JP2013001055A - Method of manufacturing wafer lens, wafer lens, and lens unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a wafer lens, which can suppress occurrence of breakage when a wafer lens and its stack body is made into individual pieces.SOLUTION: The difference in thermal expansion coefficients between a substrate 101 and a spacer part 106 is set to be small like 55 ppm/°C or less, thereby when wafer lenses 100, 200 constituting a stack structure 1000 or a stack lens array 500 is manufactured and cut, expansion/shrinkage differences are hardly generated between the substrate 101 and spacer part 106 and relatively large stress is hardly generated therebetween, and thereby preventing lens elements 11, 12 etc., as lens parts constituting the wafer lenses 100, 200 from peeling or cracking.

Description

  The present invention relates to a method for manufacturing a wafer lens that is singulated by cutting, and more particularly to a method for manufacturing a wafer lens for use in an imaging lens or the like.

  As a method for producing a wafer lens, there is a method in which a curable resin is interposed between a substrate (for example, a glass flat plate) and a mold, and the curable resin is cured to mold a lens portion (for example, Patent Documents). 1). As a method of obtaining a lens unit from such a wafer lens, a plurality of wafer lenses are prepared, a spacer is sandwiched between these wafer lenses, and a protrusion formed simultaneously with the lens portion of the wafer lens is abutted. Thus, a method has been developed in which wafer lenses are stacked and bonded at appropriate intervals, and the flat plate portion of the laminated body obtained by bonding is cut into pieces so as to be separated into a large number of lens units.

  However, when the wafer lens or its laminated body is singulated, a part of the lens part or the lens unit may be peeled off or cracked. Such a breakage is considered to be due to stress being applied to the cut portions of the wafer lens or the laminated body at the time of cutting, or the cut portions being heated, but the yield is lowered when manufacturing a lens unit or the like.

Japanese Patent No. 4420141

  An object of this invention is to provide the manufacturing method of the wafer lens which can suppress generation | occurrence | production of the damage at the time of separating a wafer lens or its laminated body into pieces.

  Another object of the present invention is to provide a wafer lens and a lens unit obtained by the manufacturing method as described above.

  In order to achieve the above object, a first wafer lens manufacturing method according to the present invention is formed around a substrate, a plurality of lens portions formed on at least one substrate surface of the substrate, and the periphery of the lens portion. A method for manufacturing a wafer lens comprising a support portion, wherein a difference in thermal expansion coefficient between the substrate and the support portion is 55 ppm / ° C. or less. That is, the thermal expansion coefficient of the substrate and the thermal expansion coefficient of the support portion are equal or close to each other.

  According to the wafer lens manufacturing method, the difference in thermal expansion coefficient between the substrate and the support is set to 55 ppm / ° C. or less, so that a difference in expansion and contraction occurs between the substrate and the support during manufacturing or cutting of the wafer lens. It becomes difficult to generate a relatively large stress between them, and it is possible to prevent the lens portion constituting the wafer lens from being peeled off or cracked.

  In a specific aspect or aspect of the present invention, in the first method for manufacturing a wafer lens, the support portion is integrally formed of the lens portion and the resin layer. In this case, the wafer lens can be aligned and fixed to another wafer lens or an image sensor using the resin layer, but such a resin layer can be prevented from causing damage.

  In another specific aspect of the present invention, the support portion is a protrusion portion that protrudes more than the plurality of lens portions and adjusts the interval between the members adjacent to the outside in the optical axis direction.

  In still another specific aspect of the present invention, the support portion is a flat portion formed relatively thicker than the plurality of lens portions.

  In still another specific aspect of the present invention, the support portion is a spacer portion having a plurality of openings through which the optical axes of the plurality of lens portions pass. In this case, the wafer lens can be aligned and fixed to another wafer lens or an image sensor using the spacer portion, but such a spacer portion can be prevented from being damaged.

  The second wafer lens manufacturing method according to the present invention includes a first lens group including a first substrate and a first resin layer formed on at least one substrate surface of the first substrate and having a plurality of lens portions. And a second lens group having a second resin layer and a second resin layer having a plurality of lens portions molded on at least one substrate surface of the second substrate, and disposed adjacent to the first lens group. And joining the first resin layer and the second resin layer to connect the first lens group and the first lens group, and the first substrate, the first resin layer, and the second substrate, The maximum difference in thermal expansion coefficient with the second resin layer is 55 ppm / ° C. or less.

  According to the method for manufacturing a wafer lens, the maximum difference in thermal expansion coefficient among the first substrate, the first resin layer, the second substrate, and the second resin layer is 55 ppm / ° C. or less. A relatively large stress is unlikely to be generated between the first substrate, the first resin layer, the second substrate, the second resin layer, and the like at the time of manufacture and cutting, and damage to each part constituting the wafer lens can be prevented.

  In another specific aspect of the present invention, in the method for manufacturing the second wafer lens, the outer side of the plurality of lens units in the first resin layer and the outer side of the plurality of lens units in the second resin layer. By joining, the first lens group and the second lens group are coupled.

  In still another specific aspect of the present invention, the first lens group and the first lens group are formed by bonding a plurality of lens portions of the first resin layer and a plurality of lens portions of the second resin layer. And

  A third wafer lens manufacturing method according to the present invention includes a first lens group including a first substrate and a first resin layer having a plurality of lens portions formed on at least one substrate surface of the first substrate. And a second lens group having a second resin layer and a second resin layer having a plurality of lens portions molded on at least one substrate surface of the second substrate, and disposed adjacent to the first lens group. And a spacer part that is bonded to the opposite side of the first lens group with respect to the second lens group and has a plurality of openings through which the optical axes of the plurality of lens parts pass. The maximum difference in coefficient of thermal expansion among one substrate, the first resin layer, the second substrate, the second resin layer, and the spacer portion is 55 ppm / ° C. or less.

  A fourth wafer lens manufacturing method according to the present invention includes a first lens group having a first substrate and a first resin layer formed on at least one substrate surface of the first substrate and having a plurality of lens portions. A second lens group having a second resin layer and a second resin layer formed on at least one substrate surface of the second substrate and having a plurality of lens portions, and disposed adjacent to the first lens group; A first spacer portion that is bonded to the opposite side of the first lens group with respect to the second lens group and has a plurality of openings through which the optical axes of the plurality of lens portions pass, and a first lens group and a first lens group. A wafer lens manufacturing method comprising: a second spacer portion that is joined to the first lens group and the first lens group so as to be coupled, and has a plurality of openings through which the optical axes of the plurality of lens portions pass. 1 substrate, 1st resin layer, 2nd substrate, 2nd tree A layer, a first spacer portion, the maximum difference in thermal expansion coefficient between the second spacer portions is not more than 55 ppm / ° C..

  According to the third and fourth methods of manufacturing a wafer lens, the first substrate, the first resin layer, the second substrate, the second resin layer, the first spacer portion, and the second spacer portion Since the maximum difference in coefficient of thermal expansion is 55 ppm / ° C. or less, a relatively large stress is generated between the first substrate, the first resin layer, the second substrate, the second resin layer, the spacer portion, etc. during the manufacturing or cutting of the wafer lens. Is less likely to occur, and damage to each part constituting the wafer lens can be prevented.

