JP2012230741A - Optical pickup - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical pickup which includes a positioning mechanism of a heat sink suitable for the optical pickup requiring downsizing and thinning.SOLUTION: In the optical pickup 1 which includes light sources 11 and 18, a base member 10 on which the light sources 11 and 18 are mounted, and a heat sink 50 for releasing heat generated by the light sources 11 and 18, engagement holes 101 and 102 are formed on the side surface of the base member 10, the heat sink 50 has a top plate portion 51 mounted on the surface 10d of the base member 10, and an engagement hook portion 52 of approximately L-shape from the side view obtained by being formed by folding a part of the top plate portion 51, and the heat sink 50 is mounted on the base member 10 in a state in which the engagement hook portion 52 is engaged with the engagement holes 101 and 102.

Description

  The present invention relates to an optical pickup, and more particularly to a heat sink positioning mechanism provided in the optical pickup.

  An optical disk device (disk drive) used for recording information on an optical disk and reproducing information recorded on an optical disk irradiates the optical disk with light and receives light reflected from the optical disk. A pickup is built-in. The optical pickup includes a light source for irradiating the optical disk with light, a driver IC for driving the light source, and the like.

  Conventionally, an optical pickup is provided with a heat sink for the purpose of releasing heat generated from a light source or heat generated from a driver IC, for example. The shape and mounting structure of these heat sinks vary depending on, for example, the shape of the optical pickup and its mounting purpose (see, for example, Patent Documents 1 to 5).

JP 2004-253092 A JP 2006-134440 A JP 2007-193855 A JP 2009-158022 A JP 2003-157564 A

  The optical pickup includes a base member to which, for example, a light source, an optical member, a circuit board, and the like are attached. For the purpose of efficiently radiating heat generated by a plurality of light sources arranged, it is conceivable to attach a large heat sink to the base member so as to cover the surface of the base member. However, recently, there is a great demand for miniaturization and thinning of the optical pickup in the market. For this reason, when arrange | positioning a heat sink so that a base member may be covered, it is necessary to raise the attachment position accuracy of a heat sink.

  In such a case, for example, it is conceivable to improve the mounting position accuracy (positioning accuracy) in the horizontal direction of the heat sink by providing two bosses with a large distance from each other on the base member. Further, for example, it is conceivable to increase the horizontal mounting position accuracy of the heat sink by increasing the distance between the screw for fixing the heat sink to the base member and the boss provided on the base member for positioning. However, the position where the boss is provided is often limited due to the demand for miniaturization and thinning of the optical pickup, and the above-described measures may not be adopted.

  Further, in order to improve the accuracy of the mounting position in the height direction (to prevent floating), for example, it is conceivable to fix the heat sink to the base member using many screws. However, it is difficult to fix the heat sink 50 using a large number of screws because of the demand for miniaturization and thinning of the optical pickup.

  In view of the above points, an object of the present invention is to provide an optical pickup equipped with a heat sink positioning mechanism suitable for an optical pickup that is required to be reduced in size and thickness.

  In order to achieve the above object, an optical pickup according to the present invention is an optical pickup comprising a light source, a base member to which the light source is attached, and a heat sink that dissipates heat generated by the light source. An engagement hole is formed on a side surface, and the heat sink is substantially L-shaped in a side view obtained by bending a top plate portion placed on the surface of the base member and a part of the top plate portion. An engagement hook portion, and is configured to be attached to the base member in a state in which the engagement hook portion is engaged with the engagement hole (first configuration).

  According to this configuration, the positioning accuracy in the height direction of the heat sink and the positioning accuracy in the left-right direction can be improved by the engagement hole and the engagement hook portion. Such engagement holes and engagement hook portions are easy to use and convenient even when a thin optical pickup is required.

