JP2013063371A - Method for adjusting alignment of thin film forming device, thin film forming device, and electromechanical conversion film, electromechanical conversion element, liquid droplet discharge head and liquid droplet discharge device produced with the method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin film forming device which can reduce the production cost, a produced electromechanical conversion element and a liquid droplet discharge device.SOLUTION: In the first alignment adjustment process, a landing position 251 is captured by using a camera 205, and a substrate or a liquid drop head 201 is moved relatively so that the landing position 251 matches with an imaging standard position 252 of the camera 205. In the second alignment adjustment process, an irradiated spot is formed by irradiating a laser beam with laser red, the irradiated spot is captured by using the camera 205, and the substrate or the laser head is relatively moved so that the irradiated spot matches the standard imaging position of the camera 205. In the third alignment adjustment process, the direction of the substrate is adjusted after detecting the direction of the substrate based on the image of the shape of the alignment mark formed previously on the substrate, the image captured by the imaging means 205, and the mounting position of the substrate is adjusted by moving the substrate so that the alignment mark comes to the standard imaging position of the imaging means 205.

Description

  The present invention relates to an alignment adjustment method for a thin film manufacturing apparatus, a thin film manufacturing apparatus, an electromechanical conversion film manufactured by the thin film manufacturing apparatus, an electromechanical conversion element, a droplet discharge head, and a droplet discharge device.

  Conventionally, an electromechanical conversion element configured such that an electromechanical conversion film is sandwiched between electrodes includes, for example, a liquid discharge head that discharges ink droplets, and forms an image by adhering ink droplets to a sheet while conveying a medium. Used in an ink jet recording apparatus. The medium here is also referred to as “paper”, but the material is not limited, and a recording medium, a recording medium, a transfer material, a recording paper, and the like are also used synonymously. The image forming apparatus means an apparatus for forming an image by discharging a liquid onto a medium such as paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, ceramics. The image formation is not only giving an image having a meaning such as a character or a figure to the medium but also giving an image having no meaning such as a pattern to the medium (simply ejecting a droplet). Also means. The ink is not limited to so-called ink, and is not particularly limited as long as it becomes liquid when ejected. For example, the ink is a generic term for liquids including DNA samples, resists, pattern materials, and the like. Use.

  The ink jet recording apparatus mainly includes a nozzle that discharges ink droplets, a discharge chamber that communicates with the nozzle, a liquid chamber called a pressurized liquid chamber, a pressure chamber, and an ink flow path chamber, and ink in the liquid chamber. And pressure generating means for discharging. As this pressure generating means, there is known a piezo-type pressure generating means for discharging ink droplets by deforming and displacing a vibration plate forming the wall surface of the discharge chamber using an electromechanical conversion element such as a piezoelectric element. . The electromechanical conversion element used for this piezo-type pressure generating means is formed by laminating a lower electrode (first electrode), an electromechanical conversion layer, and an upper electrode (second electrode). Individual electromechanical conversion elements are arranged to generate ink discharge pressure in each pressure chamber. The electromechanical conversion layer is formed by performing the process of forming the electromechanical conversion film a plurality of times. For example, lead zirconate titanate (PZT) is used as the electromechanical conversion film, and these are generally referred to as metal composite oxides because they contain a plurality of metal oxides as main components.

  The electromechanical conversion film manufacturing method includes a sputtering method, a sol-gel method, a CVD method, a laser ablation method, and the like. The method is excellent in controllability of the crystal state. As a method for producing an electromechanical conversion film using this sol-gel method, the one described in Patent Document 1 is known. In the manufacturing method of Patent Document 1, platinum serving as the lower electrode has high wettability, and the surface of the lower electrode becomes a lyophilic surface having lyophilic properties. When the solution containing the PZT component is applied to the surface of the lower electrode, the surface becomes less wettable and becomes a lyophobic surface having lyophobic characteristics. Then, a photoresist formed in a predetermined pattern by photolithography is placed on the applied PZT solution film, and etching according to the predetermined pattern of the photoresist is performed. Specifically, the PZT solution film that has been exposed without being covered with the photoresist by oxygen plasma irradiation or UV light irradiation is removed, and the PZT solution film that has been coated with the photoresist remains. . Thereafter, the photoresist used for the processing is removed, and the patterning of the PZT solution film covered with the photoresist is completed. By performing the above steps, surface modification is performed so that the surface other than the predetermined portion to which the PZT liquid on the lower electrode is applied is made lyophobic.

  Next, a PZT liquid droplet containing a raw material for forming an electromechanical conversion film is dropped from a nozzle of a droplet discharge head onto a predetermined portion on the lower electrode from which the PZT solution film has been removed by the etching. A coating process is performed. Then, a heat treatment process by laser light irradiation is performed in which only the film of the PZT liquid dropped on the predetermined portion is scanned while irradiating the laser light to perform heat treatment at a predetermined temperature. Specifically, the base substrate on which the PZT liquid film is formed is fixed, and a spot outer ring portion of laser light that is invisible light such as infrared rays or ultraviolet rays is formed on a predetermined end of the PZT liquid film. Scan along with laser light. Alternatively, by placing the base substrate on the XY axis moving stage and moving the XY axis moving stage in the X axis direction-Y axis direction, the predetermined portion on the lower electrode is relatively moved to the fixed laser beam irradiation position. Irradiate with scanning. By performing the heat treatment process by this laser light irradiation, the PZT liquid can be dried, pyrolyzed and crystallized to form an electromechanical conversion film having a desired pattern. The heat treatment step by laser light irradiation here includes a step of drying the PZT liquid, a step of thermally decomposing the dried PZT liquid film, and a step of crystallizing the thermally decomposed PZT liquid film. It is out.

  When an electromechanical conversion film having a desired pattern having a desired film thickness is to be obtained, the heat treatment process is performed when an electromechanical conversion film having a desired film thickness is obtained by performing the manufacturing process up to the heat treatment process once. Since the entire film is dried by performing a heat treatment with a laser beam at a temperature higher than a predetermined temperature, the surface temperature of the electromechanical conversion film to which the laser beam strikes is extremely higher than the internal temperature. And temperature difference distribution is formed in the whole inside of an electromechanical conversion film, and it becomes easy to generate | occur | produce a crack in an electromechanical conversion film. Therefore, a series of performing a coating process of dropping and applying the PZT liquid onto the electromechanical conversion film formed after the heat treatment process by the laser light irradiation and performing the heat treatment process by the laser light irradiation at a predetermined temperature. Repeat the process. Thereby, the film thickness of the electromechanical conversion film can be increased stepwise while suppressing the occurrence of cracks to obtain a desired film thickness.

