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JP2012238502A - Light-emitting device, lighting device, and lighting fixture - Google Patents

Light-emitting device, lighting device, and lighting fixture Download PDF

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JP2012238502A
JP2012238502A JP2011107316A JP2011107316A JP2012238502A JP 2012238502 A JP2012238502 A JP 2012238502A JP 2011107316 A JP2011107316 A JP 2011107316A JP 2011107316 A JP2011107316 A JP 2011107316A JP 2012238502 A JP2012238502 A JP 2012238502A
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light emitting
emitting device
light
lighting
substrate
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Susumu Shimazaki
進 島崎
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Toshiba Lighting and Technology Corp
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Abstract

【課題】自動化に適した電気的な接続手段を構成することが可能な発光装置、照明装置および照明器具を提供する。
【解決手段】発光装置10は、複数の基板11と接続部材15を具備する。複数の基板11は、固体発光素子12および固体発光素子に電気的に接続される電極13を有し、少なくとも一辺に凹部14が設けられ、凹部が設けられた一辺を対向させることにより嵌合凹部16が形成される。接続部材15は、少なくとも一部が前記嵌合凹部に嵌合し、隣接する基板の各電極を電気的に接続する。
【選択図】 図1
A light emitting device, a lighting device, and a lighting fixture capable of constituting an electrical connection means suitable for automation are provided.
A light emitting device includes a plurality of substrates and a connection member. The plurality of substrates 11 includes a solid light emitting element 12 and an electrode 13 that is electrically connected to the solid light emitting element. The concave part 14 is provided on at least one side, and the one side provided with the concave part is opposed to the fitting concave part. 16 is formed. The connection member 15 is at least partially fitted in the fitting recess, and electrically connects the electrodes of the adjacent substrates.
[Selection] Figure 1

Description

本発明の実施形態は、発光ダイオード等の固体発光素子を光源とする発光装置、照明装置および照明器具に関する。   Embodiments described herein relate generally to a light emitting device, a lighting device, and a lighting fixture that use a solid light emitting element such as a light emitting diode as a light source.

近年、フィラメント電球や蛍光ランプに代わって、寿命が長く、また消費電力の少ない固体発光素子である発光ダイオード(以下「LED」と称する)を光源とした発光装置、およびこの発光装置を用いたLEDランプ等の照明装置が商品化されている。これら照明装置においては、屋内外の照明器具に広く使用されている直管形の蛍光ランプに代えて使用することが可能な直管状をなすLEDランプや灯具等の照明装置が提案され商品化されている。   In recent years, a light-emitting device using a light-emitting diode (hereinafter referred to as “LED”), which is a solid-state light-emitting element having a long life and low power consumption, instead of a filament bulb or a fluorescent lamp, and an LED using this light-emitting device Lighting devices such as lamps have been commercialized. In these lighting devices, lighting devices such as LED lamps and lamps having a straight tube shape that can be used instead of the straight tube fluorescent lamps widely used in indoor and outdoor lighting fixtures have been proposed and commercialized. ing.

特開2011−023227号公報JP 2011-023227 A

これら直管状をなすLEDランプは、全長が600〜2400mm程度の長さを有し、発光モジュールを構成する発光装置も長尺な基板が必要となる。この基板は、製造性等を考慮して短く構成した基板を複数構成し、この複数の基板を長手方向に連結して長尺な発光装置を構成している。   These straight tube-shaped LED lamps have a total length of about 600 to 2400 mm, and a light emitting device constituting the light emitting module also requires a long substrate. In this substrate, a plurality of short substrates are formed in consideration of manufacturability and the like, and a plurality of substrates are connected in the longitudinal direction to form a long light emitting device.

このため、複数の各基板を電気的に接続する必要が生じることから、一般的には各基板にコネクタを設け、ワイヤハーネスによって各コネクタを接続する構成が採用されている。しかしながら、これらワイヤハーネスとコネクタとの接続作業は人手を介さなければならず、量産化を必要とするこの種の発光装置、照明装置および照明器具においては自動化に不向きな問題が生じる。   For this reason, since it is necessary to electrically connect a plurality of substrates, a configuration is generally adopted in which connectors are provided on the substrates and the connectors are connected by a wire harness. However, these wire harnesses and connectors must be connected manually, and this type of light-emitting device, lighting device, and lighting fixture that requires mass production has a problem that is unsuitable for automation.

このため、如何にして自動化に適した電気的な接続手段を構成するかが重要な課題となっている。これらの課題は、直管状をなす照明装置に限らず、円形や四角形等の環状をなす照明装置を構成する場合にも同様の課題が生じる。   For this reason, how to configure an electrical connection means suitable for automation is an important issue. These problems are not limited to a straight tubular illumination device, but the same problem arises when a circular or square illumination device is configured.

本発明は、上記課題に鑑みてなされたもので、自動化に適した電気的な接続手段を構成することが可能な発光装置、照明装置および照明器具を提供しようとするものである。   The present invention has been made in view of the above problems, and an object of the present invention is to provide a light-emitting device, a lighting device, and a lighting fixture that can constitute electrical connection means suitable for automation.

実施形態における発光装置は、複数の基板と接続部材を具備する。複数の基板は、固体発光素子および固体発光素子に電気的に接続される電極を有し、少なくとも一辺に凹部が設けられ、凹部が設けられた一辺を対向させることにより嵌合凹部が形成される。接続部材は、少なくとも一部が前記嵌合凹部に嵌合し、隣接する基板の各電極を電気的に接続する。   The light emitting device in the embodiment includes a plurality of substrates and connection members. The plurality of substrates have a solid-state light emitting element and an electrode electrically connected to the solid-state light-emitting element, and are provided with a recess at least on one side, and a fitting recess is formed by facing one side provided with the recess. . At least a part of the connection member is fitted in the fitting recess, and the electrodes of the adjacent substrates are electrically connected.

本発明によれば、自動化に適した電気的な接続手段を構成することが可能な発光装置、照明装置および照明器具を提供することが可能となる。   ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the light-emitting device, the illuminating device, and the lighting fixture which can comprise the electrical connection means suitable for automation.

実施形態に係る発光装置を示し、(a)は複数の基板同士を連結する部分を拡大して示す斜視図、(b)は分解した状態を縮小して示す斜視図。The light-emitting device which concerns on embodiment is shown, (a) is a perspective view which expands and shows the part which connects several board | substrates, (b) is a perspective view which reduces and shows the disassembled state. 同じく発光装置を示し、(a)は基板の連結部分を拡大して示す斜視図、(b)は接続部材を拡大して示す斜視図。The light emitting device is also shown, (a) is an enlarged perspective view showing a connecting portion of a substrate, (b) is an enlarged perspective view showing a connecting member. 同じく発光装置を示し、(a)は図1(a)のa−a線に沿う断面図、(b)は図1(a)のb−b線に沿う断面図。The light emitting device is also shown, and (a) is a cross-sectional view taken along the line aa in FIG. 1 (a), and (b) is a cross-sectional view taken along the line bb in FIG. 1 (a). 同じく発光装置の基板および接続部材の組み立て手順を示す斜視図。The perspective view which similarly shows the assembly procedure of the board | substrate and connection member of a light-emitting device. 同じく発光装置の半田およびネジ止めにおける組み立て手順を示す斜視図。The perspective view which similarly shows the assembly procedure in the solder and screwing of a light-emitting device. 同じく発光装置の概略的な電気回路図。FIG. 3 is a schematic electric circuit diagram of the light emitting device. 同じく発光装置の第1の変形例を示し、(a)は接続部材の斜視図、(b)は図3(b)に相当する断面図。Similarly, the 1st modification of a light-emitting device is shown, (a) is a perspective view of a connection member, (b) is sectional drawing equivalent to FIG.3 (b). 同じく発光装置の第2の変形例を示し、(a)は接続部材の斜視図、(b)は図3(b)に相当する断面図。Similarly, the 2nd modification of a light-emitting device is shown, (a) is a perspective view of a connection member, (b) is sectional drawing equivalent to FIG.3 (b). 同じく発光装置の変形例を示し、(a)は第3の変形例を示す図1(a)に相当する斜視図、(b)は第4の変形例を示す図1(a)に相当する斜視図、(c)は第5の変形例を示す凹部および電極部分の断面図。Similarly, a modification of the light emitting device is shown, (a) is a perspective view corresponding to FIG. 1 (a) showing a third modification, and (b) is equivalent to FIG. 1 (a) showing a fourth modification. A perspective view and (c) are sectional views of a crevice and an electrode portion showing the 5th modification. 実施形態に係る照明装置を示し、(a)は照明装置を分解し、一部を切り欠いて示す斜視図、(b)は口金を外した状態で示す端面図。The illuminating device which concerns on embodiment is shown, (a) is a perspective view which decomposes | disassembles an illuminating device and shows a part, and (b) is an end elevation shown in the state which removed the nozzle | cap | die. 同じく照明装置の変形例を示し、(a)は第1の変形例を、口金を外した状態で示す端面図、(b)は第2の変形例を、口金を外した状態で示す端面図。The modification of an illuminating device is similarly shown, (a) is an end view showing the first modification with the base removed, and (b) is an end view showing the second modification with the base removed. . 実施形態に係る照明器具を示し、(a)は正面図、(b)は側面図。The lighting fixture which concerns on embodiment is shown, (a) is a front view, (b) is a side view. 同じく照明器具に用いられる照明装置の変形例を示し、(a)は第3の変形例を概略的に示す平面図、(b)は第4の変形例を概略的に示す平面図。The modification of the illuminating device similarly used for a lighting fixture is shown, (a) is a top view which shows schematically the 3rd modification, (b) is a top view which shows schematically the 4th modification.

