JP2013014743A - 表面活性添加剤およびこれを含むフォトレジスト組成物 - Google Patents
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Abstract
【解決手段】式(Ia)、式(Ib)または式(Ia)および(Ib)の組み合わせを含む窒素含有モノマーと、特定の酸脱保護性モノマーとを含むモノマーの重合生成物を含むポリマー。(Ia):Ra−C(=CH2)−CO−(−O−L1−)a−NRb 2、(Ib):Ra−C(=CH2)−CO−O−LN−X。(式中aは0または1であり、L1は直鎖もしくは分岐C1−10アルキレン基、または単環式、多環式、もしくは縮合多環式C3−20(ヘテロ)シクロアルキル等であり、各Rbは別々に分かれているか、または少なくとも一つのRbは隣のRbに結合されており;LNは縮合多環式C3−20ヘテロシクロアルキレン基等であり、XはH、C1−10アルキル等である。)
【選択図】なし
Description
リソグラフィ例2についてのPAG:トリフェニルスルホニウム(3−ヒドロキシアダマンタン−1−イルメトキシカルボニル)−ジフルオロ−メタンスルホナート)。
Claims (10)
- 式(Ia)、式(Ib)、または式(Ia)および(Ib)の組み合わせを含む窒素含有モノマーと、式(II)を有する酸脱保護性モノマーとを含むモノマーの重合生成物を含むポリマー:
(式中、aは0または1であり;
各Raは独立してH、F、C1−10アルキルまたはC1−10フルオロアルキルであり、
L1は直鎖もしくは分岐C1−20アルキレン基、または単環式、多環式もしくは縮合多環式C3−20シクロアルキレン基であり、各Rbは独立してH、C1−10アルキル、C3−20シクロアルキル、C3−20ヘテロシクロアルキル、脂肪族C5−20オキシカルボニル、またはC1−30アシル基であって、場合によってはヘテロ原子置換基を含むものであり、各Rbは別々に分かれているかまたは少なくとも一つのRbは隣のRbに結合されており;
LNは窒素含有単環式、多環式または縮合多環式C3−20ヘテロシクロアルキレン基であり、および
XはH、C1−10アルキル、脂肪族C5−20オキシカルボニルまたはC1−30アシル基であって、場合によってはヘテロ原子置換基を含むものであり;並びに、
各Rcは独立してC1−10アルキル、C3−20シクロアルキル、またはC3−20ヘテロシクロアルキルであって、各Rcは別々に分かれているかまたは少なくとも一つのRcは隣のRcに結合されている)。 - 窒素含有モノマーが式(Ic)を有する請求項1に記載のポリマー:
(式中、各Rdは独立してC1−10アルキル、C3−20シクロアルキル、またはC3−20ヘテロシクロアルキルであり、および各Rdは別々に分かれているかまたは少なくとも一つのRdは隣のRdに結合されており;
式(Ib)におけるLNは:
であり、
式中、各Reは独立して、H、ハロゲン、OR’、C1−10アルキル、またはC3−10シクロアルキルであり、R’はHまたはC1−10アルキルであり、およびbは1〜9の整数であり;
式中、各Reは独立して、H、C1−10アルキル、OH、C(=O)R’、C(=O)OR’、ハロゲン、または−NR”2であり、R’はC1−10アルキルであり、R”はHまたはC1−10アルキルであり、およびbは1〜9の整数である)。 - 酸感受性基とラクトン含有基とを含む酸感受性ポリマー、
光酸発生剤、および
請求項1〜8のいずれか1項に記載のポリマー系クエンチャー、
を含むフォトレジスト。 - (a)基体の表面上にパターン形成される1以上の層を有する基体;および
(b)前記パターン形成される1以上の層上の請求項9に記載のフォトレジスト組成物の層;
を含む、コーティングされた基体。
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017068259A (ja) * | 2015-09-30 | 2017-04-06 | ローム・アンド・ハース・エレクトロニック・マテリアルズ・コリア・リミテッド | フォトリソグラフィのためのオーバーコート組成物及び方法 |
| JP2017068252A (ja) * | 2015-09-30 | 2017-04-06 | ローム・アンド・ハース・エレクトロニック・マテリアルズ・コリア・リミテッド | フォトレジスト組成物及び方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2013061648A (ja) | 2011-09-09 | 2013-04-04 | Rohm & Haas Electronic Materials Llc | フォトレジスト上塗り組成物および電子デバイスを形成する方法 |
| US9213234B2 (en) * | 2012-06-01 | 2015-12-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photosensitive material and method of lithography |
| US9158198B2 (en) | 2012-07-31 | 2015-10-13 | Rohm And Haas Electronic Materials Llc | Photoresist compositions and methods of forming photolithographic patterns |
| US9182669B2 (en) | 2013-12-19 | 2015-11-10 | Rohm And Haas Electronic Materials Llc | Copolymer with acid-labile group, photoresist composition, coated substrate, and method of forming an electronic device |
| JP6637740B2 (ja) * | 2014-11-28 | 2020-01-29 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| KR101848656B1 (ko) * | 2015-04-30 | 2018-04-13 | 롬엔드하스전자재료코리아유한회사 | 오버코트 조성물 및 포토리소그래피 방법 |
| US9815930B2 (en) * | 2015-08-07 | 2017-11-14 | Rohm And Haas Electronic Materials Llc | Block copolymer and associated photoresist composition and method of forming an electronic device |
| JP6520753B2 (ja) * | 2016-02-19 | 2019-05-29 | 信越化学工業株式会社 | ポジ型レジスト材料、及びパターン形成方法 |
| JP7264019B2 (ja) * | 2018-12-14 | 2023-04-25 | 信越化学工業株式会社 | ポジ型レジスト材料及びパターン形成方法 |
| JP7626044B2 (ja) * | 2021-01-20 | 2025-02-04 | 信越化学工業株式会社 | ポジ型レジスト材料及びパターン形成方法 |