  In the application process, in order to land the PZT liquid droplets on the predetermined portion of the lower electrode with high accuracy from the nozzles of the liquid droplet ejection heads, the landing position by the liquid droplet ejection heads is the target position before the manufacturing process. It is necessary to perform a first alignment adjustment process for obtaining a predetermined movement amount of the droplet discharge head. In the heat treatment process by laser light irradiation, in order to accurately irradiate the applied droplets of the PZT liquid with laser light, a predetermined irradiation position to the irradiation position where the irradiation position by the laser light source is aimed before the manufacturing process is determined. It is necessary to perform the second alignment adjustment process for acquiring the movement amount. And when performing the said thin film manufacturing process, it is necessary to perform the 3rd alignment adjustment process of rotating a board | substrate so that a board | substrate may be assembled | attached to a predetermined position, or moving to an XY-axis direction and adjusting the assembly position of a board | substrate. There is.

  As a method for performing these alignment adjustment steps, the method described in Patent Document 2 is known. In this alignment adjustment method of Patent Document 2, two cameras (imaging means) are used. In the first alignment adjustment step and the second alignment adjustment step, first and second cameras (imaging means) are used, and in the third alignment adjustment step, a second camera (imaging means) is used. In the first alignment adjustment step and the second alignment adjustment step, the substrate or the droplet discharge head by the XY axis movement stage is relatively moved, and the droplet discharge head is placed on the substrate placed on the XY axis movement stage. A few drops of the alignment mark forming solution are arranged in the vertical direction and landed in the X-axis direction. And a laser beam is irradiated to a predetermined fixed position. The zoom magnification of the first camera is adjusted as necessary while relatively moving the substrate or the laser light source in the X-axis direction, and an irradiation spot by laser light irradiation is placed within the imaging range of the first camera. While the substrate or the droplet discharge head is relatively moved in the X-axis direction, the zoom magnification of the second camera is adjusted as necessary, and each solution that has landed in the imaging range of the second camera is put. The irradiation spot and each of the landed solutions are captured. The first camera is a special camera such as an infrared camera capable of recognizing an irradiation spot of laser light such as infrared rays, and is more expensive than the second camera. The second camera is a drawing camera capable of recognizing alignment marks formed in advance on an alignment mark forming solution or a substrate. Then, the substrate or the irradiation spot by the XY axis moving stage is relatively moved so that the irradiation spot captured by the first camera coincides with each of the landed solutions captured by the second camera. . The amount of movement when the irradiation spot matches each landed solution is stored. Thus, the first alignment adjustment step and the second alignment adjustment step are completed. During the manufacturing process, after droplets were ejected onto a substrate at a predetermined position by a droplet ejection head, the substrate or irradiation spot by the XY axis movement stage was moved relatively by the stored movement amount, and landed. The solution can be irradiated with laser light.

  In the third alignment adjustment step, alignment marks are formed at two locations on the substrate, and these two alignment marks are used. That is, the substrate or the droplet discharge head is relatively moved based on two movement amounts stored in the first alignment adjustment step and the second alignment adjustment step. Then, the alignment mark forming solution is discharged by a droplet discharge head to two locations on the substrate different from the landing positions of the solution discharged in the first alignment adjustment step. The substrate or irradiation spot by the XY axis moving stage is relatively moved based on the two movement amounts, respectively, and laser light is irradiated to the two solutions, respectively, and drying and baking are performed. Thereby, two alignment marks are formed on the substrate. Then, the substrate is moved in the Y-axis direction by the XY-axis moving stage so that the two alignment marks are within the imaging range of the second camera, and the two alignment marks are captured by the second camera. Then, the second camera captures two alignment marks and stores the images. Thus, the third alignment adjustment process ends. In the manufacturing process, for example, when the thin film manufacturing process is performed again after the substrate is removed and another process is performed, two alignment marks on the installed substrate are captured by the second camera. Then, the substrate is rotated or moved in the XY-axis direction so that the two alignment marks on the substrate captured by the second camera coincide with the two alignment marks on the stored image. Adjust the attachment position.

  However, according to the alignment adjustment method of Patent Document 2, the alignment mark formed on the substrate or the solution for forming the alignment mark that is recognized by the first camera and is landed by the second camera is recognized. Recognize. As described above, the first camera, which is an expensive camera compared to the second camera, has a drawing photographing function capable of recognizing the landing alignment mark forming solution and the alignment mark formed on the substrate, Even if each alignment adjustment process can be performed only by the first camera having the drawing imaging function, the first camera becomes more expensive as the function is increased. For this reason, using the first camera when performing alignment adjustment leads to an increase in cost of the apparatus.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an alignment adjustment method for a thin film manufacturing apparatus, a thin film manufacturing apparatus, and an electric device manufactured by the thin film manufacturing apparatus, which can reduce the cost of the apparatus. A mechanical conversion film, an electromechanical conversion element, a droplet discharge head, and a droplet discharge device are provided.

  In order to achieve the above object, a solution for forming a thin film is ejected by a droplet ejection head onto a substrate held on a stage that can move in the XY plane and can be rotated in the plane, and a laser is applied to the solution landed on the substrate. In an alignment adjustment method of a thin film manufacturing apparatus that forms a thin film by irradiating a laser beam from a light source to form a thin film, the substrate or the droplet discharge head is relatively positioned so that the substrate is directly below the droplet discharge head. The alignment mark solution is discharged onto the substrate by the droplet discharge head after being moved from an arbitrary reference position, and the image pickup reference position of one imaging device for drawing and photographing is applied to the landed alignment mark solution. The first distance between the landing alignment mark solution and the imaging reference position when the substrate or the imaging means is moved relatively so as to coincide is stored. A first alignment adjustment step of relatively moving the substrate or the droplet discharge head based on the first distance so that the landing position comes directly below the droplet discharge head; and The irradiation position by the laser light source is relatively moved to irradiate a laser beam on the substrate by the laser light source to form an irradiation mark having a shape different from the shape of the alignment mark solution landed, and the irradiation mark is formed on the irradiation mark. A second distance between the irradiation trace and the imaging reference position when the imaging means or the substrate is relatively moved so that the imaging reference position of the imaging means coincides is stored, and the irradiation position by the laser light source is stored. A second alignment adjustment step of relatively moving an irradiation position by the substrate or the laser light source based on the second distance so that a landing position comes; An alignment mark having a predetermined shape that is different from the shape of the alignment mark solution that has been formed and has landed and the shape of the irradiation trace are imaged by the imaging means, and the substrate is based on the imaged shape of the alignment mark. Rotation angle is stored when the substrate or the imaging unit is relatively rotated so that the orientation of the substrate or the imaging unit is rotated so that a predetermined direction is detected, and the position of the alignment mark coincides with the imaging reference position of the imaging unit The position coordinate of the alignment mark on the stage when the image pickup unit or the substrate is relatively moved is stored, and the substrate or the substrate based on the rotation angle so that the orientation of the substrate becomes a predetermined orientation. The image pickup means is rotated relatively, and the position of the alignment mark coincides with the image pickup reference position. And a third alignment adjustment step of relatively moving the substrate or the imaging means.

