JP2013004609A - Substrate bonding method - Google Patents

Abstract

There is a problem in that the relative position between the aligned substrate and the substrate is shifted during conveyance.
A substrate bonding method includes a temporary bonding step of overlapping a plurality of substrates and bonding at least one part of a plurality of opposing surfaces and side surfaces with a temporary bonding member at a temporary bonding portion, and the temporary bonding step. A transporting step of transporting the plurality of substrates temporarily joined in step to a main joining portion, and a main joining in which the plurality of substrates temporarily joined in the temporary joining step are finally joined by a main joining member in the main joining portion. Stages.
[Selection] Figure 5

Description

  The present invention relates to a substrate bonding method.

Conventionally, a substrate bonding method is known in which a plurality of aligned substrates are transported and then bonded together by heating or pressurization.
Patent Document 1 Japanese Unexamined Patent Application Publication No. 2009-49066

  However, there is a problem that the relative position between the aligned substrate and the substrate is shifted during conveyance.

  In the first aspect of the present invention, in the temporary bonding portion, a temporary bonding step of overlapping a plurality of substrates and bonding at least one part of the plurality of facing surfaces and side surfaces with a temporary bonding member, and the temporary bonding step A transporting step of transporting the plurality of substrates temporarily joined in step to a main joining portion, and a main joining in which the plurality of substrates temporarily joined in the temporary joining step are finally joined by a main joining member in the main joining portion. A substrate bonding method comprising the steps of:

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

1 is an overall configuration diagram of a substrate bonding apparatus 10. FIG. 2 is a side view of the overall configuration of an aligner 28. FIG. It is a figure explaining the operation | movement of the aligner. It is a figure explaining the operation | movement of the aligner. It is a figure explaining the temporary joining of the board | substrates 90 and 90 by the aligner which is 1 process of a board | substrate bonding method. 6 is a plan view of a substrate 90 for explaining the positional relationship of a temporary bonding member 96. FIG. FIG. 3 is a front view for explaining the overall configuration of a storage chamber 55 and a heating / pressurizing device 56. It is a figure explaining the main joining of the board | substrates 90 and 90 by the heating-and-pressing apparatus 56 which is 1 process of a board | substrate bonding method. It is a figure explaining the state of the electrode pad 98 and the temporary joining member 96 which were finally joined. FIG. 5 is a plan view of an embodiment in which the number of temporary joining members 96 is modified. It is a top view of embodiment which apply | coated the resin material of the temporary joining member 96 to the whole surface. FIG. 12 is a partial longitudinal sectional view of the embodiment of FIG. 11. It is a partial top view of embodiment which changed arrangement of temporary joining member 96. FIG. It is a longitudinal cross-sectional view of embodiment which formed the temporary joining member 96 in the side surface. It is a longitudinal cross-sectional view of embodiment which changed the shape of the temporary joining member. It is a longitudinal cross-sectional view of embodiment which changed the shape of the temporary joining member. It is a longitudinal cross-sectional view of embodiment which changed the shape of the temporary joining member. It is a longitudinal cross-sectional view of embodiment which changed the joining method of the temporary joining member. It is a longitudinal cross-sectional view of embodiment which changed the joining method of the temporary joining member. It is a top view of the board | substrate of the lower layer of embodiment which changed the temporary joining member. It is a top view of the board | substrate of the middle layer of embodiment which changed the temporary joining member. It is a top view of the board | substrate of the upper layer of embodiment which changed the temporary joining member. It is a longitudinal cross-sectional view in a state where three substrates are stacked. It is a longitudinal cross-sectional view of the state where the upper layer substrate was temporarily bonded to the two substrates previously bonded.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is an overall configuration diagram of a substrate bonding apparatus. The substrate bonding apparatus 10 bonds the two substrates 90 and 90 and manufactures an overlapping substrate 92. Note that the substrate bonding apparatus 10 may be configured to bond the three or more substrates 90 to manufacture the superimposed substrate 92.

  The board | substrate bonding apparatus 10 by this embodiment suppresses the shift | offset | difference of the relative position of the board | substrate in conveyance by temporarily joining the board | substrate aligned to the board | substrate. As shown in FIG. 1, the substrate bonding apparatus 10 includes a housing 12, a normal temperature unit 14, a high temperature unit 16, and a control unit 18. The housing 12 is formed so as to surround the normal temperature part 14 and the high temperature part 16.

  The room temperature unit 14 includes a plurality of substrate cassettes 20, 20, 20, a robot arm 24, a pre-aligner 26, an aligner 28, and a robot arm 30.

  The substrate cassette 20 accommodates the substrates 90 that are bonded and bonded together in the substrate bonding apparatus 10. Further, the substrate cassette 20 accommodates the overlapping substrate 92 bonded and bonded in the substrate bonding apparatus 10. The substrate cassette 20 is detachably attached to the outer surface of the housing 12. Thereby, a plurality of substrates 90 can be loaded into the substrate bonding apparatus 10 at a time. In addition, a plurality of sets of overlapping substrates 92 can be collected at once. The substrate 90 to be bonded by the substrate bonding apparatus 10 is a single silicon wafer, a compound semiconductor wafer, a glass substrate, or the like on which elements, circuits, terminals, and the like are formed. Further, the loaded substrate 90 may be an overlapping substrate 92 on which a plurality of wafers are already stacked.

  The robot arm 24 is disposed inside the housing 12 and in the vicinity of the substrate cassette 20. The robot arm 24 transports the substrate 90 loaded in the substrate cassette 20 to the pre-aligner 26. The robot arm 24 transports the substrate 90 transported to the pre-aligner 26 to the fixed stage unit 36 or the moving stage unit 38 of the aligner 28 described later. Note that the robot arm 24 reverses the substrate 90 transported to the fixed stage unit 36. The robot arm 24 transports the superposed substrate 92 that is coupled and transported to the moving stage unit 38 to one of the substrate cassettes 20, 20, 20.

