field, the withstand voltage is insufficient, and there is a possibility of discharging. It has been found that this discharge is caused not by the triple point on the anode side but the triple point on the cathode side, which is disclosed in Patent Document 2 above. The mechanism is as follows.

静電型の荷電粒子線レンズは、電極が絶縁体を介して積層された構造であり、真空領域と絶縁体と電極との境界は三重点となる。その電極間に電界を印加した際、三重点からは電界集中によって電子が放出され、電子が絶縁体表面を叩いて二次電子を放出させる。その結果、絶縁体表面は正に帯電し、三重点近傍の電界をさらに強め、電界放出電子を増大させる。このような正帰還により、ついには絶縁体表面で二次電子雪崩現象が発生し、放電に至る。 An electrostatic charged particle beam lens has a structure in which electrodes are stacked via an insulator, and the boundary between the vacuum region, the insulator, and the electrode is a triple point. When an electric field is applied between the electrodes, electrons are emitted from the triple point due to the concentration of the electric field, and the electrons hit the surface of the insulator to emit secondary electrons. As a result, the insulator surface is positively charged, further strengthening the electric field near the triple point and increasing the field emission electrons. Such positive feedback eventually causes a secondary electron avalanche phenomenon on the insulator surface, leading to discharge.

更には、荷電粒子線レンズの小型化に伴い、レンズ組み立て時に、より繊細な位置合わせやハンドリングが求められるようになった。電子ビームが通過する近傍のスペーサは、電子ビーム軌道に影響しないよう特に詳細に位置合わせされるため、製造上の公差は主に周辺部で吸収しなければならない。この周辺部は、電子ビーム軌道には影響しないものの、電子ビーム近傍と同様の電界がかかるため、位置ずれがあると、形状的に電界が集中しやすく、放電の原因となることがあった。また周辺部は、組み立てや位置調整などの際のハンドリングに伴って、キズ、欠けなどの発生することがあり、これらも、形状的な電界集中による放電を助長することがあった。すなわち、電子ビームの通過する近辺よりも、むしろ周辺部の放電が問題となる場合があり、レンズ周辺部の陰極側三重点近傍の耐圧性に関し、更なる改善が望まれていた。 Furthermore, with the miniaturization of charged particle beam lenses, more delicate positioning and handling have been required during lens assembly. Since the neighboring spacers through which the electron beam passes are aligned in particular detail so as not to affect the electron beam trajectory, manufacturing tolerances must be absorbed primarily at the periphery. Although this peripheral portion does not affect the electron beam trajectory, an electric field similar to that in the vicinity of the electron beam is applied. Therefore, if there is a positional deviation, the electric field tends to concentrate in shape and may cause discharge. In addition, the peripheral portion may be flawed or chipped due to handling during assembly or position adjustment, and these may also promote discharge due to shape electric field concentration. That is, there is a case where the discharge in the peripheral part becomes a problem rather than the vicinity where the electron beam passes, and further improvement has been desired regarding the pressure resistance in the vicinity of the cathode side triple point in the peripheral part of the lens.

上記課題に鑑み、本発明の荷電粒子線レンズは、少なくとも一つの板状の陽極と、少なくとも一つの板状の陰極と、前記陽極と前記陰極の間に配置される少なくとも一つの絶縁体と、を有する。そして、前記絶縁体と前記陽極と前記陰極がそれぞれ荷電ビームを通す一つ以上のビーム通過部を持ち、前記ビーム通過部の周りにおいて、前記陽極の外周側面は前記絶縁体の最外側面及び前記陰極の外周側面それぞれより、前記ビーム通過部に近い内側に配置されている。 In view of the above problems, the charged particle beam lens of the present invention includes at least one plate-like anode, at least one plate-like cathode, and at least one insulator disposed between the anode and the cathode, Have The insulator, the anode, and the cathode each have one or more beam passing portions through which a charged beam passes, and around the beam passing portion, the outer peripheral side surface of the anode is the outermost surface of the insulator and the It arrange | positions from the outer peripheral side surface of a cathode at the inner side near the said beam passage part.

