JP2013004708A - Heat radiation structure and heat radiation material - Google Patents

Abstract

The heat conductivity is 170 W / mK and the thermal emissivity is 0.85 or more, but the volume resistivity is low, and a high resistivity layer is provided on the surface of a semiconductor-like silicon carbide powder to insulate heat dissipation. As a filler, we provide thermal radiation materials and applied products.
A silicon carbide particle having a high thermal conductivity and a high thermal emissivity but having a semiconductor specific resistance is provided with a high resistivity layer so that the silicon carbide particles are made into an insulator and filled in a resin. In this case, insulation is maintained even if silicon carbides are in contact with each other, and thermal conductivity and thermal emissivity are increased.
[Selection] Figure 1

Description

The present invention relates to a heat radiating member, and more particularly to a heat radiating structure with improved heat radiating properties and an application product thereof.

The mainstream of current heat radiating members is alumina, aluminum nitride, boron nitride, silicon nitride, zinc oxide, magnesium oxide and the like.

Searched by the following keyword in the JPO electronic library. Patents & (public + registration) & (utility model) & heat radiation & heat absorption & heat conduction hits were 26, but the present invention does not conflict with any of the 26 cases. Number of hits 26 Items No. Publication number Name of invention Applicant (Registered publication / US Japanese abstract indicates the right holder) 1 JP 2010-086750 Lamp device and lighting equipment Toshiba Lighting & Technology Corporation 2 JP 2009-286092 Shin Nippon Steel Co., Ltd. 3 JP 2009-283871 Rework Soldering Method and Apparatus FUJITSU LIMITED 4 JP 2006-244846 LIGHT EMITTING ELEMENT, LIGHT EMITTING DEVICE EQUIPPED WITH THE SAME, AND ELECTRONIC DEVICE SEIKO EPSON CORPORATION 5 JP 2004 2004 -361386 Infrared radiation detection device General Electric Company 6 Japanese Patent Application Laid-Open No. 2004-303448 Light source device Sharp Corporation 7 Japanese Patent Application Laid-Open No. 2004-037063 Solar energy collection device and water heating device Luo Ching Koan 8 Japanese Patent Application Laid-Open No. 2003-207849 SEIKO EPSON CORPORATION 9 Japanese Patent Application Laid-Open No. 2001-274145 Liquid material vaporizer, semiconductor device and semi Manufacturing method of conductor device Mitsubishi Electric Corporation 10 JP 2000-185697 Sequential heat removal of stable satellites Space Systems / Loral Incorporated 11 JP 2000-031119 Dry etching apparatus and dry etching method Mitsubishi Electric Corporation 12 Special Kaihei 11-165715 Equipment for heating heat-deformable film webs in packaging equipment Lowbelt Bossille Geselsyaft Mits Besiyurenkterhafung 13 Japanese Patent Laid-Open No. 11-083202 Company 15 JP 08-205995 Rice Cooker Sharp Corporation 16 JP 08-033347 Inverter Maintenance System Hitachi, Ltd. and others 17 JP 06-037406 Metal Vapor Laser Equipment Hitachi, Ltd. 18 JP 05-193592 Spacecraft Thermal control device of General Electric NPA 19 Special Table 2008-502431 Fire extinguishing method and equipment Fire-Trace USA, LLC 20 Special Table 2007-532004 Integrated Circuit Laminating System and Method STACTTECH Group LP 21 Special Table 2007-509344 Ultra High Sensitivity Silicon Millimeter-wave active image forming device for sensors Northrop Grumman Corporation 22 Patent 3319885 Rice cooker Sharp Corporation 23 Patent 3218661 Electric rice cooker Sharp Corporation 24 JP 07-083131 Solar cell module Kyocera Co., Ltd. 3093599 Appliance Luo Qing Coan

We also searched with the following keywords.
Patent & (Public + Registration) & (Utility Model) & Thermal Radiation & Heat Absorption & Heat Conduction & (Heat Transfer + Convection)
The number of hits was 4, but the present invention does not conflict with any of the 4 cases.
4 hits
Sr. No. Gazette No. Title of Invention Applicant (Registered Gazette / US Japanese abstract indicates right holder)

1 Japanese Patent Application Laid-Open No. 2004-361386 Infrared Radiation Detection Device General Electric Company
2 Japanese Unexamined Patent Application Publication No. 2004-303448 Light Source Device Sharp Corporation
3 Sequential heat removal space for body-stabilized geostationary satellite Systems / Loral Incorporated
4 Special Table 2007-532004 Integrated Circuit Laminating System and Method STACTTECH Group LP

The problem to be solved is, for example, how to dissipate the heat when the electronic components in the enclosure are generating heat.
Also, when the motor is generating heat or when the LED lighting is generating heat, the heat dissipation is important. Because the heat rays (far infrared rays) radiated from the parts that generate heat are radiated toward the air, the way the heat rays come out changes greatly depending on the heat emissivity of the parts that generate heat, and as a result, heat is generated. This is because the temperature of the parts changes greatly.

An object of the present invention made in view of the above problems is to provide a heat dissipation structure that efficiently dissipates heat of a heating element and suppresses a temperature rise of the heating element.
If the temperature of the heating element is lowered by 10 ° C., the lifetime is doubled according to Arrhenius' law.

Means for achieving the above object are as follows.
That is, a heat radiation layer having a high heat emissivity is provided on the surface of the heat generating body or the heat radiating plate that dissipates the heat of the heat generating body. The heat radiation layer may be a heat radiation paint, a heat radiation sheet, or a heat radiation plate.

As a result, heat rays are efficiently radiated from the surface of the heat generating body or the heat radiating plate that dissipates the heat of the heat generating body, but this is sufficient if the surface of the heat generating body or the heat radiating plate that dissipates the heat of the heat generating body is in contact with the outside air However, the situation is different when the heating element or the heat dissipation plate that dissipates the heat of the heating element is housed in the casing.

In such a case, the heat rays dissipated from the heating element or the air near the surface of the heat dissipation plate that dissipates the heat of the heating element or the heating element is heated, and the hot air rising from the heat dissipation plate that dissipates the heat of the heating element or the heating element is not Stay in the enclosure. Here, if the heat absorption rate of the inner surface of the casing is low, the heat rays dissipated from the heating element and the heat quantity of the hot air rising from the heating element are not sufficiently transmitted to the inner surface of the casing, and as a result, the temperature of the casing increases greatly.
For example, when the housing is an aluminum plate or an iron plate, the heat absorption rate of aluminum or iron is equal to the thermal emissivity (λ) according to Kirchoff's law, so that λ = 0.03 for aluminum and λ = 0.21 for iron are low. So the heat absorption rate is also low. These heat emissivity and heat absorption rate are values for heat rays having a wavelength of 8 to 14 μm.

Here, a heat radiation layer (heat absorption layer) having a large heat emissivity (also having a large heat absorption rate) in close contact with the inner surface of the housing is provided. The heat radiation layer may be a heat radiation paint, a heat radiation sheet, or a heat radiation plate. The heat radiation sheet is a sheet in which heat radiation ceramic powder is dispersed in acrylic, polypropylene or silicone, polyolefin, urethane, epoxy or other resin. The thermal radiation coating is a coating in which thermal radiation ceramic powder is dispersed in a liquid resin such as a silica-based inorganic binder, silicone, polyolefin, acrylic, urethane, epoxy or the like.
In this way, the heat rays (far infrared rays) radiated from the heating element in the enclosure or the surface of the radiator plate that dissipates the heat of the heating element enter the heat radiation layer (heat absorption layer) provided on the enclosure surface. This heat is absorbed and transmitted to the plate surface of the housing, and the temperature of the entire plate surface rises due to heat conduction in the plate surface. Here, a heat radiation layer is also provided on the outer surface of the housing. The heat radiation layer may be a heat radiation paint, a heat radiation sheet, or a heat radiation plate.

In this way, since heat rays are radiated from the outer surface of the housing, the temperature of the housing plate surface is lowered by radiation cooling. As a result, the temperature of the air in the housing also decreases, and accordingly, the temperature of the heat generating body in the housing or the heat dissipation plate that dissipates the heat of the heat generating body also decreases.

