JP2013082085A - Thermal transfer molding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermal transfer molding device which can save equipment costs required for a molding device which performs thermal transfer molding under a vacuum (pressure-reduced) condition, and can improve productivity per time by achieving continuous production.SOLUTION: The thermal transfer molding device includes: a conveyance molding unit 10 for depressurizing and conveying a material to be processed; an auxiliary heating part 30 for secondarily heating the material to be processed in the conveyance molding unit; a pressurizing thermal molding part 40 for holding the conveyance molding unit, and heat-molding the material to be processed at higher pressure in comparison with the auxiliary heating part; a pressurizing cooling part 50 for cooling the material to be processed in the conveyance molding unit; an auxiliary cooling part 60 for holding the conveyance molding unit secondarily cooling the material to be processed at lower pressure in comparison with the pressurizing cooling part; a carry-out part 70 for depressurizing the inside of the conveyance molding unit through a deairing part and carrying out the conveyance molding unit toward the auxiliary heating part; a carry-in part 80 for receiving the conveyance molding unit from the auxiliary cooling part and separating the conveyance molding unit; and a conveyance device 100 which includes a connection part 110 and conveys the conveyance molding unit in the order in which each of the parts is arranged, and places the conveyance molding unit in a predetermined position.

Description

  The present invention relates to a thermal transfer molding apparatus, and more particularly to a thermal transfer molding apparatus that performs molding by moving a unit that accommodates the workpiece itself rather than moving the workpiece itself.

  In a thermal transfer molding apparatus for transferring a mold surface to a workpiece made of thermoplastic resin or the like, the workpiece is placed on a fixed side member having a hot plate, and a movable hot plate is provided for the fixed side member. The movable member is advanced, and the workpiece is heated and pressed by pressing from both sides. As such an apparatus for thermal transfer molding, for example, an apparatus has been proposed in which a vacuum chamber is formed when the movable side member moves forward, and a workpiece is heated and pressurized (thermal transfer press) in a reduced pressure state (for example, Patent Documents). 1, see Patent Document 2). In the thermal transfer press apparatus disclosed in Patent Documents 1 and 2 and the like, since the vacuum state is set during molding, the stamper is in close contact with the workpiece, which is particularly convenient for molding a precise and fine surface shape.

  In the case of the apparatus described in the above-mentioned patent document and the like, since the pressure is reduced during molding, both the heating and pressurization and the cooling and pressurization for the workpiece are performed in a pair of press apparatuses. That is, for heating and pressurization, water vapor or the like is passed through a flow path formed on the press platen behind the stamper that transfers the mold surface to the workpiece. Further, during cooling and pressurization, cold water or the like is sent through the same flow path. Once the inside of the apparatus is in a reduced pressure state for molding, the workpiece is not taken out of the apparatus, and the temperature rise and fall are repeated on the press board side while the crimped state is maintained.

  Since it is necessary to perform heating and pressurization and cooling and pressurization under a predetermined set temperature condition corresponding to the workpiece, a preparation time for adjusting the temperature of the press panel is inevitably generated between the processes. Therefore, considering the improvement of the processing capacity per unit time due to the continuation of work, the demand is not always met. In addition, when trying to improve the processing capacity with the conventional apparatus, the number of apparatuses and devices is increased. For this reason, there is a problem that capital investment increases.

  Therefore, in a molding machine that performs thermal transfer molding under vacuum (reduced pressure) conditions, molding that can improve productivity per hour by compressing the equipment cost required for the equipment and enabling continuous production. A device was desired.

JP 2006-167788 A JP 2008-155521 A

  The present invention has been made in view of the above points, and reduces the equipment cost required for a molding apparatus that performs thermal transfer molding under vacuum (reduced pressure) conditions, thereby enabling continuous production. It is an object of the present invention to provide a thermal transfer molding apparatus that can improve the performance.

  That is, the invention according to claim 1 accommodates the workpiece, the upper stamper and the lower stamper that are in close contact with the upper and lower surfaces of the workpiece, the upper stamper, the workpiece, and the lower stamper in this order. An upper housing member, a lower housing member, and a deaeration part that depressurizes the inside of the housing space formed by joining the upper housing member and the lower housing member, and can be conveyed while maintaining a decompressed state. The conveyance molding unit includes a conveyance molding unit and a pair of upper and lower auxiliary heating platens. The conveyance molding unit is sandwiched between the auxiliary heating platen parts, and pressurized and auxiliary heated with respect to the conveyance molding unit. An auxiliary heating unit for auxiliary heating of the work material within and a front side of the auxiliary heating unit, and a pair of upper and lower heating platen parts are provided, and the conveyance molding unit is sandwiched between the heating platen parts. A pressurization thermoforming unit that pressurizes and heats the transport molding unit at a pressure higher than that of the auxiliary heating unit to heat mold the workpiece in the transport molding unit, and the pressurization thermoforming Arranged on the front side of the section, and provided with a pair of upper and lower cooling disk parts, sandwiching the conveyance molding unit between the cooling disk parts and pressurizing and cooling the conveyance molding unit, A pressure cooling unit that cools the workpiece, and a pair of upper and lower auxiliary cooling disk units that are disposed on the front side of the pressure cooling unit, and sandwich the transport molding unit between the auxiliary cooling disk units. And an auxiliary cooling unit that cools the conveyance molding unit while being pressurized with a pressure lower than that of the pressure cooling unit, and auxiliary cooling the workpiece in the conveyance molding unit, and behind the auxiliary heating unit An unloading unit that is disposed in the chamber and depressurizes the accommodation space through the deaeration unit of the conveyance molding unit that accommodates a workpiece, and is placed at a standby position and unloads the conveyance molding unit toward the auxiliary heating unit A carry-in portion that is disposed on the front side of the auxiliary cooling unit and receives the transfer molding unit carried in from the auxiliary cooling unit and separates the transfer molding unit; and a connection portion connected to the transfer molding unit. The transport molding unit connected to the connection unit is transported in the order of arrangement as the carry-out unit, the auxiliary heating unit, the pressure thermoforming unit, the pressure cooling unit, the auxiliary cooling unit, and the carry-in unit. The transfer molding unit connected to the connection part is located between the auxiliary heating board parts, between the heating board parts, between the cooling board parts, and between the auxiliary cooling board parts. The present invention relates to a thermal transfer molding apparatus characterized by having a conveying device placed at a fixed position.

  According to a second aspect of the present invention, in the carrying-in portion, the workpiece that has been molded from the conveyance molding unit is taken out, and the workpiece before molding is mounted in the conveyance molding unit. According to the described thermal transfer molding apparatus.

  A third aspect of the present invention relates to the thermal transfer molding apparatus according to the second aspect, further comprising a return device that returns the transport molding unit that accommodates the workpiece before molding from the carry-in portion toward the carry-out portion.

  According to a fourth aspect of the present invention, a return roller conveyor is included in the return device, and the return roller conveyor includes the auxiliary heating platen of the auxiliary heating unit, the heating platen of the pressure thermoforming unit, and the additional heating unit. The thermal transfer molding apparatus according to claim 3, wherein the thermal transfer molding apparatus is laid immediately below the cooling platen of the pressure cooling unit and the auxiliary cooling platen of the auxiliary cooling unit.

  According to a fifth aspect of the present invention, the transport device includes a transport roller conveyor, a moving beam member including a plurality of the connection portions, and a driving unit that drives the moving beam member to move forward and backward. The thermal transfer molding apparatus according to the item.