  In the present invention, an object to be captured in the second alignment adjustment step is an irradiation mark. This irradiation trace is a drawn image, and can be recognized by an imaging means for drawing photographing having a function of recognizing drawing. As a result, all the objects to be captured in each alignment adjustment step can be recognized by the imaging means for drawing photographing. For this reason, it is not necessary to use an expensive and special imaging means for laser light photography like a conventional infrared camera, and an imaging means for drawing photography that is lower in cost than an imaging means for laser light photography. All alignment adjustment processes can be performed with only one unit. Therefore, the cost of the apparatus can be reduced.

  According to the present invention, it is possible to reduce the cost of the apparatus.

It is a schematic block diagram which shows the example of 1 structure of the droplet discharge apparatus of embodiment of this invention. It is a schematic perspective view of the droplet discharge device of the present embodiment. It is process sectional drawing which shows the manufacturing process of the electromechanical conversion element accompanied with formation of the electromechanical conversion film which concerns on one Embodiment of this invention. It is a characteristic view which shows the hysteresis curve of P (polarization) -E (electric field strength). It is a schematic block diagram which shows one structural example of the droplet discharge head comprised using the electromechanical conversion element manufactured with the manufacturing method. FIG. 6 is a schematic configuration diagram illustrating a configuration example in which a plurality of liquid ejection heads of FIG. 5 are arranged. It is a perspective view of the manufacturing apparatus of the electromechanical conversion film in the droplet discharge head of this embodiment. It is the schematic which shows each process of application | coating of functional ink by an electromechanical conversion film manufacturing apparatus, a heating, and crystallization. It is a schematic diagram for demonstrating alignment adjustment with the application position of a droplet discharge head, and the reference position within the imaging | photography range of a camera. It is a schematic diagram for demonstrating alignment adjustment with the irradiation position of a laser beam, and the reference position in the image of a camera. It is a schematic diagram for demonstrating the alignment adjustment of the coordinate system of a moving means group, the direction of a board | substrate, and a position. It is a schematic diagram for demonstrating a state when it deviates from the predetermined direction of an alignment mark. It is explanatory drawing which shows each mode of the contact angle of the pure water in the electrode exposure surface which removed the SAM film, and the surface where the SAM film has been arrange | positioned.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic configuration diagram showing a configuration example of a droplet discharge apparatus according to an embodiment of the present invention. FIG. 2 is a schematic perspective view of the droplet discharge device of this embodiment. An ink jet recording apparatus 100 as an example of the droplet discharge apparatus of the present invention shown in both figures mainly includes a carriage 101 that can move in the main scanning direction inside the recording apparatus main body, and the present invention mounted on the carriage 101. The printing mechanism unit 104 is configured to include a recording head 102 including an inkjet head, which is an example of a liquid droplet ejection head manufactured as described above, and an ink cartridge 103 that supplies ink to the recording head 102. In addition, a sheet feeding cassette 106 capable of stacking a large number of sheets 105 can be detachably attached to the lower part of the apparatus main body from the front side, and a manual feed tray 107 for manually feeding sheets 105 is provided. The paper 105 fed from the paper feed cassette 106 or the manual feed tray 107 can be taken in, and a required image is recorded by the printing mechanism 104, and then discharged to a paper discharge tray 108 mounted on the rear side. Make paper.

  The printing mechanism unit 104 holds a carriage 101 slidably in the main scanning direction by a main guide rod 109 and a sub guide rod 110 which are guide members horizontally mounted on left and right side plates (not shown). (Y), cyan (C), magenta (M), and black (Bk) ink droplets are ejected from a recording head 102, which is an example of a droplet ejection head according to the present invention that ejects ink droplets of each color. Outlets (nozzles) are arranged in a direction crossing the main scanning direction, and are mounted with the ink droplet ejection direction facing downward. In addition, each ink cartridge 103 for supplying ink of each color to the recording head 102 is replaceably mounted on the carriage 101. The ink cartridge 103 has an air port that communicates with the atmosphere upward, a supply port that supplies ink to the recording head 102 below, and a porous body filled with ink inside. The ink supplied to the recording head 102 by the force is maintained at a slight negative pressure.

  Further, although the heads of the respective colors are used here as the recording heads 102, a single head having nozzles for ejecting ink droplets of the respective colors may be used. Here, the carriage 101 is slidably fitted to the main guide rod 109 on the rear side (downstream side in the paper conveyance direction), and is slidably mounted on the sub guide rod 110 on the front side (upstream side in the paper conveyance direction). doing. In order to move and scan the carriage 101 in the main scanning direction, a timing belt 114 is stretched between a driving pulley 112 and a driven pulley 113 that are rotationally driven by a main scanning motor 111, and the timing belt 104 is moved to the carriage 101. The carriage 101 is reciprocally driven by forward and reverse rotations of the main scanning motor 111.

  On the other hand, in order to convey the paper 105 set in the paper feed cassette 106 to the lower side of the recording head 102, the paper feed roller 115 and the friction pad 116 for separating and feeding the paper 105 from the paper feed cassette 106 and the paper 105 are guided. A guide member 117 that rotates, a conveyance roller 118 that reverses and conveys the fed paper 105, a conveyance roller 119 that is pressed against the peripheral surface of the conveyance roller 118, and a feeding angle of the sheet 105 from the conveyance roller 118. A tip roller 120 is provided. The transport roller 118 is rotationally driven by a sub-scanning motor 121 through a gear train. A printing receiving member 122 is provided as a paper guide member that guides the paper 105 fed from the transport roller 118 on the lower side of the recording head 102 corresponding to the movement range of the carriage 101 in the main scanning direction. A conveyance roller 123 and a spur 124 that are rotationally driven to send the paper 105 in the paper discharge direction are provided on the downstream side of the printing receiving member 122 in the paper conveyance direction, and the paper 105 is further delivered to the paper discharge tray 108. A roller 125 and a spur 126, and guide members 127 and 128 that form a paper discharge path are disposed.

  At the time of recording, the recording head 102 is driven in accordance with the image signal while moving the carriage 101, thereby ejecting ink onto the stopped paper 105 to record one line. Record the line. Upon receiving a recording end signal or a signal that the trailing edge of the paper 105 has reached the recording area, the recording operation is terminated and the paper 105 is discharged.

  Further, a recovery device 129 for recovering the ejection failure of the recording head 102 is disposed at a position outside the recording area on the right end side in the movement direction of the carriage 101. The recovery device 129 includes a cap unit, a suction unit, and a cleaning unit. The carriage 101 is moved to the recovery device 129 side during printing standby, and the recording head 102 is capped by the capping means, and the ejection port portion is kept in a wet state to prevent ejection failure due to ink drying. Further, by ejecting ink that is not related to recording during recording or the like, the ink viscosity of all the ejection ports is made constant and stable ejection performance is maintained.

  As described above, since the ink jet recording apparatus is equipped with the ink jet head of the present embodiment, there is no ink droplet ejection failure due to vibration plate drive failure, stable ink droplet ejection characteristics are obtained, and image quality is improved. .