FIG. 1 shows the above schematic diagram.
The heating element 101 is mounted on a heat radiating plate 102 that dissipates heat from the heating element.
A heat radiation layer 103 is provided on the surface of the heating element 101 and / or the surface of the heat dissipation plate 102 that dissipates the heat of the heating element. The heat radiation layer 103 may be a heat radiation paint or a heat radiation sheet.

As a result, heat rays (far infrared rays) 104 are radiated into the housing 106 from the surface of the heating element 101 and / or the surface of the heat radiating plate 102 that dissipates the heat of the heating element.
The radiated heat rays 104 are absorbed by a heat radiation layer (heat absorption layer) 105 provided on the inner surface of the housing 106, and this amount of heat is conducted through the plate 107 of the housing 106 by heat conduction as indicated by an arrow 108. Then, the temperature of the plate 107 of the housing 106 is increased. When the temperature of the plate 107 of the housing 106 rises, the temperature of the heat radiation layer 109 provided on the outer surface of the housing 106 also rises, so that the heat radiation indicated by numeral 110 is radiated from the heat radiation layer 109 and the temperature of the heat radiation layer 109 is increased. However, the temperature of the casing plate 107 is also lowered by the radiation cooling.
Accordingly, the temperature of the heat radiation layer 105 on the inner surface of the housing 106 also decreases.
As a result, the temperature of the heat generating plate 101 and the heat radiating plate 102 that dissipates the heat of the heat generating device also decreases due to radiation cooling. For this reason, when the heating element 101 is an electronic component, the temperature of the electronic component is lowered, the life of the electronic component is extended, and malfunctions are less likely to occur.

The heat transport mechanism transports heat by heat conduction in the heat generating plate 101 and the heat dissipating plate 102 that dissipates the heat of the heat generating member. The heat transported heat dissipates heat of the heat generating member 101 and the heat generating member. The surface radiates heat. The heat radiated heat is absorbed by the heat radiation layer (heat absorption layer) 105 on the inner surface of the housing 106, and the heat absorbed is thermally transported by heat conduction through the plate 107 of the housing 106. The heat radiation layer 109 is reached, and heat is radiated from the heat radiation layer 109 toward the outside air 111. At the same time, heat is dissipated by the convection of the outside air 111. When the housing 106 is closed, the convection due to the air in the housing 106 is not so great.
Therefore, the heat transport mechanism is named “tandem heat transport” because it is transported by a multistage mechanism of heat conduction-heat radiation-heat absorption-heat conduction-heat radiation-convection.
Tandem means “tandem standing carriage (two horses lined up in front and back)” and is a suitable term to express the heat transport mechanism.

In the heat transport mechanism, convective heat transfer occurs in the housing 106, but convection occurs transiently when the housing 106 is a closed system, but the contribution of convective heat transfer is small in a steady state.

The heat conduction is defined by the following equation.
W = λA (T1-T2) / L
Here, W is the heat flow (Joule / sec), λ is the thermal conductivity, A is the electrothermal cross section, L is the heat transfer distance, T1 is the high temperature side temperature, and T2 is the low temperature side temperature.
When the plate of the enclosure is aluminum, λ = 236W / mK, the area of the plate is A square meter, the thickness of the plate is L meter, the high temperature side / absolute temperature of the plate is T1 (K), the low temperature side / absolute temperature is T2 ( K).

Thermal radiation is defined by the following equation.
The amount of heat released by thermal radiation from an object having a thermal emissivity ε ₂ of the surface area A ₂ of the absolute temperature Ts is expressed by the following equation. Surrounding wall surface area A1 _, thermal emissivity ε1 _, ambient temperature Ta,
W is heat flow (Joule / sec)

W = σA ₂ (Ts ⁴ −Ta ⁴ ) / (1 / ε ₂ + A ₂ (1 / ε ₁ −1) / A ₁ )

σ: Stephan-Boltzmann constant = 5.67 × 10 ^-8 W m ^-2 K ^-4
When A ₂ << A ₁ , that is, when heat spreads far away

W = σε ₂ A ₂ (Ts ⁴ −Ta ⁴ )
It becomes.

The Stefan-Boltzmann constant is a small value, so it was traditionally thought that when the temperature was low, the amount of heat radiated was small.
However, an experiment was conducted to measure the surface temperature of the metal resistor through 1.5A by attaching a 5Ω metal resistor on a 120 × 50 × 0.5 mm copper plate.
When only the copper plate was used, the surface temperature of the metal resistor was 145 ° C.
In comparison, the surface temperature of the metal resistor when the heat radiation sheet was attached to the front and back of the copper plate was 100 ° C. The metal resistor was screwed directly to the copper plate, and no heat radiation sheet was attached to any metal resistor. As a result, the person who applied the heat radiation sheet was able to observe the radiation cooling effect because the temperature dropped by 45 ° C.

In addition, a silicone resin was used in place of the heat radiation sheet, and a paint in which 30 wt% of the heat radiation ceramic powder was dispersed in the silicone resin was made and applied to the front and back surfaces by 30 μm. The same experiment was conducted, but the results were the same. . Each copper plate was measured by putting it in a polyethylene casing (230 W × 170 D × 90 H). The thickness of the resin casing is 2 mm, and the thermal conductivity of this polyethylene is as low as 0.2 W / mK, but the thermal emissivity is relatively high at 0.8.
For this reason, the heat rays radiated from the copper plate to which the heat radiation sheet is attached heats the inner wall of the polyethylene container, raises the temperature of the polyethylene wall, radiates heat from the outer wall of the polyethylene container toward the free space, and by convection. The heat was also dissipated, and the temperature of the entire system and the temperature of the metal resistor decreased.
However, only the copper plate without the heat radiation sheet attached has a low heat emissivity of 0.03, so there are few heat rays radiated from the copper plate, so the temperature of the copper plate rises and the temperature of the metal resistor on the copper plate also It has risen.
On the other hand, the thermal radiation rate of the thermal radiation sheet and thermal radiation paint stuck on the copper plate is as high as 0.85 or more, so the thermal radiation is large and the temperature of the metal resistor on the copper plate is lowered.

Here, heat transport by convection on the surface of the enclosure is defined by the following equation.

W = αA (T-Ta)

W: Heat flow density by convection α: Heat transfer coefficient A: Heat transfer area (surface area of the housing)
T: Housing surface temperature Ta: Outside air temperature

As the heat radiation sheet, a 30 μ sheet in which ceramic powder (5 μ) was dispersed by 30 wt% in any of acrylic, polypropylene, polyolefin, urethane, or silicone was used.
The ceramic powder itself had a thermal emissivity of 0.85 or more.
Here, the thermal emissivity ε is the ratio when the black body is 1, and the copper 0.03
Aluminum 0.02
Rubber 0.95
Ceramic 0.95
General resin 0.8
It is.
Moreover, the following resin can also be used for a heat radiation sheet or a heat radiation paint.
That is, the following thermoplastics in which heat radiation ceramic powder is dispersed;
Polyolefin plastics (polypropylene, EVA).
Polyvinyl plastics (polyvinyl chloride, polyvinylidene chloride, polystyrene, ABS, polymethyl methacrylate).
Polyester plastics (PET, PBT, PEN, polycarbonate, liquid crystal polymer).
Polyether plastics.
Special ether plastics (PPS).
Polyamide plastics (nylon, aromatic polyamide).
Can also be used.
In addition, the following thermosetting plastics in which heat radiation ceramic powder is dispersed;
That is, phenol resin, amino resin, (urea resin, urea resin, melamine resin)
Unsaturated polyester resin, diallyl phthalate resin, epoxy resin, polyimide resin, and silicone resin can also be used.
Furthermore, thermoplastic elastomer with dispersed thermal radiation ceramic powder (olefin-based TPE, styrene-based TPE, polyvinyl chloride-based TPE, ester-based TPE, amide-based TPE, urethane-based TPE, syndiotactic-1, 2 polybutadiene-based TPE) .
Can also be used.