  According to a sixth aspect of the present invention, the moving beam member includes the transfer molding unit mounted on the carry-out unit, the auxiliary heating unit, the pressure thermoforming unit, the pressure cooling unit, and the auxiliary cooling unit. The transfer device is placed on the carry-out part, the auxiliary heating part, the pressure thermoforming part, the pressure cooling part, and the auxiliary cooling part. 6. Any one of claims 1 to 5, wherein the transport molding units are transported and placed on the auxiliary heating unit, the pressure thermoforming unit, the pressure cooling unit, the auxiliary cooling unit, and the carry-in unit in a lump. The thermal transfer molding apparatus according to claim 1.

  According to a seventh aspect of the present invention, in the conveyance molding unit, the pressure is reduced through the deaeration unit in any of the auxiliary heating unit, the pressure thermoforming unit, the pressure cooling unit, and the auxiliary cooling unit. 7. The thermal transfer molding apparatus according to any one of 1 to 6.

  The invention according to claim 8 is the method according to any one of claims 1 to 7, wherein the transfer molding unit is supplied with air through the deaeration unit after the auxiliary cooling is completed in the auxiliary cooling unit, and the inside of the accommodation space is pressurized. The thermal transfer molding apparatus according to Item 1.

  According to the thermal transfer molding apparatus of the invention of claim 1, the workpiece, the upper stamper and the lower stamper that are in close contact with the upper and lower surfaces of the workpiece, the upper stamper, the workpiece, and the lower stamper An upper housing member and a lower housing member that are housed in order, and a deaeration section that decompresses the housing space formed by the joining of the upper housing member and the lower housing member, while maintaining a decompressed state A conveyance molding unit that enables conveyance, an auxiliary heating unit that sandwiches the conveyance molding unit between the auxiliary heating disk units, pressurizes and auxiliary heats, and auxiliary heats the workpiece in the conveyance molding unit; A pressure thermoforming section that sandwiches the transport molding unit between heating platens and pressurizes and heats the workpiece in the transport molding unit by pressurizing and heating at a higher pressure than the auxiliary heating section; and cooling The conveyance molding unit is sandwiched between the auxiliary cooling disk units, and the pressure cooling unit that sandwiches the conveyance molding unit between the parts and pressurizes and cools to cool the workpiece in the conveyance molding unit. An auxiliary cooling unit that sandwiches and pressurizes at a lower pressure than the pressure cooling unit and auxiliary cools the workpiece in the conveyance molding unit, and is disposed behind the auxiliary heating unit, and passes through the deaeration unit The decompression unit performs pressure reduction in the housing space and is placed at a standby position, and is disposed on the front side of the auxiliary cooling unit, and is carried in from the auxiliary cooling unit. A carry-in portion that receives the transfer molding unit and separates the transfer molding unit; and a connection portion that connects to the transfer molding unit, and the transfer molding unit that is connected to the connection portion is connected to the carry-out portion. The auxiliary heating unit, the pressure thermoforming unit, the pressure cooling unit, the auxiliary cooling unit, and the carry-in unit are conveyed in the order of arrangement, and the conveyance molding unit connected to the connection unit is transferred to the auxiliary heating panel. Parts between the heating plates, between the heating plates, between the cooling plates, and between the auxiliary cooling plates, and a transfer device placed at a predetermined position. It is possible to improve productivity per hour by compressing the equipment cost required for a molding apparatus that performs thermal transfer molding underneath and enabling continuous production.

  According to the thermal transfer molding apparatus according to the invention of claim 2, in the invention of claim 1, in the carry-in portion, the removal of the workpiece after molding from the conveyance molding unit and the conveyance of the workpiece before molding are performed. Since the mounting in the molding unit is performed, the removal of the workpiece and the new attachment are concentrated in the carry-in part, so that the work efficiency is improved. Also, the number of places required for work can be reduced.

  According to a thermal transfer molding apparatus according to a third aspect of the present invention, in the second aspect of the invention, the apparatus includes a return device that returns the transport molding unit containing the workpiece before molding from the carry-in portion toward the carry-out portion. Therefore, circulation of the conveyance molding unit is facilitated, and processing can be continued.

  According to the thermal transfer molding apparatus according to the invention of claim 4, in the invention of claim 3, the return device includes a return roller conveyor, and the return roller conveyor includes the auxiliary heating unit of the auxiliary heating unit, Since it is laid directly under the heating platen of the pressure thermoforming unit, the cooling platen of the pressure cooling unit, and the auxiliary cooling platen of the auxiliary cooling unit, it is placed over the side of the thermal transfer molding device. Without this, the installation place in the thermal transfer molding device can be saved.

  According to a thermal transfer molding apparatus according to a fifth aspect of the present invention, in the invention according to any one of the first to fourth aspects, the conveying device includes a conveying roller conveyor, a moving beam member including a plurality of the connecting portions, and the moving beam member. Therefore, the mechanism required for transporting the transport molding unit can be made relatively simple.

  According to a thermal transfer molding apparatus according to a sixth aspect of the present invention, in the invention according to any one of the first to fifth aspects, the moving beam member includes the carry-out section, the auxiliary heating section, the pressure thermoforming section, and the pressurizing section. The transport unit has a length that enables the transport unit formed on the cooling unit and the auxiliary cooling unit to be held together, and the transport device includes the carry-out unit, the auxiliary heating unit, and the pressurized heat. The auxiliary heating unit, the pressurization thermoforming unit, the pressurization cooling unit, and the auxiliary cooling unit collectively for each conveyance molding unit mounted on the forming unit, the pressurization cooling unit, and the auxiliary cooling unit. In addition, since the moving beam member is transported and placed in the carry-in portion, the moving beam member can be transported by one forward movement, and the transport efficiency of the transport molding unit in the thermal transfer molding apparatus is increased.

  According to the thermal transfer molding apparatus according to the invention of claim 7, in the invention of any one of claims 1 to 6, the conveyance molding unit includes the auxiliary heating unit, the pressurization thermoforming unit, the pressurization cooling unit, and In any of the auxiliary cooling units, the pressure is reduced through the deaeration unit, so that the degree of vacuum can be constantly increased prior to molding and cooling. Further, molding and cooling with pressurization can be performed while always ensuring a certain degree of vacuum, and molding quality can be improved by avoiding molding defects and misalignment between the workpiece and the stamper.

  According to the thermal transfer molding apparatus according to an eighth aspect of the present invention, in the invention according to any one of the first to seventh aspects, the conveyance molding unit is supplied with air through the deaeration unit after completing the auxiliary cooling in the auxiliary cooling unit. Since the inside of the housing space is pressurized, the air injected into the housing space enters between the upper and lower parts of the processed workpiece and separates the stamper and the workpiece from the conveyance molding unit. Demolding can be performed relatively smoothly.

1 is a schematic perspective view of a thermal transfer molding apparatus according to an embodiment of the present invention. It is a whole perspective view of a conveyance molding unit. It is a schematic sectional drawing of a conveyance molding unit. 1 is an overall side view of a thermal transfer molding apparatus. It is a front view of a pressurization thermoforming part. It is the elements on larger scale near the conveyance apparatus of the pressurization thermoforming part of FIG. It is a partial expansion perspective view of the connection part of a conveying apparatus. It is the elements on larger scale near the drive part of a conveyance apparatus. It is a 1st side surface schematic diagram of a thermal transfer molding device. It is a 2nd side surface schematic diagram of a thermal transfer molding apparatus. It is the graph which showed the history of pressure and temperature.

  A thermal transfer molding apparatus 1 shown in the schematic perspective view of FIG. 1 is configured such that a pattern is formed on the surface thereof by applying heat and pressure to a surface layer of a workpiece W (see FIG. 3) made of a thermoplastic resin such as PMMA or polycarbonate. It is an apparatus for forming. The workpiece W after molding is used as a light guide plate for a backlight mounted on various display devices such as a liquid crystal display. Alternatively, it is also used as a plate for LED illumination diffusion or light guide.