  In the optical pickup having the first configuration, the engagement hook portion is bent from the top plate portion and is bent from the first portion, the first portion being substantially perpendicular to the top plate portion. A second portion that is substantially parallel to the top plate portion, wherein a vertical distance between the top plate portion and the second portion is A, and the heat sink is the base member. The vertical distance between the contact position at which the surface of the second part contacts the base member when attached to the base member and the surface of the base member on which the top plate portion is placed is defined as B. In this case, it is preferable that the configuration satisfies A <B (second configuration). Thereby, the mounting position accuracy in the height direction is improved.

  In the optical pickup having the first or second configuration, two engagement holes are provided, the two engagement holes are arranged in parallel at intervals, and the end of the engagement hook portion has the 2 It is preferable to adopt a configuration (third configuration) in which two claw portions sandwiching a column portion formed between two engagement holes are formed. Thereby, the mounting position accuracy in the direction in which the two engagement holes are arranged (left-right direction) is improved.

  In the optical pickup of the third configuration, it is preferable that the column portion has a configuration (fourth configuration) having an inclined portion whose width gradually increases toward the surface side of the base member.

  In the optical pickup having any one of the first to fourth configurations, the heat sink may be fixed to the base member using a screw (fifth configuration).

  In the optical pickup having any one of the first to fifth configurations, the base member may be provided with a boss for positioning (sixth configuration).

  In the optical pickup having any one of the first to sixth configurations, the surface of the base member on which the top plate portion is placed may be a surface facing the optical disc.

  ADVANTAGE OF THE INVENTION According to this invention, the optical pick-up provided with the positioning mechanism of a heat sink suitable for the optical pick-up which requires size reduction and thickness reduction can be provided.

Schematic plan view showing the external configuration of the optical pickup of the present embodiment Schematic plan view showing the optical configuration of the optical pickup of the present embodiment Schematic perspective view showing a partial configuration of a heat sink provided in the optical pickup of the present embodiment The perspective view for demonstrating the engagement hole provided in the pick-up base with which the optical pick-up of this embodiment is provided The schematic diagram for demonstrating the detailed structure of the engagement hook part of the heat sink with which the optical pick-up of this embodiment is provided. In the optical pickup of the present embodiment, a schematic side view showing a partial configuration when the heat sink is attached to the pickup base.

  Hereinafter, embodiments of an optical pickup to which the present invention is applied will be described with reference to the drawings. Note that the optical pickup of the present embodiment is configured to be able to read and write information on optical discs of three types of standards such as a Blu-ray disc (BD), a digital versatile disc (DVD), and a compact disc (CD). Yes.

(Schematic configuration of optical pickup)
FIG. 1 is a schematic plan view showing an external configuration of the optical pickup 1 of the present embodiment. When the optical pickup 1 shown in FIG. 1 reads information on the optical disk, the optical disk is disposed on the front side of the paper. As shown in FIG. 1, the optical pickup 1 includes a pickup base 10. This pickup base 10 is an example of a base member of the present invention.

  An optical pickup 1 to be mounted on an optical disk apparatus (an apparatus for reproducing and recording an optical disk) is slidably supported by two guide shafts GS arranged in the optical disk apparatus. Thus, the optical disk can be moved in the radial direction (radial direction) of the optical disk. Note that the pickup base 10 is supported by the guide shaft GS using bearings 10 a and 10 b provided at the left and right ends of the pickup base 10.

  The pickup base 10 is loaded with various members necessary for reading information recorded on the optical disk and writing information on the optical disk. These various members include semiconductor lasers 11 and 18 serving as light sources (see FIG. 2 described later), various optical members including objective lenses 17 and 21, a photodetector 23, and an actuator 30 that drives the objective lenses 17 and 21. And a printed circuit board 40 on which various circuits necessary for driving the semiconductor lasers 11 and 18 and the actuator 30 are formed.

