JP2013038272A - Shield case fixing structure and fixing method, electronic device, and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a shield case fixing structure which allows for simpler fixing of a shield case onto a circuit board with an electronic component mounted thereon when compared with prior art.SOLUTION: In a mother board 1 having a plurality of individual boards 10 as circuit boards, grooves are formed once along dicing lines DL for defining these individual boards 10, an adhesive 5 is applied to the grooves, the sidewall ends of shield cases 7 are fitted in the grooves, to which the adhesive 5 is applied, and then the adhesive 5 is hardened, thus fixing the shield cases 7 to the mother board 1. Thereafter, the mother board 1 is further cut along the dicing lines DL and divided into the plurality of individual boards 10, thus obtaining electronic devices 100.

Description

  The present invention relates to a structure and method for fixing a shield case to a circuit board on which electronic components are mounted, an electronic device having the structure, and a method for manufacturing the same.

  Generally, a circuit unit or a printed wiring board in which electronic components such as active components such as semiconductor devices (semiconductor IC chips, etc.), capacitors (capacitors), inductors (coils), thermistors, resistors, etc. are mounted on a substrate. In an electronic device (equipment), a metal shield is used to cover the electronic component in order to shield the leakage of electromagnetic noise from the outside and electromagnetic noise from the outside, and to protect the mounted electronic component from external force. A case is provided.

  As a method for fixing the shield case to the circuit board, for example, in Patent Document 1, a mother board (an individual board called a piece or an individual product or a collective circuit board that can be divided into sub-boards) is formed with through holes. A method of manufacturing an electronic component with a shield case is described in which an engagement claw of a shield case is inserted into the engagement recess and soldered to fix the part.

JP 2005-327552 A

  However, in the conventional method described above, a plurality of through holes are formed at positions corresponding to the individual substrates to form the engagement recesses, so that high-precision substrate processing is required. However, it is necessary to project engagement claws that fit into the through holes. Also, when the engaging claws of the shield case are fitted into the through holes of the board, high assembly accuracy is required, and further, if the engaging claws interfere with the board, the part is damaged. There is also a fear. As a result, parts processing becomes complicated, and there are problems that manufacturing man-hours and costs increase.

  Therefore, the present invention has been made in view of such circumstances, and a shield case fixing structure capable of fixing a shield case more easily than a conventional case on a circuit board on which electronic components are mounted and its It is an object to provide a method, an electronic device, and a manufacturing method thereof.

  In order to solve the above problems, a shield case fixing method according to the present invention is a method of fixing a shield case covering an electronic component on a circuit board to the circuit board, and includes a plurality of individual boards as circuit boards. A first step of forming a groove (substantially continuously) along a cutting line for defining the individual substrates in the substrate; a second step of depositing an adhesive in the groove; and an adhesive. A third step in which the end of the side wall of the shield case is inserted into the groove attached to the cover, the adhesive is cured, and the shield case is fixed to the collective substrate; And a fourth step of dividing the substrate into individual substrates.

  Here, the “cutting line” may or may not be actually drawn on the collective substrate. For example, the “cut line” is used on the collective substrate as used when dicing the collective substrate with a dicing saw or the like to obtain individual substrates. This implies a virtual cutting line (dicing line) defined by a plurality of formed alignment marks.

  In the shield case fixing method configured as described above, a groove (trench-like recess) is formed in advance along the cutting line in the collective substrate on which the electronic components are mounted, and the side wall of the shield case is formed in the groove. In the state where the end portion of is inserted, the collective substrate and the shield case are fixed by an adhesive, and then the collective substrate is cut and divided into a plurality of individual substrates along a cutting line by an appropriate method such as dicing, As a result, an electronic device in which a shield case is fixed to an individual substrate (circuit board) on which electronic components are mounted is obtained. Thus, by forming grooves in the collective substrate, the adhesive stays securely in the grooves and does not flow on the circuit board surface, and a part of the shield case (side wall end) fits into the grooves. Therefore, the movement is restricted, and in particular, the lateral displacement of the shield case is prevented. In addition, it is not necessary to process and form multiple through-holes with high positional accuracy in the collective substrate just by forming grooves in the collective substrate, and processing for providing engagement claws on the side walls of the shield case. Is completely unnecessary.

