JP2013098495A - Support structure for electronic apparatus - Google Patents

Abstract

Provided is a support structure for an electronic device that can improve heat dissipation of the electronic device without increasing the size of the electronic device or improving the electronic device.
An electronic apparatus supporting structure for supporting an electronic apparatus having a built-in heat generating device, wherein the electronic apparatus is erected with respect to an installation surface and is disposed between a proximal end portion and a distal end portion. 3, a hollow portion h that extends in the axial direction is formed inside the support column 5, and a lower side penetration that penetrates the side wall 9 that forms the hollow portion h is formed in the base end portion P <b> 1 of the support column 5. An electronic device support structure in which the hole 11 is provided and the upper through-hole 13 penetrating the side wall 9 is provided at a position corresponding to the position where the electronic device 3 is disposed on the tip P2 side of the lower through-hole 11. 1.
[Selection] Figure 1

Description

  The present invention relates to a support structure that supports an electronic device such as a radio base station device, and relates to a technique for improving heat dissipation of the electronic device without increasing the size of the electronic device or improving the electronic device.

  Many electronic devices such as wireless base station equipment are installed outdoors, but internal devices are prevented from being damaged by heat generated by heat-generating devices such as semiconductor elements mounted inside or temperature rises caused by solar radiation. Therefore, excellent heat dissipation is required.

  As a means for improving the heat dissipation of the electronic equipment, generally, a natural air cooling system that increases the heat dissipation area by erecting a large number of radiating fins on the outer wall surface of the casing of the electronic equipment as shown in FIG. The method is popular.

  By the way, in recent years, the amount of heat generation has increased remarkably with the increase in integration and speed of semiconductor elements. Since the necessary heat dissipation area is theoretically determined with respect to the heat dissipation amount, If it is only to cover, a large number of heat dissipating fins must be provided, which increases the external dimensions of the electronic device and affects the cityscape.

  On the other hand, in Patent Document 1, a spiral protrusion is provided on the casing of the outdoor base station device to increase the heat radiation area, and a fan that is rotated by a motor is provided at the center of the spiral protrusion to actively dissipate heat. There has been proposed an outdoor base station apparatus that performs the above.

Japanese Patent Laid-Open No. 11-121956

  However, although the thing of patent document 1 has a high heat radiation effect compared with the heat radiation only by a radiation fin, since the fan is attached to the housing | casing itself of a base station apparatus, the enlargement of the external dimension of a base station apparatus is avoided. In addition, since the base station apparatus is installed outdoors, there is a possibility that the expected heat dissipation effect may not be obtained because the fan motor is damaged by the influence of moisture or dust.

  SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a support structure for an electronic device that can improve the heat dissipation of the electronic device without enlarging the electronic device or improving the electronic device.

  The present invention has been made to solve the above problems, and the support structure for an electronic device according to the present invention is a support structure for an electronic device that supports an electronic device having a built-in heat generating device, and is provided on an installation surface. A support column that is erected with respect to the base unit and is supported between the base end and the front end, and a hollow portion extending in the axial direction is formed in the support column; and the base end of the support column In addition, a lower through-hole penetrating the side wall constituting the hollow portion is provided, and the side wall is penetrated at a position corresponding to the disposition location of the electronic device on the tip side from the lower through-hole. An upper through hole is provided.

  In the electronic apparatus supporting structure according to the present invention, a solar power generation panel for converting sunlight into electric power is provided on the support column, and the hollow portion is driven by electric power from the solar power generation panel. It is preferable to provide a blower that allows air to flow in a direction from the lower through hole toward the upper through hole.

  In the electronic device support structure according to the present invention, the electronic device has a heat radiation fin on at least one surface of the housing for housing the heat generating device, and the upper through hole is formed in the heat radiation of the housing. It is preferable to be directed to the surface having fins.

  In the electronic device support structure according to the present invention, when the air existing in the cavity in the support is heated and raised by heat from outside, the inside of the base end of the support becomes negative pressure due to the so-called chimney effect. Air flows into the column from the lower through-hole and the air that has risen flows out from the upper through-hole, and the outflowed air is blown onto the heat dissipation fins of the electronic device located near the upper through-hole to cool the electronic device. To do.

  Therefore, according to the support structure of the electronic device of the present invention, air can be blown to the heat radiating fin without any improvement including the addition of the heat radiating fin to the electronic device. The heat dissipation (cooling) can be improved without increasing the size, and the air is accelerated by the chimney effect utilizing the density difference of the air and blown to the electronic equipment. Thus, the fan directly attached to the casing of the base station apparatus does not break down and the desired heat dissipation effect cannot be obtained.