  In another specific aspect of the present invention, in the first method for producing a wafer lens, the maximum difference in flexural modulus between the substrate and the support portion is 15 GPa or less. In this case, even if a relatively large stress is applied when the wafer lens is cut, local stress concentration is less likely to occur, and damage to the wafer lens is suppressed. Further, local stress is less likely to be inherent in the wafer lens, and damage to the wafer lens due to release of the stress can be suppressed.

  In another specific aspect of the present invention, in the method for manufacturing the second to fourth wafer lenses, the maximum bending elastic modulus of the first substrate, the first resin layer, the second substrate, and the second resin layer is obtained. The difference is 15 GPa or less.

  In still another specific aspect of the present invention, in the third and fourth wafer lens manufacturing methods, the first substrate, the first resin layer, the second substrate, the second resin layer, and the spacer bends. The maximum difference in elastic modulus is 15 GPa or less.

  In still another specific aspect of the present invention, in the first to fourth wafer lens manufacturing methods, the difference in thermal expansion coefficient is determined based on an average value in a temperature range from 120 ° C to 140 ° C.

  A wafer lens according to the present invention is a wafer lens comprising a substrate, a plurality of lens portions molded on at least one substrate surface of the substrate, and a support portion formed around the plurality of lens portions, The difference in thermal expansion coefficient between the substrate and the support is 55 ppm / ° C. or less.

  In the wafer lens, since the difference in thermal expansion coefficient between the substrate and the support portion is 55 ppm / ° C. or less, relatively large stress is less likely to occur between the substrate, the support portion, etc. during the manufacturing or cutting of the wafer lens. Damage to each part constituting the wafer lens can be prevented.

  The lens unit wafer lens according to the present invention is manufactured using the method for manufacturing a wafer lens.

(A) is a top view of the laminated structure containing the wafer lens of 1st Embodiment, (B) is AA arrow sectional drawing of the laminated structure shown to (A). It is sectional drawing of the lens unit which separated the laminated structure into pieces. It is a flowchart explaining the manufacturing process of the laminated structure containing a wafer lens. (A)-(E) are the figures for demonstrating the manufacturing process of a wafer lens. (A)-(C) are the figures for demonstrating the manufacturing process of a wafer lens. It is a sectional side view of the laminated structure containing the wafer lens of 2nd Embodiment. It is a sectional side view of the laminated structure containing the wafer lens of 3rd Embodiment. It is a sectional side view of the laminated structure containing the wafer lens of 4th Embodiment. It is a sectional side view of the laminated structure containing the wafer lens of 5th Embodiment. It is a sectional side view of the laminated structure containing the wafer lens of 6th Embodiment.

[First Embodiment]

A) Wafer Lens A wafer lens according to the first embodiment of the present invention will be described with reference to the drawings.

  As shown in FIGS. 1A and 1B, a laminated structure 1000 is obtained by laminating a first wafer lens 100, a second wafer lens 200, and an imaging element array 300 in the Z-axis direction. By cutting out the laminated structure 1000 by dicing, an imaging device 700 (see FIG. 2) in which the pair of compound lenses 10 and the imaging element 330 are stacked can be obtained. Here, the first wafer lens 100, the second wafer lens 200, and the imaging element array 300 each extend in parallel to the XY plane, and the laminated structure 1000 as a whole also extends in parallel to the XY plane. Among these, a laminate of the first wafer lens 100 and the second wafer lens 200 is referred to as a laminated lens array 500 for convenience in this specification, but is included in a broad sense of wafer-lens.

  In the laminated structure 1000, the first wafer lens 100 is a wafer lens with a spacer and is also referred to as a first lens group. The first wafer lens (first lens group) 100 has, for example, a disk shape, and includes a substrate 101, a first resin layer 102, a second resin layer 103, an IR cut filter layer 104, a diaphragm 105, and a spacer portion. 106. Here, the first and second resin layers 102 and 103 are bonded to the substrate 101 while being aligned with each other with respect to translation in the XY plane perpendicular to the axis AX and rotation around the axis AX. In the first wafer lens 100, a large number of compound lenses 10 are formed as optical elements constituting the first lens, and are secondarily arranged along the XY plane. The compound lens 10 includes a lens body 10a that forms an optical surface, a flange portion 10b that exists around the lens body 10a, and a spacer member 10c that is connected to the flange portion 10b. The flange portion 10b includes not only a part of the resin layers 102 and 103 but also a part of the substrate 101.

  The substrate 101 of the first wafer lens 100 is a flat plate extending over the entire first wafer lens 100, and is formed of, for example, glass. The thickness of the substrate 101 is basically determined by optical specifications, but is such a thickness that the first wafer lens 100 is not damaged when the first wafer lens 100 is released. The substrate 101 constitutes the central portion of the lens body 10a of the compound lens 10 and the flange portion 10b. As the material of the substrate 101, a glass, a thermosetting resin, a photocurable resin, a thermoplastic resin, or the like can be used, and glass is particularly preferable. Although the specific thickness of the board | substrate 101 is based also on a use, it shall be 0.2 mm or more and 1.5 mm or less, for example.

  The first resin layer 102 is made of resin and is formed on one surface 101 a of the substrate 101. The first resin layer 102 has a plurality of first lens elements 11. Each first lens element 11 constitutes the upper part of the lens body 10 a of the compound lens 10. The first lens elements 11 are two-dimensionally arranged in the XY plane on the substrate 101. The first lens element 11 is, for example, a convex aspheric lens part, and has a first optical surface 11a and a first flange surface 11b as shown in FIG. The first optical surface 11a and the first flange surface 11b serve as a first molding surface 102a that is collectively molded by transfer. The thickness at the cutting position of the first resin layer 102 is, for example, 0.01 mm or more and 0.3 mm or less.

  The first resin layer 102 is made of a photocurable resin. The photocurable resin contains a photopolymerization initiator that initiates polymerization of the photocurable resin. As the photocurable resin, acrylic resin, allyl ester resin, epoxy resin, vinyl resin and the like can be used. When acrylic resin, allyl ester resin, or vinyl resin is used, it can be cured by radical polymerization of photopolymerization initiator. When epoxy resin is used, it can be cured by cationic polymerization of photopolymerization initiator. Can do.

  Similar to the first resin layer 102, the second resin layer 103 is made of resin and is formed on the other surface 101 b of the substrate 101. The second resin layer 103 has a plurality of second lens elements 12. Each second lens element 12 is independent in a state of being separated from each other, and constitutes a lower portion of the lens body 10 a of the compound lens 10. The second lens elements 12 are two-dimensionally arranged in the XY plane on the substrate 101. The position of each second lens element 12 corresponds to the position of each first lens element 11 on the opposite side of the substrate 101. The second lens element 12 is a concave aspherical lens portion, for example, and has a second optical surface 12a and a second flange surface 12b as shown in FIG. The second optical surface 12a and the second flange surface 12b form a second molding surface 103a that is collectively molded by transfer. The thickness at the cutting position of the first resin layer 102 is, for example, 0.01 mm or more and 0.3 mm or less.

