JP2013048151A - Semiconductor cooling device for vehicle - Google Patents

Abstract

The present invention provides a semiconductor cooling device for a vehicle that can improve the temperature balance on the semiconductor mounting surface of a heat receiving block and improve the cooling performance.
A semiconductor cooling device for a vehicle includes a heat receiving block, a plurality of rows of semiconductor elements, and a heat dissipation member. The heat receiving block has a first surface and a second surface opposite to the first surface. The plurality of semiconductor element rows are alternately arranged on the first surface of the heat-receiving block. The heat dissipating member is disposed on the second surface of the heat receiving block such that the end in the longitudinal direction coincides with the vehicle traveling direction.
[Selection] Figure 1

Description

  Embodiments described herein relate generally to a semiconductor cooling device for a vehicle.

  For example, a control device for controlling the running of the vehicle and other equipment is provided under the floor of the body of a railway vehicle. Inside the control device is a semiconductor element such as an inverter or converter that is a heat source. Therefore, the control device is provided with a vehicle semiconductor cooling device for cooling the control device itself.

  Conventionally, in a control device, a group of semiconductor elements such as inverters and converters arranged as an example is one arm, and a plurality of arms are arranged on the semiconductor element mounting surface of the heat receiving block, while the semiconductor element mounting of the heat receiving block is mounted. A heat sink is attached to the surface opposite to the surface, and heat generated in the semiconductor element group is dissipated by the heat sink (see, for example, Patent Document 1).

  Usually, the semiconductor element group is arranged in the heat receiving block for each function of the semiconductor element group constituting the function of the inverter and the semiconductor element group constituting the function of the converter.

JP 2007-104784 A

  However, since these semiconductor element groups have different heat losses depending on the functions of the inverter and the converter, there is a problem that the temperature balance is poor and the cooling efficiency is poor when viewed from the semiconductor element mounting surface of the heat receiving block.

  The problem to be solved by the present invention is to provide a vehicular semiconductor cooling device capable of improving the temperature balance on the semiconductor element mounting surface of the heat receiving block and improving the cooling performance.

  The vehicle semiconductor cooling device of the embodiment includes a heat receiving block, a row of a plurality of semiconductor elements, and a heat dissipation member. The heat receiving block has a first surface and a second surface opposite to the first surface. The plurality of rows of semiconductor elements are formed by a plurality of semiconductor elements, and rows of semiconductor elements having different calorific values are alternately arranged on the first surface. The heat radiating member is provided with a gap for air cooling, and is disposed on the second surface so that the direction in which the airflow passes through the gap coincides with the vehicle traveling direction.

It is a top view which shows the structure of the semiconductor cooling device for vehicles of 1st Embodiment. It is a side view when the semiconductor cooling device for vehicles of FIG. 1 is seen from the direction of arrow A. It is a temperature curve which shows the effect of 1st Embodiment. It is a top view which shows the structure of the semiconductor cooling device for vehicles of 2nd Embodiment. FIG. 5 is a side view of FIG. 4. It is a layout view showing a semiconductor element for one arm when a two-para structure is adopted. It is a circuit diagram for one arm in the case of a 2-para configuration. It is a temperature curve which shows the effect of 2nd Embodiment. It is a top view which shows the structure of the semiconductor cooling device for vehicles of 3rd Embodiment. It is a temperature curve which shows the effect of 3rd Embodiment. It is a figure which shows the relationship between the converter loss with respect to vehicle speed, and inverter loss.

Hereinafter, embodiments will be described in detail with reference to the drawings.
In general, in a vehicle semiconductor cooling device in which an inverter and a converter are mounted on a heat receiving surface, the converter loss 14 relative to the vehicle speed is low in the low speed region and high in the high speed region, as shown in FIG.

  On the other hand, the inverter loss 15 with respect to the vehicle speed is high in the low speed region and low in the high speed region. Further, when the converter loss 14 and the inverter loss 15 are compared, the converter loss 14 is higher as a whole. That is, the converter loss 14 and the inverter loss 15 have completely different characteristics with respect to the vehicle speed. The loss can be considered as almost the calorific value.