  Note that the semiconductor lasers 11 and 18 and some of the optical members described later are built in the pickup base 10. The actuator 30 is attached so that the entirety thereof is substantially embedded in the pickup base 10, and the objective lenses 17 and 21 mounted on the actuator 30 are exposed to the outside. The printed circuit board 40 is attached to the back side of the pickup base 10 (the side opposite to the surface facing the optical disk).

  In addition, a heat sink 50 is attached to the pickup base 10 in order to dissipate heat generated by the semiconductor lasers 11 and 18. The heat sink 50 is attached to the pickup base 10 so as to cover the surface 10d of the pickup base 10 (the surface facing the optical disk). The actuator 30 is exposed without being covered by the heat sink 50.

  FIG. 2 is a schematic plan view showing the optical configuration of the optical pickup 1 of the present embodiment. The optical pickup 1 guides the light emitted from the first semiconductor laser 11 to the information recording surface of the optical disc and guides the reflected light (returned light) reflected from the information recording surface to the photodetector 23. The optical path is formed. The optical pickup 1 guides light emitted from the second semiconductor laser 18 to the information recording surface of the optical disc and guides reflected light (returned light) reflected from the information recording surface to the photodetector 23. Optical paths for DVD and CD are formed.

  Note that the optical pickup 1 has a configuration in which a plurality of optical members are shared by the optical path for BD and the optical path for DVD and CD. Since such a configuration is adopted, the optical pickup 1 can form an optical pickup corresponding to BD, DVD, and CD with a small number of parts.

  First, the optical path for BD will be described. The first semiconductor laser 11 can emit BD laser light (for example, laser light having a wavelength of 405 nm band). The position at which the first semiconductor laser 11 is disposed corresponds to the position indicated by the broken line DL1 in FIG.

  Laser light emitted from the first semiconductor laser 11 is divided into main light and two sub-lights by the diffraction element 12. The laser beam that has passed through the diffraction element 12 is reflected by the polarization beam splitter 13 and passes through the quarter-wave plate 14 and the collimating lens 15. The laser light transmitted through the collimating lens 15 is reflected by the first rising mirror 16 and reaches the first objective lens 17 above the first rising mirror 16.

  The first objective lens 17 has a function of condensing incident laser light on the information recording surface of the optical disc. The laser beam condensed on the information recording surface by the first objective lens 17 is reflected by the information recording surface. This reflected light (returned light) passes through the first objective lens 17 and is reflected by the first rising mirror 16, and passes through the collimating lens 15, the quarter wavelength plate 14, the polarizing beam splitter 13, and the beam splitter 19. Transparent in order. Then, the return light transmitted through the beam splitter 19 is given astigmatism by the sensor lens 22 and is condensed on a predetermined light receiving region of the photodetector 23.

  The photodetector 23 functions as a photoelectric conversion unit that converts the received optical signal into an electrical signal. The electric signal output from the photodetector 23 is sent to a signal processing unit (not shown), and a reproduction signal, a focus error (FE) signal, a tracking error (TE) signal, and the like are generated by the signal processing unit.

  Next, optical paths for DVD and CD will be described. The second semiconductor laser 18 can emit by switching between laser light for DVD (for example, laser light having a wavelength of 650 nm band) and laser light for CD (for example, laser light having a wavelength of 780 nm band). Such a laser light source can be constituted by, for example, a monolithic type or a hybrid type two-wavelength laser. Note that the position where the second semiconductor laser 18 is disposed corresponds to the position indicated by the broken line DL2 in FIG.

  The laser light emitted from the second semiconductor laser 18 is reflected by the beam splitter 19, and then the polarizing beam splitter 13, the quarter wavelength plate 14, the collimating lens 15, and the first raising mirror 16 are sequentially arranged. To Penetrate. The laser beam that has passed through the first raising mirror 16 is reflected by the second raising mirror 20 and reaches the second objective lens 21 above the second raising mirror 20.