Also, apply 20μ of heat-resistant paint in which thermal radiation ceramic powder with thermal emissivity of 0.85 or more is dispersed on one side of a 100 × 100 × 3mm aluminum plate, and adhere the non-coated aluminum surface to a 360W electric stove. The temperature of was measured.
The center temperature of the top surface of uncoated aluminum after 30 minutes was 386 ° C., the center temperature of the top surface when the heat-resistant paint was applied to the top surface of 20 μm was 182 ° C., and the radiation cooling effect could be observed as low as 204 ° C.
Each aluminum surface in close contact with the electric stove receives heat from the heater and transfers heat to the aluminum. Since the thermal emissivity of the aluminum surface where the thermal radiation coating is not applied on the upper surface is as low as about 0.02, there are few heat rays radiated from the upper surface, so the temperature of the aluminum rose to 286 ° C. On the other hand, when the thermal radiation coating was applied to the upper surface, there were many heat rays radiated from the upper surface, radiative cooling occurred, and the temperature remained at 182 ° C.

Also, when the aluminum surface to which the heat radiation paint is applied is in close contact with the electric stove, the heat of the heater of the electric stove is absorbed by the heat radiation paint that is applied and raises the temperature of the aluminum plate. Compared to 415 ° C. after 30 minutes, aluminum alone was 372 ° C. and 43 ° C. lower and reversed. This is because the heat absorption rate is low because the heat absorption rate (thermal emissivity) of the aluminum surface is as low as 0.02.

Also, when the aluminum surface with the thermal radiation paint is lifted 4mm from the electric stove, the heat of the heater of the electric stove is absorbed by the applied thermal radiation paint and raises the temperature of the aluminum plate. The temperature of aluminum alone was 215 ° C and 114 ° C lower than the temperature of 329 ° C after 20 minutes. This is because the heat absorption rate is low because the heat absorption rate (thermal emissivity) of the aluminum surface is as low as 0.02.

In addition, a black anodized plate 100 × 100 × 1 mm, which has been widely used for heat radiation, is used, with the black anodized surface facing the top surface and the heat radiation coating on the top surface of a 100 × 100 × 1 mm aluminum plate. The samples coated with 20μ were compared.
In both cases, the aluminum surface was measured in close contact with the electric stove.
After 12 minutes, the center temperature of the upper surface of black alumite was 241 ° C., but the center temperature of the heat radiation coating applied 20 μm on the upper surface was as low as 179 ° C.
This seems to be because the thermal emissivity of black alumite is low because the thickness of the black alumite alumite layer is thin.

From this result, it was found that the heat radiation coating of the present invention has a higher radiation cooling effect than black anodized, which has been widely used for heat radiation.
After 12 minutes, smoke was generated from black alumite, so the experiment was terminated in 12 minutes. This seems to be because the organic paint is thinly applied on the commercially available black anodized surface for gloss. However, no smoke is generated from the thermal radiation paint of the present invention.
The base of the heat radiation paint of the present invention was an inorganic heat-resistant paint made by making a heat-resistant paint having a heat-resistant temperature of 1000 ° C. and dispersing 65 wt% of heat-radiating ceramic having a heat emissivity of 0.85 or more.
The binder component of the inorganic heat resistant paint was special colloidal silica, and an inorganic film could be formed by simply drying at 150 ° C. for 30 minutes after coating.

In addition, a similar experiment was performed with a silicone-based paint having a heat resistance of 600 ° C. dispersed with 45 wt% of heat radiation ceramic powder having a heat emissivity of 0.85 or more. In the case of an inorganic heat resistant paint, it is necessary to sandblast the base metal to increase the peel strength of the film by the anchoring effect, but the silicone-based heat resistant 600 ° C. paint does not require sandblasting.

Thermal radiation ceramic powder dispersed in thermal radiation paint and thermal radiation sheet
Aluminum nitride, silicon nitride, boron nitride, zinc oxide, aluminum oxide, crystalline silica, titanium oxide, manganese ferrite ((FeMn) ₂ O ₃ ), ferric oxide (Fe ₂ O ₃ ), high resistance silicon carbide, For example, silica nanoparticles of about 100 nm, alumina nanoparticles, and the like.
Since normal silicon carbide is a semiconductor, it cannot be used in a thermal radiation filler. However, high resistance silicon carbide has a specific resistance of about 10 13 Ω · cm and can be used as a thermal radiation filler.
Aluminum nitride is extremely expensive, and when it encounters moisture, it produces ammonia and its insulation is reduced. Boron nitride and silicon nitride are also expensive for a low thermal conductivity of 30 W / mK. Zinc oxide also has a low thermal conductivity of 30 W / mK and is toxic.

Among the thermal radiation ceramics, those having a high thermal conductivity tend to have a low thermal conductivity, and those having a high thermal conductivity tend to have a low thermal conductivity. In addition, carbon fiber and metal powder, which are high thermal conductivity fillers, are electrically conductive and thus are restricted in usage.
The types of the thermal radiation ceramic of the present invention are aluminum nitride, silicon nitride, boron nitride, zinc oxide, aluminum oxide, crystalline silica, titanium oxide, manganese ferrite ((FeMn) ₂ O ₃ ), ferric oxide (Fe ₂ O ₃ ), high resistance / silicon carbide, silica / nanoparticles of around 100 nm, alumina / nanoparticles, etc., and any type of thermal emissivity can be used as long as the thermal emissivity is 0.85 or more.
The effect of the present invention is a mechanism in which heat is transported by a heat transport mechanism, that is, a multistage mechanism of heat conduction-heat radiation-heat absorption-heat conduction-heat radiation-convection, and the temperature of the heating element is lowered by "tandem heat transport". As a result, the temperature of the heating element is dramatically reduced, and not only can the life of the heat-generating component be extended, but also when used in a heat exchanger, the heat transfer efficiency is improved and it can contribute to energy saving.

The schematic diagram of the tandem heat transport thermally radiated from the heating element in the enclosure. Sectional drawing which dissipates heat of LED lighting by radiation cooling. A sketch that dissipates the heat of electrolytic capacitors, electric double layer capacitors, lithium ion capacitors, and other capacitors by radiation cooling. The sketch which dissipates the heat | fever of a lithium ion battery other batteries by radiation cooling. Sectional drawing which dissipates heat generation of a motor by radiation cooling. Sectional drawing which dissipates the heat transfer efficiency of a heat exchanger by a heat radiation layer. Sectional drawing which dissipates heat of a car's muffler etc. by heat radiation. Sectional drawing which dissipates heat_generation | fever of an internal combustion engine by heat radiation. Sectional drawing which dissipates the heat_generation | fever of the electronic component on a printed circuit board by thermal radiation. Sectional drawing which dissipates the heat_generation | fever of batteries, such as a mobile phone and a smart phone, by thermal radiation. Sectional drawing which improves the thermal radiation property of the metallic coating or normal coating of an object or a moving body surface, and reduces the temperature of an object or a moving body by radiation cooling. Halogen lamp, HID lamp or LED lamp mounted on the reflector boiler Solar water heater The figure which disperse | distributed the heat dissipation filler to the fiber. FIG. 16A shows a heat sink called a skive fin, and FIG. 16B shows a conventional heat sink. Sectional drawing showing a heating furnace. Solder flow equipment and other heating kilns. Sectional drawing showing an air towel. Dryer or other hot air dryer Air blower or liquid pump Thermal radiation sheet and thermal grease. Heat radiation sheet and heat generating parts such as IC. heater.