以下、発光装置、照明装置および照明器具の実施形態につき、図に従い説明する。   Hereinafter, embodiments of a light emitting device, a lighting device, and a lighting fixture will be described with reference to the drawings.

先ず、発光装置につき説明する。本実施形態の発光装置は、現行40Wタイプの直管形蛍光ランプに相当する全長が約1200mmの直管形LEDランプに用いられる発光モジュールを構成するもので、図1に示すように、発光装置10は、固体発光素子12および固体発光素子に電気的に接続される電極13を有する複数の基板11と、隣接する基板の各電極13を電気的に接続する接続部材15等で構成される。   First, the light emitting device will be described. The light emitting device of this embodiment constitutes a light emitting module used for a straight tube type LED lamp having a total length of about 1200 mm corresponding to the current 40 W type straight tube fluorescent lamp. As shown in FIG. 10 includes a solid-state light emitting element 12 and a plurality of substrates 11 having electrodes 13 electrically connected to the solid-state light emitting elements, a connection member 15 that electrically connects each electrode 13 of an adjacent substrate, and the like.

基板11は、光源体を構成するもので、電気絶縁性の良好な部材、本実施形態では、長さ約300mm、幅約20mm、厚さ約1.6mm程度の平板状の薄く細長い矩形状のガラスエポキシ樹脂からなる回路基板で構成され、その表面(図1(a)における上方の面)に銅箔等で構成された配線パターン(図示省略)が形成され、この配線パターン上に複数個の発光部を構成するように固体発光素子12が基板11の長手方向の軸線x−xに沿って略直線状に一列に略等間隔に配設される。   The substrate 11 constitutes a light source body, and is a member having good electrical insulation, in this embodiment, a flat and thin rectangular shape having a length of about 300 mm, a width of about 20 mm, and a thickness of about 1.6 mm. A circuit board made of glass epoxy resin is formed, and a wiring pattern (not shown) made of copper foil or the like is formed on the surface (upper surface in FIG. 1A), and a plurality of wiring patterns are formed on the wiring pattern. Solid light-emitting elements 12 are arranged in a substantially straight line at substantially equal intervals along an axis xx in the longitudinal direction of the substrate 11 so as to constitute a light-emitting portion.

また、基板11の表面には、配線パターンの形成時に同時に一対の電極13が形成され、この電極13に隣接して一対の凹部14が形成される。そして、本実施形態においては、図1(b)に示すように、上記に構成された同様構成の4枚の基板11が用意され、4枚の各基板11が基板の長手方向の軸線x−xに沿って連結され、全長が約1200mmの長尺基板が構成される。なお、基板11は、セラミックスで構成しても、さらには、エポキシ樹脂等で電気絶縁処理を施した熱伝導性の良好な金属、例えば、アルミニウムや銅等で構成したものであってもよい。   A pair of electrodes 13 is formed on the surface of the substrate 11 simultaneously with the formation of the wiring pattern, and a pair of recesses 14 is formed adjacent to the electrodes 13. In the present embodiment, as shown in FIG. 1B, four substrates 11 having the same configuration as described above are prepared, and each of the four substrates 11 has an axis x− in the longitudinal direction of the substrate. A long substrate connected along x and having a total length of about 1200 mm is formed. The substrate 11 may be made of ceramics, or may be made of a metal having good thermal conductivity, such as aluminum or copper, which has been electrically insulated with an epoxy resin or the like.

固体発光素子12は、本実施形態では発光ダイオード(以下「LED」と称す)で構成し、複数個のSMD(Surface Mount Device)タイプのLEDからなり、これら各LED12は、基板11の配線パターン上に実装され直列に接続される。なお、固体発光素子は、基板に直接実装される複数個のLEDチップおよびこのLEDチップから照射される光により励起される蛍光体を含む樹脂で封止し、白色(昼白色、昼光色、電球色等を含む)を発光するように構成されたCOB(Chip on Board)タイプであってもよい。   In the present embodiment, the solid state light emitting device 12 is composed of a light emitting diode (hereinafter referred to as “LED”), and is composed of a plurality of SMD (Surface Mount Device) type LEDs. And connected in series. The solid state light emitting device is sealed with a resin containing a plurality of LED chips directly mounted on a substrate and a phosphor excited by light emitted from the LED chips, and white (day white, daylight, light bulb color). COB (Chip on Board) type configured to emit light.

電極13は、基板11の両端の短手方向の辺11a、11aに沿って一対ずつ計4個が形成される。各電極13は、図2(a)に示すように、短手方向の辺11a、11aからそれぞれ所定の間隔寸法l1を有し、かつ長手方向の辺11b、11bからもそれぞれ所定の間隔寸法l2を有するようにして形成される。この各電極13は、同様の形状をなし、配線パターンの形成時に同時に形成されることによって、配線パターンと同様に銅箔等で構成され、配線パターンによって形成される電路とともに、各LED12に電気的に接続されるように構成される。   A total of four electrodes 13 are formed in pairs along the lateral sides 11 a and 11 a at both ends of the substrate 11. As shown in FIG. 2A, each electrode 13 has a predetermined distance dimension 11 from the sides 11a and 11a in the short direction, and also has a predetermined distance dimension 12 from the sides 11b and 11b in the longitudinal direction. Is formed. Each electrode 13 has the same shape and is formed at the same time as the wiring pattern is formed, so that it is made of copper foil or the like as in the wiring pattern and is electrically connected to each LED 12 together with the electric circuit formed by the wiring pattern. Configured to be connected to.

凹部14は、細長い矩形状をなす基板11の少なくとも一辺、本実施形態においては、4枚の基板11を連結するために、基板11の両端の短手方向の辺11a、11aに沿って、一辺当たり一対ずつ計4個、二辺で計8個が形成される。なお、2枚の基板のみを連結する場合には、基板の一端の短手方向の辺のみに、一対ずつ計4個を形成すればよく、凹部は少なくとも基板の一辺に形成されていればよい。   The recess 14 is formed on one side along at least one side of the elongated rectangular substrate 11, in this embodiment, the sides 11 a and 11 a in the short direction at both ends of the substrate 11 in order to connect the four substrates 11. A total of 4 pairs are formed, and a total of 8 are formed on two sides. In the case of connecting only two substrates, a total of four pairs may be formed only on the short side of one end of the substrate, and the recesses may be formed on at least one side of the substrate. .

各凹部14は、本実施形態では縦に矩形状に切り込んだ溝で構成され、各電極13の両側に隣接して一対が形成される。すなわち、図2(a)に示すように、凹部14を構成する一対の溝は、一端部が基板11の短手方向の辺11aの端面11a1に開放し、他端部が長手方向の辺11bに略平行して電極13の略中間部まで延伸させて形成する。   In the present embodiment, each recess 14 is constituted by a groove cut vertically in a rectangular shape, and a pair is formed adjacent to both sides of each electrode 13. That is, as shown in FIG. 2A, the pair of grooves constituting the recess 14 has one end opened to the end surface 11a1 of the side 11a in the short direction of the substrate 11, and the other end is the side 11b in the longitudinal direction. Is formed so as to extend substantially parallel to the intermediate portion of the electrode 13.

凹部14は、その溝の開口幅寸法w1が狭く、高さ寸法h1が基板11の厚さ寸法の中間部分より若干深く切り込んだ寸法を有し、長さ寸法l3が電極13の中間部分までの寸法l4と略等しい寸法に形成する(l3≒l4)。上記に構成される凹部14は、同様構成の一対ずつ計4個の電極13に対して、それぞれ同様の形状・寸法を有する溝で構成される。   The recess 14 has a narrow opening width dimension w1 of the groove, a height dimension h1 cut slightly deeper than an intermediate portion of the thickness dimension of the substrate 11, and a length dimension l3 extending to the intermediate portion of the electrode 13. The dimension is approximately equal to the dimension l4 (l3≈l4). The concave portion 14 configured as described above is configured by a groove having the same shape and size with respect to a total of four electrodes 13 each having a similar configuration.