  Thus, the shield case fixing method according to the present invention is convenient in the sense that the collective substrate is not cut and divided completely, but the collective substrate is cut halfway by forming grooves by the same cutting means. It can also be called a “half-cut method”. On the other hand, the method of cutting and dividing the shield case after fixing the shield case for each individual substrate of the collective substrate can be referred to as a “full cut method” for convenience in terms of completely cutting the collective substrate.

  In the second step, a conductive adhesive and / or a thermosetting adhesive (at least one of a conductive adhesive and a thermosetting adhesive) can be used as the adhesive.

  For example, when a box-shaped shield case is fixed to a circuit board such as a multilayer printed wiring board, a ground conductor (a conductor such as a ground wiring pattern connected to the ground potential) is usually formed or exposed on the surface of the circuit board. A method is widely used in which the side wall end (that is, the open end) of the shield case is brought into contact with the above-described portion, and the shield case and the circuit board are joined via a conductive adhesive such as solder.

  However, when an electronic device composed of a circuit board having a shield case fixed in this manner is mounted on a mother board or the like by heat application processing such as reflow, a conductive adhesive such as solder is heated and remelted or softened. As a result, the shield case may be displaced or dropped (especially when the top wall of the shield case is reflowed in a state of being vertically downward). Therefore, by using a conductive adhesive and a thermosetting adhesive in combination as the adhesive, it is possible to suitably prevent the positional displacement and dropout of the shield case during the heat treatment in the subsequent process while grounding the shield case. .

  Specifically, in the first step, the width of the groove is the width of the cutting line (usually a width that is scraped off by a cutting means such as a dicing saw used when the aggregate substrate is completely cut (full cut): Preferably, the grooves are formed so as to be larger than the thickness (which substantially corresponds to the thickness), and in the fourth step, the collective substrate is cut so that the cut width of the collective substrate is smaller than the width of the grooves.

  Thus, by forming a groove wider than the final cutting width (substantially the width of the cutting line) in the aggregate substrate, the shield case can be reliably and easily inserted into the groove. Further, since the individual substrates are adjacent to each other, two shield cases are arranged in one groove, but the collective substrate is cut with a narrower width than the groove formed relatively wide, so that the cutting means It is easy to prevent the shield case from interfering.

  More specifically, it includes a fifth step of forming a conductor layer connected to a ground conductor (a conductor connected to the ground potential as described above) provided on the collective substrate. In the third step, the conductor It is desirable to connect the layer and the shield case. Thereby, the shield case in which the side wall end portion is inserted into the groove can be grounded via the conductor layer and the ground conductor.

  At that time, in the fifth step, a conductor is plated in the groove formed in the first step, and the grounded conductor (for example, a ground wiring pattern exposed on the surface of the aggregate substrate) is formed using the plated conductor thus formed as a conductor layer. In the third step, the shield case and the conductor layer made of the plating conductor may be connected in the third step. In this case, if the aggregate substrate is a multilayer printed wiring board or the like, the ground conductor laminated inside the aggregate substrate can be exposed on the inner wall of the groove, so that by forming a plated conductor as a conductor layer there The shield case can be connected not only to the ground conductor exposed on the surface of the collective substrate but also to the ground conductor exposed on the inner wall of the groove.

  Alternatively, the fifth step is performed after the sixth step, in which a buried conductor (for example, via conductor, via plug, etc.) connected to the ground conductor along the cutting line is formed in advance before the first step. The first step may be configured. In this way, when the groove is formed along the cutting line in the first step, the embedded conductor is also cut at the same time, and the remaining part is exposed to the inner wall of the groove (the remaining part of the embedded conductor constitutes a part of the inner wall of the groove). And function as a conductor layer connected to the ground conductor. If the circuit board is a multilayer printed wiring board or the like, it is indispensable to form via conductors for connecting the layers in the manufacturing process. Therefore, the buried conductor should be formed at the same time as the via conductors for the interlayer connection. It is possible to suppress the load (increase in man-hours) applied to the process, rather than forming the groove after the groove is formed.

