JP2013089464A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC socket which prevents contact failure due to warpage of an inspection object device and dimensional tolerance of an external terminal.SOLUTION: An IC socket 100 includes multiple pogo pins 3 which contact solder balls 67 of a semiconductor device 51. The pogo pins 3 respectively have upper end surfaces 4, which contact with the solder balls 67 and has taper shapes, and taper directions of the taper shapes may be different between the adjacent pogo pins 3.

Description

  The present invention relates to an IC socket.

  2. Description of the Related Art In recent years, with the miniaturization and high performance of electronic devices, the density and the number of pins of semiconductor devices used in electronic devices are increasing.

  For this reason, a structure such as a BGA (Ball Grid Array) in which metal balls such as solder balls as external terminals are arranged in a lattice pattern on the back surface of the semiconductor device may be used as a connection structure between the semiconductor device and the substrate.

  On the other hand, when performing product inspection such as energization inspection of a semiconductor device having a BGA structure, a dedicated IC socket including a contact member such as a pogo pin having an array shape corresponding to the array of metal balls is required. .

  As such an IC socket, for example, as described in Patent Document 1, pogo pins are arranged on a plate so as to be arranged corresponding to an external terminal of a BGA, and a semiconductor device having a BGA structure is mounted on a carrier. However, there is one in which a pogo pin and a metal ball are brought into contact by combining a carrier with a plate (Patent Document 1).

  At this time, in Patent Document 1, the contact portions of the pogo pins at the four corners are tapered for positioning the pogo pins and the metal balls.

JP 2003-294808 A

  However, in the structure of Patent Document 1, it is necessary to prepare a pogo pin having a taper at four corners, other pogo pins and two types of pogo pins, which increases the cost of the socket and makes maintenance difficult. There was a fear.

  In particular, in recent years, the progress of multilayering of chips due to improved integration, the accompanying increase in the number of metal balls, and the small diameter / narrow pitch, the effect of BGA warpage and positional deviation due to ball diameter tolerance on inspection. Has become prominent.

  That is, as the number of metal balls increases and the diameter / narrow pitch decreases, the number of pogo pins on the IC socket side also increases and the diameter / narrow pitch decreases, so the allowable positional deviation decreases.

  However, even if the four corners of the semiconductor device can be aligned in the structure of Patent Document 1, it is difficult to absorb the positional deviation due to the BGA warp and the ball diameter tolerance.

  Therefore, depending on the degree of BGA warpage and the tolerance of the ball diameter, there is a risk of poor contact between the pogo pin and the metal ball due to the positional deviation between the metal ball and the pogo pin, or the metal ball may be damaged by the pogo pin. It was.

  The present invention has been made in view of such problems, and an object of the present invention is to provide an IC socket capable of preventing poor contact due to warpage of a device to be inspected and dimensional tolerance of an external terminal.

  In order to achieve the above-described object, a first aspect of the present invention includes a plurality of contact members that contact an external terminal of a semiconductor device, and the plurality of contact members have a tapered shape at a portion that contacts the external terminal. The IC socket is characterized in that the taper-shaped taper direction differs between adjacent contact members.

  ADVANTAGE OF THE INVENTION According to this invention, the IC socket which can prevent the contact failure by the curvature of a to-be-inspected apparatus and the dimensional tolerance of an external terminal can be provided.

It is an exploded sectional view showing IC socket 100, and pogo pin 3 is indicated by a side view. It is an enlarged view of the pogo pin 3 of FIG. It is a perspective view of the pogo pin 3 of FIG. 2 is a cross-sectional view showing a semiconductor device 51. FIG. 5 is a diagram showing a procedure for inspecting a semiconductor device 51 using an IC socket 100. FIG. 5 is a diagram showing a procedure for inspecting a semiconductor device 51 using an IC socket 100. FIG. 5 is a diagram showing a procedure for inspecting a semiconductor device 51 using an IC socket 100. FIG. 5 is a diagram showing a procedure for inspecting a semiconductor device 51 using an IC socket 100. FIG. 5 is a diagram showing a procedure for inspecting a semiconductor device 51 using an IC socket 100. FIG. 5 is a diagram showing a procedure for inspecting a semiconductor device 51 using an IC socket 100. FIG. It is sectional drawing which shows IC socket 100a, Comprising: The pogo pin 3 is described with the side view. It is sectional drawing which shows IC socket 100b, Comprising: The pogo pin 3 is described with the side view.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail based on the drawings.

  First, a schematic configuration of an IC socket 100 according to an embodiment of the present invention will be described with reference to FIG.