  The pre-aligner 26 is disposed inside the housing 12 and in the vicinity of the robot arm 24. The pre-aligner 26 temporarily aligns the position of the substrate 90 so that the substrate 90 is loaded in the narrow adjustment range of the aligner 28 because of high accuracy when the substrate 90 is loaded on the aligner 28. Thereby, the positioning of the substrate 90 in the aligner 28 can be performed quickly and accurately.

  The aligner 28 is an example of a temporary joint. The aligner 28 is disposed between the robot arm 24 and the robot arm 30. The aligner 28 includes a frame body 34, a fixed stage unit 36, a moving stage unit 38, and a pair of shutters 40 and a shutter 42.

  The frame body 34 is formed so as to surround the fixed stage portion 36 and the moving stage portion 38. The surface of the frame 34 on the substrate cassette 20, 20, 20 side and the surface on the high temperature part 16 side are opened so that the substrate 90 and the like can be carried in and out.

  The fixed stage portion 36 is fixed inside the frame body 34 and in the vicinity of the substrate cassette 20. The lower surface of the fixed stage unit 36 vacuum-sucks the substrate 90 conveyed from the moving stage unit 38 by the robot arm 30 while holding the substrate 90.

  The moving stage unit 38 is disposed inside the frame body 34 and on the high temperature unit 16 side. The upper surface of the moving stage unit 38 vacuum-sucks the substrate 90. The moving stage unit 38 moves in the horizontal direction and the vertical direction inside the frame body 34. The moving stage unit 38 moves and aligns the substrate 90 held by the moving stage unit 38 with the substrate 90 held by the fixed stage unit 36 and then superimposes them. The moving stage unit 38 temporarily bonds the stacked substrates 90 and 90 together.

  The shutter 40 opens and closes the opening of the frame 34 on the substrate cassette 20 side. The shutter 42 opens and closes the opening on the high temperature part 16 side of the frame body 34. The area surrounded by the frame body 34 and the shutters 40 and 42 is communicated with an air conditioner or the like, and the temperature is controlled. Thereby, the accuracy of alignment between the substrate 90 and the substrate 90 is improved.

  The robot arm 30 is disposed inside the housing 12 and between the high temperature part 16 and the aligner 28. The robot arm 30 is positioned by the moving stage unit 38 and vacuum-sucks the pair of temporarily bonded substrates 90 and transports them to the high temperature unit 16. The robot arm 30 conveys the superposed substrate 92 bonded and bonded in the high temperature unit 16 from the high temperature unit 16 to the moving stage unit 38.

  The high temperature part 16 is set to a high temperature and a vacuum state in the bonding process of the substrate bonding apparatus 10. The high temperature unit 16 includes a heat insulating wall 46, an air lock chamber 48, a pair of shutters 50 and 52, a robot arm 54, five storage chambers 55, and five heating and pressurizing devices 56. The robot arm 54 is an example of a transport unit. Note that the number of the heating and pressing devices 56 is not limited to five, and may be changed as appropriate.

  The heat insulating wall 46 surrounds the high temperature part 16. Thereby, the heat insulating wall 46 maintains the high internal temperature of the high temperature part 16 and blocks heat radiation from the high temperature part 16 to the outside. As a result, the heat insulating wall 46 reduces the influence of the heat of the high temperature part 16 on the normal temperature part 14. Moreover, the heat insulation wall 46 interrupts | blocks the gas flow of the high temperature part 16 and the exterior. Thereby, the heat insulation wall 46 maintains the vacuum state of the high temperature part 16.

  The air lock chamber 48 connects the normal temperature part 14 and the high temperature part 16. The room temperature portion 14 side and the high temperature portion 16 side of the air lock chamber 48 are opened so as to be able to transport an overlapping substrate 92 including a pair of substrates 90.

  The shutter 50 opens and closes the opening of the air lock chamber 48 on the normal temperature part 14 side. When the shutter 50 is in an open state, the air lock chamber 48 is communicated with the normal temperature unit 14. As a result, the air lock chamber 48 has substantially the same atmospheric pressure as the room temperature portion 14. In this state, the robot arm 30 conveys the overlapping substrate 92 between the air lock chamber 48 and the aligner 28.

  The shutter 52 opens and closes the opening of the air lock chamber 48 on the high temperature part 16 side. When the shutter 52 is opened, the air lock chamber 48 is communicated with the high temperature part 16. As a result, the air lock chamber 48 has substantially the same atmospheric pressure as the high temperature portion 16. In the bonding process, neither the shutter 50 nor the shutter 52 is opened.

  The robot arm 54 carries the substrates 90 and 90 carried into the air lock chamber 48 by the robot arm 30 into one of the heating and pressurizing devices 56 when the shutter 52 is open. The robot arm 54 transports the superposed substrate 92 including the substrates 90 and 90 that are finally bonded by the heating and pressurizing device 56 to the air lock chamber 48.

  The storage chamber 55 is formed in a hollow shape. The accommodating chamber 55 accommodates and surrounds the main part of the heating and pressurizing device 56. The accommodation chamber 55 has an opening that can be opened and closed in order to carry in and carry out the overlapping substrate 92. The storage chamber 55 is sealed to make a vacuum after the superimposed substrate 92 is carried in.

  The heating and pressurizing device 56 is an example of the main joint. The heating / pressurizing device 56 is disposed inside the heat insulating wall 46. The three heating / pressurizing devices 56 are arranged at substantially equal angular intervals around the center of the heat insulating wall 46. The heating / pressurizing device 56 holds the overlapping substrate 92 carried from the air lock chamber 48 by the robot arm 54. The heating / pressurizing device 56 pressurizes the overlapping substrate 92 in the combined temperature state. Then, the heating and pressurizing device 56 raises the temperature of the loaded overlapping substrate 92 to a bonding temperature at which the substrate 90 of the overlapping substrate 92 can be bonded. Thereby, the heating and pressurizing device 56 combines and bonds the overlapping substrates 92 together.

  The robot arm 54 transports the superposed substrate 92 bonded and bonded from the heating / pressurizing device 56 to the air lock chamber 48.