本発明の荷電粒子線レンズによれば、ビーム通過部の周りの陽極の外周側面が上記の如くに配置されているので、レンズ周辺部における陰極側三重点での電界集中が緩和される。また、絶縁体の陽極側の面上も絶縁体沿面となり、絶縁体沿面距離を延ばすことが可能となる。この2つの効果により、組み立て時における位置ずれやキズ、欠けなど電界が集中する構造が生じやすいレンズ周辺部での沿面放電の発生を抑制することができる。 According to the charged particle beam lens of the present invention, since the outer peripheral side surface of the anode around the beam passing portion is arranged as described above, the electric field concentration at the cathode-side triple point in the lens peripheral portion is alleviated. Further, the surface on the anode side of the insulator also becomes the creeping surface of the insulating material, and it is possible to extend the creeping distance of the insulating material. Due to these two effects, it is possible to suppress the occurrence of creeping discharge at the lens peripheral portion where a structure in which an electric field concentrates, such as misalignment, scratches, and chips during assembly.

第1の実施形態における荷電粒子線レンズの構成概略断面、拡大部、及びアインツェル型レンズの構成概略断面を示す図。The figure which shows the structure schematic cross section of the charged particle beam lens in 1st Embodiment, a structure schematic cross section of an enlarged part, and an Einzel type | mold lens. 第2の実施形態における荷電粒子線レンズの構成概略断面、拡大部、及びアインツェル型レンズの構成概略断面を示す図。The figure which shows the structure schematic cross section of the charged particle beam lens in 2nd Embodiment, an expansion part, and the structure schematic cross section of an Einzel type | mold lens. 第3の実施形態における荷電粒子線レンズの構成概略断面、及びアインツェル型レンズの構成概略断面を示す図。The figure which shows the structure schematic cross section of the charged particle beam lens in 3rd Embodiment, and the structure schematic cross section of an Einzel type | mold lens. 第4の実施形態における荷電粒子線レンズの構成概略断面、及びアインツェル型レンズの構成概略断面を示す図。The figure which shows the structure schematic cross section of the charged particle beam lens in 4th Embodiment, and the structure schematic cross section of an Einzel type | mold lens.

本発明の荷電粒子線レンズの特徴は、陽極の外周側面を絶縁体の最外側面及び陰極の外周側面それぞれより内側に配置することで、荷電粒子線レンズの耐圧性を向上させることである。この考え方に基づいて、本発明の荷電粒子線レンズは、上記課題を解決するための手段のところで述べた様な基本的な構成を有する。 A feature of the charged particle beam lens of the present invention is that the pressure resistance of the charged particle beam lens is improved by disposing the outer peripheral side surface of the anode inside the outermost side surface of the insulator and the outer peripheral side surface of the cathode. Based on this concept, the charged particle beam lens of the present invention has a basic configuration as described in the means for solving the above-mentioned problems.

以下に、本発明の実施形態を添付の図面を用いて詳細に説明する。図1〜図4を用いて、本発明の第1〜第4の実施形態を説明する。ただし、これらの実施の形態に記載されている構成部品の寸法、材質、形状、その相対配置などは、特に特定的な記載がない限り、本発明の範囲をそれらのみに限定する趣旨のものではない。また、本発明において陰極とは、低電位側の電極と略同電位の導電体を含むものである。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The first to fourth embodiments of the present invention will be described with reference to FIGS. However, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in these embodiments are not intended to limit the scope of the present invention only to those unless otherwise specified. Absent. In the present invention, the cathode includes a conductor having substantially the same potential as the electrode on the low potential side.