  Next, the manufacturing process of the electromechanical conversion film according to the embodiment of the present invention will be described. In this embodiment, an electromechanical conversion element having a transverse vibration (bend mode) type electromechanical conversion film using deformation of the piezoelectric constant d31 will be described as an example. The present invention is an electromechanical conversion film of this type. It is applicable without being limited to.

  When the electromechanical conversion film is a PZT film, a PZT precursor solution synthesized using lead acetate trihydrate, isopropoxide titanium, and normal butoxide zirconium as starting materials can be used. The crystal water of lead acetate is dissolved in methoxyethanol and then dehydrated. The amount of lead is 10 mol% excess relative to the stoichiometric composition. This is to prevent crystallinity deterioration due to so-called lead loss during heat treatment. It is possible to synthesize PZT precursor solution by dissolving isopropoxide titanium and normal butoxide zirconium in methoxyethanol, proceeding with alcohol exchange reaction and esterification reaction, and uniformly mixing with methoxyethanol solution in which lead acetate is dissolved. it can. The PZT concentration of the PZT precursor solution is, for example, 0.1 mol / liter.

  The PZT precursor solution in the case where the electromechanical conversion film is a PZT film is prepared by dissolving lead acetate, zirconium alkoxide, and titanium alkoxide compounds described in Non-Patent Document 1 as starting materials and dissolving them in methoxyethanol as a common solvent. Alternatively, a uniform solution may be obtained. The PZT precursor solution is also called “sol-gel solution”.

PZT is a solid solution of lead zirconate (PbZrO ₃ ) and lead titanate (PbTiO ₃ ), and the characteristics differ depending on the ratio. In general, the composition exhibiting excellent piezoelectric characteristics has a ratio of PbZrO ₃ and PbTiO ₃ of 53:47. When expressed by a chemical formula, Pb (Zr0.53, Ti0.47) O ₃ , generally PZT (53/47) It is indicated. The starting materials for lead acetate, zirconium alkoxide and titanium alkoxide compounds are weighed according to this chemical formula. Since the metal alkoxide compound is easily hydrolyzed by moisture in the atmosphere, an appropriate amount of a stabilizer such as acetylacetone, acetic acid or diethanolamine may be added to the precursor solution as a stabilizer.

  Examples of composite oxides other than PZT include barium titanate. In this case, it is also possible to prepare a barium titanate precursor solution by dissolving barium alkoxide and a titanium alkoxide compound in a common solvent. is there.

  Further, when obtaining a patterned PZT film as an electromechanical conversion film on the surface of the first electrode on the base substrate, a coating film is formed by applying the above solution as a coating liquid by a droplet discharge method. A patterned PZT film can be obtained by performing heat treatments of solvent drying, thermal decomposition, and crystallization. Since transformation from the coating film to the crystallized film involves volume shrinkage, it is preferable to obtain a film thickness of 100 [nm] or less in one step in order to obtain a crack-free film. And it is preferable to adjust so that a precursor density | concentration may be optimized from the relationship between the film-forming area of an electromechanical conversion film, and the application quantity of a PZT precursor solution. Further, when used as an electromechanical conversion element of a droplet discharge device, the thickness of the PZT film is required to be 1 [μm] to 2 [μm]. In order to obtain this film thickness, the process is repeated ten times or more.

  Further, in the case of forming a patterned electromechanical conversion layer by the sol-gel method, the PZT precursor solution in which the wettability of the base substrate is controlled is separately applied. This utilizes the phenomenon of alkanethiol self-arranged on a specific metal shown in Non-Patent Document 2, and first, a SAM (Self assembled monolayer) film of thiol on the surface of the platinum group metal of the substrate. Form. Since the alkyl group is arranged on the SAM film, it becomes lyophobic. This SAM film can be patterned using a photoresist by, for example, well-known photolithography etching. Since the patterned SAM film remains even after the resist is peeled off, this portion is lyophobic. On the other hand, the portion from which the SAM film has been removed is lyophilic because the platinum surface is exposed. Using this surface energy contrast, the PZT precursor solution can be applied separately. In the present embodiment, after the SAM film is selectively formed in a region where the PZT precursor solution is not applied, as shown below, the droplet discharge method can reduce the consumption of the PZT precursor solution. The PZT precursor solution is selectively applied by coating (inkjet coating).

FIG. 3 is a process cross-sectional view illustrating a manufacturing process of an electromechanical conversion element accompanied with formation of an electromechanical conversion film according to an embodiment of the present invention. A platinum electrode made of a platinum group metal (not shown) as a first electrode excellent in reactivity with thiol is formed on the surface (upper surface) of the substrate 11 shown in FIG. Yes. A SAM film 12 is formed on the surface of the platinum electrode of the substrate 11 as shown in FIG. The SAM film 12 can be obtained by dipping the substrate 11 in an alkanethiol solution and making it self-align. In this example, an alkanethiol solution obtained by dissolving alkanethiol molecules of CH ₃ (CH ₂ ) —SH in a general organic solvent (alcohol, acetone, toluene, etc.) at a predetermined concentration (for example, several [mol / l]). Was used. After immersing the substrate 11 in this alkanethiol solution and taking it out after a predetermined time, the SAM film 12 can be formed on the surface of the platinum electrode by replacing and washing excess molecules with a solvent and drying. Next, as shown in (c) of the figure, a photoresist 13 is patterned by photolithography, and dry etching (for example, oxygen plasma irradiation or UV light irradiation) is performed as shown in (d) of the figure. Then, the SAM film 12 is removed, and the photoresist 13 used for processing is removed, and the patterning of the SAM film 12 is completed. The SAM film 12 formed in this manner has a contact angle with respect to pure water of, for example, 92 degrees and exhibits lyophobic properties. On the other hand, the surface of the platinum electrode of the substrate 11 exposed by removing the SAM film 12 has a contact angle with pure water of, for example, 54 degrees and exhibits lyophilicity.

  Next, after performing the steps shown in FIGS. 3A to 3D, a droplet discharge method in which the droplets of the PZT precursor solution are discharged from the nozzles, specifically, the PZT precursor by the droplet discharge head 14 is used. The body solution 15 is applied (see (e) of FIG. 3). The application of the PZT precursor solution 15 is performed such that the PZT film 16 is not formed on the SAM film that is a lyophobic part, and the PZT film is formed only on the lyophilic part from which the SAM film has been removed. Finally, the electromechanical conversion film 17 is obtained by performing heat treatments such as solvent drying, thermal decomposition, and crystallization (see (f) of FIG. 3).