  The polarization beam splitter 13 is an optical member that acts on the BD laser beam, and the DVD laser beam and the CD laser beam are transmitted regardless of the polarization state. The first raising mirror 16 is a dichroic mirror, which reflects BD laser light but allows DVD laser light and CD laser light to pass therethrough.

  The second objective lens 21 has a function of condensing incident laser light on the information recording surface of the optical disc. The laser beam condensed on the information recording surface by the second objective lens 21 is reflected by the information recording surface. The reflected light (returned light) passes through the second objective lens 21 and is then reflected by the second rising mirror 20, and is reflected by the first rising mirror 16, the collimating lens 15, the quarter wavelength plate 14, and the polarized light. It passes through the beam splitter 13 and the beam splitter 19 in order. Then, the return light transmitted through the beam splitter 19 is given astigmatism by the sensor lens 22 and is condensed on a predetermined light receiving region of the photodetector 23.

  As in the case of BD compatibility, the electrical signal output from the photodetector 23 is sent to a signal processing unit (not shown), and a reproduction signal, an FE signal, a TE signal, and the like are generated by this signal processing unit.

  The collimating lens 15 can be moved in the optical axis direction (direction indicated by an arrow in FIG. 2) by a lens driving mechanism (not shown). The position of the collimating lens 15 is appropriately moved according to the type of optical disk, layer jump, and the like. The reason why the collimating lens 15 can be moved in this way is to adjust the degree of convergence / divergence of the laser light incident on the objective lenses 17 and 21 so as to appropriately suppress the influence of spherical aberration.

  Further, the first objective lens 17 and the second objective lens 21 are mounted on the pickup base 10 in a state where they are mounted on an actuator 30 (see FIG. 1) attached to the pickup base 10. The actuator 30 moves the two objective lenses 17 and 21 provided in the optical pickup 1 in a focus direction (in FIG. 1 and FIG. 2, a direction perpendicular to the paper surface) and a tracking direction (in FIG. 1 and FIG. It is a device that can be moved to the corresponding).

  In the optical pickup 1, when reading or writing information, it is necessary to perform focusing control so that the focal positions of the objective lenses 17 and 21 always match the information recording surface of the optical disc. Further, in the optical pickup 1, when reading or writing information, tracking is performed so that the position of the light spot condensed on the information recording surface of the optical disk by the objective lenses 17 and 21 always follows the track of the optical disk. It is necessary to control. The actuator 30 is driven, for example, when performing these focusing control and tracking control.

  The actuator 30 has a lens holder 31 (see FIG. 1) that holds the objective lenses 17 and 21, and is configured to support the lens holder 31 with a wire 32 (see FIG. 1) so as to be swingable. Then, the lens holder 31 (that is, the objective lenses 17 and 21) is moved by a force generated using a coil and a magnet. Since this type of actuator is known, a detailed description is omitted here.

(Heat sink positioning mechanism)
Next, a characteristic configuration of the optical pickup 1 configured as described above will be described. The optical pickup 1 is characterized by a positioning mechanism for positioning the heat sink 50.

  In order to reduce the thickness of the optical pickup 1 and the optical disk device on which the optical pickup 1 is mounted, the heat sink 50 is required to be positioned so as not to float in the height direction. In particular, in the case where the heat sink 50 is placed on the surface 10d (the surface facing the optical disk) of the pickup base 10 as in the present embodiment, since there is a disk tray or the like on the upper side, positioning in the height direction is performed. The importance is high.

  Further, due to the demand for miniaturization of the optical pickup 1 and the optical disk apparatus on which the optical pickup 1 is mounted, for example, the horizontal positioning of the heat sink 50 is also important in order to avoid deformation due to interference with other members arranged on the pick base 10. Become. For example, in the optical pickup 1 of the present embodiment, the heat sink 50 also has a function as a countermeasure against static electricity, and is placed in contact with a sheet metal member 60 (see FIG. 1) for countermeasure against static electricity that is attached to the pickup base 10. In this case, if the positioning of the heat sink 50 in the horizontal direction (left and right direction in FIG. 1) is insufficient, the heat sink 50 is deformed due to the presence of the sheet metal member 60, which causes a problem.

