JP2013061288A - Manufacturing method of semiconductor device, measurement device, feeding device, and program - Google Patents

Abstract

An object of the present invention is to improve the accuracy of a predetermined test executed in a state in which a device under measurement and a measurement device are connected via an intermediate member.
A method of manufacturing a semiconductor device, comprising: a computer determining a pass / fail of a device to be measured connected to a measuring device via a mediating member, wherein the resistance calculating step calculates a resistance value of the mediating member S10, a test signal is input to the device under test, and then a measurement step S20 for obtaining a response signal output from the device under test, and a resistance value calculated in the resistance calculation step S10 are used for measurement. A semiconductor device having a determination step S30 for determining whether the device under test is acceptable based on a comparison result between the corrected response signal and a predetermined standard value after correcting the response signal acquired in step S20. Device manufacturing method.
[Selection] Figure 5

Description

  The present invention relates to a method for manufacturing a semiconductor device, a measuring device, a sending device, and a program.

  A semiconductor device such as an LSI (Large Scale Integration) is subjected to a predetermined test after manufacturing a product, and a pass / fail judgment is made. In the test, the device under measurement is connected to the measurement device via a mediating member such as a test board. Then, a test signal is input from the measurement device to the device under measurement via the mediation member, and then a response signal to the test signal is input from the device under measurement to the measurement device via the mediation member. Next, the response signal is compared with a predetermined standard value, and a pass / fail decision is made according to the result.

  In Patent Document 1, in the above technique, (1) the wiring resistance in the test board may affect the test result, and (2) a plurality of devices to be measured in parallel using the plurality of test boards. In some cases, the following inventions have been disclosed, focusing on the fact that the wiring resistance may vary among a plurality of test boards.

  In other words, a current is applied to the device under test via a mounting test board on which the device under test is mounted, a measurement unit that measures the voltage at a predetermined part of the device under test, and a measurement result obtained by the measurement unit is obtained. A determination unit that determines whether the device under test is acceptable or not, and the determination unit acquires a specific resistance value that is specific to the mounted test board, and determines whether the measurement is successful based on the specific resistance value. A test apparatus for determining the above is disclosed.

JP 2011-38920 A

  The inventor of the present invention may cause the internal resistance (contact resistance) of a mediating member such as a test board to change with time, and the change with time of the internal resistance may affect the accuracy of pass / fail judgment of the semiconductor device. I found out. In the case of the technique described in Patent Document 1, it is not configured to solve the problem.

  According to the present invention, there is provided a semiconductor device manufacturing method including a step in which a computer determines whether or not a device under measurement connected to a measuring device via a mediating member, and the resistance for calculating a resistance value of the mediating member Utilizing the resistance value calculated in the calculation step, the measurement step of inputting a test signal to the device under measurement, and then acquiring the response signal output from the device under measurement, and the resistance calculation step, After correcting the response signal acquired in the measurement step, a determination step of determining pass / fail of the device under measurement based on a comparison result between the corrected response signal and a predetermined standard value. A method for manufacturing a semiconductor device is provided.

  In addition, according to the present invention, there is provided a method for manufacturing a semiconductor device, the computer comprising a step of determining pass / fail of a device under measurement connected to a measuring device via a mediating member, wherein the resistance value of the mediating member is calculated. Using the resistance value calculated in the resistance calculation step, a measurement step of inputting a test signal to the device under test, and then acquiring a response signal output from the device under test, and the resistance calculation step. A determination step of determining pass / fail of the device under measurement based on a comparison result between the corrected standard value and the response signal acquired in the measurement step, after correcting a predetermined standard value; , A method for manufacturing a semiconductor device is provided.

  Further, according to the present invention, there is provided a measuring device for determining pass / fail of a device to be measured connected via a mediating member, a resistance calculating unit for calculating a resistance value of the mediating member, and a test on the device to be measured. A measurement unit that inputs a signal and then acquires a response signal output from the device under measurement, and corrects the response signal acquired by the measurement unit using the resistance value calculated by the resistance calculation unit Thereafter, a measuring device is provided that includes a determination unit that determines whether the device under measurement is acceptable based on a comparison result between the corrected response signal and a predetermined standard value.

  Further, according to the present invention, there is provided a measuring device for determining pass / fail of a device to be measured connected via a mediating member, a resistance calculating unit for calculating a resistance value of the mediating member, and a test on the device to be measured. After inputting a signal and correcting the predetermined standard value by using the resistance value calculated by the measurement unit that acquires the response signal output from the device under test and the resistance calculation unit, the correction is performed. There is provided a measuring device including a determination unit that determines whether the device under measurement is acceptable based on a comparison result between the later standard value and the response signal acquired by the measuring unit.

  Further, according to the present invention, there is provided a sending device for continuously sending a plurality of devices to be measured, which are connected to the measuring device via an intermediary member and are judged to pass or fail, toward the measuring device, In the apparatus, in place of the semiconductor chip included in the device under measurement, a sending device for sending a short device in which a conductive plate is arranged to a plurality of the devices under measurement at predetermined intervals is sent to the measurement device. Provided.