  Here, as the IC socket 100, an IC socket for inspecting a semiconductor device 51 (device to be inspected) having a BGA structure is disclosed.

  As shown in FIG. 1, the IC socket 100 includes a socket guide 5 having a pogo pin 3 as a contact member, an inserter 7 provided so as to be connectable to the socket guide 5 and on which a semiconductor device 51 is mounted, a socket guide 5, and The pusher 9 is provided so as to be connectable to the inserter 7 and presses the semiconductor device 51.

  Next, with reference to FIGS. 1 to 3, the members constituting the IC socket 100 and the structure of the semiconductor device 51 mounted on the IC socket 100 will be described in detail.

  First, the structure of the socket guide 5 will be described with reference to FIGS.

  As shown in FIG. 1, the socket guide 5 has a rectangular plate-shaped socket guide main body 21, and the socket guide main body 21 has a concave portion 23 having a square cross section on one surface.

  In the recess 23, a plurality of pogo pins 3 are arranged in a grid at predetermined intervals so as to correspond to the terminal arrangement of external terminals (solder balls 67 described later) of the semiconductor device 51.

  The pogo pin 3 is configured such that one end thereof is exposed in the recess 23 and the other end is exposed on the other surface side of the socket guide main body 21.

  On the other hand, columnar guide pins 27 for connecting the inserter 7 and the pusher 9 to the socket guide 5 are provided at the four corners of the socket guide body 21.

  A recess 27 a is provided at the tip of the guide pin 27.

  Here, with reference to FIG. 2 and FIG. 3, the shape and arrangement | positioning of the pogo pin 3 are demonstrated more concretely.

  As shown in FIGS. 2 and 3, the upper end surface 4 of the pogo pin 3 has a tapered shape.

  That is, the pogo pin 3 is columnar (cylindrical) and has a shape in which the normal direction 8 of the upper end surface 4 that is a plane is inclined with respect to the central axis 6 of the cylinder.

  2 and 3, the shape of the pogo pins 3 (the height, diameter, shape of the upper end surface 4 and inclination angle) of the pogo pins 3 are all equal, but the direction of the tapered shape of the adjacent pogo pins 3 In this case, the taper surface (upper end surface 4) is inclined differently (the directions of the adjacent pogo pins 3 are different in FIGS. 2 and 3).

  Specifically, in FIG. 2 and FIG. 3, the pogo pin 3 includes a pogo pin 3a having an inclination direction A1, a pogo pin 3b having an A2 direction, a pogo pin 3c having an A3 direction, and a pogo pin 3d having an A4 direction. The inclination direction has four directions as a whole.

  Among these, the directions of A1 and A2, and the directions of A3 and A4 are parallel to each other and differ only in direction, and are so-called opposite directions (first directions).

  On the other hand, the directions of A1 and A2 and the directions of A3 and A4 intersect with each other (the direction orthogonal to the second direction in FIG. 3).

  That is, the direction of inclination is perpendicular to the direction facing each other, and when viewed from above, the direction corresponds to the direction of the XY axes of the plane coordinates (for example, the direction of A1 and A2 is the direction of the X axis) , A3, and A4 are in the Y-axis direction).

  2 and 3, only the arrangement of the directions of A1 and A2 is shown, but since the pogo pins 3 are arranged in a lattice shape as described above, the directions of A3 and A4 are also A1, A2 Similar to the direction, the taper shape of the adjacent pogo pins 3 is different (or all different).

  Although the details will be described later, the tapered surface (upper end surface 4) is a portion in contact with the external terminal (solder ball 67) of the semiconductor device 51 to be inspected.

  The above is a specific description of the shape and arrangement of the pogo pins 3.

  Next, the structure of the inserter 7 will be described with reference to FIG.

  As shown in FIG. 1, the inserter 7 has a rectangular plate-like inserter main body 31, and an opening 35 having a square cross-sectional shape that accommodates the semiconductor device 51 is provided in the center of the inserter main body 31. .

  The opening 35 is formed in a tapered shape so as to increase from the lower surface side to the upper surface side of the inserter body 31, and the semiconductor device 51 is mounted on the lower surface side so as to protrude from the side surface of the opening 35. A product mounting portion 37 is provided.

  The periphery of the opening 35 on the lower surface side of the inserter body 31 forms a protrusion 33.

  Furthermore, guide pin holes 39 into which the guide pins 27 are inserted are provided at the four corners of the inserter body 31 at positions corresponding to the guide pins 27.

  The inner diameter of the guide pin hole 39 is formed larger than the outer diameter of the guide pin 27.