  The photocurable resin used for the second resin layer 103 is the same as the photocurable resin of the first resin layer 102. However, both the resin layers 102 and 103 do not need to be formed of the same photocurable resin, and can be formed of different photocurable resins.

The IR cut filter layer 104 reflects infrared light and transmits visible light. The IR cut filter layer 104 is formed on the entire surface of the substrate 101 with a substantially uniform thickness and density. That is, the IR cut filter layer 104 is provided between the substrate 101 and the first resin layer 102 so as to divide them. The IR cut filter layer 104 is, for example, an interference filter, and is formed by alternately laminating, for example, Ta ₂ O ₅ , TiO ₂ or the like as a high refractive material and SiO ₂ or the like as a low refractive material. The IR cut filter layer 104 is formed by, for example, vacuum deposition, sputtering, or the like.

  The diaphragm 105 is provided between the substrate 101 and the first resin layer 102 and between the substrate 101 and the second resin layer 103. As shown in FIG. 2, the diaphragm 105 includes a diaphragm main body 105a, which is a diaphragm member, and an opening 105b. The aperture body 105a is formed in a part of a region excluding the lens body 10a on at least one of the surfaces 101a and 101b of the substrate 101. The aperture body 105a is disposed so as not to interfere with the lens body 10a. The opening 105b is substantially circular and is formed at a position corresponding to the lens body 10a. The aperture body 105a is formed of a light-shielding metal film, a resist, a silicon film, a carbon film, or the like. The diaphragm body 105 a may be provided only between one of the substrate 101 and the first resin layer 102 and between the substrate 101 and the second resin layer 103.

  The spacer part 106 functions as a support part. The spacer portion (support portion) 106 is a flat plate member made of glass, ceramics, resin, or the like, and has holes formed in an array corresponding to the compound lens 10. The spacer portion 106 is divided into a plurality of spacer members 10c by dicing. Each spacer member 10c has a cylindrical support 6a and an opening 6b having a circular cross section. The opening 6b extends along the optical axis OA so as to pass the optical axis OA of the lens body 10a. The support 6a is fixed to the flange portion 10b around the lens body 10a, avoiding the lens body 10a. At this time, the end surface 106a on the base side (upper side in the drawing) of the support 6a is bonded to the second flange surface 12b on the lower side in the drawing. The spacer portion 106 and the spacer member 10c are members for adjusting the distance between the first wafer lens 100 and the second wafer lens 200, and the distance between the two compound lenses 10 and 10 constituting the imaging device 700. It has a role to adjust. For this reason, the end face 106b on the front end side (lower side of the drawing) of the support 6a is the first flange on the upper side of the drawing of the compound lens 10 constituting the second wafer lens 200 when the two wafer lenses 100 and 200 are bonded together. Bonded to the surface 11b.

  The thickness of the spacer portion 106 is set to a value that appropriately maintains the distance between the lens elements 11 and 12 or the distance between the lens element 12 and the image sensor 330. The specific thickness of the spacer 106 depends on the optical characteristics of the lens elements 11 and 12, the performance of the imaging device, the function and application required for the imaging lens, but is generally 0.1 mm to 0.8 mm. Preferably, it is 0.2 mm or more and 0.6 mm or less. When the thickness is 0.1 mm or more, handling is easy, stress relaxation is high, and failures such as peeling and cracking are unlikely to occur. Moreover, it is preferable that it is 0.8 mm or less because the transmittance is high. With respect to the transmittance of the spacer unit 106, the adhesive light of the spacer unit 106 is cured by irradiating the adhesive with light through the spacer unit 106 when the wafer lens and the spacer are bonded using a photo-curing type adhesive. It is important that the light transmittance in the wavelength region is high. For example, if the transmittance of light having a wavelength of 350 nm is 30% or more, it is preferable that the UV curing proceeds rapidly at the time of bonding with the main body of the first wafer lens 100. More preferably, it is 50% or more.

  Specific materials for the spacer portion 106 include soft glass, resin, and organic-inorganic hybrid material, and are not particularly limited. However, a heat-resistant resin or a heat-resistant organic-inorganic hybrid material is preferable. The organic-inorganic hybrid material is preferably a heat-resistant glass fiber reinforced resin, a filler reinforced resin, an organic-silica hybrid, or the like. In particular, organic silica hybrids are good, and among them, epoxy resin-silica hybrids and acrylic-silica hybrids are preferable because they have good adhesion to the lens resin part.

  The second wafer lens 200 is a wafer lens with a spacer and is also called a second lens group. Similar to the first wafer lens 100, the second wafer lens (second lens group) 200 has, for example, a disk shape, and includes a substrate 101, a first resin layer 102, a second resin layer 103, and an IR cut filter layer. 104, a diaphragm 105, and a spacer portion 106. The configuration of the second wafer lens 200 is substantially the same as the configuration of the first wafer lens 100 except for the presence or absence of the IR cut filter layer 104. In the case of the second wafer lens 200, the spacer portion 106 and the spacer member 10c are members for adjusting the distance between the second wafer lens 200 and the imaging element array 300, and the end face 106b on the distal end side is the second wafer lens 200. At the stage where the wafer lens 200 and the image sensor array 300 are bonded together, the wafer lens 200 and the image sensor array 300 are bonded to appropriate positions in the region outside the optical path of the image sensor array 300.

B) Thermal expansion coefficient of material The first wafer lens 100 described above is cut by dicing together with the second wafer lens 200 and the like. At this time, the first and second resin layers 102 and 103 are peeled off, the substrate It is necessary to prevent 101 and the spacer part 106 from being broken. For this reason, the combination of the materials of the first wafer lens 100 is appropriately selected, and the maximum difference in thermal expansion coefficient between the substrate 101, the first and second resin layers 102 and 103, and the spacer portion 106 is 55 ppm / ° C. or less. It is trying to become. Thereby, even if the 1st and 2nd resin layers 102 and 103 are heated at the time of dicing, it becomes difficult to produce the difference of expansion amount in each part, and generation | occurrence | production of unintended stress can be avoided. Here, in consideration of the temperature environment in which the first wafer lens 100 is processed, the thermal expansion coefficient, the thermal expansion coefficient of the substrate 101, and the first and second resin layers 102 in a temperature range from room temperature to 160 ° C., for example. , 103 and the thermal expansion coefficient of the spacer portion 106 are compared in relative magnitude. Specifically, for example, the average thermal expansion coefficient of the substrate 101 from room temperature to 160 ° C., the average thermal expansion coefficient of the first and second resin layers 102 and 103 from room temperature to 160 ° C., and from room temperature to 160 ° C. The material of the substrate 101 and the materials of the first and second resin layers 102 and 103 are compared so that the difference between the maximum value and the minimum value is 55 ppm / ° C. or less by comparing the average thermal expansion coefficient of the spacer portion 106. And the material of the spacer portion 106 are selected. However, since damage at the time of dicing is a problem, only the temperature range of 100 ° C. to 160 ° C. assumed at the time of dicing can be considered. That is, the average thermal expansion coefficient of the substrate 101 at 100 ° C. to 160 ° C., the average thermal expansion coefficient of the first and second resin layers 102 and 103 at 100 ° C. to 160 ° C., and the spacer portion 106 at 100 ° C. to 100 ° C. The average thermal expansion coefficient is compared, and the material of the substrate 101, the material of the first and second resin layers 102 and 103, and the spacer portion so that the difference between the maximum value and the minimum value is 55 ppm / ° C. or less. 106 materials are selected. In addition, the temperature range assumed at the time of dicing will be about 120 degreeC-140 degreeC normally further limited. In this case, the average thermal expansion coefficient of the substrate 101 at 120 ° C. to 140 ° C., the average thermal expansion coefficient of the first and second resin layers 102 and 103 at 120 ° C. to 140 ° C., and the spacer portion 106 at 120 ° C. to 140 ° C. Of the substrate 101, the material of the first and second resin layers 102 and 103, and the spacer so that the difference between the maximum value and the minimum value is 55 ppm / ° C. or less. The material of the part 106 is selected.