  Further, according to the present invention, there is provided a program for determining pass / fail of a device to be measured connected via a mediating member, wherein the computer calculates resistance value of the mediating member, and the device to be measured A test signal is input to the measurement device, and then the response signal output from the device under measurement is obtained by using the resistance value calculated by the resistance calculation unit. After correction, a program is provided for functioning as a determination unit that determines the pass / fail of the device under measurement based on a comparison result between the corrected response signal and a predetermined standard value.

  Further, according to the present invention, there is provided a program for determining pass / fail of a device to be measured connected via a mediating member, wherein the computer calculates a resistance value of the mediating member, and the device under test. A test signal is input to the device, and then a measurement value for obtaining a response signal output from the device under measurement is corrected using the resistance value calculated by the resistance calculation device. A program is provided for functioning as a determination unit that determines pass / fail of the device under measurement based on a comparison result between the corrected standard value and the response signal acquired by the measurement unit.

  According to the present invention as described above, the internal resistance of the mediating member can be calculated (measured) at predetermined intervals (eg, every predetermined time, every time a predetermined number of devices to be measured are measured). Then, using the value, either the response signal output from the device under test or the standard value set in advance for comparison with the response signal is corrected, and the corrected value is used. The pass / fail determination of the device under measurement can be performed.

  According to the present invention as described above, it is possible to realize a highly accurate test in consideration of the internal resistance of the mediating member and its change with time. That is, the accuracy of the inspection process in the method for manufacturing a semiconductor device can be improved, and as a result, the quality reliability of the semiconductor device to be shipped can be increased.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to raise the precision of the predetermined test performed in the state which connected the to-be-measured apparatus and the measuring apparatus via the mediation member.

It is an example of the functional block diagram which shows the connection state of various apparatuses in the measurement process included in the manufacturing method of the semiconductor device of this embodiment. It is an example of the functional block diagram of the measuring apparatus of this embodiment. It is an example of the functional block diagram which shows the connection state of various apparatuses in the resistance calculation process included in the manufacturing method of the semiconductor device of this embodiment. FIG. 4 is an example of an equivalent circuit diagram of the functional block diagram of FIG. 3. It is a flowchart which shows an example of the flow of a process of the manufacturing method of the semiconductor device of this embodiment. It is an example of the functional block diagram of the measuring apparatus of this embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

  Note that each unit of the present embodiment includes an arbitrary computer CPU, memory, a program loaded in the memory (a program stored in the memory in advance from the stage of shipping the device, a storage medium such as a CD, and the Internet). And a storage unit such as a hard disk for storing the program, and a network connection interface, and any combination of hardware and software. It will be understood by those skilled in the art that there are various modifications to the implementation method and equipment.

<First Embodiment>
First, an outline of a method for manufacturing a semiconductor device according to the present embodiment will be described.

  In the present embodiment, as shown in FIG. 1, there is a step of connecting the device under measurement 10 to the measuring device 30 via the mediating member 20 and determining whether the device under measurement 10 is acceptable. That is, in the state shown in FIG. 1, a test signal is input from the measuring device 30 to the device under measurement 10 via the mediating member 20, and then a response signal to the test signal is received via the mediating member 20. Input from the measuring apparatus 10 to the measuring apparatus 20. For example, the measuring device 30 causes a current of a predetermined value to flow through the device under measurement 10 as a test signal, and acquires a voltage value of a predetermined portion of the device under measurement 10 as a response signal.

  Moreover, in this embodiment, it has the process of measuring the internal resistance (contact resistance) of the mediation member 20. The measurement is performed at predetermined intervals (eg, every predetermined time, every time a predetermined number of devices to be measured 20 are measured).

  And in this embodiment, a response signal is correct | amended using the internal resistance value of the mediation member 20 measured at the said process. Thereafter, the corrected response signal is compared with a predetermined standard value, and pass / fail of the device under measurement 10 is determined based on the comparison result.

  In the present embodiment, the following process may be performed instead of the process of correcting the response signal. That is, the predetermined standard value is corrected using the internal resistance value of the mediating member 20. Thereafter, the corrected standard value is compared with the response signal, and pass / fail of the device under measurement 10 is determined based on the comparison result.

  Hereinafter, this embodiment will be described in detail.

<Measured device 10>
The device under test 10 is a semiconductor device such as an LSI, for example. The device under test 10 is, for example, an embodiment in which a semiconductor chip is mounted on a package, and has a plurality of input terminals and a plurality of output terminals (hereinafter collectively referred to as “device under test terminals”).