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| WO2011037246A1 (ja) * | 2009-09-28 | 2011-03-31 | Jsr株式会社 | 感放射線性樹脂組成物、レジストパターン形成方法、及び、重合体 |
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| DE10340330A1 (de) * | 2003-08-29 | 2005-03-24 | Röhm GmbH & Co. KG | Verfahren zur Synthese von Copolymeren zur Herstellung von Polymethacrylimiden |
| US7476492B2 (en) | 2006-05-26 | 2009-01-13 | International Business Machines Corporation | Low activation energy photoresist composition and process for its use |
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| KR20100068083A (ko) * | 2008-12-12 | 2010-06-22 | 제일모직주식회사 | (메트)아크릴레이트 화합물, 감광성 폴리머, 및 레지스트 조성물 |
| JP5516195B2 (ja) * | 2009-08-04 | 2014-06-11 | 信越化学工業株式会社 | パターン形成方法及びレジスト材料 |
| JP5440515B2 (ja) | 2011-01-14 | 2014-03-12 | 信越化学工業株式会社 | レジスト材料及びパターン形成方法 |
| JP2013011861A (ja) * | 2011-05-27 | 2013-01-17 | Sumitomo Chemical Co Ltd | レジスト組成物及びレジストパターンの製造方法 |
-
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- 2012-05-22 EP EP20120168948 patent/EP2527377A1/en not_active Withdrawn
- 2012-05-22 JP JP2012116277A patent/JP2013014743A/ja active Pending
- 2012-05-24 TW TW101118474A patent/TWI515211B/zh active
- 2012-05-28 CN CN201210243288.6A patent/CN102796221B/zh active Active
- 2012-05-29 US US13/482,574 patent/US8722825B2/en active Active
- 2012-05-29 KR KR20120056827A patent/KR101400764B1/ko active Active
-
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- 2013-11-11 US US14/076,724 patent/US9012128B2/en active Active
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| JP2008133312A (ja) * | 2006-11-27 | 2008-06-12 | Mitsubishi Rayon Co Ltd | 重合体、レジスト組成物及びパターンが形成された基板の製造方法 |
| JP2009031767A (ja) * | 2007-07-04 | 2009-02-12 | Shin Etsu Chem Co Ltd | レジスト材料及びこれを用いたパターン形成方法 |
| JP2011085927A (ja) * | 2009-09-18 | 2011-04-28 | Jsr Corp | 感放射線性樹脂組成物、レジストパターン形成方法及び重合体 |
| US20120237875A1 (en) * | 2009-09-18 | 2012-09-20 | Jsr Corporation | Radiation-sensitive resin composition, method for forming resist pattern, polymer and polymerizable compound |
| WO2011037246A1 (ja) * | 2009-09-28 | 2011-03-31 | Jsr株式会社 | 感放射線性樹脂組成物、レジストパターン形成方法、及び、重合体 |
| US20120219908A1 (en) * | 2011-02-25 | 2012-08-30 | Sumitomo Chemical Company, Limited | Resist composition and method for producing resist pattern |
| JP2012190004A (ja) * | 2011-02-25 | 2012-10-04 | Sumitomo Chemical Co Ltd | レジスト組成物及びレジストパターンの製造方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017068259A (ja) * | 2015-09-30 | 2017-04-06 | ローム・アンド・ハース・エレクトロニック・マテリアルズ・コリア・リミテッド | フォトリソグラフィのためのオーバーコート組成物及び方法 |
| JP2017068252A (ja) * | 2015-09-30 | 2017-04-06 | ローム・アンド・ハース・エレクトロニック・マテリアルズ・コリア・リミテッド | フォトレジスト組成物及び方法 |
| JP2018185533A (ja) * | 2015-09-30 | 2018-11-22 | ローム・アンド・ハース・エレクトロニック・マテリアルズ・コリア・リミテッド | フォトレジスト組成物及び方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120132669A (ko) | 2012-12-07 |
| US20130137035A1 (en) | 2013-05-30 |
| EP2527377A1 (en) | 2012-11-28 |
| CN102796221B (zh) | 2014-08-27 |
| KR101400764B1 (ko) | 2014-05-29 |
| US9012128B2 (en) | 2015-04-21 |
| JP2017075323A (ja) | 2017-04-20 |
| JP6307579B2 (ja) | 2018-04-04 |
| US8722825B2 (en) | 2014-05-13 |
| TWI515211B (zh) | 2016-01-01 |
| US20140065540A1 (en) | 2014-03-06 |
| CN102796221A (zh) | 2012-11-28 |
| TW201302817A (zh) | 2013-01-16 |
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