  Furthermore, in the first step, the groove is formed so that the ground conductor provided on the collective substrate is exposed to the groove, and in the third step, the ground conductor and the shield case are preferably connected. It is. If it carries out like this, it will become possible to skip the process of plating-forming a conductor layer as mentioned above.

  The method for manufacturing an electronic device according to the present invention is a method that is effectively implemented using the shield case fixing method of the present invention. The electronic device is mounted on a circuit board, and the shield case fixing method described above is performed. Thus, the shield case is fixed to the circuit board so as to cover the electronic component.

  Furthermore, the shield case fixing structure according to the present invention is effectively configured using the shield case fixing method of the present invention, and a notch groove is formed in the peripheral edge of the circuit board, and the side wall end portion of the shield case Is configured to fit into the notch groove. That is, the cutout grooves formed on the peripheral edge of the circuit board are formed by cutting the “grooves” formed on the collective board before the individual boards as the circuit boards are divided and formed by cutting. . In other words, the “notch groove” in the present invention refers to a groove that is provided over the periphery of an individual substrate, which is a substrate after an individual piece, and is cut out to the middle in the thickness direction.

  In the shield case fixing structure having such a configuration, the shield case has the depth of the notch groove as compared with the conventional product described in Patent Document 1 and the above-described full cut method. It is provided so as to wrap around the side surface and cover the part. As a result, electromagnetic noise generated from the inside of the shield case, that is, from the mounted electronic circuit or inner layer circuit, and electromagnetic noise that can enter from the outside of the shield case are not limited to one side of the circuit board, Since it can shield also on the side surface side, it is possible to significantly enhance the shielding effect.

  Further, the sum of the distances (opposite distances) between the both side (left and right) side walls of the shield case and both side (left and right) side walls of the notch groove in the circuit board is configured to be smaller than the width of the bottom wall of the notch groove. It is preferable that In this way, even if the shield case is misaligned to the maximum extent, the side wall end of the shield case falls outside from the bottom wall of the cutout groove, and as a result, the top of the shield case is removed. It is possible to prevent the wall from coming into contact with the surface of the electronic board or the circuit board.

  Specifically, it is desirable to include a grounding conductor formed on the notch groove and provided on the circuit board and a conductor layer connected to the shield case.

  An electronic device according to the present invention is effectively configured using the shield case fixing structure of the present invention, and includes a circuit board, an electronic component mounted on the circuit board, and the shield case fixing structure described above. And a shield case fixed to the circuit board so as to cover the electronic component.

  According to the shield case fixing structure and method of the present invention, and the electronic device and method of manufacturing the same, a groove is formed in advance along the cutting line of the collective substrate, and the shield case is inserted into the groove, and then bonded. Since the collective substrate and the shield case are fixed by the agent, and the collective substrate is cut and divided into a plurality of individual substrates along the cutting line, the shield case can be fixed more easily than in the past. Further, since there is no need to provide a special engagement claw in the shield case, there is no fear of breakage of the shield case, which has been a concern in the past. Furthermore, even if the adhesive flows somewhat, it will fit in the groove, so that it is possible to prevent the adhesive from diffusing on the circuit board surface, and at that time, the shield case also fits into the groove and its movement is restricted. Therefore, the displacement of the shield case can be reliably suppressed.

It is a top view (top view) showing typically an example of a collective substrate used for the present invention. It is a process flowchart which shows an example of the procedure which obtains the electronic device of this invention using suitable one Embodiment of the shielding case fixing method by this invention. It is a process flowchart which shows an example of the procedure which obtains the electronic device of this invention using suitable one Embodiment of the shielding case fixing method by this invention. It is a process flowchart which shows an example of the procedure which obtains the electronic device of this invention using suitable one Embodiment of the shielding case fixing method by this invention. It is a process flowchart which shows an example of the procedure which obtains the electronic device of this invention using suitable one Embodiment of the shielding case fixing method by this invention. It is a process flowchart which shows an example of the procedure which obtains the electronic device of this invention using suitable one Embodiment of the shielding case fixing method by this invention. It is a process flow figure showing an example of a procedure which obtains an electronic device of the present invention using other suitable one embodiment of a shielding case fixing method by the present invention. It is a process flow figure showing an example of a procedure which obtains an electronic device of the present invention using other suitable one embodiment of a shielding case fixing method by the present invention. It is a process flow figure showing an example of a procedure which obtains an electronic device of the present invention using other suitable one embodiment of a shielding case fixing method by the present invention. 1 is a schematic view showing a cross section of an electronic device 100. FIG.