  In the method of FIG. 3, the heat treatments of PZT precursor solution application, solvent drying, thermal decomposition, and crystallization are performed once by (a) to (d) of FIG. As shown in the case of obtaining an electromechanical conversion film having a film thickness, (a) to (d) of FIG. 3 above, (e) of FIG. 3 of application of the PZT precursor solution by the droplet discharge method, and solvent drying, 3 (f) of the thermal decomposition and crystallization heat treatments are repeatedly performed a predetermined number of times (two or more times) to form thin electro-mechanical conversion films in multiple layers, and the electric film having a predetermined thickness is formed. A mechanical conversion film may be obtained. In this case, generation of cracks in the electromechanical conversion film can be prevented more reliably.

  Further, in the method of FIG. 3 described above, the surface modification other than the predetermined portion on which the PZT precursor solution on the first electrode is applied is made a lyophobic surface by the SAM film. When the surface is a lyophobic surface, surface modification may be performed so that the surface of a predetermined portion to which the PZT precursor solution on the first electrode is applied becomes a lyophilic surface.

The manufacturing process described above was repeated 15 times to obtain a film of 500 [nm]. No defects such as cracks occurred in the film produced at this time. Further, selective application of the PZT precursor and laser irradiation were performed 15 times to perform crystallization treatment. Defects such as cracks did not occur in the film. The film thickness reached 1000 [nm]. An upper electrode (platinum) was formed on this patterned film, and electrical characteristics and electromechanical conversion ability (piezoelectric constant) were evaluated. As a result, a hysteresis curve of P (polarization) -E (electric field strength) in FIG. 4 was obtained. The relative dielectric constant of the film is 1220, the dielectric loss is 0.02, the remanent polarization is 19.3 [μC / cm ² ], and the coercive electric field is 36.5 [kV / cm], which is equivalent to a normal ceramic sintered body It was found that it has the characteristics of In addition, the electromechanical conversion ability was calculated by measuring the amount of deformation by applying an electric field with a laser Doppler vibrometer and fitting it by simulation. The piezoelectric constant d31 was 120 [pm / V], which was also the same value as the ceramic sintered body. This value is a characteristic value that can be sufficiently designed as a piezoelectric element for use in a liquid discharge head. As an electrode film, an electrode film can be formed in the same manner as the piezoelectric layer by dissolving an oxide such as platinum, SrRuO _3, or LaNiO ₃ in a solvent, applying the ink by an inkjet method, and irradiating with a laser.

  FIG. 5 is a schematic configuration diagram showing a configuration example of a droplet discharge head configured using the electromechanical conversion element manufactured by the manufacturing method. In the illustrated example, a diaphragm 30, an adhesion layer 41, and a lower electrode (first electrode) 42 are stacked on a silicon substrate 20 serving as a liquid chamber substrate, and a predetermined on the lower electrode (first electrode) 42 is formed. The electromechanical conversion element (PZT element) 43 and the upper electrode 44 having the same performance as that of bulk ceramics can be patterned and formed on the portion by the simple manufacturing method described above. Thereafter, the liquid chamber 22a is formed from the back surface (the lower surface in the drawing) of the silicon substrate 20 by an etching removal process, and the nozzle plate 22 having the nozzle holes 21 is joined, whereby the liquid discharge head 50 can be manufactured. In the figure, descriptions of the liquid supply means, the flow path, and the fluid resistance are omitted. Further, a plurality of the droplet discharge heads 50 shown in FIG. 5 can be arranged as shown in FIG.

  FIG. 7 is a perspective view of an electromechanical conversion film manufacturing apparatus in the droplet discharge head of this embodiment. The electromechanical conversion film manufacturing apparatus 200 shown in the figure includes a droplet discharge head 201 for applying functional ink on a substrate, a stage 203 for holding the substrate 202, and heating the applied functional ink to crystallize it. A laser head 204 for adjusting the position, a camera 205 for alignment, a θ axis moving means 206 for adjusting the orientation of the substrate, a scan axis moving means 207 for moving the substrate in the scan axis direction, and a substrate in the feed axis direction Feed shaft moving means 208 for moving the feed shaft. The scan axis corresponds to the X axis in the figure, and the feed axis corresponds to the Y axis in the figure. The droplet discharge head 201 is supported by a droplet discharge head support member 209. Ink is supplied to the droplet discharge head 201 from each ink tank (not shown) from a functional material ink supply pipe. The stage 203 for holding the substrate 202 is accompanied by suction means such as vacuum and static electricity (not shown) so that the substrate 202 can be fixed on the stage 203. The laser head 204 is supported by a laser head support member 210. The laser head 204 may be a multi-channel or a single port, but a multi-channel is preferable. The wavelength of the laser beam 204-1 is preferably an infrared region or an ultraviolet region, and more preferably a wavelength having a high absorption coefficient of the substrate or a layer formed on the substrate. The camera 205 is supported by the camera support member 211. The camera 205 preferably has a larger number of pixels. As a result, since a wide area can be imaged, the time required for alignment can be shortened, and since the image can be imaged with high resolution, the alignment mark can be accurately recognized. An example of a camera with a large number of pixels is a 1/2 type progressive scan CMOS camera (model number: EO-5012, number of pixels: about 5 million pixels) manufactured by Edmund. In addition, in such a camera, there is a camera having a pixel size of 2.2 [μm] × 2.2 [μm] in length. Using this camera, for example, when a microscope type lens having a general lens magnification of 5 is mounted, an area of about 1 mm square can be photographed with a resolution of about 0.4 [μm].

  The stage 203 that holds the substrate 202 is installed on the θ-axis moving means 206, and the orientation of the substrate can be adjusted. The θ-axis moving means 206 preferably has an encoder function so that the amount of rotation can be detected and recorded. Further, the θ-axis moving unit 206 is installed on the scan axis moving unit 207, and can move the substrate 202 in order to perform application, heating, and crystallization on the functional ink pattern. The scan axis driving means 207 and the feed axis driving means 208 preferably have an encoder function so that the amount of movement can be detected and recorded.

  FIG. 8 shows a functional ink coating, heating, and crystallization process by the electromechanical conversion film manufacturing apparatus 200 shown in FIG. First, as shown in FIG. 8A, the substrate 202 is moved directly below the droplet discharge head using the scan axis moving means 207 and the feed axis driving means 208, and an arbitrary pattern is applied onto the substrate 202. Thereafter, as shown in FIG. 8B, the substrate 202 is moved directly below the laser head 204, and the functional ink is heated and crystallized by irradiating the laser. This process is repeated until the desired film thickness is obtained.

  The functional ink application position and the laser light irradiation position are set in the scan axis direction (left-right direction in FIG. 8) and the feed axis direction (front-rear direction in FIG. 8) so that the steps described above can be performed at an arbitrary place. ) Can be adjusted. Furthermore, in order to efficiently perform the functional ink application, heating, and crystallization processes, the θ-axis direction (scan axis-rotation in the feed axis plane) can be adjusted. In the steps described above, the droplet discharge head 201 and the laser head 204 may move. In this case, the substrate may be fixed. Further, the laser head 204 is fixed, and the laser beam may be scanned with a mirror or the like.