接続部材15は、図2(b)に示すように、導電性を有する金属、本実施形態では幅寸法が電極13の幅寸法より大きい銅板で構成され、連結される際、隣接する基板11の各一対の電極13同士を、それぞれ電気的に連結して接続する部材で、両側部に鉤形の脚部15aが一体に折曲された断面形状が略逆U字状をなすように構成される。   As shown in FIG. 2B, the connecting member 15 is made of a conductive metal, which is a copper plate having a width dimension larger than the width dimension of the electrode 13 in this embodiment, and when connected, Each of the pair of electrodes 13 is a member that is electrically connected and connected to each other, and is configured such that a cross-sectional shape obtained by integrally bending a bowl-shaped leg portion 15a on both sides forms a substantially inverted U shape. The

そして、脚部15aの厚さ寸法t1は、凹部14の溝の開口幅寸法w1と等しいか若干大きい寸法に形成する(t1≧w1)。脚部15aの高さ寸法h2は、凹部14を構成する溝の高さ寸法h1より短く形成する(h2<h1)。また、接続部材15の長さ寸法l5は、図1(a)のように、複数の各基板11を連結した際に、隣り合う各基板11の対向する各電極13の中間部分までの間の寸法l6(l6=l4×2)より短い寸法(l5<l6)、換言すれば、凹部14の長さ寸法l3の2倍より短い寸法(l5<l3×2)に形成する。   And the thickness dimension t1 of the leg part 15a is formed in the dimension which is equal to or slightly larger than the opening width dimension w1 of the groove | channel of the recessed part 14 (t1> = w1). The height dimension h2 of the leg 15a is formed shorter than the height dimension h1 of the groove constituting the recess 14 (h2 <h1). Further, the length dimension 15 of the connecting member 15 is the distance between the electrodes 13 adjacent to each other adjacent to each other when the plurality of substrates 11 are connected as shown in FIG. The dimension is smaller than the dimension l6 (l6 = l4 × 2) (l5 <l6), in other words, the dimension is smaller than twice the length dimension l3 of the recess 14 (l5 <l3 × 2).

そして、上記に構成された接続部材15は、少なくとも一部、本実施形態では、脚部15aが、2個の凹部14が連続した長い溝(l3+l3)からなる嵌合凹部16に嵌合される。すなわち、図1(a)に示すように、複数の各基板11を連結する際に、各基板11の短手方向の辺11a、11aが突き合わされる。これにより隣接する各基板11の各凹部14を構成する溝の開口が対向して合致し、連続した長い溝(l3+l3)からなる一対の嵌合凹部16が形成される。   In the connection member 15 configured as described above, at least a part, in this embodiment, the leg portion 15a is fitted into the fitting recess 16 formed of a long groove (l3 + l3) in which two recesses 14 are continuous. . That is, as shown in FIG. 1A, when connecting a plurality of substrates 11, the sides 11a and 11a in the short direction of each substrate 11 are abutted. As a result, the openings of the grooves constituting the recesses 14 of the adjacent substrates 11 face each other and are matched to form a pair of fitting recesses 16 formed of continuous long grooves (l3 + l3).

そして、この一対の嵌合凹部16に対して、上方から接続部材15の両脚部15aを差し込む。換言すれば、隣接する各基板11の凹部14、14に跨って、上方から接続部材15の両脚部15aを差し込む。この際、図1(a)に示すように、接続部材15の中心線y−yが各基板11の合わせ目の線z−zに合致するように位置させて差し込む。これにより、接続部材15における両端が、電極13の略半分程度を覆い、接続部材15の両端の内面が電極13の表面に接触し、隣接する各基板11の電極13同士が、銅板からなる接続部材15によって電気的に接続される。   Then, both leg portions 15a of the connecting member 15 are inserted into the pair of fitting recesses 16 from above. In other words, both leg portions 15a of the connecting member 15 are inserted from above over the recesses 14 and 14 of the adjacent substrates 11. At this time, as shown in FIG. 1A, the center line yy of the connection member 15 is inserted so as to be aligned with the line zz of the joint of each substrate 11. Thus, both ends of the connection member 15 cover approximately half of the electrode 13, the inner surfaces of both ends of the connection member 15 are in contact with the surface of the electrode 13, and the electrodes 13 of each adjacent substrate 11 are made of a copper plate. It is electrically connected by the member 15.

この際、接続部材15の長さ寸法l5、脚部15aの厚さ寸法t1、高さ寸法h2および凹部14の溝の長さ寸法(l3)、嵌合凹部16を構成する溝の長さ寸法(l3+l3)、各凹部14を構成する溝の幅寸法w1、高さ寸法h1は、上記のように、l5<l3+l3、t1≧w1、h2<h1の関係を有するように構成されており、接続部材15の脚部15aが嵌合溝16に確実に嵌合される。特に、接続部材15の長さ寸法l5は、凹部14の長さ寸法l3の2倍、すなわち、嵌合凹部16の長さより短い寸法(l5<l3+l3)に形成されているので、接続部材15と嵌合凹部16との、基板軸線x−x方向への多少の位置ずれを吸収することができ、より確実に接続部材15を嵌合凹部16に差し込むことが可能となる。   At this time, the length 15 of the connecting member 15, the thickness t 1 of the leg 15 a, the height h 2, the length of the groove 14 (13), and the length of the groove constituting the fitting recess 16. (13 + 13), the width dimension w1 and the height dimension h1 of the grooves constituting each recess 14 are configured so as to have a relationship of l5 <l3 + l3, t1 ≧ w1, h2 <h1, as described above. The leg portion 15 a of the member 15 is securely fitted in the fitting groove 16. In particular, the length 15 of the connection member 15 is twice the length 13 of the recess 14, that is, a length shorter than the length of the fitting recess 16 (l 5 <l 3 + l 3). A slight positional shift in the substrate axis xx direction with respect to the fitting recess 16 can be absorbed, and the connecting member 15 can be more reliably inserted into the fitting recess 16.

これにより、接続部材15の内面を電極13の表面に対して確実に接触させることができるとともに、接続部材15によって、隣接する各基板11同士が短手方向の辺11a、11aに確実に当接して機械的な連結が行われる。同時に、連結される各基板11同士の位置合せを確実に行うことが可能になる。   Accordingly, the inner surface of the connection member 15 can be reliably brought into contact with the surface of the electrode 13, and the adjacent substrates 11 are reliably brought into contact with the sides 11 a and 11 a in the short direction by the connection member 15. Mechanical connection. At the same time, it is possible to reliably align the substrates 11 to be connected.

また、上記のように、一対の電極13間の寸法、一対の接続部材15間の寸法は、電気絶縁性を十分に確保する必要があることから、沿面距離・空間距離は、1mm以上若しくは3mm以上を確保するように配置して構成する。特に、図3(a)に示すように、接続部材15の脚部15aの先端と、後述する金属製の筐体17との距離寸法aは、1mm若しくは3mm以上を確保できるように、脚部15aの高さ寸法h2は、凹部14を構成する溝の高さ寸法h1より短く形成する(h2<h1)。   Further, as described above, the dimension between the pair of electrodes 13 and the dimension between the pair of connecting members 15 need to ensure sufficient electrical insulation, so that the creepage distance and the spatial distance are 1 mm or more or 3 mm. Arrangement is made so as to ensure the above. In particular, as shown in FIG. 3 (a), the distance between the tip of the leg 15a of the connecting member 15 and the metal casing 17 to be described later is 1 mm or 3 mm or more so that the distance dimension a is 1 mm or more. The height dimension h2 of 15a is formed shorter than the height dimension h1 of the groove constituting the recess 14 (h2 <h1).

上記により、LED12およびLED12に電気的に接続される電極13を有し、少なくとも一辺、本実施形態では、両端の短手方向に凹部14が設けられ、凹部が設けられた一辺を対向させることにより嵌合凹部が形成される複数の基板11と、少なくとも一部が嵌合凹部16に嵌合し、隣接する基板11の各電極13を電気的に接続する接続部材15とを具備する発光モジュール、すなわち、発光装置10が構成され、熱伝導性を有する筐体17に取り付けられる。   As described above, the LED 12 and the electrode 13 that is electrically connected to the LED 12 are provided, and at least one side, in this embodiment, the concave portion 14 is provided in the short direction of both ends, and the one side provided with the concave portion is opposed to each other. A light emitting module comprising: a plurality of substrates 11 in which fitting recesses are formed; and a connecting member 15 that at least partially fits into the fitting recesses 16 and electrically connects the electrodes 13 of the adjacent substrates 11; That is, the light emitting device 10 is configured and attached to the housing 17 having thermal conductivity.

