JP2013093130A - Led lamp - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED lamp with a simple structure, that is excellent in heat radiation characteristics and can select illumination directions.SOLUTION: The LED lamp has a body part, a transparent cover installed on an upper side of the body part, and a base part installed on a lower side of the body part. A support pole is formed by integrating at least two rectangular metal members with an insulating member interposed in between, the upper part of the support pole making an element mounting part for mounting an LED, the lower part of the support pole making a support part, the LED is electrically installed on the two metal members interposing the insulating member at the element mounting part of the support pole, and the support part of the support pole is connected and fixed to a power supply part built-in in the body part.

Description

  The present invention relates to an LED lamp having a plurality of LED elements, and more specifically, a plurality of LED elements are mounted on a support pillar in which two rectangular metal members are integrated with an insulating member interposed therebetween. The present invention relates to an LED lamp in which high-luminance illumination is possible by connecting and fixing a column to a power supply unit built in the lamp main body, heat radiation characteristics are good, and the directionality of illumination can be freely controlled.

  In recent years, an LED element (hereinafter abbreviated as LED) as a semiconductor light emitting element is a semiconductor element, and thus has a long life and excellent driving characteristics, and is small, has high luminous efficiency, and has a bright emission color. In particular, high-intensity and low-power LED lamps having the same base mounting configuration as conventional incandescent light bulbs have been widely used. It was.

  Particularly, in recent years, various LED lamps have been proposed in which a plurality of LEDs are mounted, illumination with high brightness is possible, and heat dissipation characteristics are improved (for example, Patent Document 1, Patent Document 2, and Patent Document 3). There is also a proposal of an LED module considering heat dissipation characteristics (for example, Patent Document 4). Further, an LED lamp whose emission direction is controlled in accordance with the LED lamp mounting state has been proposed (for example, Patent Document 5).

  A conventional LED lamp will be described below. For ease of understanding, the drawings are partially simplified within the scope not departing from the spirit of the invention, and component names are also included in the present application. 13 is a sectional view of the LED lamp 100L in Patent Document 1, and FIG. 14 is a perspective view of the LED module 100 in FIG. In FIG. 13, an LED lamp 100 </ b> L has a heat dissipating part 103, an insulating part 104, and a base part 102, and is an LED lamp having the same base part mounting configuration as a conventional incandescent bulb. An LED module 100 on which an LED is mounted is attached, and the LED module 100 is wrapped and molded with an insulating transparent resin 105. The molded transparent resin 105 forms a spherical shape, and has the same shape as a conventional light bulb. Yes.

  FIG. 14 is a perspective view of the LED module 100 shown in FIG. 13, in which the four module boards 112 on which the plurality of LEDs 111 are mounted are assembled in a square shape to constitute the LED module 100, and the LEDs wired on each module board 112. The group is connected to a power supply unit (not shown) provided inside the heat radiating unit 103 and the insulating unit 104 via an extraction electrode 113 provided on the back side of the module substrate 112. The LED module 100 is molded into a lamp shape with a transparent resin 105.

  In the operation of the LED lamp 100L, the LED module 100 emits light by the power supplied from the base portion 102, passes through the transparent resin 105, and is emitted to the outside. Further, a large amount of heat generated from the LED 111 is radiated through the heat radiating portion 103 and the transparent resin 105.

Moreover, although illustration was abbreviate | omitted about patent document 2 and patent document 3, both are LED lamps of a nozzle | cap | die part structure, and each has the characteristic in the structure of an LED module.
In the LED module of the LED lamp of Patent Document 2, a circuit board on which an LED is mounted is attached to the outside of a hollow metal support cylinder, heat generated by the LED is conducted to the support cylinder through the circuit board, and flows around the support cylinder. The cooling effect is enhanced by air.
Further, the LED module in the LED lamp of Patent Document 3 is provided with a metal support column as a support member, and after applying insulation treatment to the surface of the support column, a connection wiring is provided, and a plurality of LEDs are mounted on the connection wiring. LED module.

  Patent Document 4 describes an LED module with improved heat dissipation. 15 and 16 are both perspective views of the LED modules 200 and 300 described in Patent Document 4, and the LED module 200 described in FIG. 15 includes two rectangular metal members 203 and insulating members 202. A laminated body 205 is formed by being sandwiched between them, and the LED 211 is flip-chip mounted using the two metal members 203 as electrodes to constitute the LED module 200. In the LED module 300 shown in FIG. 16, two metal members 303 are integrated with an insulating member 302 interposed therebetween to form a laminated body 305, and LEDs 311 are flip-chip mounted on two sides of the laminated body 305. The LED module 300 is configured.