  As described above, the combination of the materials of the first wafer lens 100 is appropriately selected, and the maximum difference in thermal expansion coefficient between the substrate 101, the first and second resin layers 102 and 103, and the spacer portion 106 is 55 ppm / It has been experimentally confirmed that problems such as peeling of the resin layers 102 and 103 are less likely to occur when the temperature is lower than or equal to.degree. In particular, when the maximum difference in thermal expansion coefficient between the substrate 101 constituting the first wafer lens 100, the first and second resin layers 102 and 103, and the spacer portion 106 is 35 ppm / ° C. or less, the resin The occurrence of problems such as peeling of the layers 102 and 103 was greatly reduced.

  In the above, the difference in thermal expansion coefficient between the substrate 101, the resin layers 102 and 103, and the spacer portion 106 constituting the first wafer lens 100 has been considered, but the relationship with the thermal expansion coefficients of the IR cut filter layer 104 and the diaphragm 105 is considered. It is desirable that the difference in thermal expansion coefficient does not increase. However, the volume of the IR cut filter layer 104 and the diaphragm 105 is smaller than that of the resin layers 102, 103, etc., and it is not necessary to provide a narrow thermal expansion coefficient restriction as described above for the resin layers 102, 103, etc. .

  As a further desirable condition, the maximum difference in flexural modulus between the substrate 101, the first and second resin layers 102 and 103, and the spacer portion 106 constituting the first wafer lens 100 is set to 15 GPa or less. As a result, even if a relatively large stress is applied when the first wafer lens 100 is cut, local stress concentration is less likely to occur, and damage to the first wafer lens 100 is suppressed. Further, local stress is unlikely to be inherent in the first wafer lens 100, and damage to the first wafer lens 100 due to release of the stress can be suppressed. In particular, when the maximum difference in flexural modulus between the substrate 101 constituting the first wafer lens 100, the first and second resin layers 102 and 103, and the spacer portion 106 is 8 GPa or less, the first wafer Damage to the lens 100 was greatly suppressed. When the compound lens 10 was cut out in the first wafer lens 100 stage, the optical characteristics of the compound lens 10 were equal to or better than those manufactured by a known method.

  Hereinafter, the appropriate selection of the material of the second wafer lens 200 will be described. Similarly to the first wafer lens 100, the second wafer lens 200 has problems such as peeling and cracking during dicing. For this reason, a combination of materials constituting the second wafer lens 200 is appropriately selected, and the maximum difference in thermal expansion coefficient between the substrate 101, the first and second resin layers 102 and 103, and the spacer portion 106 is 55 ppm / It is made to be below ℃. Thereby, even if the 1st and 2nd resin layers 102 and 103 are heated at the time of dicing, it becomes difficult to produce the difference of expansion amount in each part, and generation | occurrence | production of unintended stress can be avoided. Note that the thermal expansion coefficient of the material forming the substrate 101, the first and second resin layers 102 and 103, and the spacer portion 106 constituting the second wafer lens 200 is the same as in the case of the first wafer lens 100. Think. That is, as a temperature environment in which the second wafer lens 200 is processed, for example, in a temperature range from room temperature to 160 ° C., a temperature range from 100 ° C. to 160 ° C., preferably a temperature range from 120 ° C. to 140 ° C. A thermal expansion coefficient is determined.

  As described above, the material of the second wafer lens 200 is appropriately selected, and the maximum difference in thermal expansion coefficient between the substrate 101, the first and second resin layers 102 and 103, and the spacer portion 106 is 55 ppm / ° C. or less. It has been experimentally confirmed that problems such as peeling of the resin layers 102 and 103 are less likely to occur. In particular, when the maximum difference in thermal expansion coefficient between the substrate 101 constituting the second wafer lens 200, the first and second resin layers 102 and 103, and the spacer portion 106 is 35 ppm / ° C. or less, the resin The occurrence of problems such as peeling of the layers 102 and 103 was greatly reduced.

  As a further desirable condition, the maximum difference in flexural modulus between the substrate 101, the first and second resin layers 102 and 103, and the spacer portion 106 constituting the second wafer lens 200 is set to 15 GPa or less. As a result, even if a relatively large stress is applied when the second wafer lens 200 is cut, local stress concentration is less likely to occur, and damage to the second wafer lens 200 is suppressed. Further, local stress is unlikely to be inherent in the second wafer lens 200, and damage to the second wafer lens 200 due to release of the stress can be suppressed. In particular, when the maximum difference in flexural modulus among the substrate 101 constituting the second wafer lens 200, the first and second resin layers 102 and 103, and the spacer portion 106 is 8 GPa or less, the second wafer Damage to the lens 100 was greatly suppressed.

  In the above, the thermal expansion coefficient of the combination of materials composing the first wafer lens 100 and the thermal expansion coefficient of the combination of materials composing the second wafer lens 200 have been described individually. When dicing is performed in the bonded state, the difference between the thermal expansion coefficient of the material constituting the first wafer lens 100 and the thermal expansion coefficient of the material constituting the second wafer lens 200 is prevented from becoming too large. There is a need. Specifically, the thermal expansion coefficient of the substrate 101 constituting the first wafer lens 100, the thermal expansion coefficients of the first and second resin layers 102 and 103, the thermal expansion coefficient of the spacer portion 106, and the second wafer lens. The maximum difference between the thermal expansion coefficient of the substrate 101 constituting the substrate 200, the thermal expansion coefficients of the first and second resin layers 102 and 103, and the thermal expansion coefficient of the spacer portion 106 is set to 55 ppm / ° C. or less. Further, the bending elastic modulus of the substrate 101 constituting the first wafer lens 100, the bending elastic modulus of the first and second resin layers 102 and 103, the bending elastic modulus of the spacer portion 106, and the second wafer lens 200 are constituted. The maximum difference between the bending elastic modulus of the substrate 101, the bending elastic modulus of the first and second resin layers 102 and 103, and the bending elastic modulus of the spacer portion 106 is 15 GPa or less (preferably 8 GPa or less). .

C) Manufacturing Method of Wafer Lens and Compound Lens A manufacturing process of the wafer lens 100 will be described with reference to FIGS. 3 and 4A to 4F. Hereinafter, the molding of the first resin layer 102 will be described, but the same process is performed for the molding of the second resin layer 103.