Accordingly, in consideration of the relationship between the vehicle speed and the loss, the first to third embodiments will be described below.
(First embodiment)
(Description of configuration)
FIG. 1 is a diagram showing a configuration of a semiconductor cooling device for a vehicle according to a first embodiment, and FIG. 2 is a sectional view taken along the line AA.

  As shown in FIGS. 1 and 2, the vehicle semiconductor cooling device 8 of the first embodiment includes semiconductor elements 6, 6 a group, a heat receiving block 9, a heat sink 11 as a radiator or a heat radiating member, and the like.

The semiconductor elements 6 and 6a constitute one arm 5 for each function. A function is a function of an inverter or a converter. The function of the converter is a function of converting AC voltage into DC voltage. The function of the inverter is a function of converting a DC voltage into an AC voltage.
In this example, the semiconductor element 6 is an inverter element or a converter element, and the semiconductor element 6a is a slightly smaller clamp diode than the semiconductor element 6 (see FIG. 7).

  On the semiconductor element mounting surface 10 of the heat receiving block 9, five rows 22 and 23 of semiconductor elements 6 and 6a constituting one arm 5 are alternately arranged in parallel and mounted.

  A row 22 of the semiconductor elements 6 and 6a is a row constituting a function of the inverter. The row | line | column 23 of the semiconductor elements 6 and 6a is a row | line | column which comprises the function of a converter.

  That is, the semiconductor element mounting surface 10 is provided with rows 22 and 23 in which a plurality of semiconductor elements 6 and 6a form a row, and rows 22 and 23 of semiconductor elements having different heat generation amounts are alternately arranged. .

  In power conversion in which single-phase alternating current is once converted into direct current and then converted into three-phase alternating current, two columns 23 constituting the converter function are required for one phase, and two columns 22 constituting the inverter function are three. Three rows are required for each of the U phase, V phase, and W phase of the phase alternating current, and at least five rows are required.

  The semiconductor elements 6 and 6a on the semiconductor element mounting surface 10 of the heat receiving block 9 are covered with a case 8a.

  A heat sink 11 is disposed on the surface of the heat receiving block 9 opposite to the semiconductor element mounting surface 10. The heat sink 11 is provided with a plurality of plate-like fins (heat radiating plates) that are heat radiating members. The end portions of the fins in the longitudinal direction are parallel to the air blowing direction 18 in the direction in which the wind passes. The air blowing direction 18 is the same as the direction in which the vehicle travels, and can be said to be the vehicle traveling direction. In other words, the heat dissipating member has a longitudinal direction that coincides with the vehicle traveling direction, and a gap between the heat dissipating members is provided along the vehicle traveling direction.

  That is, the heat sink 11 is provided with a gap for air cooling, and is disposed on the surface opposite to the conductor element mounting surface 10 so that the direction in which wind (airflow) passes and the vehicle traveling direction coincide with each other. Yes. The semiconductor element mounting surface 10 is referred to as a first surface, and the surface opposite to the semiconductor element mounting surface 10 is referred to as a second surface. The air blowing direction 18 is a direction in which the direction of the arrow is opposite to the vehicle traveling direction when this device is attached to the vehicle.

  The semiconductor cooling device 8 for a vehicle is attached to the under floor 17 of the vehicle so as to expose a portion of the heat sink 11 to the outside, and is generated by the semiconductor elements 6 and 6 a arranged in a row in the heat receiving block 9. The generated heat is radiated from the heat sink 11 on the back side to the outside.

  In other words, in the semiconductor cooling device 8 for a vehicle, a plurality of semiconductor elements 6 and 6a constitute one arm 5 and the plurality of arms 5 are arranged on the semiconductor element mounting surface 10, and the plurality of heat generation amounts are different from each other. The rows 22 and 23 of the individual semiconductor elements 6 and 6a are arranged alternately (every other row) and provided on the semiconductor element mounting surface 10.

(Description of action)
The operation of the first embodiment will be described.
In the first embodiment, a row of semiconductor elements 6 and 6a that constitute a plurality of arms that are heat sources and have different amounts of heat generation, that is, a row of semiconductor elements 6 and 6a that constitute one phase of an inverter. 22 and the row 23 of the semiconductor elements 6 and 6a constituting one phase of the converter are alternately arranged on the semiconductor element mounting surface 10 of one heat receiving block 9, so that the heat input to the semiconductor element mounting surface 10 is dispersed. Is done.