筐体17は、LED12の点灯時に発生する熱を外部に放熱させるための放熱部材を兼ねるもので、熱伝導性を有する部材、本実施形態では、熱伝導性の良好なアルミニウムの押し出し成形によって、長手方向に延在する細く長い形状に構成する。本実施形態では、上述した4枚の発光装置10を設置できるように約1200mmの長さ寸法を有して形成される。筐体17は、図1(b)に示すように、断面形状が円弧部17aと直線部17bからなり、全体の断面形状が円弧状底面を有する略半月状をなすように形成する。   The housing 17 also serves as a heat radiating member for radiating the heat generated when the LED 12 is turned on to the outside, and is a member having thermal conductivity, in this embodiment, by extrusion molding of aluminum with good thermal conductivity. It is configured in a thin and long shape extending in the longitudinal direction. In the present embodiment, the light emitting device 10 is formed with a length of about 1200 mm so that the four light emitting devices 10 described above can be installed. As shown in FIG. 1B, the housing 17 is formed so that the cross-sectional shape is formed of an arc portion 17a and a straight portion 17b, and the entire cross-sectional shape is substantially half-moon shaped with an arc-shaped bottom surface.

筐体17は、長尺状をなし、4枚の発光装置10の長手方向に沿って延在して補強材の作用をなすことから、細く長い発光装置10の強度を強くすることが可能になる。また、筐体17は、図11(a)に示すように、軽量化、強度アップさらに材料費削減のために中空のパイプ状をなすように構成してもよい。そして、筐体17は、直線部17bを形成する表面側に、電気絶縁性を有する絶縁部材18を介して4枚の発光装置10が筐体17の長手方向に沿い、かつ発光装置10および筐体17におけるそれぞれの長手方向の軸線が合致して載置される。   The casing 17 has a long shape and extends along the longitudinal direction of the four light emitting devices 10 to act as a reinforcing material. Therefore, the strength of the thin and long light emitting device 10 can be increased. Become. Moreover, as shown to Fig.11 (a), you may comprise the housing | casing 17 in the shape of a hollow pipe for weight reduction, strength improvement, and material cost reduction. The casing 17 has four light emitting devices 10 along the longitudinal direction of the casing 17 through an insulating member 18 having electrical insulation on the surface side forming the straight portion 17b, and the light emitting device 10 and the casing. The respective longitudinal axes of the body 17 are placed in alignment.

絶縁部材18は、本実施形態では、電気絶縁性および熱伝導性を有するシリコーン樹脂やエポキシ樹脂等からなるシートまたは接着剤等で構成され、4枚の発光装置10を構成する各基板11が絶縁部材18を介して、上方からネジ等の固定手段S1によって筐体17の表面側に固定される。   In this embodiment, the insulating member 18 is composed of a sheet or adhesive made of a silicone resin, an epoxy resin, or the like having electrical insulation and thermal conductivity, and each substrate 11 constituting the four light emitting devices 10 is insulated. It is fixed to the front surface side of the housing 17 by a fixing means S1 such as a screw from above through the member 18.

これにより、基板11は、電気絶縁性を有する絶縁部材18を介して、アルミニウムからなる電気伝導性を有する筐体17に取り付けられ、この絶縁部材18は接続部材15と筐体17との間に介在し、基板11と筐体17との間、すなわち、電極13および接続部材15と筐体17との間の電気絶縁性を十分に確保することが可能になる。なお、本実施形態において、電気絶縁性を十分に確保することが可能であれば、絶縁部材18を省略して電気絶縁性を有する樹脂からなる基板11を直接、筐体17に設けるように構成してもよい。   Thus, the substrate 11 is attached to the casing 17 having electrical conductivity made of aluminum via the insulating member 18 having electrical insulation, and the insulating member 18 is interposed between the connection member 15 and the casing 17. It is possible to ensure sufficient electrical insulation between the substrate 11 and the housing 17, that is, between the electrode 13 and the connection member 15 and the housing 17. In the present embodiment, if sufficient electrical insulation can be ensured, the insulating member 18 is omitted, and the substrate 11 made of a resin having electrical insulation is provided directly on the housing 17. May be.

次に、上記に構成される発光装置10の組み立て手順につき、図4、図5に従い説明する。先ず、上記のように構成された4枚の発光装置10と、1本の筐体17を用意し、図4中の矢印Aに示すように、筐体17の直線部17bを形成する表面側に、上方から絶縁部材18を載置し、さらに絶縁部材18の表面側に上方から連結する4枚の発光装置10を順次載置する。この際、隣接する各基板11両端の短手方向の辺11a、11a同士を突き合わせ、各凹部14を対向させて合致し、各凹部14を連続させて嵌合凹部16を形成する。   Next, an assembly procedure of the light emitting device 10 configured as described above will be described with reference to FIGS. First, four light emitting devices 10 configured as described above and one casing 17 are prepared, and as shown by an arrow A in FIG. In addition, the insulating member 18 is mounted from above, and the four light emitting devices 10 connected from the upper side to the surface side of the insulating member 18 are sequentially mounted. At this time, the sides 11a, 11a in the short direction at both ends of the adjacent substrates 11 are abutted to each other so that the respective concave portions 14 are opposed to each other, and the respective concave portions 14 are continued to form the fitting concave portion 16.

次に、矢印Bに示すように、嵌合凹部16に対して上方から接続部材15を、その両脚部15aが位置するように搬送して載置する。次に、上方から接続部材15を押圧して、両脚部15aを嵌合凹部16に差し込み、隣接する2枚の基板11同士を連結する。   Next, as shown by an arrow B, the connection member 15 is transported and placed from above with respect to the fitting recess 16 so that both legs 15a are positioned. Next, the connecting member 15 is pressed from above, the both leg portions 15a are inserted into the fitting recesses 16, and the two adjacent substrates 11 are connected.

次に、残り2枚の基板11を順次、上記と同様にして連結する。これにより、4枚の基板11が連結されると同時に、4枚の隣接する基板11の各電極13が導電性を有する接続部材15によって電気的に接続される。さらに、各基板11同士の位置合せがなされる。   Next, the remaining two substrates 11 are sequentially connected in the same manner as described above. As a result, the four substrates 11 are connected, and at the same time, the electrodes 13 of the four adjacent substrates 11 are electrically connected by the connection member 15 having conductivity. Further, the substrates 11 are aligned with each other.

次に、さらに、電気的な接続を確実に行うために、図5中の矢印Cに示すように、上方から、接続部材15の表面と電極13の表面に対して半田やスポット溶接等の手段によって溶接Yを行う。この際、上記のように、連結される各基板11同士が接続部材15によって位置合せが確実になされていることから、半田等の作業を所定の位置に対して上方から確実に行うことが可能になり、組み立て性を向上させることができる。   Next, in order to ensure electrical connection, as shown by an arrow C in FIG. 5, means such as soldering or spot welding from above to the surface of the connection member 15 and the surface of the electrode 13 are used. To perform welding Y. At this time, as described above, since the substrates 11 to be coupled are reliably aligned by the connecting member 15, it is possible to reliably perform soldering and the like from above on a predetermined position. As a result, the assemblability can be improved.

最後に、上記のように連結された各基板11の表面側の4箇所程度に対して、図5中の矢印Cに示すように、上方からネジS1をねじ込んで筐体17に固定する。これにより、放熱部材を兼ねる筐体17を備えた長さ約1200mmの長尺な発光装置10が構成される。   Finally, as shown by an arrow C in FIG. 5, screws S <b> 1 are screwed from above and fixed to the casing 17 at about four locations on the surface side of each substrate 11 connected as described above. Thereby, the long light-emitting device 10 having a length of about 1200 mm including the housing 17 that also serves as a heat dissipation member is configured.

上記のように、本実施形態における4枚の発光装置10の組み立てに際しては、全ての工程が上方から下方への操作方向によって行われる。すなわち、筐体17に対する絶縁部材18の載置工程(矢印A)、絶縁部材18に対する4枚の発光装置10を順次載置する工程(矢印A)、嵌合凹部16に対する接続部材15の載置工程(矢印B)、接続部材15を押圧して、両脚部15aを嵌合凹部16に差し込み連結する工程(矢印B)、接続部材15の表面と電極13の表面に対して半田やスポット溶接等の手段によって溶接する工程(矢印C)、ネジS1によって各基板11を筐体17に固定する工程(矢印C)は、全て上方から下方への操作方向によって行うことができ、これら全ての工程を簡易な手段によって自動化することが可能になる。換言すれば、自動化に適した電気的な接続手段を構成することが可能になった。   As described above, when assembling the four light emitting devices 10 in the present embodiment, all the steps are performed in the operation direction from the upper side to the lower side. That is, the step of placing the insulating member 18 on the housing 17 (arrow A), the step of sequentially placing the four light emitting devices 10 on the insulating member 18 (arrow A), and the placement of the connection member 15 on the fitting recess 16. Step (arrow B), step of pressing connecting member 15 and inserting both leg portions 15a into fitting recess 16 (arrow B), soldering, spot welding, etc. to the surface of connecting member 15 and the surface of electrode 13 The step of welding by the means (arrow C) and the step of fixing each substrate 11 to the housing 17 by the screw S1 (arrow C) can all be performed in the operating direction from the upper side to the lower side. It can be automated by simple means. In other words, it is possible to configure an electrical connection means suitable for automation.