  First, the master mold 30 (see FIG. 4A) corresponding to the final shape of the first resin layer 102 is manufactured by grinding or the like (step S11). Next, a resin material 41b is applied on the master die 30, and ultraviolet rays are irradiated by a UV generator (not shown) while pressing the sub-master substrate 42 from above the master die 30, and the resin material 41b sandwiched therebetween is applied. Photocuring is performed (step S12). At this time, the first transfer surface 31 of the master mold 30 is transferred to the resin material 41b, and the second transfer surface 43 (second optical transfer surface and second flange transfer surface) is formed on the resin material 41b. Thereby, the sub master molding part 41 is formed. The transfer position on the sub-master substrate 42 is changed, and the sub-master type curing process (step S12) of this process and the sub-master mold release process (step S13) of the next process are repeated to further increase the second transfer surface 43. You may form in an array form.

  Next, as shown in FIG. 4B, the sub-master mold 40 is manufactured by releasing the sub-master molding part 41 and the sub-master substrate 42 as a single unit from the master mold 30 (step S13). Thereafter, although not shown, an inorganic oxide film is formed on the second transfer surface 43 of the sub master mold 40. The inorganic oxide film is formed by, for example, vacuum deposition or sputtering. Further, a release agent is applied on the inorganic oxide film.

Next, the wafer lens 100 is produced using the submaster mold 40 obtained in the above process. First, as shown in FIG. 4C, the IR cut filter layer 104 is formed on the substrate 101 (step S14). The IR cut filter layer 104 is formed by, for example, vacuum deposition, sputtering, or the like. For example, when the IR cut filter layer 104 is formed by vacuum deposition, a high refractive material and a low refractive material are alternately stacked on one surface 101 a of the substrate 101 using the vacuum device 60. By the operation of the driving device 61 of the vacuum device 60, for example, Ta ₂ O ₅ is heated as a highly refractive material from the vapor deposition source 62, vaporized or sublimated, and deposited on one surface 101 a of the substrate 101. Further, by the operation of the driving device 61, for example, SiO ₂ is heated as a low refractive material from the vapor deposition source 63, vaporized or sublimated, and is deposited on one surface 101 a of the substrate 101. The IR cut filter layer 104 is formed so that the film density is 1.5 g / cm ³ or more and 2.0 g / cm ³ or less.

  Next, as shown in FIG. 4D, a stop 105 is formed on one surface 101a of the substrate 101 (step S15). The diaphragm 105 is formed, for example, by forming an opaque metal film on the surface 101a of the substrate 101 by vapor deposition or sputtering, and then performing patterning to form the opening 105b. The diaphragm 105 can also be formed by depositing a dark photoresist and then performing patterning to form the opening 105b.

  Next, as shown in FIG. 4E, a resin 102 b (a photocurable resin that forms the first resin layer 102) is applied onto the sub master mold 40, and the substrate 101 is pressed from above the sub master mold 40. While the ultraviolet ray is irradiated by a UV generator (not shown), the resin 102b sandwiched therebetween is photocured (step S16). At this time, the second transfer surface 43 of the sub-master mold 40 is transferred to the resin 102b, and the first molding surface 102a (the first optical surface 11a and the first flange surface 11b in FIG. 2) is formed on the resin 102b. Thereby, the first resin layer 102 is formed. In addition, you may make it harden | cure by heat in order to make it harden | cure after photocuring.

  Although a detailed description is omitted, as shown in FIG. 5A, the substrate 101 is processed in the same process as described above by using the sub master mold 140 having the same structure as the sub master mold 40 but having a different transfer surface. The second resin layer 103 is formed on the other surface 101b.

  After that, as shown in FIG. 5B, the substrate 101 and the resin layers 102 and 103 are integrally released by separating the pair of sub master molds 40 and 140 (step S17).

  Next, the sheet-like spacer 106 is attached to the wafer lens body, that is, the second resin layer 103 (step S18). Specifically, an adhesive is applied to one side of the spacer unit 106. Then, the spacer part 106 is aligned with respect to the board | substrate 101 and the 2nd resin layer 103, while the adhesion surface of the spacer part 106 is pressed on the surface of the 2nd resin layer 103, UV light is irradiated and hardened | cured to an adhesive agent. As a result, the first wafer lens 100 in which the spacer portion 106 is fixed to the wafer lens body in which the substrate 101 and the resin layers 102 and 103 are integrated is completed.

  A second wafer lens 200 having a structure substantially similar to that of the first wafer lens 100 is completed through the same processes as those described above (steps S11 to S18).

  Thereafter, the first wafer lens 100 and the second wafer lens 200 are joined to produce a laminated lens array 500, and the imaging element array 300 is attached to the second wafer lens 200 side (step S19). That is, an adhesive is applied to the end face of the spacer portion 106 fixed to the first wafer lens 100 and bonded to the second wafer lens 200 to irradiate UV light. As a result, the second wafer lens 200 is fixed or bonded to the first wafer lens 100. Next, the image sensor array 300 is attached to the second wafer lens 200 on the opposite side of the first wafer lens 100 (step S19). That is, an adhesive is applied to the end face of the spacer portion 106 fixed to the second wafer lens 200 and bonded to the imaging element array 300, and UV light is irradiated. Thereby, the imaging device array 300 is fixed or bonded to the first wafer lens 100. As described above, the laminated structure 1000 in which the first wafer lens 100, the second wafer lens 200, and the imaging element array 300 are laminated is completed.

  Thereafter, the wafer lenses 100, 200, etc. are cut, that is, diced along the cut line DX shown in FIG. 1 (step S20). Here, the cut line DX is provided at a portion where the substrate 101, the first and second resin layers 102 and 103, and the IR cut filter layer 104 overlap, and is not provided on the diaphragm 105. By such dicing, the wafer lenses 100, 200, etc. are cut out into a quadrangular prism shape, and an imaging device 700 having a structure in which the compound lenses 10, etc. are laminated is obtained.

  In the above description, the laminated structure 1000 is described as including the first wafer lens 100, the second wafer lens 200, and the imaging element array 300, but the laminated structure 1000 is composed of the first wafer lens 100 and the second wafer lens 200. It can also consist of. In this case, the laminated structure 1000 is constituted by the laminated lens array 500 in which the first wafer lens 100 and the second wafer lens 200 are laminated. Such a laminated lens array 500 can be separated into individual pieces by dicing, and can be joined to an individual imaging device 330 separately manufactured. In the embodiment described below, the image pickup device array 300 is included in the laminated structure 1000, but the image pickup device array 300 may be omitted and the laminated lens array 500 may be used.

  According to the wafer lens manufacturing method of the first embodiment, since the difference in thermal expansion coefficient between the substrate 101 and the spacer portion 106 is 55 ppm / ° C. or less, the wafer lenses 100 and 200 or the laminated lens constituting the laminated structure 1000 are used. When the array 500 is manufactured or cut, a difference in expansion and contraction is less likely to occur between the substrate 101 and the spacer portion 106, and a relatively large stress is less likely to occur between them, so that the lenses constituting the wafer lenses 100 and 200 are formed. It is possible to prevent the lens elements 11, 12, etc., which are the parts from peeling off or cracking.