  Further, in the case where heat radiation grease is disposed between the semiconductor lasers 11 and 18 and the heat sink 50 and the solidified grease is integrated with the heat sink 50, the horizontal positioning of the heat sink 50 is insufficient. As a result, the semiconductor lasers 11 and 18 are displaced. Also in this respect, the horizontal positioning of the heat sink 50 is important.

  From the above, in the optical pickup 1 of the present embodiment, a characteristic positioning mechanism is provided in order to improve the mounting accuracy of the heat sink 50.

  FIG. 3 is a schematic perspective view showing a partial configuration of the heat sink 50 provided in the optical pickup 1 of the present embodiment. As shown in FIG. 3, the heat sink 50 formed of, for example, aluminum includes a top plate portion 51 placed on the surface 10 d of the pickup base 10.

  The top plate portion 51 is provided with a screw fastening portion 511 for attaching a screw 70 (see FIG. 1). This screwing portion 511 is obtained by cutting out a part of the top plate portion 51 and bending it. The screw fastening portion 511 is formed with a screw hole for inserting the screw 70. The screw fastening portion 511 is configured such that the upper part of the attached screw 70 does not protrude from the top surface of the heat sink 50. Further, the top plate portion 51 is formed with a boss hole 512 into which a boss 10c (see FIG. 1) provided on the pickup base 10 is inserted. The boss 10c and the boss hole 512 are provided to ensure the positioning of the heat sink 50.

  Further, the heat sink 50 is formed with an engagement hook portion 52 having a substantially L shape in side view, which is obtained by bending a part of the top plate portion 51. The engagement hook portion 52 is bent from the top plate portion 51 and is substantially perpendicular to the top plate portion 51, and the engagement hook portion 52 is bent from the first portion 512 and substantially to the top plate portion 51. A second portion 522 that is parallel. Two claw portions 522a and 522b are provided on the front end side of the second portion 522 (the front end side of the engaging hook portion 52) so that an object can be sandwiched between the two claw portions 522a and 522b. Yes.

  FIG. 4 is a perspective view for explaining the engagement holes 101 and 102 provided in the pickup base 10 provided in the optical pickup 1 of the present embodiment. In FIG. 4, a heat sink 50 is also shown for easy understanding.

  On the side surface of the pickup base 10 adjacent to the attachment portion 103 to which the second semiconductor laser 18 is attached, two engagement holes 101 and 102 that engage with the engagement hook portion 52 provided in the heat sink 50 are provided. Yes. The claw portion 522a of the engagement hook portion 52 is inserted into the engagement hole 101, and the claw portion 522b of the engagement hook portion 52 is inserted into the engagement hole 102. Although the two engagement holes 101 and 102 are through holes, they may not be through holes depending on circumstances. In the present embodiment, the two engagement holes 101 and 102 are through holes so that the position of the second semiconductor laser 18 can be easily adjusted.

  The two engagement holes 101 and 102 have a substantially rectangular shape in plan view, and are arranged in parallel at a predetermined interval. As for the column part 104 formed between the two engagement holes 101 and 102, the corner | angular part of the two engagement holes 101 and 102 becomes R shape. For this reason, the pillar part 104 has a configuration including an inclined part 104a whose width W gradually increases toward the upper part (the surface 10d side of the pickup base 10). The distance d between the claw portions 522a and 522b of the engagement hook portion 52 of the heat sink 50 is substantially the same as the shortest width W of the column portion 104, but in detail is slightly wider than the shortest width W of the column portion 104. .