<Intermediate member 20>
The mediating member 20 can be configured to include, for example, at least one of a test board and a socket. The mediating member 20 includes a plurality of measured-side mediating terminals connected to a plurality of measured device terminals included in the measured device 10 and a plurality of measuring-side mediating terminals connected to a plurality of measuring device terminals included in the measuring device 30. Have. Each of the plurality of measured-side mediating terminals and each of the plurality of measuring-side mediating terminals are connected by a plurality of channels provided in the mediating member 20. The channel is composed of, for example, wiring. By connecting the device under measurement 10 and the measurement device 30 via such an intermediary member 20, each device under measurement terminal and each of the measurement device terminals are connected.

  Note that the internal resistance (contact resistance) of the mediating member 20 changes with time. The internal resistance includes I (Input) / O (Output) resistance, power source DC resistance, wiring resistance, and the like.

<Measurement device 30>
In FIG. 2, an example of the functional block diagram of the measuring apparatus 30 is shown. As shown in the figure, the measurement apparatus 30 includes a resistance calculation unit 31, a measurement unit 32, and a determination unit 33.

  The resistance calculator 31 calculates the internal resistance of the mediating member 20. The resistance calculation unit 31 can calculate the internal resistance for each of the plurality of channels of the mediating member 20. The means for calculating the value of the internal resistance may be as follows.

  For example, the measured mediation terminal of the mediating member 20 is short-circuited in a state where the mediating member 20 is connected to the measuring device 30 and not connected to the measured device 10. In this state, the resistance calculation unit 31 applies a voltage to the mediating member 20, measures the flowing current, and calculates the resistance using the measured value.

  The internal resistance of the mediating member 20 is calculated at predetermined intervals (eg, every predetermined time, every time a predetermined number of devices 20 to be measured are measured). The calculated resistance value is stored in the storage device.

  The means for realizing the short of the measured-side mediating terminal may be realized by connecting a short device 40 to the mediating member 20 as shown in FIG.

  The short device 40 has a plurality of terminals to be connected to each measured-side mediating terminal of the mediating member 20, and these are connected to each other (a state in which the short device 40 and the mediating member 20 are connected). The relay terminal is configured to be short-circuited. For example, in the configuration of the device under measurement 10, the short device 40 may be configured in the same manner as the device under measurement 10 except that a conductive plate such as a copper plate is disposed instead of the semiconductor chip of the device under measurement 10. . The plurality of terminals included in the short device 40 are connected to the conductive plate.

  FIG. 4 shows an example of an equivalent circuit diagram of the above configuration. 4 is configured by a part of a plurality of measuring device terminals included in the measuring device 30, a part of a plurality of channels included in the mediating member 20, and a conductive plate included in the short device 40. An equivalent circuit is shown.

  As shown in the figure, by connecting the short device 40 to the mediating member 20, the measured mediation terminal of the mediating member 20 is short-circuited via a conductive plate provided in the short device 40. In this state, a voltage is applied by a PMU (Parametric Measurement Unit) of the measuring device 30. At this time, the short device 40 is connected to the ground (GND) of the measuring device, and when a voltage is applied, a current corresponding to the resistance of the mediating member flows. By measuring this current, the internal resistance value of the mediating member 20 is calculated. Note that when such a short device 40 is connected to the mediating member 20, all of the plurality of channels of the mediating member 20 are short-circuited by the conductive plate provided in the short device 40. However, during measurement of a certain channel, the other channel can be substantially opened by a process such as disconnecting the relay by the measurement unit of the measurement apparatus 30. For this reason, it is possible to measure a plurality of channels individually.

  Returning to FIG. 2, the measurement unit 32 inputs a test signal to the device under measurement 10 in a state where the measurement device 30 is connected to the device under measurement 10 via the mediating member 20 (see FIG. 1). The response signal output from the measuring device 10 is acquired. For example, the measurement unit 32 causes a current having a predetermined value to flow through the device under measurement 10 as a test signal, and acquires a voltage value at a predetermined portion of the device under measurement 10 as a response signal.

  Each of the plurality of measuring device terminals included in the measuring device 30 can be individually identified by a computer. Similarly, each of a plurality of device terminals to be measured included in the device to be measured 10 can be individually identified by a computer. In connection between the measuring device 30 and the device under measurement 10, it is defined in advance which measuring device terminal and the device under measurement terminal are connected, and the connection is performed according to the definition.

  The determination unit 33 corrects the response signal acquired by the measurement unit 32 using the value of the internal resistance of the mediating member 20 calculated by the resistance calculation unit 31, and then corrects the response signal after correction and a predetermined standard value. And compare. Then, the pass / fail of the device under measurement 10 is determined based on the comparison result. For example, when the value of the response signal after correction is included in the range of a predetermined standard value, it is determined to be acceptable, and when it is not included, it is determined to be unacceptable.

  In addition, the determination unit 33 uses the value of the internal resistance of the mediating member 20 calculated by the resistance calculation unit 31 to correct a predetermined standard value, and then acquires the corrected standard value and the measurement unit 32. The response signal can also be compared. Then, the pass / fail of the device under measurement 10 is determined based on the comparison result. For example, when the value of the response signal is included within the range of the standard value after correction, it is determined to be acceptable, and when it is not included, it is determined to be unacceptable.