  Further, Patent Document 5 describes a PED lamp for a lighting device of a sideways type, and an LED mounted in a planar state on the upper surface of a main body in a lamp configuration with a base, and a predetermined periphery around the LED. The LRD lamp has a reflection plate that is rotatably attached with a reflection angle, and that emits illumination light in an arbitrary direction by rotating the reflection plate with the LED lamp attached by a base.

JP 2009-1335026 A JP 2010-135181 A JP 2008-103112 A Republished patent-WO2006-070457 JP 2011-181345 A

  However, in the conventional PED lamp described in Patent Document 1, a plurality of LEDs are mounted on a circuit board as an LED module, and a heat radiation path in which the circuit board is brought into contact with a heat radiation portion and a molded transparent resin are used. Although heat dissipation is performed by the heat dissipation path, heat dissipation from the LED mounted on the circuit board has a drawback that sufficient heat dissipation is not performed because the thermal conductivity of the circuit board is not so good. The conventional PED lamp described in Patent Document 2 dissipates heat by attaching a circuit board on which a plurality of LEDs are mounted as an LED module to a metal support cylinder. Is not so good, there is a drawback that sufficient heat dissipation is not performed.

Moreover, the conventional PED lamp described in Patent Document 3 is provided with a metal support pillar as a support member, and after applying insulation treatment to the surface of the support pillar, a connection wiring is provided, and a plurality of LEDs are provided on the connection wiring. Since the LED module is mounted, the heat generated from the multiple LEDs is favorably performed by the metal support pillars. However, the metal support pillars are insulated, and wiring electrodes are formed. The manufacturing process is required and the manufacturing cost is high.
Further, in the conventional LED module described in Patent Document 4, two metal members are integrated with an insulating member interposed therebetween to form a laminate, and the LED is flip-chiped using the two metal members as electrodes. Since it is mounted, the LED is mounted directly on the metal member, so it has excellent heat dissipation characteristics and has the advantage that the configuration is simple, but only the configuration as an LED module has been proposed, There is no description about the configuration as an LED lamp.

  In addition, the conventional LPED lamp described in Patent Document 5 has an advantage of emitting illumination light in an arbitrary direction. However, the illumination light is emitted in an arbitrary direction by rotating a rotatable reflector. Since it is a structure, it is necessary to build a complicated rotation mechanism inside the LED lamp, and there are drawbacks such as an increase in shape.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an LED lamp that applies the techniques of each of the above-described conventional examples, eliminates the respective drawbacks, has a simple configuration, has excellent heat dissipation characteristics, and provides a degree of freedom in illumination direction. It is.

In order to achieve the above object, the configuration of the LED lamp in the present invention is as follows.
In an LED lamp having a main body portion, a transparent cover attached to the upper surface of the main body portion, and a base portion attached to the lower surface of the main body portion, at least two rectangular metal members are sandwiched between insulating members. The support pillars are formed integrally with each other, the upper part of the support pillar is an element mounting part for mounting the LED, the lower part of the support pillar is a support part, and the element mounting part of the support pillar is sandwiched with an insulating member The LED is electrically attached to two metal members, and the support portion of the support pillar is connected and fixed to a power supply portion built in the main body portion.

  According to the above configuration, an LED unit in which a plurality of LEDs are mounted on a support pillar integrated with two metal members sandwiched between insulating members is connected to a power supply unit and attached to a main body unit having a heat dissipation function. Therefore, it is possible to provide an LED lamp having a simple configuration and excellent heat dissipation characteristics.

  It is preferable that the LED is mounted on two opposing surfaces of an element mounting surface formed by two metal members sandwiching an insulating member in the element mounting portion of the support pillar.

  The number of LEDs mounted on the two opposing surfaces of the element mounting portion of the support pillar may be different.

  It is preferable that an LED is also mounted on the upper surface portion of the element mounting portion of the support pillar.

  According to the said structure, many LED can be mounted in one support pillar, and an illumination range can be widened.

  The element mounting portion may be inclined with respect to the support portion of the support pillar.

  The LED may have an LED package configuration mounted on a mounting substrate having two connection electrodes.

  The LED lamp has a metal main body part, a transparent cover attached to the upper surface of the main body part, and a base attached to the lower surface of the main body part, and a power supply part built in the main body part. It is preferable that a support portion of the support column is inserted and fixed, and an element mounting portion of the support column is disposed in the transparent cover.