(第1の実施形態)
図1(a)は第1の実施形態の荷電粒子線レンズの構成概略断面図であり、図1(b)は図1(a)の破線で囲むエリアAの一部拡大図である。図1(a)において、11は板状の陽極、12は板状の陰極であり、それぞれ金属または各種合金、各種半導体などから構成される。13は板状の絶縁体であり、各種ガラスまたは各種セラミックから構成される。絶縁体13の一方の面には少なくとも陽極11が配置され、これと対向する面に少なくとも陰極12が配置される。陽極11と陰極12は絶縁体13を介して電気的に絶縁されている。陰極12、陽極11、絶縁体13はそれぞれ不図示の光源から放出された荷電ビームが通過する少なくとも一つの貫通孔(ビーム通過部)14を有する。陽極11の外周側面aは、陰極12の外周側面b、及び絶縁体13の最外側面cそれぞれより内側(貫通孔14に近い側)に配置されている。ここで、例えば陰極12に負電圧を印加し陽極11をアース電位とすると、イマージョンレンズとして機能する。
(First embodiment)
FIG. 1A is a schematic cross-sectional view of the configuration of the charged particle beam lens of the first embodiment, and FIG. 1B is a partially enlarged view of an area A surrounded by a broken line in FIG. In FIG. 1A, 11 is a plate-like anode, and 12 is a plate-like cathode, each of which is made of metal, various alloys, various semiconductors, or the like. Reference numeral 13 denotes a plate-like insulator made of various types of glass or various types of ceramics. At least the anode 11 is disposed on one surface of the insulator 13, and at least the cathode 12 is disposed on the surface opposite to the anode 11. The anode 11 and the cathode 12 are electrically insulated via an insulator 13. Each of the cathode 12, the anode 11, and the insulator 13 has at least one through-hole (beam passage portion) 14 through which a charged beam emitted from a light source (not shown) passes. The outer peripheral side surface a of the anode 11 is disposed on the inner side (side closer to the through hole 14) than the outer peripheral side surface b of the cathode 12 and the outermost side surface c of the insulator 13. Here, for example, when a negative voltage is applied to the cathode 12 and the anode 11 is set to the ground potential, it functions as an immersion lens.

上記構成において、図1(b)に示すように、絶縁体沿面距離15は絶縁体13の厚さより長くなる。また、図1(b)で示す複数の湾曲した破線はこれらの形状の等電位線であり、貫通孔14から離れた周りのレンズ周辺部における陰極側三重点16にかかる電界が緩和されていることが分かる。以上のように沿面距離15が絶縁体13の厚み以上に確保できることと、陰極側三重点16の電界を緩和することで、著しく耐圧性を向上させることができる。 In the above configuration, the insulator creepage distance 15 is longer than the thickness of the insulator 13 as shown in FIG. Further, the plurality of curved broken lines shown in FIG. 1B are equipotential lines having these shapes, and the electric field applied to the cathode-side triple point 16 in the peripheral portion of the lens away from the through hole 14 is relaxed. I understand that. As described above, the creepage distance 15 can be ensured to be equal to or larger than the thickness of the insulator 13 and the electric field at the cathode side triple point 16 can be relaxed, whereby the pressure resistance can be remarkably improved.

図1(c)は、第1の実施形態におけるアインツェル型レンズの構成を表す図であり、同図において、11は陽極、12は陰極、13は絶縁体、14は光源から放出された荷電粒子が通過する貫通孔である。陽極11は、厚さ100μm、直径98mmの両面研磨の円板状単結晶シリコン基板である。陰極12は、厚さ100μm、直径101.6mmの両面研磨の円板状単結晶シリコン基板である。絶縁体13は、厚さ400μm、直径101.6mmの円板状硼珪酸ガラスである。貫通孔14の開口径は、陽極11、陰極12においてはそれぞれ30μmで、絶縁体13においては4mmである。ここで、陽極11、陰極12は絶縁体13を挟み、貫通孔14の中心軸を揃えて配置されている。 FIG. 1C is a diagram illustrating the configuration of the Einzel lens according to the first embodiment. In FIG. 1, 11 is an anode, 12 is a cathode, 13 is an insulator, and 14 is a charged particle emitted from a light source. Is a through-hole. The anode 11 is a disk-like single crystal silicon substrate having a thickness of 100 μm and a diameter of 98 mm that is polished on both sides. The cathode 12 is a disk-like single crystal silicon substrate having a thickness of 100 μm and a diameter of 101.6 mm, which is polished on both sides. The insulator 13 is a disc-shaped borosilicate glass having a thickness of 400 μm and a diameter of 101.6 mm. The opening diameter of the through hole 14 is 30 μm for the anode 11 and the cathode 12 and 4 mm for the insulator 13. Here, the anode 11 and the cathode 12 are disposed with the insulator 13 interposed therebetween and the central axis of the through hole 14 being aligned.