  The content of the “correction using the value of the internal resistance of the mediating member 20” may be as follows. For example, the determination unit 33 calculates the voltage drop at the mediating member 20 based on the resistance value calculated by the resistance calculation unit 31. Then, the response signal or the standard value is corrected so that the calculated voltage drop is reflected.

  The resistance calculator 31 calculates the value of the internal resistance of the mediating member 20 at predetermined intervals and stores the value in the storage device. For example, the determination unit 33 can perform the correction by using the latest one of the plurality of resistance values calculated by the resistance calculation unit 31. The plurality of resistance values calculated by the resistance calculation unit 31 may be stored in the storage device in association with the calculated time so that the determination unit 33 can determine the latest resistance value, or the old resistance value is It may be deleted from the storage device and only the latest resistance value may be stored.

  The measurement apparatus of the present embodiment described above can be realized by installing the following program in a computer, for example.

A program for determining pass / fail of a device under measurement connected via a mediating member,
Computer
Resistance calculating means for calculating a resistance value of the mediating member;
Measuring means for inputting a test signal to the device under test and then obtaining a response signal output from the device under test;
Using the resistance value calculated by the resistance calculation unit, after correcting the response signal acquired by the measurement unit, based on a comparison result between the corrected response signal and a predetermined standard value, Determining means for determining whether the device under measurement is acceptable or not;
Program to function as.

A program for determining pass / fail of a device under measurement connected via a mediating member,
Computer
Resistance calculating means for calculating a resistance value of the mediating member;
Measuring means for inputting a test signal to the device under test and then obtaining a response signal output from the device under test;
After correcting a predetermined standard value using the resistance value calculated by the resistance calculation unit, based on a comparison result between the corrected standard value and the response signal acquired by the measurement unit, Determining means for determining whether the device under measurement is acceptable or not;
Program to function as.

<Method for Manufacturing Semiconductor Device>
Next, a method for manufacturing the semiconductor device of the present embodiment realized using the above-described devices and members will be described.

  In this embodiment, first, a so-called pre-process is performed, and a plurality of semiconductor chips are formed on the wafer. Then, it progresses to what is called a post process. In the post-process, for example, a semiconductor chip is cut out from the wafer, and the cut out semiconductor chip is mounted on a package. Next, after a predetermined process such as stamping is performed, the process proceeds to a step of determining whether or not each semiconductor device is acceptable. Hereinafter, with reference to the flowchart of FIG. 5, one process included in the pass / fail determination process, that is, the computer under measurement 10 (semiconductor device) in which the computer is connected to the measurement apparatus 30 via the mediating member 20 is described. The process for determining pass / fail will be described.

  As shown in FIG. 5, the process includes a resistance calculation process S10, a measurement process S20, and a determination process S30.

  In the resistance calculation step S10, the resistance calculation unit 31 of the measuring device 30 calculates the value of the internal resistance of the mediating member 20 (S10). For example, as shown in FIG. 3, the measuring device 30 is connected to the mediating member 20 and the short device 40 is connected to short the measured mediating terminal of the mediating member 20. Thereafter, the resistance calculation unit 31 applies a voltage to the mediating member 20 and measures the value of the current flowing in this state. Then, the internal resistance of the mediating member 20 is calculated using the measurement result. The calculated internal resistance value is stored in the storage device.

  Such a resistance calculation step S10 is performed at least once before the measurement step S20. Thereafter, the resistance calculation step S10 is performed at predetermined intervals (eg, every predetermined time, every time a predetermined number of devices to be measured 20 are measured), and the calculated resistance value is stored in the storage device.

  In the measurement step S20, the measurement unit 32 of the measurement device 30 inputs a test signal to the device under measurement 10, and then acquires a response signal output from the device under measurement 10 (S20). For example, as shown in FIG. 1, in a state where the device under measurement 10 and the measurement device 30 are connected via the mediating member 20, the measurement unit 32 causes a current of a predetermined value to flow through the device under measurement 10 as a test signal. As a signal, the voltage value of a predetermined part of the device under test 10 is acquired (measured).

  In the determination step S30, the determination unit 33 of the measurement device 30 corrects the response signal acquired in S20 using the internal resistance value of the mediating member 20 calculated in S10. Then, the determination unit 33 compares the corrected response signal with the standard value held in advance, and determines whether the device under measurement 10 is acceptable based on the result. For example, the standard value is standardized in a numerical range having a certain width, and if the corrected response signal value is included in the numerical range, it is determined to be acceptable, and otherwise, it is determined to be unacceptable. .