  Next, the structure of the pusher 9 will be described with reference to FIG.

  As shown in FIG. 1, the pusher 9 has a plate-like pressing portion 41 whose center protrudes, and the periphery of the pressing portion 41 forms a flange portion 43 that is thinner than the pressing portion 41.

  Pusher pins 45 are provided at positions corresponding to the guide pins 27 at the four corners of the flange portion 43.

  The shape of the pusher pin 45 has a shape corresponding to the depression 27a of the guide pin 27, and the pusher pin 45 can be inserted into the depression 27a.

  Next, the structure of the semiconductor device 51 will be described with reference to FIG.

  As shown in FIG. 4, the semiconductor device 51 includes a semiconductor chip 57 in which a predetermined circuit, for example, a logic circuit such as a microprocessor or a storage circuit is formed on one surface of a substrate such as Si.

  The semiconductor chip 57 is provided with a plurality of electrode pads 61 on the outer periphery of the surface.

  The semiconductor chip 57 is mounted on one surface of a rectangular plate-like wiring substrate 53 through a fixing member 55 that is an insulating adhesive or DAF (Die Attached Film) on the back surface side.

  The wiring substrate 53 has a plurality of connection pads 59 corresponding to the electrode pads 61 of the semiconductor chip 57 on one surface, and a plurality of lands 65 corresponding to the connection pads 59 are provided on the other surface.

  The connection pad 59 and the land 65 are electrically connected by an internal wiring 69.

  The electrode pads 61 of the semiconductor chip 57 and the connection pads 59 of the wiring substrate 53 are connected by a conductive wire 63 such as Au.

  Furthermore, a sealing resin 71 formed so as to cover at least the semiconductor chip 57, the wires 63, and the connection pads 59 is disposed on one surface of the wiring substrate 53.

  As the sealing resin 71, a thermosetting resin, for example, an epoxy resin is used.

  In addition, metal balls such as solder balls 67 are mounted on lands 65 formed on the other surface of the wiring board 53 to form external terminals.

  Next, an inspection method of the semiconductor device 51 using the IC socket 100 will be described with reference to FIGS.

  First, the semiconductor device 51 to be inspected is taken out from a product tray (not shown), inserted into the opening 35 of the inserter 7 and mounted on the product mounting portion 37 as shown in FIG.

  When the semiconductor device 51 is mounted on the inserter 7, the inserter 7 is preheated by a preheating unit (not shown).

  Next, as shown in FIG. 6, the socket guide 5 is mounted on the test board 81, and the lower end of the pogo pin 3 exposed from the lower end of the socket guide 5 is electrically connected to the wiring pattern 83 of the test board 81.

  Next, by inserting the guide pin 27 of the socket guide 5 into the guide pin hole 39 of the inserter 7, the preheated inserter 7 is mounted on the socket guide 5 and connected.

  In this state, the solder ball 67 and the pogo pin 3 are in contact.

  Next, as shown in FIG. 7, the pusher 9 located at the upper part of the socket guide 5 is lowered and contacts the inserter 7 and the semiconductor device 51, and these are pressed down to the pogo pin 3 side.

  At this time, the pusher pin 45 is inserted into the recess 27a (see FIG. 1) of the guide pin 27, and the socket guide 5 and the pusher 9 are connected.

  In this state, the solder ball 67 and the pogo pin 3 are fixed in contact with each other and are electrically connected.

  In this state, when a current flows from the test board 81 to the semiconductor device 51 through the pogo pin 3, a predetermined inspection is performed.

  Here, the details when the solder balls 67 and the pogo pins 3 come into contact will be described with reference to FIGS.

  First, when the solder ball 67 and the pogo pin 3 are in contact with each other, it is assumed that there is a displacement between the solder ball 67 and the pogo pin due to warpage of the semiconductor device 51 and dimensional tolerance of the solder ball 67 as shown in FIG. .

  Specifically, in this example, the center axis of the solder ball 67 has a positional deviation 89 in the direction of A1 with respect to the center axis of the pogo pin 3.

  In this case, when the solder ball 67 and the pogo pin 3 start to contact, the solder ball 67 slides down the upper end surface 4 of the pogo pin 3b in which the upper end surface 4 is inclined in the direction A2 in the pogo pin 3, as shown in FIG. As shown in FIG. 10, the solder balls 67 and the pogo pins 3 are guided to positions where they are evenly contacted (positions in which the central axes coincide with each other in FIG. 10).

  If the solder ball 67 is misaligned in the direction of A2, it is guided in the direction of A1 by the pogo pin 3a.