  Hereinafter, embodiments of the present invention will be described in detail. The positional relationship such as up, down, left, and right is based on the positional relationship shown in the drawings unless otherwise specified. Further, the dimensional ratios in the drawings are not limited to the illustrated ratios. Furthermore, the following embodiment is an illustration for explaining the present invention, and is not intended to limit the present invention only to the embodiment. Furthermore, the present invention can be variously modified without departing from the gist thereof.

  FIG. 1 is a plan view (top view) schematically showing an example of an aggregate substrate used in the present invention. The mother board 1 (collective board; also called a work board, a worksheet, etc.) is, for example, a multilayer printed wiring board, and a wiring pattern group (wiring layer) of a plurality of individual boards 10 (pieces, individual items, sub-boards). For example, the substrate is about 300 to 500 mm square. The mother board 1 is divided into a plurality of individual substrates 10 using appropriate cutting means such as a dicing saw along a substantial or virtual dicing line DL (cutting line) indicated by a one-dot chain line in the drawing ( So-called many).

  2 to 7 show examples of procedures for obtaining the electronic device 100 by dividing the individual substrate 10 from the mother board 1 shown in FIG. 1 using a preferred embodiment of the shield case fixing method according to the present invention. FIG. 2 is a process flow diagram showing a part of a cross section in the thickness direction of the motherboard 1. In order to facilitate understanding of the position of the dicing line DL, the dicing line DL is illustrated on the cross section of the mother board 1 for convenience.

  First, the mother board 1 shown in FIG. 1 is prepared, and fixed on a support member such as an appropriate adhesive sheet (not shown) as required (FIG. 2). Next, the dicing blade B1 provided in an appropriate cutting means such as a dicing saw is moved in a direction indicated by an arrow Y (direction perpendicular to the extending surface of the mother board 1) to cut from the upper surface of the mother board 1 to a predetermined depth. (In other words, the motherboard 1 is “half-cut” in the thickness direction). At this time, the center of the dicing blade B1 in the width direction is matched with the center of the dicing line DL. This cutting is performed along the dicing line DL, and grooves 2 (trench) are formed on the entire mother board 1 in a grid pattern (matrix shape, cross beam shape) (FIG. 3: first step).

If the relationship of various dimensions at this time is clarified by a mathematical expression, for example, it is as shown in the following formulas (1) to (3).
Ka <Kb1 (1)
C1 = C2 (2)
Kl <Kh (3)

  Here, Ka indicates the width of the dicing line DL, Kb1 indicates the width of the dicing blade B1, and C1 and C2 indicate the distance between the center α of the dicing blade B1 and the dicing line DL and both side walls of the groove 2. Kl indicates the depth of the groove 2 (distance between the bottom wall of the groove 2 and the top surface of the mother board 1), and Kh indicates the thickness of the mother board 1.

  Then, an appropriate conductor (such as Cu) is plated on the inner wall (bottom wall and side wall) of the groove 2 to form the conductor layer 3. This plating process is performed such that the conductor layer 3 is connected to, for example, the ground wiring pattern 4 (ground conductor) exposed on the surface of the mother board 1 and the inner wall of the groove 2 (FIG. 4: fifth step).

  Next, a conductive adhesive such as solder and an uncured thermosetting adhesive (both adhesives 5) are applied and applied to appropriate portions in the groove 2 (FIG. 5: second step). . Thereafter, the electronic component 6 is mounted at a position corresponding to the individual board on the mother board 1 (fixed with a conductive adhesive such as solder), and a box-shaped shield case 7 having an opening is formed at the end of the side wall. It is installed so as to be inserted into the groove 2. The side wall end of the shield case 7 is electrically and mechanically connected to the conductor layer 3 at the bottom wall of the groove 2. Further, a gap is defined between the top wall (upper wall) of the shield case 7 and the electronic component 6, and the entire electronic component 6 is covered with the shield case 7. In this state, the entire motherboard 1 is subjected to heat treatment such as reflow to cure the adhesive 5, thereby fixing the electronic component 6 and the shield case 7 to the motherboard 1 (FIG. 5: third step).