次に、図1(c)に示すアインツェル型レンズの第1の実施形態の製造方法を説明する。陽極11及び陰極12においては、シリコンウエハに、高精度のフォトリソグラフィとドライエッチングにより貫通孔14を形成する。絶縁体13においては、サンドブラスト加工により貫通孔14を形成し、ウェットエッチングと表面研磨により加工面のマイクロクラックやバリを処理する。図示例では1つの貫通孔を示すが、複数の貫通孔が形成されてもよい。次に、これらの加工をした2枚の陽極11、1枚の陰極12、2枚の絶縁体13を、陽極11、絶縁体13、陰極12、絶縁体13、陽極11の順番で中心軸を合わせて接合する。こうして、図1(c)に示す構成となる。接合は、耐熱性のあるシリコーン系の接着剤を使って張り合わせた。この構成にすることで、貫通孔14から離れた周りのレンズ周辺部における陰極側三重点の電界が緩和し、絶縁体沿面距離が長くなるため、耐圧性が向上する。実際に、陰極12に−3.7kVを印加し、2枚の陽極11をアース電位として、貫通孔14に電子ビームを通過させたところ、放電は観測されず、所望のレンズ作用を安定に長時間にわたって保つことが出来た。この様に、本実施形態により、信頼性の高い電子レンズを構成できることが確認された。 Next, a manufacturing method of the first embodiment of the Einzel lens shown in FIG. In the anode 11 and the cathode 12, a through hole 14 is formed in a silicon wafer by high-precision photolithography and dry etching. In the insulator 13, through holes 14 are formed by sandblasting, and microcracks and burrs on the processed surface are processed by wet etching and surface polishing. Although one through hole is shown in the illustrated example, a plurality of through holes may be formed. Next, the two anodes 11, the one cathode 12, and the two insulators 13 that have been subjected to these processes are arranged in the order of the anode 11, the insulator 13, the cathode 12, the insulator 13, and the anode 11. Join together. Thus, the configuration shown in FIG. Bonding was performed using a heat-resistant silicone adhesive. With this configuration, the electric field at the cathode-side triple point in the periphery of the lens away from the through hole 14 is relaxed, and the creepage distance of the insulator is increased, so that the pressure resistance is improved. Actually, when -3.7 kV was applied to the cathode 12 and the two anodes 11 were set to the ground potential and the electron beam was passed through the through hole 14, no discharge was observed, and the desired lens action was stably prolonged. I was able to keep it over time. Thus, it was confirmed that a highly reliable electron lens can be configured according to this embodiment.