なお、4枚の発光装置10は、接続部材15によって、図6の電気回路図に示すように、一方の電路R1に対して各LED12が直列になるように接続され、ループ電路L1によって他方の電路R2に接続される。各電路R1、R2の開放端が入力端子P1、P1となる。上記に構成された1本の長尺の発光装置10は、直管形LEDランプ等を構成する照明装置の光源として用いられる。   In addition, as shown in the electrical circuit diagram of FIG. 6, the four light emitting devices 10 are connected so that each LED 12 is connected in series to one electric circuit R1, and the other electric circuit R1 is connected by the loop electric circuit L1. Connected to the electric circuit R2. The open ends of the electric circuits R1 and R2 serve as input terminals P1 and P1. One long light emitting device 10 configured as described above is used as a light source of an illuminating device that constitutes a straight tube LED lamp or the like.

以上、本実施形態によれば、自動化に適した電気的な接続手段を構成することが可能な発光装置を提供することができ、設備投資も従来のコネクタ実装方式よりも低く抑えられ、さらに、コネクタ間のワイヤハーネスによる配線作業のための人件費を削減することができ、製造原価を大きく削減することが可能になる。   As described above, according to the present embodiment, it is possible to provide a light-emitting device capable of configuring an electrical connection means suitable for automation, and the capital investment can be suppressed to be lower than that of the conventional connector mounting method. The labor cost for the wiring work by the wire harness between the connectors can be reduced, and the manufacturing cost can be greatly reduced.

また、その構成は、各凹部14を対向させることによって形成される嵌合凹部16に対して、接続部材15の脚部15aを単に差し込む簡単な構成および操作によって電気的な接続とともに、複数の基板11の機械的な接続や位置合せも同時に行うことができる。これにより、製造原価に対して占める部品単価が大きなコネクタやワイヤハーネス等の部品を省略することができ、より一層のコスト削減が可能になる。   In addition, the configuration includes a plurality of substrates together with an electrical connection by a simple configuration and operation in which the leg portion 15a of the connection member 15 is simply inserted into the fitting recess 16 formed by making each recess 14 face each other. Eleven mechanical connections and alignments can be made simultaneously. As a result, it is possible to omit components such as connectors and wire harnesses that occupy a large part of the manufacturing cost, thereby further reducing costs.

さらに、接続部材15は、嵌合凹部16に差し込まれるので、基板11の表面に接続部材15が突出することがなく、光の影が形成され難くなる。また、連結する基板11間の隙間をなくすことも可能になり、隙間によって発光部分に暗部が形成されることが防止される。さらに、従来のように接続のためのコネクタやワイヤハーネス等が基板11から外方に突出することがなく、外観意匠的にも良好で商品性に優れた発光装置を提供することが可能になる。   Furthermore, since the connection member 15 is inserted into the fitting recess 16, the connection member 15 does not protrude from the surface of the substrate 11, and it is difficult to form a shadow of light. It is also possible to eliminate the gap between the substrates 11 to be connected, and the dark portion is prevented from being formed in the light emitting portion by the gap. Further, a connector or a wire harness for connection does not protrude outward from the substrate 11 as in the conventional case, and it is possible to provide a light emitting device that is good in appearance design and excellent in merchantability. .

以上、本実施形態において、接続部材15は、図7(a)に示すように、一対の脚部15aの中間部分を、それぞれ切り欠いて切欠部15a1を形成してもよい。この構成によれば、図7(b)に示すように、連結する各基板11の短手方向の辺11a、11aとの間に形成される合せ目部分における接続部材15と筐体17との間の空間距離l7を、切欠部15a1によって十分に確保することが可能になり、電気絶縁性のより良好な発光装置10を構成することが可能になる。   As described above, in the present embodiment, as illustrated in FIG. 7A, the connection member 15 may notch the intermediate portions of the pair of leg portions 15 a to form the notch portions 15 a 1. According to this configuration, as shown in FIG. 7B, the connection member 15 and the housing 17 at the joint portion formed between the short sides 11a and 11a of the substrates 11 to be connected. The space distance l7 can be sufficiently secured by the notch 15a1, and the light emitting device 10 with better electrical insulation can be configured.

また、図8(a)に示すように、接続部材15の一対の脚部15aを合成樹脂で形成し、一対の脚部を結ぶ連結部分15a2を銅板等の導電性の金属によって構成してもよい。この構成によれば、図8(b)に示すように、連結する各基板11の短手方向の辺11a、11aとの間に形成される合せ目部分における接続部材15と筐体17との間の空間距離l7を含む、接続部材15の連結部分15a2と筐体17との空間距離を、十分に確保することが可能になり、電気絶縁性のより一層良好な発光装置10を構成することが可能になる。   Further, as shown in FIG. 8A, the pair of leg portions 15a of the connecting member 15 may be formed of synthetic resin, and the connecting portion 15a2 connecting the pair of leg portions may be formed of a conductive metal such as a copper plate. Good. According to this configuration, as shown in FIG. 8B, the connection member 15 and the casing 17 at the joint portion formed between the short sides 11a and 11a of the substrates 11 to be connected. It is possible to secure a sufficient spatial distance between the connecting portion 15a2 of the connecting member 15 and the housing 17, including the space distance 17 between them, and to configure the light emitting device 10 having a better electrical insulation. Is possible.

また、図9(a)に示すように、比較的幅広の凹部14を形成し、この凹部に嵌合する脚部を構成する突部15aを接続部材15の下面に一体に形成してもよい。さらに、図9(b)に示すように、凹部14を角形等なす凹みで形成し、この凹部に嵌合する脚部を構成する角形等をなす一対の突部15aを接続部材15の下面に一体に形成してもよい。   Further, as shown in FIG. 9A, a relatively wide recess 14 may be formed, and a protrusion 15 a constituting a leg fitted into the recess may be integrally formed on the lower surface of the connection member 15. . Further, as shown in FIG. 9 (b), the recess 14 is formed by a recess having a square shape, and a pair of protrusions 15 a having a square shape or the like constituting a leg portion fitted into the recess is formed on the lower surface of the connection member 15. You may form integrally.

また、電極13は、図9(c)に示すように、凹部14を構成する溝内に銅箔等からなる電極を形成するようにしてもよい。この構成によれば、接続部材15の脚部15aを凹部14に挿入することによって、脚部15aと電極13が強固に密着して接触させることができ、半田等による接続手段を省略することも可能になる。なお、発光装置10の変形例を示す図7〜図9には、図1〜図6と同一部分に同一の符号を付し、詳細な説明は省略した。   Further, as shown in FIG. 9C, the electrode 13 may be formed of a copper foil or the like in a groove constituting the recess 14. According to this configuration, by inserting the leg portion 15a of the connecting member 15 into the concave portion 14, the leg portion 15a and the electrode 13 can be firmly brought into close contact with each other, and connection means such as solder can be omitted. It becomes possible. 7 to 9, which show modified examples of the light emitting device 10, are assigned the same reference numerals as in FIGS. 1 to 6, and detailed descriptions thereof are omitted.

次に、上記に構成された長尺の発光装置10を用いた照明装置の構成を、図10に従い説明する。本実施形態の照明装置20は、透光性のカバー部材21と、カバー部材21内に配設される上述した発光装置10等で構成される。   Next, the structure of the illuminating device using the elongate light-emitting device 10 comprised above is demonstrated according to FIG. The illuminating device 20 of the present embodiment includes a translucent cover member 21 and the above-described light emitting device 10 disposed in the cover member 21.

カバー部材21は、合成樹脂で構成された透光性を有する部材、本実施形態では、乳白色の半透明のポリカーボネート製で、断面が略円形で両端に開口21a、21aを有する長さが約1200mmの長尺の略直管状をなす筒形に構成される。なお、カバー部材21は、発光装置10を内部に挿入し配設するための作業性を考慮すると、両端が開口されていることが好ましいが、いずれか一方の端部が閉口されたものであってもよい。   The cover member 21 is a translucent member made of a synthetic resin. In the present embodiment, the cover member 21 is made of milky white translucent polycarbonate and has a substantially circular cross section and has openings 21a and 21a at both ends. It is comprised in the cylinder shape which makes | forms the elongate substantially straight tube shape. The cover member 21 is preferably open at both ends in consideration of workability for inserting and disposing the light emitting device 10 inside, but one of the ends is closed. May be.