  In addition, determination process S30 can also be set as the following processes. That is, the determination unit 33 of the measuring device 30 corrects the standard value held in advance by using the internal resistance value of the mediating member 20 calculated in S10. Then, the determination unit S33 compares the corrected standard value with the response signal acquired in S20, and determines pass / fail of the device under measurement 10 based on the result. For example, the standard value is standardized in a numerical range having a certain width, and if the response signal is included within the corrected standard value numerical range, it is determined to be acceptable, and otherwise is determined to be unacceptable. .

  Note that after the resistance calculation step S10 is performed at least once, the measurement step S20 and the determination step S30 are repeatedly performed while replacing the device under test 10 (semiconductor device). The resistance calculation step S10 is performed at predetermined intervals (eg, every predetermined time, every time a predetermined number of devices to be measured 20 are measured), and the calculated resistance value is stored in the storage device. And in determination process S30, the said correction process is performed using the newest resistance value.

  Next, the effect of this embodiment is demonstrated.

  In the semiconductor device of this embodiment, the internal resistance of the mediating member 20 is calculated (measured) at predetermined intervals. Then, using the value, either the response signal output from the device under measurement 10 or a standard value determined in advance for comparison with the response signal is corrected, and the corrected value is used. Then, the pass / fail determination of the device under measurement 10 is performed.

  According to the present embodiment as described above, it is possible to realize a highly accurate test in consideration of the internal resistance of the mediating member and its change over time. That is, the accuracy of the inspection process in the method for manufacturing a semiconductor device can be improved, and as a result, the quality reliability of the semiconductor device to be shipped can be increased.

<Second Embodiment>
In addition to the configuration of the first embodiment, the present embodiment further has the following characteristic configuration.

  In the present embodiment, the plurality of devices under measurement 10 are sent out toward the measuring device 30 by the sending device 50. In addition, a plurality of short devices 40 are sent out toward the measuring device 30 at predetermined intervals, mixed with the plurality of devices under measurement 10.

  The device under test 10 and the short device 40 sent out by the sending device 50 are picked up in order and connected to the measuring device 10 via the mediating member 20. Thereafter, when the picked-up device is the short device 40, the resistance calculating step S10 described in the first embodiment is executed, and when the device under measurement 10 is used, the measuring step S20 is executed.

  Hereinafter, this embodiment will be described in detail. In addition, since the structure of the to-be-measured apparatus 10 and the mediation member 20 is the same as that of 1st Embodiment, description here is abbreviate | omitted.

<Short device 40>
The short device 40 of the present embodiment has the same configuration as the device under measurement 10 except that a conductive plate such as a copper plate is disposed in place of the semiconductor chip of the device under measurement 10 in the configuration of the device under measurement 10. The plurality of terminals included in the short device 40 are connected to the conductive plate.

  Further, the short device 40 of the present embodiment has a configuration that allows the computer to identify the device under measurement 10 and the short device 40. Although the configuration is not particularly limited, for example, the short device 40 may be stamped with a lot number that can be identified from the device under measurement 10 or may have some other mark.

<Transmission device 50>
The sending device 50 sends the plurality of devices under measurement 10 continuously toward the measuring device 30. In addition, the sending device 50 mixes the short devices 40 at a predetermined interval into the plurality of devices 10 to be measured that are sent to the measuring device 30 and sends them to the measuring device 30. In order to realize such a function, the sending device 50 may include a sending unit 51 and a placement unit 52.

  The sending unit 51 is configured by, for example, a belt conveyor, and moves an object placed on the belt conveyor toward the measuring device 30. The mounting unit 52 sequentially mounts the plurality of devices to be measured 10 on the belt conveyor, and places the short devices 40 at predetermined intervals (design matters). Mix.

<Measurement device 30>
FIG. 6 shows an example of a functional block diagram of the measuring device 30. As illustrated, the measurement device 30 includes a resistance calculation unit 31, a measurement unit 32, a determination unit 33, a determination unit 34, and a selection unit 35. Hereinafter, the determination unit 34 and the selection unit 35 will be described. In addition, since the structure of the resistance calculation part 31, the measurement part 32, and the determination part 33 is the same as that of 1st Embodiment, description here is abbreviate | omitted.

  The discriminating unit 34 takes out one of the plurality of measured devices 10 and the short device 40 that are mixed and sent by the sending device 50, and then the taken-out device is connected to the measured device 10 and the short device 40. Determine which is.

  The determination means is not particularly limited. For example, when an identification number such as a lot number is stamped on the device under measurement 10, the information may be used for determination. Alternatively, a determination mark may be newly added to at least one of the device under test 10 and the short device 40, and the determination may be performed by reading the mark.

  The selection unit 35 determines which of the resistance calculation unit 31 and the measurement unit 32 to execute processing based on the determination result of the determination unit 34.

  For example, when the device picked up by the determination unit 34 is the short device 40, when the short device 40 is connected to the measurement device 30 via the mediating member 20, the selection unit 35 performs processing on the resistance calculation unit 31. Decide to execute, and instruct the resistance calculator 31 to execute the process. Then, the resistance calculation unit 31 executes the process described in the first embodiment, calculates the value of the internal resistance of the mediating member 20, and stores it in the storage device.