  Therefore, as shown in FIG. 3, the temperature rise of the comparative example in the case where the semiconductor element row 22 constituting the inverter function and the semiconductor element row 23 constituting the converter function are collectively arranged for each function. When the curve 20 is compared with the temperature rise curve 24 of the first embodiment, the temperature rise curve 24 of the first embodiment has a smaller temperature difference between the maximum value and the minimum value of the temperature rise as the cooling device. It can be seen that the temperature of the entire heat receiving surface is equalized.

  As a result, the cooling efficiency by the fins of the heat sinks arranged on the opposite surface of the heat receiving block 9 is increased, and the state 25 in which the maximum temperature rise value of the cooling device is lower than that of the comparative example can always be continued (maintained). , Cooling performance can be improved.

(Explanation of effect)
As described above, according to the first embodiment, the rows 22 and 23 for each phase of the plurality of semiconductor elements 6 and 6a having different heating values are alternately arranged on the semiconductor element mounting surface 10 of one heat receiving block 9. By doing so, while maintaining the cooling efficiency of the fins of the original heat sink 11 without generating a heat spot, it is possible to achieve a uniform temperature on the semiconductor element mounting surface 10 of the heat receiving block 9 and improve the cooling performance.

(Second Embodiment)
Next, a second embodiment will be described with reference to FIGS.
(Description of configuration)
In the first embodiment, the columns of the semiconductor elements 6 and 6a constituting the converter function are configured in one phase and two columns, but in the second embodiment, the two columns are configured in a circuit manner so as to be configured in one phase and four columns. Are connected in parallel to each other (hereinafter referred to as “two-para”), and a semiconductor element that constitutes a function of one phase of the inverter between two arms 5a (row 23a and row 23b) constituting the function of the converter A row 22 of 6 and 6a is arranged and mounted.

  Specifically, in this example, the semiconductor element mounting surface 10 of the heat receiving block 9 includes rows 22, 23 a, and 23 b of semiconductor elements 6 and 6 a that constitute one arm 5 and that have different calorific values alternately in parallel 7. Columns are arranged and implemented.

  The number of arms for one phase of the converter is four because the number of arms 5a constituting the function for one phase of the converter is two in each of the row 23a and the row 23b. It becomes a column.

  In this case, the number of inverter rows 22 is smaller by one than the number of converter rows 23a and 23b, so that arms with different functions (rows with different calorific values) are arranged alternately on both edges. The rows 23a and 23b constituting the converter function are arranged, and the inverter row 22 and the converter rows 23b and 23a are alternately arranged therebetween.

  FIG. 6 shows a mounting state of a semiconductor element for a two-para converter and one arm 5a, and FIG. 7 shows a circuit configuration thereof (a circuit in which semiconductor elements 6 and 6a are connected in parallel). In FIG. 7, reference numeral 7 denotes a filter capacitor, which is not shown in FIG.

  As shown in FIG. 7, in the second embodiment, among the plurality of semiconductor element rows 22, 23a, and 23b, the semiconductor elements 6 and 6a that generate a large amount of heat and the two rows 23a and 23b are electrically connected in parallel. Connected to.

(Description of action and effect)
In the second embodiment, the same effects as in the first embodiment can be obtained, and, as shown in FIGS. 6 and 7, for example, two semiconductor elements 6 and 6a constituting a converter with a three-level main circuit configuration are provided. In the case of para, the configuration for one arm of the converter is a configuration in which two rows 23a and 23b of the semiconductor elements 6 and 6a are connected in parallel.

  Therefore, as shown in FIGS. 4 and 5, a row 22 of semiconductor elements constituting one phase of the inverter is arranged between the rows 23a and 23b of the two parallel semiconductor elements 6 and 6a constituting one phase of the converter. As a result, element rows with different losses are alternately arranged.

  Therefore, as shown in FIG. 8, when the temperature rise curve 20a of the comparative example in which the elements of the inverter and the converter are collectively arranged for each function is compared with the temperature rise curve 24a of the second embodiment, the temperature of the second embodiment is compared. In the rising curve 24a, the temperature difference between the maximum value and the minimum value of the temperature increase becomes smaller, and the temperature of the entire heat receiving surface can be equalized.