FIG. 1 shows a typical embodiment 1 of the present invention. The configuration described in claim 1 is as follows.
A heat radiation layer 103 is provided on the surface of the heat generating body 101 and / or the surface of the heat radiating plate 102 that dissipates the heat of the heat generating body, and from the surface of the heat generating body 101 and / or the surface of the heat radiating plate 102 that dissipates heat of the heat generating body. Is characterized in that heat rays (far infrared rays) 104 are radiated inside the housing 106, and the radiated heat rays 104 are absorbed by a heat absorption layer (heat radiation layer) 105 provided on the inner surface of the housing 106. This heat is conducted in the plate 107 of the casing 106 to increase the temperature of the plate 107. When the temperature of the plate 107 of the casing 106 rises, the temperature of the heat radiation layer 109 provided on the outer surface of the casing 106 also increases. Therefore, as a result of radiating the heat ray indicated by reference numeral 110 from the heat radiation layer 109, the temperature of the heat radiation layer 109 and the temperature of the housing plate 107 are both lowered by radiation cooling, and accordingly, the heat of the inner surface of the housing 106 is reduced. The temperature of the heat collecting layer (thermal radiation layer) 105 and the temperature of the gas in the housing are lowered, and as a result, the temperature of the heat generating body 101 and the heat radiating plate 102 that dissipates the heat of the heat generating body is also reduced by radiative cooling. A radiation cooling mechanism of a heating element characterized by being lowered and a cross-sectional view thereof are shown.

FIG. 2 shows a second embodiment of the present invention. The configuration described in claim 2 is as follows.
In the light bulb type or straight tube type LED lighting fixture 201, there is an aluminum substrate below the LED element 202, and the heat of the LED, which is a heating element, is provided in close contact with the lower portion of the aluminum substrate, that is, the opposite side of the LED. The heat radiation is radiated from the heat radiation layer 203 as indicated by the arrow and is absorbed by the heat absorption layer (heat radiation layer) 204 provided on the inner surface of the heat sink. The absorbed heat gives heat to the heat radiation layer 205 provided on the outer surface of the heat radiating plate. As a result, heat rays are radiated from the heat radiation layer 205 toward the free space as indicated by the arrows. A light bulb type or straight tube type LED lighting apparatus and its cross-sectional view are characterized in that the temperature is lowered by radiation cooling to extend the lifetime of the LED and the brightness of the LED is increased.
Although this structure is shown as a light bulb type LED lighting apparatus in FIG. 2 as an example, the structure is not limited to this, and a straight tube type LED lighting apparatus can be applied to a straight tube type LED lighting apparatus because it has a similar structure.

FIG. 3 shows a third embodiment of the present invention. The configuration described in claim 3 is as follows.
In the electrolytic capacitor, electric double layer capacitor, lithium ion capacitor or film capacitor or ceramic capacitor element 301, heat is applied in the resin film 302 that covers the surface of the electrolytic capacitor, electric double layer capacitor, lithium ion capacitor or film capacitor or ceramic capacitor element 301. The radiant ceramic powder is dispersed, and the heat generated by the electrolytic capacitor, the electric double layer capacitor, the lithium ion capacitor, the film capacitor, or the ceramic capacitor element 301 is transferred to the radiant ceramic powder in the resin film 302 by heat conduction, In addition, heat radiation is radiated from the heat radiation ceramic powder in the resin film 302 by heat radiation, so that an electrolytic capacitor, an electric double layer capacitor, a lithium ion capacitor are emitted. Electrolytic capacitor, electric double layer capacitor, lithium ion capacitor, film capacitor, or ceramic capacitor element characterized in that the temperature of a sita, film capacitor, or ceramic capacitor element 301 is lowered by radiation cooling to extend the life of the capacitor, and its sectional view Indicates. A printed circuit board is shown at 303.

FIG. 4 shows a fourth embodiment of the present invention. The configuration described in claim 4 is as follows.
In the lithium ion battery, the nickel metal hydride battery, or the dry battery 401, the heat radiation ceramic powder is dispersed in the resin film 402 that covers the surface of the lithium ion battery, the nickel metal hydride battery, or the dry battery 401. Heat generated is transmitted to the heat radiating ceramic powder in the resin film 402 by heat conduction, and heat rays are radiated from the heat radiating ceramic powder in the resin film 402 by heat radiation, so that a lithium ion battery or a nickel metal hydride battery or A lithium ion battery, a nickel metal hydride battery, or a dry battery and a cross-sectional view thereof are characterized in that the temperature of the dry battery 401 is lowered by radiation cooling to extend the life of the battery.

FIG. 5 shows a fifth embodiment of the present invention. The configuration described in claim 5 is as follows.
In the motor 501, a heat radiation layer 503 is provided on the outer surface of the rotor 502, a heat absorption layer (heat radiation layer) 504 is provided on the inner surface of the stator 505, and a heat radiation layer 507 is provided on the outer surface of the housing 506. Sectional drawing of the motor characterized by this is shown.
The heat radiation layer 503 on the outer surface of the rotor 502 absorbs the heat of the rotor 502 and radiates heat rays to the space between the rotor 502 and the stator 505. The heat absorption layer (heat radiation layer) 504 on the inner surface of the stator 505 absorbs the heat rays, and the heat is transferred to the stator 505 by heat conduction. The heat of the stator 505 is transmitted to the housing 506 by heat conduction, but since this heat is radiated from the heat radiation layer 507 provided on the outer surface of the housing 506, the temperature of the motor 501 is lowered by radiation cooling.
Although FIG. 5 illustrates an axial gap type motor, the radial gap type motor is also included in the present invention because the same principle applies to the radial gap type motor.

FIG. 6 shows a sixth embodiment of the present invention. The configuration described in claim 6 is as follows.
In a heat exchanger 601 such as an air conditioner or air conditioner, a heat radiation layer 603 is provided on the outer surface and / or inner surface of the heat exchange fin 602, and the heat of the first heat medium (fluid) 605 that flows in the fin 602. Is transmitted to the heat radiation layer 603, heat rays are radiated from the heat radiation layer 603, and the heat of the first heat medium (fluid) 605 is transmitted to the second heat medium (fluid) 604 by heat radiation by adding heat conduction and convection. FIG. 2 shows a heat exchanger such as an air conditioner or an air conditioner, which is improved in heat transfer efficiency, and a sectional view thereof.

FIG. 7 shows a seventh embodiment of the present invention. The configuration described in claim 7 is as follows.
The muffler 701 of the vehicle is characterized in that a heat radiation layer 704 is provided on the surfaces of the exhaust gas supply pipe 702, the muffler 701, and the exhaust pipe 703 to the muffler, respectively, and the exhaust gas supply pipe 702, the muffler 701, the exhaust The heat of the pipe 703 is transferred to the heat radiation layer 704 by heat conduction, heat rays are emitted from the heat radiation layer 704 by heat radiation, and the temperatures of the exhaust gas supply pipe 702, the muffler 701, and the exhaust pipe 703 are lowered by radiation cooling and exhausted. FIG. 2 is a cross-sectional view of an exhaust gas air supply pipe, a muffler, and an exhaust gas air supply pipe, a muffler, and an exhaust pipe of a vehicle having an exhaust pipe characterized by reducing the amount of heat generated.

FIG. 8 shows an eighth embodiment of the present invention. The configuration described in claim 8 is as follows.
A heat radiation layer 802 is provided on the outer surface of the engine 801 of the internal combustion engine, the heat of the engine 801 is transferred to the heat radiation layer 802 by heat conduction, heat rays are radiated from the heat radiation layer 802, and the temperature of the engine 801 is lowered by radiation cooling. FIG. 2 shows an engine of an internal combustion engine characterized by improving the efficiency and life of the engine and its sectional view.

FIG. 9 shows Example 9 of the present invention. The configuration described in claim 9 is as follows.
In the printed circuit board 901, a heat radiation layer made of a heat radiation sheet or a heat radiation paint 902 is provided on the upper and lower surfaces of the printed circuit board 901, and heat of an electronic component (not shown) on the printed circuit board is transferred to the heat radiation layer 902 by heat conduction. A printed circuit board characterized by radiating heat rays from the heat radiation layer 902, reducing the temperature of an electronic component (not shown) on the printed circuit board by radiation cooling, extending the life of the electronic component and preventing malfunction, and a cross-sectional view thereof Indicates.

FIG. 10 shows Example 10 of the present invention. The configuration described in claim 10 is as follows.
In a cellular phone, a portable device, or a smartphone 1001, a heat radiation coating layer 1003 is provided on the surface of the battery 1002, the heat of the battery 1002 is transmitted to the heat radiation coating layer 1003 by heat conduction, and heat is radiated from the heat radiation coating layer 1003. The absorbed heat rays are absorbed by a heat absorption layer (heat radiation layer) 1004 provided on the inner surface of the housing 1005, and the absorbed heat is transmitted to the housing 1005 by heat conduction, and from the outer surface of the housing 1005 by convection and heat radiation. A mobile phone, a mobile device, or a smartphone characterized by dissipating heat, reducing the temperature of the battery, extending the battery life, and preventing malfunctions are shown.