  In the thermal transfer molding method using the thermal transfer molding apparatus 1 of the present invention, the workpiece W is not conveyed by itself and sequentially heated and molded. The workpiece W is accommodated in the conveyance molding unit 10 disclosed in FIGS. 2 and 3, and the workpiece W accommodated in the conveyance molding unit 10 is sequentially conveyed by the conveyance molding unit 10. On the other hand, heating and pressurization are performed. Hereinafter, the configuration of the thermal transfer molding apparatus 1 of the present invention will be described.

  In the thermal transfer molding apparatus 1 grasped from FIG. 1, the carry-out unit 70, the auxiliary heating unit 30, the pressure thermoforming unit 40, the pressure cooling unit 50, the auxiliary cooling unit 60, and the carry-in in accordance with the advance order of the conveyance molding unit 10. The parts 80 are arranged in the same straight line. The transport molding unit 10 is transported in the forward direction by the transport device 100. After the conveyance molding unit 10 is sequentially fed from the carry-out unit 70 and reaches the carry-in unit 80, the internal workpiece W is replaced and returned to the carry-out unit 70 by the return device 94. In FIG. 1, reference numeral 71 is a carry-out unit lifting plate, 72 is a carry-out unit upper stage, 73 is a carry-out unit lower stage, 81 is a carry-in unit lift plate, 82 is a carry-in unit upper stage, 83 is a carry-in unit lower stage, 91 is an extrusion device, Reference numeral 95 is a return roller conveyor, 101 is a moving beam member, and 110 is a connecting portion.

  The conveyance molding unit 10 will be described with reference to FIGS. The conveyance molding unit 10 is formed of an upper housing member 13 and a lower housing member 14. The entire central portion of the upper housing member 13 is an upper base plate portion 21, and an upper base frame portion 23 is provided around the entire periphery thereof. Similarly, the entire central portion of the lower housing member 14 is a lower base plate portion 22, and a lower base frame portion 24 is provided around the entire periphery thereof. The upper base plate portion 21 and the lower base plate portion 22 receive pressurization, heating, and cooling from the auxiliary heating board portions 31, 32 and the like after the auxiliary heating portion 30. Therefore, it forms from members excellent in thermal conductivity, such as a metal plate.

  When the workpiece W is accommodated in the conveyance molding unit 10, the upper stamper 11 that is in close contact with the upper surface Wa of the workpiece W and the lower stamper 12 that is in close contact with the lower surface Wb of the workpiece W are provided. Is also sandwiched at the same time. Therefore, as shown in FIG. 3A, the upper stamper 11, the workpiece W, and the lower stamper 12 are maintained between the upper housing member 13 and the lower housing member 14 while maintaining the vertical order. It is accommodated in a predetermined position. A predetermined molding pattern is attached to the upper stamper and the lower stamper, and the patterns of both stampers are transferred to the surface of the workpiece W softened by heating. When the surface of the workpiece W is processed into a flat surface (smooth surface), a mirror finish stamper is used.

  The upper housing member 13 and the lower housing member 14 are provided with a positioning member 16 having a pin, an engagement hole, and the like for alignment at the time of mutual attachment. Moreover, a gasket (not shown) is provided on the joint surface between the upper housing member 13 and the lower housing member 14 for the purpose of ensuring airtightness at the time of attachment. Reference numeral 19 in FIG. 2 denotes an engaging block, which will be described in detail with reference to FIG.

  As shown in FIG. 3B, the upper stamper 11, the workpiece W, and the lower stamper 12 are housed and held when the upper housing member 13 and the lower housing member 14 are joined together. An accommodation space 15 is created by the joining of the upper accommodation member 13 and the lower accommodation member 14. The workpiece W is heated and pressurized under reduced pressure conditions. By setting the reduced pressure state, the air in the gap between the upper and lower stampers 11 and 12 and the workpiece W is removed, and the adhesion accuracy is increased. This is particularly convenient for improving the yield when a fine pattern is uniformly formed.

  Therefore, a deaeration unit is provided for degassing the accommodation space 15 formed in the transfer molding unit 10 to maintain a reduced pressure state (vacuum state). A known check valve, check valve or the like is used for the deaeration unit. In the drawing, an upper deaeration unit 17 and a lower deaeration unit 18 are provided. As will be described later, the deaeration (decompression) in the accommodation space 15 is performed prior to pressurization in the auxiliary heating unit 30, the pressurization thermoforming unit 40, the pressurization cooling unit 50, and the auxiliary cooling unit 60, In the carry-out unit 70, the inside of the accommodation space 15 is deaerated during standby. In each part of the list, the upper deaeration part 17 and the lower deaeration part 18 of each individual transfer molding unit 10 are connected to the upper deaeration connector part 27 and the lower deaeration connector part 28 shown in FIG. Then, the air in the accommodation space 15 is sucked by the suction force of the vacuum pump V.

  Each part included in the thermal transfer molding apparatus 1 such as the auxiliary heating unit 30, the pressure thermoforming unit 40, the pressure cooling unit 50, the auxiliary cooling unit 60, and the carry-out unit 70 and the carry-in unit 80 in addition to FIG. The structure of will be described.

  The auxiliary heating unit 30 includes an upper auxiliary heating panel 31 and a lower auxiliary heating panel 32 that form a pair of upper and lower sides. One transfer molding unit 10 is placed and sandwiched between the upper auxiliary heating platen 31 and the lower auxiliary heating platen 32. A hydraulic press device 36 is disposed below the lower auxiliary heating panel 32. That is, the lower auxiliary heating panel 32 is the movable side, and the upper auxiliary heating panel 31 is the fixed side. In the auxiliary heating unit 30, the conveyance molding unit 10 receives pressure and auxiliary heating of the upper auxiliary heating panel 31 and the lower auxiliary heating panel 32.

  The pressure thermoforming unit 40 is disposed on the front side of the auxiliary heating unit 30 (the front side in the course of the transport molding unit 10). The pressure thermoforming unit 40 includes an upper heating platen 41 and a lower heating platen 42 that form a pair of upper and lower sides. One transport molding unit 10 is placed and sandwiched between the two heating platens 41 and 42. A hydraulic press device 46 is disposed below the lower heating panel 42. That is, the lower heating panel 42 is the movable side, and the upper heating panel 41 is the fixed side. In the pressure thermoforming unit 40, the transfer molding unit 10 receives pressure and heating from the upper heating platen 41 and the lower heating platen 42.

  The pressure cooling unit 50 is disposed on the front side of the pressure thermoforming unit 40 (the front side in the course of the transport molding unit 10). The pressurized cooling unit 50 includes an upper cooling platen 51 and a lower cooling platen 52 that form a pair of upper and lower sides. One transport molding unit 10 is placed and sandwiched between both the cooling platens 51 and 52. A hydraulic press device 56 is disposed below the lower cooling panel 52. That is, the lower cooling platen 52 is a movable side, and the upper cooling platen 51 is a fixed side. In the pressurizing and cooling unit 50, the transfer molding unit 10 receives pressurization and cooling of the upper cooling platen 51 and the lower cooling platen 52.

  The auxiliary cooling unit 60 is disposed on the front side of the pressure cooling unit 50 (the front side in the course of the transport molding unit 10). The auxiliary cooling unit 60 includes an upper auxiliary cooling plate unit 61 and a lower auxiliary cooling plate unit 62 that form a pair of upper and lower sides. One conveyance molding unit 10 is placed and sandwiched between the auxiliary cooling disk units 61 and 62. A hydraulic press device 66 is disposed below the lower auxiliary cooling panel 62. That is, the lower auxiliary cooling platen 62 is the movable side, and the upper auxiliary cooling platen 61 is the fixed side. In the auxiliary cooling unit 60, the transfer molding unit 10 receives pressurization and cooling of the upper auxiliary cooling plate unit 61 and the lower auxiliary cooling plate unit 62.