  The control unit 18 controls the overall operation of the substrate bonding apparatus 10. The control unit 18 includes an operation unit that is operated by the user from the outside when the substrate bonding apparatus 10 is turned on and various settings are made.

  A substrate bonding method using the above-described substrate bonding apparatus 10 will be described. First, the robot arm 24 transports the substrates 90 and 90 one by one from the substrate cassette 20 to the moving stage unit 38 and the fixed stage unit 36 of the aligner 28 via the pre-aligner 26. The fixed stage unit 36 and the moving stage unit 38 suck and hold the substrates 90 and 90, respectively. Next, the moving stage unit 38 aligns the substrate 90 and the substrate 90. Thereafter, the moving stage unit 38 raises the substrate 90 to be held, superimposes the substrates 90 and 90, and temporarily joins a part of the opposing surface of the substrates 90 and 90 with a temporary joining member described later. Thereafter, the moving stage unit 38 moves the temporarily bonded substrates 90 and 90 to the vicinity of the robot arm 30. The robot arm 30 transports the substrates 90, 90 on the moving stage unit 38 to the air lock chamber 48. The robot arm 54 transports a pair of substrates 90 and 90 temporarily joined from the air lock chamber 48 to the heating and pressurizing device 56. The heating and pressurizing device 56 heats and presses the substrates 90 and 90 to electrically bond the electrode pads of the pair of temporarily bonded substrates 90 and 90 to each other. Thereby, the overlapping substrate 92 is completed. Thereafter, the robot arms 54, 30, and 24 carry the superimposed substrate 92 to the substrate cassette 20. Thereby, a board | substrate bonding process is complete | finished.

  FIG. 2 is a side view of the overall configuration of the aligner 28. As shown in FIG. 2, the frame body 34 includes a bottom plate 102, a top plate 104, and side walls 106. The bottom plate 102 and the top plate 104 are arranged in parallel to each other. The side wall 106 surrounds the side surface while connecting the bottom plate 102 and the top plate 104. The side wall 106 in the region corresponding to the shutters 40 and 42 is opened.

  A part of the moving stage unit 38 is provided on the bottom plate 102 so as to be movable in the XYZ directions. The moving stage unit 38 includes an X direction driving unit 110, a Y direction driving unit 112, a Z direction driving unit 114, a plurality of swing driving units 116, a lower stage 118, a lower microscope 120, and a lower reflecting mirror 122. And an ultraviolet light source 124.

  The X direction drive unit 110 is disposed on the bottom plate 102 via an X guide rail 111 provided on the bottom plate 102. The X direction driving unit 110 moves the Y direction driving unit 112 in the X direction along the X guide rail 111. The Y direction driving unit 112 is disposed on the upper surface of the X direction driving unit 110. The Y direction driving unit 112 moves the lower stage 118 in the Y direction. In the Z direction drive unit 114, the lower stage 118 is arranged at the center of the upper surface of the Y direction drive unit 112. The Z direction driving unit 114 drives the lower stage 118 in the Z direction. Thereby, the Z-direction drive unit 114 can contact and press the substrate 90 adsorbed on the lower stage 118 to the substrate 90 adsorbed on the fixed stage unit 36.

  The lower stage 118 is supported by the Z-direction driving unit 114 via the spherical seat 115. The lower stage 118 vacuum-sucks the substrate 90.

  The plurality of swing drive units 116 are disposed on the peripheral edge of the upper surface of the Y direction drive unit 112. The plurality of swing driving units 116 are individually extended and contracted. As a result, the swing drive unit 116 swings the lower stage 118 with the spherical seat 115 provided on the Z direction drive unit 114 as the swing axis.

  The lower microscope 120 is fixed to the lower stage 118. The lower microscope 120 is installed so that the upper part can be observed. Thereby, the lower microscope 120 observes the alignment mark 94 of the substrate 90 adsorbed to the fixed stage unit 36. As a result, the relative position of the substrate 90 of the fixed stage unit 36 with respect to the lower stage 118 is measured. The lower reflecting mirror 122 reflects light emitted from an interferometer (not shown). Thereby, the position and movement amount of the lower stage 118 are detected.

  For example, three ultraviolet light sources 124 are provided around the substrate 90. The ultraviolet light source 124 includes a laser or a light emitting diode that can emit ultraviolet light. The ultraviolet light source 124 irradiates the temporary bonding member 96 with ultraviolet light, which is light for curing, in a state where the temporary bonding member 96 applied on the substrate 90 is in contact with the substrate 90. Accordingly, the temporary bonding member 96 that is an example of a photo-curing resin and includes an insulating ultraviolet curable resin is cured, and the substrate 90 and the substrate 90 are temporarily bonded.

  Although not shown, the aligner 28 has a rotation drive unit that rotates the lower stage 118 around the vertical direction. As a result, the aligner 28 rotates the substrates 90 and 90 to align the substrates 90 and 90 in the rotational direction.

  The fixed stage unit 36 is fixed to the top plate 104. The fixed stage unit 36 includes a plurality of load cells 130, an upper stage 132, an upper reflecting mirror 134, and an upper microscope 136.

  The plurality of load cells 130 are fixed to the top plate 104. The plurality of load cells 130 detect pressure. The upper stage 132 is supported by the top plate 104 via the load cell 130. As a result, the pressure acting on the upper stage 132 is detected by the load cell 130. The lower surface of the upper stage 132 sucks the substrate 90 by vacuum.

  The upper reflecting mirror 134 reflects the outgoing light from the interferometer for detecting the position and movement amount of the upper stage 132. The upper microscope 136 is fixed to the top plate 104 in the vicinity of the upper stage 132. The upper microscope 136 observes the alignment mark 94 of the substrate 90 adsorbed on the moving stage unit 38. As a result, the relative position of the moving stage unit 38 with respect to the upper stage 132 is measured.

  3 and 4 are diagrams for explaining the operation of the aligner 28. FIG. FIG. 5 is a diagram for explaining the temporary bonding of the substrates 90 and 90 by the aligner, which is one step of the substrate bonding method.