(第2の実施形態)
次に、図2を用いて第2の実施形態を説明する。図2(a)は本発明の第2の実施形態の荷電粒子線レンズの構成概略断面図であり、図2(b)は図2(a)の破線で囲むエリアBの拡大図である。図2(a)に示すように、第2の実施形態では、第1の実施形態における絶縁体13の最外側面の一部に導電膜27を形成している。導電膜27は陰極12と電気的に接続し、陽極11と離間して配置されている。導電膜27は金属または各種合金、各種半導体などから構成される。荷電粒子線レンズの小型化、高精細化に伴い、レンズの組み立てには、より繊細な位置合わせ、ハンドリングが要求される。すなわち、各材料は小さく、薄くなるためハンドリングの際に欠損しやすくなる。レンズ周辺部においてキズや欠け、組立ズレが存在すると、電界の集中、電界強度の変化により、耐圧性が低下する場合がある。図2(b)に示すような構成にすることで、レンズ周辺部において陰極側三重点近傍のキズd、欠けe、組立ズレf等が存在しても、これらの部位が同電位なため電界が殆どかからず、沿面放電の原因となることが抑制される。
(Second Embodiment)
Next, a second embodiment will be described with reference to FIG. FIG. 2A is a schematic sectional view of a charged particle beam lens according to the second embodiment of the present invention, and FIG. 2B is an enlarged view of an area B surrounded by a broken line in FIG. As shown in FIG. 2A, in the second embodiment, a conductive film 27 is formed on a part of the outermost surface of the insulator 13 in the first embodiment. The conductive film 27 is electrically connected to the cathode 12 and is spaced apart from the anode 11. The conductive film 27 is made of metal, various alloys, various semiconductors, or the like. As charged particle beam lenses become smaller and more precise, more precise alignment and handling are required for lens assembly. That is, since each material is small and thin, it tends to be lost during handling. If there are scratches, chippings, or assembly deviations in the lens periphery, the pressure resistance may be reduced due to the concentration of the electric field and the change in the electric field strength. With the configuration shown in FIG. 2 (b), even if there is a flaw d, chipping e, assembly deviation f, etc. near the cathode side triple point in the periphery of the lens, these portions are at the same potential, so the electric field Is less likely to cause creeping discharge.

本実施形態は、以下で説明する箇所以外は、第1の実施形態と同様の材料・寸法および製造方法で作製され得る。図2(c)は第2の実施形態におけるアインツェル型レンズを表す図面であり、同図において27は導電膜である。導電膜27は白金で、膜厚は500nm、膜幅(図2(c)の上下方向の長さ)は300μmで、陰極12の外周を中心に、レンズ周辺部の陰極側三重点すべてを覆っている。第1の実施形態と同様に貫通孔の形成と接合を行った後、スパッタ膜のリフトオフプロセスにより導電膜27を形成すると、図2(c)に示す構成となる。この構成にすることで、レンズ周辺部の陰極側三重点近傍のキズ、欠け、組立ズレ等の部位に電位差を与えないため、沿面放電の発生を抑制することができる。実際に陰極12に−3.7kVを印加し、2枚の陽極11をアース電位として、貫通孔14に電子ビームを通過させたところ、放電は観測されず、所望のレンズ作用を安定に、より長時間保つことが出来た。こうして、本実施形態によって、より信頼性の高い電子レンズを構成できることが確認された。 The present embodiment can be manufactured by the same material and dimensions and manufacturing method as those of the first embodiment except for the portions described below. FIG. 2C is a drawing showing an Einzel lens in the second embodiment, in which 27 is a conductive film. The conductive film 27 is platinum, the film thickness is 500 nm, the film width (length in the vertical direction in FIG. 2C) is 300 μm, and covers all the triple points on the cathode side of the lens periphery centering on the outer periphery of the cathode 12. ing. When the conductive film 27 is formed by the lift-off process of the sputtered film after forming and bonding the through holes in the same manner as in the first embodiment, the configuration shown in FIG. With this configuration, the occurrence of creeping discharge can be suppressed because no potential difference is given to sites such as scratches, chips, and assembly misalignments in the vicinity of the cathode side triple point in the lens periphery. When −3.7 kV was actually applied to the cathode 12 and the two anodes 11 were set to the ground potential and the electron beam was passed through the through hole 14, no discharge was observed, and the desired lens action was more stable. I was able to keep it for a long time. Thus, it was confirmed that a more reliable electron lens can be configured according to this embodiment.