  Although not shown, the auxiliary heating unit 30 and the pressure thermoforming unit 40 are each provided with a hydraulic oil supply adjustment pump, a hydraulic oil tank, a hydraulic oil pressure control sensor, an auxiliary heating panel, and a heating panel. A sensor for position detection and adjustment, a temperature sensor for the auxiliary heating panel and the heating panel, a supply device for heating oil or steam to the auxiliary heating panel and the heating panel, and the like are suitably provided. Similarly, although not shown, the pressurized cooling unit 50 and the auxiliary cooling unit 60 include a hydraulic oil supply adjustment pump, a hydraulic oil tank, a hydraulic oil pressure control sensor, a cooling disk unit, and an auxiliary cooling unit, respectively. A sensor for position detection adjustment of the board part, a temperature sensor of the cooling board part and the auxiliary cooling board part, a cold water supply device to the cooling board part and the auxiliary cooling board part, etc. are suitably provided.

  In thermal transfer molding, air may remain in the gap between the stamper and the workpiece. The remaining air thermally expands during auxiliary heating or thermoforming, causing deformation or molding leakage in the workpiece, and lowering the product yield. In thermal transfer molding, fine processing and molding are required, so even a small amount of air remains fatal. In order to improve such problems, it is becoming mainstream to perform heat molding under reduced pressure conditions. By reducing the pressure, the degree of vacuum increases, the efficiency of removing the air remaining in the gap between the stamper and the workpiece is improved, and the molding accuracy is dramatically increased.

  When the transport molding unit 10 is transported, the degree of vacuum in the accommodation space 15 may decrease. However, since the pressure is successively reduced in each of the auxiliary heating unit 30, the pressure thermoforming unit 40, the pressure cooling unit 50, and the auxiliary cooling unit 60, a vacuum state can always be obtained during pressurization. Therefore, since the adhesion between the stamper and the workpiece is enhanced, the mutual displacement is avoided, and the malfunction of the product is solved. Further, since the stamper is in close contact, the workpiece can be efficiently cooled. Therefore, in order to take advantage of the vacuum thermal transfer molding in the thermal transfer molding apparatus 1 as well, a vacuum pump (not shown) is provided in each part of the auxiliary heating unit 30, the pressure thermoforming unit 40, the pressure cooling unit 50, and the auxiliary cooling unit 60. ) Is connected, and pressure reduction by air suction in the accommodation space 15 of the transfer molding unit 10 is performed prior to pressurization.

  In essence, each of the heat molding and cooling in the thermal transfer molding apparatus can be performed at one location. However, in the case of a conventional apparatus with one place for heat forming and one place for cooling, the decompression (degassing) of the conveyance molding unit 10 and the pressure heating or pressure cooling must be completed in each part. The processing time in the part becomes longer. For this reason, when heating and cooling are not performed at the same time, for the convenience of conveyance, the other is restricted to the longer processing time. Therefore, it takes time to thermally transfer and form the workpiece.

  In view of this point, as illustrated and described above, in the thermal transfer molding apparatus 1 of the embodiment, the auxiliary heating unit 30 and the pressure thermoforming unit 40 are arranged for heat molding, and the pressure cooling unit 50 for cooling. And the auxiliary | assistant cooling part 60 is arrange | positioned. That is, by performing preliminary pressurization and heating by the auxiliary heating unit 30 prior to full-scale thermoforming of the pressurization thermoforming unit 40, the processing time required for molding in the pressurization thermoforming unit 40 can be reduced. Figured. Similarly, cooling can be made more sufficient by overlapping with the pressurized cooling unit 50 and the auxiliary cooling unit 60. Therefore, it is only necessary to complete the cooling through both of them, and the processing time can be reduced.

  Certainly, the conveyance destination of the conveyance molding unit 10 increases with the auxiliary heating unit 30, the pressure thermoforming unit 40, the pressure cooling unit 50, and the auxiliary cooling unit 60. However, since the advantage of the continuous conveyance of the conveyance molding unit 10 is utilized to the maximum, the processing time per one becomes short. As a result, it can contribute to the improvement of production efficiency per unit time.

  The conveyance molding unit 10 is conveyed in the order in which the auxiliary heating unit 30, the pressure thermoforming unit 40, the pressure cooling unit 50, and the auxiliary cooling unit 60 are arranged. The forming of the workpiece W can be completed. However, “contains the workpiece W in the conveyance molding unit 10, conveys the conveyance molding unit 10 in the forward direction, takes out the workpiece W completed after forming, and unprocessed workpieces to the conveyance molding unit again. In the case of trying to improve productivity by continuing each process, such as “accommodating the workpiece,”, the processes not involved in the direct processing other than the heat forming and cooling of the workpiece W are also ignored. I can't. Therefore, a carry-out unit 70 is provided for efficient delivery of the transfer molding unit 10, and a carry-in unit 80 is provided for receiving the transfer molding unit 10.

  The carry-out unit 70 is disposed behind the auxiliary heating unit 30 (the rear side when viewed from the forward direction of the conveyance molding unit 10). In the carry-out unit 70, the pressure is reduced by deaeration in the accommodation space with respect to the conveyance molding unit 10 in which the workpiece W is accommodated. Then, the transfer molding unit 10 is placed at the standby position and is carried out toward the auxiliary heating unit 30 at a predetermined interval. In the carry-out unit 70, the standby position side is the carry-out unit upper stage 72, and the reception position side for receiving the transfer molding unit 10 returned from the carry-in unit 80 described later is the carry-out unit lower stage 73. An unloading unit lifting plate 71 (unloading unit elevator) is used for vertical movement between both stages. A stop device 74 is provided on the carry-out unit elevating plate 71 and movement of the transfer molding unit 10 is restricted. The carry-out unit lifting plate 71 is provided with a roller conveyor 76 (see FIG. 9) for moving the transport molding unit 10.

  The carry-in unit 80 is disposed on the front side of the auxiliary cooling unit 60. In the carry-in part 80, the conveyance molding unit 10 conveyed from the auxiliary cooling part 60 is received, and the conveyance molding unit 10 is separated. The transport molding unit 10 is separated from the lower housing member 14 by gripping the upper housing member 13 through the unit separating device 85 in the carry-in section 80. As specified in the invention of claim 2, the workpiece W that has been molded by heating and cooling is taken out from the inside. Then, a new unprocessed (pre-molding) workpiece W is mounted in the upper housing member 13 and the lower housing member 14 together with the upper stamper 11 and the lower stamper 12, and both are bonded together to carry out transport molding again. Unit 10 is completed. As described above, since the removal of the workpiece and the new attachment are concentrated in the carry-in unit 80, the work efficiency can be improved. Also, the number of places required for work can be reduced. A workpiece supply device 90 for efficiently and sequentially supplying unprocessed workpieces to the front side of the carry-in unit 80 is disposed. Of course, the method for supplying the raw material to be processed can be either an apparatus or manually.

  In the carry-in unit 80, the receiving position side for receiving the transport molding unit 10 being conveyed is the carry-in unit upper stage 82, and the delivery position side that is sent to the carry-out unit 70 through the return device 94 is the carry-in unit lower stage 83. A carry-in lift plate 81 (carry-in elevator) is used for vertical movement between the two stages. The carry-in lift plate 81 is provided with a stop device 84 to restrict the movement of the transfer molding unit 10. In the carry-in unit 80, when the carry-in unit lift plate 81 is positioned on the carry-in unit lower stage 83, an extrusion device 91 (pusher) that pushes the transfer molding units 10 on the carry-in unit lift plate one by one toward the return device 94. Also provided. The carry-in lift plate 81 is provided with a roller conveyor 86 (see FIG. 9) for moving the transport molding unit 10.