上記のように構成されたカバー部材21に対して、上記のように構成された発光装置10が挿入され配設される。すなわち、発光装置10の一端部をカバー部材21の一方の開口21aから差し込む。この際、筐体17の円弧部17aをカバー部材21の内面に嵌合してガイドにしながらスライドさせて差し込む。そして、さらなる押し込み操作によって、カバー部材21の他方の開口21a近傍までスライドさせる。   The light emitting device 10 configured as described above is inserted into the cover member 21 configured as described above. That is, one end of the light emitting device 10 is inserted from one opening 21 a of the cover member 21. At this time, the circular arc portion 17a of the housing 17 is fitted to the inner surface of the cover member 21 and is inserted while being slid as a guide. Then, the cover member 21 is slid to the vicinity of the other opening 21a by further pushing operation.

これにより、発光装置10が、カバー部材21の長手方向に沿って挿入され内部に配設されるとともに、図10(b)に示すように、筐体17の円弧部17aがカバー部材21の内面に載置されて支持される。これにより、基板11に設けられた各LED12が、カバー部材21の断面における円の中心Oより片方(図10(b)中、下方)に偏位した位置に支持され、筐体17の円弧部17aがカバー部材21の円弧内面に密着して支持される。   Thereby, the light emitting device 10 is inserted along the longitudinal direction of the cover member 21 and disposed therein, and the arc portion 17a of the housing 17 is formed on the inner surface of the cover member 21 as shown in FIG. It is mounted on and supported by. Thereby, each LED 12 provided on the substrate 11 is supported at a position displaced to one side (downward in FIG. 10B) from the center O of the circle in the cross section of the cover member 21, and the arc portion of the housing 17. 17a is supported in close contact with the arc inner surface of the cover member 21.

上記のように構成されたカバー部材21および発光装置10は、カバー部材21内に発光装置10が挿入によって配設された状態で、カバー部材21の両端の開口21a、21aに対し、図10(a)に示すように、口金部材22が嵌め込まれ両端の開口が塞がれる。口金部材22は、耐熱性および電気絶縁性を有する合成樹脂、本実施形態では、白色のPBT(ポリブチレンテレフタレート)で円形のキャップ状に形成され、キャップをカバー部材21の両端の開口21a、21aに被せ、筐体17の両端面に対してネジ等の固定手段S2によって固定される。   With the cover member 21 and the light emitting device 10 configured as described above, the openings 21a and 21a at both ends of the cover member 21 in a state where the light emitting device 10 is inserted into the cover member 21 are inserted into the cover member 21 as shown in FIG. As shown to a), the nozzle | cap | die member 22 is engage | inserted and the opening of both ends is closed. The base member 22 is formed in a circular cap shape with a synthetic resin having heat resistance and electrical insulation, which is white PBT (polybutylene terephthalate) in this embodiment, and the caps are formed in openings 21 a and 21 a at both ends of the cover member 21. And is fixed to both end faces of the housing 17 by fixing means S2 such as screws.

また、一方の口金部材22には、給電用の一対のL型の端子22aが設けられ、端子22aと発光装置10の入力端子P1、P1がリード線等によって電気的に接続されて発光装置の各LED12に電源が供給される。他方の口金部材22には、発光装置10のループ電路L1を構成する端子22bが設けられ、基板11のループ電路側の各電極13とリード線等によって電気的に接続される。さらに、アース端子22cが設けられてL型口金付直管形LEDランプからなる照明装置20が構成される。   Also, one base member 22 is provided with a pair of L-shaped terminals 22a for feeding, and the terminals 22a and the input terminals P1 and P1 of the light-emitting device 10 are electrically connected by lead wires or the like, so that Power is supplied to each LED 12. The other base member 22 is provided with a terminal 22b constituting the loop electric circuit L1 of the light emitting device 10, and is electrically connected to each electrode 13 on the loop electric circuit side of the substrate 11 by a lead wire or the like. Further, the grounding terminal 22c is provided, and the illuminating device 20 composed of a straight tube LED lamp with an L-shaped base is configured.

本実施形態の照明装置は、カバー部材21の長さが約1200mm、カバー部材21の外径が約25.5mmで、現行40W形の直管形蛍光ランプに相当するL型口金付直管形LEDランプを構成した。なお、発光装置10の各LED12を点灯するための点灯装置は、上記に構成された照明装置20が組み込まれる照明器具側に設けられる。そして、商用電源Eから器具内の点灯装置を介し、器具に装着された照明装置10のL型の端子22aから各LED12に電源が供給され点灯制御される。なお、点灯装置は、照明装置20に内蔵させるように構成してもよい。この場合、点灯装置を基板11の裏側(発光面の裏側)に配設することによって、基板11の面積、すなわち、発光面の面積を減少させることなく構成することが可能になる。   In the lighting device of this embodiment, the length of the cover member 21 is about 1200 mm, the outer diameter of the cover member 21 is about 25.5 mm, and a straight tube type with an L-shaped base corresponding to the current 40 W type straight tube fluorescent lamp. An LED lamp was constructed. In addition, the lighting device for lighting each LED12 of the light-emitting device 10 is provided in the lighting fixture side in which the illuminating device 20 comprised above is integrated. Then, power is supplied to the LEDs 12 from the L-type terminal 22a of the lighting device 10 attached to the fixture from the commercial power source E through the lighting device in the fixture, and lighting control is performed. The lighting device may be configured to be built in the lighting device 20. In this case, by arranging the lighting device on the back side of the substrate 11 (the back side of the light emitting surface), it is possible to configure the lighting device without reducing the area of the substrate 11, that is, the area of the light emitting surface.

上記のように、本実施形態によれば、自動化に適した電気的な接続手段を構成することが可能な発光装置を光源として用いることにより、量産化に適した照明装置を提供することができるとともに、放熱部材を兼ねる筐体17の円弧部17aが、カバー部材21の円弧内面に合致して密着し、熱的に結合された状態で支持され、各LED12で発生する熱を筐体17からカバー部材21に伝達させ、外部に効果的に放熱させることができる。これにより、各LEDの温度上昇を防止して発光効率の低下を抑制することができ、また寿命の長い照明装置を提供することが可能になる。   As described above, according to the present embodiment, it is possible to provide a lighting device suitable for mass production by using a light emitting device capable of configuring electrical connection means suitable for automation as a light source. At the same time, the arc portion 17a of the casing 17 that also serves as a heat radiating member is fitted in close contact with the arc inner surface of the cover member 21 and is supported in a thermally coupled state, and heat generated by each LED 12 is transmitted from the casing 17. It can be transmitted to the cover member 21 to effectively dissipate heat to the outside. Thereby, the temperature rise of each LED can be prevented, and the fall of luminous efficiency can be suppressed, and it becomes possible to provide an illuminating device with a long lifetime.

以上、本実施形態において、乳白色の半透明のプラスチック製のカバー部材21を用いたが、ガラス製のカバー部材を用いて構成したものであってもよい。また、カバー部材21は、青色や赤色等に着色したものであってもよい。   As described above, in the present embodiment, the milky white translucent plastic cover member 21 is used. However, a cover member made of glass may be used. The cover member 21 may be colored blue or red.

また、カバー部材21は、図11(a)に示すように、略半円形の断面形状を有する樋状に形成し、筐体17の直線部17bの表面側に基板11を覆い被せるように支持してもよい。この構成によれば、カバー部材12の材料費を削減してコストダウンを図ることが可能になると同時に、放熱部材を兼ねる筐体17を外部に露出させることができ、一層効果的な放熱を行うことが可能になる。   Further, as shown in FIG. 11A, the cover member 21 is formed in a bowl shape having a substantially semicircular cross-sectional shape, and is supported so as to cover the substrate 11 on the surface side of the linear portion 17 b of the housing 17. May be. According to this configuration, the material cost of the cover member 12 can be reduced and the cost can be reduced, and at the same time, the casing 17 that also serves as a heat radiating member can be exposed to the outside, and more effective heat radiation can be performed. It becomes possible.