  On the other hand, when the device picked up by the determination unit 34 is the device under measurement 10, when the device under measurement 10 is connected to the measurement device 30 via the mediating member 20, the selection unit 35 performs processing on the measurement unit 32. Is determined to be executed, and the measurement unit 32 is instructed to execute the process. Then, the measurement part 32 performs the process demonstrated in 1st Embodiment, and acquires the response signal which the to-be-measured apparatus 10 output. Thereafter, the processing described in the first embodiment by the determination unit 33 is performed.

  According to this embodiment, in addition to the functions and effects described in the first embodiment, the following functions and effects can be realized.

  That is, according to the present embodiment, the step of calculating (measuring) the internal resistance of the mediating member 20 at predetermined intervals can be automated. As a result, effects such as reduction of burden on workers and improvement of work efficiency are expected.

<Third Embodiment>
In addition to the configuration of the first embodiment or the second embodiment, the present embodiment further has the following characteristic configuration.

  The mediating member 20 of the present embodiment is configured to be connectable to a plurality of types of measured devices 10 having different configurations of the measured device terminals. “Different configurations of device under test terminals” means that the number of device under test terminals, the number of output terminals, the number of input terminals, the ratio of the number of output terminals and input terminals, and the like are different.

  And the measurement part 32 of this embodiment measures the predetermined number of the same types of to-be-measured apparatuses 10 continuously.

  And when calculating the internal resistance of the mediating member 20, the resistance calculating unit 31 of this embodiment does not calculate the resistance of all of the plurality of channels included in the mediating member 20, but is measured at that time. The resistance is calculated only for the channels used in the ten measurements.

  Hereinafter, this embodiment will be described in detail. Note that the configurations of the device under measurement 10, the short device 40, and the sending device 50 are the same as those in the first or second embodiment, and thus description thereof is omitted here.

<Intermediate member 20>
The mediating member 20 is configured to be connectable to a plurality of types of devices to be measured 10 having different configurations of the devices to be measured. That is, the mediating member 20 has M (M: natural number) measured-side mediating terminals and can be connected to a plurality of types of measured devices 10 having measured device terminals smaller than the number.

<Measurement device 30>
An example of a functional block diagram of the measuring apparatus 30 of the present embodiment is the same as that of the first embodiment (FIG. 2) or the second embodiment (FIG. 3). Note that the configurations of the determination unit 33, the determination unit 34, and the selection unit 35 are the same as those in the first and second embodiments, and a description thereof will be omitted here. Hereinafter, the configurations of the resistance calculation unit 31 and the measurement unit 32 will be described.

  The measuring unit 32 measures a plurality of types of measured devices 10 having different configurations of the measured device terminals, and obtains response signals. Note that the measurement unit 32 measures a predetermined number of the same types of devices under measurement 10 in a continuous manner, and acquires response signals.

  The resistance calculating unit 31 specifies the device under measurement 10 to be measured at the time of calculating the value of the internal resistance of the mediating member 20, and then includes the plurality of device under test terminals included in the device under measurement 10 and the measuring device 30. The resistance value is calculated only for a channel used to connect a plurality of measuring device terminals.

  The means for specifying the measurement target device 10 at the time of calculating the value of the internal resistance is not particularly limited. For example, by specifying the measurement target device 10 measured immediately before that, the type can be specified. Alternatively, the type of device to be measured 10 that is measured immediately after that may be specified.

  Each of the plurality of measuring device terminals included in the measuring device 30 can be individually identified by a computer. Similarly, each of a plurality of device terminals to be measured included in the device to be measured 10 can be individually identified by a computer. In connection between the measuring device 30 and the device under measurement 10, it is defined in advance which measuring device terminal and the device under measurement terminal are connected, and the connection is performed according to the definition. In such a case, the computer can individually identify each of the plurality of channels of the mediating member 20 based on, for example, the measuring device terminals to which the mediating member 20 is connected.

  When the resistance calculation unit 31 specifies the measurement target device 10 to be measured at the time of calculating the value of the internal resistance, the resistance calculation unit 31 uses the above definition according to the type of the measurement target device 10 to establish a connection with the measurement target device 10. Identify the measurement device terminal used for connection. And the calculation (measurement) of resistance only for a specific channel is realized by applying a voltage only from the specified measurement device terminal. Then, the calculated resistance value is stored in the storage device in association with each channel.

  According to this embodiment, in addition to the functions and effects described in the first and second embodiments, the following functions and effects can be realized.

  That is, according to the present embodiment, it is possible to calculate the resistance for only the channel required at that time among the plurality of channels of the mediating member, so when calculating the resistance of all the channels. In comparison, the processing load on the computer can be reduced, and effects such as a reduction in processing time can be realized.

<Fourth Embodiment>
In addition to the configurations of the first to third embodiments, the present embodiment further has the following characteristic configuration.