  In the thermal transfer molding apparatus 1 of the embodiment, as specified in the invention of claim 3, the return device 94 returns the transport molding unit 10 containing the workpiece W before molding from the carry-in portion 80 toward the carry-out portion 70. To do. By using the return device 94, the conveyance molding unit 10 can be easily circulated, and the processing can be continued. The return device 94 includes a return roller conveyor 95 as shown in FIGS. The roller conveyor is composed of a plurality of rollers having a simple structure, and can move the conveyance molding unit 10 with an extremely small force. As particularly grasped from FIG. 4 and defined in the invention of claim 4, the return roller conveyor 95 is composed of the auxiliary heating plates 31 and 32 of the auxiliary heating unit 30, the heating plates 41 and 42 of the pressure thermoforming unit 40, The cooling platens 51 and 52 of the pressure cooling unit 50 and the auxiliary cooling plate units 61 and 62 of the auxiliary cooling unit 60 are laid immediately below.

  Since the return roller conveyor 95 of the return device 94 is placed under the auxiliary heating unit 30 or the auxiliary cooling unit 60, the return device 94 is not overhanging the heat transfer molding device 1 and is placed in the thermal transfer molding. The installation place in the device 1 can be saved. Therefore, it is possible to return the direction in the direction opposite to the traveling direction accompanying the molding of the transport molding unit 10.

  In the transport apparatus 100 of the embodiment, the transport molding unit 10 is transported in the order of arrangement of the carry-out unit 70, the auxiliary heating unit 30, the pressure thermoforming unit 40, the pressure cooling unit 50, the auxiliary cooling unit 60, and the carry-in unit 80. Are provided with one moving beam member 101 on each of the left and right sides in the direction of travel of the transport molding unit 10. As defined in the invention of claim 6, the moving beam member 101 is placed on the carry-out part 70, the auxiliary heating part 30, the pressure thermoforming part 40, the pressure cooling part 50, and the auxiliary cooling part 60. The length is such that each conveyance molding unit 10 can be held together (see FIG. 1 and the like).

  Therefore, each transfer molding unit placed on the carry-out unit 70, the auxiliary heating unit 30, the pressure thermoforming unit 40, the pressure cooling unit 50, and the auxiliary cooling unit 60 by the advancement of the moving beam member 101 once. 10 are sequentially conveyed to the auxiliary heating unit 30, the pressure thermoforming unit 40, the pressure cooling unit 50, the auxiliary cooling unit 60, and the carry-in unit 80 one by one, and are simultaneously placed at predetermined positions of the respective units. The two moving beam members 101 of the transport apparatus 100 can be driven forward and backward by the drive unit 120. The moving beam member 101 can be transported by one forward movement, and the transport efficiency of the transport molding unit 10 in the thermal transfer molding apparatus 1 is increased.

  As understood from the configuration of the thermal transfer molding apparatus 1, the apparatus includes a carry-out unit 70 and a carry-in unit 80. For this reason, the unloading unit 70 can prepare for standby and can stand by, and the loading unit 80 can also prepare for removal and return of the processed workpiece W after loading. Therefore, the carrying-in efficiency into the auxiliary heating unit 30 and the carrying-out efficiency from the auxiliary cooling unit 60 are increased.

  Further, the thermal transfer molding apparatus 1 includes a return device 94 that can return the transport molding unit 10 that newly accommodates the workpiece W before processing from the carry-in unit 80 to the carry-out unit 70. For this reason, in the thermal transfer molding apparatus 1, the conveyance molding unit 10 enclosing the workpiece W is moved back and forth between the auxiliary heating unit 30, the pressure thermoforming unit 40, the pressure cooling unit 50, and the auxiliary cooling unit 60. There is no need. The conveyance molding unit 10 is always one-way conveyance, and the productivity of the molding process is dramatically improved.

  In the auxiliary heating unit 30, the pressure thermoforming unit 40, the pressure cooling unit 50, and the auxiliary cooling unit 60 of the thermal transfer molding device 1, there are differences in the output and size of the hydraulic press device due to the difference in the pressurizing force of each part. The structure is almost the same. Therefore, further details will be described using the pressure thermoforming section 40 shown in the front view of FIG. 5 and the partially enlarged view of FIG. 6 as a representative example.

  In the front view of the pressure thermoforming unit 40 in FIG. 5, a fixed platen 43 and an upper heating platen unit 41 connected thereto are provided immediately above the transfer molding unit 10. The fixed platen 43 is connected to the upper pedestal 47a. A movable platen 44 and a lower heating platen unit 42 connected to the movable platen 44 are provided directly below the transfer molding unit 10. A hydraulic press device 46 is disposed below the movable platen 44. A hydraulic piston 45 that can be raised and lowered by a hydraulic press device 46 is connected to the movable platen 44. The hydraulic press device 46 is accommodated in the lower pedestal 47b. The pedestal 47 is supported by the pedestal 49. In the figure, the pedestal 49 and the grounding surface (not shown) are fixed via a grounding part 49b.

  The upper pedestal portion 47 a including the upper heating platen portion 41 is strongly pressed by the hydraulic piston 45 of the hydraulic press device 46. Therefore, the upper pedestal portion 47 a and the lower pedestal portion 47 b are fixed to each other by the support column portion 48. Support column portions 44 a are provided on the left and right of the movable platen 44. As can be particularly understood from FIG. 5, the return device 94 (return roller conveyor 95) is disposed directly under the lower pedestal portion 47 b and surrounded by the pedestal portion 49. Accordingly, the return device 94 is laid immediately below the heating platen portions 41 and 42 of the pressure thermoforming unit 40, and the installation place is effectively utilized.

  The transport apparatus 100 that transports the transport molding unit 10 includes a transport roller conveyor 105, a moving beam member 101, a driving unit 120, a connection unit 110 connected to the transport molding unit 10, and the like, as defined in the invention of claim 5. Configured. Therefore, the mechanism required for transporting the transport molding unit 10 can be made relatively simple. As can be understood from the enlarged view of the main part of FIG. 6, the conveyance molding unit 10 is placed on the conveyance roller conveyor 105, and includes an auxiliary heating unit 30, a pressure thermoforming unit 40, a pressure cooling unit 50, and an auxiliary cooling unit. It is conveyed in the order of 60 arrangement.

  When the transport molding unit 10 is transported, the connecting portion 110 is connected to the engagement block 19 (see FIG. 7) of the transport molding unit 10. The connection part 110 is installed on the upper part of the long bar of the moving beam member 101 at a predetermined interval. The moving beam member 101 is connected to the linear guide 102 to facilitate movement in the length direction. Examples of the linear guide include an LM guide (registered trademark). Therefore, the transfer molding unit 10 connected to the connecting portion 110 is moved between the auxiliary heating plate portions 31 and 32, between the heating plate portions 41 and 42, and between the cooling plate portions 51 and 52 by the movement of the transfer device 100. And a predetermined position between the auxiliary cooling disk units 61 and 62.

  The movable beam member 101 that can move in the length direction through the linear guide 102 can be moved by the rotation transmitted to the ball screw 126. In the figure, a transmission belt 123 is installed between the motor pulley 127 of the motor 121 and the pulley 122 of the ball screw 126. The drive unit 120 is configured by a combination of the motor 121, the ball screw 126, and various pulleys. The drive unit 120 including the moving beam member 101 is connected to the beam member support column 103.