  FIG. 5 is a schematic diagram for explaining a detailed configuration of the engagement hook portion 52 of the heat sink 50 provided in the optical pickup 1 of the present embodiment. FIG. 5A shows a state before the heat sink 50 is attached to the pickup base 10. FIG. 5B shows a state before the engagement hook portion 52 of the heat sink 50 is inserted into the engagement holes 101 and 102 and is fixed by the screw 70. FIG. 6 is a schematic side view showing a partial configuration when the heat sink 50 is attached to the pickup base 10 in the optical pickup 1 of the present embodiment.

  As described above, the heat sink 50 is provided so that the top plate portion 51 and the second portion 522 of the engagement hook portion 52 are in a substantially parallel relationship before being attached to the pickup base 10. Here, as shown in FIG. 5A, the distance in the vertical direction between the top plate portion 51 and the second portion 522 is A.

  As will be described in detail later, when the heat sink 50 is attached to the pickup base 10, the surface (upper surface) of the second portion 522 (the claw portion 522a and the claw portion 522b) is the inner surface of the engagement holes 101 and 102 ( It comes into contact with the pickup base 10). The contact position in this case is indicated by a symbol CP as shown in FIG. As shown in FIG. 6, the vertical distance between the contact position CP and the surface 10d of the pickup base 10 on which the heat sink 50 is placed is B.

  The heat sink 50 of the present embodiment is configured to satisfy A <B. For this reason, when the engagement claws 522a and 522b of the engagement hook portion 52 of the heat sink 50 are simply inserted into the engagement holes 101 and 102, the heat sink 50 is slightly inclined as shown in FIG. . For this reason, when fixing the heat sink 50 with the screw 70, a force in the downward direction in the vertical direction (X direction in FIG. 5B) is applied to the heat sink 50.

  By this force, the engagement hook portion 52 is attached to the pickup base 10 in a deformed state. Then, due to this deformation, a force (which corresponds to the force in the Y direction in FIG. 5B) that the upper surface of the second portion 522 is pressed against the inner surfaces (pickup base 10) of the engagement holes 101 and 102 is applied. The heat sink 50 is fixed to the pickup base 50. That is, the heat sink 50 is attached to the pickup base 10 without being lifted up and being positioned in the height direction.

  Further, as described above, the pillar portion 104 has a configuration having the inclined portion 104a that gradually spreads toward the upper side. For this reason, the second portion 522 that has received a force in the Y direction (see FIG. 5B) can firmly hold the column portion 104 without any gap between the claw portions 522a and 522b. As a result, the heat sink 50 is attached to the pickup base 10 while being positioned in the left-right direction without moving in the left-right direction.

  If the distance A is too small with respect to the distance B, the heat sink 50 is deformed or destroyed, and the function as the positioning mechanism cannot be obtained. Considering this point, it is necessary to set the distance A appropriately.

  Here, a procedure for attaching the heat sink 50 to the pickup base 10 will be described. First, the engagement claws 522a and 522b of the engagement hook portion 52 are inserted into the engagement holes 101 and 102, respectively. Then, the top plate portion 511 of the heat sink 50 is pressed against the surface 10 d of the pickup base 10. At this time, the position is adjusted so that the boss hole 512 of the heat sink 50 fits into the boss 10 c formed on the pickup base 10. After this position adjustment, the screw 70 is attached to the screw fastening portion 511, and the fixing of the heat sink 50 to the pickup base 10 is completed.

  In the optical pickup 1 of the present embodiment, the engagement hook portion 52 engages with the engagement holes 101 and 102 of the pickup base 10 at the other end portion opposite to the one end portion fixed by the screw 70, and the heat sink 50. Positioning in the height direction and the left-right direction is performed. In addition, positioning by a boss is performed at a location away from the position where the engagement hook portion 52 and the engagement holes 101 and 102 that act as a positioning mechanism are provided. For this reason, the heat sink 50 can be accurately positioned in both the height direction and the horizontal direction.