Next, an alignment adjustment process for applying, heating, and crystallizing the functional ink on the pattern will be described. This process includes the following three alignment adjustment processes.
Alignment adjustment step A: Alignment of the distance between the application position of the droplet discharge head and the reference position within the imaging range of the camera Alignment adjustment step B: The distance between the irradiation position of the laser beam and the reference position within the imaging range of the camera Alignment adjustment step C: Alignment of the coordinate system of the scan axis driving means and the feed axis driving means as the moving means group and the orientation and position of the substrate

  First, the alignment adjustment process A for the distance between the application position of the droplet discharge head and the reference position within the imaging range of the camera will be described. FIG. 9 is a schematic diagram for explaining alignment adjustment between the application position of the droplet discharge head and the reference position within the photographing range of the camera.

First, the stage 203 is moved directly below the droplet discharge head 201, and the liquid is discharged from the droplet discharge head 201. The positions of the scan axis driving means 207 and the feed axis driving means 208 at this time are (X _IJ , Y _IJ ). At this time, the landing position where the droplet has landed is the landing position 251 of the droplet discharge head 201. Then, after the droplet has landed on the stage, the stage 203 is moved so that the landed droplet comes to the photographing reference position 252 of the camera 205. The positions of the scan axis driving means 207 and the feed axis driving means 208 at this time are (X _C , Y _C ). The distances (ΔX _a , ΔY _a ) between the landing position 251 of the droplet discharge head and the imaging reference position 252 within the imaging range of the camera 205 are ΔX _a = X _IJ −X _C , ΔY _a = Y _IJ −Y _C . Thereby, the alignment of the distance between the landing position 251 of the droplet discharge head and the shooting reference position 252 within the shooting range of the camera 205 is completed. This alignment adjustment process is performed when the apparatus is constructed. Moreover, it is preferable to perform this alignment adjustment process at the time of apparatus replacement | exchange and regularly. Furthermore, it is preferable that the liquid applied in this alignment adjustment step is the same as the liquid used for pattern application.

  Next, the alignment adjustment process B for the distance between the irradiation position of the laser beam and the reference position in the camera image will be described. FIG. 10 is a schematic diagram for explaining alignment adjustment between the irradiation position of the laser beam and the reference position in the image of the camera.

First, the stage 203 is moved directly below the laser head 204, and laser light is irradiated from the laser head 204 to leave a trace of the irradiation position. At this time, it is desirable to fix a photosensitive paper or the like that reacts with the laser beam on the stage 203 so that the place irradiated with the laser beam can be recognized. The positions of the scan axis driving unit 207 and the feed axis driving unit 208 at this time are (X _L , Y _L ). At this time, the position irradiated with the laser beam is the irradiation position 261 of the laser beam. Then, after irradiating the laser beam, the stage 203 is moved so that the trace of the irradiation position comes to the reference point position 252 of the camera 205. The positions of the scan axis driving means 207 and the feed axis driving means 208 at this time are (X ′ _C , Y ′ _C ). The distances (ΔX _b , ΔY _b ) between the laser light irradiation position 261 and the imaging reference position 252 within the imaging range of the camera 205 are _expressed as _follows : ΔX _b = X _L −X ′ _C , ΔY _b = Y _L −Y ′ _{Let C} be. Thereby, the alignment of the distance between the laser light irradiation position 261 and the reference position 251 within the imaging range of the camera 205 is completed. This alignment adjustment process is performed when the apparatus is constructed. Furthermore, it is preferable to perform this alignment adjustment process at the time of apparatus replacement | exchange and regularly.

  Next, the coordinate adjustment process C of the moving means group of the scan axis driving means 207 and the feed axis driving means 208 and the orientation and position of the substrate will be described. FIG. 11 is a schematic diagram for explaining the alignment adjustment of the coordinate system of the moving means group, the orientation of the substrate, and the installation position.

First, the substrate 202 is fixed on the stage 203, and the substrate 202 is moved so that the alignment mark 271 formed in advance on the substrate 202 is within the photographing range 253 of the camera as shown in FIG. The mark 271 is captured. Then, the orientation of the substrate 202 is detected based on the shape of the captured alignment mark 271 and rotated in the θ direction so that the orientation of the substrate 202 becomes a predetermined orientation as shown in FIG. Next, as shown in FIG. 11C, the alignment mark 271 is moved to the photographing reference position 252 within the photographing range of the camera. The positions of the scan axis driving means 207 and the feed axis driving means 208 at this time are (X " _C , Y" _C ). Thereby, the alignment of the coordinate system of the scan axis driving means 207 and the feed axis driving means 208, the orientation of the substrate, and the installation position is completed. At this time, the alignment mark 271 preferably has a straight portion in its shape so that the orientation of the substrate 202 can be easily recognized.

By performing the three alignments, it is possible to apply functional ink to a predetermined position on the substrate and irradiate the position with laser light. For example, the substrate 202 is rotated based on the alignment mark 271 formed in advance on the substrate 202 so that the orientation of the substrate 202 becomes a predetermined orientation. When the coating is applied at a position (ΔX _P , ΔY _P ) away from the alignment mark 271, the scan axis driving unit 207 and the feed axis driving unit 208 are (X ″ _C −ΔX ′ _P + ΔX _a , Y ″ _C −ΔY). ' _P + ΔY _a ), the functional ink is applied to the pattern application position. Further, by moving the scan axis driving unit 207 and the feed axis driving unit 208 to be (X " _C -ΔX ' _P + ΔX _b , Y" _C -ΔY' _P + ΔY _b ), the coating position on the substrate Is irradiated with a laser.

  Here, when there is one alignment mark, the size of the alignment mark is increased. In this way, the larger the size, the more accurately the inclination of the substrate can be recognized. FIG. 12 is a schematic diagram for explaining a state when the alignment mark is deviated from a predetermined direction when there is one alignment mark. The alignment mark shown in the figure is a cross-shaped mark, but is not limited to this. In the figure, an alignment mark 272 is a rotation of a deviation angle Δθ with respect to the alignment mark 271 in a predetermined direction. The deviation amount D between the alignment mark 271 and the alignment mark 272 is L × sin Δθ, where L is the length of the horizontal straight line portion of the alignment mark used for determining the tilt of the substrate. That is, the larger the length L of the horizontal straight line portion of the alignment mark, the larger the misalignment amount D of the alignment mark. If the length of the horizontal straight line portion of the alignment mark is increased even when the angle is small, it will be easy to recognize.