  With reference to the partially enlarged perspective view of FIG. 7, the connection unit 110 provided in the transport apparatus 100 will be described including the operation. The main body 111 of the connecting part 110 is fixed to the moving beam member 101. An advancing / retreating plate 113 that moves forward and backward with respect to the main body 111 is provided, and a connection pin 112 is provided at the tip of the advancing / retreating plate 113. As the advance / retreat plate 113 advances, the connection pin 112 also advances. The advance / retreat plate 113 can be advanced / retracted by an air cylinder, for example. The advancing / retracting plate 113 is provided with an advancing / retreating pin 114 and is inserted through the main body 111. Since the engaging block 19 of the illustrated conveyance molding unit 10 has a claw shape having a block recess 19c, the connection pin 112 is received on the engaging block 19 side.

  When the transport molding unit 10 is transported from the current placement position to the next placement position, the advancing / retracting plate 113 of the connection portion 110 moves forward from the main body portion 111, whereby the connection pin 112 is connected to the engagement block 19. Although not shown in the drawing, the same applies to the opposite side of the conveyance molding unit 10. Since the connecting portion 110 is installed on the moving beam member 101 of the transport apparatus 100, the movement of the moving beam member 101 is also transmitted to the transport forming unit 10 via the connecting portion 110 (connecting pin 112). Therefore, the transport molding unit 10 is transported while being dragged in the forward direction of the moving beam member 101 as it is. When the predetermined mounting position is reached, the advance / retreat plate 113 moves backward toward the main body 111 and the connection between the connection pin 112 and the engagement block 19 is released. After the molding and cooling are completed, the connection pin 112 of the connection part 110 is connected to the engagement block 19 again.

  As shown in the figure, the lower deaeration connector portion 28 is placed directly below the lower deaeration unit 18 of the transport molding unit 10 when placed at a specified position in each panel unit such as the auxiliary heating unit 30 of the transport molding unit 10. Are aligned. Although not shown, the upper deaeration connector part 27 is also aligned directly above the upper deaeration part 17. Thereafter, as the hydraulic piston of the hydraulic press device rises, the lower degassing connector portion 28 is connected to the lower degassing portion 18, and the upper degassing connector portion 27 is connected to the upper degassing portion 17. Refer to FIG. 6 for these connection positions. The lower degassing connector portion 28 and the like are connected to a vacuum pump (not shown).

  The driving state of the driving unit 120 will be described with reference to the partially enlarged perspective view of FIG. A beam side fixing part 125 is provided at the lower part of the moving beam member 101. The ball screw 126 of the driving unit 120 is screwed into the beam side fixing unit 125 and inserted. The ball screw 126 is connected to the pulley 122 and is rotatably supported by the ball screw support portion 124. The rotation of the motor 121 is transmitted to the ball screw 126 through the belt 123 and the pulley 122, and the ball screw 126 itself also rotates. Therefore, the beam side fixing portion 125 screwed to the ball screw 126 can move back and forth in the length direction of the ball screw, and the moving beam member 101 can also move forward and backward.

  As can be seen from FIGS. 7 and 8, the transport roller conveyor 105 is composed of a roller having a short length with which only the lower housing member 14 (lower support frame portion 24) contacts the transport molding unit 10. That is, the roller does not get in the way because the heating platen or the like needs to be in close contact with the inside of the conveyance molding unit 10. Reference numeral 106 denotes a roller frame, and 107 denotes a roller base, which is fixed to the beam member support pillar 103 (see FIG. 6).

  The process in which the conveyance molding unit 10 is conveyed from the carry-out unit 70 to the carry-in unit 80 and returns to the carry-out unit 70 will be described with reference to the schematic schematic diagrams of FIGS. FIG. 9 is a time point when the moving beam member 101 of the transport apparatus 100 is located at the carry-out unit 70, the auxiliary heating unit 30, the pressure thermoforming unit 40, the pressure cooling unit 50, and the auxiliary cooling unit 60. As shown in the figure, a conveyance molding unit 10 is placed in each part. Since the unloading unit 70 is at the time when the transfer molding unit 10 is delivered, the unloading unit lifting plate 71 is naturally positioned on the unloading unit upper stage 72 serving as a standby position of the transfer molding unit 10. At the time of conveyance, the connection pin 112 of the connection part 110 is connected to the engagement block 19 of the conveyance molding unit 10 at each part, and at the time of placement and pressurization at each part, the connection pin 112 and the engagement block 19 are connected. The connection is released (see FIG. 7 etc.).

  In this case, as defined in the invention of claim 7, the conveyance molding unit 10 is removed in any of the auxiliary heating unit 30, the pressure thermoforming unit 40, the pressure cooling unit 50, and the auxiliary cooling unit 60 at that time. The inside of the accommodation space 15 is depressurized through the air parts (the upper deaeration part 17 and the lower deaeration part 18). 6 and 7 are referred to for the connection mode between the upper deaeration unit 17 and the upper deaeration connector unit 27, and the lower deaeration unit 18 and the lower deaeration connector unit 28.

  A known check valve is provided in the deaeration part of the upper deaeration part 17 and the lower deaeration part 18 in order to maintain a reduced pressure state. However, the duration may not be sufficient in terms of accuracy such as airtightness. Therefore, even if the vacuum degree in the accommodating space of the conveyance molding unit 10 is reduced during conveyance, the degree of vacuum is always maintained prior to molding and cooling by sequentially degassing and reducing the pressure at each of the four portions with pressure. Can be increased. In addition, molding and cooling with pressurization can be performed while ensuring a constant degree of vacuum, and molding quality can be improved by avoiding molding defects and misalignment between the workpiece and the stamper.

  In the auxiliary heating unit 30, the pressure thermoforming unit 40, the pressure cooling unit 50, and the auxiliary cooling unit 60, after deaeration, the lower auxiliary heating panel unit 32 is passed through the hydraulic press devices 36, 46, 56, and 66 of each unit. The lower heating platen 42, the lower cooling platen 52, and the lower auxiliary cooling platen 62 are raised. And the conveyance molding unit 10 (4 units) of each part is auxiliary | assistant heating, thermoforming, cooling, and auxiliary cooling in each part mounted at once.

  Next, as shown in FIG. 10, as the moving beam member 101 of the transport apparatus 100 moves, the transport molding unit 10 of the auxiliary heating unit 30 is transferred to the press thermoforming unit 40. Is transferred to the pressure cooling unit 50, the conveyance molding unit 10 of the pressure cooling unit 50 is conveyed to the auxiliary cooling unit 60, and the conveyance molding unit 10 of the auxiliary cooling unit 60 is conveyed to the carry-in unit 80. The connection and release between the transfer molding unit 10 and the connecting portion 110 are the same as described above, and will be omitted.

  In the carry-in part 80, the carry-in part raising / lowering plate 81 is waiting on the receiving position side (the carry-in part upper stage 82), and the newly formed transport molding unit 10 is accepted. Auxiliary heating, thermoforming, cooling, and auxiliary cooling with the same pressurization as described above are also performed in each of the newly transported and placed parts.

  Thereafter, the moving beam member 101 of the transport apparatus 100 is retracted to the position shown in FIG. Then, the moving beam member 101 newly holds four transport molding units 10 collectively through the connecting portion 110 and advances to the position shown in FIG. This operation is repeated, and the conveyance molding unit 10 initially placed on the carry-out unit 70 is sent to the auxiliary heating unit 30, the pressure thermoforming unit 40, the pressure cooling unit 50, and the auxiliary cooling unit 60 at regular intervals. The feeds are made sequentially, and finally reach the carry-in unit 80. The forward and backward movement of the moving beam member 101 is controlled by forward and reverse rotations of the ball screw 126 as shown in FIG. Of course, in addition to the rotation of the ball screw by the motor, driving means using a solenoid or compressed air can also be used.