  As described above, according to the present invention, two metal members are integrated with an insulating member interposed therebetween to form a support column, and the LED unit in which a plurality of LEDs are mounted on the support column further has a heat dissipation function. Since it is the structure attached to a main-body part, the structure is simple, it is excellent in the thermal radiation characteristic, and the LED lamp which can select an illumination direction can be provided.

It is sectional drawing of the LED lamp in 1st Embodiment of this invention. It is detail drawing of the LED unit in the LED lamp shown in FIG. It is sectional drawing of the LED lamp in 2nd Embodiment of this invention. It is sectional drawing of the LED lamp in 3rd Embodiment of this invention. It is sectional drawing of the LED lamp in 4th Embodiment of this invention. It is a top view of the LED unit in the LED lamp shown in FIG. It is sectional drawing which shows the attachment state of the LED lamp shown in FIG. It is sectional drawing which shows the attachment state of the LED lamp shown in FIG. It is sectional drawing which shows the attachment state of the LED lamp shown in FIG. It is sectional drawing which shows the attachment state of the LED lamp shown in FIG. It is detail drawing which shows other embodiment of the LED unit in this invention. It is detail drawing which shows other embodiment of the LED unit in this invention. It is sectional drawing of the conventional LED lamp. It is a perspective view of the LRD unit in the conventional LED lamp shown in FIG. It is a perspective view of the conventional LED unit. It is a perspective view of the conventional LED unit.

(First embodiment)
Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 show an LED lamp according to a first embodiment of the present invention. FIG. 1 is a sectional view of an LED lamp 10L. FIG. 2 is a detailed view of an LED module 10 used in the LED lamp 10L shown in FIG. is there. In FIG. 1, the basic configuration of the LED lamp 10 </ b> L has a conventional lamp configuration in which a transparent cover 5 is attached to an upper portion of a metal main body portion 3 having a heat dissipation function to which a base portion 2 is attached. A power circuit 6 and a connector 7 are housed inside the main body 3, and an LED module 10 on which a plurality of LEDs 11 to be described later are mounted is inserted into the connector 7 and disposed inside the transparent cover 5. Yes.

  In the above configuration, the LED lamp 10L converts the AC voltage supplied from the base part 2 into a voltage for driving the LED 11 by the power supply part 6 and supplies it to the LED module 10 via the connector 7, whereby the LED 11 is turned on and illuminated. Is done. Further, heat generated by the lighting of a large number of LEDs 11 is directly radiated from a metal member constituting the LED module 10 to be described later, and is also conducted from the metal member to the main body 3 through the outer wall of the connector 7, and is radiated more strongly than the main body 3. Going to be.

  2A and 2B show details of the LED module 10. FIG. 2A is a perspective view of the LED module 10, FIG. 2B is a plan view, FIG. 2C is a side view, and FIG. In FIG. 2A, the LED module 10 is formed by integrating two rectangular metal members 13 with an insulating member 14 interposed therebetween to form a support column 15, and above the support column 15 (indicated by arrows AA). ) Is an element mounting portion 15a for mounting the LED 11, and a lower portion of the support column 15 is a support portion 15b for connecting and fixing to the power source unit 6, and an insulating member 14 is sandwiched between the element mounting portion 15a of the support column 15 and 2 The LEDs 11 are electrically attached to the individual metal members 13, and the support portion 15 b of the support pillar 15 is inserted and fixed to the connector 7 provided in the power supply portion 6.

  The LED 11 in this embodiment is a flip-chip mounting (hereinafter abbreviated as FC mounting) type LED having two mounting electrodes 11a and 11b as shown in a side view and a bottom view in FIG. ) As shown in (c), FC mounting is performed using two metal members 13 sandwiching the insulating member 14 as electrodes, and a plurality of LEDs 11 are mounted side by side on the opposite sides, and the LEDs 11 are also mounted on the top. . As shown in the drawing, a large number of LEDs 11 can be mounted in parallel on a support pillar 15 having a simple structure constituted by two metal members 13 sandwiching an insulating member 14, and a bright illumination device can be realized.