  First, the temporary bonding member 96 is provided on the substrates 90 and 90. Next, the shutter 40 is opened. In this state, as shown in FIG. 2, the robot arm 24 places the substrates 90 and 90 on the lower stage 118 of the moving stage unit 38 and the upper stage 132 of the fixed stage unit 36 in this order. The lower stage 118 and the upper stage 132 vacuum-suck the substrates 90 and 90, respectively.

  Next, as shown in FIG. 3, the X-direction drive unit 110 and the Y-direction drive unit 112 are driven so that the substrates 90 and 90 held by the lower stage 118 and the upper stage 132 are generally opposed to each other. In this state, while observing the substrates 90 and 90 with a camera or the like, the swing driving unit 116 is operated to make the opposing surfaces of the substrates 90 and 90 parallel.

  Next, the X-direction drive unit 110 and the Y-direction drive unit 112 are driven, and the alignment mark 94 of the substrate 90 held on the lower stage 118 is placed in the field of view of the upper microscope 136. Thereby, the relative position of the substrate 90 with respect to the upper stage 132 is measured. Similarly, the alignment mark 94 of the substrate 90 held on the upper stage 132 is observed with the lower microscope 120, and the relative position of the substrate 90 with respect to the lower stage 118 is measured.

  Based on these measurements, the amount of deviation of the horizontal relative position of the pair of substrates 90, 90 is calculated. An alignment amount that eliminates the shift amount is calculated, and the lower stage 118 is moved based on the alignment amount. Thereby, a pair of board | substrates 90 and 90 are aligned. The step of providing the temporary bonding member 96 on the substrates 90 and 90 is preferably performed before the alignment of the substrates 90 and 90.

  Thereafter, as shown in FIG. 4, the Z-direction drive unit 114 is driven to raise the lower stage 118. Thereby, the board | substrate 90 and the board | substrate 90 adjoin.

  In this state, as shown in FIG. 5, the temporary bonding member 96 of the upper substrate 90 and the temporary bonding member 96 of the lower substrate 90 are in contact with each other. Here, the height of the temporary bonding member 96 from the surface of the substrate 90 is higher than the height of the electrode pad 98 electrically connected to the element formed on the substrate 90 from the surface of the substrate 90. Therefore, even if the temporary joining members 96 and 96 are in contact with each other, the electrode pads 98 and 98 formed on the opposing substrates 90 and 90 are not in contact with each other and are separated. The electrode pad 98 is an example of the bonding member. The step of providing the temporary bonding member 96 on the substrates 90 and 90 is preferably performed after the electrode pad 98 is provided. The temporary bonding member 96 is preferably formed after the surface of the substrate 90 on which the element and the electrode pad 98 are formed is polished by CMP (Chemical Mechanical Polishing) or the like.

  The temporary bonding member 96 and the electrode pad 98 include different bonding materials. For example, the temporary joining member 96 is made of an ultraviolet curable resin, and the electrode pad 98 is made of a metal material. In this case, the temporary bonding member 96 is softer than the electrode pad 98, and the temporary bonding member 96 can be reduced from being a load in the main bonding in which electrode pads 98 and 98 described later are bonded to each other.

  FIG. 6 is a plan view of the substrate 90 for explaining the positional relationship of the temporary bonding member 96. As shown in FIG. 6, the three temporary bonding members 96 are extremely small in plan view, and the total bonding area of the three temporary bonding members 96 is larger than the total bonding area of the electrode pads 98 to be bonded. Is also small. Further, the bonding strength of the temporary bonding member 96 made of resin is lower than the bonding strength of the individual electrode pads 98 made of metal. Therefore, the total bonding strength by the three temporary bonding members 96 after the temporary bonding is weaker than the total bonding strength of the electrode pads 98 after the main bonding. The three temporary joining members 96 are arranged on the periphery of the substrate 90 so as to be separated from each other. The three temporary joining members 96 are arranged around the center of the substrate 90 at intervals of 120 °. The substrate 90 is placed on the moving stage unit 38 so that the three temporary bonding members 96 face the three ultraviolet light sources 124. In addition, the temporary bonding member 96 is disposed outside the element region where the element is formed, and is insulated from the element. The temporary joining member 96 is provided on the scribe line 99. The scribe line 99 is a line that divides the overlapping substrate 92 into elements after the substrates 90 and 90 are bonded together.

  After the substrates 90 and 90 are brought close to each other in this way, as shown in FIGS. 5 and 6, the three ultraviolet light sources 124 irradiate the temporary bonding members 96 formed at three locations on the substrate 90 with ultraviolet rays. To do. As a result, the temporary bonding member 96 is cured and temporarily bonded so that the substrates 90 and 90 are aligned with each other so as not to move relative to each other. Even in this state, the electrode pads 98 and 98 formed on the different substrates 90 and 90 are separated from each other.

  FIG. 7 is a front view illustrating the entire configuration of the storage chamber 55 and the heating and pressurizing device 56. As shown in FIG. 7, the storage chamber 55 includes a shutter 144 that opens and closes an opening 142 for loading and unloading the substrate 90.

  The heating and pressing apparatus 56 includes a fixed base 150, a lower heating unit 152, an elevating unit 154, an upper heating unit 156, a vertical microscope 158, and a horizontal microscope 160.

  The fixed base 150 is fixed to the floor of the storage chamber 55. The lower heating unit 152 is fixed to the upper surface of the fixed base 150. The lower heating unit 152 vacuum-sucks the substrate 90. The lower heating unit 152 includes a heating wire or the like. As a result, the lower heating unit 152 heats the substrate 90 from below.

  The elevating part 154 is fixed to the ceiling of the accommodation chamber 55. The elevating unit 154 supports the upper heating unit 156 and moves the upper heating unit 156 up and down. Thereby, the elevating unit 154 pressurizes the substrates 90 and 90 via the upper heating unit 156. The upper heating unit 156 heats the substrate 90 from above with a heating wire or the like.