[Second Embodiment]
Hereinafter, the laminated structure including the wafer lens according to the second embodiment will be described. Note that the structure and manufacturing method of the wafer lens of the second embodiment are modifications of the structure and manufacturing method of the wafer lens of the first embodiment, and parts not specifically described are the same as those of the first embodiment. .

  As shown in FIG. 6, the first wafer lens 100 and the second wafer lens 200 constituting the laminated structure 1000 are directly joined without interposing a spacer portion 106 as shown in FIG. In order to adjust the distance between the first wafer lens 100 and the second wafer lens 200, the second resin layer 103 of the first wafer lens 100 is used instead of the spacer portion 106 that is externally bonded to the first wafer lens 100. Protrusions 206 formed at appropriate positions are used.

  Similarly, the second wafer lens 200 and the imaging element array 300 are connected via a protrusion 206 formed at an appropriate position of the second resin layer 103 of the first wafer lens 100 instead of the spacer 106 as shown in FIG. Are joined.

  In the first and second wafer lenses 100 and 200, the protrusions 206 are collectively formed when the second resin layer 103 is molded. That is, in the step of forming the second resin layer 103 shown in FIG. 5A, the spacer portion is formed in the second resin layer 103 by separating the first lens element 11 from the first lens element 11 and forming a ridge. A protrusion 206 similar in shape to 106 can be obtained. When bonding the first wafer lens 100 and the second wafer lens 200, an adhesive is applied to the end surface 206 b on the front end side of the protrusion 206 provided on the first wafer lens 100, and the second wafer lens 200 is bonded to the second wafer lens 200. One resin layer 102 is brought into contact with an appropriate position and irradiated with UV light. When the second wafer lens 200 and the image sensor array 300 are bonded, an adhesive is applied to the end surface 206b on the front end side of the protrusion 206 provided on the second wafer lens 200, and the corresponding portion of the image sensor array 300 is applied. It is made to contact and is irradiated with UV light.

  In the present embodiment, the thermal expansion coefficient of the substrate 101 constituting the first wafer lens 100, the thermal expansion coefficients of the first and second resin layers 102 and 103, and the heat of the substrate 101 constituting the second wafer lens 200 are illustrated. The maximum difference between the expansion coefficient and the thermal expansion coefficient of the first and second resin layers 102 and 103 is set to 55 ppm / ° C. or less.

  In the present embodiment, the bending elastic modulus of the substrate 101 constituting the first wafer lens 100, the bending elastic modulus of the first and second resin layers 102 and 103, and the substrate 101 constituting the second wafer lens 200 are also shown. And the maximum difference between the bending elastic moduli of the first and second resin layers 102 and 103 is 15 GPa or less.

[Third Embodiment]
Hereinafter, the laminated structure including the wafer lens according to the third embodiment will be described. Note that the structure and manufacturing method of the wafer lens of the third embodiment is a modification of the structure and manufacturing method of the wafer lens of the first or second embodiment, and parts not specifically described are the same as those of the first embodiment. It shall be.

  As shown in FIG. 7, the first wafer lens 100 and the second wafer lens 200 constituting the laminated structure 1000 are directly joined without interposing a spacer portion 106 as shown in FIG. 1. In order to adjust the distance between the first wafer lens 100 and the second wafer lens 200, the second resin layer 103 of the first wafer lens 100 is used instead of the spacer portion 106 that is externally bonded to the first wafer lens 100. Protrusions 206 formed at appropriate positions are used. However, the second wafer lens 200 and the image sensor array 300 are joined via the spacer portion 106.

[Fourth Embodiment]
Hereinafter, the laminated structure including the wafer lens according to the fourth embodiment will be described. Note that the structure and manufacturing method of the wafer lens of the fourth embodiment is a modification of the structure and manufacturing method of the wafer lens of the first embodiment, and parts not specifically described are the same as those of the first embodiment. .

  As shown in FIG. 8, the first wafer lens 100 and the second wafer lens 200 constituting the laminated structure 1000 are directly bonded without interposing a spacer portion 106 as shown in FIG. In order to adjust the distance between the first wafer lens 100 and the second wafer lens 200, the flat portion 303 s formed in the thickness of the second resin layer 303 of the first wafer lens 100, and the second wafer lens 200 A flat portion 302t formed to have a thickness of one resin layer 302 is used. In the case of the present embodiment, when the first wafer lens 100 and the second wafer lens 200 are bonded, the flat portion 303 s of the second resin layer 303 of the first wafer lens 100 and the first of the second wafer lens 200 are combined. The flat portion 302t of the resin layer 302 is bonded with an adhesive.

  In the present embodiment, the thermal expansion coefficient of the substrate 101 constituting the first wafer lens 100, the thermal expansion coefficients of the first and second resin layers 102 and 103, and the heat of the substrate 101 constituting the second wafer lens 200 are illustrated. The maximum difference between the expansion coefficient, the thermal expansion coefficient of the first and second resin layers 102 and 103, and the thermal expansion coefficient of the spacer portion 106 is set to 55 ppm / ° C. or less.

  In the present embodiment, the bending elastic modulus of the substrate 101 constituting the first wafer lens 100, the bending elastic modulus of the first and second resin layers 102 and 103, and the substrate 101 constituting the second wafer lens 200 are also shown. The maximum difference between the bending elastic modulus, the bending elastic modulus of the first and second resin layers 102 and 103, and the bending elastic modulus of the spacer portion 106 is 15 GPa or less.

[Fifth Embodiment]
Hereinafter, the laminated structure including the wafer lens according to the fifth embodiment will be described. The structure and manufacturing method of the wafer lens of the fifth embodiment is a modification of the structure and manufacturing method of the wafer lens of the first embodiment or the fourth embodiment, and the portions not particularly described are the first embodiment and the like. It shall be the same.

  As shown in FIG. 9, the second wafer lens 200 and the imaging element array 300 constituting the laminated structure 1000 are directly joined without interposing a spacer portion 106 as shown in FIG. In order to adjust the distance between the second wafer lens 200 and the imaging element array 300, etc., a flat portion 303s formed in the thickness of the second resin layer 303 of the second wafer lens 200 is used.

  When the second wafer lens 200 and the image sensor array 300 are bonded, the flat portion 303s of the second resin layer 303 of the second wafer lens 200 and the corresponding portion of the image sensor array 300 are bonded with an adhesive. .

  In the present embodiment, the thermal expansion coefficient of the substrate 101 constituting the first wafer lens 100, the thermal expansion coefficients of the first and second resin layers 102 and 103, and the heat of the substrate 101 constituting the second wafer lens 200 are illustrated. The maximum difference between the expansion coefficient and the thermal expansion coefficient of the first and second resin layers 102 and 103 is set to 55 ppm / ° C. or less.

  In the present embodiment, the bending elastic modulus of the substrate 101 constituting the first wafer lens 100, the bending elastic modulus of the first and second resin layers 102 and 103, and the substrate 101 constituting the second wafer lens 200 are also shown. And the maximum difference between the bending elastic moduli of the first and second resin layers 102 and 103 is 15 GPa or less.