It is a schematic perspective view of the support structure of the electronic device of one Embodiment according to this invention. It is a schematic perspective view which shows an example of the electronic device (base station apparatus) which can be attached to the support structure of the electronic device according to this invention. It is a schematic perspective view of the support structure body of the electronic device of other embodiment according to this invention. It is a schematic perspective view of the support structure of the electronic device of further another embodiment according to this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  Reference numeral 1 in FIG. 1 represents a support structure 1 according to a first embodiment of the present invention. The support structure 1 is erected and fixed to an installation surface such as the ground, and is a base end portion. A support column 5 that supports the electronic device 3 is provided between the P1 and the tip end portion P2. Here, the electronic device 3 is a base station device for a mobile phone, a PHS or the like. As shown in FIG. 2, the electronic device 3 has various devices (antenna, transmission / reception unit, control unit, etc.). (Not shown) is housed in a box-shaped housing 3 a and is fixed around the support column 5 by a mounting bracket 7. In addition, a plurality of radiating fins 3b are arranged at predetermined intervals on the front surface and the back surface (surface facing the column 5) of the housing 3a of the electronic device 3, respectively. In addition, regarding arrangement | positioning of each device accommodated in the electronic device 3, a device with big heat_generation | fever is on the back side (side near the support | pillar 5) from which the high cooling effect is anticipated with the air which flows out from the upper through-hole 13 mentioned later. It is preferable to arrange.

  The support | pillar 5 is comprised with a cylindrical steel pipe, and has the cavity part h extended in an axial direction inside. Further, the column 5 has a lower through hole 11 penetrating the side wall 9 constituting the hollow portion h at the base end portion P1, and the attachment position of the electronic device 3 on the distal end portion P2 side with respect to the lower through hole 11 The upper side through-hole 13 which penetrates the side wall 9 is provided at a position corresponding to. At least one lower through-hole 11 may be provided. In this embodiment, the lower through-hole 11 is provided at two locations facing each other. In addition, at least one upper through-hole 13 may be provided, and in this embodiment, the upper through-hole 13 is provided at one location facing the electronic device 3.

  Further, in this embodiment, the column 5 is disposed close to the upper side of the upper through-hole 13 and closes the upper part of the cavity h from the upper through-hole 13. A deflecting plate 15 is provided for directing the flow of air that has flowed in and raised to the upper through-hole 13 to flow out.

  In the support structure 1 according to this embodiment, when the air existing in the hollow portion h in the column 5 is heated and raised by heat from the outside, the inside of the base end portion P1 of the column 5 is caused by a so-called chimney effect. The negative pressure causes air to flow from the lower through-hole 11 into the support column 5, and the air that has risen flows out from the upper through-hole 13. The electronic device 3 is cooled by being sprayed to 3b.

  Therefore, according to the support structure 1 of this embodiment, air can be blown to the heat radiating fins 3b without any improvement including the addition of the heat radiating fins 3b to the electronic equipment 3, so that the electronic Since the heat dissipation (cooling performance) can be improved without increasing the size of the device 3, and the air is accelerated by the chimney effect using the density difference of the air to blow the air to the electronic device 3. Thus, unlike the prior art, the fan directly attached to the casing 3a of the base station apparatus does not fail and the desired heat dissipation effect cannot be obtained.

  Further, according to the support structure 1 of this embodiment, since the upper through hole 13 is directed to the surface of the housing 3a of the electronic device 3 having the heat radiation fins 3b, it flows out of the upper through hole 13. Air can be reliably blown to the heat radiating fins 3b of the electronic device 3, and the heat dissipation of the electronic device 3 can be further improved.

  Next, a support structure 1 for an electronic device according to another embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 3, the electronic device support structure 1 of this embodiment is solar light fixed in the vicinity of the front end portion P <b> 2 of the support column 5 so as to cover the upper surface of the electronic device 3 held by the support column 5. Is fixed to the inner surface of the side wall 9 that constitutes the hollow portion h of the support column 5 with its rotation axis fixed in the vertical direction (the axial direction of the support column 5), and air is blown upward. The blower 19 is provided. The photovoltaic power generation panel 17 and the direct current motor 21 of the blower 19 are electrically connected by the wiring 23, and the power generated by the photovoltaic power generation panel 17 by receiving light is directly supplied to the direct current motor 21. It has become. Other configurations are the same as those of the above-described embodiment.