さらに、図11(b)に示すように、発光装置10の基板11を熱伝導性の良好なセラミックスや電気絶縁処理を施したアルミニウム等で構成した場合には、筐体17を設けずに、基板11単独で発光装置10を構成し、カバー部材21内に挿入することにより、筐体レスの照明装置10を構成するようにしてもよい。これによれば、筐体17を省略することによって、一層のコストダウンおよび照明装置の軽量化を図ることが可能になる。なお、照明装置20の変形例を示す図11には、図1〜図10と同一部分に同一の符号を付し、詳細な説明は省略した。   Furthermore, as shown in FIG. 11 (b), when the substrate 11 of the light emitting device 10 is made of ceramic with good thermal conductivity, aluminum that has been electrically insulated, or the like, without providing the casing 17, The light emitting device 10 may be configured by the substrate 11 alone and inserted into the cover member 21 to configure the housingless lighting device 10. According to this, by omitting the housing 17, it is possible to further reduce the cost and reduce the weight of the lighting device. In addition, in FIG. 11 which shows the modification of the illuminating device 20, the same code | symbol was attached | subjected to the same part as FIGS. 1-10, and detailed description was abbreviate | omitted.

次に、上記のように構成された照明装置20を用いた照明器具の構成を説明する。本実施形態の照明器具30は、店舗、オフィスなど施設・業務用のベースライト等の照明器具を構成したもので、図12に示すように、器具本体31と、器具本体に装着される上述した照明装置20等で構成される。   Next, the structure of the lighting fixture using the illuminating device 20 comprised as mentioned above is demonstrated. The lighting device 30 of the present embodiment is a lighting device such as a base light for facilities and businesses such as stores and offices. As shown in FIG. 12, the lighting device 30 is mounted on the lighting device body 31 and the lighting device main body. It is comprised with the illuminating device 20 grade | etc.,.

器具本体31は、白色の塗装鋼板等で構成された長尺の矩形箱状をなすベース部31aと、ベース部の下面に設けられた逆富士形をなす一対の反射板31b、31bで構成され、ベース部31aに点灯装置31cが内蔵されている。点灯装置31cは、交流電圧100Vを直流電圧24V程度に変換して照明装置20の各LED12に定電流を供給する点灯回路で構成されている。   The instrument body 31 is composed of a long rectangular box-shaped base portion 31a made of a white painted steel plate and the like, and a pair of reflecting plates 31b and 31b having an inverted Fuji shape provided on the lower surface of the base portion. The lighting device 31c is built in the base portion 31a. The lighting device 31c is configured by a lighting circuit that converts an AC voltage of 100V to a DC voltage of about 24V and supplies a constant current to each LED 12 of the lighting device 20.

各反射板31bには、照明装置20に設けられた口金部材22が装着される一対のソケット31d、31dが設けられている。そして、一対のソケット31d、31dに対し、上述した構成の2本の照明装置20が装着され、照明器具30が構成される。上記に構成された照明器具30は、商用電源に配線され部屋の天井等の被設置部Xに直付けされて設置される。   Each reflector 31b is provided with a pair of sockets 31d and 31d to which the cap member 22 provided in the lighting device 20 is attached. And the two illuminating devices 20 of the structure mentioned above are mounted | worn with respect to a pair of sockets 31d and 31d, and the lighting fixture 30 is comprised. The lighting fixture 30 configured as described above is wired to a commercial power supply and directly attached to an installation part X such as a ceiling of a room.

設置された照明器具30を点灯すると、商用電源から点灯装置31c、ソケット31d、31dから照明装置20の口金部材22、22を介して各LED12に電源が供給され白色の光を放射し部屋の照明を行う。   When the installed luminaire 30 is turned on, power is supplied from the commercial power source to the LEDs 12 via the lighting device 31c, the sockets 31d and 31d through the base members 22 and 22 of the lighting device 20, and white light is emitted to illuminate the room. I do.

この際、カバー部材21は乳白色のポリカーボネートで構成され光を拡散させることができ、明るく、しかもLED点灯時に生じる輝点を抑制し、眩しさ感を減じた照明を行うことができる。特に、基板11の各LED12は、カバー部材21の円の中心Oから偏位した位置に設けられているので、光が180°を越えた角度で放射されるので、一層広範囲にわたって光を拡散させた照明を行うことが可能になる。   At this time, the cover member 21 is made of milky white polycarbonate, can diffuse light, can be bright, can suppress a bright spot generated when the LED is turned on, and can perform illumination with reduced glare. In particular, each LED 12 on the substrate 11 is provided at a position deviated from the center O of the circle of the cover member 21, so that the light is emitted at an angle exceeding 180 °, so that the light is diffused over a wider range. It becomes possible to perform the illumination.

以上、本実施形態の照明器具によれば、自動化に適した電気的な接続手段を構成することが可能な発光装置および照明装置を光源として用いることにより、量産化に適した照明器具を提供することができる。本実施形態において、照明器具は、上記に例示した店舗やオフィスなど施設・業務用等に限らず、住宅用の各種の照明器具、さらには防犯灯・街路灯・道路灯など屋外用の各種照明器具を構成してもよい。   As mentioned above, according to the lighting fixture of this embodiment, the lighting fixture suitable for mass production is provided by using the light-emitting device and lighting device which can comprise the electrical connection means suitable for automation as a light source. be able to. In the present embodiment, the lighting fixture is not limited to facilities / businesses such as the stores and offices exemplified above, but also various lighting fixtures for homes, and various outdoor lightings such as crime prevention lights, street lights, and road lights. An instrument may be configured.

以上、本実施形態において、発光装置10は、平板状の薄く細長い矩形状をなす基板を用いて構成し、一般の直管形蛍光ランプに代えることが可能な直管形の照明装置を構成したが、その他各種の外観形状、用途をなす照明装置、例えば、図13(a)に示すように、円形の環状形をなす照明装置20に適用することができる。この場合、発光装置10の基板11は、円弧状をなす回路基板で構成し、例えば、この基板4枚を環状に連結して構成し、環状の筒形をなすカバー部材21内に挿入して配設することにより構成することが可能になる。   As described above, in the present embodiment, the light emitting device 10 is configured using a flat, thin, elongated rectangular substrate, and configures a straight tube illumination device that can be replaced with a general straight tube fluorescent lamp. However, the present invention can be applied to lighting devices having various other external shapes and uses, for example, a lighting device 20 having a circular annular shape as shown in FIG. In this case, the substrate 11 of the light emitting device 10 is constituted by a circuit board having an arc shape. For example, the four substrates are annularly connected and inserted into a cover member 21 having an annular cylindrical shape. It becomes possible to constitute by arranging.

また、図13(b)に示すように、四角形の環状をなす照明装置20を構成してもよい。この場合、発光装置10の基板11は、長い矩形状をなす回路基板で構成し、例えば、この基板8枚を環状に連結して構成し、四角形の環状で樋状をなすカバー部材21により覆うことによって構成することが可能になる。なお、四角形の横方向に連結される基板11には、短手方向と長手方向の辺にそれぞれ凹部14および電極13を設けることによって、縦方向に連結された基板11との電気接続および機械的な接続を行うことができる。   Further, as shown in FIG. 13B, a lighting device 20 having a quadrangular annular shape may be configured. In this case, the substrate 11 of the light emitting device 10 is constituted by a circuit board having a long rectangular shape. For example, the substrate 11 is constituted by connecting the eight substrates in a ring shape, and is covered with a cover member 21 having a rectangular ring shape. Can be configured. In addition, the board | substrate 11 connected to a square horizontal direction is provided with the recessed part 14 and the electrode 13 in the side of a transversal direction and a longitudinal direction, respectively, and electrical connection with the board | substrate 11 connected longitudinally, and mechanical Connection can be made.

また、口金付の照明装置を構成したが、口金を有さない、例えば、器具へ直接組み込まれる口金を有さない照明装置に適用されてもよい。また、本実施形態では、全長が約1200mmの照明装置を構成したが、全長が約600mm、さらには、約2400mmの照明装置を構成し、用途に合わせた長さの各種の照明装置を構成するようにしてもよい。さらに、管外径の細い照明装置を構成してもよい。   Moreover, although the illuminating device with a base was comprised, you may apply to the illuminating device which does not have a base, for example, does not have a base directly integrated in an instrument. In the present embodiment, the lighting device having a total length of about 1200 mm is configured. However, the total length is about 600 mm, and further, the lighting device having a length of about 2400 mm is configured, and various types of lighting devices having a length corresponding to the application are configured. You may do it. Furthermore, you may comprise the illuminating device with a thin pipe | tube outer diameter.