[Sixth Embodiment]
Hereinafter, the laminated structure including the wafer lens according to the sixth embodiment will be described. Note that the structure and manufacturing method of the wafer lens of the sixth embodiment is a modification of the structure and manufacturing method of the wafer lens of the first embodiment or the fifth embodiment, and the parts that are not particularly described are the first embodiment and the like. It shall be the same.

  As shown in FIG. 10, the laminated structure 1000 includes the first wafer lens 100 and the imaging element array 300. The first wafer lens 100 and the image sensor array 300 are directly bonded without interposing a spacer portion 106 as shown in FIG. In order to adjust the distance between the second wafer lens 200 and the imaging element array 300, etc., a flat portion 303s formed in the thickness of the second resin layer 303 of the second wafer lens 200 is used.

  When the first wafer lens 100 and the image sensor array 300 are bonded, the flat portion 303s of the second resin layer 303 of the first wafer lens 100 and the corresponding portion of the image sensor array 300 are bonded with an adhesive. .

  In this embodiment, the maximum difference between the thermal expansion coefficient of the substrate 101 constituting the first wafer lens 100 and the thermal expansion coefficients of the first and second resin layers 102 and 103 is set to 55 ppm / ° C. or less. .

  In the present embodiment, the maximum difference between the bending elastic modulus of the substrate 101 constituting the first wafer lens 100 and the bending elastic modulus of the first and second resin layers 102 and 103 is set to 15 GPa or less. .

表１において、面Ｓ１〜Ｓ４は、ウェハーレンズ１００，２００の物体側から数えた面を意味し、成形面１０２ａ，１０３ａを意味する。 〔Example〕
The laminated structure 1000 was actually produced and separated into individual pieces, whereby the laminated composite lens 10 was produced, and the production method of the embodiment was evaluated. The result was as shown in Table 1 below.

In Table 1, the surfaces S1 to S4 mean surfaces counted from the object side of the wafer lenses 100 and 200, and the molding surfaces 102a and 103a.

In Example 1, a glass epoxy substrate (Mitsubishi Kasei PGE-6771) having a thickness of 0.5 mm and a diameter of 10 cm is prepared as the substrate 101 of the first wafer lens 100, and a total thickness of 1 is formed on both surfaces 101 a and 101 b of the substrate 101. A 2 μm IR cut filter layer 104 was formed. The physical properties of the substrate 101 are as shown in Table 1 above, and the IR cut filter layer 104 was formed by laminating SiO ₂ and Ta ₂ O ₅ alternately with a vapor deposition machine.

  Next, for example, a metal film having a plurality of chromium oxide layers with a total thickness of 800 nm is formed on the IR cut filter layer 104 formed on the surface 101a side by a vapor deposition machine, and a positive photoresist is formed thereon. The resist layer was coated by the method and dried. Thereafter, using the mask, the resist layer is exposed and developed, and the exposed portion of the chromium oxide layer is removed by etching. After the unnecessary resist is removed, the first lens element is heated at 130 ° C. for 2 minutes. The aperture 105 having the opening 105b corresponding to 11 was formed. The diaphragm 105 was similarly formed on the surface 101b side (or the IR cut filter layer 104 formed on the surface 101b side).

  Next, an epoxy resin is dropped on the surface of one side of the substrate 101 on which the diaphragm 105 and the like are formed, and the first resin layer 102 is formed by irradiating UV light while pressing with a mold and curing the resin. . Similarly, the second resin layer 103 was formed by dropping an epoxy resin on the other surface of the substrate 101, irradiating with UV light while pressing with a mold, and curing the resin.

  Next, the spacer portion 106 was adhered to the second resin layer 103 side of the substrate 101 including the first and second resin layers 102 and 103 to obtain a wafer lens with a spacer, that is, the first wafer lens 100. The spacer portion 106 is made of the same glass epoxy as that of the substrate 101 and has an opening 6 b at a position corresponding to the first lens element 11. The spacer portion 106 was affixed to the second resin layer 103 via an adhesive, and the spacer portion 106 was fixed to the second resin layer 103 by curing the adhesive by irradiation with UV light.

  Thereafter, the spacer portion 106 side of the first wafer lens 100 was fixed to the pedestal, and dicing was performed from the first resin layer 102 side with a known dicer using a blade at a rotational speed of 20000 rpm and a cutting speed of 4 mm / s. . An imaging lens having a square shape in plan view separated into pieces by this dicing was obtained.

  In Table 1, the thermal expansion coefficient was measured using a TMA (thermomechanical analyzer), and the average thermal expansion coefficient at 120 ° C. to 140 ° C. was calculated from the measurement results. Further, the flexural modulus of the object is obtained by measuring in accordance with JIS K 7203.

The evaluation of the state after dicing was performed by observing the section of 10 image pickup lenses separated into pieces with a microscope. During the evaluation, the first resin layer 102, the second resin layer 103, and the IR cut filter layer 104 were observed for states such as peeling and cracking. In addition, the substrate 101 and the spacer portion 106 were observed for the presence or absence of cracks. These failure states were determined at the following four levels.
(1) Level 4: There are 0 imaging lenses out of 10 imaging lenses that have failed such as peeling and cracking in the resin layers 102 and 103 and the IR cut filter layer 104 and cracking in the substrate 101 and the spacer portion 106. When there is (2) Level 3: When there is one imaging lens in which the same failure occurs in 10 imaging lenses (3) Level 2: There are 10 imaging lenses in which a similar failure occurs (4) Level 1: When the number of imaging lenses having the same failure is 8 or more in 10 imaging lenses

  Examples 2 to 8 were also produced by the same method as in Example 1, but Example 2 used Neoprim L-3430 (polyimide manufactured by Mitsubishi Gas Chemical Company) as the material of the substrate 101 and the material of the spacer portion 106. The spacer part 106 used was punched by a known method in a sheet obtained from Neoprim L-3430. In Example 3, as the material of the substrate 101 and the spacer part 106, Comporacene E (an organic polysiloxane having an epoxy group manufactured by Arakawa Chemical Industries) was used, and the spacer part 106 was formed on a sheet obtained from Comporacene E. Drilling was performed by a known method.

  In Examples 4 and 5, the first wafer lens 100 and the second wafer lens 200 are laminated to form a laminated lens array 500. In Example 4, the spacer portion 106 is provided only on the image sensor array 300 side, and corresponds to the structure of the third embodiment in FIG. 7. In Example 5, the first wafer lens 100 is provided. 1 and the second wafer lens 200 are provided with spacer portions 106, which correspond to the structure of the first embodiment of FIG.