  In the optical pickup 1 of this embodiment, a boss cannot be formed in the range R indicated by the arrow in FIG. That is, in the optical pickup 1 of the present embodiment, for example, the positioning accuracy cannot be improved by using two bosses (or bosses and screws) that are largely separated from each other. Since the positioning accuracy of the heat sink 50 can be improved even under such restrictions, the positioning mechanism of this embodiment is convenient.

(Other)
The embodiment described above is an example of the present invention, and the configuration of the optical pickup of the present invention is not limited to the configuration described above.

  For example, in the embodiment described above, the heat sink 50 is fixed to the pickup base 10 using the screws 70. However, the present invention is not limited to this configuration, and the heat sink 50 may be fixed to the pickup base 10 without using screws. For example, the heat sink 50 may be fixed to the pickup base 10 by using bending of a part of the end of the heat sink 50.

  Further, in the embodiment described above, the positioning by the boss 10c is also performed in order to ensure the positioning of the heat sink 50 in the horizontal direction. However, the positioning by the boss 10c may be omitted depending on circumstances. In the present embodiment, since positioning in the left-right direction is necessary, two claw portions 522a and 522b are provided at the tip of the engagement hook portion 52, and are engaged with separate engagement holes 101 and 102, respectively. The configuration. However, when only the positioning accuracy in the height direction is required, it is not necessary to provide the claw portions 522a and 522b at the tip of the engagement hook portion 52. In this case, the engagement with the engagement hook portion 52 is not necessary. One hole may be provided.

  In the embodiment described above, the heat sink 50 is provided on the surface side of the pickup base 10 (the surface side facing the optical disk). However, the present invention is also applicable when the heat sink 50 is provided on the back side of the pickup base 10.

  In the embodiment described above, the optical pickup 1 is configured to support three types of optical discs. However, this is merely an example, and it goes without saying that the present invention can be widely applied even if the type of optical disc that the optical pickup can handle and the optical configuration to be used are changed from the configuration of this embodiment.

  The present invention is suitable for optical pickups that are required to be small and thin.

1 Optical pickup 10 Pickup base (base member)
10d Pickup base surface 11 First semiconductor laser (light source)
18 Second semiconductor laser (light source)
50 Heat sink 51 Top plate part 52 Engagement hook part 101, 102 Engagement hole
104 Pillar part 104a Inclined part 521 1st part 522 2nd part 522a, 522b Claw part CP Contact position

Claims (7)

A light source;
A base member to which the light source is attached;
A heat sink that dissipates heat generated by the light source;
An optical pickup comprising:
An engagement hole is formed on the side surface of the base member,
The heat sink includes a top plate portion placed on the surface of the base member, and an engagement hook portion having a substantially L shape in side view obtained by bending a part of the top plate portion. An optical pickup attached to the base member in a state where the engagement hook portion is engaged with the engagement hole. The engagement hook portion is bent from the top plate portion and is substantially perpendicular to the top plate portion, and the engagement hook portion is bent from the first portion and substantially parallel to the top plate portion. A second part that becomes
A vertical distance between the top plate portion and the second portion is A,
When the heat sink is attached to the base member, the vertical direction between the contact position where the surface of the second portion contacts the base member and the surface of the base member on which the top plate portion is placed The optical pickup according to claim 1, wherein A <B is satisfied, where B is a distance B. Two engagement holes are provided, and the two engagement holes are arranged in parallel at intervals,
3. The optical pickup according to claim 1, wherein two claw portions sandwiching a column portion formed between the two engagement holes are formed at a distal end of the engagement hook portion.   The optical pickup according to claim 3, wherein the column portion has an inclined portion whose width gradually increases toward the surface side of the base member.   The optical pickup according to claim 1, wherein the heat sink is fixed to the base member using screws.   The optical pickup according to claim 1, wherein the base member is provided with a boss for positioning.   The optical pickup according to claim 1, wherein a surface of the base member on which the top plate portion is placed is a surface facing the optical disc.

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