  Here, the type of the electronic component 6 is not particularly limited. For example, a digital IC such as a CPU (Central Processing Unit) or a DSP (Digital Signal Processor), a memory system such as an F-Rom or SDRAM. Examples include active elements such as analog ICs such as ICs, high-frequency amplifiers, antenna switches, and high-frequency oscillation circuits, and passive elements such as varistors, resistors, capacitors, and lines.

  In addition, the thermosetting resin used in the thermosetting adhesive is not particularly limited. For example, epoxy resin, phenol resin, vinyl benzyl ether compound resin, bismaleimide triazine resin, cyanate ester resin, polyimide, polyolefin resin Examples thereof include resins, polyesters, polyphenylene oxides, liquid crystal polymers, silicone resins, fluorine resins, and the like, and these can be used alone or in combination. In addition, these resin compositions may contain appropriate additives such as rubber components, inorganic fillers (including fibers), oxide powders, and other additive aids.

  Then, an appropriate cutting means such as another dicing blade B2, which is different from the dicing blade B1 described above, is moved in the direction indicated by the arrow Y (direction perpendicular to the extending surface of the mother board 1) to bond in the groove 2 The motherboard 1 together with the agent 5 is cut along the dicing line DL (at this point, “full cut” is completed) so that the electronic component 6 is covered on the individual substrate 10 (circuit board) on which the electronic component 6 is mounted. A plurality of electronic devices 100 to which the shield case 7 is fixed are obtained (FIG. 6: fourth step). In the electronic device 100 obtained in this way, a cutout groove 20 formed by dividing the groove 2 is formed on the periphery of the individual substrate 10, and the side wall end portion of the shield case 7 is fitted into the cutout groove 20. It is configured.

In addition, the relationship of the width dimension of dicing blade B1, B2 is represented by following formula (4), for example.
Kb1> Kb2 = Ka (4)
Here, Kb2 indicates the width of the dicing blade B2 (see Equations (1) to (3) for Kb1 and Ka).

  According to such a shield case fixing structure and method, and an electronic device and method for manufacturing the same, the adhesive 5 reliably stays in the groove 2 and flows onto the mother board 1 and then the individual substrate 10 (the liquid spread is reduced). It is possible to prevent device damage and performance degradation. Moreover, since the side wall end of the shield case 7 is configured to fit into the groove 2, it is possible to prevent the shield case 7 from being particularly laterally displaced. Furthermore, since the groove 2 is once formed in the mother board 1 and the shield case 7 is fixed and then cut for each individual substrate 10, it is necessary to process and form a plurality of through-holes in the collective substrate with high positional accuracy as in the prior art. In addition, there is no need for a process of providing an engaging claw on the side wall of the shield case 7. Therefore, it becomes possible to fix the shield case 7 to the mother board 1 more easily than in the past. Furthermore, since it is not necessary to provide a special engagement claw in the shield case 7, there is no fear of breakage of the shield case 7 which is a concern in the past.

  Further, by using a conductive adhesive and a thermosetting adhesive in combination as the adhesive 5, it is possible to prevent the positional displacement or dropping of the shield case 7 during the heat treatment in the subsequent process while grounding the shield case 7. it can. Furthermore, since the groove 2 wider than the final cutting width of the mother board 1 (the width of the dicing line DL) is formed, the shield case 7 can be reliably and easily inserted into the groove 2. Furthermore, since the groove 2 is formed so wide as described above, there is an advantage that it is easy to prevent interference between the dicing blade B2 and the shield case 7. In addition, since the conductor layer 3 is formed in the groove 2, the shield case 7 can be reliably grounded via the conductor layer 3.

  Further, in the electronic device 100, the shield case 7 is provided so as to cover the side of the individual substrate 10 by the depth of the notch groove 20, so that the part is also covered. That is, the electromagnetic noise generated from the mounted electronic circuit 6 and the inner layer circuit and the electromagnetic noise that can enter from the outside of the shield case 2 are shielded not only on one surface side of the individual substrate 10 but also on the side surface side of the circuit substrate. be able to. Thereby, the electromagnetic wave shielding effect can be significantly enhanced.