  Further, by using two alignment marks and setting the length L as the distance between the two alignment marks, the substrate can be oriented in a predetermined direction. Thereby, the area | region which can apply | coat a pattern can be ensured widely. At this time, the distance between the alignment marks is preferably long, and is preferably at least half of the diameter of the circumscribed circle in contact therewith. Since the region where the pattern can be applied can be widened, the alignment mark is preferably located at the end of the substrate. The size of the alignment mark should be small if it is larger than the size that can be recognized by the camera in order to widen the area where the pattern can be applied. At this time, the size of the alignment mark is preferably smaller than the short width of the pattern to be applied. Thereby, the position accuracy of the alignment mark can be at least equal to or shorter than the short width of the pattern. When there are a plurality of alignment marks, the alignment marks may have the same shape, but the shapes of the individual alignment marks are preferably different. This can reduce the time required to recognize a specific alignment mark. Moreover, since the alignment mark is not mistakenly recognized, the yield can be improved.

Then, a thermal oxide film (film thickness 1 [μm]) was formed on the silicon wafer, and a titanium film (film thickness 50 [nm]) was formed by sputtering as an adhesion layer. Subsequently, a platinum film (film thickness 200 [nm]) was formed by sputtering as the lower electrode. SAM treatment was performed by using CH ₃ (CH ₂ ) ₆ -SH in alkanethiol and immersing it in a 0.01 [mol / l] (solvent: isopropyl alcohol) solution. Then, after washing with isopropyl alcohol and drying, the process proceeds to a patterning process.

  The lyophobic property after the SAM treatment was measured by a contact angle, and the contact angle of water on the SAM film was 92.2 °. On the other hand, that of the sputtered platinum film before SAM treatment is 5 ° or less (complete wetting), indicating that the SAM film treatment was performed.

  A photoresist made by Tokyo Ohka Co., Ltd. (TSMR8800) was formed by spin coating, a resist pattern was formed by ordinary photolithography, and oxygen plasma treatment was then performed to remove the exposed SAM film. The residual resist after the treatment was dissolved and removed with acetone, and the same contact angle evaluation was performed. As a result, the removed portion was 5 ° or less (completely wet), and the portion covered with the resist had a value of 92.4 °. It was confirmed that the SAM film was patterned.

  As another type of patterning, a resist pattern was formed in advance with the same resist work, and after the same SAM film treatment, the resist was removed with acetone, and the contact angle was measured. The contact angle on the resist-covered platinum film was 5 ° or less (complete wetting), and that at other sites was 92.0 °, confirming that the SAM film was patterned.

  As another method, ultraviolet irradiation using a shadow mask was performed. The ultraviolet rays used were irradiated with vacuum ultraviolet light having a wavelength of 176 [nm] from an excimer lamp for 10 minutes. The contact angle of the irradiated part was 5 ° or less (completely wet) (see FIG. 13A), and that of the unirradiated part was 92.2 ° (see FIG. 13B). It was confirmed that conversion was made.

  PZT (53/47) is deposited as a piezoelectric layer. In the synthesis of the precursor coating solution, lead acetate trihydrate, isopropoxide titanium, and isopropoxide zirconium were used as starting materials. Crystal water of lead acetate was dissolved in methoxyethanol and then dehydrated. The lead amount is 10 mol% excess relative to the stoichiometric composition. This is to prevent crystallinity deterioration due to so-called lead loss during heat treatment.

  Isopropoxide titanium and isopropoxide zirconium were dissolved in methoxyethanol, the alcohol exchange reaction and the esterification reaction were advanced, and the PZT precursor solution was synthesized by mixing with the methoxyethanol solution in which the lead acetate was dissolved. The PZT concentration was 0.1 mol [mol / l].

  The film thickness obtained by one sol-gel film formation is preferably 100 [nm], and the precursor concentration is optimized from the relationship between the film formation area and the amount of applied precursor. Therefore, it is not limited to 0.1 [mol / l]. This precursor solution was applied on the patterned SAM film by an ink jet method. By discharging only the lyophilic part without discharging droplets on the SAM film by the ink jet method, a coating film was formed only on the lyophilic part due to the contact angle contrast. At the time of this coating, the substrate is heated by irradiating the laser with an output according to the film thickness, and the patterned precursor ink is dried and crystallized, and the electromechanical conversion film 17 shown in FIG. Obtained.

  As described above, since the inkjet head embodying the present invention is mounted in this inkjet recording apparatus, there is no ink droplet ejection failure due to vibration plate drive failure, stable ink droplet ejection characteristics are obtained, and image quality is improved. improves.

What has been described above is merely an example, and the present invention has a specific effect for each of the following modes.
(Aspect A)
In the first alignment adjustment step, the substrate or the droplet discharge head is relatively moved from an arbitrary reference position so that the substrate is directly below the droplet discharge head, and the solution for alignment marks is transferred to the substrate by the droplet discharge head. The first movement amount when the substrate or the imaging unit is relatively moved so that the imaging reference position of one imaging unit for drawing imaging coincides with the alignment mark solution discharged and landed on the top. Based on the first movement amount, the substrate or the droplet discharge head is relatively moved so that the landing position comes directly below the droplet discharge head. In the second alignment adjustment step, the irradiation position by the substrate or the laser light source is relatively moved from the reference position, the laser light is irradiated on the substrate by the laser light source, and an irradiation mark is formed on the irradiation mark. A second movement amount when the substrate or the imaging means is relatively moved so that the photographing reference positions coincide is stored, and based on the second movement amount so that the landing position comes to the irradiation position by the laser light source. The irradiation position by the substrate or the laser light source is relatively moved. In the third alignment adjustment step, an alignment mark formed in advance on the substrate is imaged by an imaging means, and the substrate is detected so as to be in a predetermined direction based on the shape of the imaged alignment mark. Alternatively, the rotation angle is stored when the image pickup means is relatively rotated, and the alignment mark stage when the image pickup means or the substrate is relatively moved so that the position of the alignment mark coincides with the image pickup reference position of the image pickup means. The position coordinates are stored so that the substrate or the imaging means is relatively rotated based on the rotation angle so that the orientation of the substrate becomes a predetermined orientation, and the position of the alignment mark coincides with the imaging reference position. The substrate or the imaging means is relatively moved based on the above. According to this, as described in the above embodiment, the object to be captured in the second alignment adjustment step is the irradiation trace on which the photosensitive paper is pasted on the substrate and the trace remains on the photosensitive paper. This irradiation trace is a drawn image and can be recognized by the camera 205 having a function of recognizing the drawing. As a result, all objects to be captured in each alignment adjustment step can be recognized by the camera 205 for drawing photography. For this reason, it is not necessary to use an expensive and special imaging means for laser light photography like a conventional infrared camera, and the drawing photography camera 205 which is lower in cost than the imaging means for laser light photography is provided. All alignment processes can be performed with only one unit. Therefore, cost reduction can be achieved.
(Aspect B)
In (Aspect A), the alignment mark has a straight portion. According to this, as described in the above embodiment, since the orientation of the alignment mark 271 is easily recognized and the recognition accuracy of the orientation of the substrate 202 is improved, the pattern application accuracy is improved.
(Aspect C)
In (Aspect A) or (Aspect B), one alignment mark is formed, and the alignment mark is substantially the same as the size of the substrate. According to this, as described in the above embodiment, the alignment mark 271 is large, the recognition accuracy of the orientation of the alignment mark 271 is improved, and the recognition accuracy of the orientation of the substrate 202 is improved. Will improve.
(Aspect D)
In (Aspect A) or (Aspect B), a plurality of alignment marks are formed. According to this, as described in the above embodiment, it is possible to realize highly accurate substrate orientation recognition in a state where the space occupied by the alignment mark 271 with respect to the substrate 202 is reduced. The pattern can be applied, and the production cost can be reduced.
(Aspect E)
In (Aspect D), the length between at least one set of alignment marks is longer than half the diameter of the circumscribed circle with which the substrate contacts. According to this, as described in the above embodiment, the recognition accuracy of the orientation of the substrate is improved by using a plurality of alignment marks at distant positions, so that the accuracy of pattern application is improved.
(Aspect F)
The alignment is adjusted using the alignment adjustment method of any of the thin film manufacturing apparatuses of (Aspect A) to (Aspect D). According to this, as described in the above embodiment, since only one expensive camera is required, the cost of the entire apparatus can be reduced, and the installation space occupied in the apparatus can be reduced and the size can be reduced.
(Aspect G)
A solution for forming an electromechanical conversion film is discharged by a droplet discharge head using the thin film manufacturing apparatus of (Aspect F), and the solution that has landed on the substrate is irradiated with laser light from a laser light source to be heat-treated. . According to this, since the manufacturing cost can be suppressed as described in the above embodiment, the manufactured electromechanical conversion film can be reduced in cost.
(Aspect H)
After the first electrode is formed on the electromechanical conversion film of (Aspect G), the second electrode is disposed so as to sandwich the electromechanical conversion film formed on the first electrode. According to this, since the manufacturing cost can be suppressed as described in the above embodiment, the manufactured electromechanical transducer can be manufactured at low cost.
(Aspect I)
The electromechanical transducer of (Aspect H) was provided. According to this, since the manufacturing cost can be suppressed as described in the above embodiment, the manufactured droplet discharge head can be made low-cost.
(Aspect J)
The liquid droplet ejection head of (Aspect I) was provided. According to this, since the manufacturing cost can be suppressed as described in the above embodiment, the manufactured droplet discharge device can be made low-cost.