  As described above, the moving beam member 101 of the transport apparatus 100 includes the carry-out unit 70, the auxiliary heating unit 30, the pressure thermoforming unit 40, the pressure cooling unit 50, the auxiliary cooling unit 60, and the carry-in unit 80. Repeat forward and backward for a distance corresponding to one of the parts. By this operation, the transport molding unit 10 is continuously transported in the forward direction. In this way, the conveyance molding unit is always conveyed every time the moving beam member 101 advances, and the conveyance efficiency of the conveyance molding unit in the thermal transfer molding apparatus 1 is increased.

  In the conveyance molding unit 10 in the middle of conveyance, the depressurized state in the accommodation space 15 for accommodating the workpiece W or the like is maintained (high vacuum state) although there is a difference in degree due to deaeration by the vacuum pump. Therefore, even if the air tightness of the deaeration part is simply released and the inside of the accommodation space 15 is returned to the atmospheric pressure, the upper accommodation member 13 and the lower accommodation member of the transport molding unit 10 in the carry-in part 80 due to the difference from the atmospheric pressure. It is not always easy to separate 14. It is necessary to promote separation of the upper housing member 13 and the lower housing member 14 in order to improve the efficiency of taking out the workpiece W that has been molded and mounting the new workpiece W before processing. In addition, the workpiece W is in close contact with the stamper with heating and pressurization. For this reason, it is necessary to promote separation of the workpiece W and the stamper.

  Therefore, as defined in the invention of claim 8, in the carry-in unit 80 of the thermal transfer molding device 1, the deaeration unit ( Air is supplied (compressed air injection) through the upper deaeration unit 17 and the lower deaeration unit 18), and the inside of the accommodation space 15 is pressurized. Then, since the inside of the storage space 15 becomes a positive pressure rather than the atmospheric pressure, the air injected into the storage space 15 is the upper base plate portion 21, the upper stamper 11, the workpiece W after processing, the lower stamper. 12, it enters between each of the lower base plate portions 22. As a result, it is possible to relatively smoothly separate and remove the stamper and the workpiece from the conveyance molding unit 10. From this, workability | operativity by the unit separation apparatus 85 of the carrying-in part 80 and the workpiece supply apparatus 90 (refer FIG. 4) improves.

  In the graph of FIG. 11, the upper graph is a graph of the pressure change applied to the workpiece W over time, and the lower graph is the graph of the temperature change of the workpiece W over time. From the vertical leftmost column, the carry-out unit 70, the auxiliary heating unit 30, the pressure thermoforming unit 40, the pressure cooling unit 50, the auxiliary cooling unit 60, and the carry-in unit 80 are arranged in this order, and the conveyance order of the conveyance molding unit 10 is established. . The rightmost column is a stage in which the carry-in unit 80 returns to the carry-out unit 70 by the return device 94.

  As can be seen from the configuration of the moving beam member 101 of the transfer apparatus 100 described so far, the movement is always a constant forward and backward movement. That is, when the conveyance molding unit 10 conveys each unit from the carry-out unit 70 to the carry-in unit 80, all of them have a fixed time. In the thermal transfer molding apparatus 1 of this embodiment, the processing time including movement in each part is 40 seconds. Accordingly, a new transport molding unit 10 is transported to the carry-in section 80 every 40 seconds, and a workpiece W that has been processed by one sheet every 40 seconds is completed. Hereinafter, the state of each part in the graph of FIG. 11 will be described in order.

  Regarding the relationship between pressure and temperature in the carry-out unit 70, since the workpiece W before processing is accommodated in the transport molding unit 10, the pressure initially applied to the workpiece W remains at atmospheric pressure (gauge pressure). 0 MPa). After that, while the transfer molding unit 10 is placed on the unloading unit upper stage 72 at the standby position, the air in the accommodation space 15 is degassed from the deaeration unit (the upper deaeration unit 17 and the lower deaeration unit 18), and the decompressed state. It becomes. For this reason, in the final stage of the carrying-out part 70, the pressure added to the workpiece W apparently rises (0.1 MPa in gauge pressure). The temperature is constant at room temperature. The following pressure notation means “gauge pressure”.

  Regarding the relationship between pressure and temperature in the auxiliary heating unit 30, the conveyance molding unit 10 is placed and sandwiched between the upper auxiliary heating platen 31 and the lower auxiliary heating platen 32, and is pressurized and auxiliary heated by both. Therefore, an increase in pressure applied to the workpiece W is observed (1 MPa). At the same time, the workpiece W is heated to a maximum of 120 ° C. by heat transfer from both auxiliary heating panels. The portion of the graph where the pressure and temperature are reduced is a stage where the pressurization and auxiliary heating are finished and conveyed.

  Regarding the relationship between pressure and temperature in the pressure thermoforming unit 40, the transfer molding unit 10 is placed and sandwiched between the upper heating platen 41 and the lower heating platen 42, and is pressurized and heated by both. In this case, the pressure is increased by a pressure higher than the pressure in the auxiliary heating unit 30. According to the pressure applied to the workpiece W in the graph, the pressure rises to 5 MPa. In this embodiment, the workpiece W is heated up to a maximum of 140 ° C. by heat transfer from both heating platens. In this case, since the workpiece W has already been sufficiently heated by the auxiliary heating unit 30, the heating temperature setting of the heating platen of the pressure thermoforming unit 40 may be set to be equivalent to the auxiliary heating unit 30. This is optimally set and selected according to the processing time, the material of the workpiece, the thickness, the machining accuracy, and the like. The pressure drop portion of the graph is a stage where the pressurization and thermoforming are finished and conveyed. In addition, since the temperature is sufficiently increased, the temperature drop during conveyance is slight.

  Regarding the relationship between pressure and temperature in the pressure cooling unit 50, the transfer molding unit 10 is placed and sandwiched between the upper cooling platen 51 and the lower cooling platen 52 and is pressurized and cooled by both. In the pressure cooling unit 50, the maximum pressure applied to the workpiece W is the same as the pressure in the press thermoforming unit 40, and the pressure on the workpiece W is set to decrease with the progress of cooling. Due to heat transfer from the cooling platen, the temperature of the workpiece W decreases from 140 ° C. to 40 ° C. That is, the workpiece W is rapidly cooled in the pressure cooling unit 50. Usually, the thermal transfer molding of the workpiece W is almost completed by passing through the pressure cooling unit 50. The pressure drop portion of the graph is a stage where the pressurization and cooling are finished and the sheet is conveyed.

  Regarding the relationship between pressure and temperature in the auxiliary cooling unit 60, the transfer molding unit 10 is placed and sandwiched between the upper auxiliary cooling platen 61 and the lower auxiliary cooling platen 62, and is pressurized and auxiliary cooled by both. The pressure applied to the workpiece W in the auxiliary cooling unit 60 is a pressure (1 MPa) lower than the high pressure (5 MPa) in the pressure cooling unit 50. In the auxiliary cooling unit 60, additional cooling time can be secured by applying low pressure to the workpiece W and auxiliary cooling. Therefore, if the temperature drop at the time of passing through the pressure cooling unit 50 is small, the auxiliary cooling unit 60 is also cooled, so that the workpiece W can be sufficiently cooled. From the temperature history shown in the figure, since the workpiece W is already 40 ° C., the auxiliary cooling of the auxiliary cooling unit 60 is the subsequent slow cooling to room temperature.

  In the carry-in part 80, the workpiece W after finishing the processing in the conveyance molding unit 10 is taken out. For this reason, the pressure applied to the workpiece W is only atmospheric pressure (0 MPa). And the temperature of the to-be-processed material W approaches nearly room temperature. Thus, the thermal transfer molding of the workpiece W is completed by a series of conveyance from the carry-out unit 70 to the carry-in unit 80.