  If the solder ball 67 is misaligned in the direction of A3, the solder ball 67 is guided in the direction of A4 by the pogo pin 3d.

  Further, when the solder ball 67 is displaced in the direction of A4, it is guided in the direction of A3 by the pogo pin 3c.

  In this way, even if the solder ball 67 is misaligned in any direction, it is guided by any of the pogo pins 3a, 3b, 3c, and 3d, and the misalignment is absorbed.

  In addition, by providing the pogo pins 3a, 3b, 3c, and 3d having different inclination directions in this way, individual solder balls 67 are displaced in an arbitrary direction due to warpage of the semiconductor device 51 and dimensional tolerance of the external terminals. Even in such a case, the individual solder balls 67 are guided so as to contact evenly.

  Therefore, the IC socket 100 not only facilitates the alignment of the pogo pins 3a, 3b, 3c, and 3d and the solder balls 67, but can also prevent poor contact due to warpage of the semiconductor device 51 and dimensional tolerance of the external terminals.

  Further, the IC socket 100 is not much different from the existing IC socket in the components other than the shape and orientation of the tip of the pogo pin.

  Therefore, the IC socket 100 can be manufactured without making a significant design change to the existing IC socket, and an increase in manufacturing cost can be suppressed.

  Furthermore, the pogo pins 3a, 3b, 3c and 3d have the same shape except for the inclination direction.

  Therefore, there is only one kind of pogo pin 3 and it is not necessary to prepare pogo pins for alignment and connection separately. Therefore, the IC socket 100 suppresses cost increase and deterioration of maintainability due to the provision of the pogo pin 3. Can do.

  2 and 3, the pogo pin 3 has four inclination directions (two directions), but due to the positional accuracy of the solder balls 67 of the semiconductor device 51, there is only one direction that may cause a positional deviation. In this case, the direction of the taper of the pogo pin 3 may be only two directions facing each other.

  For example, in the case where only the directions of A1 and A2 are likely to cause misalignment, all the pogo pins 3 may be only the pogo pins 3a and 3b as in the IC socket 100a shown in FIG.

  In addition, when the direction in which the positional deviation may occur is only the direction of A3 and A4, all the pogo pins 3 may be only the pogo pins 3c and 3d as in the IC socket 100b shown in FIG.

  Finally, when the test is completed, the pusher 9 moves upward, whereby the IC socket 100 is opened and the inserter 7 is taken out from the socket guide 5.

  Further, after the inserter 7 returns to room temperature, the semiconductor device 51 is taken out from the inserter 7 and the test of the semiconductor device 51 is completed.

  Thus, according to the present embodiment, the IC socket 100 has the pogo pin 3 whose upper end surface 4 has a tapered shape, and the pogo pin 3 has a taper direction that differs between adjacent pogo pins 3. Has been placed.

  For this reason, it is possible to prevent contact failure due to warpage of the semiconductor device 51 and dimensional tolerance of the external terminals.

  In the embodiment described above, the case where the present invention is applied to the inspection socket of the semiconductor device 51 having the BGA structure has been described. However, the present invention is not limited to this, and the inspection of the semiconductor device having another structure is possible. It can also be applied to sockets.

3 pogo pin 3a pogo pin 3b pogo pin 3c pogo pin 3d pogo pin 4 upper end surface 5 socket guide 6 central axis 7 inserter 8 normal direction 9 pusher 21 socket guide main body 23 concave portion 27 guide pin 31 inserter main body 33 protruding portion 35 opening 37 product mounting portion 39 Guide pin hole 41 Press part 43 Flange part 45 Pusher pin 51 Semiconductor device 53 Wiring board 55 Fixing member 57 Semiconductor chip 59 Connection pad 61 Electrode pad 63 Wire 65 Land 67 Solder ball 69 Internal wiring 71 Sealing resin 81 Test board 83 Wiring pattern 89 Misalignment 100 IC socket 100a IC socket 100b IC socket

Claims (5)

Provided with a plurality of contact members that contact the external terminals of the semiconductor device,
The plurality of contact members have taper portions in contact with the external terminals,
An IC socket, wherein the taper-shaped taper has a different direction between adjacent contact members.   2. The IC socket according to claim 1, wherein the taper-shaped taper directions are all different between adjacent contact members. 3.   3. The IC socket according to claim 1, wherein the plurality of contact members are formed to have an equal taper shape. 4.   The IC socket according to any one of claims 1 to 3, wherein the taper has a first direction in which tapered surfaces face each other.   5. The IC socket according to claim 4, wherein the taper direction further has a second direction in which the first direction and the tapered surface are orthogonal to each other.

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