11 Substrate 12 SAM Film 13 Photoresist 14 Droplet Discharge Head 15 PZT Precursor Solution 16 PZT Film 17 Electromechanical Conversion Film 20 Silicon Substrate 21 Nozzle Hole 22 Nozzle Plate 22a Liquid Chamber 30 Vibration Plate 41 Adhesion Layer 42 Lower Electrode 43 Electromechanical Conversion element 44 Upper electrode 50 Liquid discharge head 100 Inkjet recording apparatus 200 Electromechanical conversion film manufacturing apparatus 201 Droplet discharge head 202 Substrate 203 Stage 204 Laser head 205 Camera 206 θ axis moving means 207 Scan axis moving means 208 Feed axis moving means 209 Droplet discharge head support member 210 Laser head support member 211 Camera support member 251 Landing position 252 Shooting reference position 253 Shooting range 261 Irradiation position 271 Alignment mark 272 Application portion 273 Alignment mark

JP 2008-187302 A Japanese Patent No. 4353145

K. D. Budd, S.M. K. Day and D.D. A. Payne, Proc. Brit. Ceram. Soc. 36, 107 (1985) A. Kumar and G.K. M.M. Whitesides, Appl. Phys. Lett. 63, 2002 (1993)

Claims (10)

A solution for forming a thin film is ejected by a droplet ejection head onto a substrate that is held on a stage that can move in the XY plane and that can rotate in-plane, and the solution that has landed on the substrate is irradiated with laser light from a laser light source. In the alignment adjustment method of a thin film manufacturing apparatus that forms a thin film by performing heat treatment,
The substrate or the droplet discharge head is relatively moved from an arbitrary reference position so that the substrate is directly below the droplet discharge head, and an alignment mark solution is placed on the substrate by the droplet discharge head. The first movement amount when the substrate or the imaging unit is relatively moved so that the imaging reference position of one imaging unit for drawing imaging coincides with the discharged alignment mark solution. Storing, and a first alignment adjustment step of relatively moving the substrate or the droplet discharge head based on the first movement amount so that the landing position comes directly below the droplet discharge head;
The irradiation position of the substrate or the laser light source is relatively moved from the reference position, and the laser light is irradiated on the substrate by the laser light source to form an irradiation mark, and the imaging reference position of the imaging means is formed on the irradiation mark. Is stored based on the second movement amount so that the landing position comes to the irradiation position by the laser light source. A second alignment adjustment step of relatively moving the irradiation position by the substrate or the laser light source,
An image of an alignment mark formed in advance on the substrate is picked up by the image pickup means, and the substrate or the image pickup means is detected so that the orientation of the substrate is detected based on the shape of the picked-up alignment mark. The rotation angle is stored when the image pickup device or the substrate is relatively moved so that the rotation angle is stored and the position of the alignment mark coincides with the image pickup reference position of the image pickup device. Is stored in the stage, the substrate or the imaging means is relatively rotated based on the rotation angle so that the orientation of the substrate is a predetermined orientation, and the position of the alignment mark is the imaging Third alignment for relatively moving the substrate or the imaging means based on the position coordinates so as to coincide with a reference position Alignment method of a thin film manufacturing apparatus characterized by comprising an adjusting step. In the alignment method of the thin film manufacturing apparatus of Claim 1,
An alignment adjustment method for a thin film manufacturing apparatus, characterized in that the alignment mark has a straight line shape. In the alignment method of the thin film manufacturing apparatus of Claim 1 or 2,
One alignment mark is formed, and the alignment mark is substantially the same as the size of the substrate. In the alignment method of the thin film manufacturing apparatus of Claim 1 or 2,
An alignment adjustment method for a thin film manufacturing apparatus, wherein a plurality of the alignment marks are formed. In the alignment method of the thin film manufacturing apparatus of Claim 4,
An alignment adjustment method for a thin film manufacturing apparatus, wherein a length between at least one set of the alignment marks is longer than a half of a diameter of a circumscribed circle in contact with the substrate.   A thin film manufacturing apparatus that adjusts alignment using the alignment adjustment method of the thin film manufacturing apparatus according to claim 1.   Using the thin film manufacturing apparatus according to claim 6, the solution for forming the electromechanical conversion film is discharged by a droplet discharge head, and the solution that has landed on the substrate is irradiated with laser light from a laser light source to be subjected to heat treatment. An electromechanical conversion film characterized by:   A first electrode is formed on the electromechanical conversion film according to claim 7, and then the second electrode is disposed so as to sandwich the electromechanical conversion film formed on the first electrode. An electromechanical conversion element characterized by the above.   A droplet discharge head comprising the electromechanical conversion element according to claim 8.   A droplet discharge apparatus comprising the droplet discharge head according to claim 9.