FIG. 11 shows Example 11 of the present invention. The structure described in claim 11 is as follows.
When coating the surface of a stationary object or moving body 1101 with metallic paint or normal paint 1102, heat radiation ceramic powder is dispersed in the metallic paint or normal paint 1102 to increase the thermal emissivity of the metallic paint or normal paint 1102. And radiating heat rays to lower the temperature of the stationary object or moving body 1101 to radiatively cool the stationary object or moving body 1101 to lower the temperature of the stationary object or moving body, thereby saving energy. Or a normal paint and its application | coating sectional drawing are shown.
FIG. 12 shows Example 12 of the present invention. The configuration described in claim 12 is as follows.
In the halogen lamp, HID lamp, or LED lamp 1202 attached to the reflecting mirror 1201, a heat radiation layer 1203 is provided on the back surface of the reflecting mirror 1201, and reflection by heat conduction from the halogen lamp, HID lamp, or LED lamp 1202 to the reflecting mirror. A halogen lamp, an HID lamp, or an LED lamp mounted on the reflecting mirror 1201, which is characterized in that the heat of the mirror 1201 is transmitted to the heat radiation layer 1203 and dissipated by radiation cooling, and a cross-sectional view thereof are shown.
FIG. 13 shows Example 13 of the present invention. The configuration described in claim 13 is as follows.
A boiler characterized by providing a heat absorption layer (heat radiation layer) 1302 on the heating surface of the boiler 1301 to improve heat transfer efficiency and a cross-sectional view thereof are shown.
FIG. 14 shows Example 14 of the present invention. The configuration described in claim 14 is as follows.
The heat radiation layer 1402 and the heat absorption layer (heat radiation layer) 1404 are provided on the inner and / or outer surface of the heat medium pipe 1403 on the inner and outer surfaces of the fin 1401 of the solar water heater to improve the heat transfer efficiency of the solar water heater. The solar water heater characterized by this and its sectional view are shown.
FIG. 15 shows Example 14 of the present invention. The configuration described in claim 15 is as follows.
Thermally radiating ceramic powder 1502 is dispersed in clothing fiber 1501 to increase the heat dissipation of the fiber 1501, and the body temperature of the wearer is transmitted to the thermal radiating ceramic powder 1502 and dissipated to the outside. And a sectional view thereof.
FIG. 16 shows Example 16 of the present invention. The configuration described in claim 15 is as follows.
A heat sink and a cross-sectional view thereof are shown in which the heat radiation paint of the present invention is applied to the fin surface of the heat sink to increase the heat dissipation of the heat sink.
FIG. 16A shows a heat sink called a skive fin, in which the surface of an aluminum plate 1601 is ground to provide a fin called a cracked heat release fin 1602. The heat dissipating paint 1603 of the present invention is applied to the surface of this cracked fin (skive fin) to increase the heat dissipation. The skive fin has a raw aluminum surface, and the thermal emissivity of uncoated aluminum is 0.02, but the thermal emissivity of the thermal radiation paint of the present invention is 0.97. .
FIG. 16B shows a conventional heat radiating plate 1604 where the heat radiation paint 1606 of the present invention is applied to the surface of the fin 1605. Reference numeral 1605 denotes a conventional aluminum fin.
FIG. 17 shows Example 17 of the present invention. The configuration described in claim 17 is as follows. In the heating furnace 1701, the heat radiation / heat reflection paint 1703 of the present invention is applied to the inner surface of the recess for housing the heater 1702, and the heat rays emitted from the back of the heater are reflected by the heat radiation / heat reflection paint 1703 as indicated by an arrow 1704. Therefore, the heat efficiency inside the furnace is increased, and as a result, a heating furnace characterized by operating the furnace with less heater power and a cross-sectional view thereof are shown.
FIG. 18 shows Example 18 of the present invention. The configuration described in claim 18 is as follows. In a heating kiln such as a solder flow apparatus, a heat absorption (heat radiation) paint 1802 is applied to the outer surface of the heating kiln 1801 to absorb more heat from the heater 1803, and the heat is transmitted to the heating kiln 1801. A heating kiln in which a heat reflection (heat radiation) layer 1805 is provided on a surface facing the heater on the inner surface of 1804 to increase the thermal efficiency of the heating kiln and a sectional view thereof are shown.
FIG. 19 shows Example 19 of the present invention. The structure described in claim 19 is as follows. In a hot air drying device 1901 such as an air towel, a heater 1903 is provided on the back of the skive fin 1902 to transmit heat to the fin, and when the hot air 1905 is blown by the fan 1904, the main surface is placed on the fin surface of the skive fin 1902. A hot air drying apparatus and a cross-sectional view thereof are shown in which the thermal radiation coating of the invention is applied to improve the thermal emissivity and the thermal efficiency of the hot air drying apparatus is increased.
FIG. 20 shows Example 20 of the present invention. The structure described in claim 20 is as follows. In a dryer or other hot air dryer 2005, the heat radiation (heat absorption) paint 2004 is applied to the inner surface of the hot air cylinder 2001 and / or the heat absorption (heat radiation) paint 2003 is applied to the outer surface of the hot air cylinder 2001, and the heater 2002 is applied. The hot air dryer and its cross-section are characterized in that the heat of the hot air dryer is improved by transferring the heat of the air to the hot air tube 2001 and radiating heat from the heat radiation paint 2004 on the inner surface to heat the gas 2006 in the hot air tube 2001. The figure is shown.
FIG. 21 shows Example 21 of the present invention. The structure described in claim 21 is as follows. In the air blower or liquid feed pump having the housing 2101, heat radiation (heat absorption) paint layer 2102 is formed on the outer surface of the housing 2101 of the air blower or liquid feed pump and / or heat radiation (heat absorption is absorbed) on the inner surface of the housing 2101. ) The coating layer 2103 is provided, and the gas or liquid is heated by the frictional resistance between the rotating vane 2104 of the air supply blower or liquid supply pump and the gas or liquid in the gap of the housing, and the temperature of the gas or liquid rises. Is absorbed in the thermal radiation paint layer 2103 and transmitted to the housing 2101, and the heat of the housing is dissipated to the outside by the thermal radiation paint layer 2102, thereby reducing the heat generation of the gas or liquid, The liquid feed pump and its sectional view are shown. Reference numeral 2104 denotes a duct or a liquid feeding pipe.
FIG. 22 shows Example 22 of the present invention. The structure described in claim 22 is as follows. The fine irregularities on the upper surface of the electronic component 2206 are filled with the thermal conductive grease 2205, the thermal radiation sheet 2203 is provided on the upper part of the grease 2205, and the thermal conductive grease 2202 is applied on the upper surface of the thermal radiation sheet 2203 to The heat radiating ceramic powder 2204 in the heat radiating sheet 2203 is in solid contact with each other when the heat radiating sheet 2203 is compressed by tightening the heat sink 2201 with screws. The heat radiation sheet, the heat conduction grease, and the arrangement cross-sectional view thereof are characterized in that the heat conductivity is enhanced.
A printed circuit board 2208 and a lead 2207 for an electronic component such as an IC are shown.
FIG. 23 shows Example 23 of the present invention. The structure described in claim 23 is as follows.
When a heat generating component 2301 such as an IC is mounted on the printed circuit board 2302,
The tip of the terminal 2303 of the heat generating component 2301 such as an IC is exposed by being soldered to the lower portion of the printed board 2302. The exposed terminal 2303 is covered with a heat radiation sheet 2304, and the terminal 2303 of the heat generating component 2301 such as an IC is covered. A heat radiating sheet, a heat generating component such as an IC, and a cross section thereof, wherein heat is transmitted to the heat radiating sheet 2304, heat rays are radiated from the heat radiating sheet 2304, and heat of the heat generating component 2301 such as an IC is reduced by radiative cooling. The figure is shown.
In the heat radiation sheet 2304, heat radiation ceramic powder 2305 is dispersed.
An arrow 2306 is a heat ray emitted from the heat radiation sheet 2304.
FIG. 24 shows Example 24 of the present invention. The configuration described in claim 24 is as follows.
The heater 2402 is housed in a metal heater jacket 2401, and the space between the heater 2402 and the heater jacket 2401 is filled with a heat conductive powder such as magnesium oxide 2403. The heating object 2406 is, for example, a solder tank.
When the heat absorption layer (heat radiation layer) 2405 of the present invention is provided between the heater jacket 2401 and the heating object 2406, the heat of the heater jacket 2401 is efficiently transmitted to the heating object 2406. On the other hand, when a heat reflecting layer 2404 mainly composed of, for example, titanium oxide is provided on the surface of the heater jacket surface where the heat absorbing layer (heat radiation layer) 2405 is not provided, the heat rays from the heater 2402 are reflected by the heat reflecting layer as indicated by the arrows. The heater is reflected by 2404 and transmitted to the heat absorption layer (heat radiation layer) 2405 and also to the heating object 2406, so that the heating efficiency of the heater is increased, and the heating object 2406 is heated with less power. Can be built. A heater having such a construction and a cross-sectional view thereof are shown.