  The vertical microscope 158 observes the alignment marks of the two substrates 90 and 90 with light that can pass through the substrate 90 such as infrared rays through the observation hole 157 formed in the upper heating unit 156. Thereby, based on the alignment marks of the two substrates 90, 90, a positional deviation of the other substrate 90 with respect to one substrate 90 is detected. The horizontal microscope 160 observes the substrate 90 from the side. Thereby, the bending and the swell of the substrate 90 are detected.

  FIG. 8 is a diagram illustrating the main bonding of the substrates 90 and 90 by the heating and pressurizing device 56, which is one step of the substrate bonding method. FIG. 9 is a diagram for explaining the state of the electrode pad 98 and the temporary bonding member 96 that are finally bonded.

  As shown in FIG. 7, the substrates 90 and 90 that are aligned and temporarily joined by the aligner 28 are placed on the upper surface of the lower heating unit 152 of the heating and pressing device 56. In this state, the vertical microscope 158 and the horizontal microscope 160 detect abnormalities of the substrates 90 and 90 such as displacement and deformation. When abnormality of the substrates 90 and 90 is detected, the substrates 90 and 90 may be carried out. Thereby, the board | substrates 90 and 90 before this joining can be reused.

  Next, as shown in FIG. 8, heating by the lower heating unit 152 and the upper heating unit 156 starts, and the elevating unit 154 moves the upper heating unit 156 downward. Thereafter, the lower surface of the upper heating unit 156 contacts the upper surface of the substrate 90. From this state, the elevating unit 154 further pressurizes the substrates 90 and 90 via the upper heating unit 156. As a result, as shown in FIG. 9, the temporary bonding member 96 is compressed, and the electrode pads 98 of the lower substrate 90 and the electrode pads 98 of the upper substrate 90 come into contact with each other. When the temperature of the electrode pads 98 and 98 is increased to a temperature at which the electrode pads 98 and 98 can be bonded by heating by the lower heating unit 152 and the upper heating unit 156, the temperature is thereafter maintained at the bonding temperature and the pressure of the substrates 90 and 90 is increased. Pressure is also maintained. As a result, the electrode pads 98 and 98 are joined together, and the elements formed on the substrates 90 and 90 are electrically connected via the electrode pads 98 and 98. If heating is not necessary, it may be omitted. As a result, the substrates 90 and 90 are joined to complete the superimposed substrate 92. Thereafter, the superimposed substrate 92 is carried out to the substrate cassette 20 by the robot arms 54, 30, and 24. It should be noted that after the superposed substrate 92 is carried out to the outside, the temporary joining member 96 may be removed by cleaning or blowing off and then divided into element units along the scribe line 99.

  As described above, in the substrate bonding method of the present embodiment, the aligned substrate 90 and the substrate 90 are temporarily bonded by the temporary bonding member 96 and then conveyed to the heating and pressing device 56. Thereby, the position shift of the board | substrate 90 and the board | substrate 90 in conveyance can be suppressed. Furthermore, since the temporary bonding member 96 is provided on the opposing surface of the substrate 90 and the substrate 90 and is not exposed to the outside, it is not easily affected by external force. As a result, the positional deviation between the substrates 90 can be further suppressed.

  In the above-described substrate bonding method, the temporary bonding member 96 is partially provided, and the bonding area of the temporary bonding member 96 is made smaller than the bonding area of the electrode pad 98 to be permanently bonded. Further, the bonding force of the temporary bonding member 96 is made smaller than the bonding force of the electrode pad 98. Thereby, the temporary joining member 96 can be easily removed after this joining.

  In the substrate bonding method described above, the temporary bonding member 96 is provided on the scribe line 99. Thereby, the area | region of the board | substrate 90 which cannot be used for the temporary joining member 96 can be reduced.

  In the above-described substrate bonding method, the positional displacement and deformation of the temporarily bonded substrates 90 and 90 are observed in the heating and pressing device 56 before the main bonding by heating and pressing. Thereby, when an abnormality such as a positional deviation of the substrates 90 and 90 is detected, the substrate 90 can be reused by taking out the substrate 90 without performing the main bonding.

  Next, an embodiment in which a part of the above-described embodiment is changed will be described.

  FIG. 10 is a plan view of an embodiment in which the number of temporary joining members 96 is modified. As shown in FIG. 10, the number of temporary joining members 96 may be three or more, for example, eleven. Here, when only three ultraviolet light sources 124 are arranged, the rotation driving unit of the aligner 28 may rotate the substrate 90 around the rotation axis along the vertical direction. Thus, the three ultraviolet light sources 124 can sequentially irradiate 11 portions of the temporary bonding member 96 with ultraviolet rays. Further, a temporary bonding member 96 may be provided at the center of the substrate 90. The number and arrangement of these temporary joining members 96 are merely examples, and may be changed as appropriate.

  FIG. 11 is a plan view of an embodiment in which the resin material of the temporary bonding member 96 is applied to the entire surface. FIG. 12 is a partial longitudinal sectional view of the embodiment of FIG. As shown in FIG. 11, a resin material 97 such as an ultraviolet curable resin may be applied to substantially the entire surface between the substrates 90. Thereafter, the irradiated region may be applied as the temporary bonding member 96 by irradiating a part of the resin material 97 with ultraviolet rays. Alternatively, the entire surface of the resin material 97 may be irradiated with ultraviolet rays, and the entire surface may be used as the temporary bonding member 96. In this case, as shown in FIG. 12, the resin material 97 is preferably thicker than the sum of the heights of the electrode pads 98 and 98. Thereby, it can suppress that the electrode pad 98 of the board | substrate 90 and the electrode pad 98 of the board | substrate 90 which were temporarily joined are connected. Alternatively, the entire surface of the resin material 97 may be irradiated with ultraviolet rays, and the substantially entire surface of the substrate 90 may be temporarily bonded.