  That is, the measuring apparatus according to the present embodiment further includes an output unit 36 that outputs the resistance value calculated by the resistance value calculating unit 31. The output means is not particularly limited, and can be realized by any output device such as a display, a speaker, and a printing device.

  The content of the information output by the output unit 36 may be, for example, the resistance value itself calculated by the resistance value calculation unit 31. Alternatively, information (change rate, difference, etc.) indicating a change from the resistance value calculated at the beginning of the mediating member 20 may be output together. In addition, an upper limit of change from the resistance value calculated first in advance (upper limit of change rate, upper limit of difference, etc.) may be set, and if the upper limit is exceeded, a warning indicating that may be output. .

  Information output from the output unit 36 is browsed by an operator. And an operator can perform the maintenance work of the mediating member 20 as needed.

  According to this embodiment, in addition to the functions and effects described in the first to third embodiments, the following functions and effects can be realized.

  That is, according to the present embodiment, since the maintenance work such as repair or replacement of the mediating member 20 can be performed at an appropriate timing, the semiconductor device manufacturing method is caused by the deterioration of the mediating member 20. The inconvenience that the accuracy of the inspection process is deteriorated can be reduced. As a result, the quality reliability of the semiconductor device to be shipped can be increased.

DESCRIPTION OF SYMBOLS 10 Device under test 20 Mediating member 30 Measuring device 31 Resistance calculation part 32 Measurement part 33 Determination part 34 Determination part 35 Discrimination part 35 Selection part 36 Output part 40 Short apparatus 50 Sending apparatus 51 Sending part 52 Mounting part

Claims (25)