  FIG. 7 shows a part of an example of a procedure for dividing the individual board 10 from the mother board 1 shown in FIG. 1 to obtain the electronic device 100 using another preferred embodiment of the shield case fixing method according to the present invention. FIG. 2 is a process flow diagram showing a part of a cross section in the thickness direction of the motherboard 1. In this embodiment, the conductor layer 3 is not formed by plating (see FIG. 4), and the dicing by the dicing blade B1 is stopped at a predetermined depth in the first step illustrated in FIG. It is an example of the method of obtaining the electronic device 100 like the procedure shown in FIG.

  That is, when the motherboard 1 is a multilayer printed wiring board in which a plurality of insulating layers 1a and a plurality of wiring layers 1b are alternately stacked, a predetermined wiring layer 1b (ground conductor) which is an inner layer of the board and is connected to a ground potential. ) Is exposed to the bottom of the groove 2 by half-cutting (half-dicing) the mother board 1 with the dicing blade B1, and in this state, a conductive adhesive is applied in the groove 2, and the shield case 7 is placed there. When inserted, the shield case 7 can be connected to the ground potential via the wiring layer 1b. Therefore, the step of plating the conductor layer 3 can be omitted.

  8 and 9 show a process for dividing the individual board 10 from the mother board 1 shown in FIG. 1 to obtain the electronic device 100 using another preferred embodiment of the shield case fixing method according to the present invention. It is a process flow figure showing a part of example of a procedure, and shows a part of thickness direction section of mother board 1. In the present embodiment, a mother board 1 is prepared in which embedded conductors such as via conductors 30 connected to the ground potential are formed in advance along the dicing line DL (the formation of the via conductor 30 is the sixth step). 2, that is, in FIG. 2, the mother board 1 shown in FIG. 8 is used, and in the first step illustrated in FIG. 3, the mother conductor 1 is half cut (half dicing) by the dicing blade B <b> 1 together with the via conductors 30. Except for this, it is an example of a method for obtaining the electronic device 100 in the same manner as the procedure shown in FIGS.

  In this way, when the via conductor 30 is simultaneously cut when forming the groove 2 along the dicing line DL, the remaining portion of the via conductor 30 is exposed to the inner wall of the groove 2 and connected to the ground conductor. The conductor layer 33 is formed (first step, fifth step: FIG. 9). In this case, the width (maximum width) of the via conductor 30 is set larger than that of the dicing blade B1. If the mother board 1 is a multilayer printed wiring board or the like, it is indispensable to form via conductors or the like for connecting the wiring layers 1b and 1b in the manufacturing process. Therefore, the via conductor 30 is used for such interlayer connection. It can be formed simultaneously with the via conductor. Therefore, an increase in the number of man-hours can be suppressed as compared with the case where the groove 2 is formed and then the inside thereof is plated.

  Furthermore, when forming the groove 2 in the process shown in FIGS. 3 and 7, the wiring layer 1b located on the side wall of the groove 2 may not be sufficiently exposed to the side wall of the groove 2 by cutting with the dicing blade B1. On the other hand, according to the present embodiment in which the via conductor 30 securely connected to the wiring layer 1b is formed in advance, the shield is provided via the conductor layer 33 formed from the via conductor 30 and the wiring layer 1b which is the substrate inner layer. It becomes possible to ground the case 7 more reliably.

  In addition, as above-mentioned, this invention is not limited to said each embodiment, A various deformation | transformation is possible in the limit which does not change the summary. For example, in order to half-cut and full-cut the motherboard 1, a technique such as laser ablation or blasting may be used instead of the dicing blades B1 and B2, and when the groove 2 is formed by half-cutting, The groove 2 wider than the dicing line DL may be formed by cutting the dicing blade B2 narrower than the dicing blade B1 while sliding it in the surface direction of the mother board 1. Further, in the embodiment shown in FIGS. 8 and 9, the bottom surfaces of the via conductor 30 and the conductor layer 33 are not necessarily matched with the level of the wiring layer 1 b, in other words, the conductor layer 33 is wired only on the side wall of the groove 2. It may be connected to the layer 1b.