A twenty-fifth embodiment of the present invention is an embodiment of the metal / heat exchanger according to the twenty-fifth aspect.
In the heat exchanger of the application field shown in the following (1) to (20) in a metal / heat exchanger such as aluminum or stainless steel, the heat radiation layer of the present invention (at least part of the metal surface of the metal / heat exchanger ( Metal / heat exchanger characterized by providing a heat absorption layer).
(1) In automobiles, metal and heat exchangers such as radiators, heaters, condensers for air conditioners, and evaporators.
(2) Metal / heat exchangers such as railcar / diesel radiators, intercoolers and oil coolers.
(3) Metal / heat exchangers such as transformer oil coolers and CFC condensers for railway vehicles and electric vehicles.
(4)
Metal and heat exchangers such as construction vehicle radiators and oil coolers.
(5)
Metal / heat exchangers such as aircraft oil coolers, heat converters for air conditioning, and heat exchangers for electronic equipment.
(6)
Special vehicle radiators, air-cooled oil coolers, intercoolers, etc.
Metal / heat exchanger.
(7)
Evaporators for industrial air conditioners, heat transfer fins for metal, heat exchangers, etc. (8) Metals for heat systems, air-cooled oil coolers, heat exchangers (9) Air-cooled oil coolers for heavy electrical machines, Freon condensers, gas Cooler, air cooler metal / heat exchanger (10) Vending machine evaporator, condenser heat transfer fins, metal heat exchanger (11) Refrigerator metal, heat exchanger (12) Solar panel metal, Heat exchanger (13) Metal bath / heat exchanger (14) Plant air separator metal / heat exchanger (15) Hydrocarbon separator / ethylene plant, ethane recovery plant metal / heat exchanger ( 16) Metal / heat exchanger for LNG (LPG) liquefaction equipment (17) Metal / heat exchanger for LNG evaporation equipment (18) Waste heat recovery equipment / Gold for heat pipe Say the heat exchanger (19) Geothermal power generator and heat exchanger of the metal-heat exchanger (20) of solar collectors metallic, heat exchanger

Further, the heat radiation sheet in which the heat radiation ceramic powder as the heat radiation layer described in the claims and the specification of the present invention is dispersed is, for example, an adhesive resin sheet of acrylic, silicone or the like having a thickness of 10 to 60 microns. In particular, in the case of acrylic, an adhesive resin sheet in which a non-adhesive sheet such as PET of 10 μm or more is pasted on one side is suitable.
As for the non-adhesive resin sheet in polypropylene or claim 28, one having an adhesive layer of about 5 μm on one side is suitable.
Furthermore, in the case of the heat radiation coating material in which the heat radiation ceramic powder as the heat radiation layer described in the claims and specifications of the present invention is dispersed, the thickness is preferably 5 to 60 μm.
The present invention is not limited to the above embodiment. It goes without saying that similar embodiments not mentioned here also fall within the scope of the invention on the basis of equivalent principles within the scope of the invention.

According to the present invention, the heat dissipation of electronic parts and equipment is improved, and the efficiency of the heat exchanger is improved and the temperature is lowered, so that the life is extended and malfunction can be prevented.
Moreover, as a result of improving the heat dissipation of various electronic components and products, the thermal deterioration of the products is delayed by the Arrhenius law.

101; heating element 102; heat dissipation plate 103; heat radiation layer 104; heat ray 105; heat absorption layer 106 on the surface of the housing; housing 107; plate 108 constituting the housing; heat conduction 109 in the plate of the housing; Heat radiation layer 110; heat ray 111; outside air

201; LED lighting fixture 202; LED element 203; heat radiation layer 204 provided on the lower surface of the aluminum substrate on which the LED element is mounted; heat absorption layer 205 provided on the inner surface of the heat radiation fin of LED lighting; Thermal radiation layer 206 on the outer surface of the fin; LED lighting equipment cover

301; Capacitor 302; Thermal radiation layer 303 provided on the surface of the capacitor; Printed circuit board

401; battery 402; heat radiation layer provided on the surface of the battery

501; motor 502; rotor 503; heat radiation layer 504 provided on the surface of the rotor; heat absorption layer 505 provided on the surface of the stator; stator 506; housing 507; heat radiation layer provided on the outer surface of the housing

601; heat exchanger 602; heat exchanger fin 603; heat radiation layer 604 provided on the outer surface or inner surface of the fin; second heat medium (fluid)
605; first heat medium (fluid)

701; Exhaust gas muffler, etc. 702 of vehicle; Exhaust gas inflow pipe 703; Exhaust pipe 704; Thermal radiation layer provided on the surface of exhaust gas muffler, etc.

801; engine 802 of an internal combustion engine; heat radiation layer provided on the surface of the engine

901; Printed circuit board 902; Thermal radiation layer provided on upper and lower surfaces of printed circuit board

1001; mobile phone or smartphone 1002; battery 1003; heat radiation layer 1004 provided on the surface of the battery; heat absorption layer 1005 provided on the inner surface of the battery housing; battery housing

1101; Object or moving object 1102; Paint layer with enhanced thermal radiation with paint layer for coating the surface of object or moving object

1201; reflecting mirror 1202; halogen lamp, HID lamp or LED lamp 1203; heat radiation layer provided on the back side of the reflecting mirror

1301; Boiler 1302; Heat absorption layer (heat radiation layer) provided on the heating surface of the boiler

1401; Solar water heater fin 1402; Heat absorption layer (heat radiation layer) provided on the inner and outer surfaces of the solar water heater fin
1403; Heat medium pipe 1404 of solar water heater; Heat absorption layer (heat radiation layer) provided on the inner and outer surfaces of the heat medium pipe

Claims (30)