A method of manufacturing a semiconductor device, comprising: a computer determining a pass / fail of a device under measurement connected to a measuring device via a mediating member,
A resistance calculating step of calculating a resistance value of the mediating member;
A measurement step of inputting a test signal to the device under test and then obtaining a response signal output from the device under test;
After correcting the response signal acquired in the measurement step using the resistance value calculated in the resistance calculation step, based on a comparison result between the corrected response signal and a predetermined standard value A determination step for determining pass / fail of the device under measurement;
A method for manufacturing a semiconductor device comprising: A method of manufacturing a semiconductor device, comprising: a computer determining a pass / fail of a device under measurement connected to a measuring device via a mediating member,
A resistance calculating step of calculating a resistance value of the mediating member;
A measurement step of inputting a test signal to the device under test and then obtaining a response signal output from the device under test;
After correcting a predetermined standard value using the resistance value calculated in the resistance calculation step, based on a comparison result between the standard value after correction and the response signal acquired in the measurement step A determination step for determining pass / fail of the device under measurement;
A method for manufacturing a semiconductor device comprising: In the manufacturing method of the semiconductor device according to claim 1 or 2,
In the resistance calculating step, the measuring device is connected to the measuring device in a state in which the mediating member is connected to the measuring device, and an input terminal and an output terminal of the mediating member connected to the measured device are short-circuited. A method for manufacturing a semiconductor device, wherein a voltage is applied to calculate a resistance value of the mediating member. In the manufacturing method of the semiconductor device according to claim 3,
In the resistance calculating step, a short device that short-circuits the input terminal and the output terminal of the mediating member in a state of being connected to the mediating member is prepared, and the input is performed by connecting the short device to the mediating member. A method for manufacturing a semiconductor device, in which a terminal and an output terminal are short-circuited. In the manufacturing method of the semiconductor device according to claim 4,
The method of manufacturing a semiconductor device, wherein the short device is a device in which a conductive plate is arranged in the device under measurement instead of the semiconductor chip of the device under measurement. In the manufacturing method of the semiconductor device according to claim 4 or 5,
Discrimination to determine whether the taken out device is the measured device or the short device after taking out one of the plurality of measured devices and the plurality of short devices that are mixed and sent Process,
A selection step for determining which of the resistance calculation step and the measurement step is to be performed based on the result of the determination step;
A method for manufacturing a semiconductor device further comprising: In the manufacturing method of the semiconductor device according to claim 6,
When the resistance calculation step is determined in the selection step, the resistance calculation step is executed, and the calculated resistance value is stored in a storage device. In the manufacturing method of the semiconductor device according to claim 7,
A manufacturing method of a semiconductor device in which, when the measurement step is determined in the selection step, the measurement step is executed, and the correction is performed using the latest resistance value stored in the storage device. In the manufacturing method of the semiconductor device according to claim 1,
The intermediary member is configured to be able to connect a plurality of types of the devices under measurement having different terminal configurations and the measurement device, and a plurality of channels connecting the terminals of the device under measurement and the terminals of the measurement device. More than the number of the terminals of the type of the device under test,
The measurement step continuously measures the device under measurement of the same type,
In the resistance calculation step,
A semiconductor device that calculates the resistance value only for a channel that is used to connect a terminal of the device to be measured and a terminal of the measuring device after specifying the device to be measured at the time of calculating the resistance value Manufacturing method. In the manufacturing method of the semiconductor device according to any one of claims 1 to 9,
The intermediary member is a method of manufacturing a semiconductor device including at least one of a test board and a socket. In the manufacturing method of the semiconductor device according to any one of claims 1 to 10,
In the measuring step, a current is passed through the device under test as the test signal, and a voltage value of a predetermined part of the device under measurement is acquired as the response signal. A measuring device for determining pass / fail of a device under measurement connected via a mediating member,
A resistance calculator for calculating a resistance value of the mediating member;
A measurement unit that inputs a test signal to the device under measurement and then acquires a response signal output from the device under measurement;
After correcting the response signal acquired by the measurement unit using the resistance value calculated by the resistance calculation unit, based on a comparison result between the response signal after correction and a predetermined standard value, A determination unit for determining the pass / fail of the device under measurement;
Measuring device. A measuring device for determining pass / fail of a device under measurement connected via a mediating member,
A resistance calculator for calculating a resistance value of the mediating member;
A measurement unit that inputs a test signal to the device under measurement and then acquires a response signal output from the device under measurement;
Using the resistance value calculated by the resistance calculation unit, after correcting a predetermined standard value, based on a comparison result between the standard value after correction and the response signal acquired by the measurement unit, A determination unit for determining the pass / fail of the device under measurement;
Measuring device. The measuring device according to claim 13 or 14,
The resistance calculation unit applies a voltage to the mediating member in a state where the mediating member is connected to the measuring device and an input terminal and an output terminal of the mediating member connected to the device to be measured are short-circuited. A measuring device for calculating a resistance value of the mediating member. The measuring device according to claim 14,
The resistance calculation unit prepares a short device that short-circuits the input terminal and the output terminal of the mediation member in a state of being connected to the mediation member, and connects the short device to the mediation member so that the input A measuring device for forming a state in which a terminal and the output terminal are short-circuited. The measuring device according to claim 15,
The shorting device is a measuring device in which a conductive plate is arranged in the device under measurement instead of the semiconductor chip of the device under measurement. The measuring device according to claim 15 or 16,
Discrimination to determine whether the taken out device is the measured device or the short device after taking out one of the plurality of measured devices and the plurality of short devices that are mixed and sent And
A selection unit that determines which of the resistance calculation unit and the measurement unit to execute processing based on the result of the determination unit;
Measuring device. The measuring device according to claim 17,
When the selection unit determines to cause the resistance calculation unit to execute processing, the resistance calculation unit calculates a resistance value, and stores the calculated resistance value in a storage device. The measuring device according to claim 18,
A measurement device that performs the correction using the latest resistance value stored in the storage device when the selection unit determines to cause the measurement unit to execute processing. The measuring device according to any one of claims 12 to 19,
The intermediary member is configured to be able to connect a plurality of types of devices under measurement having different terminal configurations and the measurement device, and a plurality of channels connecting the terminals of the device under measurement and the terminals of the measurement device. More than the number of the terminals of the type of the device under test,
The measurement unit continuously measures the device under measurement of the same type,
The resistance calculation unit, after specifying the measurement target device at the time of calculating the resistance value, only for the channel used to connect the terminal of the measurement target device and the terminal of the measurement device, A measuring device that calculates a resistance value. The measuring device according to any one of claims 12 to 20,
The intermediary member is a measuring device including at least one of a test board and a socket. The measuring device according to any one of claims 12 to 21,
The measurement unit is a measurement device that causes a current to flow through the device under test as the test signal and acquires a voltage value of a predetermined part of the device under test as the response signal. A sending device that is connected to a measuring device via an intermediary member and continuously sends a plurality of devices to be determined to pass or fail toward the measuring device,
In the device to be measured, instead of the semiconductor chip of the device to be measured, a short device in which a conductive plate is arranged is mixed into the plurality of devices to be measured at predetermined intervals and sent to the measuring device. Sending device. A program for determining pass / fail of a device under measurement connected via a mediating member,
Computer
Resistance calculating means for calculating a resistance value of the mediating member;
Measuring means for inputting a test signal to the device under test and then obtaining a response signal output from the device under test;
Using the resistance value calculated by the resistance calculation unit, after correcting the response signal acquired by the measurement unit, based on a comparison result between the corrected response signal and a predetermined standard value, Determining means for determining whether the device under measurement is acceptable or not;
Program to function as. A program for determining pass / fail of a device under measurement connected via a mediating member,
Computer
Resistance calculating means for calculating a resistance value of the mediating member;
Measuring means for inputting a test signal to the device under test and then obtaining a response signal output from the device under test;
After correcting a predetermined standard value using the resistance value calculated by the resistance calculation unit, based on a comparison result between the corrected standard value and the response signal acquired by the measurement unit, Determining means for determining whether the device under measurement is acceptable or not;
Program to function as.

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