  Further, as shown in FIG. 10, if the maximum value of the distance L between the side wall of the shield case 7 and the side wall of the notch groove 2 in the individual substrate 10 is smaller than the width X of the bottom wall of the notch groove 2, 7 can be prevented from falling out of the individual substrate 10. The maximum value of the distance L corresponds to the sum of the distances between the both side (left and right) side walls of the shield case described above and the both side (left and right) side walls of the notch groove in the circuit board. In FIG. 10, the display of members other than the individual substrate 10 and the shield case 7 among members constituting the electronic device 100 is omitted. In addition, when the shield case 7 is not grounded, the conductor layers 3 and 33 may not be provided. Further, the shield case 7 does not have to be box-shaped (for example, has a rectangular cross section), may have any other cross-sectional shape, and the top wall and the side wall in the installed state are plates. For example, a mesh shape may be used.

  As described above, the present invention is a general shield for circuit boards on which various electronic components, in particular, electronic components that operate at high frequencies, and electronic devices, modules, units, equipment, facilities, systems, and the like. It can be used widely and effectively for manufacturing and operation.

  DESCRIPTION OF SYMBOLS 1 ... Mother board (collection board), 1a ... Insulating layer, 1b ... Wiring layer (a part, grounding conductor), 2 ... Groove, 3,33 ... Conductor layer, 4 ... Wiring pattern (grounding conductor), 5 ... Adhesive, 6 ... electronic parts, 7 ... shield case, 10 ... individual substrate, 20 ... notched groove, 30 ... via conductor (embedded conductor), 100 ... electronic device, DL ... dicing line (cutting line), B1, B2 ... dicing blade .

Claims (11)

A shield case fixing method for fixing a shield case covering an electronic component on a circuit board to the circuit board,
In a collective substrate having a plurality of individual substrates as the circuit substrate, a first step of forming a groove along a cutting line for defining the individual substrate;
A second step of applying an adhesive to the groove;
A third step of inserting an end of a side wall of the shield case into the groove to which the adhesive is applied, and curing the adhesive to fix the shield case to the collective substrate;
A fourth step of cutting the aggregate substrate along the cutting line and dividing it into the plurality of individual substrates;
Including shield case fixing method. In the second step, a conductive adhesive and / or a thermosetting adhesive is used as the adhesive.
The shield case fixing method according to claim 1. In the first step, the groove is formed so that the width of the groove is larger than the width of the cutting line,
In the fourth step, the collective substrate is cut such that the cut width of the collective substrate is smaller than the width of the groove.
The shield case fixing method according to claim 1 or 2. Including a fifth step of forming a conductor layer connected to a ground conductor provided on the aggregate substrate;
In the third step, the conductor layer and the shield case are connected.
The shield case fixing method according to claim 1. In the fifth step, a conductor is plated in the groove formed in the first step, and the formed plated conductor is connected to the ground conductor as the conductor layer,
In the third step, the shield case and the plated conductor are connected.
The shield case fixing method according to claim 4. The fifth step includes a sixth step of previously forming a buried conductor connected to the ground conductor along the cutting line and the first step prior to the first step.
The shield case fixing method according to claim 4. In the first step, the groove is formed so that the ground conductor provided on the collective substrate is exposed to the groove,
In the third step, the ground conductor and the shield case are connected.
The shield case fixing method according to claim 1. Mount electronic components on the circuit board,
By the shield case fixing method according to any one of claims 1 to 7, the shield case is fixed to the circuit board so as to cover the electronic component.
A method for manufacturing an electronic device. A shield case covering the electronic component on the circuit board is fixed to the circuit board,
A notch groove is formed in the peripheral edge of the circuit board, and a side wall end portion of the shield case is configured to fit into the notch groove.
Shield case fixing structure. A grounding conductor formed on the notch groove and provided on the circuit board; and a conductor layer connected to the shield case.
The shield case fixing structure according to claim 9. A circuit board;
Electronic components mounted on the circuit board;
A shield case fixed to the circuit board so as to cover the electronic component by the shield case fixing structure according to claim 9 or 10,
An electronic device comprising:

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