  FIG. 13 is a plan view of a part of the embodiment in which the arrangement of the temporary joining member 96 is changed. As shown in FIG. 13, the number of the temporary bonding members 96 is higher in the region where the bonding strength is lower than in the region where the bonding force between the electrode pads 98 and 98 is high in the state where the main bonding members 96 are bonded. For example, the number of temporary bonding members 96 disposed in a region with a lower density than that in a region with a high density of electrode pads 98 may be increased. In other words, the number of the electrode pads 98 may be increased in a region far from the electrode pad 98 compared to a close region. Thereby, after main joining, it can control that substrates 90 and 90 separate by external force etc. Moreover, when the board | substrate 90 deform | transforms by bending etc. and the distance between the board | substrate 90 and the board | substrate 90 differs, you may arrange | position the temporary joining member 96 according to the said distance. For example, in a region where the distance between the substrate 90 and the substrate 90 is large, it is preferable to dispose a larger number of temporary bonding members 96 than in a small region. Thereby, the intensity | strength of temporary joining of the area | region where the said distance is large and the board | substrates 90 and 90 are easy to space apart can be improved. As a result, the separation between the substrates 90 and 90 after temporary bonding can be suppressed.

  FIG. 14 is a longitudinal sectional view of an embodiment in which the temporary joining member 96 is formed on the side surface. As shown in FIG. 14, the temporary joining member 96 may be formed on the opposing surfaces of the substrates 90 and 90 and may be formed on the side surfaces of the substrate 90. Thereby, the ultraviolet light source 124 can easily irradiate the temporary joining member 96 with light. Further, by covering the side surface of the substrate 90, the horizontal displacement of the substrates 90, 90 can be more efficiently suppressed.

  FIG. 15 is a longitudinal sectional view of an embodiment in which the shape of the temporary joining member is changed. As shown in FIG. 15, an acute-angle convex portion 280 may be provided at the end portion on the joining side of one temporary joining member 296. The tip of the acute angle convex part 280 is formed at an acute angle. Accordingly, the temporary bonding members 296 and 297 are temporarily bonded to each other in a state where the one temporary bonding member 296 is stuck into the other temporary bonding member 297. One temporary joining member 296 is preferably made of the same material as the other temporary joining member 297 or a material harder than the other temporary joining member 297. Furthermore, it is preferable that the temporary bonding members 296 and 297 are made of a material that can be bonded at a normal temperature or a low temperature by plasma or an atomic beam. An example of the material constituting the temporary joining members 296 and 297 is metal.

  FIG. 16 is a longitudinal sectional view of an embodiment in which the shape of the temporary joining member is changed. As shown in FIG. 16, at one end of one temporary joining member 396, 397, a tapered convex portion 380 that protrudes in a tapered shape, which is an example of a guided portion, is formed. At the tip of the other temporary joining member 397, a tapered concave portion 382 that is an example of a guide portion and is recessed in a tapered shape is formed. Accordingly, when the substrates 90 and 90 are close to each other, the tapered concave portion 382 guides the tapered convex portion 380. As a result, the substrates 90 and 90 can be easily positioned. In this embodiment, it is preferable to use a material that can be bonded at normal temperature or low temperature by plasma or atomic beam. As an example, both the temporary joining members 396 and 397 may be made of metal. As another example, one of the temporary bonding members 396 and 397 may be formed of silicon, and the other of the temporary bonding members 396 and 397 may be formed of a silicon oxide film, or vice versa.

  FIG. 17 is a longitudinal sectional view of an embodiment in which the shape of the temporary joining member is changed. As shown in FIG. 17, a protruding portion 480 that partially protrudes is formed at the tip of one temporary joining member 496. A concave portion 482 having the same shape as the convex portion 480 is formed at the tip of the other temporary joining member 497. Thereby, the board | substrates 90 and 90 can be positioned by fitting the convex part 480 to the recessed part 482. FIG. In addition, the positional displacement in the horizontal direction can be suppressed by fitting the convex portion 480 and the concave portion 482 after positioning.

  FIG. 18 is a longitudinal cross-sectional view of an embodiment in which the method of joining the temporary joining members is changed. As shown in FIG. 18, a through hole 513 is formed in the lower stage 518 of the aligner 28. A vibrator 572 which is an example of a vibration member is inserted into the through hole 513. The tip of the vibrator 572 is in contact with the lower surface of the substrate 90. The vibrator 572 is ultrasonically vibrated in the horizontal direction by an ultrasonic motor or a piezoelectric element. The vibrator 572 applies ultrasonic vibration to the lower temporary bonding member 596 via the substrate 90. Thereby, since the temporary joining member 596 is ultrasonically vibrated in the horizontal direction, frictional heat is generated between the temporary joining member 596 and the temporary joining member 596, and the temporary joining members 596, 596 are heated. Here, the temporary bonding members 596 and 596 are temporarily bonded together by configuring the temporary bonding member 596 with a low melting point material or a thermosetting resin. The melting point of the temporary bonding member 596 is preferably lower than the melting point of the electrode pad 98. The vibrator 572 vibrates between a position indicated by a solid line and a position indicated by a one-dot chain line in FIG. In the surface direction of the substrate 90, the width W 1 that is twice the amplitude of the vibrator 572 is preferably smaller than the width W 2 in the same direction of the temporary bonding member 596. Thereby, it can suppress that one temporary joining member 596 to vibrate separates from the other temporary joining member 596. Note that the vibrator 572 may be vibrated in the vertical direction.

  FIG. 19 is a longitudinal sectional view of an embodiment in which the joining method of the temporary joining members is changed. As shown in FIG. 19, a magnetic field generation source 624 is provided at the peripheral edge of the lower stage 118. An alternating current is supplied to the magnetic field generation source 624. As a result, the magnetic field generation source 624 generates a magnetic field from the side surface of the substrate 90. Thereby, the eddy current is arranged outside the element formation region and flows to the temporary bonding member 696 including the conductive material. As a result, the temporary joining members 696 and 696 are joined by induction heating by Joule heat. The temporary bonding member 696 is preferably made of a low melting point metal, and particularly preferably has a lower melting point than the material constituting the electrode pad 98. The magnetic field generated by the magnetic field generation source 624 is preferably a high frequency. Thereby, heating of the inner electrode pad 98 can be suppressed while efficiently heating the temporary bonding member 696 at the peripheral portion.