(第3の実施形態)
次に、図3を用いて第3の実施形態を説明する。図3(a)は本発明の第3の実施形態の荷電粒子線レンズの構成概略断面図である。図3(a)に示すように第3の実施形態では、第2の実施形態における絶縁体13の最外側面上の導電膜が、陽極11のある面と同一平面まで延伸した導電膜37となっている。第3の実施形態の構成にすることで、絶縁体沿面36を、平坦性が優れ特異点を持ちにくい絶縁体13の平面上のみでとることが可能となり、耐圧性能はより向上する。第3の実施形態における絶縁体沿面36の距離は第2の実施形態よりも若干短くなるにも関わらず絶縁耐圧性がより向上しているのは、電界のかかる沿面を平面性に優れる面で構成している効果が大きいためと考えられる。
(Third embodiment)
Next, a third embodiment will be described with reference to FIG. FIG. 3A is a schematic sectional view of a charged particle beam lens according to the third embodiment of the present invention. As shown in FIG. 3A, in the third embodiment, the conductive film on the outermost surface of the insulator 13 in the second embodiment has a conductive film 37 extending to the same plane as the surface on which the anode 11 is provided. It has become. By adopting the configuration of the third embodiment, the insulator creeping surface 36 can be obtained only on the plane of the insulator 13 which has excellent flatness and hardly has a singular point, and the pressure resistance performance is further improved. Although the distance between the insulator creepage surfaces 36 in the third embodiment is slightly shorter than that in the second embodiment, the withstand voltage is improved because the creeping surface where the electric field is applied is excellent in flatness. This is thought to be due to the large effect of the composition.

本実施形態は、以下で説明する箇所以外は、第1の実施形態と同様の材料・寸法および製造方法で作製され得る。図3(b)は第3の実施形態におけるアインツェル型レンズを表す図面であり、同図において37は導電膜である。導電膜37は白金で、膜厚は500nmであり、陰極12及び2枚の絶縁体13の最外側面の全てと、2枚の絶縁体13の陽極面上に最外側面から200μm内側までを覆っている。第1の実施形態と同様に貫通孔14の形成と接合を行った後、スパッタ膜のリフトオフプロセスにより導電膜37を形成すると、図3(b)に示す構成となる。この構成にすることで、レンズ周辺部で電界がかかる面は、図3(b)の絶縁体沿面に示す通り、板状の陽極11の主平面のみとなる。この面は一般的に平坦性に優れ、ハンドリング時のキズ、欠け等も発生しにくい場所である。すなわち、絶縁体沿面上に、形状的に電界が集中する特異点を持つ可能性が低くなり、沿面放電の発生を抑制することができる。実際に陰極12に−3.7kVを印加し、2枚の陽極11をアース電位として、貫通孔14に電子ビームを通過させたところ、放電は観測されず、所望のレンズ作用を安定に、より長時間保つことが出来た。こうして、本実施形態によって、より信頼性の高い電子レンズを構成できることが確認された。 The present embodiment can be manufactured by the same material and dimensions and manufacturing method as those of the first embodiment except for the portions described below. FIG. 3B is a drawing showing an Einzel type lens in the third embodiment, in which 37 is a conductive film. The conductive film 37 is platinum, and has a film thickness of 500 nm. The conductive film 37 is formed on the cathode 12 and the outermost surfaces of the two insulators 13 and on the anode surfaces of the two insulators 13 from the outermost surface to the inner side of 200 μm. Covering. When the conductive film 37 is formed by the lift-off process of the sputtered film after the through hole 14 is formed and bonded as in the first embodiment, the configuration shown in FIG. 3B is obtained. With this configuration, the surface to which an electric field is applied in the lens peripheral portion is only the main plane of the plate-like anode 11 as shown in the insulator creepage surface of FIG. This surface is generally excellent in flatness, and is a place where scratches, chips, etc. during handling are unlikely to occur. That is, the possibility of having a singular point where the electric field concentrates on the creeping surface of the insulator is reduced, and the occurrence of creeping discharge can be suppressed. When −3.7 kV was actually applied to the cathode 12 and the two anodes 11 were set to the ground potential and the electron beam was passed through the through hole 14, no discharge was observed, and the desired lens action was more stable. I was able to keep it for a long time. Thus, it was confirmed that a more reliable electron lens can be configured according to this embodiment.