  In the graph portion corresponding to the return device 94, a new unprocessed (pre-molding) workpiece W is mounted in the carry-in portion 80, and the transport molding unit 10 is assembled again. Therefore, the pressure applied to the workpiece W being returned by the return device 94 is only atmospheric pressure (0 MPa). The temperature of the workpiece W is also room temperature.

  As can be understood from the description of the series of apparatuses and processes, it is possible to continue the vacuum thermal transfer molding for the workpiece. Therefore, productivity per unit time can be increased. In addition, the workpiece can be transported while maintaining the reduced pressure state as a transport molding unit, not as a single unit. For this reason, it is not necessary to surround the thermoforming part or the cooling part itself with a decompression chamber as in the conventional apparatus, and the apparatus itself can be simplified. In addition, the temperature of the auxiliary heating unit of the auxiliary heating unit, the heating unit of the pressure thermoforming unit, the cooling unit of the pressure cooling unit, and the auxiliary cooling unit of the auxiliary cooling unit can be maintained constant in advance. Therefore, it is not necessary to adjust the temperature. Furthermore, since the auxiliary heating unit and the auxiliary cooling unit are also provided, further heating and cooling efficiency can be enhanced by the preliminary heating and the subsequent cooling.

DESCRIPTION OF SYMBOLS 1 Thermal transfer molding apparatus 10 Conveying molding unit 11 Upper stamper 12 Lower stamper 13 Upper housing member 14 Lower housing member 15 Housing space 17 Upper deaeration part (deaeration part)
18 Lower deaeration part (deaeration part)
DESCRIPTION OF SYMBOLS 19 Engagement block 21 Upper base plate part 22 Lower base plate part 27 Upper deaeration connector part 28 Lower deaeration connector part 30 Auxiliary heating part 31 Upper auxiliary heating board part 32 Lower auxiliary heating board part 36 Hydraulic press apparatus 40 Pressurized thermoforming unit 41 Upper heating platen unit 42 Lower heating platen unit 46 Hydraulic press device 50 Pressurized cooling unit 51 Upper cooling platen unit 52 Lower cooling platen unit 56 Hydraulic press device 60 Auxiliary cooling unit 61 Upper auxiliary cooling plate unit 62 Lower auxiliary cooling panel 66 Hydraulic press device 70 Unloading unit 71 Unloading unit lifting plate 72 Unloading unit upper stage 73 Unloading unit lower stage 80 Loading unit 81 Loading unit lifting plate 82 Loading unit upper stage 83 Loading unit lower stage 85 Unit separation device 94 Returning device 95 Returning roller conveyor 100 Conveying device 101 Moving beam member 102 Linear guide 105 Conveying roller Conveyor 110 connection portion 112 connecting pin 120 driver 121 motor 123 belt 124 ball screw support part 125 beam-side fixing portion 126 ball screw V vacuum pump W workpiece

Claims (8)

A workpiece, an upper stamper and a lower stamper that are in close contact with the upper and lower surfaces of the workpiece, an upper housing member and a lower housing member that house the upper stamper, the workpiece, and the lower stamper in that order. A conveyance molding unit that includes a deaeration part that depressurizes the inside of the accommodation space formed by joining the upper accommodation member and the lower accommodation member, and that can be conveyed while maintaining a reduced pressure state;
A pair of upper and lower auxiliary heating platens are provided, the conveyance molding unit is sandwiched between the auxiliary heating platens, and the workpiece in the conveyance molding unit is pressurized and auxiliary heated to the conveyance molding unit. An auxiliary heating unit for auxiliary heating of the material,
It is arrange | positioned in the front side of the said auxiliary | assistant heating part, is equipped with a pair of upper and lower heating board parts, clamps the said conveyance molding unit between the said heating board parts, and with higher pressure than the said auxiliary | assistant heating part with respect to the said conveyance molding unit. A pressure thermoforming section that pressurizes and heats to heat mold the workpiece in the transport molding unit;
It is arranged on the front side of the pressure thermoforming unit, and includes a pair of upper and lower cooling disk parts, sandwiches the conveyance molding unit between the cooling disk parts and pressurizes and cools the conveyance molding unit, A pressure cooling unit for cooling the workpiece in the conveyance molding unit;
It is arranged on the front side of the pressure cooling unit, and includes a pair of upper and lower auxiliary cooling disk units, sandwiching the conveyance molding unit between the auxiliary cooling disk units and from the pressure cooling unit to the conveyance molding unit. An auxiliary cooling unit that cools while pressurizing with a low pressure, and auxiliary cools the workpiece in the transfer molding unit;
Disposed in the rear side of the auxiliary heating unit, performs decompression in the accommodation space through the deaeration unit of the conveyance molding unit that accommodates the workpiece, and is placed in a standby position and conveyed toward the auxiliary heating unit. An unloading section for unloading the molding unit;
A carry-in unit that is arranged on the front side of the auxiliary cooling unit and receives the transfer molding unit carried in from the auxiliary cooling unit and separates the transfer molding unit;
The connecting unit connected to the transfer molding unit, the transfer molding unit connected to the connection unit, the carry-out unit, the auxiliary heating unit, the pressure thermoforming unit, the pressure cooling unit, the auxiliary cooling unit, And in the order of arrangement as the carry-in unit, the conveyance molding unit connected to the connection unit between the auxiliary heating platen, between the heating platen, between the cooling platen, and the A thermal transfer molding apparatus, comprising: a conveying device that is placed at a predetermined position between the auxiliary cooling disk units.   2. The thermal transfer molding apparatus according to claim 1, wherein in the carry-in portion, the workpiece that has been molded from the conveyance molding unit is taken out, and the workpiece before molding is mounted in the conveyance molding unit.   The thermal transfer molding apparatus according to claim 2, further comprising a return device that returns the transport molding unit that accommodates the workpiece before molding from the carry-in portion toward the carry-out portion.   The return roller conveyor is included in the return device, and the return roller conveyor includes the auxiliary heating platen of the auxiliary heating unit, the heating platen of the pressure thermoforming unit, and the cooling plate of the pressure cooling unit. The thermal transfer molding apparatus according to claim 3, wherein the thermal transfer molding apparatus is laid immediately below the auxiliary cooling plate portion of the auxiliary cooling portion.   5. The thermal transfer molding apparatus according to claim 1, wherein the transport device includes a transport roller conveyor, a moving beam member including a plurality of the connection portions, and a driving unit that drives the moving beam member to move forward and backward. . The moving beam member can collectively hold the transport molding units mounted on the carry-out unit, the auxiliary heating unit, the pressure thermoforming unit, the pressure cooling unit, and the auxiliary cooling unit. Has a length to
The transport device collectively includes the transport molding unit mounted on the carry-out unit, the auxiliary heating unit, the pressure thermoforming unit, the pressure cooling unit, and the auxiliary cooling unit. The thermal transfer molding apparatus according to any one of claims 1 to 5, wherein the thermal transfer molding apparatus is transported and placed on the pressurized thermoforming section, the pressurized cooling section, the auxiliary cooling section, and the carry-in section.   The said conveyance molding unit is any one of the said auxiliary | assistant heating part, the said pressurization thermoforming part, the said pressure cooling part, and the said auxiliary | assistant cooling part, and is pressure-reduced through the said deaeration part. The thermal transfer molding apparatus according to Item.   The thermal transfer molding according to any one of claims 1 to 7, wherein after the auxiliary cooling unit finishes the auxiliary cooling in the auxiliary cooling unit, air is supplied through the deaeration unit and the inside of the accommodation space is pressurized. apparatus.

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