  Next, a method for bonding substrates when three substrates are bonded will be described. FIG. 20 is a plan view of a lower layer substrate according to the embodiment in which the temporary bonding member is changed. FIG. 21 is a plan view of a middle-layer substrate according to an embodiment in which the temporary bonding member is changed. FIG. 22 is a plan view of the upper substrate of the embodiment in which the temporary bonding member is changed.

  As shown in FIG. 20, three lower temporary joining members 795 extending outward are provided on the outer periphery of the lower substrate 789. The lower temporary joining member 795 protrudes outward from the outer periphery of the substrate 789. Three lower provisional bonding members 795 are arranged around the center of the substrate 789 at intervals of 120 °.

  As shown in FIG. 21, six intermediate provisional joining members 796 extending outward are provided on the outer periphery of the middle-layer substrate 790. The six intermediate provisional joining members 796 are arranged around the center of the substrate 790 at intervals of 60 °. The three middle temporary joining members 796 are disposed at the same position as the lower temporary joining member 795 in plan view. The remaining middle temporary joining member 796 is arranged at a position different from the lower temporary joining member 795 in plan view.

  As shown in FIG. 22, three upper temporary joining members 797 extending outward are provided on the outer periphery of the upper substrate 791. Three upper temporary joining members 797 are arranged around the substrate 791 at intervals of 120 °. The three upper provisional joining members 797 are arranged at the same positions as the three middle provisional joining members 796 arranged at positions different from the lower provisional joining member 795. In other words, the upper temporary bonding member 797 is disposed at a position different from the lower temporary bonding member 795.

  FIG. 23 is a longitudinal sectional view showing a state in which the two lower substrates 789 and 790 are aligned and temporarily joined. FIG. 24 is a longitudinal sectional view showing a state in which the upper substrate 791 is temporarily bonded to the two substrates 789 and 790 that have been temporarily bonded. 23 and 24 are cross-sectional views taken along the line AA shown in FIG.

  First, as shown in FIG. 23, when the two lower substrates 789 and 790 are aligned and stacked by the fixed stage portion 36 and the moving stage portion 38 of the aligner 28, three intermediate provisional joining members are provided. 796 overlaps the three lower temporary joining members 795. In this state, the intermediate temporary bonding member 796 is bonded to the lower temporary bonding member 795. As a result, the two substrates 789 and 790 are temporarily joined. In addition, the lower temporary bonding member 795 and the intermediate temporary bonding member 796 may be bonded at room temperature after surface activation by plasma or atomic beam, or may be bonded by other bonding methods. The substrates 789 and 790 are conveyed to the heating and pressurizing device 56, and the electrode pads 782 and the electrode pads 784 formed on the substrates 789 and 790 are finally joined. Thereafter, the substrates 789 and 790 are taken out from the substrate bonding apparatus 10, and electrode pads 784 and elements are formed on the upper surface of the substrate 790.

  Next, as shown in FIG. 24, when the upper layer substrate 791 is aligned and stacked with respect to the substrates 789 and 790 by the fixed stage unit 36 and the moving stage unit 38, the remaining portions that are not temporarily joined are stacked. The three middle temporary joining members 796 overlap the three upper temporary joining members 797. In this state, the intermediate temporary bonding member 796 is bonded to the upper temporary bonding member 797. As a result, the upper substrate 791 is temporarily joined to the lower two substrates 789 and 790. The bonding method is the same as the two temporary bonding methods below. The substrates 789, 790, and 791 are conveyed to the heating and pressurizing device 56, and the electrode pads 784 and electrode pads 786 formed on the substrates 790 and 791 are finally bonded to form a three-layer overlapping substrate 792. The superimposed substrate 792 is unloaded from the substrate bonding apparatus 10, and the lower temporary bonding member 795, the middle temporary bonding member 796, and the upper temporary bonding member 797 are removed. In addition, what is necessary is just to repeat the above-mentioned process, when bonding a 4 or more-layer board | substrate.

  The material which comprises the temporary joining member mentioned above is an example, Comprising: You may change suitably. For example, you may comprise a temporary joining member with the adhesive agent hardened | cured by mixing resin of 2 liquids. In this case, one of the two liquids is applied as a temporary bonding member for one substrate, and the other liquid of the two liquids is applied as a temporary bonding member for the other substrate. And what is necessary is just to mix and harden two liquids by making temporary joining members contact with an aligner.

  Although the ultraviolet curable resin is applied as the resin material constituting the temporary bonding member described above, other resins may be applied. For example, the temporary joining member may be made of an infrared curable resin, a thermosetting resin, or the like. When an infrared curable resin is used, in the case of a substrate that can transmit infrared rays, the resin may be irradiated with infrared rays from the vertical direction. Thereby, only the resin of a specific area | region can be hardened.

  In the above-described embodiment, when the temporary bonding member is partially provided, the temporary bonding member is disposed on both opposing surfaces of the substrate. However, the temporary bonding member may be disposed on one substrate.

  In the above-described embodiment, an example in which a substrate on which an element or the like is formed is bonded is shown, but an element may not be formed on the substrate.