(第4の実施形態)
次に、図4を用いて第4の実施形態を説明する。図4(a)は本発明の第4の実施形態の荷電粒子線レンズの構成概略断面図である。図4(a)に示すように、第4の実施形態では、第3の実施形態における絶縁体沿面を高抵抗膜48で覆っている。高抵抗膜48は金属酸化物、金属窒化物または半導体を母材として構成される。第4の実施形態の如き構成にすることで、陽極11と導電膜37の離間部、すなわち高抵抗膜48の成膜部に電子が衝突しても帯電しなくなるため、耐圧性が向上する。第4の実施形態における高抵抗膜の如き構成を、また、第1や第2の実施形態に適用してもよい。すなわち、第2の実施形態において陽極11と導電膜27の離間部を高抵抗膜で覆った構成や、第1の実施形態において周辺部の絶縁体沿面の一部もしくは全部を高抵抗膜で覆った構成にしても良い。
(Fourth embodiment)
Next, a fourth embodiment will be described with reference to FIG. FIG. 4A is a schematic sectional view of a charged particle beam lens according to the fourth embodiment of the present invention. As shown in FIG. 4A, in the fourth embodiment, the creeping surface of the insulator in the third embodiment is covered with a high resistance film 48. The high resistance film 48 is formed using a metal oxide, metal nitride, or semiconductor as a base material. With the configuration as in the fourth embodiment, even if electrons collide with the separation portion of the anode 11 and the conductive film 37, that is, the film formation portion of the high resistance film 48, the charge resistance is improved. The configuration like the high resistance film in the fourth embodiment may be applied to the first and second embodiments. In other words, in the second embodiment, the separated portion of the anode 11 and the conductive film 27 is covered with a high resistance film, and in the first embodiment, part or all of the peripheral surface of the insulator is covered with the high resistance film. You may make it the structure.

本実施形態は、以下で説明する箇所以外は、第3の実施形態と同様の材料・寸法および製造方法で作製され得る。図4(b)は第4の実施形態におけるアインツェル型レンズを表す図面であり、同図において48は高抵抗膜である。高抵抗膜48は酸化アルミニウムにタングステンを添加したもので、体積抵抗率が1×1011[Ω・cm]、膜厚は300nmであり、陽極11と導電膜37の離間部を覆っている。第3の実施形態と同様に貫通孔14の形成と接合を行った後、導電膜37を形成し、さらにスパッタ膜のリフトオフプロセスにより高抵抗膜48を形成すると、図4(b)に示す構成となる。この構成にすることで、陽極11と導電膜37の離間部に電子が衝突しても帯電することはなくなるため、沿面放電の発生を抑制することができる。実際に、陰極12に−3.7kVを印加し、2枚の陽極11をアース電位として、貫通孔14に電子ビームを通過させたところ、放電は観測されず、所望のレンズ作用を安定に、より長時間保つことが出来た。こうして、本実施形態によって、より信頼性の高い電子レンズを構成できることが確認された。 The present embodiment can be manufactured by the same material / dimension and manufacturing method as those of the third embodiment except for the portions described below. FIG. 4B is a drawing showing an Einzel lens in the fourth embodiment, in which 48 is a high resistance film. The high resistance film 48 is obtained by adding tungsten to aluminum oxide, has a volume resistivity of 1 × 10 11 [Ω · cm], a film thickness of 300 nm, and covers the separated portion of the anode 11 and the conductive film 37. When the through hole 14 is formed and bonded as in the third embodiment, the conductive film 37 is formed, and the high resistance film 48 is formed by the lift-off process of the sputtered film, the configuration shown in FIG. It becomes. With this configuration, even if electrons collide with the separated portion between the anode 11 and the conductive film 37, charging is not performed, so that the occurrence of creeping discharge can be suppressed. Actually, when -3.7 kV was applied to the cathode 12 and the two anodes 11 were set to the ground potential and the electron beam was passed through the through hole 14, no discharge was observed, and the desired lens action was stably achieved. I could keep it for a longer time. Thus, it was confirmed that a more reliable electron lens can be configured according to this embodiment.