  Examples 6 to 8 are wafer lenses 100 and 200 provided with a second resin layer 103 that also functions as a spacer. In this case, the wafer lens 100 is formed with a depression on the image sensor array 300 side (as illustrated in FIG. 8, a lens having a U-shaped cross section in which the resin layer is a spacer without providing a separate spacer. ) Is used to form the laminated structure 1000. When forming the depression, the aperture 105 was produced by applying a material containing a black filler and an epoxy resin by an ink jet method and drying to form a film having a thickness of 3 μm. Example 6 is a single-layer type of the first wafer lens 100 and corresponds to the structure of the sixth embodiment of FIG. 10, and Examples 7 and 8 are the fourth embodiment of FIG. It corresponds to the structure. The difference between the seventh and eighth embodiments is that the flange surfaces 11b and 12b at the outer edges of the first lens element 11 of the first resin layer 102 and the first lens element 12 of the second resin layer 103 are abutted and bonded. The abutment and adhesion are performed outside the flange surfaces 11b and 12b.

  Comparative Examples 1, 2, and 3 have structures corresponding to Examples 1, 5, and 7, respectively, but the material of the substrate 101 is different.

  The optical element manufacturing method and the like according to the present embodiment have been described above, but the optical element manufacturing method according to the present invention is not limited to the above. For example, in the above embodiment, the shape and size of the first and second optical surfaces 11a and 12a can be changed as appropriate according to the application and function.

  Moreover, in the said embodiment, the wafer lenses 100 and 200 do not need to be disk shape, and can have various outlines, such as an ellipse. For example, the dicing process can be simplified by forming the wafer lenses 100 and 200 into a square plate shape from the beginning.

  Moreover, in the said embodiment, the number of the 1st and 2nd lens elements 11 and 12 formed in the wafer lens 100 is not restricted to nine of illustration, It can be made into two or more arbitrary plural. At this time, the arrangement of the first and second lens elements 11 and 12 is preferably on a lattice point for convenience of dicing. Further, the interval between the adjacent lens elements 11 and 12 is not limited to the illustrated one, and can be set as appropriate in consideration of workability and the like.

  Moreover, in the said embodiment, you may provide a resin layer only in the one surface 101a or the other surface 101b of the board | substrate 101 of the wafer lens 100,200.

  Further, in the above embodiment, the diaphragm main body 105a of the diaphragm 105 is not provided at the planned cutting portion. However, if the first and second resin layers 102 and 103 are not affected when the wafer lenses 100 and 200 are cut, the cutting is performed. An aperture body 105a may be provided in the planned portion.

6a ... support, 6b ... aperture, 10 ... compound lens, 10a ... lens body, 10c ... spacer member, 11, 12 ... lens element, 11a, 12a ... optical surface, 330 ... imaging device, 100, 200 ... wafer lens, DESCRIPTION OF SYMBOLS 101 ... Board | substrate, 102, 103 ... Resin layer, 102a, 103a ... Molding surface, 104 ... Cut filter layer, 105 ... Diaphragm, 106 ... Spacer part, 206 ... Projection part, 300 ... Imaging element array, 500 ... Multilayer lens array, 700 ... Imaging device, 1000 ... Laminated structure, AX ... axis, DX ... cut line, OA ... optical axis

Claims (15)

A wafer lens manufacturing method comprising: a substrate; a plurality of lens portions formed on at least one substrate surface of the substrate; and a support portion formed around the lens portion,
A method for producing a wafer lens, wherein a difference in thermal expansion coefficient between the substrate and the support is 55 ppm / ° C. or less.   The method for manufacturing a wafer lens according to claim 1, wherein the support portion is formed integrally with the lens portion and a resin layer.   The method for manufacturing a wafer lens according to claim 2, wherein the support part is a protrusion part that protrudes from the plurality of lens parts and adjusts an interval between members adjacent to the outside in the optical axis direction. .   The method for manufacturing a wafer lens according to claim 2, wherein the support part is a flat part formed relatively thicker than the plurality of lens parts.   The method of manufacturing a wafer lens according to claim 1, wherein the support part is a spacer part having a plurality of openings through which optical axes of the plurality of lens parts pass. A first lens group having a first substrate and a first resin layer formed on at least one substrate surface of the first substrate and having a plurality of lens portions;
A second lens having a second substrate and a second resin layer having a plurality of lens portions molded on at least one substrate surface of the second substrate and disposed adjacent to the first lens group A group,
By joining the first resin layer and the second resin layer, the first lens group and the second lens group are coupled,
A method for producing a wafer lens, wherein a maximum difference in thermal expansion coefficients among the first substrate, the first resin layer, the second substrate, and the second resin layer is 55 ppm / ° C. or less.   The first lens group and the second lens group are joined by bonding the outside of the plurality of lens portions of the first resin layer and the outside of the plurality of lens portions of the second resin layer. The wafer lens manufacturing method according to claim 6, wherein the wafer lenses are connected. A first lens group having a first substrate and a first resin layer formed on at least one substrate surface of the first substrate and having a plurality of lens portions;
A second lens having a second substrate and a second resin layer having a plurality of lens portions molded on at least one substrate surface of the second substrate and disposed adjacent to the first lens group Group,
A spacer unit that is bonded to the opposite side of the first lens unit with respect to the second lens unit and has a plurality of openings through which the optical axes of the plurality of lens units pass, and a wafer lens manufacturing method comprising:
The wafer characterized in that the maximum difference in thermal expansion coefficient among the first substrate, the first resin layer, the second substrate, the second resin layer, and the spacer portion is 55 ppm / ° C. or less. Lens manufacturing method. A first lens group having a first substrate and a first resin layer formed on at least one substrate surface of the first substrate and having a plurality of lens portions;
A second lens group having a second substrate and a second resin layer formed on at least one substrate surface of the second substrate and having a plurality of lens portions, and disposed adjacent to the first lens group When,
A first spacer portion which is bonded to the opposite side of the first lens group with respect to the second lens group and has a plurality of openings through which the optical axes of the plurality of lens portions pass;
The second lens group is joined to the first lens group and the second lens group so as to connect the first lens group and the second lens group, and has a plurality of openings through which the optical axes of the plurality of lens portions pass. A method of manufacturing a wafer lens comprising a spacer portion,
The wafer characterized in that the maximum difference in thermal expansion coefficient among the first substrate, the first resin layer, the second substrate, the second resin layer, and the spacer portion is 55 ppm / ° C. or less. Lens manufacturing method.   6. The method for manufacturing a wafer lens according to claim 1, wherein a maximum difference in flexural modulus between the substrate and the support portion is 15 GPa or less.   10. The maximum difference in flexural modulus among the first substrate, the first resin layer, the second substrate, and the second resin layer is 15 GPa or less. A method for producing a wafer lens according to claim 1.   The maximum difference in bending elastic modulus between the first substrate, the first resin layer, the second substrate, the second resin layer, and the spacer is 15 GPa or less. The manufacturing method of the wafer lens as described in any one of these.   The method for manufacturing a wafer lens according to any one of claims 1 to 12, wherein the difference in thermal expansion coefficient is determined based on an average value in a temperature range from 120 ° C to 140 ° C. A wafer lens comprising a substrate, a plurality of lens portions molded on at least one substrate surface of the substrate, and a support portion formed around the plurality of lens portions,
A wafer lens, wherein a difference in thermal expansion coefficient between the substrate and the support is 55 ppm / ° C. or less.   A lens unit manufactured using the method for manufacturing a wafer lens according to claim 1.

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