発光装置10を構成する固体発光素子12は、例えば、青色を発光する窒化ガリウム(GaN)系半導体からなるLEDチップで構成されることが好適であるが、半導体レーザ、有機ELなどを発光源とした固体発光素子が許容される。また、白色で発光するようにしたが、照明装置の用途に応じ、赤色、青色、緑色等でも、さらには各種の色を組み合わせて構成してもよい。また、固体発光素子は、矩形状の基板に直線状をなすように1列に実装したが、多数の固体発光素子をマトリックス状に配置したものや、千鳥状または放射状など、規則的に一定の順序をもって一部または全体が面状に配置され実装されたものであってもよい。   The solid-state light-emitting element 12 constituting the light-emitting device 10 is preferably composed of, for example, an LED chip made of a gallium nitride (GaN) -based semiconductor that emits blue light. The solid-state light emitting device is acceptable. Moreover, although it was made to light-emit in white, according to the use of an illuminating device, you may comprise red, blue, green, etc., and also combining various colors. In addition, the solid light emitting elements are mounted in a line so as to form a straight line on a rectangular substrate. However, the solid light emitting elements are regularly fixed, such as those in which a large number of solid light emitting elements are arranged in a matrix, a staggered pattern or a radial pattern. A part or the whole may be arranged and mounted in a plane in order.

さらに、固体発光素子12は、SMDタイプでもCOBタイプでもよく、SMDタイプの場合は、複数個の固体発光素子で構成されていることが好ましいが、照明の用途に応じて必要な個数は選択され、例えば、4個程度の素子群を構成し、この群1個、若しくは複数の群をなすように構成してもよい。さらには、1個の固体発光素子で構成されたものであってもよい。   Further, the solid light emitting element 12 may be of SMD type or COB type. In the case of the SMD type, it is preferable that the solid light emitting element 12 is composed of a plurality of solid light emitting elements, but the necessary number is selected according to the use of lighting. For example, about four element groups may be configured, and one group or a plurality of groups may be formed. Furthermore, it may be composed of a single solid state light emitting device.

基板11の形状は、直管形の照明装置を構成するために、長方形や正方形などの矩形状をなしていることが好ましいが、六角形や八角形などの多角形状、さらには、円形や楕円形状等をなすものを直線状や環状に配設したものであってもよい。   The shape of the substrate 11 is preferably a rectangular shape such as a rectangle or a square in order to constitute a straight tube lighting device. However, it is a polygonal shape such as a hexagon or an octagon, and further a circle or an ellipse. Those having a shape or the like may be arranged linearly or annularly.

カバー部材21は、配光特性向上のため内面の一部に反射膜等の反射手段が形成されていてもよい。また、カバー部材21は、発光部を実質的に密閉する外囲器を構成することが好ましいが、完全に密閉することが条件ではなく、光学的に密閉していればよく、例えば、一部に小さな通気用の孔等を形成したものであってもよい。   The cover member 21 may have a reflecting means such as a reflecting film formed on a part of its inner surface for improving light distribution characteristics. In addition, the cover member 21 preferably constitutes an envelope that substantially seals the light emitting portion, but it is not a condition that the cover member 21 is completely sealed, and may be optically sealed. In addition, a small ventilation hole or the like may be formed.

筐体17は、固体発光素子の放熱性を高めるために熱伝導性の良好な金属、例えば、アルミニウム(Al)、銅(Cu)、鉄(Fe)、ニッケル(Ni)の少なくとも一種を含む金属で形成することが好ましいが、この他に、窒化アルミニウム(AlN)、シリコンカーバイト(SiC)などの工業材料で構成してもよい。さらに、高熱伝導樹脂で構成してもよい。さらに、外周面には放熱性能をより高めるために一端部側から他端部側に向かい放射状に突出する多数の放熱フィンや、放射方向に突出する放熱ピン等を一体に形成してもよい。   The casing 17 is a metal having at least one of aluminum (Al), copper (Cu), iron (Fe), and nickel (Ni) having good thermal conductivity in order to enhance the heat dissipation of the solid state light emitting device. In addition, it may be made of an industrial material such as aluminum nitride (AlN) or silicon carbide (SiC). Furthermore, you may comprise with high heat conductive resin. Further, in order to further improve the heat dissipation performance, a large number of heat radiation fins projecting radially from one end side to the other end side, heat radiation pins projecting in the radial direction, and the like may be integrally formed on the outer peripheral surface.

口金部材22は、一般の直管形蛍光ランプで使用されるピン形の端子でも、例えば、白熱電球や電球形蛍光ランプ等に用いられているエジソンタイプのE17やE26等の口金であってもよい。さらに、フラットな薄型構造のランプに用いられるGX53口金でもよく、特定の口金には限定されない。また、固体発光素子12を点灯制御するための点灯装置は、固体発光素子を調光するための調光回路や調色回路等を有するものであってもよい。   The base member 22 may be a pin-type terminal used in a general straight tube fluorescent lamp, or may be a base such as an Edison type E17 or E26 used in an incandescent bulb or a bulb-type fluorescent lamp. Good. Furthermore, it may be a GX53 base used for a flat thin lamp, and is not limited to a specific base. Moreover, the lighting device for controlling the lighting of the solid state light emitting device 12 may include a dimming circuit, a toning circuit and the like for dimming the solid state light emitting device.

以上、本発明の好適な実施形態を説明したが、本発明は上述の実施形態に限定されることなく、本発明の要旨を逸脱しない範囲内において、種々の設計変更を行うことができる。   The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and various design changes can be made without departing from the scope of the present invention.

10 発光装置
11 基板
12 固体発光素子
13 電極
14 凹部
15 接続部材
16 嵌合凹部
17 筐体
18 絶縁部材
20 照明装置
21 カバー部材
30 照明器具
31 器具本体
DESCRIPTION OF SYMBOLS 10 Light-emitting device 11 Board | substrate 12 Solid light emitting element 13 Electrode 14 Recessed part 15 Connection member 16 Fitting recessed part 17 Housing | casing 18 Insulating member 20 Lighting apparatus 21 Cover member 30 Lighting fixture 31 Instrument main body

Claims (4)

固体発光素子および固体発光素子に電気的に接続される電極を有し、少なくとも一辺に凹部が設けられ、凹部が設けられた一辺を対向させることにより嵌合凹部が形成される複数の基板と;
少なくとも一部が前記嵌合凹部に嵌合し、隣接する基板の各電極を電気的に接続する接続部材と;
を具備していることを特徴とする発光装置。
A plurality of substrates having a solid light-emitting element and electrodes electrically connected to the solid-state light-emitting element, provided with a recess on at least one side, and formed with a fitting recess by opposing one side provided with the recess;
A connecting member that at least partially fits into the fitting recess and electrically connects each electrode of the adjacent substrate;
A light-emitting device comprising:
前記基板は、電気絶縁性を有する絶縁部材を介して電気伝導性を有する筐体に取り付けられ、この絶縁部材は前記接続部材と筐体との間に介在することを特徴とする請求項1に記載の発光装置。 2. The substrate according to claim 1, wherein the substrate is attached to a casing having electrical conductivity through an insulating member having electrical insulation, and the insulating member is interposed between the connection member and the casing. The light-emitting device of description. 透光性のカバー部材と;
カバー部材内に配設される請求項1または2記載の発光装置と;
を具備していることを特徴とする照明装置。
A translucent cover member;
The light-emitting device according to claim 1 or 2 disposed in the cover member;
An illumination device comprising:
器具本体と;
器具本体に装着される請求項3に記載の照明装置と;
を具備していることを特徴とする照明器具。
An instrument body;
The lighting device according to claim 3, which is attached to the fixture body;
The lighting fixture characterized by comprising.
JP2011107316A 2011-05-12 2011-05-12 Light-emitting device, lighting device, and lighting fixture Withdrawn JP2012238502A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014143125A (en) * 2013-01-25 2014-08-07 Stanley Electric Co Ltd Both-side luminescent led lamp
JP2015167073A (en) * 2014-03-03 2015-09-24 パナソニックIpマネジメント株式会社 Illumination light source and illumination device
JP5795114B1 (en) * 2014-05-02 2015-10-14 アイリスオーヤマ株式会社 LED lighting device
JP2017107697A (en) * 2015-12-08 2017-06-15 パナソニックIpマネジメント株式会社 Light source unit and lighting fixture
JP2020136181A (en) * 2019-02-22 2020-08-31 寶凱電子企業股▲分▼有限公司 Light strip fixing structure

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014143125A (en) * 2013-01-25 2014-08-07 Stanley Electric Co Ltd Both-side luminescent led lamp
JP2015167073A (en) * 2014-03-03 2015-09-24 パナソニックIpマネジメント株式会社 Illumination light source and illumination device
JP5795114B1 (en) * 2014-05-02 2015-10-14 アイリスオーヤマ株式会社 LED lighting device
JP2017107697A (en) * 2015-12-08 2017-06-15 パナソニックIpマネジメント株式会社 Light source unit and lighting fixture
JP2020136181A (en) * 2019-02-22 2020-08-31 寶凱電子企業股▲分▼有限公司 Light strip fixing structure

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