11・・陽極、12・・陰極、13・・絶縁体、14・・貫通孔(ビーム通過部)、a・・陽極外周側面、b・・陰極外周側面、c・・絶縁体最外側面 11 .. Anode, 12 .. Cathode, 13 .. Insulator, 14 .. Through hole (beam passage part), a .. Anode outer side surface, b .. Cathode outer side surface, c.

Claims (4)

少なくとも一つの板状の陽極と、少なくとも一つの板状の陰極と、前記陽極と前記陰極の間に配置される少なくとも一つの絶縁体とを有し、前記絶縁体と前記陽極と前記陰極が荷電ビームを通す一つ以上のビーム通過部を持つ荷電粒子線レンズであって、
前記ビーム通過部の周りにおいて、前記陽極の外周側面は、前記絶縁体の最外側面及び前記陰極の外周側面それぞれより、前記ビーム通過部に近い内側に配置されていることを特徴とする荷電粒子線レンズ。
At least one plate-like anode, at least one plate-like cathode, and at least one insulator disposed between the anode and the cathode, wherein the insulator, the anode, and the cathode are charged. A charged particle beam lens having one or more beam passing portions for passing a beam,
Around the beam passage portion, the outer peripheral side surface of the anode is disposed closer to the inner side of the beam passage portion than the outermost side surface of the insulator and the outer peripheral side surface of the cathode. Line lens.
前記絶縁体の少なくとも最外側面に導電膜が形成され、前記導電膜が少なくとも前記陰極と電気的に接続し、前記導電膜と前記陽極が離間して配置されていることを特徴とする請求項1に記載の荷電粒子線レンズ。 The conductive film is formed on at least the outermost surface of the insulator, the conductive film is electrically connected to at least the cathode, and the conductive film and the anode are spaced apart. 2. The charged particle beam lens according to 1. 前記導電膜が、前記陽極のある前記絶縁体の面と同一平面まで延伸していることを特徴とする請求項2に記載の荷電粒子線レンズ。 The charged particle beam lens according to claim 2, wherein the conductive film extends to the same plane as the surface of the insulator having the anode. 前記陰極と前記陽極または前記導電膜と前記陽極の離間部は高抵抗膜で覆われていることを特徴とする請求項1から3のいずれか1項に記載の荷電粒子線レンズ。 4. The charged particle beam lens according to claim 1, wherein a separation portion between the cathode and the anode or the conductive film and the anode is covered with a high resistance film. 5.
JP2012008318A 2012-01-18 2012-01-18 Charged particle beam lens Pending JP2013149751A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016117628A1 (en) * 2015-01-23 2016-07-28 株式会社 日立ハイテクノロジーズ Charged particle beam device, and method of manufacturing component for charged particle beam device
WO2024176419A1 (en) * 2023-02-24 2024-08-29 株式会社日立ハイテク Insulator, charged particle gun, and charged particle beam device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016117628A1 (en) * 2015-01-23 2016-07-28 株式会社 日立ハイテクノロジーズ Charged particle beam device, and method of manufacturing component for charged particle beam device
US10170273B2 (en) 2015-01-23 2019-01-01 Hitachi High-Technologies Corporation Charged particle beam device, and method of manufacturing component for charged particle beam device
WO2024176419A1 (en) * 2023-02-24 2024-08-29 株式会社日立ハイテク Insulator, charged particle gun, and charged particle beam device

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