(Second Embodiment)
Next, the LED lamp of the second embodiment will be described with reference to FIG. FIG. 3 is a cross-sectional view of the LED lamp 20L of the second embodiment, and the basic configuration is the same as that of the LED lamp 10L shown in FIG. 1, and thus the same elements are denoted by the same reference numerals and redundant description is omitted. The difference between the LED lamp 20L of the second embodiment and the LED lamp 10L of the first embodiment is the mounting structure of the LED module 10. That is, in the case of the LED lamp 10L, the connector 7 is provided, and the support portion 15b of the LED module 10 is inserted into the connector 7 for connection and fixing, whereas in the case of the LED lamp 20L, the connector 7 is not provided. The circuit board 21 having an insulating property and good reflectivity is fixed to the upper surface of the main body 3, and the metal members 13 on both sides of the support portion 15 b of the LED module 10 are soldered to the wiring electrodes 22 provided on the circuit board 21. It is fixed by.

  Although the illustration of the LED lamp 20L is omitted, the wiring electrode 22 and the base part 2 are electrically connected to the power supply unit 6, and the AC voltage supplied from the base part 2 is supplied to the LED 11 by the power supply part 6. Is converted into a voltage for driving the LED 11 and supplied to the LED module 10 via the wiring electrode 22, whereby the LED 11 is turned on and illumination is performed. Further, the heat generated by the lighting of a large number of LEDs 11 is directly radiated from the metal member 3 constituting the LED module 10, and is conducted from the metal member 3 to the main body 3 via the solder 23 and the circuit board 21, and is stronger than the main body 3. The heat goes away.

(Third embodiment)
Next, an LED lamp according to a third embodiment will be described with reference to FIG. FIG. 4 is a cross-sectional view of the LED lamp 30L of the third embodiment, and the basic configuration is the same as that of the LED lamp 10L shown in FIG. 1, and thus the same elements are denoted by the same reference numerals and redundant description is omitted. The difference between the LED lamp 30L of the third embodiment and the LED lamp 10L of the first embodiment is the difference in the structure of the LED module. In the LED module 10, the number of LEDs 11 mounted on the opposing surface of the support pillar 15 is the same. In contrast, the LED module 30 of the LED lamp 30L is different in the number of LEDs 11 mounted on the opposing surface of the support column 15, and in the embodiment, the number of LEDs 11 on the left side is reduced. Although the mounting structure and light emission state of the LED lamp 30L will be described later, it is basically used as a one-side lighting device.

(Fourth embodiment)
Next, an LED lamp according to a fourth embodiment will be described with reference to FIGS. FIG. 5 is a cross-sectional view of the LED lamp 40L of the fourth embodiment, FIG. 6 is a plan view of the LED module 40 attached to the LED lamp 40L, and the basic configuration is the same as the LED lamp 10L shown in FIG. The same number is attached | subjected to the same element, and the overlapping description is abbreviate | omitted. The difference between the LED lamp 40L of the fourth embodiment and the LED lamp 10L of the first embodiment is the difference in the shape of the LED module, and the LED module 10 of the LED lamp 10L has the support pillar 15 having a linear shape. On the other hand, the support column 45 of the LED module 40 of the LED lamp 40L is bent. Although the mounting structure and light emission state of the LED lamp 40L will be described later, it is basically used as a one-side lighting device.

  FIG. 6 is a plan view of the LED module 40. The support pillar 45 is bent between the element mounting portion 45a and the support portion 45b, and the support portion 45b is inserted into the connector 7 in the first embodiment or the second. If it fixes to the wiring electrode 22 of the circuit board 1 in embodiment with the solder 23, as shown in FIG. 5, the LED module 40 will be inclined and attached.

(LED lamp mounting structure)
Next, the mounting structure and illumination direction of each LED lamp will be described with reference to FIGS. FIG. 7 shows a structure in which the LED lamp 10L or 20L is attached to the ceiling, and the illumination direction is all the lower side as shown by the radiation beam P, so it is preferable to attach it to the center of the room. FIG. 8 shows a structure in which the LED lamp 30L is attached to the ceiling, and the illumination direction is a lower oblique direction as shown by the radiation beam P, so it is preferable to attach it to a corner of a room or hallway.

  FIG. 9 also shows a case where the LED lamp 30L is attached to the wall, and its illumination direction is a lower oblique direction as indicated by the radiation beam P, and is suitable for desk or entrance illumination. Further, FIG. 10 shows a case where the LED lamp 40L is attached to the wall, and its illumination direction is a lower oblique direction as indicated by the radiation beam P, and is suitable for desk or entrance illumination.