  In the electronic device support structure 1 of this embodiment, in addition to the air flowing in from the lower through-hole 11 rising due to natural convection, the photovoltaic power generation panel 17 supplies power to operate the blower 19 and the cavity portion Since the upward flow is positively generated in h, the air flowing out from the upper through-hole 13 can be blown to the heat radiation fins 3b of the electronic device 3 at a higher speed, and the heat radiation effect of the electronic device 3 can be further enhanced. In addition, when the sunshine becomes stronger, further cooling of the electronic device 3 is required. However, the stronger the sunshine, the more electric power is supplied from the photovoltaic power generation panel 17 to the blower 19 and the air blown to the electronic device 3 is increased. Since the flow rate is increased, cooling according to the surrounding thermal environment can be easily realized. Further, unlike the above-described prior art, the blower 19 is not easily broken because it is disposed in the support column 5 that is not easily affected by rain or dust.

  Moreover, according to the support structure 1 of the electronic device of this embodiment, since the photovoltaic power generation panel 17 is disposed so as to cover the upper surface of the electronic device 3, the photovoltaic power generation panel 17 also functions as an awning, The temperature rise of the electronic device 3 can also be suppressed.

  In addition, in the support structure 1 of the electronic device of this embodiment, a storage battery (not shown) that accumulates electric power obtained from the solar power generation panel 17 and supplies the accumulated electric power to the blower 19 may be provided. According to this, even if the weather is bad and sufficient electric power cannot be obtained from the photovoltaic power generation panel 17, the electric power can be stably sent to the blower 19. In this case, a temperature sensor may be provided in the housing 3a of the electronic device 3, and power control means (not shown) for adjusting the power supplied from the storage battery to the blower 19 based on temperature information from the temperature sensor may be provided. According to this, when the weather is bad and sufficient power cannot be obtained from the photovoltaic power generation panel 17 and the temperature of the electronic device 3 is not so high, the operation of the blower 19 is stopped or lowered, When the weather is bad and sufficient electric power cannot be obtained from the photovoltaic power generation panel 17 and the temperature of the electronic device 3 is high, the operation of the blower 19 can be increased. Since the operation of the corresponding blower 19 becomes possible, the electric power accumulated in the storage battery can be saved as compared with the case where the blower 19 is always operated when the weather is bad. Period is bad can be realized also stable cooling of the electronic device 3 for a long time.

  Although the present invention has been described based on the illustrated examples, the present invention is not limited to the above-described embodiment, and can be appropriately changed within the scope of the claims. For example, in the above-described embodiment, it has been described that the support column 5 stands directly on the ground. However, the support column 5 may be attached to the wall surface B1 or the roof of the building structure B as shown in FIG. In addition, the number of electronic devices 3 attached to one column 5 is not limited to one, and can be two or more. In that case, it is preferable to arrange the upper through holes 13 corresponding to the respective electronic devices 3. Furthermore, the shape of the support | pillar 5 is not restricted to a cylindrical shape, You may comprise with a square steel pipe whose cross-sectional shape is a square or a rectangle. In addition, the column 5 is preferably arranged along the direction of gravity from the viewpoint of utilizing the density difference of air, but may be arranged inclined with respect to the direction of gravity within the range in which the chimney effect is exhibited. .

  Thus, according to the present invention, it is possible to provide a support structure for an electronic device that can improve the heat dissipation of the electronic device without increasing the size of the electronic device or improving the electronic device.

DESCRIPTION OF SYMBOLS 1 Support structure of electronic device 3 Electronic device 3a Case 3b Radiation fin 5 Post 7 Mounting bracket 9 Side wall 11 Lower through-hole 13 Upper through-hole 15 Deflector plate 17 Solar power generation panel 19 Blower h Cavity P1 Base end P2 Tip

Claims (3)

An electronic device support structure for supporting an electronic device incorporating a heat generating device,
A column that is erected with respect to the installation surface and that supports the electronic device between the proximal end and the distal end,
Forming a hollow portion extending in the axial direction inside the support column; and
A lower through hole penetrating a side wall constituting the hollow portion is provided at a base end portion of the support column, and at a position corresponding to a position where the electronic device is disposed on a distal end side with respect to the lower through hole. An electronic apparatus supporting structure comprising an upper through hole penetrating the side wall. While providing a solar power generation panel for converting sunlight into electric power on the support column,
2. The electron according to claim 1, wherein a blower that is driven by electric power from the photovoltaic power generation panel and flows air in a direction from the lower through hole toward the upper through hole is provided in the hollow portion. Equipment support structure. The electronic apparatus has a heat radiation fin on at least one surface of a housing that houses the heat generating device,
The support structure for an electronic device according to claim 1, wherein the upper through hole is directed to a surface of the housing having the heat dissipating fins.

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