  As a result, the cooling efficiency by the fins of the heat sink 11 arranged substantially in parallel on the opposite surface of the heat receiving block 9 is increased, and as a result, the state 25a in which the maximum temperature rise value of the cooling device is lower than that of the comparative example is always maintained. It becomes possible to continue (maintain) and to improve the cooling performance.

(Third embodiment)
Next, a third embodiment will be described with reference to FIGS.
(Description of configuration)
In the first and second embodiments, the rows 22 and 23 of the semiconductor elements 6 and 6a or the rows 22, 23a and 23b are arranged in a direction perpendicular to the air blowing direction 18 to the heat sink 11. In the third embodiment, the direction of the rows 22, 23 a, 23 b of the semiconductor elements 6, 6 a in each phase is arranged in parallel with the blowing direction 18 to the heat sink 11.

  That is, in the semiconductor cooling device 8 for a vehicle according to the third embodiment, the direction of the rows 22 and 23 of the individual semiconductor elements 6 and 6a or the rows 22, 23a and 23b is set to the air blowing direction 18 (the direction opposite to the vehicle traveling direction) ).

(Description of action and effect)
In the third embodiment, the same effects as in the first embodiment and the second embodiment are obtained, and when the vehicle is driven and blown, the semiconductor element mounting surface 10 is upwind 29 in the blowing direction 18. The effect of leeward 30 occurs.

  As a result, the semiconductor element sections 6 and 6a disposed on the lee receive heat from the semiconductor elements 6 and 6a disposed on the leeward, and a difference occurs in the heat distribution between the leeward and the leeward.

  If the direction of the rows 22 and 23 of the semiconductor elements 6 and 6a or the rows 22, 23a and 23b in each phase is parallel to the blowing direction 18, the influence of the leeward is only the influence from the elements arranged on the windward side. The temperature distribution is determined by the unit of the arm 5, and the temperature variation on the heat receiving surface of the heat receiving block 9 can be minimized as compared with the case where each row is arranged in the direction orthogonal to the air blowing direction 18.

  As shown in FIG. 10, when the temperature rise curve 20b of the comparative example in which the elements of the inverter and the converter are arranged for each function are compared with the temperature rise curve 24b of the third embodiment, the temperature rise curve of the third embodiment is compared. In the case of 24b, the temperature difference between the maximum value and the minimum value of the temperature rise of the cooling device becomes smaller, and the temperature rise of the entire heat receiving surface can be equalized.

  As a result, the fin efficiency of the heat sink 11 disposed substantially parallel to the opposite surface of the heat receiving block 9 is increased, and as a result, the state 25b in which the maximum temperature rise value of the cooling device is lower than that of the comparative example is always maintained (maintained). ) To improve cooling performance.

  That is, according to each embodiment mentioned above, the temperature balance in the semiconductor element attachment surface 10 of the heat receiving block 9 can be improved, and the cooling performance of the semiconductor cooling device 8 for vehicles can be improved.

  In the above-described embodiment, the main circuit configuration is described mainly with three levels, but it goes without saying that the same effect can be obtained with a two-level main circuit configuration.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 5 ... Arm, 6, 6a ... Semiconductor element, 8 ... Semiconductor cooling device for vehicles, 8a ... Case, 9 ... Heat receiving block, 10 ... Semiconductor element mounting surface, 11 ... Heat sink, 17 ... Under floor, 22, 23, 23a, 23b ... a row of semiconductor elements.

Claims (3)

A heat receiving block having a first surface and a second surface opposite to the first surface;
A plurality of rows of semiconductor elements in which rows of semiconductor elements having different calorific values are alternately arranged on the first surface of the heat receiving block;
A vehicle semiconductor cooling device comprising: a heat radiating member disposed on a second surface of the heat receiving block so that a longitudinal end thereof coincides with a vehicle traveling direction.   2. The semiconductor cooling device for a vehicle according to claim 1, wherein two rows of semiconductor elements having a high calorific value among the rows of the plurality of semiconductor elements are electrically connected in parallel.   The vehicle semiconductor cooling device according to claim 1, wherein the plurality of rows of semiconductor elements are arranged along the vehicle traveling direction.

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