(Another embodiment of LED module)
11 and 12 show another embodiment of the LED module. FIG. 11 shows a mounting type LED module 50, FIG. 11A is a perspective view of the LED module 50, FIG. 11B is a plan view, and FIG. ) Is a side view, and (d) is a cross-sectional view of a mounted LED. The basic configuration of the LED module 50 shown in FIG. 11 is the same as that of the LED module 10 shown in FIG. 2, and the same elements are denoted by the same reference numerals, and redundant description is omitted. The difference between the LED module 10 and the LED module 50 is that the LED 11 mounted on the LED module 10 is a single LED, whereas the LED mounted on the LED module 50 is an element substrate as shown in FIG. This is a mounting LED 51 mounted on 52 and further sealed with a sealing resin 53.

  This structure can be used for both the LED lamp 10L of the first embodiment and the LED lamp 20L of the second embodiment. In the case of the mounted LED 51, a blue LED is used as the LED 11, and the sealing resin 53 is used. By adopting YAG fluorescent resin, it can be used as a white light emitting device.

  FIG. 12 shows a wire-mounted LED module 60, FIG. 12 (a) is a perspective view of the LED module 60, (b) is a plan view, and (c) is a side view. The basic configuration of the LED module 60 shown in FIG. 12 is the same as that of the LED module 10 shown in FIG. 2, and the same elements are denoted by the same reference numerals, and redundant description is omitted. The difference between the LED module 10 and the LED module 60 is that the LED 11 mounted on the LED module 10 is an FC mounting type LED, whereas the LED 61 mounted on the LED module 60 is a wire bonding type LRD. 12 (a) and 12 (b), an LED 61 having an electrode on the upper surface is bonded to the element mounting portion 15a of the support column 15 in the opposite direction, and connected to the two metal members 13 constituting the support column 15 by wires 62. doing. This LED module 60 can also be employed in both the LED lamp 10L of the first embodiment and the LED lamp 20L of the second embodiment.

  In each embodiment of the present invention, the lamp shape is a spherical shape similar to that of a conventional light bulb, but is not limited to this, and naturally includes a lamp shape such as a cylindrical shape or a rectangular shape. is there. In addition to being a material with good thermal conductivity for dissipating the heat generated by the LDE, the metal member must be a material with excellent bonding properties for mounting the LED. A metal film having good bonding properties may be plated on the surface.

2,102 Base part 3 Body part 5 Transparent cover 6 Power supply part 7 Connector 10, 30, 40, LED module 100, 200, 300 LED module 10L, 20L, 30L, 40L, LED lamp 100L, LED lamp 11, 111, 211 , 311 LED
11a, 11b Mounting electrode 13, 203, 303 Metal member 14, 104, 204, 304 Insulating member 15, 45 Support column 15a, 45a Element mounting portion 15b, 45b Support portion 21 Circuit board 22 Wiring electrode 23 Solder 51 Mounting LED
52 Element substrate 53 Sealing resin 61 Wire mounted LED
62 Wire 103 Heat radiation part 105 Transparent resin 112 Module substrate 113 Lead electrode 205, 305 Laminate

Claims (7)

  In an LED lamp having a main body portion, a transparent cover attached to the upper surface of the main body portion, and a base portion attached to the lower surface of the main body portion, at least two rectangular metal members are sandwiched between insulating members. The support pillars are formed integrally with each other, the upper part of the support pillar is an element mounting part for mounting the LED, the lower part of the support pillar is a support part, and the element mounting part of the support pillar is sandwiched with an insulating member An LED lamp, wherein the LED is electrically attached to two metal members, and the support portion of the support pillar is connected and fixed to a power supply portion built in the main body portion.   The LED lamp according to claim 1, wherein the LED is mounted on two opposing surfaces of an element mounting surface formed by two metal members sandwiching an insulating member in the element mounting portion of the support pillar.   The LED lamp according to claim 2, wherein the number of LEDs mounted on two opposing surfaces of the element mounting portion of the support pillar is different.   The LED lamp according to any one of claims 1 to 3, wherein an LED is also mounted on an upper surface portion of an element mounting portion of the support pillar.   The LED lamp according to claim 1, wherein the element mounting portion is inclined with respect to the support portion of the support pillar.   The LED lamp according to any one of claims 1 to 5, wherein the LED has an LED package configuration mounted on a mounting substrate having two connection electrodes. The LED lamp has a metal main body, a transparent cover attached to the upper surface of the main body, and a base attached to the lower surface of the main body, and is a power supply built in the main body. 7. The LED lamp according to claim 1, wherein a support portion of the support pillar is inserted and fixed, and an element mounting portion of the support pillar is disposed in the transparent cover.