  Further, the bonding strength of the temporary bonding member may be higher than the bonding strength of the main bonding. The temporary bonding member may be a conductor. In this case, it is preferable to insulate the temporary bonding member and the element from each other.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

  DESCRIPTION OF SYMBOLS 10 Board | substrate bonding apparatus, 12 Housing | casing, 14 Normal temperature part, 16 High temperature part, 18 Control part, 20 Substrate cassette, 24 Robot arm, 26 Pre-aligner, 28 Aligner, 30 Robot arm, 34 Frame body, 36 Fixed stage part, 38 Moving stage section, 40 shutter, 42 shutter, 46 heat insulation wall, 48 air lock chamber, 50 shutter, 52 shutter, 54 robot arm, 55 storage chamber, 56 heating and pressurizing device, 90 substrate, 92 overlapping substrate, 94 alignment mark 96 Temporary bonding member, 97 Resin material, 98 Electrode pad, 99 Scribe line, 102 Bottom plate, 104 Top plate, 106 side Wall, 110 X direction drive unit, 111 X guide rail, 112 Y direction drive unit, 114 Z direction drive unit, 115 spherical seat, 116 swing drive unit, 118 lower stage, 120 lower microscope, 122 lower reflector, 124 ultraviolet Light source, 130 load cell, 132 upper stage, 134 upper reflecting mirror, 136 upper microscope, 142 opening, 144 shutter, 150 fixed base, 152 lower heating part, 154 lifting / lowering part, 156 upper heating part, 157 observation hole, 158 vertical microscope , 160 horizontal microscope, 280 acute angle convex part, 296 temporary joint member, 297 temporary joint member, 380 taper convex part, 382 taper concave part, 396 temporary joint member, 397 Bonding member, 480 convex portion, 482 concave portion, 496 temporary bonding member, 497 temporary bonding member, 518 lower stage, 513 through-hole, 572 vibrator, 596 temporary bonding member, 624 magnetic field generation source, 696 temporary bonding member, 782 electrode pad , 784 electrode pad, 786 electrode pad, 789 substrate, 790 substrate, 791 substrate, 792 superimposed substrate, 795 lower temporary bonding member, 796 middle temporary bonding member, 797 upper temporary bonding member

Claims (26)

In the temporary bonding portion, a temporary bonding step of overlapping a plurality of substrates and bonding a part of at least one of the plurality of facing surfaces and side surfaces by a temporary bonding member;
A conveying step of conveying the plurality of substrates temporarily bonded in the temporary bonding step to a main bonding portion;
A substrate bonding method comprising: a main bonding step in which the plurality of substrates temporarily bonded in the temporary bonding step are main bonded by a main bonding member in the main bonding portion. The substrate bonding method according to claim 1, wherein the temporary bonding member and the main bonding member include different bonding materials. In the temporary joining step,
The substrate bonding method according to claim 1, wherein the substrates are bonded together by a plurality of temporary bonding members that are spaced apart from each other on at least one substrate. The substrate bonding method according to claim 1, wherein a bonding strength in the temporary bonding stage is lower than a bonding strength in the main bonding stage. In the temporary bonding step, the plurality of substrates are temporarily bonded by the temporary bonding member insulated from the elements formed on the substrate,
5. The main bonding step according to claim 1, wherein the main bonding is performed by the main bonding member that electrically connects an element formed on one substrate and an element formed on another substrate. Substrate bonding method. The temporary joining members are plural,
6. The number of the plurality of temporary joining members according to any one of claims 1 to 5, wherein the number of the regions where the joining strength of the main joining member is low is larger than the region where the joining strength of the main joining member is high. Substrate bonding method. The substrate bonding according to any one of claims 1 to 6, wherein in the temporary bonding stage, in the state where the temporary bonding members are bonded, the main bonding members bonded to each other in the main bonding stage are separated from each other. Method. The temporary joining member is plural,
The substrate bonding method according to claim 1, wherein the plurality of temporary bonding members are arranged according to a distance between the plurality of substrates. The substrate bonding method according to claim 1, wherein the temporary bonding member has a melting point lower than that of the main bonding member. The substrate bonding method according to claim 1, wherein the temporary bonding member is softer than the main bonding member. The substrate bonding method according to claim 1, wherein the temporary bonding member has a bonding area smaller than that of the main bonding member. The temporary joining member includes a temporary joining member having a guided portion formed on one substrate, and a temporary joining member having a guide portion formed on another substrate and guiding the guided portion. The substrate bonding method according to any one of 11 to 11. The board | substrate bonding method of any one of Claim 1 to 12 with which the temporary joining member formed in one board | substrate fits with the temporary joining member formed in the other board | substrate. In the temporary joining step,
The light curing resin provided between the plurality of substrates is irradiated with curing light from a side surface of the plurality of substrates to cure the photocurable resin, thereby temporarily joining the plurality of substrates. 14. The substrate bonding method according to any one of 1 to 13. The substrate bonding method according to claim 14, wherein the photocurable resin is provided on the entire surface of the plurality of substrates. The substrate bonding method according to claim 15, wherein the photocurable resin is cured by irradiating a part of the photocurable resin with the curing light. In the temporary joining step,
The substrate bonding method according to claim 1, wherein ultrasonic vibration is applied to the temporary bonding member by a vibration member to temporarily bond the plurality of substrates. The substrate bonding method according to claim 17, wherein in the surface direction of the substrate, twice the amplitude of the ultrasonic vibration is smaller than the width of the temporary bonding member. In the temporary joining step,
The substrate bonding method according to claim 1, wherein the temporary bonding member including a conductive material is heated to temporarily bond the plurality of substrates. The substrate bonding method according to claim 19, wherein the temporary bonding member is induction-heated by a magnetic field generated from a magnetic field generation source. The temporary bonding member is disposed outside an element formation region of the substrate,
The substrate bonding method according to claim 20, wherein the magnetic field generation source applies a magnetic field to the temporary bonding member from a side surface of the substrate. In the temporary joining step,
The substrate bonding method according to claim 1, wherein the plurality of substrates are temporarily bonded through temporary bonding members extending outward from the respective substrates. The plurality of substrates includes a first substrate, a second substrate, and a third substrate, and in plan view, a first temporary bonding member that temporarily bonds the first substrate and the second substrate, the second substrate, and the second substrate The substrate bonding method according to claim 22, wherein the second temporary bonding member that temporarily bonds the third substrate is disposed at a different position.   The board | substrate bonding method as described in any one of Claim 1 to 23 which has a temporary joining member installation step which provides the said temporary joining member in the said board | substrate. An alignment step of aligning the plurality of substrates;
The substrate bonding method according to claim 24, wherein the provisional bonding member installation step is performed before the alignment step. A main bonding member installation step of providing the main bonding member on the substrate;
The substrate bonding method according to claim 24 or 25, wherein the temporary bonding member installation step is performed after the main bonding member installation step.

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