A heat radiation layer 103 is provided on the surface of the heat generating body 101 and / or the surface of the heat radiating plate 102 that dissipates the heat of the heat generating body, and from the surface of the heat generating body 101 and / or the surface of the heat radiating plate 102 that dissipates heat of the heat generating body. Is characterized in that heat rays (far infrared rays) 104 are radiated inside the housing 106, and the radiated heat rays 104 are absorbed by a heat absorption layer (heat radiation layer) 105 provided on the inner surface of the housing 106. This heat is conducted in the plate 107 of the casing 106 to increase the temperature of the plate 107. When the temperature of the plate 107 of the casing 106 rises, the temperature of the heat radiation layer 109 provided on the outer surface of the casing 106 also increases. Therefore, as a result of radiating the heat ray indicated by reference numeral 110 from the heat radiation layer 109, the temperature of the heat radiation layer 109 and the temperature of the housing plate 107 are both lowered by radiation cooling, and accordingly, the heat of the inner surface of the housing 106 is reduced. The temperature of the heat collecting layer (thermal radiation layer) 105 and the temperature of the gas in the housing are lowered, and as a result, the temperature of the heat generating body 101 and the heat radiating plate 102 that dissipates the heat of the heat generating body is also reduced by radiative cooling. A radiant cooling mechanism for a heating element, characterized in that it is lowered. In the light bulb type or straight tube type LED lighting fixture 201, there is an aluminum substrate below the LED element 202, and the heat of the LED, which is a heating element, is provided in close contact with the lower portion of the aluminum substrate, that is, the opposite side of the LED. The heat radiation is emitted from the heat radiation layer 203 and is absorbed by the heat absorption layer (heat radiation layer) 204 provided on the inner surface of the heat radiating plate. The absorbed heat gives heat to the heat radiation layer 205 provided on the outer surface of the heat radiating plate. As a result, heat rays are radiated from the heat radiation layer 205 toward the free space. A bulb-type or straight-tube type LED luminaire characterized in that the LED lifetime is reduced and the LED brightness is increased. In the electrolytic capacitor, electric double layer capacitor, lithium ion capacitor or film capacitor or ceramic capacitor element 301, heat is applied in the resin film 302 that covers the surface of the electrolytic capacitor, electric double layer capacitor, lithium ion capacitor or film capacitor or ceramic capacitor element 301. The radiant ceramic powder is dispersed, and the heat generated by the electrolytic capacitor, the electric double layer capacitor, the lithium ion capacitor, the film capacitor, or the ceramic capacitor element 301 is transferred to the radiant ceramic powder in the resin film 302 by heat conduction, In addition, heat radiation is radiated from the heat radiation ceramic powder in the resin film 302 by heat radiation, so that an electrolytic capacitor, an electric double layer capacitor, a lithium ion capacitor are emitted. Electrolytic capacitor for causing the temperature below or film capacitor or ceramic capacitor element 301 is extended the life of the capacitor is lowered by radiational cooling, electric double-layer capacitor, a lithium ion capacitor or film capacitor or ceramic capacitor element. In the lithium ion battery, the nickel metal hydride battery, or the dry battery 401, the heat radiation ceramic powder is dispersed in the resin film 402 that covers the surface of the lithium ion battery, the nickel metal hydride battery, or the dry battery 401. Heat generated is transmitted to the heat radiating ceramic powder in the resin film 402 by heat conduction, and heat rays are radiated from the heat radiating ceramic powder in the resin film 402 by heat radiation, so that a lithium ion battery or a nickel metal hydride battery or A lithium ion battery, a nickel metal hydride battery, or a dry battery characterized in that the temperature of the dry battery 401 is lowered by radiation cooling to extend the life of the battery. In the motor 501, a heat radiation layer 503 is provided on the outer surface of the rotor 502, a heat absorption layer (heat radiation layer) 504 is provided on the inner surface of the stator 505, and a heat radiation layer 507 is provided on the outer surface of the housing 506. A motor characterized by that. In a heat exchanger 601 such as an air conditioner or air conditioner, a heat radiation layer 603 is provided on the outer surface and / or inner surface of the heat exchange fin 602, and the heat of the first heat medium (fluid) 605 that flows in the fin 602. Is transmitted to the heat radiation layer 603, heat rays are radiated from the heat radiation layer 603, and the heat of the first heat medium (fluid) 605 is transmitted to the second heat medium (fluid) 604 by heat radiation by adding heat conduction and convection. A heat exchanger such as an air conditioner or an air conditioner characterized by improving heat transfer efficiency. The muffler 701 of the vehicle is characterized in that a heat radiation layer 704 is provided on the surfaces of the exhaust gas supply pipe 702, the muffler 701, and the exhaust pipe 703 to the muffler, respectively, and the exhaust gas supply pipe 702, the muffler 701, the exhaust The heat of the pipe 703 is transferred to the heat radiation layer 704 by heat conduction, heat rays are emitted from the heat radiation layer 704 by heat radiation, and the temperatures of the exhaust gas supply pipe 702, the muffler 701, and the exhaust pipe 703 are lowered by radiation cooling and exhausted. A vehicle having an exhaust gas supply pipe, a muffler, and an exhaust pipe characterized by reducing the amount of heat generated. A heat radiation layer 802 is provided on the outer surface of the engine 801 of the internal combustion engine, the heat of the engine 801 is transferred to the heat radiation layer 802 by heat conduction, heat rays are radiated from the heat radiation layer 802, and the temperature of the engine 801 is lowered by radiation cooling. An internal combustion engine characterized in that the engine efficiency and life are improved. In the printed circuit board 901, a heat radiation layer made of a heat radiation sheet or a heat radiation paint 902 is provided on the upper surface and the lower surface of the printed circuit board 901, and heat of electronic components on the printed circuit board is transmitted to the heat radiation layer 902 by heat conduction. A printed board characterized in that heat rays are radiated from the layer 902, the temperature of the electronic component on the printed board is lowered by radiation cooling, the life of the electronic component is extended, and malfunction is prevented. In a cellular phone, a portable device, or a smartphone 1001, a heat radiation coating layer 1003 is provided on the surface of the battery 1002, the heat of the battery 1002 is transmitted to the heat radiation coating layer 1003 by heat conduction, and heat is radiated from the heat radiation coating layer 1003. The absorbed heat rays are absorbed by a heat absorption layer (heat radiation layer) 1004 provided on the inner surface of the housing 1005, and the absorbed heat is transmitted to the housing 1005 by heat conduction, and from the outer surface of the housing 1005 by convection and heat radiation. A mobile phone, portable device or smartphone characterized by dissipating heat, reducing battery temperature, extending battery life, and preventing malfunction. When coating the surface of a stationary object or moving body 1101 with metallic paint or normal paint 1102, heat radiation ceramic powder is dispersed in the metallic paint or normal paint 1102 to increase the thermal emissivity of the metallic paint or normal paint 1102. And radiating heat rays to lower the temperature of the stationary object or moving body 1101 to radiatively cool the stationary object or moving body 1101 to lower the temperature of the stationary object or moving body, thereby saving energy. Or normal paint. In the halogen lamp, HID lamp, or LED lamp 1202 attached to the reflecting mirror 1201, a heat radiation layer 1203 is provided on the back surface of the reflecting mirror 1201, and reflection by heat conduction from the halogen lamp, HID lamp, or LED lamp 1202 to the reflecting mirror. A halogen lamp, an HID lamp, or an LED lamp mounted on the reflecting mirror 1201, wherein the heat of the mirror 1201 is transmitted to the heat radiation layer 1203 and dissipated by radiation cooling. A boiler characterized in that a heat absorption layer (heat radiation layer) 1302 is provided on the heating surface of the boiler 1301 to improve heat transfer efficiency. The heat radiation layer 1402 and the heat absorption layer (heat radiation layer) 1404 are provided on the inner and / or outer surface of the heat medium pipe 1403 on the inner and outer surfaces of the fin 1401 of the solar water heater to improve the heat transfer efficiency of the solar water heater. A solar water heater characterized by that. Thermally radiating ceramic powder 1502 is dispersed in clothing fiber 1501 to increase the heat dissipation of the fiber 1501, and the body temperature of the wearer is transmitted to the thermal radiating ceramic powder 1502 and dissipated to the outside. . A heat sink, wherein the heat radiation paint of the present invention is applied to the fin surface of the heat sink to increase the heat dissipation of the heat sink. In the heating furnace 1701, the heat radiation / heat reflection paint 1703 of the present invention is applied to the inner surface of the recess for housing the heater 1702, and the heat rays emitted from the back of the heater are reflected by the heat radiation / heat reflection paint 1703. A heating furnace characterized in that the thermal efficiency of the furnace is increased, and as a result, the furnace is operated with less heater power. In a heating kiln such as a solder flow apparatus, a heat absorption (heat radiation) paint 1802 is applied to the outer surface of the heating kiln 1801 to absorb more heat from the heater 1803, and the heat is transmitted to the heating kiln 1801. A heating kiln in which a heat reflection (heat radiation) layer 1805 is provided on a surface facing the heater on the inner surface of 1804 to increase the thermal efficiency of the heating kiln. In a hot air drying device 1901 such as an air towel, a heater 1903 is provided on the back of the skive fin 1902 to transmit heat to the fin, and when the hot air 1905 is blown by the fan 1904, the main surface is placed on the fin surface of the skive fin 1902. A hot air drying apparatus characterized in that the thermal radiation rate is improved by applying the thermal radiation paint of the invention, and the thermal efficiency of the hot air drying apparatus is increased. In a dryer or other hot air dryer 2005, the heat radiation (heat absorption) paint 2004 is applied to the inner surface of the hot air cylinder 2001 and / or the heat absorption (heat radiation) paint 2003 is applied to the outer surface of the hot air cylinder 2001, and the heater 2002 is applied. The hot air dryer is characterized in that the heat of the hot air dryer is improved by transmitting the heat of the air to the hot air tube 2001 and radiating heat from the heat radiation paint 2004 on the inner surface to heat the gas 2006 in the hot air tube 2001. In the air blower or liquid feed pump having the housing 2101, heat radiation (heat absorption) paint layer 2102 is formed on the outer surface of the housing 2101 of the air blower or liquid feed pump and / or heat radiation (heat absorption is absorbed) on the inner surface of the housing 2101. ) The coating layer 2103 is provided, and the gas or liquid is heated by the frictional resistance between the rotating vane 2104 of the air supply blower or liquid supply pump and the gas or liquid in the gap of the housing, and the temperature of the gas or liquid rises. Is absorbed in the thermal radiation paint layer 2103 and transmitted to the housing 2101, and the heat of the housing is dissipated to the outside by the thermal radiation paint layer 2102, thereby reducing the heat generation of the gas or liquid, Feed pump. The fine irregularities on the upper surface of the electronic component 2206 are filled with the thermal conductive grease 2205, the thermal radiation sheet 2203 is provided on the upper part of the grease 2205, and the thermal conductive grease 2202 is applied on the upper surface of the thermal radiation sheet 2203 to The heat radiating ceramic powder 2204 in the heat radiating sheet 2203 is in solid contact with each other when the heat radiating sheet 2203 is compressed by tightening the heat sink 2201 with screws. Thermal radiation sheet and thermal grease characterized by improving thermal conductivity. When a heat generating component 2301 such as an IC is mounted on the printed circuit board 2302,
The tip of the terminal 2303 of the heat generating component 2301 such as an IC is exposed by being soldered to the lower portion of the printed board 2302. The exposed terminal 2303 is covered with a heat radiation sheet 2304, and the terminal 2303 of the heat generating component 2301 such as an IC is covered. A heat radiating sheet and a heat generating component such as an IC, wherein heat is transmitted to the heat radiating sheet 2304, heat rays are radiated from the heat radiating sheet 2304, and heat of the heat generating component 2301 such as an IC is reduced by radiative cooling. The heater 2402 is housed in a metal heater jacket 2401, and the space between the heater 2402 and the heater jacket 2401 is filled with a heat conductive powder such as magnesium oxide 2403.
When the heat absorption layer (heat radiation layer) 2405 of the present invention is provided between the heater jacket 2401 and the heating object 2406, the heat of the heater jacket 2401 is efficiently transmitted to the heating object 2406. On the other hand, if a heat reflecting layer 2404 mainly composed of, for example, titanium oxide is provided on the surface of the heater jacket surface where the heat absorbing layer (heat radiation layer) 2405 is not provided, the heat rays from the heater 2402 are reflected by the heat reflecting layer 2404. Heat is transmitted to the heat absorption layer (heat radiation layer) 2405 and also to the heating object 2406, so that the heating efficiency of the heater is increased, and a heater can be constructed that heats the heating object 2406 with less power. A heater characterized by such construction. The thermal radiation ceramic powder dispersed in the thermal radiation layer according to any one of claims 1 to 24 is a thermal radiation ceramic powder in which a high resistivity layer is provided on a surface of silicon carbide powder. The heat radiation ceramic powder dispersed in the heat radiation layer according to any one of claims 1 to 24 is made of aluminum nitride, silicon nitride, boron nitride, zinc oxide, aluminum oxide, crystalline silica, titanium oxide, manganese ferrite ((FeMn) ₂ O ₃ ), thermal radiation ceramic powder containing at least one of ferric oxide (Fe ₂ O ₃ ), high resistance / silicon carbide, silica / nanoparticles around 100 nm, alumina / nanoparticles, etc. Heat radiation ceramic powder. The heat radiation ceramic powder dispersed in the heat radiation layer according to any one of claims 1 to 24 is a heat radiation ceramic powder containing at least one of silica nanoparticles, alumina nanoparticles, and the like of around 100 nm. Heat radiation ceramic powder. The heat radiation layer (heat absorption layer) according to any one of claims 1 to 27 is a heat radiation sheet or a heat radiation paint in which a heat radiation ceramic is dispersed in a resin shown in the following (a), (b), and (c). Characteristic heat radiation layer.
(a) the following thermoplastics in which the thermal radiation ceramic powder is dispersed;
Polyolefin plastics (polypropylene, EVA).
Polyvinyl plastics (polyvinyl chloride, polyvinylidene chloride, polystyrene, ABS, polymethyl methacrylate).
Polyester plastics (PET, PBT, PEN, polycarbonate, liquid crystal polymer). Polyether plastics. Special ether plastics (PPS).
Polyamide plastics (nylon, aromatic polyamide).
(B) The following thermosetting plastics in which the thermal radiation ceramic powder is dispersed;
That is, phenol resin, amino resin, (urea resin, urea resin, melamine resin)
Unsaturated polyester resin, diallyl phthalate resin, epoxy resin, polyimide resin, silicone resin.
(C) Thermoplastic elastomer that disperses thermal radiation ceramic powder (olefin-based TPE, styrene-based TPE, polyvinyl chloride-based TPE, ester-based TPE, amide-based TPE, urethane-based TPE, syndiotactic-1, 2 polybutadiene-based TPE ). 29. The heat radiation layer according to claim 1, wherein the heat radiation layer (heat absorption layer) is a heat radiation sheet or a heat radiation paint in which a heat radiation ceramic is dispersed in an inorganic paint shown in (d) below. layer.
(D) An inorganic paint having colloidal silica as the main binder. In the heat exchanger of the application field shown in the following (1) to (20) in a metal / heat exchanger such as aluminum or stainless steel, the heat radiation layer of the present invention (at least part of the metal surface of the metal / heat exchanger ( Metal / heat exchanger characterized by providing a heat absorption layer).
(1) In automobiles, metal and heat exchangers such as radiators, heaters, condensers for air conditioners, and evaporators.
(2) Metal / heat exchangers such as radiators, intercoolers, oil coolers for railway vehicles and diesel vehicles.
(3) Metal / heat exchangers such as transformer oil coolers and CFC condensers for railway vehicles and electric vehicles.
(8)
Metal and heat exchangers such as construction vehicle radiators and oil coolers.
(9)
Metal / heat exchangers such as aircraft oil coolers, heat converters for air conditioning, and heat exchangers for electronic equipment.
(10)
Special vehicle radiators, air-cooled oil coolers, intercoolers, etc.
Metal / heat exchanger.
(11)
Evaporators for industrial air conditioners, heat transfer fins for metal, heat exchangers, etc. (8) Metals for heat systems, air-cooled oil coolers, heat exchangers (9) Air-cooled oil coolers for heavy electrical machines, Freon condensers, gas Cooler, air cooler metal / heat exchanger (10) Vending machine evaporator, condenser heat transfer fins, metal heat exchanger (11) Refrigerator metal, heat exchanger (12) Solar panel metal, Heat exchanger (13) Metal bath / heat exchanger (14) Plant air separator metal / heat exchanger (15) Hydrocarbon separator / ethylene plant, ethane recovery plant metal / heat exchanger ( 16) Metal / heat exchanger for LNG (LPG) liquefaction equipment (17) Metal / heat exchanger for LNG evaporation equipment (18) Waste heat recovery equipment / Gold for heat pipe Say the heat exchanger (19) Geothermal power generator and heat exchanger of the metal-heat exchanger (20) of solar collectors metallic, heat exchanger

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